TW200842014A - Apparatus and method for separating and transporting substrates - Google Patents

Abstract

The invention relates in particular to the separation and transportation of a disc shaped substrate (102; 202) such as e.g. a solar wafer. The invention is characterized by the fact that separations take place within a fluid, and that adhesion forces resulting from a thin fluid film develop between a gripper (108; 208) and the substrate to be separated (102; 202) that enable adherance to the gripper (108; 208). Through unloading perpendicular to the feed direction (105; 205) or particularly in parallel to the planar design of the substrates (102; 202), a very gentle and efficient separation of disc shaped substrates (102; 202) is possible with a short cycle time.

Description

200842014 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a sheet for isolating the body into a sheet. For isolation, == set: these bases are used to connect to _ become the base stack / hai set 仃 & The reclaiming equipment implements the isolation and handling process. The invention is a method of the invention relating to the species _ and (iv) substrates. Home Edition® Cares [Prior Art] "Bases" are sheet or plate and are usually rectangular. The ore is obtained from the base block, and the "corner" is a rectangular, circular or beveled shape. "Basic stacking" defines the upper and lower stacking or its _. The flying sub-row or the rear of the plurality 2. According to the invention, the stack in which the surface of the substrate is horizontal is called the flat-bottomed flat of the upper and lower flats. Stacking; if the surface of the substrate is vertical, this X is stacked in a "" vertical stack of the substrates side by side. The individual substrates have been separated from the holding members required for the sawing process and are freely and independently of each other. H Individual substrates are usually adhered to their surfaces due to the U-cut process. For the further processing, it is usually necessary to separate the substrates thus stacked. This means that the substrate provided at the end of the g-aligned substrate stack should be removed from the substrate by means of a device and transferred to further processing. - The "stacking direction" of the substrate in the stack of substrates is determined by the position of the substrate to be isolated. Individual substrates are oriented such that they are generally sturdy and their surfaces are connected to each other. I27488.doc 200842014 In the special case where the surface of the substrate is precisely and completely oriented, the stack = exactly corresponds to the direction of the normal to the surface of the substrate, in the middle, the forward direction is the bottom to be isolated - the end of the stack of the substrate . If the substrate is positioned to the right of the "cum vertical" substrate stack arranged in the carrier, the stack direction is therefore directed to the right in the direction of the arrow. 'Stacked "feed direction" generally corresponds to the stacking direction.

"Stacking start end" means the end of the substrate stack where the next substrate to be isolated is located = that is, the end pointing to the feeding direction. However, if they are collectively referred to as the end of the stacking, this cannot be said to mean that the stacking start or stacking A substantially vertical or vertically positioned substrate stack is provided in the carrier device, wherein one of the edges of each substrate is supported on the carrier device, for example, sawing and/or removing the bond. After the agent (usually used to fix the uncut initial substrate to the holding plate), the carrying device picks up the substrate stack and transports it to the picking device, and the isolation will be carried out at the picking device. The preferred design is such that the individual substrates are stacked as a unitary body, that is, the individual substrates are generally erected adjacent to each other or to the front and rear. If necessary, the carrier device can allow or force the substrates that are in adjoining contact with each other to be inclined from the original stacking direction, thereby A constructive predetermined "inclination angle" of the matrix relative to the original stacking direction is produced, which in the context of the present invention is referred to as alpha. This angle is the angle between the normal to the surface of the substrate and the feed direction, wherein the surface normal to the surface of the substrate in the feed direction is selected to be more than -90. With +90. The angle of inclination between. A positive angle indicates that the base is tilted backwards (opposite to the feed direction); a negative angle indicates that the base is tilted forward (on feed side 127488.doc 200842014 up). The preferred angle of inclination is +5. To +35. Especially preferred is an angle of +15. To +20.

- According to the present invention, "adhesion" means a force acting between two surfaces and thus waiting for the two surfaces to approach each other. Since the adhesive force of the present invention is generated in the fluid '0' it is necessary to reduce the liquid volume between the two surfaces', as this can be achieved by displacement and/or suction. In order to achieve the gentlest treatment of the substrate of the present invention, it is only necessary to reduce the volume to the extent that there is a fluid film or a liquid film between the surfaces. "Reclaiming Equipment" is used to isolate the substrate and transport the substrate away from the substrate stack. Here, the take-up device picks up the substrate at one end of the stack of substrates (e. g., using a suction device), separating the substrate from the stack and thus isolating it, and feeding the substrate to a subsequent processing or handling process. The reclaiming device is used for dislocating the substrate to be isolated from the I-stack, thereby achieving "reclaiming" in a plurality of crucibles. On the one hand, the reclaiming can be performed in the stacking direction, that is, the reclaiming device picks up The substrate is to be isolated and the substrate is pulled apart in the stacking direction and parallel to the planar shape of the subsequent substrate such that tension or compressive forces are generated between the substrate to be separated and the subsequent substrate due to the existing adhesion. The substrate can be removed by displacement relative to the subsequent substrate such that only shear forces are generated between the two substrates. In this case, preferably in a direction in which the plane of the substrate extends, substantially perpendicular to the plane of the carrier device Moving up or removing the substrate to be isolated. Depending on the direction of the take-up, different forces having different magnitudes act on the substrate to be isolated and the substrate still in the stack, whereby these forces act especially on the being taken On the substrate behind the substrate. 127488.doc 200842014 For the isolation of the substrate stack, the stack and the carrying device should be placed in the fluid. The fluid here should be understood to mean the medium to be liquid. Flow: provided with a "flow-through device" which allows the fluid to flow through the substrate stack from the side and/or from below or above, respectively. This is done in the following way: to achieve a flow, which is directed to the substrate stack and to the individual substrate. Dispersing" and maintaining the substrates at a certain distance from each other. This means that a fluid-filled gap is created between the individual substrates. According to a preferred embodiment, other suitable members can be used to support this spreading, for example specifically to spread out. Ultrasonic transducers in the region. This embodiment is particularly advantageous where the adhesion between the substrates in contact with each other is strong enough that the fluid can only enter between the substrates at a very slow rate. The device " is used to detect the position of the substrate to be isolated and/or the stack of the substrate. The electronic device with the appropriate configuration of the sensor on the right receives the signal equivalent to the substrate to be removed arranged in the proper position, then starts the reclaiming The operation of the device for isolation. ^ The isolation substrate does not abut the position detection device at the exact position, and a different signal is generated and must be interpreted accordingly. The location debt measuring device can also be used to move the substrate to be isolated to a desired location (which is necessary for signaling signals for the fetching device) and/or by using suitable constraints (eg, constraints) The substrate is held at the desired position. In one of the known substrate preparation methods (for example, a method for preparing a solar wafer or a semiconductor wafer), a crucible or a crucible is used (referred to herein as The base block) is sawn into a fragile thin wafer (referred to herein as a substrate). The typical thickness of the substrate produced in this manner is between about 127488.doc 200842014 3 00 μηι, and usually Preferably, they each have a side length of no more than 21 〇 mm. For sawing, the base block is usually glued to the holding member. The holding member is usually composed of a metal carrier, the metal carrier A glass plate serving as an intermediate carrier is mounted thereon, whereby the base block to be treated is glued to the glass plate. As an alternative and according to the prior art, the holding member can also be constructed from other materials.

