1232144 五、發明說明（1) — 〜 【發明所屬之技術領域】 本發明尤指其提供一種高速微铲細 以提高切削工件的表面精度並確保刀且伯削的製程技術， 射輔助微精細切削之加工方法及穿’、用壽命之脈衝雷 【先前技術】 、4 ° 按，目前於不易切削之材料（如 合金等）進行切削製程中，刀具合 时、破璃、鎳基超 工的表面精度不佳；以陶竟材料i例生的磨耗’且如 加工方式，有研磨加工、超音凌力 則其力口工使用的 工、離子束加工等，這些加工方式二:：：加工、放電如 無法取得較佳之移除率，就以研磨加:而f優缺點，但岣 本卻也佔陶瓷元件總成本的γ 〇 %〜 ° ，其加工的成 件進行研磨加工，仍是耗力費時，盔 4，因此陶瓷元 而，陶瓷是繼金屬、塑膠之後的第三材料低製造成本；然 性、耐蝕性及硬質性，這些皆屬於高斜二二其兼具有耐熱 性，因此陶瓷也將是高科技時代的斬才料必要的特 的元件將快速成長，故發展更高效率=，以陶究為素材 前首要的課題。 （革的加工方式，將是目 ,，+射^ 人先/提出台灣專利申請第9 1 1 345 6 3號 田射輔助切制之加工方法”之專利申請案，請來閱第工、 2圖所示，該陶瓷工件1係裝設於^ ^ ^ ^ ^ ^ ^ ^ ^ =銳床等切削工具機）《夾頭上，而切削刀具2裝設於側 方之刀具座3上，一脈衝雷射頭4則裝設在刀具座3上， 並位於切削刀具2之側方，且將雷射光束調整聚焦至切削 1232144 五、發明說明（2) - — 刀具2刀口前方數//m至數十//Dj的距離（即加埶區A)， 使刀口前方保留一微小距離不被雷射的脈衝光束昭射到 j即未加熱區B ) ，·請參閱第3圖所示，當陶甍工件i開 =旋=動時’即啟動脈衝雷射頭4，以雷射的脈衝頻率 $ —百4Hz為例，即令雷射光束先照射在距刀口前方 〇二微小距離處，由於加熱區域A並非在切削刀 =二ΓΓ:距離的微小區W刀口與加熱區A間 成為熱的間隔物，故雷射的熱並 不曰直接傳導至切削刀口處，因此， 會因雷射加熱材料而同時則刀/、2的&度不 較低溫的狀態，即保持應有 強：具】依然保持在 刀具2的損耗；請參閱第所強度兮進而減少切削 可進給切入陶瓷工株彳 5圖所不，该切削刀具2 料c受切削推：而：i斷Γ=、深度’使刀口前的材 D已被雷射光束加削材料C後方之材料 強度，在切削材料c、缺乏：方係降低後方之支揮 阻力，使切削刀呈丄 #下，乃大幅減少切削 削材料C猶如刀;Ρ南切削速度而易於切削，且令切 移，將已瞬間被軟二二後方被加熱軟化的區域推擠 2持續進給，即可將才::D切削擠壓排除，而後切削刀且 切下排除；惟該加工材料C及瞬間被軟化材料D —併 再以前方之切削材係以加熱軟化後方之材料後，1232144 V. Description of the invention (1) — ~ [Technical field to which the invention belongs] The present invention particularly relates to a process technology that provides a high-speed micro-shovel to improve the accuracy of the surface of the cutting workpiece and to ensure that the knife and undercutting are performed. Machining method and wear method, using life-time pulse thunder [previous technology], 4 ° press, currently in the cutting process of materials that are not easy to cut (such as alloys, etc.), the tool is out of date, broken glass, nickel-based overworked surface The accuracy is not good; the abrasion generated by the ceramic material i and the processing methods include grinding processing, supersonic Lingli, and other methods used by Likou, ion beam processing, etc. These two processing methods ::: processing, If the discharge cannot achieve a better removal rate, grinding is added: f has advantages and disadvantages, but the copy also accounts for γ 0% ~ ° of the total cost of ceramic components. The grinding of its processed parts is still labor-intensive. Time-consuming, helmet 4, so ceramic, ceramic is the third material after metal, plastic, low manufacturing cost; nature, corrosion resistance and rigidity, these are all high-inclined two and both have heat resistance, so Porcelain will be cut before the high-tech era of the special material necessary components will grow rapidly, so the development of more efficient = to study pottery is first and foremost task before the material. (The processing method of leather will be head, + shot ^ person first / filed Taiwan Patent Application No. 9 1 1 345 6 No. 3 field shot assisted cutting processing method "patent application, please see No. 2, 2 As shown in the figure, the ceramic workpiece 1 is installed on a cutting tool such as ^ ^ ^ ^ ^ ^ ^ ^ ^ = sharp bed, and the cutting tool 2 is installed on the side of the tool holder 3, a pulse The laser head 4 is installed on the tool holder 3 and is positioned at the side of the cutting tool 2 and adjusts the laser beam to focus on the cutting 1232144. V. Description of the invention (2)--The number