TW201641282A - Delamination method of laminate structure - Google Patents

Abstract

A delamination method of laminate structure includes the following steps. A laminate structure is provided. The laminate structure includes a carrier and a substrate, wherein the carrier has a first surface and the substrate has a second surface, and the first surface is in contact with the second surface. A separating device is provided. The separating device includes a fixture and a flexible structure, and both ends of the flexible structure are connected with the fixture. The flexible structure is stretched out by the fixture and is then inserted between the first surface and the second surface such that the first surface is not in contact with the second surface. Subsequently, the flexible structure is lifted up such that the substrate is lifted and the substrate is separated from the carrier.

Description

Lamination method of laminated structure

The present invention relates to a delamination method for a laminated structure, and more particularly to a delamination method for a laminated structure formed by contact bonding.

In order to meet the market demand, today's display panels are oriented toward a light, short, short form and flexible characteristics. However, due to limitations in process capability, the display panel is currently designed to avoid problems such as fragmentation and warpage of its thin and light substrates. Most of the thin and light substrates are first fabricated on the carrier, then the display elements are fabricated on the thin and light substrate, and finally the fabricated thin substrate is separated from the carrier. At present, the adhesive layer (for example, optical glue, hot melt adhesive, etc.) is often used in the industry to attach a thin and light substrate to a carrier, and then an illumination process or a thermal process is used to securely fix the thin and light substrate to the carrier. Then, the adhesive layer between the thin substrate and the carrier is destroyed by a destructive manner such as laser or solvent to separate the thin and light substrate from the carrier. However, the method of bonding the thin and light substrate to the carrier by the adhesive layer and destructively separating the thin substrate and the carrier is easy to cause a part of the adhesive layer to remain on the thin substrate and the carrier, thereby causing contamination of the thin and light substrate and the carrier cannot be used. The recycling process is repeated, so the process steps are complicated, the cost is high, and the yield is low. Therefore, how to make the thin and light substrate securely fixed on the carrier board, and the thin and light substrate and the carrier board can be smoothly formed after the display element is fabricated on the thin and light substrate. Separation is the biggest problem in developing lightweight, short display panels.

One of the objects of the present invention is to provide a delamination method for a laminated structure formed by contact bonding to overcome and solve the conventional problems.

In order to achieve the above object, the present invention provides a delamination method for a laminated structure, comprising the steps of: providing a laminated structure comprising a first carrier bonded to each other and a first substrate, wherein the first The carrier has a first surface, the first substrate has a second surface, and the first surface and the second surface are in contact with each other; a separator is provided, wherein the separator comprises a first jig and a first soft structure, and The two ends of the first flexible structure are respectively connected to the first jig; the first flexible structure is tensioned by the first jig and inserted into the first surface and the second surface by one side of the first carrier and the first substrate The first surface and the second surface are not joined to each other; and the first flexible structure is lifted up by the first jig to lift the first substrate to separate the first substrate from the first carrier.

In the delamination method of the laminated structure of the present invention, the first surface of the first carrier and the second surface of the first substrate are in direct contact, so that there is no adhesive layer between the first surface and the second surface, so Causing contamination of the first carrier and the first substrate, and the first carrier and the first substrate are formed between the first surface and the second surface while the first flexible structure is interposed between the first surface and the second surface As a result of the unengagement of each other, the first flexible structure is then lifted up by the first jig to lift the first substrate to separate the first substrate from the first carrier. In this way, the first carrier can still be reused and the first substrate can be smoothly peeled off, thereby overcoming the problems of complicated process steps, high cost, and low yield.

The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .

Please refer to Figures 1 to 6. 1 is a flow chart showing the steps of a delamination method of a laminated structure according to a first embodiment of the present invention; and FIG. 2 is a top view showing a laminated structure of a first embodiment of the first embodiment of the present invention; 3 is a perspective view showing a laminated structure of a first embodiment of the first embodiment of the present invention; and FIG. 4 is a first embodiment of the first embodiment of the present invention for tightening the first flexible structure. And a top view of the first carrier and the first substrate inserted between the first surface and the second surface; FIG. 5 is a first embodiment of the first embodiment of the present invention The structure is tensioned and inserted into a perspective view between the first surface and the first substrate by a first carrier and a second surface; FIG. 6 is the first embodiment of the first embodiment of the present invention. The jig lifts the first flexible structure upward to lift the first substrate to separate the first substrate from the first carrier. As shown in FIGS. 1 to 6, the method for fabricating the delamination method of the stacked structure of the first embodiment may include the following steps:

