TW202303893A - Electronic device - Google Patents

Abstract

An electronic device includes a substrate, a plurality of first pads, an electronic element and a first spacer. The first pads are disposed on the substrate. The electronic element is disposed on the substrate and electrically connected to the first pads. The first spacer is disposed between the electronic element and the substrate. The electronic device of the present disclosure can effectively control the height and uniformity of the gap between the electronic element and the substrate, so as to prevent the electronic element from being skewed, and can have better structural reliability.

Description

electronic device

The present invention relates to an electronic device, and more particularly to an electronic device with better structural reliability.

Flip chip packaging (Flip Chip) technology is currently widely used semiconductor packaging technology. In flip-chip packaging technology, electronic components are usually soldered to a substrate by soldering. However, in the process of reflowing, since the solder will be in a molten state, the thickness of the solder is difficult to control during the reflowing process, which may easily lead to distortion of the electronic components disposed on the substrate. How to effectively improve problems such as the skew of electronic components caused by the reflow process is one of the problems that R&D personnel need to solve urgently.

The invention provides an electronic device with better structural reliability.

The electronic device of the present invention includes a substrate, a plurality of first pads, an electronic component, and a first spacer. The first pad is disposed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first pad. The first spacer is disposed between the electronic component and the substrate.

The electronic device of the present invention includes a substrate, an electronic component, a plurality of spacers and pads. The electronic components are arranged on the substrate. The spacer is disposed on one of the electronic component and the substrate. The pad is disposed on the other of the electronic component and the substrate. The substrate and the electronic components are electrically connected through the spacers and the pads.

Based on the above, in the embodiments of the present disclosure, the spacer is disposed between the electronic component and the substrate, which can effectively control the height and uniformity of the gap between the electronic component and the substrate, so as to prevent the electronic component from being skewed. Therefore, the electronic device of the present disclosure can have better structural reliability.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

The present disclosure can be understood by referring to the following detailed description combined with the accompanying drawings. It should be noted that, in order to make the readers understand easily and for the simplicity of the drawings, several drawings in the present disclosure only depict a part of the electronic device. Also, certain elements in the drawings are not drawn to actual scale. In addition, the number and size of each component in the figure are only for illustration, and are not intended to limit the scope of the present disclosure.

Certain terms will be used throughout the specification and appended claims of this disclosure to refer to particular elements. Those skilled in the art should understand that electronic device manufacturers may refer to the same element by different names. This document does not intend to distinguish between those elements that have the same function but have different names.

In the description and claims below, words such as "comprising" and "comprising" are open-ended words, so they should be interpreted as meaning "including but not limited to...".

In addition, relative terms such as "below" or "bottom" and "upper" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the drawings. It will be appreciated that if the illustrated device is turned over so that it is upside down, elements described as being on the "lower" side will then become elements on the "upper" side.

In some embodiments of the present disclosure, terms such as “connected” and “interconnected” related to bonding and connection, unless otherwise specified, may mean that two structures are in direct contact, or may also mean that two structures are not directly (indirectly). ) contact with other structures interposed between the two structures. And the terms about joining and connecting may also include the situation that both structures are movable, or both structures are fixed. In addition, the term "coupled" includes the transfer of energy between two structures by means of direct or indirect electrical connection, or the transfer of energy between two separate structures by means of mutual induction.

It will be understood that when an element or film is referred to as being "on" or "connected to" another element or film, it can be directly on or directly connected to the other element or film To another element or layer, or there is an intervening element or layer between the two (indirect cases). In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or film, there are no intervening elements or layers present.

The terms "about", "equal", "equal" or "same", "substantially" or "substantially" are generally interpreted as being within 20% of a given value or range, or as being within 20% of a given value or range Within 10%, 5%, 3%, 2%, 1%, or 0.5% of a value or range.

As used herein, the terms "film" and/or "layer" may refer to any continuous or discontinuous structures and materials (such as materials deposited by the methods disclosed herein). For example, films and/or layers may comprise two-dimensional materials, three-dimensional materials, nanoparticles, or even partial or complete molecular layers, or partial or complete atomic layers, or clusters of atoms and/or molecules. The film or layer may comprise a material or layer having pinholes, which may be at least partially continuous.

Although the terms first, second, third... may be used to describe various constituent elements, the constituent elements are not limited to this term. This term is only used to distinguish a single constituent element from other constituent elements in the specification. The same terms may not be used in the claims, but are replaced by first, second, third... in the order in which elements are declared in the claims. Therefore, in the following description, a first constituent element may be a second constituent element in the claims.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the related art and the present disclosure, and not in an idealized or overly formal manner Interpretation, unless specifically defined herein.

It should be noted that in the following embodiments, without departing from the spirit of the present disclosure, technical features in several different embodiments may be replaced, reorganized, and mixed to complete other embodiments.