In order to manufacture the above-mentioned substrate, the base block must be completely sawn into a sheet shape, so that the saw itself extends beyond the base block into the glass sheet. After sawing, an edge of the substrate thus produced is still adhered to the glass sheet by adhesive bonding. After the base block is completely isolated into individual substrates, a comb-like member is formed. The pre-cleaning of the self-sustaining member prior to the separation of the individual substrates of the sheet & geometry is now typically performed. In order to carry out the sawing process, a medium is required which mainly comprises ethylene glycol and, if necessary, other chemical additives as well as release agents (for example, niobium carbide particles). This medium is referred to as a "slurry" and is used to carry out the sawing process. Under normal conditions, there is always a certain amount of slurry remaining between individual sawn substrates. In the case of damage, 'the slurry will become a paste during or after the treatment, and the mouth will mix with the particles from the base block, the abrasive grains and the release agent used in the sawing process, or because Certain components of the mixture react with each other. Due to its consistency, the slurry adheres to the surface of the wafer. Although the base block is normally pre-cleaned after cutting, in most cases the residue of the mixture is still found between the substrates. The method and apparatus for forming a substrate are disclosed in WO 01/28745 A1 for use in separating sheets 127488.doc 200842014 in which the 'separation' is carried out in a dry environment (i.e., outside the tank). The substrate can be wetted by the nozzle only, and the human device reduces the separation substrate by the suction device (for example, generating a gas vacuum by the true twist line), whereby the substrate is self-propelled by the vibration movement of the device. The holding members are separated. The vibrating movement can be performed in different directions. The substrate to be isolated is gripped by means of a suction device arranged above the surface of the substrate and fixed to the device. To release the substrate, a specific gas overpressure must be created inside the suction device to remove the separated substrate from the device again. A method and apparatus for separating a sheet-like substrate, such as a particular wafer, is disclosed in DE 199 00 671 A1. It is proposed that the precisely oriented fluid jets will still adhere to each other after the metallizing process and that the sides of the retaining members are still held at a distance from each other. The wedge material is prepared to isolate the substrate to be separated from the holding member. At the same time, the isolated substrate is removed from the holding member by the gripping arm device having the suction member. A device for placing a wafer obtained by ore cutting a bulk block on a storage element is disclosed in 〇71 T2. A disposal apparatus is proposed which allows gripping a base having a circular or square cross section and transferring it to the support article. During this process, several substrates are picked at the same time and transferred to the placement area for housing the isolated substrate. A device for separating individual, thin, sheet-like substrates is disclosed in DE 199 04 834 A1. The base block with the already sawed base is located in the fluid-filled reservoir 9 compared to the prior art, the retaining member is vertically disposed with the base still fixed to the retaining member, thereby arranging the substrate to be separated parallel to the fluid surface The shaped device separates the substrate to be separated from the glass plate by 127488.doc 11 200842014. A conveyor belt disposed near the substrate is used to carry the separated floats. The propulsion device ensures that the holding members are always in the same position and are horizontally moved to separate the respective substrates. The other side of the conveyor belt is provided with a device for automatically inserting the isolated substrate into the holder. The purpose of the separation is to stack the sheet-like substrates that are isolated from each other after the substrate is removed from the holding member, and insert it into the predetermined device (4) to place the upper and lower thieves. EP 762 762 483 A1 also discloses a device which is capable of isolating a planar substrate. The isolated substrates are provided in the carrying device and they are temporarily in contact with each other in their planes. In order to isolate the substrate and transfer it into the container, the substrate is transported away from the stack using a pusher (and, if necessary, by means of a roller and/or a fluid jet), wherein the substrate must be in a horizontal position (ie in a flat position) . According to the foregoing, the substrate is arranged in the form of a "flat-flat" body stack placed above and below. As an alternative, this document discloses the suction grip by using a suction gripper. The device must be supplied with a gas vacuum throughout the handling and handling process and in direct contact with the substrate, ie, there is no protective fluid film between the gripper and the surface of the substrate. However, as far as possible in accordance with this technique Soft individual substrate isolation is difficult to achieve and has a number of disadvantages. If manual operation is required, isolation must be achieved by moving, but such movement requires complex equipment. However, due to the extremely fragile thin plate of the base system The matrix, and thus such substrates, cannot be picked directly by the usual gripper system. To this end, an extremely precise and sensitive device must be provided. Therefore, the apparatus disclosed in the prior art generally uses a suction device to hold 127488. .doc -12- 200842014 Individual substrates. Immediately after the suction device has moved to the plane of the substrate to be isolated, the vacuum pump is used to pump the device to the substrate to be isolated. A gas vacuum is created to make it possible for the substrate to adhere to the disposal equipment. However, care must be taken here because the substrate to be isolated will break due to excessively high pressure. It must be adjusted between at least i mbar between the two surfaces. Compared with the vacuum or low pressure method, the adhesive force of the present invention is achieved by a low pressure while maintaining a fluid film or a liquid film, which is much weaker than vacuum and is