Step S10: providing a laminated structure 10, the laminated structure 10 includes a first carrier C1 and a first substrate S1 joined to each other, wherein the first carrier C1 has a first surface A1, and the first substrate S1 has a a second surface A2, and the first surface A1 and the second surface A2 are in contact with each other;

Step S11: providing a separator 20, wherein the separator 20 includes a first jig F1 and a first soft structure L1, and the two ends of the first soft structure L1 are respectively connected to the first jig F1;

Step S12: The first flexible structure L1 is tensioned by the first jig F1 and inserted between the first surface A1 and the second surface A2 by the first carrier C1 and one side of the first substrate S1 to make the first surface A1 and second surface A2 are not joined to each other;

Step S13: The first flexible structure L1 is lifted up by the first jig F1 to lift the first substrate S1 to separate the first substrate S1 from the first carrier C1.

Specifically, as shown in FIG. 2 and FIG. 3, step S10 is first performed to provide a laminated structure 10 including a first carrier C1 and a first substrate S1 joined to each other, wherein A carrier C1 has a first surface A1, the first substrate S1 has a second surface A2, and the first surface A1 and the second surface A2 are in contact with each other. In this embodiment, the first carrier C1 and the first substrate S1 are bonded to each other by contact bonding. In other words, the first carrier C1 is in direct contact with the first substrate S1, and there is no adhesive layer therebetween. The contact bonding manner of the first carrier C1 and the first substrate S1 may be, for example, a hydrogen bonding manner. For example, the first carrier C1 and the first substrate S1 are both glass plates, and thus the first carrier C1. Both the first surface A1 and the second surface A2 of the first substrate S1 have a plurality of hydroxyl groups (also known as hydroxyl groups, chemical formula −OH), and the oxygen atoms on the hydroxyl groups are Lone pairs. An atom, therefore, an oxygen atom having a higher electron density tends to attract nearby hydrogen atoms, that is, an oxygen atom on the hydroxyl group can attract a hydrogen atom adjacent to and not on the same hydroxyl group, and form an intermolecular hydrogen bond therewith. Specifically, the oxygen atom of the hydroxyl group on the first surface A1 can attract the hydrogen atom of the hydroxyl group on the second surface A2, and the oxygen atom of the hydroxyl group on the second surface A2 can also attract the hydrogen atom of the hydroxyl group on the first surface A1, thus the first The surface A1 and the second surface A2 may be bonded to each other by hydrogen bonding. When the first surface A1 and the second surface A2 are in contact with each other in a hydrogen bonding manner, the first surface A1 and the second surface A2 have a plurality of hydrogen peroxide structures (chemical formula HO...HO), and on the hydroxyl group The oxygen atom has a high electronegativity, and the negative charge can be stabilized, so that the hydrogen atom on the hydroxyl group is easily dissociated, so when the stacked structure 10 composed of the first substrate S1 and the first carrier C1 is heated, A portion of the water molecule (hydrogen oxide) between the first surface A1 and the second surface A2 is evaporated by heat, whereby a covalent bond between the first surface A1 and the second surface A2 can be formed by using oxygen atoms. The first substrate S1 can be stably and closely attached to the first carrier C1. The present invention is not limited to the above-described hydrogen bonding method, and the first carrier C1 and the first substrate S1 may be bonded to each other by electrostatic bonding (also referred to as anodic bonding) or other suitable contact bonding method.

Referring to FIG. 3, in the present embodiment, the thickness D2 of the first substrate S1 is smaller than the thickness D1 of the first carrier C1. For example, the thickness D2 of the first substrate S1 may be less than or equal to 0.3 millimeters (mm), and the thickness D1 of the first carrier C1 may be greater than or equal to 0.5 millimeters (mm). Since the thickness D2 of the first substrate S1 is relatively thin, in the process of fabricating other components on the first substrate S1, the first substrate S1 is disposed on the first carrier C1 so that it is less prone to fragmentation, warpage, and the like. , which facilitates the fabrication of other finishes on the first substrate S1. In this embodiment, the first substrate S1 is preferably a base material having flexibility, bendable, stretchable or lightweight characteristics, and the first carrier C1 preferably has a comparative base material. Good toughness and high stiffness, which can carry soft objects to meet the needs of the production machine and process. For example, the first substrate S1 may be a flexible substrate (for example, an ultra-thin glass substrate), and the first carrier C1 may be a rigid carrier (for example, a glass substrate), but the invention is not limited thereto. The material of the substrate S1 and the first carrier C1 may also be metal, plastic, resin, glass fiber, carbon fiber or other polymer composite material. In addition, a touch sensor, a thin film transistor, a scan/data trace, an electrode, a passive component (eg, a capacitor, a resistor, etc.), an alignment layer, and a driver can be formed on the opposite side of the second surface A2 of the first substrate S1. Components such as lines, color filters, or black matrices.

