TW202409495A - Two-phase immersion-cooling heat-dissipation structure having skived fin with high porosity - Google Patents
Two-phase immersion-cooling heat-dissipation structure having skived fin with high porosity Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 50
- 238000001816 cooling Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000007654 immersion Methods 0.000 claims description 15
- 239000000110 cooling liquid Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000013043 chemical agent Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 1
- 239000002826 coolant Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
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- 230000002708 enhancing effect Effects 0.000 description 2
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- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
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- 239000003518 caustics Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明涉及一種散熱結構，具體來說是涉及一種具高孔隙率的鏟削式鰭片的兩相浸沒式散熱結構。The present invention relates to a heat dissipation structure, specifically to a two-phase immersed heat dissipation structure with high porosity scraped fins.
浸沒式冷卻技術是將發熱元件(如伺服器、磁碟陣列等)直接浸沒在不導電的冷卻液中，以透過冷卻液吸熱氣化帶走發熱元件運作所產生之熱能。然而，如何透過浸沒式冷卻技術更加有效地進行散熱一直是業界所需要解決的問題。Immersion cooling technology is to immerse heat-generating components (such as servers, disk arrays, etc.) directly in non-conductive cooling liquid, so that the cooling liquid absorbs heat and evaporates to remove the heat energy generated by the operation of the heat-generating components. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.
有鑑於此，本發明人本於多年從事相關產品之開發與設計，有感上述缺失之可改善，乃特潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述缺失之本發明。In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.
本發明所要解決的技術問題在於，針對現有技術的不足提供一種具高孔隙率的鏟削式鰭片的兩相浸沒式散熱結構。The technical problem to be solved by the present invention is to provide a two-phase immersion heat dissipation structure with high porosity shaving fins in view of the shortcomings of the prior art.
本發明實施例提供一種具高孔隙率的鏟削式鰭片的兩相浸沒式散熱結構，包括：一多孔化之散熱結構，其結構之總孔隙率在5%以上，並且所述多孔化之散熱結構包括有一多孔化之基底及多個多孔化之鏟削式鰭片，所述多孔化之基底具有相背對的第一表面與第二表面，所述多孔化之基底的第二表面用以與浸沒於兩相冷卻液的發熱元件形成接觸，所述多個多孔化之鏟削式鰭片是以鏟削成型方式一體成型在所述多孔化之基底的第一表面，並且所述多孔化之鏟削式鰭片具有一第一孔隙率，所述多孔化之基底具有一第二孔隙率，並且所述第一孔隙率高於所述第二孔隙率。Embodiments of the present invention provide a two-phase immersed heat dissipation structure with high porosity scraped fins, including: a porous heat dissipation structure, the total porosity of the structure is above 5%, and the porous heat dissipation structure The heat dissipation structure includes a porous base and a plurality of porous spade fins. The porous base has a first surface and a second surface opposite to each other. The second surface of the porous base To form contact with the heating element immersed in the two-phase cooling liquid, the plurality of porous scraping fins are integrally formed on the first surface of the porous base in a scraping molding manner, and the The porous skid fins have a first porosity, the porous base has a second porosity, and the first porosity is higher than the second porosity.
在一優選實施例中，所述多孔化之散熱結構是由銅、銅合金、鋁、鋁合金、銀的其一所製成。In a preferred embodiment, the porous heat dissipation structure is made of one of copper, copper alloy, aluminum, aluminum alloy, and silver.
在一優選實施例中，所述多孔化之散熱結構是以金屬粉末燒結所形成，並且用以形成所述多孔化之散熱結構的金屬粉末的中值粒徑(D50)為10微米至800微米之間。In a preferred embodiment, the porous heat dissipation structure is formed by sintering metal powder, and the median particle size (D50) of the metal powder used to form the porous heat dissipation structure is between 10 μm and 800 μm.
在一優選實施例中，所述多孔化之散熱結構是以化學藥劑對金屬進行化學腐蝕所形成，並且用以形成所述多孔化之散熱結構的化學藥劑是磷酸系微蝕劑、硫酸系微蝕劑、氯化鐵腐蝕劑的其一。In a preferred embodiment, the porous heat sink structure is formed by chemically corroding metal with a chemical agent, and the chemical agent used to form the porous heat sink structure is one of a phosphoric acid-based micro-etching agent, a sulfuric acid-based micro-etching agent, and a ferric chloride corrosive agent.
