KR101434224B1 - Battery protection circuits and package of battery protection circuits module - Google Patents

Abstract

The present invention relates to a battery protection circuit capable of applying a stable voltage and a package of a battery protection circuit module, capable of controlling a precise current. The battery protection circuit module package comprises a pair of field effect transistor elements which has a drain in common and is composed of a first field effect transistor element and a second field effect transistor element; a protection integrated circuit element; and a boost integrated circuit element which is interposed between the pair of electric field transistors and the protection integrated circuit so as to be electrically connected and which applies a constant voltage to the gate of the first field effect transistor and the gate of the second field effect transistor; and an encapsulant which seals the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element.

Description

[0001] The present invention relates to a battery protection circuit and a battery protection circuit module package,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a battery protection circuit and a package of the battery protection circuit module, and more particularly, to a battery protection circuit capable of applying a stable voltage and a package of a battery protection circuit module capable of controlling a precise current.

Generally, batteries are used in mobile terminals such as mobile phones and PDAs. Lithium-ion batteries are the most widely used batteries in portable handsets, and they have overcharging and over-currents, and when the temperature rises due to the heat generation, the performance deteriorates as well as the risk of explosion. Therefore, a conventional battery is equipped with a protection circuit module for detecting and blocking overcharge, over-discharge, and over-current, or a protection circuit for detecting overcharge, over-discharge, . Such a conventional protection circuit includes a switching element capable of shutting off an overcurrent in order to control the amount of current applied during charging or discharging. However, there is a problem that a range of blocking the current varies depending on an internal resistance value of the switching element.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a package of a battery protection circuit capable of applying a stable voltage and a battery protection circuit module capable of controlling a precise current for solving various problems including the above problems. However, these problems are exemplary and do not limit the scope of the present invention.

A battery protection circuit according to one aspect of the present invention can be provided. The battery protection circuit is a battery protection circuit in which one side is electrically connected to a battery bare cell and the other side is electrically connected to a charger or an electronic device. The battery protection circuit has drain common to the first and second field effect transistors A pair of field effect transistors; (V-terminal) for sensing charging / discharging and over-current conditions, a terminal (VDD terminal) for applying charging voltage and discharging voltage and sensing battery voltage, a reference terminal (VSS terminal) , the first discharge is generated off the field effect transistor off signal output terminal (D _O terminal), a charging shutoff signal output terminal for turning off the second field effect transistor in the overcharged state (C _O terminal) in the over-discharge state A protection integrated circuit (IC); And a boost integrated circuit which is interposed between the pair of field effect transistors and the protection integrated circuit and is electrically connected to the gate of the first field effect transistor or the gate of the second field effect transistor, Boost IC < / RTI >

A battery protection circuit module package according to another aspect of the present invention can be provided. Wherein the battery protection circuit module package is electrically connected to the battery bare cell and the other side is electrically connected to the charger or the electronic device. The battery protection circuit module package has a drain common to both the first field effect transistor device and the second A pair of field effect transistor elements constituted by field effect transistor elements; (V-terminal) for sensing charging / discharging and over-current conditions, a terminal (VDD terminal) for applying charging voltage and discharging voltage and sensing battery voltage, a reference terminal (VSS terminal) said first field effect transistor device discharge is generated off the blocking signal output terminal (D _O terminal), the second charge blocking for turning off the field effect transistor element in the overcharged state signal output terminal (C _O terminal in the over-discharge state A protection integrated circuit device comprising: A boost integrated circuit which is interposed between the pair of field effect transistors and the protection integrated circuit and electrically connected to the gate of the first field effect transistor or the gate of the second field effect transistor, device; And an encapsulating material sealing the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element.

The battery protection circuit module package includes a plurality of spaced leads and is electrically connected to an electrode terminal of the battery bare cell, and the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element A lead frame; And an electrical connecting member for electrically connecting any two selected from the group consisting of the pair of field effect transistor elements, the protection integrated circuit element, the boost integrated circuit element, and the plurality of leads, A battery protection circuit can be constructed without using a printed circuit board.

In the battery protection circuit module package, the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element are not inserted and fixed in the form of a separate semiconductor package on the lead frame, May be mounted and fixed on at least a part of the surface of the lead frame by a technique, in the form of a chip die not sealed with a separate encapsulant.

In the battery protection circuit module package, the electrical connection member may include a bonding wire or a bonding ribbon.

