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TWI757930B - Film forming device - Google Patents

Film forming device Download PDF

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Publication number
TWI757930B
TWI757930B TW109137087A TW109137087A TWI757930B TW I757930 B TWI757930 B TW I757930B TW 109137087 A TW109137087 A TW 109137087A TW 109137087 A TW109137087 A TW 109137087A TW I757930 B TWI757930 B TW I757930B
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Taiwan
Prior art keywords
mask
substrate
drive mechanism
substrate holder
holder
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TW109137087A
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Chinese (zh)
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TW202123771A (en
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関谷任史
木村竜司
新海達也
岡部俊介
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日商佳能特機股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本發明涉及一種抑制對準精度降低的成膜裝置。本發明的成膜裝置具備：容器；前述容器的外部的基座支承體；前述容器內的基板保持器；前述容器內的掩模保持器；基板保持器驅動機構；掩模保持器驅動機構；基板保持器驅動機構支承體，其與前述基座支承體連接；掩模保持器支承體，其與前述基座支承體連接，支承前述掩模保持器；前述基座支承體與前述基板保持器驅動機構之間的振動傳遞抑制構件；以及對準用相機單元，其設置於前述容器的外部且設置於前述掩模保持器支承體，用於測定基板與掩模的相對位置偏移。The present invention relates to a film-forming apparatus that suppresses a decrease in alignment accuracy. The film forming apparatus of the present invention includes: a container; a susceptor support outside the container; a substrate holder in the container; a mask holder in the container; a substrate holder drive mechanism; a mask holder drive mechanism; A substrate holder drive mechanism support connected to the base support; a mask holder support connected to the base support to support the mask holder; the base support and the substrate holder A vibration transmission suppressing member between drive mechanisms; and an alignment camera unit provided outside the container and on the mask holder support for measuring relative positional displacement between the substrate and the mask.

Description

成膜裝置Film forming device

本發明涉及一種用於經由掩模將規定的成膜材料蒸鍍到基板上的成膜裝置。The present invention relates to a film-forming apparatus for vapor-depositing a predetermined film-forming material on a substrate through a mask.

有機EL顯示裝置(有機EL顯示器)的應用領域不僅為智慧手機、電視機、汽車用顯示器，還擴展到VR HMD(Virtual Reality Head Mount Display)等，特別是，VR HMD所使用的顯示器為了降低用戶的目眩等而要求以高精度形成像素圖案。即，要求進一步的高解析度化。 在有機EL顯示裝置的製造中，在形成構成有機EL顯示裝置的有機發光元件(有機EL元件；OLED)時，將從成膜裝置的成膜源放出的成膜材料經由形成有像素圖案的掩模形成於基板，從而形成有機物層、金屬層。 在這樣的成膜裝置中，為了提高成膜精度，在成膜工序之前，測定基板與掩模的相對位置，在相對位置發生偏移的情況下，進行使基板和/或掩模相對移動來調整(對準)位置的工序。 因此，以往的成膜裝置包括與基板支承單元和/或掩模台連結並驅動基板支承單元和/或掩模台的對準台機構。 以往，作為包括對準台機構的成膜裝置，已知如專利文獻1所列舉出的成膜裝置。在專利文獻1中，採用了將載置對準台機構的支承板和成膜室的頂板分離的構造。由此，能夠降低成膜室的變形、向成膜室傳遞的振動，抑制基板與掩模的位置偏移。 先前技術文獻 專利文獻 專利文獻1：日本特開2012-33468號公報The application fields of organic EL display devices (organic EL displays) are not only smartphones, televisions, automotive displays, but also VR HMDs (Virtual Reality Head Mount Displays), etc. dazzling, etc., it is required to form a pixel pattern with high precision. That is, further higher resolution is required. In the manufacture of an organic EL display device, when an organic light-emitting element (organic EL element; OLED) constituting the organic EL display device is formed, the film-forming material discharged from the film-forming source of the film-forming device passes through a mask in which a pixel pattern is formed. The mold is formed on the substrate to form the organic layer and the metal layer. In such a film-forming apparatus, in order to improve the film-forming accuracy, before the film-forming step, the relative positions of the substrate and the mask are measured, and when the relative positions are shifted, the substrate and/or the mask are moved relatively. The process of adjusting (aligning) the position. Therefore, the conventional film forming apparatus includes an alignment stage mechanism that is coupled to the substrate support unit and/or the mask stage and drives the substrate support unit and/or the mask stage. Conventionally, as a film formation apparatus including an alignment stage mechanism, a film formation apparatus such as that listed in Patent Document 1 has been known. In Patent Document 1, a structure in which a support plate on which the alignment stage mechanism is placed and a top plate of a film formation chamber are separated from each other is adopted. Thereby, the deformation of the film formation chamber and the vibration transmitted to the film formation chamber can be reduced, and the positional displacement between the substrate and the mask can be suppressed. prior art literature Patent Literature Patent Document 1: Japanese Patent Laid-Open No. 2012-33468

發明所欲解決之問題 然而，在專利文獻1所公開的成膜裝置中，在對基板或掩模的對準台機構進行了驅動時，該驅動時的振動傳遞到任一方的支承體，對準精度變差。另外，在進行高精度的對準時需要提高對準台機構的可控制的頻帶，但驅動時的振動成為干擾，控制性能降低，結果，對準精度降低。 本發明是鑒於上述現有技術所具有的課題而完成的，其目的在於提供一種能夠抑制對準精度降低的成膜裝置。 解決問題之技術手段 本發明的第1技術方案的成膜裝置具備：容器；基座支承體，其設置於前述容器的外部；基板保持器，其設置於前述容器內，保持基板；掩模保持器，其設置於前述容器內，支承掩模；基板保持器驅動機構，其驅動前述基板保持器；掩模保持器驅動機構，其驅動前述掩模保持器；基板保持器驅動機構支承體，其與前述基座支承體連接，支承前述基板保持器驅動機構；掩模保持器支承體，其與前述基座支承體連接，支承前述掩模保持器；振動傳遞抑制構件，其設置於前述基座支承體與前述掩模保持器驅動機構之間；以及對準用相機單元，其設置於前述容器的外部且設置於前述掩模保持器支承體，用於測定保持於前述基板保持器的基板與支承於前述掩模保持器的掩模的相對位置偏移量。 另外，本發明的第2技術方案的成膜裝置具備： 容器； 基座支承體，其設置於前述容器的外部； 基板保持器，其設置於前述容器內，保持基板； 掩模保持器，其設置於前述容器內，支承掩模； 基板保持器驅動機構，其驅動前述基板保持器； 掩模保持器驅動機構，其驅動前述掩模保持器； 基板保持器驅動機構支承體，其與前述基座支承體連接，支承前述基板保持器驅動機構； 掩模保持器支承體，其與前述基座支承體連接，支承前述掩模保持器； 振動傳遞抑制構件，其設置於前述基座支承體與前述基板保持器驅動機構之間；以及 對準用相機單元，其設置於前述容器的外部且設置於前述基板保持器驅動機構支承體，用於測定保持於前述基板保持器的基板與支承於前述掩模保持器的掩模的相對位置偏移量。 發明之效果 根據本發明，能夠抑制對準精度降低。The problem that the invention seeks to solve However, in the film forming apparatus disclosed in Patent Document 1, when the alignment stage mechanism of the substrate or the mask is driven, the vibration during the driving is transmitted to either of the supports, and the alignment accuracy is deteriorated. In addition, it is necessary to increase the controllable frequency band of the alignment stage mechanism to perform high-precision alignment, but the vibration during driving becomes a disturbance, and the control performance is degraded, and as a result, the alignment accuracy is degraded. The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a film deposition apparatus capable of suppressing a decrease in alignment accuracy. technical means to solve problems A film forming apparatus according to a first aspect of the present invention includes: a container; a susceptor support provided outside the container; a substrate holder provided in the container and holding the substrate; and a mask holder provided in the container Inside the container, a mask is supported; a substrate holder drive mechanism drives the substrate holder; a mask holder drive mechanism drives the mask holder; a substrate holder drive mechanism support body is supported with the base body connection to support the substrate holder drive mechanism; a mask holder support body connected to the base support body to support the mask holder; vibration transmission suppressing member provided on the base support body and the mask holder between the mold holder drive mechanisms; and an alignment camera unit provided outside the container and provided on the mask holder support body for measuring the substrate held by the substrate holder and the mask holder The offset of the relative position of the mask of the device. In addition, the film forming apparatus according to the second aspect of the present invention includes: container; a base support provided outside the aforementioned container; a substrate holder, which is arranged in the aforementioned container and holds the substrate; a mask holder, which is disposed in the aforementioned container and supports the mask; a substrate holder drive mechanism that drives the aforementioned substrate holder; a mask holder drive mechanism that drives the aforementioned mask holder; a substrate holder drive mechanism support, which is connected to the base support and supports the substrate holder drive mechanism; a mask holder support connected to the base support and supporting the mask holder; a vibration transmission suppressing member provided between the base support and the substrate holder drive mechanism; and a camera unit for alignment, which is provided outside the container and is provided on the substrate holder drive mechanism support body, and is used for measuring the relative positional deviation of the substrate held by the substrate holder and the mask supported by the mask holder shift. effect of invention According to the present invention, it is possible to suppress a decrease in alignment accuracy.