As shown in FIGS. 4 to 5, after the fabrication of the components on the first substrate S1 is completed, step S11 is followed to provide the separator 20, wherein the separator 20 includes the first jig F1 and the first soft structure L1. And the two ends of the first flexible structure L1 are respectively connected to the first jig F1. Then, in step S12, the first flexible structure L1 is tightened by the first jig F1 and inserted between the first surface A1 and the second surface A2 by the first carrier C1 and the first substrate S1, so that the first One surface A1 and the second surface A2 are not joined to each other. In this embodiment, the edge E1 of the first carrier C1 protrudes from the edge E2 of the first substrate S1 such that a portion of the first surface A1 does not overlap with the second surface A2, so the first flexible structure L1 can pass through The first surface A1 on which the two surfaces A2 overlap is inserted between the first surface A1 and the second surface A2.

Further, in the present embodiment, the first flexible structure L1 is based on the first surface A1 that is not overlapped with the second surface A2 as a reference for entering the first surface A1 and the second surface A2, and thus the first soft structure L1 is The first edge E1 of the first surface A1 moves toward the second edge E2 of the second surface A2, that is, the first flexible structure L1 moves to the position where the first carrier C1 and the first substrate S1 are joined, thereby inserting the first surface A surface A1 is interposed between the second surface A2 such that the first surface A1 and the second surface A2 are not joined to each other.

When the first flexible structure L1 is tightly inserted between the first surface A1 and the second surface A2, the contact engagement between the first surface A1 and the second surface A2 is subsequently destroyed, that is, the first surface A1 and the second surface Hydrogen bonding or covalent bonding between A2 is broken by the first soft structure L1, thereby obtaining a result that the first surface A1 and the second surface A2 are separated from each other. The material of the first flexible structure L1 is selected in such a manner that the first substrate S1 is not scratched. In the embodiment, the first flexible structure L1 includes a plurality of flexible wires L12, which are disposed on the first jig F1, and the flexible wires are disposed. The material of L12 may be a high molecular polymer, such as poly(ethylene terephthalate), PET, or polytetrafluoroethene (PTFE), but the invention is not limited thereto. The first jig F1 may be an organic material or an inorganic material, and the structure of the first jig F1 is not limited to a rectangular parallelepiped, and the first jig F1 may be a U-shaped body or a cylinder, etc., which can fix the first soft structure L1. The structure.

It is to be noted that, in order to prevent the first substrate S1 from being separated from the first carrier C1 after being separated by the first flexible wire L121, in the embodiment, the first flexible structure L1 includes a plurality of flexible wires L122. L123~L12n enters between the first substrate S1 and the first carrier C1 with the first flexible wire L121, and moves along with the first flexible wire L121. In this way, after the first substrate S1 and the first carrier C1 are separated by the first flexible wire L121, the plurality of flexible wires L122 to L12n are blocked, and are not easily connected again.

Next, step S13 is performed. As shown in FIG. 6, the first flexible structure L1 is lifted up by the first jig F1 to lift the first substrate S1 to separate the first substrate S1 from the first carrier C1. In this embodiment, the first flexible structure L1 of the separator 20 can serve as a carrier plate for carrying the first substrate S1, so that the first flexible structure L1 is lifted up, and the first substrate S1 is also lifted, so The first substrate S1 is separated from the first carrier C1. Here, the separation process of the laminated structure 10 composed of the first substrate S1 and the first carrier C1 is completed.

As can be seen from the above, the first carrier C1 and the first substrate S1 are bonded to each other by contact bonding, so that there is no adhesive layer between the first carrier C1 and the first substrate S1, so the first carrier C1 and the first substrate After the S1 is separated, the first carrier C1 and the first substrate S1 do not have residual glue, so the first carrier and the first substrate are not contaminated, whereby the first carrier C1 undergoes the steps S10 to S13. It can still be reused, so the present invention can overcome the problems of complicated process steps, high cost, and low yield.