In the battery protection circuit module package, the lead frame may include lead portions for the first internal connection terminal and a lead for the second internal connection terminal, which are respectively disposed at both edge portions and are directly connected to the electrode terminals of the battery bare cell. A lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals; And an element mounting portion which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and in which the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element can be mounted, For example.

In the battery protection circuit module package, the electrode terminal of the battery bare cell includes a plate of a first polarity and an electrode cell of a second polarity disposed in the center of the plate of the first polarity, The lead may be electrically connected to the plate of the first polarity, and the lead for the second internal connection terminal may be electrically connected to the electrode cell of the second polarity.

In the battery protection circuit module package, the length of the lead frame may correspond to a length from one end of the first polarity plate to the electrode cell of the second polarity.

In the battery protection circuit module package, the sealing material exposes the lead for the first internal connection terminal and the lead for the second internal connection terminal, and at least part of the lead for the external connection terminal Can be exposed.

The battery protection circuit module package is electrically connected to the electrode terminals of the battery bare cell and includes a printed circuit board (PCB) on which the pair of field effect transistor elements, the protection integrated circuit element and the boost integrated circuit element are mounted. Board).

According to the embodiments of the present invention as described above, it is possible to provide a battery protection circuit capable of applying a stable voltage and a package of a battery protection circuit module which is advantageous in integration and miniaturization and can control a precise current. Of course, the scope of the present invention is not limited by these effects.

1 is a circuit diagram including a battery protection circuit according to an embodiment of the present invention.
2 and 3 are views illustrating a portion of a battery protection circuit module package according to another embodiment of the present invention.
4 is a perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention.
5 is a perspective view illustrating a process of coupling a battery protection circuit module package according to another embodiment of the present invention to a battery can.
6 is a perspective view illustrating an outer shape of a battery pack having a battery protection circuit module package according to another embodiment of the present invention.
7 is a perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention.
8 is a perspective view illustrating a PTC structure in a battery protection circuit module package according to another embodiment of the present invention.
9 is a view illustrating a battery protection circuit module package according to another embodiment of the present invention in which a PTC structure is combined.
10 is a perspective view illustrating a process of assembling a battery protection circuit module package according to another embodiment of the present invention in which a PTC structure is combined with a battery can.
11 is a view illustrating a configuration in which a battery protection circuit module package according to another embodiment of the present invention in which a PTC structure is combined is connected to an electrode terminal of a battery bare cell.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

In the embodiments of the present invention, the lead frame may be divided into a structure in which the lead terminals are patterned on the metal frame, and a structure and thickness of the lead frame are different from those of the printed circuit board on which the metal wiring layer is formed.

1 is a circuit diagram including a battery protection circuit according to an embodiment of the present invention. 1, a battery protection circuit 20 according to an embodiment of the present invention includes first and second internal connection terminals B + and B- for connecting to a battery cell (bare cell) And first to third external connection terminals P +, CF, and P- for connecting to an electronic device (e.g., a portable terminal or the like) that is operated by battery power when the battery is discharged. Here, the first external connection terminal P + and the third external connection terminal P- of the first to third external connection terminals P +, CF, and P- are for power supply and the other is an external connection terminal The second external connection terminals CF and TH divides the battery, for example, and charges the battery according to the battery. The second external connection terminals CF and TH may be a thermistor which is a component for sensing the battery temperature during charging, and may be used as a terminal to which other functions are applied. That is, one side of the battery protection circuit 20 may be electrically connected to the battery bare cell, and the other side may be electrically connected to the charger or the electronic device.

The battery protection circuit 20 includes a pair of field effect transistors 110, a protection integrated circuit (hereinafter, referred to as " protection integrated circuit ") 11 having a common drain and composed of a first field effect transistor FET1 and a second field effect transistor FET2 120, a protection IC, and a boost IC (boost IC) 130. Furthermore, the battery protection circuit 20 may include resistors R1, R2, R3, a varistor V1 and capacitors C1, C2.

The protection integrated circuit 120 is connected to a first internal connection terminal B + which is a (+) terminal of the battery through a resistor R 1 and receives a voltage for applying a charging voltage or a discharging voltage through the first node n 1, A reference terminal (VSS terminal) serving as a reference for an operation voltage in the protection integrated circuit 120, a detection terminal (V- terminal) for detecting charge / discharge and overcurrent states, A charge cutoff signal output terminal (C0 terminal) for turning off the second field effect transistor FET2 in an overcharge state, a discharge cutoff signal output terminal (DO terminal) for turning off the first field effect transistor FET1 in an overdischarge state, .