以下，基於附圖說明用於實施本發明的方式。以下的實施方式和實施例例示性地表示本發明的優選的結構，本發明的範圍並不限定於這些結構。另外，以下的說明中的裝置的硬體結構和軟體結構、處理流程、製造條件、尺寸、材質、形狀等只要沒有限定性的記載，就並非旨在將本發明的範圍僅限定於此。 本發明能夠應用於使各種材料堆積於基板的表面而進行成膜的裝置，能夠優選地應用於通過真空蒸鍍形成所期望的圖案的薄膜(材料層)的裝置。 作為基板的材料，能夠選擇半導體(例如矽)、玻璃、高分子材料的膜、金屬等任意的材料。基板例如也可以是矽晶圓或者在玻璃基板上層疊有聚醯亞胺等的膜的基板。另外，作為成膜材料，也能夠選擇有機材料、金屬性材料(金屬、金屬氧化物等)等任意的材料。 此外，本發明除了基於加熱蒸發的真空蒸鍍裝置之外，也能夠應用於包括濺射裝置、CVD(Chemical Vapor Deposition)裝置在內的成膜裝置。具體而言，本發明的技術能夠應用於半導體器件、磁性器件、電子元件等各種電子器件、光學元件等的製造裝置。作為電子器件的具體例，可列舉出發光元件、光電轉換元件、觸摸面板等。 其中，本發明能夠優選應用於OLED等有機發光元件、有機薄膜太陽能電池等有機光電轉換元件的製造裝置。此外，本發明的電子器件也包括具備發光元件的顯示裝置(例如有機EL顯示裝置)、照明裝置(例如有機EL照明裝置)、具備光電轉換元件的感測器(例如有機CMOS圖像感測器)。 ＜電子器件的製造裝置＞ 圖1是示意性地表示電子器件的製造裝置的一部分結構的俯視圖。 圖1的製造裝置例如用於VR HMD用的有機EL顯示裝置的顯示面板的製造。在VR HMD用的顯示面板的情況下，例如，在對規定的尺寸(例如300mm)的矽晶圓進行了用於形成有機EL元件的成膜之後，沿著元件形成區域之間的區域(劃線區域)切取該矽晶圓，制作成多個小尺寸的面板。 本實施方式的電子器件的製造裝置一般而言包括多個集群裝置1和將集群裝置之間相連的中繼裝置。 集群裝置1具備對基板W進行處理(例如成膜)的成膜裝置11、收納使用前後的掩模的掩模儲備裝置12、以及配置於其中央的輸送室13。如圖1所示，輸送室13與成膜裝置11和掩模儲備裝置12分別連接。 在輸送室13內配置有輸送基板W或掩模的輸送機器人14。輸送機器人14例如是具有在多關節臂安裝有保持基板W或掩模的機械手的構造的機器人。 在成膜裝置11中，從成膜源放出的成膜材料經由掩模被形成於基板W。與輸送機器人14的基板W/掩模的交接、基板W與掩模的相對位置的調整(對準)、基板W向掩模上的固定、成膜等一系列的成膜步驟由成膜裝置11進行。 在用於製造有機EL顯示裝置的製造裝置中，成膜裝置11根據成膜的材料的種類能夠分為有機膜的成膜裝置和金屬性膜的成膜裝置，有機膜的成膜裝置通過蒸鍍或濺射將有機物的成膜材料形成於基板W。金屬性膜的成膜裝置通過蒸鍍或濺射將金屬性的成膜材料形成於基板W。 在用於製造有機EL顯示裝置的製造裝置中，將哪個成膜裝置配置於哪個位置根據製造的有機EL元件的層疊構造而不同，根據有機EL元件的層疊構造而配置有用於對其成膜的多個成膜裝置。 在有機EL元件的情況下，通常具有在形成有陽極的基板W上依次層疊電洞注入層、電洞傳輸層、發光層、電子傳輸層、電子注入層、陰極的構造，以能夠依次成膜這些層的方式沿著基板的流動方向配置適當的成膜裝置。 例如，在圖1中，成膜裝置11a對電洞注入層HIL和/或電洞傳輸層HTL進行成膜。成膜裝置11b、11f對藍色的發光層進行成膜，成膜裝置11c對紅色的發光層進行成膜，成膜裝置11d、11e對綠色的發光層進行成膜。成膜裝置11g對電子傳輸層ETL和/或電子注入層EIL進行成膜。成膜裝置11h配置成對陰極金屬膜進行成膜。在圖1所示的實施方式中，在原材料的特性上，藍色的發光層和綠色的發光層的成膜速度比紅色的發光層的成膜速度慢，因此，為了取得處理速度的平衡，分別用2個成膜裝置對藍色的發光層和綠色的發光層進行成膜，但本發明並不限定於此，也可以具有其他配置構造。 在掩模儲備裝置12中，成膜裝置11的成膜工序所使用的新的掩模和已使用的掩模分開收納在多個盒體中。輸送機器人14將已使用的掩模從成膜裝置11輸送到掩模儲備裝置12的盒體，將收納於掩模儲備裝置12的其他盒體的新的掩模輸送到成膜裝置11。 將多個集群裝置1之間連結的中繼裝置包括在集群裝置1之間輸送基板W的通路室15。 輸送室13的輸送機器人14從上游側的通路室15接收基板W，輸送到該集群裝置1內的成膜裝置11之一(例如，成膜裝置11a)。另外，輸送機器人14從多個成膜裝置11之一(例如，成膜裝置11e)接收該集群裝置1中的成膜處理已完成的基板W，將其輸送到與下游側連結的通路室15。 中繼裝置能夠除了通路室15之外還包括用於吸收上游側的集群裝置1和下游側的集群裝置1中的基板W的處理速度之差的緩衝室(未圖示)以及用於改變基板W的方向的迴旋室(未圖示)。例如，緩衝室包括臨時收納多個基板W的基板裝載部。迴旋室包括用於使基板W旋轉180度的基板旋轉機構(例如，旋轉台或輸送機器人)。由此，在上游側的集群裝置和下游側的集群裝置之間基板W的朝向變得相同，基板處理變得容易。 通路室15也可以包括用於臨時收納多個基板W的基板裝載部(未圖示)、基板旋轉機構。也就是說，通路室15也可以兼具緩衝室、迴旋室的功能。 構成集群裝置1的成膜裝置11、掩模儲備裝置12、輸送室13等在有機發光元件的製造過程中維持為高真空狀態。中繼裝置的通路室15通常維持為低真空狀態，但根據需要也可以維持為高真空狀態。 構成有機EL元件的多個層的成膜已完成的基板W輸送到用於密封有機EL元件的密封裝置(未圖示)、用於將基板切割為規定的面板尺寸的切割裝置(未圖示)等。 在本實施方式中，參照圖1，說明了電子器件的製造裝置的結構，但本發明並不限定於此，可以具有其他種類的裝置、腔室，這些裝置、腔室之間的配置也可以改變。 例如，本發明的電子器件製造裝置也可以不是圖1所示的集群式，而是直列式。也就是說，也可以設為將基板W和掩模搭載於載體，一邊使其在排成一列的多個成膜裝置內輸送一邊進行成膜的結構。另外，也可以具有將集群式和直列式組合而成的類型的構造。例如，可以直到有機層的成膜為止由集群式的製造裝置進行，從電極層(陰極層)的成膜工序到密封工序及切割工序等由直列式的製造裝置進行。 以下，說明成膜裝置11的具體的結構。 ＜成膜裝置＞ 圖2是示意性地表示成膜裝置11的結構的剖視圖。在以下的說明中，使用將垂直方向設為Z方向、將水平面設為XY平面的XYZ直角坐標系。另外，用θX表示繞X軸的旋轉角，用θY表示繞Y軸的旋轉角，用θZ表示繞Z軸的旋轉角。 圖2是表示通過加熱成膜材料而使其蒸發或昇華、經由掩模M形成於基板W的成膜裝置11的一例的剖視圖。 成膜裝置11包括：真空容器21，其維持為真空環境或氮氣等非活性氣體環境；基板保持器24，其設置於真空容器21內，保持基板W；基板保持器驅動機構22，其設置於真空容器21內，用於在至少X方向、Y方向以及θZ方向上驅動基板保持器24；掩模保持器23，其設置於真空容器21內，支承掩模M；掩模保持器驅動機構28，其用於在至少X方向、Y方向、θZ方向上驅動掩模保持器23；以及成膜源25，其設置於真空容器21內，收納成膜材料，在成膜時使成膜材料顆粒化並放出。 成膜裝置11能夠還包括用於通過磁力將掩模M向基板W側吸引的磁力施加手段26。磁力施加手段26也可以兼作用於抑制基板W的溫度上升的冷卻手段(例如，冷卻板)。 成膜裝置11的真空容器21包括：第1真空容器部211，其配置有基板保持器驅動機構22；以及第2真空容器部212，其配置有成膜源25，例如通過與第2真空容器部212連接的真空泵P將整個真空容器21的內部空間維持為高真空狀態。在圖2中，示出了真空泵與第2真空容器部212連接，但本發明並不限定於此，也可以將真空泵與第1真空容器部211連接。 另外，至少在第1真空容器部211與第2真空容器部212之間設置有可伸縮構件213。可伸縮構件213減少來自與第2真空容器部212連結的真空泵的振動、來自設置有成膜裝置11的地面或地板的振動(地面振動)通過第2真空容器部212向第1真空容器部211傳遞。可伸縮構件213例如為波紋管，但只要能夠在第1真空容器部211與第2真空容器部212之間降低振動的傳遞，也可以使用其他構件。 成膜裝置11還包括支承真空容器21的至少一部分(例如，圖2所示的第1真空容器部211)的真空容器支承體217。 真空容器支承體217不僅支承真空容器21，還作為直接或經由其他構成要素支承成膜裝置的其他支承體(例如，基板保持器驅動機構支承體215或掩模保持器支承體216等)的基座支承體發揮功能。真空容器21也可以不直接由真空容器支承體217支承，而是由基板保持器驅動機構支承體215、掩模保持器支承體216支承。 基板保持器24是保持由輸送室13的輸送機器人14輸送來的、作為被成膜體的基板W的手段，設置於後述的基板保持器驅動機構22的可動台的微動台板部222。 基板保持器24是基板夾緊手段或基板吸附手段。作為基板保持器24的基板吸附手段例如是具有在電介質/絕緣體(例如，陶瓷材質)基體內埋設置有金屬電極等電路的構造的靜電吸盤或黏著式吸附手段。 作為基板保持器24的靜電吸盤可以是在電極與吸附面之間夾設電阻相對較高的電介質、利用電極與被吸附體之間的庫侖力進行吸附的庫侖力類型的靜電吸盤，也可以是在電極與吸附面之間夾設電阻相對較低的電介質、利用在電介質的吸附面與被吸附體之間產生的詹森·拉別克力進行吸附的詹森·拉別克力類型的靜電吸盤，還可以是利用不均勻電場吸附被吸附體的梯度力類型的靜電吸盤。 在被吸附體為導體或半導體(矽晶圓)的情況下，優選使用庫侖力類型的靜電吸盤或詹森·拉別克力類型的靜電吸盤，在被吸附體為玻璃這樣的絕緣體的情況下，優選使用梯度力類型的靜電吸盤。 靜電吸盤可以由一個板形成，也可以形成為具有多個副板。另外，在由一個板形成的情況下，也可以在其內部具有多個電路，控制為在一個板內根據位置不同而靜電引力不同。 基板保持器驅動機構22是用於通過磁懸浮線性馬達驅動基板保持器24來調整基板W的位置的對準台機構，調整至少X方向、Y方向以及θZ方向上的基板保持器24的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的基板保持器24的位置。 基板保持器驅動機構22包括作為固定台發揮功能的台基準板部221、作為可動台發揮功能的微動台板部222以及用於使微動台板部222相對於台基準板部221磁懸浮和移動的磁懸浮單元223。 如圖2所示，基板保持器驅動機構22設置於從真空容器支承體217延伸的基板保持器驅動機構支承體215。也可以在基板保持器驅動機構支承體215與第1真空容器部211之間設置可伸縮構件213。由此，能夠進一步減少外部振動經由基板保持器驅動機構支承體215向基板保持器驅動機構22傳遞。 這樣，通過使用與基板W在物理上不接觸的磁懸浮式的驅動機構作為基板保持器驅動機構22，能夠抑制地面振動、來自真空泵(P)的振動、門閥的振動、來自輸送機器人14的振動向基板W傳遞。但是，本發明並不限定於此，除了磁懸浮式的驅動機構之外，也可以使用空氣軸承機構這樣的其他非接觸懸浮式驅動機構。 掩模保持器23是支承由輸送機器人14送入到真空容器內的掩模M的手段。送入到真空容器內的掩模M至少在對準時和成膜時載置於掩模保持器23。掩模保持器23設置為經由掩模保持器支承體216與後述的掩模保持器驅動機構28連結。如圖2所示，掩模保持器23和掩模保持器支承體216也可以構成從掩模保持器驅動機構28延伸的一個支承體。 在掩模保持器23能夠設置用於檢測支承於基板保持器24的基板W的位置的位置檢測機構231。位置檢測機構231只要能夠檢測基板W、基板保持器24或者微動台板部222的位置，其種類就沒有特別限制。 例如，位置檢測機構231可以是包括雷射干涉儀和反射鏡的雷射干涉測長儀，也可以是靜電電容感測器、非接觸的位移計、光學式的刻度尺。 掩模M具有與形成在基板W上的薄膜圖案對應的開口圖案。掩模M的開口圖案由不使成膜材料的顆粒通過的阻斷圖案定義。作為掩模的材料，使用因瓦合金材料、矽、銅、鎳、不銹鋼等金屬材料。 例如，為了製造VR-HMD用的有機EL顯示面板所使用的掩模M包括形成有與有機EL元件的發光層的RGB像素圖案對應的微細的開口圖案的金屬制掩模即精細金屬掩模(Fine Metal Mask)和為了形成有機EL元件的通用層(電洞注入層、電洞傳輸層、電子傳輸層、電子注入層等)所使用的開口掩模(Open Mask)。 掩模保持器驅動機構28是用於調整掩模保持器23的位置的驅動機構，包括能夠使掩模保持器23在水準方向(XYθZ方向)上移動的粗動台機構28a和能夠使粗動台機構28a在垂直方向即Z方向上升降的粗動Z升降機構28b。粗動台機構28a能夠移動以使形成於基板W和掩模M的對準標記進入到後述的對準相機的視野內，粗動Z升降機構28b能夠容易地調整基板W與掩模M之間的垂直方向上的間隔。 粗動台機構28a和粗動Z升降機構28b例如由伺服馬達和滾珠螺桿(未圖示)等機械地驅動。 掩模保持器驅動機構28經由振動傳遞抑制構件29設置於真空容器支承體217之上。 振動傳遞抑制構件29抑制掩模保持器驅動機構28與真空容器支承體217之間的振動的傳遞。更具體而言，振動傳遞抑制構件29能夠抑制地面振動、從真空容器21傳遞的真空泵(P)的振動、真空容器21的門閥的振動、從輸送基板和掩模的輸送機器人14傳遞的振動經由掩模保持器驅動機構28向掩模保持器23傳遞。 另外，能夠抑制基板保持器驅動機構22驅動時的反作用力經由基板保持器驅動機構支承體215、真空容器支承體217向掩模保持器23、設置於掩模保持器23上的位置檢測機構231傳遞。由此，能夠抑制在基板保持器驅動機構22的控制中的頻率特性上可能成為控制的干擾的基板保持器驅動機構支承體215等的共振振動的激發，因此能夠穩定地控制到更高頻率，結果，能夠提高對準精度。 振動傳遞抑制構件29也可以設置於真空容器支承體217與基板保持器驅動機構22之間。例如，振動傳遞抑制構件29可以設置於基板保持器驅動機構支承體215與真空容器支承體217之間，或者也可以設置於由多個支承構件構成的基板保持器驅動機構支承體215的支承構件之間(參照圖4)。 振動傳遞抑制構件29也可以是主動減振裝置、減振橡膠這樣的被動減振裝置。在將振動傳遞抑制構件29設為主動減振裝置的情況下，無論振動的類型、大小、方向等如何都能夠有效地抑制振動的傳遞。 成膜源25包括收納被形成於基板W的成膜材料的坩堝(未圖示)、用於加熱坩堝的加熱器(未圖示)、在從成膜源25的蒸鍍率變得恒定之前阻止成膜材料向基板飛散的擋板(未圖示)等。在成膜源25設置有放出顆粒化的成膜材料的一個以上的放出孔，掩模M和基板W以使成膜面朝向放出孔的方式配置於該放出孔所指向的前方。 成膜源25根據用途而具有多種多樣的結構，如點(point)成膜源、線狀(linear)成膜源等。 成膜源25也可以包括收納互不相同的成膜材料的多個坩堝。在這樣的結構中，也可以將收納不同的成膜材料的多個坩堝設置為能夠移動到成膜位置，以便不使真空容器21大氣開放就能夠變更成膜材料。 磁力施加手段26是用於在成膜工序時通過磁力將掩模M向基板W側吸引而使其緊貼的手段，設置為能夠在垂直方向上升降。例如，磁力施加手段26由電磁體和/或永磁體構成。 雖在圖2中未圖示，但成膜裝置11也可以包括用於測定在基板上蒸鍍的膜的厚度的膜厚監視器(未圖示)和膜厚計算單元(未圖示)。 在真空容器21的上部外側(大氣側)設置有用於使磁力施加手段26升降的磁力施加手段升降機構261。 成膜裝置11還包括設置於真空容器21的上部外側(大氣側)並用於對形成於基板W和掩模M的對準標記進行拍攝的對準用相機單元27。 在本實施方式中，對準用相機單元27能夠包括用於粗略地調整基板W與掩模M的相對位置的粗對準用相機和用於高精度地調整基板W與掩模M的相對位置的精對準用相機。粗對準用相機相對而言視角較寬，解析度較低，景深較深，而精對準用相機相對而言視角較窄，但具有高解析度，景深較淺。 粗對準用相機和精對準用相機設置於與形成於基板W和掩模M的對準標記對應的位置。例如，在基板W為圓形的晶圓的情況下，粗對準用相機的兩個相機設置於矩形的對角上的兩個角部，精對準用相機設置於剩餘的兩個角部。但是，本發明的對準用相機的配置並不限定於此，也可以根據基板W和掩模M的對準標記的位置而具有其他配置。 如圖2所示，成膜裝置11的對準用相機單元27從真空容器21的上部大氣側通過設置於真空容器21的觀察孔214對對準標記進行拍攝。 在圖2中，對準用相機單元27設置於基板保持器驅動機構支承體217側，但本發明並不限定於此，也可以設置於掩模保持器支承體215側。 雖在圖2中未圖示，但由於在成膜工序中密閉的真空容器21的內部較暗，因此，為了通過對準用相機拍攝對準標記，也可以設置從下方照射對準標記的照明光源。 成膜裝置11具備控制部(未圖示)。控制部具有基板W/掩模M的輸送和對準的控制、成膜的控制等功能。另外，控制部也可以具有控制對靜電吸盤的電壓施加的功能。控制部在控制對準時，特別是基於由位置檢測機構231檢測到的位置進行回饋控制。 控制部例如能夠由具有處理器、記憶體、儲存器、I/O等的電腦構成。在該情況下，控制部的功能通過處理器執行存儲於記憶體或儲存器的程式來實現。作為電腦，可以使用通用的個人電腦，也可以使用嵌入式電腦或PLC (Programmable Logic Controller)。或者，也可以由ASIC、FPGA這樣的電路構成控制部的一部分或全部功能。另外，可以按每個成膜裝置設置控制部，也可以構成為一個控制部控制多個成膜裝置。 ＜振動傳遞抑制機構＞ 以下，參照圖3～圖5，詳細說明本發明的實施方式的成膜裝置11中的振動傳遞抑制機構。其中，在圖3～圖5中，為了更清楚地表示振動傳遞抑制機構，簡化成膜裝置11的一部分結構地進行圖示。 ＜第1實施方式＞ 圖3是表示第1實施方式的具備振動傳遞抑制機構的成膜裝置311的示意圖。 參照圖3，成膜裝置311包括內部例如維持為真空環境的真空容器321。真空容器321的至少一部分由設置於其外部的真空容器支承體317支承。 在真空容器321內設置有保持基板W的基板保持器(未圖示)和支承掩模M的掩模保持器323。基板保持器是吸附並保持基板W的靜電吸盤，但並不限定於此。掩模保持器323由從掩模保持器驅動機構328延伸的掩模保持器支承體316支承在真空容器321內。 基板保持器驅動機構322是用於驅動基板保持器的機構，由從真空容器支承體317延伸的基板保持器驅動機構支承體315支承在真空容器321內。根據本實施方式，基板保持器驅動機構322是用於通過磁懸浮線性馬達使基板保持器非接觸地移動來調整基板W的位置的磁懸浮式的驅動機構，能夠調整至少X方向、Y方向以及θZ方向上的基板W的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的基板W的位置。 掩模保持器驅動機構328是用於使掩模保持器323移動來調整掩模M的位置的機械式的驅動機構。掩模保持器驅動機構328能夠調整至少X方向、Y方向、Z方向以及θZ方向上的掩模M的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的掩模M的位置。掩模保持器驅動機構328設置於真空容器321的外部，由伺服馬達、滾動的線性導件以及滾珠螺桿等構成。 這樣的掩模保持器驅動機構328經由振動傳遞抑制構件329設置於真空容器支承體317上。也就是說，振動傳遞抑制構件329設置於掩模保持器驅動機構328與真空容器支承體317之間。也可以在基板保持器驅動機構支承體315與真空容器支承體317之間也設置振動傳遞抑制構件。也可以僅在基板保持器驅動機構支承體315與真空容器支承體317之間設置振動傳遞抑制構件。 本實施方式的成膜裝置311能夠還包括設置於掩模保持器323並用於檢測由基板保持器保持的基板W的位置的位置檢測機構331。例如，位置檢測機構331能夠選擇雷射干涉測長儀、靜電電容感測器、非接觸的位移計或者光學式的刻度尺。 本實施方式的成膜裝置311能夠還包括經由基板保持器驅動機構支承體315設置於真空容器321的上部外側並用於對形成於基板W和掩模M的對準標記進行拍攝的對準用相機單元327。 根據本實施方式，基板保持器驅動機構322由不與基板W或基板保持器接觸地調整基板W的位置的磁懸浮式的驅動機構構成。另外，調整掩模M的位置的機械式的驅動機構即掩模保持器驅動機構328經由振動傳遞抑制構件329設置於真空容器支承體317上。 根據這樣的結構，能夠抑制地面振動、從真空容器321傳遞的真空泵P的振動、門閥的振動、從輸送基板W和掩模M的輸送機器人14傳遞的振動向掩模保持器驅動機構328傳遞。 另外，即使作為磁懸浮式的驅動機構的基板保持器驅動機構322驅動時的反作用力經由基板保持器驅動機構支承體315向真空容器支承體317傳遞，也能夠通過振動傳遞抑制構件329抑制向掩模保持器323、設置於掩模保持器323上的位置檢測機構331傳遞。由此，能夠抑制在基板保持器驅動機構322的控制中的頻率特性上可能成為控制的干擾的基板保持器驅動機構支承體315、掩模保持器支承體316等的共振振動的激發，因此能夠穩定地控制到更高頻率，結果，能夠提高對準精度。 ＜第2實施方式＞ 圖4是表示第2實施方式的具備振動傳遞抑制機構的成膜裝置411的示意圖。 圖4所示的成膜裝置411中，基板保持器驅動機構422是設置於真空容器421的外部的機械式的驅動機構，掩模保持器驅動機構428是設置於真空容器421內的磁懸浮式的驅動機構。另外，振動傳遞抑制構件429設置於真空容器支承體417與基板保持器驅動機構422之間。以下，以與圖3所示的成膜裝置311的振動傳遞抑制機構之間的不同為中心，說明本實施方式的成膜裝置411的振動傳遞抑制機構。 參照圖4，成膜裝置411包括內部例如維持為真空環境的真空容器421。真空容器421的至少一部分由設置於其外部的真空容器支承體417支承。 在真空容器421內設置有保持基板W的基板保持器424和保持掩模M的掩模保持器(未圖示)。基板保持器424是吸附並保持基板W的靜電吸盤或夾緊機構。掩模保持器是吸附並保持掩模M的靜電吸盤。 掩模保持器驅動機構428是用於使掩模保持器(未圖示)移動來調整掩模M的位置的驅動機構，由從真空容器支承體417延伸的掩模保持器驅動機構支承體423支承於真空容器421內。由此，掩模保持器驅動機構支承體423通過支承掩模保持器驅動機構428而支承掩模M，也作為掩模保持器支承體發揮功能。 根據本實施方式，掩模保持器驅動機構428是用於通過磁懸浮線性馬達使掩模保持器非接觸地移動來調整掩模M的位置的磁懸浮式的驅動機構，能夠調整至少X方向、Y方向以及θZ方向上的掩模M的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的掩模M的位置。 基板保持器驅動機構422是用於使基板保持器424移動來調整基板W的位置的機械式的驅動機構，構成為能夠調整至少X方向、Y方向、Z方向以及θZ方向上的基板W的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的基板W的位置。基板保持器驅動機構422設置於真空容器421的外部，由伺服馬達、滾動的線性導件以及滾珠螺桿等構成。 基板保持器驅動機構422由從真空容器支承體417延伸設置的基板保持器驅動機構支承體415支承。在本實施方式中，基板保持器驅動機構支承體415包括：第1支承構件415a，其配置於真空容器421的上部外側，設置有基板保持器驅動機構422；以及第2支承構件415b，其從真空容器支承體417延伸，支承第1支承構件415a。為了抑制振動傳遞，真空容器421和第1支承構件415a也可以經由未圖示的可伸縮構件連結。 而且，在本實施方式的成膜裝置411中，在真空容器支承體417與基板保持器驅動機構422之間，特別是在第1支承構件415a與第2支承構件415b之間設置有用於抑制向基板保持器驅動機構422側的振動傳遞的振動傳遞抑制構件429。越是在真空容器支承體417與基板保持器驅動機構422之間靠近基板保持器驅動機構422地設置振動傳遞抑制構件429，越能夠更有效地抑制向基板保持器驅動機構422傳遞的振動。但是，本發明並不限定於此，也可以在其他位置設置振動傳遞抑制構件429。例如，可以在第2支承構件415b與真空容器支承體417之間設置振動傳遞抑制構件，也可以在第1支承構件415a與第2支承構件415b之間以及第2支承構件415b與真空容器支承體417之間全都設置振動傳遞抑制構件。 本實施方式的成膜裝置411能夠還包括設置於基板保持器424並用於測定由掩模保持器保持的掩模M的位置的位置檢測機構431。例如，位置檢測機構431能夠選擇雷射干涉測長儀、靜電電容感測器、非接觸的位移計或者光學式的刻度尺。 雖然在圖4中未示出，但在本實施方式的成膜裝置411中，能夠將用於拍攝形成於基板W和掩模M的對準標記的對準用相機單元設置於真空容器421的上部外側。作為一例，對準用相機單元也可以設置於掩模保持器驅動機構支承體423側。對準用相機單元也可以設置於基板保持器驅動機構支承體415(例如，第1支承構件415a)。 根據本實施方式，在調整基板W的位置的機械式的驅動機構即基板保持器驅動機構422與真空容器支承體417之間設置有振動傳遞抑制構件429。另外，掩模保持器驅動機構428由不與掩模M或掩模保持器接觸地調整掩模M的位置的磁懸浮式的驅動機構構成。 由此，能夠抑制地面振動、從真空容器421傳遞的真空泵的振動、門閥的振動、從輸送基板W和掩模M的輸送機器人14傳遞的振動向基板保持器驅動機構422傳遞。 另外，即使作為磁懸浮式的驅動機構的掩模保持器驅動機構428驅動時的反作用力經由掩模保持器驅動機構支承體423向真空容器支承體417傳遞，也能夠通過振動傳遞抑制構件429抑制振動向基板保持器424、設置於基板保持器424的位置檢測機構431傳遞。由此，能夠抑制在掩模保持器驅動機構428的控制中的頻率特性上可能成為控制的干擾的基板保持器驅動機構支承體415、掩模保持器驅動機構支承體423等的共振振動的激發，因此能夠穩定地控制到更高頻率，結果，能夠提高對準精度。 ＜第3實施方式＞ 圖5是表示第3實施方式的具備振動傳遞抑制機構的成膜裝置511的示意圖。 參照圖5，成膜裝置511包括：真空容器521，其內部例如維持為真空環境；以及基座支承體517，其設置於成膜裝置511的外部，支承成膜裝置511的主要構成要素。 真空容器521支承於從基座支承體517延伸的基板保持器驅動機構支承體515。但是，本發明並不限定於此，例如，真空容器521也可以支承於掩模保持器支承體516來代替支承於基板保持器驅動機構支承體515。 一般而言，作為真空容器521的特徵，在內部為大氣壓環境的狀態和真空環境的狀態下，有時由於氣壓差而使形狀發生較大變化。所以，在真空容器521與基板保持器驅動機構支承體515的連接上，優選使用未圖示的運動耦合件、未圖示的真空波紋管等，以避免真空容器521的變形向基板保持器驅動機構支承體515傳遞。 另外，如圖5所示，為了避免真空容器521的變形傳遞到掩模保持器支承體516，能夠在真空容器521與掩模保持器支承體516之間也設置可伸縮構件513。 在真空容器521內設置有保持基板W的基板保持器(未圖示)和支承掩模M的掩模保持器523。基板保持器是吸附並保持基板W的靜電吸盤，但並不限定於此。掩模保持器523由從掩模保持器驅動機構528延伸的掩模保持器支承體516支承於真空容器521內。 基板保持器驅動機構522是用於驅動基板保持器的機構，由從基座支承體517延伸的基板保持器驅動機構支承體515支承於真空容器521內。根據本實施方式，基板保持器驅動機構522是用於通過磁懸浮線性馬達使基板保持器非接觸地移動來調整基板W的位置的磁懸浮式的驅動機構，能夠調整至少X方向、Y方向以及θZ方向上的基板W的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的基板W的位置。 掩模保持器驅動機構528是用於使掩模保持器523移動來調整掩模M的位置的機械式的驅動機構。掩模保持器驅動機構528能夠調整至少X方向、Y方向、Z方向以及θZ方向上的掩模M的位置，優選X方向、Y方向、Z方向、θX方向、θY方向、θZ方向這6個方向上的掩模M的位置。掩模保持器驅動機構528設置於真空容器521的外部，由伺服馬達、滾動的線性導件以及滾珠螺桿等構成。 這樣的掩模保持器驅動機構528經由振動傳遞抑制構件529設置於基座支承體517上。也就是說，振動傳遞抑制構件529設置於掩模保持器驅動機構528與基座支承體517之間。 本實施方式的成膜裝置511能夠還包括設置於掩模保持器523並用於測定由基板保持器保持的基板W的位置的位置檢測機構531。例如，位置檢測機構531能夠選擇雷射干涉測長儀、靜電電容感測器、非接觸的位移計或者光學式的刻度尺。 本實施方式的成膜裝置511能夠還包括經由掩模保持器支承體516設置於真空容器521的上部外側並用於拍攝形成於基板W和掩模M的對準標記的對準用相機單元527。即，對準用相機單元527設置於在振動傳遞抑制構件529上設置的掩模保持器支承體516。在振動傳遞抑制構件529設置於基板保持器驅動機構522與基座支承體517之間的實施方式中，對準用相機單元527也可以設置於基板保持器驅動機構支承體515。 