〇·3 bar and 0.5 bar, and preferably about 〇·4 bar 〇 In this process, another key point arises from the fact that it must be close to the respective substrate, that is, the disposal equipment must be in contact with each other. Matrix. Since the substrate must not be pushed away by the device under any circumstances, precise positioning is required. However, this is difficult because, on the one hand, the relative movement of the holding member is provided to position the substrate to be isolated in the region of the holding member. Therefore, the holding member itself is provided with a corresponding freedom. Therefore, it is possible to create tolerances that may damage the substrate to be isolated. On the other hand, the movements are usually carried out in the fluid, so that the risk of the matrix being subjected to dislocation due to the flow pressure in the direction of the substrate, in particular, due to the individual movement of the device (4), or even the manual implementation of the fracture-like substrate, lies in Extremely fragile sheets, in particular, rupture with increased adhesion. SUMMARY OF THE INVENTION It is an object of the present invention to provide a device and a thin, frangible stack substrate that is removed without damage. The basic idea of the present invention is to provide a base unit having a base body that is arranged in the direction of (4) in the direction of (4), and a reclaiming device: The reclaiming device is directed away from the substrate stack, the individual substrates of the stacking start end of the substrate stack, the substrate is slightly removed from the lower substrate, and then the substrate is guided parallel to the plane of the substrate. The substrate is stacked from the substrate and further away from the carrier device. The process is based on the fact that the flow generated by the nozzle flows through the stack disposed in the fluid, thereby allowing the substrate, especially disposed at the free end of the substrate stack, to疋 distance. In this way, the bases can be prevented from sticking to each other. On the same day, the flow also forms a fluid cushion between the individual substrates, so that the shock absorbing should act on the substrate to be isolated during the sinning reclaiming device, and Avoid the rupture of the base. The gripping arm of the reclaiming device is grasped by the gripper in the following manner: (4) The base body: the fluid existing between the gripper and the base body is provided in a large distance. It The holes or perforations are sucked away and/or squeezed out due to the grasp of "/, the sin of one body" to produce a second force when forming a sufficiently small gap, without any further suction and/or squeezing Get: Keep, so that the gripper causes a plane adhesion on the substrate. Therefore, the solution to this task is to provide a device such as a request item and/or a method such as claim 16. The basic advantage of this I month is that the substrate can be completely and automatically separated in the cycle of the speed determination without breaking the substrate. The basic idea of this solution is that the substrate, which is aligned substantially perpendicular to the f-feed direction but slightly inclined at an angle, is spread out in the substrate stack by the flow-through device. Preferably, the flow generated by the fluid nozzle passes between the first five to the first ten substrates, thereby maintaining a certain distance between the individual substrates, and forming a so-called fluid damping between the individual bodies 127488.doc -14-200842014 pad. If a force acts on the substrate opposite to the stacking direction or the feeding direction, the individual substrates will not be further compressed during the process according to the invention; in fact, a reaction force will be generated on the entire surface of the substrate, the reaction force Within certain limits, it is still possible to determine, in particular, the residual mobility of the substrate at the beginning of the stack. This reaction force is combined with the • residual mobility to enable the gripper of the reclaiming device to push the substrate to be isolated. If there is no indirect shock absorption by means of a fluid damping pad located between the diffused substrates, the substrate is highly susceptible to cracking. With regard to the ugly vertical stacking, the grippers are preferably inserted from above (i.e., extending parallel to the longitudinal direction of the respective substrates, and thus substantially perpendicular to the stacking direction), and Ik is then guided to the substrate to be isolated. According to a preferred embodiment, the bore or perforation preferably present in the gripper is used to draw fluid between the gripper and the substrate to be isolated. To this end, the target must be actively applied with a low pressure, which can be generated internally or externally by a dynamic method (for example, a pump), a static method (low pressure tank) or a method of production. If the gripper is in direct contact with the substrate, so that there is only a very thin fluid film (a few nanometers to 50 micrometers) between the grasper and the substrate, then the adhesion will occur in the narrow gap. Since then, this Allow the substrate, 1 gripper to automatically adhere or stick. No need to actively maintain low pressure. According to an alternative embodiment, the desired adhesion can also be achieved by extruding the fluid between the surfaces of the surfaces, wherein a combination of such embodiments is also contemplated by the present invention. Therefore, the adhesion is significantly greater than the adhesion to the subsequent substrate. Therefore, the grasping is parallel to the surface direction of the subsequent substrate to realize the material to be separated. In this private, at most only a small shear force acts on the substrate to be isolated, thereby 127488.doc 15 200842014