The electronic device of the present disclosure may include a display device, an antenna device, a sensing device, a light emitting device, or a splicing device, but is not limited thereto. Electronic devices may include bendable or flexible electronic devices. Electronic devices may include electronic components. Electronic components may include passive components, active components, or combinations of the above, such as capacitors, resistors, inductors, variable capacitors, filters, diodes, transistors, inductors, MEMS, liquid crystals Chip (liquid crystal chip), etc., but not limited thereto. Diodes may include light emitting diodes or non-light emitting diodes. Diodes include P-N junction diodes (P-N. Junction diode), PIN type diodes (PIN Diode) or constant current diodes (Constant Current Diode). The light emitting diodes may, for example, include organic light emitting diodes (organic light emitting diodes, OLEDs), submillimeter light emitting diodes (mini LEDs), micro light emitting diodes (micro LEDs), quantum dot light emitting diodes (quantum dot LED), fluorescence (fluorescence), phosphorescence (phosphor) or other suitable materials, or a combination of the above, but not limited thereto. The sensors may, for example, include capacitive sensors, optical sensors, electromagnetic sensors, fingerprint sensors (fingerprint sensor, FPS), touch sensors (touch sensor) , antenna (antenna), or stylus (pen sensor), etc., but not limited thereto. In the following, a display device is used as an electronic device to illustrate the content of the disclosure, but the disclosure is not limited thereto.

Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

FIG. 1A is a schematic top view of an electronic device according to an embodiment of the present disclosure. FIG. 1B is a schematic cross-sectional view along line I-I of FIG. 1A . For clarity, the solder 150 in FIG. 1B is omitted in FIG. 1A . Please refer to FIG. 1A and FIG. 1B at the same time. In this embodiment, the electronic device 100 a includes a substrate 110 , a plurality of first pads 115 (two are schematically shown), an electronic component 120 and a first spacer 130 a. The first pads 115 are disposed on the substrate 110 . The electronic component 120 is disposed on the substrate 110 and electrically connected to the first pad 115 . The first spacer 130 a is disposed between the electronic component 120 and the substrate 110 .

In detail, in this embodiment, the substrate 110 includes a motherboard and circuits on the motherboard. The motherboard can be a glass substrate, a glass fiber (FR4) substrate, a flexible plastic substrate, a thin film transistor substrate, a flexible substrate or other suitable motherboards, but not limited to. The electronic component 120 is, for example, a light-emitting diode chip (LED die), which can be made of silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), sapphire (Sapphire) or glass A wafer made from a substrate, but not limited thereto. In another embodiment, the chip can also be a semiconductor package component, such as a Ball Grid Array (BGA) package component, a chip size package (Chip Size Package, CSP) component, a flip chip or a 2.5D/ 3-dimensional (2.5D/3D) semiconductor package components, but not limited thereto. In another embodiment, the chip can also be any kind of flip chip bonding components, such as integrated circuits (ICs), transistors (transistors), silicon controlled rectifiers, valves (valves), thin film transistors (Thin Film Transistors), capacitors, inductors, variable capacitors, filters, resistors, diodes, light emitting diodes, MEMS, liquid crystal chips, etc., but not limited thereto. The electronic device 100a of this embodiment further includes a plurality of second pads 125 (two are schematically shown) disposed on the electronic component 120, and the number of the second pads 125 may correspond to the number of the first pads 115 The number of the second pads 125 may also be different from the number of the first pads 115 . The first pad 115 and the second pad 125 are structurally and electrically connected together through the solder 150 . That is to say, the electronic component 120 of this embodiment is bonded on the substrate 110 in a flip-chip manner, for example.

In particular, in this embodiment, the first spacer 130a is disposed between the electronic component 120 and the substrate 110, and can be used to maintain the height and uniformity of the gap between the electronic component 120 and the substrate 110, and support the electronic component 120, so as to The electronic component 120 is prevented from being skewed. The first spacer 130 a can be fabricated on the electronic component 120 , on the substrate 110 or on the electronic component 120 and the substrate 110 , which is not limited here. As shown in FIG. 1A and FIG. 1B , the first spacer 130 a is disposed between the first pads 115 .

In addition, the electronic device 100 a of this embodiment further includes a second spacer 140 a disposed between the first pads 115 . That is to say, the first spacer 130 a and the second spacer 140 a are disposed between the electronic component 120 and the substrate 110 , and are located between the first pads 115 . Here, the material of the first spacer 130a and the second spacer 140a is, for example, photoresist (ie, photo spacer), polymer (ie, polymer pattern), metal (ie, polymer pattern). Namely metal pattern), film, tape, glue or underfill but not limited thereto.