根據本實施方式，如在第1實施方式、第2實施方式中詳細地說明的那樣，通過在掩模保持器驅動機構528或基板保持器驅動機構522與基座支承體517之間設置振動傳遞抑制構件529，能夠抑制地面振動、從真空泵、門閥、輸送基板W和掩模M的輸送機器人14傳遞的振動向掩模保持器驅動機構528和/或基板保持器驅動機構522傳遞。 另外，即使作為磁懸浮式的驅動機構的基板保持器驅動機構522驅動時的反作用力經由基板保持器驅動機構支承體515向基座支承體517傳遞，也能夠通過振動傳遞抑制構件529抑制向掩模保持器523、設置於掩模保持器523上的位置檢測機構531傳遞。由此，能夠抑制在基板保持器驅動機構522的控制中的頻率特性上可能成為控制的干擾的基板保持器驅動機構支承體515、掩模保持器支承體516等的共振振動的激發，因此能夠穩定地控制到更高頻率，結果，能夠提高對準精度。 另外，在掩模保持器驅動機構528、基板保持器驅動機構522與基座支承體517之間設置振動傳遞抑制構件529的情況下，由於振動傳遞抑制構件529的機構特性，載置於振動傳遞抑制構件529上的基板W或者掩模M的靜止位置有時會發生變動。因此，基板W或者掩模M有可能脫離對準用相機單元527、特別是景深較淺的精對準用相機的景深而使畫質變差，結果，導致對準精度的降低。 根據本實施方式，為了能夠抑制因振動傳遞抑制構件529的設置而導致的對準精度的降低，對準用相機單元527設置於掩模保持器支承體516或基板保持器驅動機構支承體515中的、在與基座支承體517之間夾設有振動傳遞抑制構件529的支承體側。根據這樣的結構，即使在對準用相機單元527使用景深較淺的高解析度的鏡頭的情況下，也不會受到振動傳遞抑制構件529的靜止穩定性的影響，能夠拍攝高畫質的圖像，測定基板W與掩模M的相對位置，能夠抑制對準精度的降低。 Below, the form for implementing this invention is demonstrated based on drawing. The following embodiments and examples illustrate preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, the hardware configuration and software configuration, process flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatus in the following description are not intended to limit the scope of the present invention only as long as they are not described as limiting. The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum deposition. As the material of the substrate, an arbitrary material such as a semiconductor (for example, silicon), glass, a film of a polymer material, and a metal can be selected. The substrate may be, for example, a silicon wafer or a substrate in which a film such as polyimide is laminated on a glass substrate. Moreover, as a film-forming material, arbitrary materials, such as an organic material and a metallic material (metal, metal oxide, etc.), can also be selected. In addition, the present invention can be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus, in addition to a vacuum vapor deposition apparatus based on heating evaporation. Specifically, the technology of the present invention can be applied to manufacturing apparatuses of various electronic devices such as semiconductor devices, magnetic devices, and electronic components, optical components, and the like. As a specific example of an electronic device, a light-emitting element, a photoelectric conversion element, a touch panel, etc. are mentioned. Among them, the present invention can be preferably applied to an apparatus for producing organic light-emitting elements such as OLEDs, and organic photoelectric conversion elements such as organic thin-film solar cells. In addition, the electronic device of the present invention also includes a display device (eg, an organic EL display device) having a light-emitting element, a lighting device (eg, an organic EL lighting device), and a sensor having a photoelectric conversion element (eg, an organic CMOS image sensor) ). <Manufacturing apparatus of an electronic device> FIG. 1 : is a top view which shows typically the partial structure of the manufacturing apparatus of an electronic device. The manufacturing apparatus of FIG. 1 is used for manufacture of the display panel of the organic electroluminescent display apparatus for VR HMD, for example. In the case of a display panel for VR HMD, for example, after a silicon wafer of a predetermined size (for example, 300 mm) is formed into a film for forming an organic EL element, the film is formed along the area (scribed) between the element formation regions. line area) to cut the silicon wafer and make a number of small-sized panels. The manufacturing apparatus of the electronic device of the present embodiment generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices. The cluster apparatus 1 is provided with the film-forming apparatus 11 which processes (for example, film-forming) the board|substrate W, the mask stock apparatus 12 which accommodates the mask before and after use, and the conveyance chamber 13 arrange|positioned in the center. As shown in FIG. 1 , the transport chamber 13 is connected to the film forming apparatus 11 and the mask stocking apparatus 12, respectively. A transport robot 14 that transports the substrate W or the mask is arranged in the transport chamber 13 . The transport robot 14 is, for example, a robot having a structure in which a manipulator for holding the substrate W or the mask is attached to the articulated arm. In the film formation apparatus 11, the film formation material discharged from the film formation source is formed on the substrate W through a mask. A series of film forming steps, such as handover of the substrate W/mask to and from the transport robot 14, adjustment (alignment) of the relative position of the substrate W and the mask, fixing of the substrate W to the mask, and film formation, are performed by the film forming apparatus. 11 to proceed. In the production apparatus for producing an organic EL display device, the film forming apparatus 11 can be classified into a film forming apparatus for an organic film and a film forming apparatus for a metallic film according to the type of the material to be formed. The organic film-forming material is formed on the substrate W by plating or sputtering. The film-forming apparatus for a metallic film forms a metallic film-forming material on the substrate W by vapor deposition or sputtering. In a manufacturing apparatus for manufacturing an organic EL display device, which film-forming apparatus is arranged at which position differs depending on the lamination structure of the organic EL element to be manufactured, and a film-forming device is arranged according to the lamination structure of the organic EL element. Multiple film forming devices. In the case of an organic EL element, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are usually stacked in this order on the substrate W on which the anode is formed, so that film formation can be performed in this order. An appropriate film-forming apparatus is arranged along the flow direction of the substrate in such a manner as to form these layers. For example, in FIG. 1, the film-forming apparatus 11a forms a film of the hole injection layer HIL and/or the hole transport layer HTL. The film forming apparatuses 11b and 11f form a blue light emitting layer, the film forming apparatus 11c forms a red light emitting layer, and the film forming apparatuses 11d and 11e form a green light emitting layer. The film-forming apparatus 11g forms a film of the electron transport layer ETL and/or the electron injection layer EIL. The film forming apparatus 11h is configured to form a cathode metal film. In the embodiment shown in FIG. 1 , in terms of the characteristics of the raw materials, the film formation rates of the blue light-emitting layer and the green light-emitting layer are slower than the film-forming rate of the red light-emitting layer. Therefore, in order to balance the processing speed, The blue light-emitting layer and the green light-emitting layer are respectively formed into films by two film forming apparatuses, but the present invention is not limited to this, and may have other arrangement structures. In the mask stocker 12 , new masks and used masks used in the film-forming process of the film-forming apparatus 11 are separately accommodated in a plurality of cassettes. The transport robot 14 transports used masks from the film forming apparatus 11 to the cassette of the mask stocking apparatus 12 , and transports new masks stored in other cassettes of the mask stocking apparatus 12 to the film forming apparatus 11 . The relay device that connects the plurality of cluster devices 1 includes a passage chamber 15 that transports the substrate W between the cluster devices 1 . The transfer robot 14 of the transfer chamber 13 receives the substrate W from the passage chamber 15 on the upstream side, and transfers the substrate W to one of the film forming apparatuses 11 (for example, the film forming apparatus 11 a ) in the cluster apparatus 1 . In addition, the conveying robot 14 receives the substrate W on which the film formation processing in the cluster apparatus 1 has been completed from one of the plurality of film formation apparatuses 11 (for example, the film formation apparatus 11 e ), and conveys it to the passage chamber 15 connected to the downstream side. . The relay device can include, in addition to the passage chamber 15 , a buffer chamber (not shown) for absorbing the difference in the processing speed of the substrates W in the cluster device 1 on the upstream side and the cluster device 1 on the downstream side, and for changing the substrate. A swirl chamber (not shown) in the direction of W. For example, the buffer chamber includes a substrate loading portion in which a plurality of substrates W are temporarily accommodated. The swirl chamber includes a substrate rotation mechanism (eg, a turntable or a transfer robot) for rotating the substrate W by 180 degrees. Thereby, the orientation of the substrate W becomes the same between the cluster device on the upstream side and the cluster device on the downstream side, and the substrate handling becomes easy. The passage chamber 15 may include a substrate loading unit (not shown) for temporarily accommodating a plurality of substrates W, and a substrate rotating mechanism. That is, the passage chamber 15 may serve as both the buffer chamber and the swirl chamber. The film forming apparatus 11 , the mask stocking apparatus 12 , the transfer chamber 13 , and the like that constitute the cluster apparatus 1 are maintained in a high vacuum state during the manufacturing process of the organic light-emitting element. The passage chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state as necessary. The substrate W on which the film formation of a plurality of layers constituting the organic EL element has been completed is transported to a sealing device (not shown) for sealing the organic EL element, and a cutting device (not shown) for cutting the substrate into a predetermined panel size. )Wait. In this embodiment, referring to FIG. 1 , the configuration of an electronic device manufacturing apparatus has been described, but the present invention is not limited to this, and other types of apparatuses and chambers may be provided, and the arrangement between these apparatuses and chambers may also be Change. For example, the electronic device manufacturing apparatus of the present invention may not be a cluster type as shown in FIG. 1 but an in-line type. That is, the substrate W and the mask may be mounted on a carrier, and film formation may be performed while being transported in a plurality of film formation apparatuses arranged in a row. Moreover, you may have the type of structure which combined a cluster type and an in-line type. For example, a cluster-type manufacturing apparatus may perform the film formation of the organic layer, and an in-line type manufacturing apparatus may perform the film-forming process of the electrode layer (cathode layer), the sealing process, the dicing process, and the like. Hereinafter, the specific configuration of the film forming apparatus 11 will be described. <Film Formation Apparatus> FIG. 2 is a cross-sectional view schematically showing the configuration of the film formation apparatus 11 . In the following description, an XYZ rectangular coordinate system is used, in which the vertical direction is the Z direction and the horizontal plane is the XY plane. In addition, the rotation angle around the X axis is represented by θX, the rotation angle around the Y axis is represented by θY, and the rotation angle around the Z axis is represented by θZ. 2 is a cross-sectional view showing an example of a film forming apparatus 11 that vaporizes or sublimates a film forming material by heating and forms it on a substrate W through a mask M. As shown in FIG. The film forming apparatus 11 includes: a vacuum container 21 maintained in a vacuum environment or an inert gas environment such as nitrogen; a substrate holder 24 provided in the vacuum container 21 to hold the substrate W; and a substrate holder drive mechanism 22 provided in Inside the vacuum vessel 21, for driving the substrate holder 24 in at least the X direction, the Y direction, and the θZ direction; the mask holder 23, which is installed in the vacuum vessel 21 and supports the mask M; the mask holder driving mechanism 28 , which is used to drive the mask holder 23 in at least the X direction, the Y direction, and the θZ direction; and the film formation source 25 , which is provided