Significantly reduce the rate of breakage. Can avoid tension or compressive forces. Given a sufficiently large gauge, the contact force is greater than the force generated by the temporary low pressure. It is possible to take high frequency from the substrate = stack. In addition, especially when the base body is located outside the base of the base two piles, even if the low pressure is not actively applied, the magnitude of the adhesion force=allows the base body to adhere to the AA depending on the geometric design of the gripper and the weight of the base body. The relationship between the diameter and number of drilled holes in the surface of the gripper, the size of the gripper surface, and the amount of pressure required to extract the fluid and the amount of attraction to the substrate caused by suction must be considered. The soil gripper itself is preferably configured in such a way that it consists of only one cymbal. According to an alternative embodiment, the gripper can be a rod-shaped gripper, a finger gripper (10) gripper 11, a gripper, (10), Triangle gripper and towards the grip! A sharp-pointed gripper (v-shaped gripper) is formed at the tip of the turbulent direction or has a two-* design. The gripper can be constructed as a generally rigid gripper, or it can be constructed as: -17 π. A particularly preferred embodiment is an embodiment that exhibits low flow resistance on the gripper moving side and/or produces a vortex that is as small as possible during the removal of the substrate from the substrate stack and during the isolation action with the roll. The grip of the shoulder embodiment additionally has the following advantages: the use of & theft for the different forms of the base problem, and the principle of grasping the substrate to be isolated can even be properly applied to the already broken f and no longer have the f rule The base of the size. Another advantage lies in the following anodic pastes: 环益山, 广争贝, hunting, picking up different forms of the substrate by a gripper embodiment. The reason for this is the fact that the suction effect is not achieved, and the adhesion of the contact surface between the gripper and the substrate in a planar manner is achieved. According to another embodiment, the gripper can also be designed as a flexible tape made of a suitable material (e.g., 127488.doc -16 - 200842014, such as 'plastic), wherein the flexible tape is preferably applied as follows. The juice can also be passed through by the fluid so that the fluid can be both inhaled and discharged. For this purpose, a drilled form and an opening for the porous base can be provided. The low pressure required for suction can be lifted by a generally fixed device. # ' The device is placed at the end of the stack and attached at the beginning of the gripping process. • The free back of the flexible band and the fluid is sucked through the opening until it is flexible The front side of the sexual band and the substrate to be grasped are sufficiently close to each other. After the adhesive force is generated as described above, the flexible tape can carry the substrate to which the liquid film is adhered, where the fluid film is maintained at all times. According to the invention, the low pressure is produced at the beginning of the reclaiming phase. Although this low pressure only needs to be maintained until the fluid film is obtained between the substrate and the gripper contact area, the low pressure can be maintained until the substrate is stacked on the handling equipment. The carrier device itself is designed in such a way that it can accommodate at least one substrate stack consisting of a plurality of substrates or wafers, respectively. Furthermore, the carrying device has means for ensuring that the individual substrates exhibit a constant inclination, wherein the inclination causes the inclination angle α (the angle between the feeding direction of the stack and the surface normal to the feeding direction to be more directed) than the twist , that is, a positive angle. In the case of a stacked stack, this means that the edge of the substrate against the carrying device is placed in front of its upper edge in the feed direction. The advantage of this situation is that the gripper 'I is parallel to this oriented insertion fluid and also removes the base ° on this plane. Thereby, it is also possible to avoid the vertical stacking of the carrying device tilting forward during the transfer in the fluid, thereby losing its orientation.曰° Therefore, the carrying device can be moved in at least one direction. Preferably, the carrying device is movable in the feeding direction; specifically, # moves to the base: 127488.doc -17- 200842014 The first substrate to be isolated reaches the position of the debt measuring device. The individual substrate thicknesses are then constant on the stack; in particular, until the stack is taken, the substrate finally reaches the reclaiming device. As an alternative, the device can be designed to be fixed. In this case, it is necessary to provide a suitable member for moving the substrate (4) on the carrying device in the feeding direction. As an alternative or in addition, the gripping device and the position-making device can be arranged with a greater degree of freedom so that they can be moved in the direction opposite the feeding direction towards the starting end of the stack. The position detecting device is a device for detecting the position of the substrate to be isolated. To this end, the position detecting device is provided to include a pin that is oriented toward the stacking direction of the substrate. By shortening the distance between the position detecting device and the substrate stack, the starting end of the base stack® is adjusted until the substrate to be isolated is pressed against the provided pin. The additional sensor element (i.e., the sensor element in the form of a touch sensor) emits a corresponding signal by which the gripper is now preferably inserted between the press pins and separated and transported to be isolated The base. In the case where the substrate stack includes a substrate having a thickness greater than the average thickness set for adjusting the pressing member and thus greater than the resulting step size, the position is detected by the position picking device so that the substrate stack is correspondingly in the feeding direction Move up until the next substrate to be isolated contacts the pressing element. Alternatively or additionally, the position detecting device may further comprise a goniometer in such a way that the exact position of the substrate to be isolated can be determined and used as an amount for verifying the quality of the substrate to be isolated. 127488.doc -18- 200842014 Therefore, the advantage of the device is that the interaction between the carrying device, the reclaiming device, the flow-through device and the position detecting device generates a device which is particularly suitable for substrate isolation and handling, The various processing steps can be performed by the apparatus automatically and at a very low fracture rate less than the prior art. This advantage is supported by fluid cushions based on flow-through equipment.