At this time, the inside of the protection integrated circuit 120 may include a reference voltage setting unit, a comparison unit for comparing a reference voltage and a charge / discharge voltage, an overcurrent detection unit, and a charge / discharge detection unit. Here, the criterion for determining the charging and discharging states can be changed to the specification (SPEC) required by the user, and the charging / discharging state is determined by recognizing the voltage difference of each terminal of the protection integrated circuit 120 according to the predetermined standard.

When the protection integrated circuit 120 reaches an overdischarge state at the time of discharging, the discharge cutoff signal output terminal (DO terminal) becomes low (LOW) to turn off the first field effect transistor (FET1) The charge blocking signal output terminal (C0 terminal) is turned low to turn off the second field effect transistor (FET2). When the overcurrent flows, the second field effect transistor (FET2) (FET1) is turned off.

For example, when the battery is abnormally charged, the second field effect transistor (FET2) corresponding to the charge cutoff signal output terminal (C0 terminal) is controlled to be turned off and the first field effect transistor The field effect transistor (FET1) maintains the ON state and controls the discharging current to flow smoothly when the battery is used. On the contrary, at the time of abnormal discharge of the battery, the first field effect transistor FET1 corresponding to the discharge cutoff signal output terminal (DO terminal) is turned off and the second field effect transistor FET2 (corresponding to the charge cutoff signal output terminal Is controlled to be in the ON state so that the charging current can flow smoothly when the battery is charged.

The resistor R1 and the capacitor C1 serve to stabilize the fluctuation of the supply power source of the protection integrated circuit 120. [ The resistor R1 is connected between the VDD terminal of the protection integrated circuit 120 and the first node n1 which is the power supply V1 supply node of the battery and the capacitor C1 is connected between the VDD terminal of the protection integrated circuit and the VSS terminal Lt; / RTI > Here, the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +. When the resistance R1 is increased, the detection voltage becomes higher due to the current penetrated into the protection integrated circuit 120 at the time of voltage detection, so that the value of the resistor R1 is set to an appropriate value of 1 K or less. Also, for stable operation, the value of the capacitor C1 has an appropriate value of 0.01 mu F or more.

And the resistors R1 and R2 become current limiting resistors when the high voltage charger or charger exceeding the absolute maximum rating of the protection integrated circuit 120 is connected upside down. The resistor R2 is connected between the V- terminal of the protection integrated circuit 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ?. If the resistance R2 is too large, the return may not occur after the overcharge cutoff, so that the value of the resistance R2 is set to a value of 10K or less.

The capacitor C2 is connected to the source terminal S1 of the first node n2 (or the third external connection terminal P-) and the first field effect transistor FET1 (or the VSS terminal, the second internal connection terminal B -)). The capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for user's request or stability. The capacitor C2 is for stabilizing the system by improving the resistance to voltage fluctuation and external noise.

The resistor R3 and the varistor V1 are elements for ESD (Electrostatic Discharge) and surge protection and are connected in parallel to each other. The second external connection terminal CF and the second node n2 Or the third external connection terminal P-). The resistance of the varistor (V1) is lowered when an overvoltage occurs. When the overvoltage is generated, the resistance of the varistor (V1) is lowered, thereby minimizing circuit damage due to overvoltage.

A battery protection circuit 20 according to an embodiment of the present invention includes a pair of field effect transistors 110 and a protection integrated circuit 120. The battery protection circuit 20 is electrically connected to a pair of field effect transistors 110 and a protection integrated circuit 120, And a boost integrated circuit 130 capable of applying a constant voltage to the gate G1 of the second field effect transistor (FET1) and / or the gate G2 of the second field effect transistor (FET2). Since the internal resistance value of the pair of field effect transistors 110 varies according to the level of the battery voltage applied to the VDD terminal, the internal resistance can be kept constant by supplying a constant voltage to the gate of the field effect transistor. Even if the voltage of the battery applied to the protection integrated circuit 120 is lowered, the voltage applied to the pair of field effect transistors 110 can be fixed by boosting the voltage using the boost integrated circuit 130. The battery protection circuit 20 according to an embodiment of the present invention controls the amount of current applied during charging or discharging to block the battery when the amount of current is excessively applied to prevent damage to the battery, For example, when the internal resistance value of the field effect transistor is increased, the current cutoff value is lowered, and when the internal resistance value of the field effect transistor is lowered, The current cutoff value becomes high. A boost integrated circuit 130 is applied between the protection integrated circuit 120 and the pair of field effect transistors 110 to reduce a change in the current cutoff value so that a constant voltage is applied to the gate of the field effect transistor, So that the amount of current applied during charging and discharging of the battery can be kept constant.