in the vacuum container 21 and accommodates the film formation material and makes the film formation material particles during film formation. melted and released. The film forming apparatus 11 can further include a magnetic force applying means 26 for attracting the mask M to the substrate W side by a magnetic force. The magnetic force applying means 26 may also serve as a cooling means (eg, a cooling plate) for suppressing the temperature rise of the substrate W. The vacuum chamber 21 of the film forming apparatus 11 includes: a first vacuum chamber part 211 in which the substrate holder drive mechanism 22 is arranged; and a second vacuum chamber part 212 in which the film formation source 25 is arranged, for example, by communicating with the second vacuum chamber The vacuum pump P connected to the part 212 maintains the entire inner space of the vacuum container 21 in a high vacuum state. In FIG. 2 , the vacuum pump is shown connected to the second vacuum container part 212 , but the present invention is not limited to this, and the vacuum pump may be connected to the first vacuum container part 211 . In addition, a telescopic member 213 is provided between at least the first vacuum container portion 211 and the second vacuum container portion 212 . The retractable member 213 reduces vibration from the vacuum pump connected to the second vacuum container portion 212 , and vibration from the floor or floor on which the film forming apparatus 11 is installed (floor vibration) to the first vacuum container portion 211 through the second vacuum container portion 212 . transfer. The retractable member 213 is, for example, a bellows, but other members may be used as long as the transmission of vibration can be reduced between the first vacuum container portion 211 and the second vacuum container portion 212 . The film forming apparatus 11 further includes a vacuum vessel support body 217 that supports at least a part of the vacuum vessel 21 (for example, the first vacuum vessel portion 211 shown in FIG. 2 ). The vacuum container support 217 not only supports the vacuum container 21 but also serves as a base for supporting other supports (for example, the substrate holder drive mechanism support 215, the mask holder support 216, etc.) of the film forming apparatus directly or via other components. The seat support body functions. The vacuum container 21 may not be directly supported by the vacuum container support body 217 , but may be supported by the substrate holder drive mechanism support body 215 and the mask holder support body 216 . The substrate holder 24 is a means for holding the substrate W as a film-formed body conveyed by the conveyance robot 14 of the conveyance chamber 13 , and is provided on a fine movement platen portion 222 of a movable table of the substrate holder drive mechanism 22 to be described later. The substrate holder 24 is a substrate clamping means or a substrate suction means. The substrate suction means as the substrate holder 24 is, for example, an electrostatic chuck or an adhesive suction means having a structure in which a circuit such as a metal electrode is embedded in a dielectric/insulator (eg, ceramic material) base. The electrostatic chuck serving as the substrate holder 24 may be a Coulomb force type electrostatic chuck that sandwiches a dielectric with relatively high resistance between the electrode and the adsorption surface, and uses the Coulomb force between the electrode and the object to be adsorbed for adsorption, or may be an electrostatic chuck of the Coulomb force type. An electrostatic chuck of the Jensen-Rabek force type that sandwiches a relatively low-resistance dielectric between the electrode and the adsorption surface, and uses the Jensen-Rabek force generated between the adsorption surface of the dielectric and the object to be adsorbed to attract. It may also be a gradient force type electrostatic chuck that uses a non-uniform electric field to attract an object to be adsorbed. When the object to be adsorbed is a conductor or semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or an electrostatic chuck of the Jensen-Rabeke force type, and when the object to be adsorbed is an insulator such as glass, The gradient force type electrostatic chuck is preferably used. The electrostatic chuck may be formed of a single plate, or may be formed to have multiple sub-plates. In addition, in the case of forming with one plate, a plurality of circuits may be provided therein, and the electrostatic attractive force may be controlled to vary depending on the position within one plate. The substrate holder drive mechanism 22 is an alignment stage mechanism for adjusting the position of the substrate W by driving the substrate holder 24 by a magnetic levitation linear motor, and adjusts the position of the substrate holder 24 in at least the X direction, the Y direction, and the θZ direction, preferably The positions of the substrate holder 24 in the six directions of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction. The substrate holder drive mechanism 22 includes a table reference plate portion 221 functioning as a fixed table, a fine movement table portion 222 functioning as a movable table, and a magnetic levitation and movement of the fine movement table portion 222 relative to the table reference plate portion 221 . Magnetic levitation unit 223 . As shown in FIG. 2 , the substrate holder drive mechanism 22 is provided on the substrate holder drive mechanism support body 215 extending from the vacuum container support body 217 . A retractable member 213 may be provided between the substrate holder drive mechanism support body 215 and the first vacuum container portion 211 . Thereby, the transmission of external vibration to the substrate holder drive mechanism 22 via the substrate holder drive mechanism support body 215 can be further reduced. In this way, by using a magnetic suspension type drive mechanism that does not physically contact the substrate W as the substrate holder drive mechanism 22, ground vibration, vibration from the vacuum pump (P), vibration of the gate valve, and vibration from the transfer robot 14 can be suppressed. Substrate W transfer. However, the present invention is not limited to this, and other non-contact suspension type drive mechanisms such as an air bearing mechanism may be used in addition to the magnetic suspension type drive mechanism. The mask holder 23 is a means for supporting the mask M sent into the vacuum container by the transfer robot 14 . The mask M sent into the vacuum container is placed on the mask holder 23 at least during alignment and film formation. The mask holder 23 is provided so as to be connected to a mask holder drive mechanism 28 described later via a mask holder support body 216 . As shown in FIG. 2 , the mask holder 23 and the mask holder support body 216 may constitute one support body extending from the mask holder drive mechanism 28 . The mask holder 23 can be provided with a position detection mechanism 231 for detecting the position of the substrate W supported by the substrate holder 24 . The type of the position detection mechanism 231 is not particularly limited as long as the position detection mechanism 231 can detect the position of the substrate W, the substrate holder 24 or the micro-movement platen portion 222 . For example, the position detection mechanism 231 may be a laser interferometric length measuring instrument including a laser interferometer and a mirror, or may be an electrostatic capacitance sensor, a non-contact displacement meter, or an optical scale. The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate W. The opening pattern of the mask M is defined by a blocking pattern that does not allow the particles of the film-forming material to pass therethrough. As the material of the mask, metal materials such as invar material, silicon, copper, nickel, and stainless steel are used. For example, the mask M used to manufacture an organic EL display panel for VR-HMD includes a metal mask (fine metal mask ( Fine Metal Mask) and an open mask (Open Mask) used to form common layers (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of organic EL elements. The mask holder drive mechanism 28 is a drive mechanism for adjusting the position of the mask holder 23, and includes a coarse motion stage mechanism 28a capable of moving the mask holder 23 in the horizontal direction (XYθZ direction) and a coarse motion table mechanism 28a. The table mechanism 28a is a coarse movement Z lift mechanism 28b that lifts and lowers the vertical direction, that is, the Z direction. The coarse movement stage mechanism 28a can move so that alignment marks formed on the substrate W and the mask M can be brought into the field of view of an alignment camera to be described later, and the coarse movement Z elevating mechanism 28b can easily adjust the distance between the substrate W and the mask M. spacing in the vertical direction. The coarse motion table mechanism 28a and the coarse motion Z lift mechanism 28b are mechanically driven by, for example, a servo motor, a ball screw (not shown), or the like. The mask holder drive mechanism 28 is provided on the vacuum container support body 217 via the vibration transmission suppressing member 29 . The vibration transmission suppressing member 29 suppresses the transmission of vibration between the mask holder drive mechanism 28 and the vacuum vessel support body 217 . More specifically, the vibration transmission suppressing member 29 can suppress ground vibration, vibration of the vacuum pump (P) transmitted from the vacuum container 21 , vibration of the gate valve of the vacuum container 21 , and vibration transmitted from the conveying robot 14 that conveys the substrate and the mask via. The mask holder drive mechanism 28 is transmitted to the mask holder 23 . In addition, it is possible to suppress the reaction force when the substrate holder drive mechanism 22 is driven to the mask holder 23 and the position detection mechanism 231 provided on the mask holder 23 via the substrate holder drive mechanism support body 215 and the vacuum container support body 217 . transfer. As a result, the excitation of resonance vibration of the substrate holder drive mechanism support 215 and the like that may interfere with the control of the frequency characteristics of the substrate holder drive mechanism 22 can be suppressed, so that it is possible to stably control to a higher frequency, As a result, alignment accuracy can be improved. The vibration transmission suppressing member 29 may be provided between the vacuum container support body 217 and the substrate holder drive mechanism 22 . For example, the vibration transmission suppressing member 29 may be provided between the substrate holder drive mechanism support body 215 and the vacuum vessel support body 217 , or may be provided on the support member of the substrate holder drive mechanism support body 215 composed of a plurality of support members between (see Figure 4). The vibration transmission suppressing member 29 may be an active vibration damping device or a passive vibration damping device such as vibration damping rubber. When the vibration transmission suppressing member 29 is used as an active vibration damping device, the transmission of vibration can be effectively suppressed regardless of the type, magnitude, direction, and the like of vibration. The film formation source 25 includes a crucible (not shown) for accommodating the film formation material formed on the substrate W, a heater (not shown) for heating the crucible, and until the deposition rate from the film formation source 25 becomes constant A baffle (not shown) or the like that prevents scattering of the film-forming material to the substrate. The film-forming source 25 is provided with one or more discharge holes for discharging the pelletized film-forming material, and the mask M and the substrate W are arranged in front of the discharge holes so that the film-forming surface faces the discharge holes. The film formation source 25 has various structures depending on the application, such as a point film formation source, a linear film formation source, and the like. The film formation source 25 may include a plurality of crucibles that accommodate different film formation materials. In such a configuration, a plurality of crucibles containing different film-forming materials may be provided