The delamination method of the laminated structure of the present invention is not limited to the above embodiment. Hereinafter, the delamination method of the laminated structure of the modified embodiment of the present invention will be sequentially described, and in order to facilitate the comparison of the differences of the respective embodiments and simplify the description, the same symbols are used to denote the same components in the following modified embodiments. And the description of the differences between the embodiments is mainly made, and the repeated parts are not described again.

Please refer to Figure 7. Figure 7 is a first variation of the first embodiment of the first embodiment of the first embodiment of the present invention. The first flexible structure is tensioned and inserted into the first surface by the first carrier and one side of the first substrate. A schematic top view between two surfaces. As shown in FIG. 7, the separator 20' provided in this embodiment further includes a plurality of nozzles N, which are disposed on the first jig F1, compared to the first embodiment of the first embodiment. . Therefore, in the process of tensioning the first flexible structure L1 by the first jig F1 and inserting the first carrier C1 and one side of the first substrate S1 between the first surface A1 and the second surface A2, the nozzle N The separating liquid may be sprayed from the first jig F1 to the first edge E1 of the first carrier C1 and the second edge E2 of the first substrate S1, and the separating liquid preferably has a relationship between the first surface A1 and the second surface A2. The effect of the contact engagement, whereby the separator 20' can separate the first carrier C1 and the first substrate S1 in a faster manner than in the first embodiment, and at the same time, clean the first carrier C1 and The effect of the first substrate S1. The separating liquid is preferably selected from a solvent having a hydrogen bond, such as a liquid such as water (hydrogen peroxide) or ethanol. For example, the first carrier C1 and the first substrate S1 are both glass plates, and the separated liquid is hydrogen peroxide. A plurality of hydroxyl groups are formed on the first surface A1 of the first carrier C1 and the second surface A2 of the first substrate S1, and the first surface A1 and the second surface A2 may be bonded to each other by hydrogen bonding. When the laminated structure 10 is subjected to a thermal process, the hydrogen peroxide between the first surface A1 and the second surface A2 is evaporated by heat, so that a covalent bond is formed between the first surface A1 and the second surface A2 by oxygen atoms. And the manner, when the first flexible structure L1 is inserted into the first surface A1 and the second surface A2, spraying hydrogen oxide on the first surface A1 and the second surface A2, at which time the hydrogen oxide can enter the first surface A1 and the second surface Between the surfaces A2, hydrogen peroxide is attracted by the oxygen atoms between the first surface A1 and the second surface A2, and the manner in which the original oxygen atoms are covalently bonded is changed back to the manner of hydrogen bonding. Since the bond of the hydrogen bond can be smaller than the bond of the covalent bond, the first carrier C1 The first substrate S1 with the aid of the separated liquid is more rapid and efficient separation, and the separated liquid present at the same time also achieve the effect of cleaning the first carrier C1 and the first substrate S1.

It is worth mentioning that the nozzle N is not limited to only separating the liquid from the spray on the first jig F1, and the nozzle N can also be disposed on the additional device. For example, the nozzle N can also be disposed on the first carrier C1 and The first substrate S1 is below the first carrier C1 and the first substrate S1 or on the side of the first carrier C1 and the first substrate S1. The position of the nozzle N is preferably disposed at a position where the first surface A1 and the second surface A2 are brought into contact with the separated liquid to achieve the effect that the first surface A1 and the second surface A2 are not joined to each other. For example, the nozzle N may be Disposed on the first carrier C1 and the first substrate S1, spraying the separation liquid when the first flexible structure L1 is inserted into the first surface A1 and the second surface A2, thereby causing the first soft structure L1 to have a separation liquid, and thus During the insertion of the first flexible structure L1 into the first surface A1 and the second surface A2, the separated liquid on the first flexible structure L1 may enter between the first surface A1 and the second surface A2.

Please refer to Figures 8 to 9. Figure 8 is a second variation of the first embodiment of the first embodiment of the first embodiment of the present invention. The first flexible structure is tensioned and inserted into the first surface by the first carrier and one side of the first substrate. FIG. 9 is a perspective view showing a first modification of the first embodiment of the first embodiment of the first embodiment of the present invention, lifting the first flexible structure upward to lift the first substrate; A schematic view of the first substrate separated from the first carrier. As shown in FIGS. 8 to 9, the first flexible structure L1 of the present embodiment is from the first corner H1 of the first surface A1 to the second surface A2 as compared with the first embodiment of the first embodiment. The second corner H2 moves, that is, the first flexible structure L1 moves to a position where the first carrier C1 and the first substrate S1 are joined, thereby being inserted between the first surface A1 and the second surface A2, so that The first surface A1 and the second surface A2 are not joined to each other, but the present invention is not limited thereto, and the first flexible structure L1 may be arbitrarily selected to be inserted into the positions of the first surface A1 and the second surface A2. It is worth mentioning that the separator of the embodiment may also comprise a plurality of nozzles for spraying the separated liquid, thereby enabling faster and effective separation with the aid of the separation liquid, and simultaneously cleaning the first carrier C1 and the first A substrate S1.