In summary, even if the voltage of the battery cell applied to the VDD terminal changes, the boost integrated circuit 130 is used to switch the discharge cutoff signal output terminal (DO terminal) and / or the charge cutoff signal output terminal (C0 terminal) The applied voltage can be kept constant so that the internal resistance value does not change. By applying a constant voltage to the gate of the field effect transistor, it has a fixed internal resistance value and has an effect of reducing the internal resistance, so that it can have a constant cut-off value against an overcurrent generated during charging and discharging.

The battery protection circuit 20 of FIG. 1 including the external connection terminals P +, P-, and CF and the internal connection terminals B + and B- Circuit module package.

The protection circuit according to one embodiment of the present invention is illustrative and the configuration, number, arrangement, etc. of the protection integrated circuit 120, the pair of field effect transistors 110, the boost integrated circuit 130, It can be appropriately modified in accordance with the additional function of the protection circuit.

FIG. 2 is a diagram illustrating a portion of a battery protection circuit module package according to another embodiment of the present invention. FIG. 3 illustrates a pair of field effect transistor elements 110a, a protection integrated circuit element 120a And the boost integrated circuit element 130a are mounted.

Referring to FIGS. 2 and 3, a protection circuit structure 200a constituting a module package of a battery protection circuit according to an embodiment of the present invention is disclosed. The protection circuit structure 200a includes a lead frame 50 and a pair of field effect transistor elements 110a, a protection integrated circuit element 120a, a boost integrated circuit element 130a, and a plurality of R2, R3, C1, C2, and V1 of the first and second passive components. Here, the pair of field effect transistor elements 110a, the protection integrated circuit elements 120a and the boost integrated circuit elements 130a are connected to the pair of field effect transistors 110, the protection integrated circuits 120 ) And the boost integrated circuit 130 are implemented.

The lead frame 50 has a protection circuit region of the first internal connection terminal region A1, the external connection terminal region A2, the element region A3 and the chip region A4, and the second internal connection terminal region A5 And are sequentially arranged. The protection circuit region is disposed between the external connection terminal region A2 and the second internal connection terminal region A5. The arrangement order of the element region A3 and the chip region A4 may be variously changed. The upper surface 50a of the lead frame 50 is connected to a pair of field effect transistor elements 110a, a protection integrated circuit element 120a, a boost integrated circuit element 130a and a plurality of passive elements R1, R2, R3, C1, C2, and V1 are mounted, and the lower surface 50b of the lead frame 50 may be the opposite surface of the upper surface 50a. All or a part of the portion corresponding to the external connection terminal region A2 on the lower surface 50b of the lead frame 50 may be plated. The plating material may be at least one selected from gold, silver, nickel, tin and chromium.

The first internal connection terminal region A1 and the second internal connection terminal region A5 are provided at both edge portions of the module package and function as a first internal connection terminal connected to the battery bare cell built in the battery can The first internal connection terminal lead B + and the second internal connection terminal lead B- functioning as the second internal connection terminal are arranged, respectively.

The external connection terminal region A2 is connected to the first to third external connection terminal leads P +, P +, which are adjacent to the first internal connection terminal region A1 and are lead terminals for a plurality of external connection terminals functioning as a plurality of external connection terminals, CF, and P-) are sequentially arranged. The arrangement order of the first to third external connection terminal leads (P +, CF, P-) may be variously changed. Here, the first external connection terminal lead (P +) and the first internal connection terminal lead (B +) are connected to each other. That is, the first internal connection terminal lead B + may extend from the first external connection terminal lead P + or the first external connection terminal lead P + may extend from the first internal connection terminal lead B + As shown in FIG.

In the element region A3, a plurality of passive elements R1, R2, R3, C1, C2, and V1 constituting the battery protection circuit are disposed. L1, L2, L3, L4, L5, and L6 for the first to sixth passive elements composed of a plurality of conductive lines may be disposed. For example, the first to third passive element leads L 1, L 2 and L 3 may have a sequential arrangement structure on the upper side of the element region A 3, and the fourth to sixth passive element leads L 4, L5, and L6 may be disposed on the lower side of the element region A3.