In short, in the embodiment of the present disclosure, since the first spacer 130a and the second spacer 140a are disposed between the electronic component 120 and the substrate 110, the first spacer 130a and the second spacer 140a can be used to support electronic components 120 , and maintain the height and uniformity of the gap between the electronic components 120 and the substrate 110 , so as to prevent the electronic components 120 from being skewed. Therefore, the electronic device 100a of the present disclosure may have better structural reliability.

It should be noted here that the following embodiments use the component numbers and partial content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 2A is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 2B is a schematic cross-sectional view along line II-II of FIG. 2A . For clarity, the solder 150 in FIG. 2B is omitted from FIG. 2A . Please refer to FIG. 1A, FIG. 2A and FIG. 2B at the same time. The electronic device 100b is similar to the electronic device 100a in FIG. between the two spacers 140b. That is to say, the first spacer 130b and the second spacer 140b are located on opposite sides of the first pad 115 .

The present disclosure does not limit the size, arrangement and quantity of the first spacer 130a, the first spacer 130b, the second spacer 140b, and the second spacer 140b. In an unillustrated embodiment, the first spacer and the second spacer may also extend from between the electronic component and the substrate to the outside of the electronic component; or, there may be multiple first spacers and second spacers, and Surrounding the first pads separately from each other, the above all belong to the protection scope of the present disclosure.

FIG. 3 is a schematic top view of an electronic device according to another embodiment of the present disclosure. For clarity, the solder between the first pad 115 and the second pad 125 is omitted in FIG. 3 . Please refer to FIG. 1A and FIG. 3 at the same time. In this embodiment, the electronic device 100c is similar to the electronic device 100a in FIG. And the first spacer 130c is, for example, a spherical spacer. As shown in FIG. 3 , the four first spacers 130c are respectively arranged around the first pads 115 and arranged symmetrically, but not limited thereto. In other unillustrated embodiments, the number of the first spacers can be, for example, 2 to 10, and can be distributed around or among the first pads, which still belongs to the protection scope of the present disclosure. .

FIG. 4 is a schematic top view of an electronic device according to another embodiment of the present disclosure. For clarity, the solder between the first pad 115 and the second pad 125 is omitted in FIG. 4 . Please refer to FIG. 1A and FIG. 4 at the same time. The electronic device 100d is similar to the electronic device 100a in FIG. On three sides of a pad 115 , where the area of the electronic component 120 is A1 and the area of the first spacer 130d is A3, then A3 > 0.5A1. That is to say, the first spacer 130d is disposed between the electronic component 120 and the substrate 110 in a large-area manner to increase the supporting force to support the electronic component 120, and maintain the gap height between the electronic component 120 and the substrate 110 and Uniformity, so as to prevent the electronic component 120 from being skewed. Therefore, the electronic device 100d of the present disclosure may have better structural reliability. Here, the mentioned area is the area of the orthographic projection on the substrate 110 . Certainly, in other unillustrated embodiments, the shape of the first spacer may also be, for example, a rectangle or other appropriate shapes, which are not limited here.

FIG. 5A is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 5B is a schematic cross-sectional view along line III-III of FIG. 5A . For clarity, the solder 150 in FIG. 5B is omitted from FIG. 5A . Please refer to FIG. 1A, FIG. 5A and FIG. 5B at the same time. The electronic device 100e is similar to the electronic device 100a in FIG. Orthographic projection area of the electronic component 120 on the substrate 110 . In detail, the shape of the first spacer 130 e is, for example, rectangular and has two openings 132 . The first pad 115 , the solder 150 and the second pad 125 are located in the opening 132 , and the first spacer 130 e surrounds and surrounds the first pad 115 . The area of the electronic component 120 is A1, and the area of the first spacer 130e is A4, then A4>0.5A1. That is to say, the first spacer 130e is disposed between the electronic component 120 and the substrate 110 in a large-area manner to increase the support force to support the electronic component 120, and maintain the gap height between the electronic component 120 and the substrate 110 and Uniformity, so as to prevent the electronic component 120 from being skewed. Therefore, the electronic device 100e of the present disclosure may have better structural reliability.

FIG. 6 is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure. Please refer to FIG. 1A and FIG. 6 at the same time, the electronic device 100f is similar to the electronic device 100a in FIG. 1A , the difference between the two is: in this embodiment, the first spacer 130f is disposed on the first pad 115 and the second pad 125, wherein the first spacer 130f is, for example, a solder ball. The first spacers 130 f are added into the solder 150 , where the solder 150 is, for example, solder paste, which can be done by screen printing or tin spraying. That is to say, the first spacer 130 f is covered by the solder 150 to maintain the height and uniformity of the gap between the electronic component 120 and the substrate 110 to prevent the electronic component 120 from being skewed. Therefore, the electronic device 100f of the present disclosure may have better structural reliability.