Please refer to Figures 10 to 12. Figure 10 is a second embodiment of the first embodiment of the present invention, the first flexible structure is tensioned and inserted between the first surface and the second surface by the first carrier and one side of the first substrate. Figure 11 is a cross-sectional view taken along line A-A' of Figure 10; Figure 12 is a first embodiment of the second embodiment of the first embodiment of the present invention. A cross-sectional view of a flexible structure being lifted up to lift the first substrate to separate the first substrate from the first carrier. As shown in FIGS. 10 to 12, the first flexible structure L1 of the separator 30 provided in the present embodiment includes a flexible sheet L14 as compared with the first embodiment of the first embodiment. The material of the flexible sheet L14 may be a high molecular polymer, such as polyethylene terephthalate (PET) or polytetrafluoroethene (PTFE), but the invention is not limited thereto. . It is to be noted that, in order to prevent the first substrate S1 from being separated from the first carrier C1 after being separated by the flexible sheet L14, in the embodiment, the area of the flexible sheet L14 is preferably larger than the first substrate S1. As a result, after the first substrate S1 and the first carrier C1 are separated by the flexible sheet L14, they are still blocked by the flexible sheet L14 and cannot be connected again.

It should be noted that, in this embodiment, the flexible sheet L14 moves from the first edge E1 of the first surface A1 to the second edge E2 of the second surface A2, but the present invention is not limited thereto, and the flexible sheet L14 may be The position of the first surface A1 and the second surface A2 is arbitrarily selected. For example, the flexible sheet L14 may be inserted between the first surface A1 and the second surface A2 from the corners of the first surface A1 and the second surface A2. In addition, the separator 30 of the present embodiment may also include a plurality of nozzles for spraying the separated liquid, thereby enabling faster and effective separation with the aid of the separation liquid, and simultaneously cleaning the first carrier C1 and the first substrate S1. .

Please refer to Figures 13 to 17. Figure 13 is a flow chart showing the steps of the delamination method of the laminated structure of the second embodiment of the present invention. Figure 14 is a cross-sectional view showing a laminated structure of a second embodiment of the present invention; and Figure 15 is a view showing a second embodiment of the present invention, which is a second flexible structure which is tensioned by a first carrier and a first substrate. Inserting a side between the third surface and the fourth surface and tensioning the first flexible structure and inserting a first carrier and a side of the first substrate between the first surface and the second surface; FIG. 16 is a schematic view; According to a second embodiment of the present invention, a second jig is lifted up by a second jig to lift the second carrier to separate the second carrier from the second substrate; The first jig of the second embodiment lifts the first flexible structure upward to lift the first substrate to separate the first substrate from the first carrier. As shown in FIGS. 13 to 17, the method for fabricating the delamination method of the stacked structure of the second embodiment may include the following steps:

Step S20: providing a laminated structure 40, the laminated structure 40 includes a first carrier C1 and a first substrate S1 joined to each other, and a second carrier C2 and a second substrate S2 joined to each other, wherein the first The carrier C1 has a first surface A1, the first substrate S1 has a second surface A2, the first surface A1 and the second surface A2 are in contact with each other, the second carrier C2 has a third surface A3, and the second substrate S2 has a fourth surface A4, the third surface A3 and the fourth surface A4 are in contact with each other, and the first substrate S1 and the second substrate S2 are located between the first carrier C1 and the second carrier C2;

Step S21: Providing a separator 50, wherein the separator 50 includes a first jig F1, a first soft structure L1, a second jig F2, and a second soft structure L2, and two of the first soft structures L1 The end portions are respectively connected to the first jig F1, and the two ends of the second soft structure L2 are respectively connected to the second jig F2;

Step S22: The second flexible structure L2 is tensioned by the second jig F2 and inserted between the third surface A3 and the fourth surface A4 by one side of the second carrier C2 and the second substrate S2 to make the third surface A3 and fourth surface A4 are not joined to each other;

Step S23: The first flexible structure L1 is tensioned by the first jig F1 and inserted between the first surface A1 and the second surface A2 by the first carrier C1 and one side of the first substrate S1 to make the first surface A1 and second surface A2 are not joined to each other;

Step S24: lifting the second carrier C2 upward by the second jig F2 to lift the second carrier C2 to separate the second carrier C2 from the second substrate S2;

Step S25: The first flexible structure L1 is lifted up by the first jig F1 to lift the first substrate S1 to separate the first substrate S1 from the first carrier C1.