The passive element lead L1 is arranged in a predetermined size in the element region A3 adjacent to the external connection terminal region A2 and the second passive element lead L2 is arranged adjacent to the passive element lead L1 And are arranged in a predetermined size. The third passive element lead L3 is disposed in the element region A3 adjacent to the chip area A4 with a predetermined size adjacent to the second passive element lead L2.

The fourth passive element lead L4 is arranged in a predetermined size in the element region A3 adjacent to the external connection terminal region A2 and the fifth passive element lead L5 and the sixth passive element lead L6 Is disposed adjacent to the fourth passive element lead L1 in such a manner that the fifth passive element lead L5 surrounds the sixth passive element lead L6.

The chip region A4 is adjacent to the element region A3 and is connected to a pair of field effect transistor elements 110a, a protection integrated circuit element 120a and a boosted integrated circuit element 130a which constitute a battery protection circuit The die pad DP can be disposed. The die pad DP may be electrically connected to the common drain terminal of the pair of field effect transistor elements 110a and may be exposed during the packaging of a subsequent process so as to function as an external connection terminal, have.

2 and 3, a pair of field effect transistor elements 110a, a protection integrated circuit element 120a, a boost integrated circuit element 130a and a pair of field effect transistor elements 110a and 120b are formed on a lead frame 50 including a plurality of spaced leads. A plurality of passive elements R1, R2, R3, C1, C2, and V1 are disposed, and the circuit shown in FIG. 1 is implemented through a bonding wire 220 or the like.

The pair of field effect transistor elements 110a, the boost integrated circuit elements 130a, and the protection integrated circuit elements 120a are mounted on the die pad DP of the chip area A4. At least one selected from the group consisting of the pair of field effect transistor elements 110a, the boost integrated circuit elements 130a and the protection integrated circuit elements 120a is inserted into the lead frame 50 in the form of a separate semiconductor package A chip die that is sawed at a wafer not sealed with a separate encapsulant is formed on at least a part of the surface of the lead frame 50 by surface mounting technology, And can be mounted and fixed.

Here, a chip die refers to a plurality of structures in the form of an array (for example, a plurality of field effect transistor elements 110a in the form of an array, a plurality of protection integrated circuit elements 120a in an array form, (A plurality of boosted integrated circuit elements 130a in the form of a plurality of boosted integrated circuit elements 130a) is formed by performing a soaking process without sealing the wafer with a separate encapsulation material. That is, when mounting at least one selected from the group consisting of the pair of field effect transistor elements 110a, the protection integrated circuit elements 120a and the boost integrated circuit elements 130a on the lead frame 50, The protection integrated circuit elements 120a and the boost integrated circuit elements 130a are electrically connected to each other by a subsequent encapsulant (250 in Fig. 4) The process of forming the sealing material can be performed only once when the battery protection circuit module package 300 is implemented.

On the other hand, when the pair of field effect transistor elements 110a, the protection integrated circuit elements 120a and / or the boost integrated circuit elements 130a are separately inserted into the printed circuit board PCB for fixing or mounting, A single molding process is first required for each of the pair of field effect transistor elements 110a, the protection integrated circuit elements 120a and / or the boost integrated circuit elements 130a, and after fixing or mounting on the printed circuit board Since another molding process is additionally required for each mounted part, the manufacturing process may be complicated and the manufacturing cost may increase.

On the other hand, a plurality of passive elements R1, R2, R3, C1, C2, and V1 may be disposed on at least a part of the plurality of spaced leads constituting the element region A3 of the lead frame 50. [ For example, a first one of the plurality of passive elements R1 is disposed between the passive element lead L1 and the second passive element lead L2, and the second one of the plurality of passive elements The second passive element R2 is disposed between the fifth passive element lead L5 and the sixth passive element lead L6. The third resistor R3 constituting the surge protection circuit among the plurality of passive elements is disposed between the fourth passive element lead L4 and the fifth passive element lead L5, The first capacitor C1 is disposed between the second passive element lead L2 and the third passive element lead L3 and the second one of the plurality of passive elements C2 is connected to the third passive element C2, And is disposed between the lead L3 and the fifth passive element lead L5. The varistor V1 constituting the surge protection circuit among the plurality of passive elements is formed in parallel with the third resistor R3 so that the fourth passive element lead L4 and the fifth passive element lead L5.