Furthermore, the predetermined removal of the substrate of the reclaiming device itself and thus perpendicular to the stacking direction has the effect that no or only weak tension is used for the substrate to be isolated. Advantageously, the reclaiming device is designed to be removed parallel to the respective base planes so that the smallest possible tension, compressive or bending forces act on the substrate. The gripper can be in the form of a single gripper or in the form of a strap. The step-by-step handling is preferably carried out in a fluid. However, it is also conceivable to leave the gripper out of the fluid, and the gripping n is stacked in such a way that it is attached to the base of the carrying member (for example a conveyor belt) by means of an adhesive force such that the fluid is passed through the bore provided to the gripper. The substrate is discharged in a direction such that the planar substrate can be easily detached from the gripper without the action of external tension and/or compressive forces. ' This loop can be repeated indefinitely. One of the basic advantages of another embodiment of the present invention is that the gripper can exhibit certain tolerances as the gripper approaches the base. The gripper does not need to be accurately stopped in front of the substrate to be isolated and positioned there. In fact, it is advantageous to use the shock absorption caused by the configuration of the base body in the flow raft and to the flow-through device, which is advantageous in that the gripper moves toward the base stack by a small force against the feeding direction by a small force, Thereby establishing a planar contact with the substrate to be isolated, '127488.doc -19- 200842014 The substrate to be isolated can be elastically supported "with/ behind the fluid cushion. The further advantage of the invention relates to the provision of a device, The := uses the adhesion between the gripper and the substrate, so that each individual matrix can be removed simply in the case of cracking, independent of the size and external shape of the 臬I# 士 ft body. Even due to the partial purification of the material in the fluid: = and transfer it to a specific injury (for example, handling equipment). Retrieving the sigh of the alternative - alternative embodiments are related to the provisions of the production The device 'is thus able to compensate for tolerances between the positioning = virtual standby isolation matrix arranged relative to the plane of the receiving surface. The grip II, the treatment device and/or the connection between the two components are designed to be flexible And therefore deformable According to a particularly preferred embodiment, in order to increase the cycle time of the isolation, other components for the self-reclaiming device to receive the isolated substrate are provided. During the time span in which the substrate is stacked on the conveyor by the other components, the reclaiming device may have Grasping other substrates from the substrate stack. As an alternative or in addition, two substantially identical reclaiming devices for heterogeneous switching. [Embodiment] Figure i [af] schematically depicts the device of the invention 1〇1 and the method of the invention The basic principle of the device 101 is suitable for isolating and transporting the sheet-like substrate 1〇2. In the depicted embodiment, the substrate 102 is disposed in the base stack 1〇3, wherein the 'base stack 1G3 is supported on the carrying device 1 ( 4) The individual substrates 1〇2 have been separated from the holding member. Preferably, the surface of the individual substrates 1〇2 is more inclined toward the feeding direction by the surface normal to the feeding direction (pour 127488.doc • 20· 200842014 corner) (depicted in Fig. 2). When the device is placed in a fluid, this tilt prevents the individual substrates 102 from floating or unintentionally leaving the bearing in the case of the vertical matrix stack 103 In addition, the individual substrates 102 can be more easily grasped by the take-up device 107, which will be described in more detail below. • The individual planar shaped substrates 1〇2 are arranged side by side in such a way that their surfaces contact each other. Adhesive forces act on these Between the substrates, which are caused by very small gaps between the substrates and, for example, possible contaminants from previous sawing steps. Due to this arrangement, the substrate 102 determines a defined feed direction of 1〇5. In the drawings depicted, the substrates are schematically shown, wherein the schematic representation of the block diagram means that the substrates in this region are intimately connected to each other. The substrates are dispersed in other regions (ie, the reclaiming region). And the gap is displayed. The adhesion between the diffused substrates is preferably zero. Furthermore, according to the invention, a pick-up device 107 designed as a gripper is also provided. It is shown schematically in the exemplary embodiment depicted herein, and primarily shows the gripper 108. At the gripper 108, a treatment device φ (described in Figure 1 [A]) is provided which allows the gripper 108 to move or rotate in different directions. Preferably, the gripper 108 is rotatable about the axis in the direction of the arrow 110 and in the direction of the arrow 112. Further, a handling device 113 is provided. The handling device 113 is constructed of a conveyor belt 114' that drives the conveyor belt 114 in the direction of the arrow 116 by the shaft 115. Preferably, at least some of the components of the device 101 (i.e., the load bearing device, the substrate stack 103) and the components of the picking device 107 are provided for being disposed within the fluid. This allows the substrate to be made between the entire axis, at least until it is stacked on the handling device. The remaining 127488.doc 21 200842014 components and handling equipment 113 may also be disposed within the fluid, as an alternative, wherein the handling apparatus may also have its own components for wetting the substrate. In order to improve the isolation of the respective substrates 102, at least one flow-through device 117 having a fluid nozzle 118 is provided, by which the fluid can be injected into the gap 119, wherein the gap 119 is located in the substrate to be isolated. 2 is between the next substrate 102. Preferably, the respective gaps 119 are maintained as fluid flows out of the fluid nozzles 118 into the gaps 119. Advantageously, a gap 119 between the two substrates 102 is formed in a defined area in which a plurality of substrates 1〇2 are arranged, and in order to avoid fluid flow, the individual substrates 1〇2 leave the carrier device 1〇4, providing a pressing element 122, In the exemplary embodiment depicted in the figures, the hold down element 122 primarily includes a press pin 123. When the substrate stack is moved in the feeding direction, the substrate to be isolated is pressed against the pressing member 122, so that the reaction force is applied to the force generated by the fluid flowing into the gap 119. So-called fluid pads are formed in the gap 119 by which the individual substrates 102 contacting the respective fluid pads are maintained at a distance from one another. In addition, these fluid pads have the following characteristics: the damping effect is due to the reaction force exerted by the pressing member 122 and also due to the contact of the gripper 1〇8 with the substrate 102 to be isolated. In Fig. 1 [B], the gripper ι 8 of the device 1 已 7 has been arranged parallel to the surface of the base 102. The gripper 108 moves in parallel in the direction of the arrow u and moves towards the surface of the substrate 102 in other subsequent steps; specifically, until it contacts the substrate 102 to be isolated (as depicted in Figure 1 [c]). ). Due to the contact pressure generated when the gripper 108 contacts the substrate 1 〇 2, the respective gaps between the two substrates 127488.doc -22· 200842014 102 are reduced. The damping effect can be produced due to the configuration of the fluid within the gap 119 between the individual substrates to be isolated. In this figure UC], the drilling in the gripper 1〇8 (not depicted in the drawings) is started by generating a low pressure as described above. Due to this low pressure, the gripper 1 〇 8 draws the substrate 102 to be isolated until the gap between the base 102 and the gripper 1 大幅 8 is greatly reduced and an adhesive force is generated between the contact surfaces. The dispersion of the substrate is supported by the fluid ejected from the fluid nozzle 118. According to Fig. 1 [D], the gripper 108 is moved together with the base 1 〇 2 adhered thereto until the gripper 1 〇 8 can stack the base 1 〇 2 on the transporting device ΐ 3 . During this process, the entirety of the base body and the gripper must be moved a short distance from the feed direction 105 so that the press pin 123 does not contact the surface of the substrate during subsequent take-up operations. Alternatively, to release the crystal, the positional debt measuring device can also be moved a short distance in the feed direction. According to this statement, these two movements can also be combined. According to Fig. 1 [£], the base body 102 is laid flat on the conveyor belt 114. To isolate the next substrate, the gripper 108 has to be moved again to the position shown in Figure 1 [8]. - The amount of viscous force generated during the suction of the substrate 1 〇 2 to be treated by suction is determined to be sufficient to carry the substrate 102 grasped by the gripper 108 in the fluid. In Figures 2 and 3, the device 2〇 i is schematically depicted, which shows another development of the basic principle compared to Figure i. The device 201 is particularly suitable for isolating and transporting the sheet-like substrate 202. In the exemplary embodiment depicted herein, the substrate 2〇2 is disposed within the substrate stack 203, wherein the substrate stack 2〇3 is supported in the carrier device (10), 127488.doc -23· 200842014 and the individual substrates 202 have Separated from the holding member. Preferably, the individual substrates 202 are disposed obliquely with respect to each other with an inclination angle α (Fig. 2) which is an angle formed between the feeding direction 2〇5 and the surface normal of the surface of the substrate which is directed more toward the feeding direction. By virtue of this tilting, in the event that the device is placed in the fluid and the substrate stack 203 is in the upright position, the individual substrates 202 can be prevented from floating and unintentionally leaving the carrier device 2〇4. The individual substrates 202 are arranged in such a manner that their surfaces are in contact with each other. Therefore, the individual substrates form a sequence which can determine the specified feed direction 2〇5. In accordance with the present invention, there is further provided a gripping device 207 designed as a gripper that is illustratively depicted in an exemplary embodiment that is not shown here, and that primarily displays the gripper 208. At the gripper 208, a treatment device 209 is provided that allows the gripper 2〇8 to move and rotate in different directions (arrow directions 210, 211, 212). The gripper 2〇8 together with the treatment device 2〇9 forms a gripping arm. Further, a handling device 213 is provided. This handling device 213 is comprised of a conveyor belt 214 that is driven by the shaft 115 in the direction of the arrow 216. In the preferred embodiment, at least some of the components of the overall device 201 (i.e., the carrier 204, the substrate stack 