Specifically, as shown in FIG. 13, step S20 is first performed. Compared with the first embodiment, the laminated structure 40 provided in this embodiment further includes a second carrier C2 and a second substrate which are bonded to each other. S2 and an element layer U, wherein the second carrier C2 has a third surface A3, the second substrate S2 has a fourth surface A4, the third surface A3 and the fourth surface A4 are in contact with each other, and the first substrate S1 and the first substrate The two substrates S2 are located between the first carrier C1 and the second carrier C2. Specifically, the second carrier C2 is in direct contact with the second substrate S2, and there is no adhesive layer between the two, wherein the second carrier C2 and the second substrate S2 are in contact with the first carrier C1. The first substrate S1 has the same contact bonding method, but is not limited thereto, and the contact bonding manner of the second carrier C2 and the second substrate S2 may be different from the contact bonding manner between the first carrier C1 and the first substrate S1. Further, the element layer U of the laminated structure 40 is disposed between the first substrate S1 and the second substrate S2.

In this embodiment, the laminate structure 40 can be a thin laminate structure or a flexible laminate structure. For example, the laminate structure 40 can be a display panel, a touch panel, a wearable electronic device, or other electronic or optical products. The first substrate S1 can be, for example, a thin film transistor substrate, and the second substrate S2 can be, for example, a color filter substrate. The component layer U is interposed between the first substrate S1 and the second substrate S2. The component layer U of the embodiment includes The display layer is, for example, a liquid crystal layer, an organic light emitting diode (OLED) element, or an electrophoresis, but is not limited thereto. The component layer U may further comprise a thin film transistor, a scan/data trace, an electrode, a passive component (eg, a capacitor, a resistor, etc.), an alignment layer, and a driving line, and the like is located between the display layer and the first substrate S1, and the component layer U may be A structure having a plurality of color filters, electrodes, a black matrix, and a spacer is located between the display layer and the second substrate S2, but the present invention is not limited thereto.

As shown in FIG. 13 to FIG. 17, step S21 to step S25 are further performed. The separator 50 further includes a second jig F2 and a second soft structure L2, and the two ends of the second soft structure L2 are respectively The second jig F2 is connected, and the delamination method of the laminated structure of the embodiment may include tightening the second flexible structure L2 by the second jig F2 and inserting one side of the second carrier C2 and the second substrate S2 Between the third surface A3 and the fourth surface A4 such that the third surface A3 and the fourth surface A4 are not joined to each other, and the first soft structure L1 is lifted up by the first jig F1 to lift the first substrate S1 Before the step, the second carrier C2 is lifted up by the second jig F2 to lift the second carrier C2 to separate the second carrier C2 from the second substrate S2. Specifically, the second flexible structure The time point at which the L2 is inserted between the third surface A3 and the fourth surface A4 may be the same as the time point when the first flexible structure L1 is inserted between the first surface A1 and the second surface A2, and thus the first surface A1 and the second surface A2 The second surface A3 and the fourth surface A4 may not be joined to each other at the same time, and the second flexible structure L2 may be inserted into the third The time point between the surface A3 and the fourth surface A4 may also be different from the time point when the first flexible structure L1 is inserted between the first surface A1 and the second surface A2. For example, the second flexible structure L2 is first inserted. Between the three surfaces A3 and the fourth surface A4, the first flexible structure L1 is then inserted between the first surface A1 and the second surface A2.

The step of lifting the second carrier C2 upward by the second jig F2 may also be performed before the first flexible structure L1 is inserted between the first surface A1 and the second surface A2. The material of the second jig F2 and the second soft structure L2 may be the same as the material of the first jig F1 and the first soft structure L1, but is not limited thereto, and the materials of the second jig F2 and the second soft structure L2 may be The first jig F1 is different from the material of the first soft structure L1. In this embodiment, the second flexible structure L2 includes a plurality of flexible wires L22 disposed at intervals on the second jig F2. In another variation, the second flexible structure may also include a flexible sheet.