so as to be movable to the film-forming positions so that the film-forming materials can be changed without opening the vacuum vessel 21 to the atmosphere. The magnetic force applying means 26 is a means for attracting the mask M to the substrate W side by magnetic force during the film forming process to make the mask M come into close contact, and is provided so as to be able to move up and down in the vertical direction. For example, the magnetic force applying means 26 is constituted by an electromagnet and/or a permanent magnet. Although not shown in FIG. 2 , the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate. A magnetic force applying means elevating mechanism 261 for raising and lowering the magnetic force applying means 26 is provided on the upper outer side (atmosphere side) of the vacuum container 21 . The film forming apparatus 11 further includes an alignment camera unit 27 that is provided on the outer side (atmosphere side) of the upper portion of the vacuum chamber 21 and that captures an image of the alignment marks formed on the substrate W and the mask M. In the present embodiment, the alignment camera unit 27 can include a rough alignment camera for roughly adjusting the relative position of the substrate W and the mask M, and a fine alignment camera for adjusting the relative position of the substrate W and the mask M with high precision. Aim with the camera. Coarse alignment cameras have a relatively wide angle of view, lower resolution and deeper depth of field, while fine alignment cameras have a relatively narrow angle of view, but have high resolution and shallow depth of field. The cameras for rough alignment and the cameras for fine alignment are provided at positions corresponding to alignment marks formed on the substrate W and the mask M. For example, when the substrate W is a circular wafer, the two cameras for rough alignment are provided at two corners of the rectangle on the opposite corners, and the cameras for fine alignment are provided at the remaining two corners. However, the arrangement of the alignment cameras of the present invention is not limited to this, and may have other arrangements depending on the positions of the alignment marks of the substrate W and the mask M. As shown in FIG. 2 , the alignment camera unit 27 of the film forming apparatus 11 captures an image of the alignment marks from the upper atmosphere side of the vacuum vessel 21 through the observation hole 214 provided in the vacuum vessel 21 . In FIG. 2 , the alignment camera unit 27 is provided on the substrate holder drive mechanism support body 217 side, but the present invention is not limited to this, and may be provided on the mask holder support body 215 side. Although not shown in FIG. 2 , since the inside of the vacuum vessel 21 sealed in the film forming process is dark, an illumination light source for irradiating the alignment marks from below may be provided in order to photograph the alignment marks with an alignment camera. . The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as control of conveyance and alignment of the substrate W/mask M, and control of film formation. In addition, the control unit may have a function of controlling voltage application to the electrostatic chuck. The control unit performs feedback control based on the position detected by the position detection mechanism 231 in particular when controlling the alignment. The control unit can be constituted by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or storage. As a computer, a general-purpose personal computer, an embedded computer or a PLC (Programmable Logic Controller) can be used. Alternatively, a part or all of the functions of the control unit may be constituted by circuits such as ASIC and FPGA. In addition, a control unit may be provided for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatuses. <Vibration Transmission Suppression Mechanism> Hereinafter, the vibration transmission suppression mechanism in the film forming apparatus 11 according to the embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5 . In addition, in FIGS. 3-5, in order to show a vibration transmission suppression mechanism more clearly, the partial structure of the film-forming apparatus 11 is simplified and shown in figure. <1st Embodiment> FIG. 3 : is a schematic diagram which shows the film-forming apparatus 311 provided with the vibration transmission suppression mechanism of 1st Embodiment. Referring to FIG. 3 , the film forming apparatus 311 includes, for example, a vacuum vessel 321 whose interior is maintained in a vacuum environment. At least a part of the vacuum container 321 is supported by the vacuum container support 317 provided outside. A substrate holder (not shown) that holds the substrate W and a mask holder 323 that supports the mask M are provided in the vacuum chamber 321 . The substrate holder is an electrostatic chuck that attracts and holds the substrate W, but is not limited to this. The mask holder 323 is supported within the vacuum vessel 321 by the mask holder support 316 extending from the mask holder drive mechanism 328 . The substrate holder drive mechanism 322 is a mechanism for driving the substrate holder, and is supported in the vacuum vessel 321 by the substrate holder drive mechanism supporter 315 extending from the vacuum vessel supporter 317 . According to the present embodiment, the substrate holder driving mechanism 322 is a magnetic levitation type driving mechanism for adjusting the position of the substrate W by moving the substrate holder non-contact by the magnetic levitation linear motor, and can adjust at least the X direction, the Y direction, and the θZ direction. The position of the substrate W above is preferably the position of the substrate W in six directions of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction. The mask holder drive mechanism 328 is a mechanical drive mechanism for adjusting the position of the mask M by moving the mask holder 323 . The mask holder drive mechanism 328 can adjust the position of the mask M in at least the X direction, the Y direction, the Z direction, and the θZ direction, and preferably six of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction. The position of the mask M in the direction. The mask holder drive mechanism 328 is provided outside the vacuum container 321, and is composed of a servo motor, a rolling linear guide, a ball screw, and the like. Such a mask holder drive mechanism 328 is provided on the vacuum container support 317 via a vibration transmission suppressing member 329 . That is, the vibration transmission suppressing member 329 is provided between the mask holder drive mechanism 328 and the vacuum container support body 317 . A vibration transmission suppressing member may also be provided between the substrate holder drive mechanism support body 315 and the vacuum container support body 317 . The vibration transmission suppressing member may be provided only between the substrate holder drive mechanism support body 315 and the vacuum vessel support body 317 . The film formation apparatus 311 of the present embodiment may further include a position detection mechanism 331 that is provided in the mask holder 323 and detects the position of the substrate W held by the substrate holder. For example, the position detection mechanism 331 can select a laser interferometric length measuring instrument, an electrostatic capacitance sensor, a non-contact displacement meter, or an optical scale. The film forming apparatus 311 of the present embodiment may further include an alignment camera unit that is provided on the outer side of the upper portion of the vacuum chamber 321 via the substrate holder drive mechanism support 315 and that captures an image of the alignment marks formed on the substrate W and the mask M. 327. According to the present embodiment, the substrate holder drive mechanism 322 is constituted by a magnetic suspension type drive mechanism that adjusts the position of the substrate W without contacting the substrate W or the substrate holder. In addition, a mask holder drive mechanism 328 , which is a mechanical drive mechanism for adjusting the position of the mask M, is provided on the vacuum container support body 317 via a vibration transmission suppressing member 329 . Such a configuration can suppress transmission of ground vibration, vibration of the vacuum pump P transmitted from the vacuum container 321 , vibration of the gate valve, and vibration transmitted from the transport robot 14 that transports the substrate W and the mask M to the mask holder drive mechanism 328 . In addition, even if the reaction force when the substrate holder drive mechanism 322 which is a magnetic suspension type drive mechanism is driven is transmitted to the vacuum container support body 317 via the substrate holder drive mechanism support body 315 , the vibration transmission suppressing member 329 can suppress the transmission of the reaction force to the mask. The holder 323 and the position detection mechanism 331 provided on the mask holder 323 are transmitted. Thereby, excitation of the resonance vibration of the substrate holder drive mechanism support 315 , the mask holder support 316 , and the like, which may interfere with the control of the substrate holder drive mechanism 322 in frequency characteristics, can be suppressed. It is stably controlled to a higher frequency, and as a result, the alignment accuracy can be improved. <Second Embodiment> FIG. 4 is a schematic diagram showing a film formation apparatus 411 provided with a vibration transmission suppressing mechanism according to a second embodiment. In the film forming apparatus 411 shown in FIG. 4 , the substrate holder driving mechanism 422 is a mechanical driving mechanism provided outside the vacuum chamber 421 , and the mask holder driving mechanism 428 is a magnetic suspension type provided in the vacuum chamber 421 . Drive mechanism. In addition, the vibration transmission suppressing member 429 is provided between the vacuum container support body 417 and the substrate holder drive mechanism 422 . Hereinafter, the vibration transmission suppression mechanism of the film formation apparatus 411 of the present embodiment will be described focusing on the difference from the vibration transmission suppression mechanism of the film formation apparatus 311 shown in FIG. 3 . Referring to FIG. 4 , the film forming apparatus 411 includes, for example, a vacuum vessel 421 whose interior is maintained in a vacuum environment. At least a part of the vacuum container 421 is supported by the vacuum container support 417 provided outside. A substrate holder 424 for holding the substrate W and a mask holder (not shown) for holding the mask M are provided in the vacuum chamber 421 . The substrate holder 424 is an electrostatic chuck or clamping mechanism that attracts and holds the substrate W. The mask holder is an electrostatic chuck that attracts and holds the mask M. The mask holder drive mechanism 428 is a drive mechanism for moving a mask holder (not shown) to adjust the position of the mask M, and a mask holder drive mechanism support body 423 extending from the vacuum container support body 417 is used. It is supported in the vacuum container 421 . Thereby, the mask holder drive mechanism support body 423 supports the mask M by supporting the mask holder drive mechanism 428, and also functions as a mask holder support body. According to the present embodiment, the mask holder driving mechanism 428 is a magnetic suspension type driving mechanism for adjusting the position of the mask M by moving the mask holder in a non-contact manner by the magnetic suspension linear motor, and can adjust at least the X direction and the Y direction. The position of the mask M in the θZ direction is preferably the position of the mask M in six directions of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction. The substrate holder drive mechanism 422 is a mechanical drive mechanism for moving the substrate holder 424 to adjust the position of the substrate W, and is configured to be able to adjust the position of the substrate W in at least the X direction, the Y direction, the Z direction, and the θZ direction. , the positions of the substrate W in the six directions of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction are preferable. The substrate holder drive mechanism 422 is provided outside the