FIG. 7 is a schematic top view of an electronic device according to another embodiment of the present disclosure. In FIG. 7 , the solder between the first pad 115g and the second pad 125g is omitted. Please refer to FIG. 1A and FIG. 7 at the same time. The electronic device 100g is similar to the electronic device 100a in FIG. , and the area of the electronic component 120 is A1, and the area of the first pad 115g or the second pad 125g is A2, then A2>0.3A1. That is to say, in this embodiment, the shape and area of the first pad 115g and the second pad 125g are changed to increase the supporting force to support the electronic component 120, and maintain the gap height between the electronic component 120 and the substrate 110 and Uniformity, so as to prevent the electronic component 120 from being skewed. Therefore, the electronic device 100g of the present disclosure can have better structural reliability.

In other unillustrated embodiments, the shapes of the first pad and the second pad are, for example, rectangular, and the area of the electronic component is A1, and the area of the second pad is A2, then A2 > 0.3A1; Alternatively, the number of the first pads and the number of the second pads are greater than two, such as three or four, etc., by increasing the number of pads to maintain the height and uniformity of the gap between the electronic component and the substrate. Resilience, and support electronic components, making electronic components more stable to prevent skewing.

FIG. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure. Please refer to FIG. 8 , in this embodiment, the spacer 130h is disposed on one of the electronic component 120 and the substrate 110 , and the pad 160 is disposed on the other of the electronic component 120 and the substrate 110 . In detail, the spacer 130h is, for example, disposed on the substrate 110 , and the pad 160 is, for example, disposed on the electronic component 120 , wherein the solder 150h is located between the spacer 130h and the pad 160 . The substrate 110 and the electronic component 120 are electrically connected through the spacer 130h, the solder 150h and the pad 160 . Here, the height of each spacer 130h is H1, the height of each pad 160 is H2, and the height of the solder 150h is H3, and H1>H2>H3. Because the height H1 of the spacer 130h is greater than the height H3 of the solder 150h, there will not be too much molten solder 150h during the reflow process, and the spacer 130h can support the electronic component 120, making the electronic component 120 more stable to prevent skewing . Therefore, the electronic device 100h of the present disclosure can have better structural reliability.

Based on the above, in the embodiments of the present disclosure, the spacer is disposed between the electronic component and the substrate, which can effectively control the height and uniformity of the gap between the electronic component and the substrate, so as to prevent the electronic component from being skewed. Therefore, the electronic device of the present disclosure can have better structural reliability.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h: electronic device 110: Substrate 115, 115g: the first pad 120: Electronic components 125, 125g: the second pad 130a, 130b, 130c, 130d, 130e, 130f: first spacers 130h: spacer 132: opening 140a, 140b: second spacers 150, 150h: solder 160: Pad A1, A2, A3, A4: area H1, H2, H3: Thickness

FIG. 1A is a schematic top view of an electronic device according to an embodiment of the present disclosure. FIG. 1B is a schematic cross-sectional view along line I-I of FIG. 1A . FIG. 2A is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 2B is a schematic cross-sectional view along line II-II of FIG. 2A . FIG. 3 is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 4 is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 5A is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 5B is a schematic cross-sectional view along line III-III of FIG. 5A . FIG. 6 is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure. FIG. 7 is a schematic top view of an electronic device according to another embodiment of the present disclosure. FIG. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure.

100a: electronic device

110: Substrate

115: The first pad

120: Electronic components

125: Second pad

130a: first spacer

140a: second spacer

150: Solder

Claims (10)

An electronic device comprising: Substrate; a plurality of first pads disposed on the substrate; an electronic component disposed on the substrate and electrically connected to the first pads; and The first spacer is arranged between the electronic component and the substrate. The electronic device as claimed in claim 1, wherein the first spacer is disposed between the first pads. The electronic device as described in claim 2, further comprising: The second spacer is disposed between the first pads. The electronic device as described in Claim 1, further comprising: The second spacer, the first pads are disposed between the first spacer and the second spacer. The electronic device as claimed in claim 1, wherein the first spacer surrounds the first pads. The electronic device as described in Claim 1, further comprising: A plurality of second pads are disposed on the electronic component, and the first spacer is disposed between the second pads and the substrate. The electronic device as claimed in claim 6, wherein the first spacers comprise solder balls. The electronic device as claimed in claim 6, wherein the area of the electronic component is A1, and the area of the second pads is A2, then A2>0.3A1. An electronic device comprising: Substrate; an electronic component disposed on the substrate; a plurality of spacers disposed on one of the electronic component and the substrate; and A plurality of pads are disposed on the other of the electronic component and the substrate, and the substrate and the electronic component are electrically connected to the pads through the spacers. The electronic device as described in Claim 9, further comprising: Solder, located between one of the spacers and one of the pads, wherein the thickness of one of the spacers is H1, and one of the pads The thickness of the solder is H2, and the height of the solder is H3, then H1>H2>H3.

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