Meanwhile, the battery protection circuit module package according to another embodiment of the present invention includes a pair of field effect transistor elements 110a, a protection integrated circuit element 120a, a boost integrated circuit element 130a, and a lead frame 50 And an electrical connecting member 220 for electrically connecting any two selected from the group consisting of a plurality of leads. For example, the gate G1 of the first field effect transistor (FET1) constituting the pair of field effect transistor elements 110a is electrically connected to the Vout1 terminal of the boost integrated circuit element 130a by wire bonding And the gate G2 of the second field effect transistor FET2 is electrically connected by performing wire bonding with the Vout2 terminal of the boost integrated circuit element 130a. Further, the discharge cutoff signal output terminal (DO terminal) of the protection integrated circuit device 120a is electrically connected to the Vin1 terminal of the boost integrated circuit device 130a by wire bonding, and the protection integrated circuit device 120a is charged The blocking signal output terminal (C0 terminal) is electrically connected to the Vin2 terminal of the boost integrated circuit element 130a by wire bonding. The reference voltage terminal VSS of the protection integrated circuit element 120a and the terminal VDD for sensing the battery voltage may be electrically connected to any one of the plurality of leads constituting the lead frame 50 Can be connected. Furthermore, any one of the plurality of leads constituting the lead frame 50 and the other one of the plurality of leads constituting the lead frame 50 may be electrically connected by performing wire bonding.

3, a battery protection circuit module package according to another embodiment of the present invention includes a pair of field effect transistor elements 110a, a protection integrated circuit element 120a, and a boost integrated circuit element 130a, May be arranged side by side so as to be adjacent to each other without being laminated. However, the technical spirit of the present invention is not limited thereto, and various modifications are possible. For example, the first field effect transistor (FET1) and the second field effect transistor (FET2) constituting the pair of field effect transistor elements 110a may have a common drain structure and be built in one chip . The one chip may be referred to as a dual field effect transistor chip.

In addition, for example, the boost integrated circuit element 130a and the protection integrated circuit element 120a may be stacked on the dual field effect transistor chip. In this case, any two terminals selected from the terminals constituting the pair of field effect transistor elements 110a, the boost integrated circuit 130 and the protection integrated circuit element 120a are not electrically connected by the bonding wires, And at least one selected from the group consisting of a pair of field effect transistor elements 110a, a boost integrated circuit 130 and a protection integrated circuit element 120a may be provided in the form of a flip chip .

Further, for example, a pair of the field effect transistor element 110a, the protection integrated circuit element 120a, and the boost integrated circuit element 130a may be integrally provided on one chip. The integrated chip can be mounted on the lead frame 50 in the form of a flip chip. The flip chip is advantageous in that the external terminal portion is soldered to a lead or the like which requires electrical connection without requiring additional wire bonding, thereby improving electrical conductivity compared to wire bonding, lowering the production cost and simplifying the process, This has the advantage of reducing the volume occupied.

A battery protection circuit module package 300 according to another embodiment of the present invention includes a pair of field effect transistor elements 110a, a protection integrated circuit element 120a and a boost integrated circuit element 130a on respective substrates It is possible to improve the efficiency of space and work by implementing it as a single package. In addition, when each package is used, current consumed by the resistance is consumed by the influence of the wiring, but when the package is constituted by one package, the resistance of the wiring is minimized so that a more precise current can be controlled .

FIG. 4 is a perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention, FIG. 5 is a perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention, And FIG. 6 is a perspective view illustrating an outer shape of a battery pack equipped with a battery protection circuit module package according to another embodiment of the present invention.

The module package 300 is formed by packaging the protection circuit structure 200a shown in FIG. 3 through a process such as molding with the sealing material 250, as shown in FIG. 4A is a bottom view of a module package 300 of a battery protection circuit according to an embodiment of the present invention, and FIG. 4B is a top view of the module package 300. FIG. For example, the lower surface of the module package 300 of the battery protection circuit corresponds to the upper surface 50a of the lead frame 50, and the upper surface of the module package 300 of the battery protection circuit corresponds to the lead frame 50 And the lower surface 50b. The lower surface of the module package 300 of the battery protection circuit can be opposed to the cap plate 430, for example, shown in Fig.

In the module package 300 of the battery protection circuit according to the embodiment of the present invention, the external connection terminals P +, CF and P- are exposed on the upper surface and the first internal connection terminal B + And the second internal connection terminal (B-) are exposed. Here, the upper surface of the module package 300 may be packaged so as to further expose the lower surface of the die pad (the opposite surface of the surface on which the boost integrated circuit element 130a is mounted) according to heat radiation or other necessity .