of the front edge of the tool 2 // m to The distance of several dozens // Dj (that is, the plus area A), so that a small distance in front of the knife edge is not projected by the laser pulse beam to j, that is, the unheated area B). Please refer to Figure 3, when Pottery workpiece i open = rotation = when moving 'that is to start the pulsed laser head 4, taking the laser pulse frequency $-100 4Hz as an example, that is, the laser beam is first irradiated at a small distance from the front of the knife edge, due to heating The area A is not a hot spacer between the small area W blade of the cutter = 2ΓΓ: distance and the heating area A, so the heat of the laser is not directly transmitted To the cutting edge, therefore, due to the laser heating material, at the same time, the & degree of the knife /, 2 is not low, that is, it should remain strong: with] it still remains at the loss of the tool 2; The strength is reduced, and the cutting can be cut. The cutting tool 2 is cut into the ceramics, as shown in the figure. The cutting tool 2 and material c are pushed by the cutting: and: i break Γ =, depth ', so that the material D in front of the cutting edge has been cut by the laser beam. The strength of the material behind the material C, in the absence of cutting material c, reduces the resistance of the support in the rear to make the cutting tool appear below #, which greatly reduces the cutting material C like a knife; the cutting speed is easy to cut, and Make the cutting move, and push the area that has been softened by the second, second, and second sides to be heated and softened for 2 moments, and then continue to feed, and then the only :: D cutting and extrusion will be eliminated, and then the cutter will be cut and removed; but the processing material C and Material D is instantly softened — and then the cutting material in front is used to heat and soften the material in the rear.
加工精度。。“至微精細加工的程度，以再次提昇J 1232144 五、發明說明（3) 、 〜---------------------------------———........................ 【内容】 本發明之主要目的 削之加工方法，其係利用展一種脈衝雷射輔助微精細切 歇性微局部的瞬間加熱、μ射對切削材料直接進行間 切削刀具之刀口正前方，人π ，即雷f光束係調整聚焦至 後刀具別進進行材料的 、正$方即為加熱區，隨 削作業，亦即”即熱即切，1，而以相同的機制重覆進行切 切到那裡（微局部），▲坪B’ ：到那裡（微局部），就 即可直接降低刀具的切削=累胃^削機制；藉此， 製程，以提高切削材料 而y作尚逮微精細的切削 造成的質變區域切除，=二’且切削的同時將熱影響 不會殘留有質變的部份而細切削加工後， 削之裝置，其係於刀具:射輔助微精細切 光束調整聚焦至切削刀且式雷射頭，並將雷射 有，喷除器，以防= = 射：：具座上裝設 可利用雷射光束對切削奸极古t T彳：射先束；藉此，即 加熱、軟化’俾利刀n4直接進订間歇性微局部的瞬間 切削加工。利刀具的切削作業’而可作高速微』二 、,本發明之又一目的係提供一種脈衝雷射輔A〜 削之裝置，其係於切削刀具之刀把内呈 微精細切 位溫度計，以婁丈位溫度計線上監測刀尖裝設-數 f系統控制器’經系統控制器進行雷射脈；寬：即時回饋 率及脈衝數量等參數的自動調控，來改變脈射 1232144 五、發明說明（4) --------------------- -一____________________ 的加熱溫度，以攸 度變化署，^正因南溫切削及摩捧埶T7 二^得刀尖溫度能保持在特二”具產生的活 的使用壽命。…“圭的切削狀態’達到確保切削刀具 【實施方式】 本發明脈衝雷如土 =衝雷射對切削材=削之加工方法，係利用 利進行微局部的切^〖生Μ局部的瞬間加熱軟化， :作業1完成心=L，再以相同的機制重覆進行切 、微精細加工方式說明如下σ工，根據上述的切削機制， 明參閱第6 、7 (si私- 工具機之夾頭上，而切幻不，該工件5 (如陶瓷）係裝設於 上， 人印丄而切削刀具6裝碍於彳日，丨+ 目一脈衝雷射頭8則F执卢π ^ 側方之刀具座7 具R 只0別裝叹在刀具庙7 μ 、， 二6之側方，且將雷射光束取7上，亚位於切削刀 則方（即加熱區Ε)，另刀:周:，焦至切削刀具6刀口正 1 1 ’其以高壓的噴射冷'上裝設有—切屬噴除器 ，遮蔽到雷射光束’Γ而％°:體或液體)噴除切屬，防 :秒等級，雷射的脈衝頻率： = 衝時間在微秒至 :力口熱範圍在數㈣至數_的寬声十萬至數等級，聚 :射的功率在數瓦特至數百瓦特，至數_的長度’ 笛射的M t m ^ 又工件5的移動速度為 ：!