在一優選實施例中，所述多孔化之鏟削式鰭片的孔隙更透過化學藥劑沉積、電鍍、氣相沉積的其一而增加。In a preferred embodiment, the pores of the porous skived fins are further increased through one of chemical deposition, electroplating, and vapor deposition.
在一優選實施例中，所述多孔化之鏟削式鰭片的厚度與所述多孔化之鏟削式鰭片之間的間距之比值為0.4至1.2之間。In a preferred embodiment, the ratio of the thickness of the porous scraped fins to the spacing between the porous scraped fins is between 0.4 and 1.2.
在一優選實施例中，具高孔隙率的鏟削式鰭片的兩相浸沒式散熱結構，更包括：一高導熱結構，其結合至所述多孔化之基底的第二表面，使所述多孔化之基底的第二表面是透過所述高導熱結構與所述發熱元件形成間接接觸。In a preferred embodiment, the two-phase immersed heat dissipation structure with high porosity scraped fins further includes: a high thermal conductivity structure bonded to the second surface of the porous substrate so that the The second surface of the porous substrate forms indirect contact with the heating element through the highly thermally conductive structure.
在一優選實施例中，所述高導熱結構是由銅、銅合金或鋁合金所製成的實心金屬板。In a preferred embodiment, the high thermal conductivity structure is a solid metal plate made of copper, copper alloy or aluminum alloy.
在一優選實施例中，所述高導熱結構是由高導熱性的石墨所製成。In a preferred embodiment, the highly thermally conductive structure is made of graphite with high thermal conductivity.
在一優選實施例中，所述高導熱結構的內部形成有一真空密閉腔，且所述真空密閉腔中含有液體。In a preferred embodiment, a vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不背離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of multiple associated listed items, depending on the actual situation.
[第一實施例][First Embodiment]
請參閱圖1至圖2所示，其為本發明的其中一種實施例，本發明實施例提供一種具高孔隙率的鏟削式鰭片的兩相浸沒式散熱結構，用於接觸浸沒於兩相冷卻液中的發熱元件(熱源)。如圖1、2所示，根據本發明實施例所提供的具高孔隙率的鏟削式鰭片的兩相浸沒式散熱結構，其包括有一多孔化之散熱結構1，其結構之總孔隙率在5%以上(最優是在7~15%)，且浸沒於兩相冷卻液900中，使得兩相冷卻液900在吸熱氣化形成的氣泡數量能大大增加，進而大幅強化了散熱效果。Please refer to FIG. 1 and FIG. 2, which are one embodiment of the present invention. The embodiment of the present invention provides a two-phase immersion heat dissipation structure with a high porosity shaving fin, which is used to contact a heat generating element (heat source) immersed in a two-phase cooling liquid. As shown in FIG. 1 and FIG. 2, the two-phase immersion heat dissipation structure with a high porosity shaving fin provided by the embodiment of the present invention includes a porous heat dissipation structure 1, the total porosity of which is above 5% (optimally 7-15%), and is immersed in a two-phase cooling liquid 900, so that the number of bubbles formed by the two-phase cooling liquid 900 during heat absorption and vaporization can be greatly increased, thereby greatly enhancing the heat dissipation effect.
本實施例的多孔化之散熱結構1可以是以銅、銅合金、鋁、鋁合金或銀等金屬所製成。並且，本實施例的多孔化之散熱結構1可以是以金屬粉末燒結所形成。進一步說，用以形成多孔化之散熱結構1的金屬粉末的中值粒徑(D50)優選為10微米至800微米之間，可確保多孔化之散熱結構1的總孔隙率能達到5%以上。The porous heat dissipation structure 1 of this embodiment may be made of metal such as copper, copper alloy, aluminum, aluminum alloy, or silver. Furthermore, the porous heat dissipation structure 1 of this embodiment may be formed by sintering metal powder. Furthermore, the median particle diameter (D50) of the metal powder used to form the porous heat dissipation structure 1 is preferably between 10 microns and 800 microns, which can ensure that the total porosity of the porous heat dissipation structure 1 can reach more than 5%. .