203) and the components of the picking device 207 are disposed within the fluid. This allows the substrate to be dried during the entire process, at least until it is stacked on the transport equipment. Optionally, the remaining components of the take-up device 207 and the handling device 213 may be disposed within the fluid, wherein, alternatively, the handling device may have its own components for wetting the substrate. In addition, in order to improve the isolation of the respective substrates 220, at least one flow device 217 having a fluid nozzle 21$ is disposed near the beginning of the stack, and the fluid can be fluidized by the 127488, doc-24-200842014 flow device 217 The gap 219 is formed in the gap 219, wherein the gap 219 is formed between the substrate 202 to be isolated and the next substrate 202. The fluid nozzles 218 are specifically disposed in the area of the substrate stack 203 to be dispersed. Typically, this applies at least to the first four to the first nine substrates 202 disposed behind the substrate 202 being isolated. A plurality of gaps 219 are thereby produced, wherein each gap 219 is limited to the right and left sides of the base 202. A fluid pad having shock absorbing properties is formed in the gap 219. Further, in FIGS. 2 and 3, the position detecting device 220 is depicted. The position detecting device 22 is mainly composed of another treating device 221 and a pressing member 222 disposed at one of the free ends of the treating device 221. The pressing member 222 further includes a pressing pin 223 which contacts the surface of each of the base bodies 202 at a predetermined position according to FIG. 2 and FIG. 3, respectively, or places the substrate in a predetermined position due to the contact, and holds the same. In the prescribed device. The other disposal equipment 221 is fulfiled in such a manner as to be movable in the direction of the arrow 230 and in the direction opposite to the direction of the arrow 230. Furthermore, the position detecting device 220 is equipped with an inductor element 224. The function of the sensor element 224 is to detect whether there is a planar contact between the isolation substrate 202 and the compression element 222 and/or the pressure pin 223. 2 and 3 depict a particular embodiment of the inductor element 224. This sensor element 224 mechanically senses the presence of the substrate 202 to be isolated. Different locations detected by the proximity switch 229 can be provided for this purpose. The sensor element 224 has a curved rod assembly that is supported at the hinge 225 for rotation in the direction of the arrow 226 and in the direction opposite the direction of the arrow 226. A free end 227 is used to support the surface of the substrate 202 to be inspected. The other end 228 is intended to be configured in the area of proximity switch 229 127488.doc -25- 200842014. If the substrate 202 is not detected at the free end 227, the sensor element 224 is returned to its original position. The free end m is disposed between the free ends of the press pins 223 via the 俨 line, and the other free end is such that the distance between the free end 228 and the proximity switch is nearly zero. The free end 227 is subjected to pressure, the sensor element 224 is rotated, and the distance between the free end 228 and the proximity switch is increased. If the proximity switch reaches the previously calibrated position, it is automatically measurable whether or not the base 2〇2 is positioned to contact the free end of the press pin 223. If the free end 227 is not under pressure, the sensor element 224 is moved back to its original position. In an alternative embodiment of the sensor element 224, which is not described in greater detail, the presence and location of the substrate can also be detected by means of other suitable devices (for example, optical or acoustic proximity switches), wherein negligible if necessary Mechanical transmission of contact information via a curved bar and hinge 225. The pressing member 222 is preferably disposed at an angle to the treatment device 221 that corresponds to the angle of inclination a. Therefore, the individual press pins 223 preferably have the same length. Alternatively, the compression element 222 can also be provided to be disposed perpendicular to the treatment device 221, and the compression pin 223 has a different length such that at the depicted position, the free end of the compression pin 223 always contacts the surface of the base 2〇2 . The position detecting device 220 operates on the principle that the substrate stack 2〇3 moves in the feeding direction 205, more specifically, until the surface of the substrate to be isolated 2〇2 contacts the free end of the pressing pin 223 of the pressing device 222. . When the substrate 202 to be isolated is placed in position, the sensor element 224 moves in one of the arrow directions 226 and the proximity switch 229 detects the correct position. If the position of the substrate 202 to be isolated is correctly positioned, the take-up device 2〇7 can be inserted into the gap formed by the press pin 223 and grasp the substrate 2〇2 to be isolated. The individual processing steps are described in more detail below with reference to Figures 4-9. In Fig. 4A and Fig. 4B, the so-called charging situation of the device 2〇1 of the present invention is depicted. The carrier device 204 is ready to receive a stack of substrates not detailed herein. The desired inclination of the substrate stack by the respective members has been previously set. The take-up device 207 and the position detecting device 220 are in the home position and are movable in the arrow direction 210 and the arrow direction 230, respectively. The sensor element 224 disposed at the pinch element 222 is also in the home position and the base of the contact pin 223 is not detected. The gripper 208 of the take-up device 207 is also in the initial position so that it can be inserted between the press pins 223 of the pressing members 222. The handling device 2 13 is ready to receive the substrate. The fluid nozzle 218 of the flow through device 2丨7 is still closed. The carrier device 204 of Figure 5A and Figure 5 is now equipped with a base stack 203. The carrier device 2〇4 or the substrate stack 203 is moved in the feed direction 2〇5, i.e., until the position detecting device 220 positioned by the movement in the arrow direction 230 reaches the prescribed position. At this position, the pressing member 222 and its press pin 223 contact the surface of the substrate 202 to be isolated. To achieve orientation of the substrate 202 in accordance with a position and shape, the fluid nozzles 218 of the flow-through device 217 direct fluid toward the substrate stack 203 such that at least a portion of the matrix stack 203 is spread apart and a voided gap 219 is created. Due to the compression of the pressing member 222, the individual substrates 202 can be prevented from further spreading. This can also cause the substrate 202 to stay on the carrier device 204. If the substrate 202 to be isolated is brought into position by spreading 127488.doc -27- 200842014, the sensor element 224 detects the precise position. If the precise position is not reached, the position detecting device 22 continues to move in the boring direction 230 and/or causes the base stack 203 to spread further. If neither of the actions causes the sensor element 224 to issue a corresponding signal for releasing the reclaiming device 207, an error message is issued. In Figures 6A and 6B, fluid nozzle 218 continues to direct fluid into gap 219, creating a so-called fluid pad in gap 219. The fluid pad is used to achieve an appropriate damping effect between individual substrates. The release is now due to the desired position of the substrate 2〇2, since the inductor element 224 is rotated in such a manner that the proximity switch 229 has been activated. The reclaiming device 207 is now moved in the direction of the arrow 210 in such a manner that the gripper 208 extends into the space between the press pins 223 of the pressing elements 222 of the position detecting device 22 and reaches the contact body 2 to be isolated. The area of the surface of the 2 is brought into contact with the surface of the substrate 202 by the rotation of the take-up slap 207 in the front direction 211. Due to the resulting adhesive force, the substrate can be moved in the opposite direction of the arrow 21 描绘 as depicted in Figures 7A and 7B, which are formed between the gripper 2 〇 8 and the surface of the substrate 2 〇 2 to be isolated. It is specifically enhanced by low pressure. Alternatively or additionally, the gripper can be rotated in the direction of the arrow 212 (Fig. 7A) until a planar contact is made with the surface of the substrate 2〇2. Thereby, the substrate to be isolated can be released, and the substrate to be isolated can be removed in the direction of the arrow 21A as shown in Figs. 7A and 7B for subsequent placement on the handling device 213. However, as shown in FIGS. 7A and 7B, in order to avoid surface damage of the substrate 2 to 2 to be isolated, the pressing member 222 is moved backward by a small distance, or the carrier having the substrate stack 203 of 127488.doc -28-200842014 is provided. Device 204 moves backwards a short distance back in the feed direction 205. The sensor element 224 is again rotated back to its starting position, and the proximity switch detects that the substrate 202 to be isolated is no longer in contact with the pin 223. Rotating the picking device 207 or its gripper 208 in the direction of the arrow 212, respectively, to stack the substrate 202 to be isolated in the time span of the handling device 213 or its conveyor belt 214 (Figs. 8A and 8B), having a substrate stack 203 The carrier device 204 is in turn moved in the feed direction 205 towards the position detecting device 220 until contact is made between the substrate 202 to be isolated and the pressing member 222 having the press pin 223. 9A and 9B depict the stacking of the substrate 202 by the take-up device 207. The base 2〇2 is stacked on the conveyor belt 214 of the handling equipment 213 and the substrate 202 is carried away in the direction of the arrow 216 by actuation at the shaft 215. During or after this process, the fluid is again directed by the flow-through device 217 or its fluid nozzle 218 into the gap 219 of the substrate stack 203, thereby dispersing the substrate stack until the substrate 202 and the position detecting device 220 are to be isolated. The pressing pin 223 of the pressing member 222 is in contact. This causes the sensor element 224 to generate a release signal for the picking device 207 to pick up the substrate 2〇2 to be isolated. In this way, the process is repeated at the desired frequency. Once the substrate 202 is absent within the substrate stack 203, the pinch element 222 or the sensor element 224 will detect the absence of the substrate 202 and issue an appropriate error message, respectively. The amount of adhesion generated during the suction of the substrate 2 〇 2 to be treated by suction is determined to be sufficient to carry the substrate 202 grasped by the gripper 2 〇 8 in the fluid. 127488.doc -29- 200842014 Illustrated. Of course, the sheet base made of 'plastics' has been treated with other materials (such as body) according to the invention. Brief Description of the Drawings j / Figure UA.F] is a schematic diagram of the inventive principle of the device of the present invention, in detail, a procedure for the isolation and handling process of the substrate to be isolated, and Figure 2 is an embodiment of the device of the present invention shown in Figure 1. Side view,