秒數十米的切削速度及研磨C 而可獲得 11及脈衝雷射頭8，以m 屑喷除器 乂采射的脈衝頻率在一百萬Hz為Precision. . "To the extent of micro-fine processing to improve J 1232144 again V. Description of the invention (3), ~ ---------------------------- -----———.............. [Content] The main purpose of the present invention is to use a cutting method Pulse laser assists micro-fine cut-away instantaneous heating and μ-rays to directly cut the cutting edge of the cutting tool directly in front of the cutting tool. The person π, that is, the laser beam f is adjusted to focus on the rear tool. The $ square is the heating zone, which follows the cutting operation, that is, "the heat is cut, 1", and the cut is repeated there with the same mechanism (micro-local), ▲ ping B ': to there (micro-local), just You can directly reduce the cutting mechanism of the cutter = tired stomach ^ cutting mechanism; by this process, to improve the cutting material and cut off the qualitative change area caused by the fine cutting, the cutting process will not affect the thermal effect at the same time. After fine cutting processing with qualitative changes remaining, the cutting device is attached to the tool: a laser-assisted micro-fine cutting beam is adjusted to focus on the cutting blade and a laser head, and the laser is sprayed and removed Device to prevent = = shooting :: The laser beam can be installed on the seat to cut the cutting pole. T 彳: Shoot the first beam; by this, the heating and softening of the knife n4 can be ordered intermittently. Local instantaneous cutting. The cutting operation of the cutting tool can be performed at high speed. Second, another object of the present invention is to provide a pulse laser auxiliary A ~ cutting device, which is provided with a micro-fine cutting thermometer inside the handle of the cutting tool. Lou Zhang position thermometer online monitoring tool tip installation-number f system controller 'laser pulses through the system controller; wide: automatic adjustment of parameters such as instant feedback rate and number of pulses to change the pulse 1232144 V. Description of the invention ( 4) ----------------------a ____________________ heating temperature in order to change the degree of agency, ^ is due to the South temperature cutting and motorcycle holding T7 two ^ The temperature of the cutting edge can be maintained at the special life of the special two .... "The cutting state of Gui" is to ensure the cutting tool. [Embodiment] The pulsed laser of the present invention = punching laser on cutting material = cutting processing The method is to make a micro-local cut using the method ^ [Temporary heating and softening of the raw M-local]: homework 1 completes the core = L, and then repeats the cutting and micro-fine processing with the same mechanism. Cutting mechanism, see section 6 and 7 (si private-machine tool chuck The workpiece 5 (such as ceramics) is installed on the upper part, and the cutting tool 6 is installed on the next day. 丨 + The pulse laser head 8 is F, and it is on the side. The tool holder 7 with R, only 0, do n’t sigh on the side of the knife temple 7 μ, 2, 6 and take the laser beam 7 on the side of the cutting tool (the heating area E), the other knife: Zhou :, Coke to cutting tool 6 knife edge is positive 1 1 'It is sprayed with high-pressure cold' is equipped with-cutting type sprayer, shielded to the laser beam 'Γ and% °: body or liquid) spray cutting type, Defense: second level, pulse frequency of laser: = punch time in microseconds to: wide range of hundreds of thousands to several levels of thermal range in the range from a few to several _, poly: power of shots in the range of several watts to hundreds of watts , The length of the number _ 'M tm of the flute and the moving speed of the workpiece 5 is:! The cutting speed of several tens of meters and the grinding C can obtain 11 and the pulse laser head 8, and the m chip ejector 乂The sampling pulse frequency is at 1 million Hz