vacuum chamber 421, and is composed of a servo motor, a rolling linear guide, a ball screw, and the like. The substrate holder drive mechanism 422 is supported by the substrate holder drive mechanism support body 415 extending from the vacuum container support body 417 . In the present embodiment, the substrate holder drive mechanism support body 415 includes: a first support member 415a disposed on the outer side of the upper portion of the vacuum chamber 421 and provided with the substrate holder drive mechanism 422; and a second support member 415b from The vacuum container support body 417 extends and supports the first support member 415a. In order to suppress vibration transmission, the vacuum container 421 and the first support member 415a may be connected via a telescopic member (not shown). Furthermore, in the film forming apparatus 411 of the present embodiment, between the vacuum container support body 417 and the substrate holder drive mechanism 422, in particular, between the first support member 415a and the second support member 415b, there is provided for suppressing the A vibration transmission suppressing member 429 for vibration transmission on the substrate holder drive mechanism 422 side. The closer the vibration transmission suppressing member 429 is provided between the vacuum container support 417 and the substrate holder drive mechanism 422, the more effectively the vibration transmission to the substrate holder drive mechanism 422 can be suppressed. However, the present invention is not limited to this, and the vibration transmission suppressing member 429 may be provided at other positions. For example, a vibration transmission suppressing member may be provided between the second support member 415b and the vacuum vessel support body 417, or may be provided between the first support member 415a and the second support member 415b and between the second support member 415b and the vacuum vessel support body Vibration transmission suppressing members are all provided between 417 . The film forming apparatus 411 of the present embodiment may further include a position detection mechanism 431 that is provided in the substrate holder 424 and measures the position of the mask M held by the mask holder. For example, the position detection mechanism 431 can select a laser interferometric length measuring instrument, an electrostatic capacitance sensor, a non-contact displacement meter, or an optical scale. Although not shown in FIG. 4 , in the film formation apparatus 411 of the present embodiment, an alignment camera unit for imaging the alignment marks formed on the substrate W and the mask M can be provided above the vacuum chamber 421 . outside. As an example, the camera unit for alignment may be provided in the mask holder drive mechanism support body 423 side. The camera unit for alignment may be provided in the board|substrate holder drive mechanism support body 415 (for example, the 1st support member 415a). According to the present embodiment, the vibration transmission suppressing member 429 is provided between the substrate holder drive mechanism 422 , which is a mechanical drive mechanism for adjusting the position of the substrate W, and the vacuum container support 417 . In addition, the mask holder drive mechanism 428 is constituted by a magnetic suspension type drive mechanism that adjusts the position of the mask M without coming into contact with the mask M or the mask holder. Thereby, ground vibration, the vibration of the vacuum pump transmitted from the vacuum container 421 , the vibration of the gate valve, and the vibration transmitted from the transport robot 14 that transports the substrate W and the mask M can be suppressed from being transmitted to the substrate holder drive mechanism 422 . In addition, even if the reaction force when the mask holder drive mechanism 428 which is a magnetic suspension type drive mechanism is driven is transmitted to the vacuum container support body 417 via the mask holder drive mechanism support body 423 , the vibration can be suppressed by the vibration transmission suppressing member 429 . It transmits to the board|substrate holder 424 and the position detection mechanism 431 provided in the board|substrate holder 424. Thereby, excitation of resonance vibration of the substrate holder drive mechanism support 415 , the mask holder drive mechanism support 423 , and the like, which may interfere with the control of the frequency characteristics of the mask holder drive mechanism 428 , can be suppressed. , so that it can be stably controlled to a higher frequency, and as a result, the alignment accuracy can be improved. <3rd Embodiment> FIG. 5 : is a schematic diagram which shows the film-forming apparatus 511 provided with the vibration transmission suppression mechanism of 3rd Embodiment. 5 , the film forming apparatus 511 includes: a vacuum container 521 , the interior of which is maintained in a vacuum environment, for example; The vacuum vessel 521 is supported by the substrate holder drive mechanism support body 515 extending from the susceptor support body 517 . However, the present invention is not limited to this. For example, the vacuum container 521 may be supported by the mask holder support body 516 instead of the substrate holder drive mechanism support body 515 . In general, as a feature of the vacuum container 521 , the shape of the vacuum container 521 may be greatly changed due to a difference in air pressure in a state where the interior is in an atmospheric pressure environment or in a vacuum environment. Therefore, in the connection between the vacuum container 521 and the substrate holder drive mechanism support body 515, it is preferable to use a motion coupling (not shown), a vacuum bellows (not shown), etc., in order to avoid the deformation of the vacuum container 521 to drive the substrate holder. The mechanism support body 515 transmits. In addition, as shown in FIG. 5 , in order to prevent the deformation of the vacuum container 521 from being transmitted to the mask holder support body 516 , a retractable member 513 can also be provided between the vacuum container 521 and the mask holder support body 516 . A substrate holder (not shown) that holds the substrate W and a mask holder 523 that supports the mask M are provided in the vacuum chamber 521 . The substrate holder is an electrostatic chuck that attracts and holds the substrate W, but is not limited to this. The mask holder 523 is supported in the vacuum vessel 521 by the mask holder support body 516 extending from the mask holder drive mechanism 528 . The substrate holder drive mechanism 522 is a mechanism for driving the substrate holder, and is supported in the vacuum chamber 521 by the substrate holder drive mechanism support body 515 extending from the susceptor support body 517 . According to the present embodiment, the substrate holder driving mechanism 522 is a magnetic levitation type driving mechanism for adjusting the position of the substrate W by moving the substrate holder non-contact by the magnetic levitation linear motor, and can adjust at least the X direction, the Y direction, and the θZ direction. The position of the substrate W above is preferably the position of the substrate W in six directions of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction. The mask holder drive mechanism 528 is a mechanical drive mechanism for adjusting the position of the mask M by moving the mask holder 523 . The mask holder drive mechanism 528 can adjust the position of the mask M in at least the X direction, the Y direction, the Z direction, and the θZ direction, and preferably six of the X direction, the Y direction, the Z direction, the θX direction, the θY direction, and the θZ direction. The position of the mask M in the direction. The mask holder drive mechanism 528 is provided outside the vacuum container 521, and is composed of a servo motor, a rolling linear guide, a ball screw, and the like. Such a mask holder drive mechanism 528 is provided on the base support 517 via the vibration transmission suppressing member 529 . That is, the vibration transmission suppressing member 529 is provided between the mask holder drive mechanism 528 and the susceptor support 517 . The film formation apparatus 511 of the present embodiment may further include a position detection mechanism 531 that is provided in the mask holder 523 and measures the position of the substrate W held by the substrate holder. For example, the position detection mechanism 531 can select a laser interferometric length measuring instrument, an electrostatic capacitance sensor, a non-contact displacement meter, or an optical scale. The film forming apparatus 511 of the present embodiment can further include an alignment camera unit 527 which is provided on the outer side of the upper portion of the vacuum chamber 521 via the mask holder support 516 and is used to image the alignment marks formed on the substrate W and the mask M. That is, the camera unit 527 for alignment is provided in the mask holder support body 516 provided in the vibration transmission suppression member 529. In the embodiment in which the vibration transmission suppressing member 529 is provided between the substrate holder drive mechanism 522 and the susceptor support body 517 , the alignment camera unit 527 may be provided on the substrate holder drive mechanism support body 515 . According to the present embodiment, as described in detail in the first and second embodiments, vibration transmission is provided between the mask holder drive mechanism 528 or the substrate holder drive mechanism 522 and the susceptor support 517 . The suppressing member 529 can suppress ground vibration and vibration transmitted from the vacuum pump, the gate valve, and the transfer robot 14 that transfers the substrate W and the mask M from being transmitted to the mask holder drive mechanism 528 and/or the substrate holder drive mechanism 522 . In addition, even if the reaction force when the substrate holder drive mechanism 522 which is a magnetic suspension type drive mechanism is driven is transmitted to the base support body 517 via the substrate holder drive mechanism support body 515 , the vibration transmission suppressing member 529 can suppress the transmission of the reaction force to the mask. The holder 523 and the position detection mechanism 531 provided on the mask holder 523 are transmitted. As a result, excitation of resonance vibration of the substrate holder drive mechanism support 515 , the mask holder support 516 and the like, which may interfere with the control of the substrate holder drive mechanism 522 in frequency characteristics, can be suppressed. It is stably controlled to a higher frequency, and as a result, the alignment accuracy can be improved. In addition, when the vibration transmission suppressing member 529 is provided between the mask holder drive mechanism 528 , the substrate holder drive mechanism 522 and the susceptor support 517 , the vibration transmission suppressing member 529 is placed on the vibration transmission due to the mechanical characteristics of the vibration transmission suppressing member 529 . The stationary position of the substrate W or the mask M on the suppressing member 529 may fluctuate. Therefore, the substrate W or the mask M may deviate from the depth of field of the alignment camera unit 527 , particularly the fine alignment camera having a shallow depth of field, thereby deteriorating image quality, resulting in a decrease in alignment accuracy. According to the present embodiment, in order to be able to suppress a decrease in alignment accuracy due to the installation of the vibration transmission suppressing member 529 , the alignment camera unit 527 is provided in the mask holder support body 516 or the substrate holder drive mechanism support body 515 . , The support body side where the vibration transmission suppressing member 529 is sandwiched between the base support body 517 and the base support body 517 . According to such a configuration, even when a high-resolution lens with a shallow depth of field is used for the alignment camera unit 527, it is possible to capture a high-quality image without being affected by the static stability of the vibration transmission suppressing member 529. , the relative position of the substrate W and the mask M can be measured, and the decrease in the alignment accuracy can be suppressed.