另外，本實施例的多孔化之散熱結構1也可以是以化學腐蝕所形成。進一步說，多孔化之散熱結構1可以是以化學藥劑對金屬進行化學腐蝕所形成，並且可以是以磷酸系微蝕劑、硫酸系微蝕劑或氯化鐵腐蝕劑進行化學腐蝕所形成。In addition, the porous heat sink structure 1 of the present embodiment can also be formed by chemical etching. Further, the porous heat sink structure 1 can be formed by chemically etching the metal with a chemical agent, and can be formed by chemically etching with a phosphoric acid-based micro-etching agent, a sulfuric acid-based micro-etching agent, or a ferric chloride-based micro-etching agent.
並且，本實施例的多孔化之散熱結構1包括有一多孔化之基底10及多個多孔化之鏟削式鰭片20。再者，多孔化之基底10具有相背對的第一表面11與第二表面12。多孔化之基底10的第二表面12用以與浸沒於兩相冷卻液900的發熱元件800形成接觸，這接觸可以是直接接觸或是透過中介層形成間接接觸(熱接觸,thermal contact)。多個多孔化之鏟削式鰭片20是以鏟削成型方式一體成型在多孔化之基底10的第一表面11。也就是說，多孔化之基底10的第一表面11是透過鏟削成型方式一體成型有極高密度排列的多孔化之鏟削式鰭片20，使其與多孔化之基底10為同一材料一體成型而成。再者，多孔化之鏟削式鰭片20表面的孔隙201可以再透過化學藥劑沉積、電鍍、或氣相沉積(物理或化學氣相沉積)而增加。Furthermore, the porous heat dissipation structure 1 of the present embodiment includes a porous substrate 10 and a plurality of porous shaving fins 20. Furthermore, the porous substrate 10 has a first surface 11 and a second surface 12 opposite to each other. The second surface 12 of the porous substrate 10 is used to form contact with the heat generating element 800 immersed in the two-phase cooling liquid 900, and this contact can be direct contact or indirect contact (thermal contact) through an intermediate layer. The plurality of porous shaving fins 20 are integrally formed on the first surface 11 of the porous substrate 10 by shaving molding. That is, the first surface 11 of the porous substrate 10 is integrally formed with the porous shaving fins 20 arranged at a very high density by shaving molding, so that the porous shaving fins 20 are integrally formed with the porous substrate 10 by the same material. Furthermore, the pores 201 on the surface of the porous shaving fins 20 can be increased by chemical deposition, electroplating, or vapor deposition (physical or chemical vapor deposition).
本實施例的多孔化之鏟削式鰭片20的厚度T優選是介於0.1毫米至1.0毫米之間。並且，多孔化之鏟削式鰭片20的厚度T與多孔化之鏟削式鰭片20之間的間距D之比值為0.4至1.2之間。另外，多孔化之鏟削式鰭片20的高度H優選是要高於3毫米。The thickness T of the porous shaving fin 20 of the present embodiment is preferably between 0.1 mm and 1.0 mm. In addition, the ratio of the thickness T of the porous shaving fin 20 to the distance D between the porous shaving fins 20 is between 0.4 and 1.2. In addition, the height H of the porous shaving fin 20 is preferably higher than 3 mm.
進一步來說，本實施例的多孔化之鏟削式鰭片20具有一第一孔隙率，多孔化之基底10具有一第二孔隙率，並且第一孔隙率要高於第二孔隙率，使得孔隙率較低的多孔化之基底10的機械強度能高於孔隙率較高的多孔化之鏟削式鰭片20的機械強度，也就是使得多孔化之散熱結構1的主結構的機械強度能高於非主結構的機械強度。因此，本實施例的多孔化之散熱結構1能透過極高密度排列的多孔化之鏟削式鰭片20來強化浸沒式散熱效果，並能透過具高孔隙率的多孔化之鏟削式鰭片20來增加氣泡的生成量來更強化浸沒式散熱效果，進而使本實施例的多孔化之散熱結構1可達到兼顧有高機械強度及加強浸沒式散熱的效果。Furthermore, the porous skiving fins 20 of this embodiment have a first porosity, the porous substrate 10 has a second porosity, and the first porosity is higher than the second porosity, so that The mechanical strength of the porous substrate 10 with lower porosity can be higher than the mechanical strength of the porous scraped fins 20 with higher porosity, that is, the mechanical strength of the main structure of the porous heat dissipation structure 1 can be higher. Higher than the mechanical strength of non-main structures. Therefore, the porous heat dissipation structure 1 of this embodiment can enhance the immersion heat dissipation effect through the porous spade fins 20 arranged at an extremely high density, and can also enhance the immersion heat dissipation effect through the porous spade fins with high porosity. The sheet 20 is used to increase the amount of bubbles generated to further enhance the immersion heat dissipation effect, so that the porous heat dissipation structure 1 of this embodiment can achieve both high mechanical strength and enhanced immersion heat dissipation effect.