Mil麵 1232144 五、發明說7(5) --- ’ ::為：Πϊί束先照射在刀口正前方處’並使該處之村 :幸人化材料F ;請參閱第9 w，切削刀具6即以 村 度，m即切削線迷度進給切入工件5 —固定的微小深 刀口^削深度為20，，㈣寬度為⑽，使^ 材料F P ^溫軟化材料F直接被切削剝離，由於高溫軟^ 得切削ΓίΓ間加熱軟化…可大幅減少切削阻力，使 度，待2，、6可提高切削速度，進而再次提高切削的精 疊上〜:。人脈衝雷射發射時，將光束聚焦處連接或部份 ^、-入的聚焦處，並重覆相同的切削機制；請參閱第 觸高溫：化ir月之微精細加工方式’係以刀具6直接接 隹處：車:化材料區f ’在高速切削的過程中，脈衝雷射二 具6问溫切削及刀具與工件間的磨擦熱將持續埶傳至刀 此將使得刀具累積熱量而逐漸升高溫度，由於 硼的結a i鼠化硼）刀具在溫度超過1 4 7 0 時’氮化 r B BB立方體轉為六方體，強度將會大幅降低，因卜 二度i4iot，可得到較佳的二 也就备ΪΓ度1 5 7 0 C時’將會超過刀具變弱的溫度， 度過K :縮短刀具的使用壽命’為了預防刀具6產生溫 刀把内武形，造成刀具的提前損毁，因此本發明可另在 9 ，以^刀具座上裝設熱電偶式或紅外線式之數位溫度計 哭i $上監測刀尖的實際溫度，並即時回饋至系統=制 及脈徐叙ί系統控制器1 0進行雷射脈衝寬度、脈衝頻率 了數夏等參數的自動調控，來改變脈 _ Λπ数、、西危 #〜主丁何料的 …Μ度，以修正因高溫切削及摩擦熱對刀具產生的溫声 第9頁 1232144 五、發明說明 變化量，使 14 7 〇 °q 態’俾以確 饋控制系統 改變雷射對 刀具產生的 切削狀態， 本發明 工材料進行 切，瞬間熱 熱量不累積 削阻力，而 上監測刀具 修正因高溫 刀尖溫度能 持在較佳的 刀尖溫度保持在持定的溫度範圍内（不得 ，且工件及刀具均能維持在較佳的切削狀^ :、： =使用壽命；本發明之線上監測 材於連續式雷射加熱，藉著自動調控 溫度變化量，使工件及刀具均能 俾以確保刀具的使用壽命。％、，隹持在較佳的 二：：細加工’由於係利用脈 間歇性微局部的瞬間加熱軟化，亦接孰于 "至1那梗（微局部），就切削那裡 ”、、 提的Λ肖，1機制，因此不但可大幅降低刀具的切 溫；：：材料的移除率及表面精度，另利用線 切削H控脈衝雷射對材料的加熱溫度，以 保持在ί?熱對刀具產生的溫度變化量，使得 C溫度的範圍内，而工件及刀具能維 ->，達到確保切削刀具的使用壽命。Mil surface 1232144 V. Invention 7 (5) --- ': is: Πϊί beam first shines directly in front of the knife edge' and makes the village there: fortunate humanized material F; see section 9 w, cutting tool 6 That is to cut into the workpiece 5 with m, the cutting line feed. —The fixed depth of the deep blade is 20, and the width is ⑽, so that the material FP ^ temperature softening material F is directly cut and peeled. The soft ^ has to be heated and softened between cutting ΓίΓ ... It can greatly reduce the cutting resistance, so that the cutting speed can be increased by waiting for 2, 6 and then the cutting precision of cutting is increased again ::. When the human pulse laser is launched, connect the focused part of the beam or the part where the focus is ^, -in, and repeat the same cutting mechanism. Connection: Car: Chemical material area f 'During the high-speed cutting, the pulse laser cutting and the frictional heat between the tool and the workpiece will continue to be transmitted to the knife, which will cause the tool to accumulate heat and gradually rise. High temperature, due to the formation of boron and boron) When the temperature exceeds 1,470, the 'nitride r B BB cube turns into a hexagonal cube, and the strength will be greatly reduced. Due to the second degree i4iot, a better one can be obtained. Secondly, it is prepared at a temperature of 1 5 7 0 C. 'It will exceed the temperature at which the tool becomes weaker, and it will pass K: Shorten the service life of the tool.' The invention can additionally install a thermocouple or infrared type digital thermometer on the tool holder to monitor the actual temperature of the knife tip, and immediately feed back to the system = system and system. 