11,311,411,511:成膜裝置 21,321,421,521:真空容器 22,322,422,522:基板保持器驅動機構 23,323,523:掩模保持器 216,316,516:掩模保持器支承體 24,424:基板保持器 25,325,425,525:成膜源 26:磁力施加手段 27,327,527:對準用相機單元 28,328,428,528:掩模保持器驅動機構 29,329,429,529:振動傳遞抑制構件 215,315,415,515:基板保持器驅動機構支承體 217,317,417:真空容器支承體 517:基座支承體11,311,411,511:Film forming device 21,321,421,521: Vacuum Vessels 22,322,422,522: Substrate holder drive mechanism 23,323,523: Mask Holder 216, 316, 516: Mask holder support 24,424: Substrate holder 25,325,425,525: Film forming source 26: Magnetic application means 27,327,527: Camera unit for alignment 28,328,428,528: Mask Holder Drive Mechanism 29,329,429,529: Vibration Transmission Suppression Member 215, 315, 415, 515: Substrate holder drive mechanism support 217, 317, 417: Vacuum vessel supports 517: Base support

[圖1]是示意性地表示電子器件的製造裝置的一部分結構的俯視圖。 [圖2]是示意性地表示成膜裝置的結構的剖視圖。 [圖3]是表示本發明的第1實施方式的振動傳遞抑制機構的示意圖。 [圖4]是表示本發明的第2實施方式的振動傳遞抑制機構的示意圖。 [圖5]是表示本發明的第3實施方式的振動傳遞抑制機構的示意圖。1 is a plan view schematically showing a part of the configuration of an electronic device manufacturing apparatus. [ Fig. 2] Fig. 2 is a cross-sectional view schematically showing the structure of a film forming apparatus. [ Fig. 3] Fig. 3 is a schematic view showing a vibration transmission suppressing mechanism according to the first embodiment of the present invention. [ Fig. 4] Fig. 4 is a schematic diagram showing a vibration transmission suppressing mechanism according to a second embodiment of the present invention. [ Fig. 5] Fig. 5 is a schematic diagram showing a vibration transmission suppressing mechanism according to a third embodiment of the present invention.