Figure 3 is a perspective view of the embodiment depicted in Figure 2; Figure 4 [A] is a side view of the first processing step of the apparatus of the present invention shown in Figure 2 [4] is the apparatus of the present invention shown in Figure 2 The perspective m of the first processing step, FIG. 5 [A] is a side view of the second processing step of the apparatus of the present invention shown in FIG. 2; FIG. 5 [B] is the second processing of the apparatus of the present invention shown in FIG. The perspective of the step 1SI · 圃, Fig. 6 [A] is a side view of the third processing step of the apparatus of the invention shown in Fig. 2; Fig. 6 [B] is the third processing step of the apparatus of the invention shown in Fig. 2. Figure 7 [A] is a side view of a fourth processing step of the apparatus of the present invention not shown in Figure 2; Figure 7 [B] is a perspective view of a fourth processing step of the apparatus of the present invention shown in Figure 2; .doc 200842014 Figure 8 [A] is a side view of a fifth processing step of the apparatus of the present invention shown in Figure 2, and Figure 8 [B] is a perspective view of a fifth processing step of the apparatus of the present invention shown in Figure 2; 9 [A] is a side view of the sixth processing step of the apparatus of the present invention shown in Fig. 2; and Fig. 9 [B] is a perspective view of the sixth processing step of the apparatus of the present invention shown in Fig. 2.