In this embodiment, the first flexible structure L1 and the second flexible structure L2 enter from the corners of the first surface A1 and the second surface A2, and move in the same direction, but the invention is not limited thereto, and the first soft structure L1 And the second flexible structure L2 can arbitrarily select the position of the first surface A1 and the second surface A2 and the positions of the third surface A3 and the fourth surface A4, and the first soft structure L1 and the second soft structure L2 can be in different directions Moving, for example, the first flexible structure L1 can enter between the first surface A1 and the second surface A2 from the left side, and the second soft structure L2 can enter the third surface A3 and the fourth surface A4 from the right side, thus the first soft structure L1 moves from left to right, and the second soft structure L2 moves from right to left. In addition, the separator 50 of the present embodiment may also include a plurality of nozzles for spraying the separated liquid, thereby enabling faster and effective separation with the aid of the separated liquid, and simultaneously cleaning the first carrier C1 and the first substrate S1. The second carrier C2 and the second substrate S2.

In summary, in the delamination method of the laminated structure of the present invention, the first surface of the first carrier and the second surface of the first substrate are bonded to each other by contact bonding, and thus the first surface and the second surface There is no adhesive layer between them, so after the first carrier is separated from the first substrate, the first carrier and the first substrate do not have residual glue, so the first carrier and the first substrate are not contaminated, and the first carrier a carrier and the first substrate insert the first flexible structure between the first surface and the second surface, and the first surface and the second surface produce a result of unjoining each other, and then the first jig is used The first flexible structure is lifted upward to lift the first substrate to separate the first substrate from the first carrier, thereby improving the complexity of the conventional process steps. In this way, the first carrier can still be reused and the first substrate can be smoothly peeled off, thereby improving product yield and reliability, and greatly reducing manufacturing costs. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10, 40‧‧‧ laminated structure
20, 20', 30, 50‧ ‧ separator
A1‧‧‧ first surface
A2‧‧‧ second surface
A3‧‧‧ third surface
A4‧‧‧ fourth surface
C1‧‧‧ first carrier
C2‧‧‧second carrier board
D1, D2‧‧‧ thickness
E1‧‧‧ first edge
E2‧‧‧ second edge
F1‧‧‧First fixture
F2‧‧‧second fixture
H1‧‧‧First corner
H2‧‧‧second corner
L1‧‧‧ first soft structure
L12, L121, L122, L123~L12n‧‧‧ soft wire
L14‧‧‧Soft sheet
L2‧‧‧Second soft structure
L22‧‧‧Soft wire
N‧‧‧ nozzle
S1‧‧‧ first substrate
S2‧‧‧second substrate
S10, S11, S12, S13‧‧‧ steps
S20, S21, S22, S23, S24, S25‧‧
U‧‧‧ component layer

Fig. 1 is a flow chart showing the steps of the delamination method of the laminated structure of the first embodiment of the present invention. Fig. 2 is a top plan view showing a laminated structure of a first embodiment of the first embodiment of the present invention. Fig. 3 is a perspective view showing the laminated structure of the first embodiment of the first embodiment of the present invention. Figure 4 is a first embodiment of the first embodiment of the present invention, the first flexible structure is tensioned and inserted between the first surface and the second surface by the first carrier and one side of the first substrate. See the schematic. Figure 5 is a perspective view showing the first embodiment of the first embodiment of the present invention in which the first flexible structure is tensioned and inserted between the first surface and the first surface by the first carrier and the first substrate. schematic diagram. FIG. 6 is a perspective view showing the first jig of the first embodiment of the first embodiment of the first embodiment of the present invention in which the first flexible structure is lifted upward to lift the first substrate to separate the first substrate from the first carrier. Figure 7 is a first variation of the first embodiment of the first embodiment of the first embodiment of the present invention. The first flexible structure is tensioned and inserted into the first surface by the first carrier and one side of the first substrate. A schematic top view between two surfaces. Figure 8 is a second variation of the first embodiment of the first embodiment of the first embodiment of the present invention. The first flexible structure is tensioned and inserted into the first surface by the first carrier and one side of the first substrate. A three-dimensional representation between two surfaces. 9 is a first jig of a second modified embodiment of the first embodiment of the first embodiment of the present invention, the first flexible structure is lifted upward to lift the first substrate to make the first substrate and the first carrier A schematic view of the separation of the plates. Figure 10 is a second embodiment of the first embodiment of the present invention, the first flexible structure is tensioned and inserted between the first surface and the second surface by the first carrier and one side of the first substrate. See the schematic. Fig. 11 is a schematic cross-sectional view taken along line A-A' of Fig. 10. Figure 12 is a cross-sectional view showing the first jig of the second embodiment of the first embodiment of the present invention in which the first flexible structure is lifted upward to lift the first substrate to separate the first substrate from the first carrier. Figure 13 is a flow chart showing the steps of the delamination method of the laminated structure of the second embodiment of the present invention. Figure 14 is a cross-sectional view showing a laminated structure of a second embodiment of the present invention. Figure 15 is a second embodiment of the present invention, the second flexible structure is tensioned and inserted between the first surface of the first carrier and the first substrate between the third surface and the fourth surface and the first flexible structure is tightened And a three-dimensional schematic diagram of the first carrier and the first substrate are inserted between the first surface and the second surface. Figure 16 is a perspective view showing the second embodiment of the second embodiment of the present invention in which the second carrier is lifted up to lift the second carrier to separate the second carrier from the second substrate. Figure 17 is a perspective view showing the first jig of the second embodiment of the present invention with the first flexible structure raised upward to lift the first substrate to separate the first substrate from the first carrier.