311:成膜裝置 311: Film forming device

315:基板保持器驅動機構支承體 315: Substrate holder drive mechanism support

316:掩模保持器支承體 316: Mask holder support

317:真空容器支承體 317: Vacuum container support

321:真空容器 321: Vacuum container

322:基板保持器驅動機構 322: Substrate holder drive mechanism

323:掩模保持器 323: Mask Holder

325:成膜源 325: Film forming source

327:對準用相機單元 327: Camera unit for alignment

328:掩模保持器驅動機構 328: Mask holder drive mechanism

329:振動傳遞抑制構件 329: Vibration transmission suppression member

331:位置檢測機構 331: Position detection mechanism

M:掩模 M: mask

W:基板 W: substrate

Claims (10)

一種成膜裝置，其特徵在於，具備：容器；基座支承體，其設置於前述容器的外部；基板保持器，其設置於前述容器內，保持基板；掩模保持器，其設置於前述容器內，支承掩模；基板保持器驅動機構，其驅動前述基板保持器；掩模保持器驅動機構，其驅動前述掩模保持器；基板保持器驅動機構支承體，其與前述基座支承體連接，支承前述基板保持器驅動機構；掩模保持器支承體，其與前述基座支承體連接，支承前述掩模保持器；振動傳遞抑制構件，其設置於前述基座支承體與前述掩模保持器驅動機構之間；以及對準用相機單元，其設置於前述容器的外部且設置於前述掩模保持器支承體，用於測定保持於前述基板保持器的基板與支承於前述掩模保持器的掩模的相對位置偏移量。 A film forming apparatus comprising: a container; a susceptor support provided outside the container; a substrate holder provided in the container to hold a substrate; and a mask holder provided in the container Inside, a mask is supported; a substrate holder drive mechanism that drives the aforementioned substrate holder; a mask holder drive mechanism that drives the aforementioned mask holder; a substrate holder drive mechanism support body that is connected to the aforementioned base support body , supporting the substrate holder drive mechanism; a mask holder support body connected to the base support body to support the mask holder; vibration transmission suppressing members provided on the base support body and the mask holding body and a camera unit for alignment, which is provided outside the container and on the mask holder support, and is used to measure the substrate held by the substrate holder and the substrate supported by the mask holder. The relative position offset of the mask. 如請求項1的成膜裝置，其中，前述基板保持器驅動機構設置於前述容器的內部，前述掩模保持器驅動機構設置於前述容器的外部。 The film forming apparatus according to claim 1, wherein the substrate holder drive mechanism is provided inside the container, and the mask holder drive mechanism is provided outside the container. 如請求項1的成膜裝置，其中，前述容器支承於前述基板保持器驅動機構支承體。 The film forming apparatus according to claim 1, wherein the container is supported by the substrate holder drive mechanism support. 如請求項1的成膜裝置，其中，還包括： 位置檢測機構，設置於前述掩模保持器，用於檢測保持於前述基板保持器的基板的位置。 The film forming apparatus of claim 1, further comprising: A position detection mechanism is provided in the said mask holder, and detects the position of the board|substrate hold|maintained by the said board|substrate holder. 如請求項1~4中任一項的成膜裝置，其中，前述基板保持器驅動機構是磁懸浮式的驅動機構，前述掩模保持器驅動機構是機械式的驅動機構。 The film forming apparatus according to any one of claims 1 to 4, wherein the substrate holder driving mechanism is a magnetic suspension type driving mechanism, and the mask holder driving mechanism is a mechanical driving mechanism. 一種成膜裝置，其特徵在於，具備：容器；基座支承體，其設置於前述容器的外部；基板保持器，其設置於前述容器內，保持基板；掩模保持器，其設置於前述容器內，支承掩模；基板保持器驅動機構，其驅動前述基板保持器；掩模保持器驅動機構，其驅動前述掩模保持器；基板保持器驅動機構支承體，其與前述基座支承體連接，支承前述基板保持器驅動機構；掩模保持器支承體，其與前述基座支承體連接，支承前述掩模保持器；振動傳遞抑制構件，其為了抑制前述基座支承體與前述基板保持器驅動機構之間的振動傳遞而設置於前述基座支承體與前述基板保持器驅動機構之間；以及對準用相機單元，其設置於前述容器的外部且設置於前述基板保持器驅動機構支承體，用於測定保持於前述基板保持器的基板與支承於前述掩模保持器的掩模的相對位置偏移量。 A film forming apparatus comprising: a container; a susceptor support provided outside the container; a substrate holder provided in the container to hold a substrate; and a mask holder provided in the container Inside, a mask is supported; a substrate holder drive mechanism that drives the aforementioned substrate holder; a mask holder drive mechanism that drives the aforementioned mask holder; a substrate holder drive mechanism support body that is connected to the aforementioned base support body , which supports the substrate holder drive mechanism; a mask holder support body which is connected to the base support body and supports the mask holder; and a vibration transmission suppressing member for suppressing the base support body and the substrate holder vibration transmission between the drive mechanisms is provided between the base support body and the substrate holder drive mechanism; and an alignment camera unit is provided outside the container and provided on the substrate holder drive mechanism support body, It is for measuring the relative positional shift amount of the board|substrate hold|maintained by the said board|substrate holder and the mask supported by the said mask holder. 如請求項6的成膜裝置，其中，前述基板保持器驅動機構設置於前述容器的外部，前述掩模保持器驅動機構設置於前述容器的內部。 The film forming apparatus according to claim 6, wherein the substrate holder drive mechanism is provided outside the container, and the mask holder drive mechanism is provided inside the container. 如請求項6的成膜裝置，其中，還包括：位置檢測機構，設置於前述基板保持器，用於檢測保持於前述掩模保持器的掩模的位置。 The film forming apparatus according to claim 6, further comprising: a position detection mechanism provided in the substrate holder for detecting the position of the mask held by the mask holder. 如請求項6的成膜裝置，其中，前述基板保持器驅動機構支承體包括：第1支承構件，其設置有前述基板保持器驅動機構；以及第2支承構件，其構成為與前述基座支承體連接並支承前述第1支承構件，前述振動傳遞抑制構件設置於前述第1支承構件與前述第2支承構件之間。 The film forming apparatus according to claim 6, wherein the substrate holder drive mechanism support body includes: a first support member provided with the substrate holder drive mechanism; and a second support member configured to be supported by the base The body is connected to and supports the first support member, and the vibration transmission suppressing member is provided between the first support member and the second support member. 如請求項6~9中任一項的成膜裝置，其中，前述容器支承於前述掩模保持器支承體或前述基座支承體。 The film forming apparatus according to any one of claims 6 to 9, wherein the container is supported by the mask holder support or the susceptor support.
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