[Main component symbol description] 10b 201 device 102, 202 base 103, 203 base stack 104 > 204 carrying device 105, 205 feeding direction 107 - 207 reclaiming device 108, 208 gripper 110, 210 arrow direction 112, 212 Arrow direction 113, 213 handling equipment 114, 214 conveyor belt 115, 215 shaft 116-216 arrow direction 117, 217 flow-through device 118, 218 fluid nozzle 127488.doc -31 - 200842014

119, 219 Clearance 122 > 222 Pressing element 123, 223 Press pin 206 Drill hole 209 Disposal device 211 Arrow direction 220 Position detecting device 221 Additional handling device 224 Inductor element 225 Hinge 226 Arrow 227 Free end 228 Another free end 229 proximity switch 230 arrow direction α inclination 127488.doc -32-

Claims (1)

200842014 X. Patent application scope: 1. A device for isolating and transporting a sheet-like substrate, wherein the device mainly comprises the following component groups: - a carrier device (1〇4; 204) disposed in a first-class body, wherein The individual substrates (102; 202) are sequentially arranged in the feed direction (1〇5; 205) in the form of a matrix stack (103; 203), one for isolating and transporting at least one substrate (丨〇2; 202) a reclaiming device (107; 207), wherein the reclaiming device (107; 207) comprises a gripper (108; 208) having a grippable body (102) 202) transporting the substrate (102; 2〇2) away from the member of the carrying device (104; 204), a flow-through device for dispersing at least a portion of the substrate stack (1〇3; 203) (117; 217), and - a pressing member (122; 222) responsive to the diffused substrate (1〇2; 202). The device of claim 1, characterized in that the compacting The component (122; 222) includes a plurality of press locks (123; 223), and the press pins (123; 223) are pressed against the substrate to be isolated (102; 202) The surface. 3. The device of claim 1 or 2, characterized in that a position detecting device (220) is provided for detecting at least the device of the base to be isolated 4, such as the device of claim 1, characterized in that The gripper (1(10); 2〇8) is designed such that the removal of the substrate (10) to be isolated is performed perpendicularly or at least substantially perpendicular to the feed direction (105; 2〇5). 127488.doc 200842014 5. The device of claim 4, characterized by being in the plane of the substrate (10); 202). 9 thousand lights in the waiting room 6 · such as the device 1 or 4, straight out + 2 〇 8) and right „ - feature is that the gripper (1 〇 8; ~ has an opening through these Open 7. If the request item is called M or row (four) body. Grab the bracket ~ 八 is characterized by, in the top view, the grip state (108; 208W line shape ι , formed into a rod shape, a finger shape, a 0 shape, a u Shape, V-shape or have a flat shape. 8. The device 'is characterized in that the carrying device (10); 2〇4) can be used to make the substrate to be isolated 〇〇2; 9. The device of claim 8, wherein the inclination is selected by - as follows: such that the feed direction (10); 2G5) and the individual bases - 2, 2 〇 2) The angle between the normal to the surface of the substrate directed to the feed direction is a positive angle, thereby being equivalent to tilting one of the substrates backward. 10. According to the device of claim 1, i ^ ^ is a direct stipulation that the carrying device (1〇4; 2〇4) can move in at least one direction. The device of the moon long 1G is characterized in that the carrying device (104; 2〇4) and/or the base stack*(10); 2〇3) are movable towards the pressing member (m; 222). 12. The device of claim 1 wherein the carrier device (2〇4) and/or the 4 substrate stack (203) are movable toward the position detecting element (22〇). 13. The device of claim 1, further comprising a port (113, 213) 'the handling device (113; 213) is configured to have a substrate to be isolated (102488.doc 200842014) 202) above the substrate stack (103; 203). 14. The device of claim 3, wherein the position detecting device (220) is a sensor (222) for inspecting contact of a substrate (202). The device of claim 2, wherein the pressing member (122, 222) is configured in such a manner that the gripper (108; 208) can be positioned at the pressing member (122; 222). ) between the sales (123; 223). A method for using a device to disperse, isolate, and carry a sheet-like substrate. The 5 Haigua set mainly includes the following component groups: - a carrying device (1〇4; 2〇4) disposed in a first-class body, wherein the individual The base body (102; 202) is arranged in the form of a base stack (1〇3; 2〇3) in the feeding direction (1〇5; 2〇5), and is used for isolating and transporting at least one substrate (1〇) 2; 2〇2) reclaiming device (107, 207), wherein the reclaiming device (1〇7; 2〇7) comprises a grip (108; 208), the gripper (1〇8; 2〇8) having a member capable of grasping the substrate (102; 202) and transporting the substrate (1〇2; 2〇2) away from the carrying device (104; 204), one for stacking the substrate ( 1〇3; 2〇3) at least a portion of the diffused flow device (117; 217), and _ a pressing element (122; 222) that counteracts the diffused substrate (1〇2; 2〇2) Wherein the method comprises the steps of: a. moving along the substrate stack (1〇3; 2〇3) in the feed direction (1〇5; 2〇5) towards the pressing element (m; us) The carrying device 127488.doc 2008 42014 (104204), or moving the carrying device (104) having the base stack (1〇3; 2〇3) toward the pressing member (123; 223) in the feeding direction (1〇5; 2〇5) 204) in order to achieve a reclaiming position for the substrate to be isolated (102; 202), b. stacking the substrate by a flow-through device (117; 217) in a manner to create a gap (119; 219) At least one region of (103; 203) is separated, c. isolating the substrate by: - positioning the gripper (108; 208) to be nearly parallel to the substrate (102; 202) Graphic design, - establishing an adhesive contact between the substrate (102; 202) and the gripper (108; 2〇8), and • being perpendicular to the feed direction (1〇5; 205) or parallel to the The plane of the substrate (102; 202) is designed to remove the substrate (102; 202) within the fluid. 17. The method of claim 16, wherein the gap is created in the substrate stack (1〇3; 2〇3) by the scattering of the flow-through device (117, 217) (119; 219 And generating a fluid pad in the gaps (119; 219) due to the fluid flow of the flow through device (117; 217), the fluid pads being on the substrate to be isolated (102; 202) and the gripper (〖08; 208) A shock absorption effect is applied to the substrate to be isolated (102; 202) upon contact. 127488.doc