0 Perform laser pulse width and pulse frequency Automatic adjustment of parameters such as Shuxia to change the number of pulses _ Λπ 、、 西 危 # ～ 主 丁 的 料 ... degrees to correct the warm sound of the tool due to high-temperature cutting and frictional heat Page 9 1232144 V. Invention Explain the amount of change, so that the state of 1470 ° q is used to change the cutting status of the laser generated by the laser control system. The cutting of the material of the present invention does not accumulate cutting resistance in an instant, and the upper tool is monitored for correction due to high temperature. The tip temperature can be maintained at a better tip temperature within a fixed temperature range (not allowed, and both the workpiece and the tool can be maintained in a better cutting state ^:,: = service life; the online monitoring material of the present invention In continuous laser heating, by automatically adjusting the temperature change, both the workpiece and the tool can be used to ensure the service life of the tool.% ,, and held in the better two :: Fine processing, because the system uses pulse intermittent The instantaneous heating and softening of the micro-parts is also connected to the stem of "to 1 (micro-parts), cutting there", and Λ Xiao, which is a 1 mechanism, so it can not only greatly reduce the cutting temperature of the tool; Removal rate and surface accuracy. In addition, the heating temperature of the material by wire cutting H-controlled pulse laser is used to maintain the temperature change of the tool on the tool, so that the range of C temperature, and the workpiece and tool can maintain- > To ensure the life of the cutting tool.
第10頁 1232144 圖式簡單說明 第1圖：習式精細加工之切削裝置示意圖。 第2圖：習式精細加工雷射頭與刀具之配置示意圖。 第3圖··習式精細加工之切削作動示意圖（一）。 第4圖：習式精細加工之切削作動示意圖（二）。 第5圖··習式精細加工之切削作動示意圖（三）。 第6圖：本發明微精細加工之切削裝置示意圖。 第7圖：本發明微精細加工雷射頭與刀具之配置示意圖 第8圖：本發明微精細加工之切削作動示意圖（一）。 第9圖：本發明微精細加工之切削作動示意圖（二）。 〔元件編號〕 習式部分： 工件：1 切削刀具·· 2 刀具座：3 脈衝雷射頭：4Page 10 1232144 Brief description of drawings Figure 1: Schematic diagram of cutting device for habitual fine machining. Figure 2: Schematic diagram of the configuration of the conventional fine machining laser head and cutter. Figure 3 · Schematic diagram of cutting action of Xi fine machining (1). Figure 4: Schematic diagram of cutting action of habitual fine machining (2). Fig. 5 · Schematic diagram of cutting action of Xi fine machining (3). FIG. 6 is a schematic diagram of a cutting device for micro-fine machining of the present invention. Fig. 7: Schematic diagram of the micro-fabricated laser head and cutter configuration of the present invention. Fig. 8: Schematic diagram of the cutting action of the micro-fabricated process of the present invention (1). Fig. 9: Schematic diagram of cutting action of micro-fine machining of the present invention (2). [Part number] Custom part: Workpiece: 1 Cutting tool · 2 Tool holder: 3 Pulse laser head: 4
加熱區· A 未加熱區· BHeating zone · A unheated zone · B
切削材料：C 軟化材料：D 本發明部分： 工件：5 切削刀具：6 刀具座：7 脈衝雷射頭：8 數位溫度計：9 系統控制器·· 1 0 切屑喷除器：1 1Cutting material: C Softening material: D Part of the invention: Work piece: 5 Cutting tool: 6 Tool holder: 7 Pulse laser head: 8 Digital thermometer: 9 System controller · 1 0 Chip ejector: 1 1
加熱區：E 軟化材料：FHeating zone: E Softening material: F