[第二實施例][Second embodiment]
請參閱圖3所示，其為本發明的第二實施例，本實施例與第一實施例大致相同，其差異說明如下。Please refer to FIG. 3 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.
在本實施例中，更包括有一高導熱結構30a。並且，高導熱結構30a為一熱傳導係數(k)大於380W/m.K的導熱結構。並且，高導熱結構30a是結合至多孔化之基底10的第二表面12，使多孔化之基底10的第二表面12是透過高導熱結構30a與浸沒於兩相冷卻液900的發熱元件800形成間接接觸。細部來說，高導熱結構30a可以是透過焊接、摩擦攪拌接合(FSW)、膠黏、擴散接合(diffusion bonding)等方式結合至多孔化之基底10的第二表面12。In this embodiment, a high thermal conductivity structure 30a is further included. Moreover, the high thermal conductivity structure 30a is a thermal conductivity structure with a thermal conductivity coefficient (k) greater than 380 W/m.K. Furthermore, the high thermal conductivity structure 30a is coupled to the second surface 12 of the porous substrate 10, so that the second surface 12 of the porous substrate 10 is formed through the high thermal conductivity structure 30a and the heating element 800 immersed in the two-phase cooling liquid 900. indirect contact. In detail, the high thermal conductivity structure 30a can be bonded to the second surface 12 of the porous substrate 10 through welding, friction stir welding (FSW), gluing, diffusion bonding, etc.
在本實施例中，高導熱結構30a可以是一實心金屬板，其可以是由銅、銅合金或鋁合金所製成。另外，高導熱結構30a也可以是由高導熱性的石墨所製成。並且，為了有更好的導熱，高導熱結構30a的厚度T2要占總基底的厚度(多孔化之基底10的厚度T1加上高導熱結構30a的厚度T2)的60%以上。In this embodiment, the high thermal conductivity structure 30a may be a solid metal plate, which may be made of copper, copper alloy or aluminum alloy. In addition, the high thermal conductivity structure 30a may also be made of graphite with high thermal conductivity. Moreover, in order to achieve better thermal conductivity, the thickness T2 of the high thermal conductivity structure 30a should account for more than 60% of the total substrate thickness (the thickness T1 of the porous substrate 10 plus the thickness T2 of the high thermal conductivity structure 30a).
[第三實施例][Third Embodiment]
請參閱圖4所示，其為本發明的第三實施例，本實施例與第一及第二實施例大致相同，其差異說明如下。Please refer to FIG. 4 , which is a third embodiment of the present invention. This embodiment is substantially the same as the first and second embodiments, and the differences are explained as follows.
在本實施例中，高導熱結構30b內部還形成有一真空密閉腔301，且真空密閉腔301的腔頂壁3011與腔底壁3012還可以分別形成有上燒結體3013與下燒結體3014，並且真空閉密腔301中含有適量的液體，所述液體可以是水或丙酮。並且，高導熱結構30b的底面可用以接觸浸沒於兩相冷卻液900中的發熱元件800，以使浸沒在兩相冷卻液900中的發熱元件800，除了可以透過兩相冷卻液900吸熱氣化帶走發熱元件800產生之熱能，更可以透過高導熱結構30b接觸並吸收發熱元件800產生之熱能，使得真空密閉腔301中內的液體氣化、蒸發為蒸汽，散發至多孔化之基底10並將熱能快速傳給與多孔化之基底10一體成型且以極高密度排列的多孔化之鏟削式鰭片20，並利用兩相冷卻液吸熱氣化將多孔化之鏟削式鰭片20吸收的熱能帶走，而真空密閉腔301中的蒸汽交出熱能並於腔頂壁3011冷凝後再回流至腔底壁3012，如此高速迴圈，就能將發熱元件800產生之熱能快速匯出，進而強化整體浸沒式散熱效果。In this embodiment, a vacuum sealed chamber 301 is formed inside the high thermal conductivity structure 30b, and the top wall 3011 and the bottom wall 3012 of the vacuum sealed chamber 301 may also form an upper sintered body 3013 and a lower sintered body 3014 respectively, and the vacuum sealed chamber 301 contains an appropriate amount of liquid, which may be water or acetone. Furthermore, the bottom surface of the high thermal conductivity structure 30b can be used to contact the heating element 800 immersed in the two-phase cooling liquid 900, so that the heating element 800 immersed in the two-phase cooling liquid 900 can not only absorb the heat generated by the heating element 800 through the two-phase cooling liquid 900, but also can contact and absorb the heat generated by the heating element 800 through the high thermal conductivity structure 30b, so that the liquid in the vacuum sealed chamber 301 is vaporized and evaporated into steam, which is dissipated to the porous base. The bottom 10 quickly transfers the heat energy to the porous shovel-cut fins 20 which are integrally formed with the porous base 10 and arranged at a very high density, and utilizes the two-phase cooling liquid to absorb heat and vaporize to take away the heat energy absorbed by the porous shovel-cut fins 20. The steam in the vacuum-sealed chamber 301 gives up the heat energy and condenses on the top wall 3011 of the chamber and then flows back to the bottom wall 3012 of the chamber. Such a high-speed loop can quickly export the heat energy generated by the heating element 800, thereby enhancing the overall immersion heat dissipation effect.