S10, S11, S12, S13‧‧‧ steps

Claims (13)

A delamination method for a laminated structure, comprising the steps of: providing a laminated structure comprising a first carrier and a first substrate bonded to each other, wherein the first carrier has a first surface The first substrate has a second surface, and the first surface and the second surface are in contact with each other; a separator is provided, wherein the separator comprises a first jig and a first soft structure, and the first softness The two ends of the structure are respectively connected to the first jig; the first jig is tensioned by the first jig and inserted into the first surface by the first carrier and one side of the first substrate; Between the second surfaces such that the first surface and the second surface are not joined to each other; and lifting the first flexible structure upward by the first jig to lift the first substrate to make the first substrate Separated from the first carrier. The delamination method of the laminated structure according to claim 1, wherein the first flexible structure comprises a plurality of flexible wires disposed at intervals on the first jig. The delamination method of the laminated structure according to claim 1, wherein the first flexible structure comprises a flexible sheet. The delamination method of the laminated structure according to claim 1, wherein an edge of the first carrier protrudes from an edge of the first substrate such that a portion of the first surface does not overlap the second surface, and the first A flexible structure is interposed between the first surface and the second surface via the first surface that does not overlap the second surface. The delamination method of the laminated structure according to claim 1, wherein the thickness of the first substrate is smaller than the thickness of the first carrier. The delamination method of the laminated structure according to claim 1, wherein the first substrate and the first carrier are bonded to each other by a contact bonding. The delamination method of the laminated structure according to claim 6, wherein the first carrier and the first substrate respectively comprise a glass plate, and the contact bonding manner comprises a hydrogen bonding manner. The delamination method of the laminated structure according to claim 1, further comprising: tensioning the first flexible structure by the first jig and inserting the first carrier and one side of the first substrate During the process between a surface and the second surface, a separate liquid is sprayed from the edge of the first carrier and the edge of the first substrate. The delamination method of the laminated structure of claim 1, wherein the laminated structure further comprises a second carrier and a second substrate joined to each other, wherein the second carrier has a third surface, the first The second substrate has a fourth surface, the third surface and the fourth surface are in contact with each other, and the first substrate and the two substrates are located between the first carrier and the second carrier. The delamination method of the laminated structure according to claim 9, wherein the separator further comprises a second jig and a second soft structure, and the two ends of the second flexible structure are respectively associated with the second jig The delamination method of the laminated structure further includes: tightening the second flexible structure by the second jig and inserting the third surface and the first surface from the side of the second carrier and the second substrate Between the four surfaces such that the third surface and the fourth surface are not joined to each other; and prior to the step of lifting the first flexible structure upward by the first jig to lift the first substrate, The second jig lifts the second carrier upward to lift the second carrier to separate the second carrier from the second substrate. The delamination method of the laminated structure according to claim 10, wherein the second flexible structure comprises a plurality of flexible wires disposed at intervals on the second jig. The delamination method of the laminate structure of claim 10, wherein the second flexible structure comprises a flexible sheet. The delamination method of the laminated structure according to claim 10, wherein the laminated structure further comprises an element layer disposed between the first substrate and the second substrate.