5, the package module 300 of the battery protection circuit including the protection circuit structure 200a having the structure as described above is disposed on the upper surface of the battery bare cell built in the battery can 400, The battery pack 600 is inserted between the case 500 and the battery pack 600 as shown in FIG. The upper case 500 is formed of a plastic material and a through hole 550 is formed at a corresponding portion to expose the external connection terminals P +, CF, and P-. The battery pack 600 is generally understood as a battery inserted into a cell phone, a terminal, or the like. The upper case 500 is formed of a plastic material and has a through hole 550 formed in a corresponding portion to expose the external connection terminals P +, CF, and P-.

The battery bare cell includes an electrode assembly and a cap assembly. The electrode assembly includes a positive electrode plate formed by applying a positive electrode active material to a positive electrode collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode collector, and a negative electrode plate interposed between the positive electrode plate and the negative electrode plate. The separator may be made of a separator. The positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out from the electrode assembly.

The cap assembly includes an anode terminal 410, a gasket 420, a cap plate 430, and the like. The cap plate 430 may serve as a positive electrode terminal. The cathode terminal 410 may be referred to as a cathode cell or an electrode cell. The gasket 420 may be formed of an insulating material to insulate the cathode terminal 410 from the cap plate 430. Therefore, the electrode terminal of the battery bare cell may include the negative terminal 410 and the cap plate 430.

The battery protection circuit package module 300 according to another embodiment of the present invention includes a plurality of spaced leads (for example, B +, P +, CF, P-, L1, L2, L3, L4, L6, DP, and B-, and has a lead frame 50 which is joined to the electrode terminals 410 and 430 of the battery bare cell accommodated in the battery can 400. The battery protection circuit package module 300 according to another embodiment of the present invention is directly mounted on the lead frame 50 and includes a pair of field effect transistor elements 110a, a protection integrated circuit element 120a, (E.g., R1, R2, R3, C1, C2, V1 in FIG. 2) of the integrated circuit element 130a and at least one passive element The battery protection circuit package module 300 may include a plurality of leads (e.g., B +, P +, B + C) of a passive element (e.g., R1, R2, R3, C1, C2, A pair of field effect transistor elements 110a, a protection integrated circuit element 120a, and a pair of field effect transistor elements 110a, 120b, 120c, 120d, 120d, 120d, Two selected from the group consisting of the boosted integrated circuit element 130a and the plurality of leads B +, P +, CF, P-, L1, L2, L3, L4, L5, L6, DP, A battery protection circuit can be constructed without using a separate printed circuit board. The electrical connection member 220 may include a bonding wire or a bonding ribbon. In the embodiments of the present invention, since the circuit is constituted by disposing the electrical connecting member 220 such as the bonding wire or the bonding ribbon on the lead frame 50, the lead frame 50 for constituting the battery protection circuit is designed The manufacturing process can be simplified. If the electrical connecting member 220 is not incorporated in the battery protection circuit in the embodiments of the present invention, the configuration of the plurality of leads constituting the lead frame 50 becomes very complicated, It is difficult to effectively provide the same.

The electrode terminal of the battery bare cell includes a plate 430 having a first polarity (for example, an anode) and an electrode cell 410 having a second polarity (for example, a cathode) disposed at the center of the plate 430 The first internal connection terminal lead B + is connected to the plate 430 of the first polarity (for example, an anode) to be electrically connected, and the second internal connection terminal lead B- And may be electrically connected to the electrode cell 410 of the bipolar (e. G., Cathode). In this case, the length of the lead frame 50 is set such that the length L (L) from one end of the plate 430 of the first polarity (for example, an anode) to the electrode cell 410 of the second polarity / 2). According to this embodiment, since the battery protection circuit package module 300 is mounted using only one side region of the upper portion with respect to the electrode cell 410 of the second polarity (for example, the cathode), the battery can be miniaturized or increased in capacity Can be implemented. For example, it is possible to contribute to miniaturization of an application product having such a battery by further forming a cell on the other side of the electrode cell 410 to increase the capacity of the battery or disposing a chip or the like having another additional function.

The lead frame 50 may be made of nickel or may be made of nickel plating on a copper plate and the lead B + for the first internal connecting terminal and the lead B- May be bonded to the electrode terminals 410 and 430 of the battery bare cell by laser welding, soldering, resistance welding, or conductive epoxy.