綜合以上所述，本發明提供的具有鏟削式鰭片的兩相浸沒式散熱結構，其至少可以通過「多孔化之散熱結構，其結構之總孔隙率在5%以上」、「多孔化之散熱結構包括有一多孔化之基底及多個多孔化之鏟削式鰭片」、「多孔化之基底具有相背對的第一表面與第二表面，多孔化之基底的第二表面用以與浸沒於兩相冷卻液的發熱元件形成接觸，多個多孔化之鏟削式鰭片是以鏟削成型方式一體成型在多孔化之基底的第一表面」、「多孔化之鏟削式鰭片具有一第一孔隙率，多孔化之基底具有一第二孔隙率，並且第一孔隙率高於第二孔隙率」的技術方案，得以有效的強化整體浸沒式散熱效果。Based on the above, the two-phase immersed heat dissipation structure with scraped fins provided by the present invention can at least adopt a "porous heat dissipation structure with a total porosity of more than 5%" and "a porous heat dissipation structure." The heat dissipation structure includes a porous base and a plurality of porous spade fins. The porous base has a first surface and a second surface that are opposite to each other. The second surface of the porous base is used to communicate with the heat dissipation structure. The heating elements immersed in the two-phase coolant are in contact, and a plurality of porous shovel-type fins are integrally formed on the first surface of the porous base by shovel molding." "Porous shovel-type fins The technical solution of "having a first porosity, the porous substrate having a second porosity, and the first porosity being higher than the second porosity" can effectively enhance the overall immersion heat dissipation effect.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.
1:多孔化之散熱結構 10:多孔化之基底 11:第一表面 12:第二表面 20:多孔化之鏟削式鰭片 201:孔隙 30a,30b:高導熱結構 301:真空密閉腔 3011:腔頂壁 3012:腔底壁 3013:上燒結體 3014:下燒結體 900:兩相冷卻液 800:發熱元件 T,T1,T2:厚度 D:間距 H:高度 1: Porous heat dissipation structure 10: Porous base 11: First surface 12: Second surface 20: Porous shaving fin 201: Pores 30a, 30b: High thermal conductivity structure 301: Vacuum sealed chamber 3011: Cavity top wall 3012: Cavity bottom wall 3013: Upper sintered body 3014: Lower sintered body 900: Two-phase cooling liquid 800: Heat generating element T, T1, T2: Thickness D: Distance H: Height
圖1為本發明第一實施例的結構側視示意圖。FIG1 is a schematic side view of the structure of the first embodiment of the present invention.
圖2為圖1中II部分的結構放大示意圖。FIG. 2 is an enlarged schematic diagram of the structure of part II in FIG. 1 .
圖3為本發明第二實施例的結構側視示意圖。FIG3 is a schematic side view of the structure of the second embodiment of the present invention.
圖4為本發明第三實施例的結構側視示意圖。Figure 4 is a schematic side view of the structure of the third embodiment of the present invention.
1:多孔化之散熱結構 1: Porous heat dissipation structure
10:多孔化之基底 10: Porous base
11:第一表面 11: First surface
12:第二表面 12: Second surface
20:多孔化之鏟削式鰭片 20: Porous shovel-cut fins
900:兩相冷卻液 900: Two-phase coolant
800:發熱元件 800: Heating element
Claims (10)
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