The battery protection circuit package module 300 according to another embodiment of the present invention exposes the lead B + for the first internal connection terminal and the lead B- for the second internal connection terminal and forms a plurality of external connection terminals A pair of field effect transistor elements 110a, a protection integrated circuit element 120a, a boost integrated circuit element 130a, and a plurality of (a plurality of) field effect transistor elements 110a, The sealing member 250 sealing the passive elements R1, R2, R3, C1, C2,

Meanwhile, the battery protection circuit module package according to the modified embodiment of the present invention may use a printed circuit board instead of the lead frame 50 shown in FIGS. In this case, the pair of field effect transistor elements 110a, the protection integrated circuit elements 120a, and the boost integrated circuit elements 130a may be mounted on the printed circuit board.

FIG. 7 is a perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention, which is a modified embodiment of the battery protection circuit module package shown in FIG.

Referring to FIG. 7, the module package 300 of the battery protection circuit according to another embodiment of the present invention exposes the external connection terminals P +, CF and P- on the upper surface, 1 internal connection terminal B + and the second internal connection terminal B- are exposed. Here, the upper surface of the module package 300 may be packaged so as to further expose the lower surface of the die pad (the opposite surface of the surface on which the boost integrated circuit element 130a is mounted) according to heat radiation or other necessity . At least one of the lead (B +) for the first internal connection terminal and the lead (B-) for the second internal connection terminal may be bent in a gull-form form. That is, at least one of the lead (B +) for the first internal connection terminal and the lead (B-) for the second internal connection terminal is bent in a gull-form form to join with the electrode terminal of the battery bare cell . For example, the lead B + for the first internal connection terminal may be bent in a gull-form form in order to be fixed to the plate 430 of the first polarity (for example, an anode) and fixed. And the second internal connection terminal lead B- is fixed to the negative electrode terminal 410 of the second polarity (for example, the negative electrode). The bonding may be bonded in any one of the methods selected from the group consisting of laser welding, resistance welding, brazing, and conductive epoxy bonding. Therefore, the battery protection circuit package module 300 can be stably fixed because the leads B + for the first internal connection terminal and the leads B- for the second internal connection terminal are bonded to the electrode terminals of the battery bare cell . Therefore, according to the embodiments of the present invention, since the side surface of the lead frame is separately bent so that the side surface of the bent lead frame is not separately bonded to the battery can 400 having the battery bare cell built therein, The product battery can be miniaturized. The rest of the configuration is the same as that described with reference to FIG. 4, and therefore will not be described here.

FIG. 8 is a perspective view illustrating a PTC structure in a battery protection circuit module package according to another embodiment of the present invention, and FIG. 9 is a view illustrating a battery protection circuit module package according to another embodiment of the present invention in which a PTC structure is combined .

8 and 9, a battery protection circuit module package according to another embodiment of the present invention includes a PTC structure. The PTC structure includes a PTC element 310, a metal layer 320 attached to a first surface of the PTC element 310, which is one of the upper and lower surfaces of the PTC element 310, And conductive connecting members 330 and 340 attached to two sides. The metal layer 320 is bonded to one of the leads for the first internal connection terminal B + and the second internal connection terminal lead B-. The connection members 330 and 340 are electrically connected to the electrode Terminal (410 in Fig. 10). For example, the metal layer 320, the connecting members 330 and 340, and / or the lead frame 50 may be made of nickel, copper, nickel plated copper or other metal. The metal layer 320 is electrically connected to one of the leads for the first internal connection terminal B + and the second internal connection terminal B- by laser welding, resistance welding, soldering, and a conductive adhesive For example, conductive epoxy), and conductive tape.

The PTC (Positive Temperature Coefficient) element 310 can be formed, for example, by dispersing conductive particles in a crystalline polymer. Therefore, the PTC device 310 becomes a passage through which current flows between the metal layer 320 and the conductive connecting members 330 and 340 at a temperature below the set temperature. However, when the temperature exceeds the set temperature due to the occurrence of the overcurrent, the crystalline polymer swells and the resistance between the conductive particles dispersed in the crystalline polymer is separated and the resistance is rapidly increased. Accordingly, the flow of current between the metal layer 320 and the conductive connecting members 330 and 340 is cut off or the flow of current is reduced. Since the flow of the current can be cut off by the PTC device 310, the PTC device 310 serves as a safety device for preventing the battery from rupturing. When the temperature is lower than the set temperature again, the PTC element 310 shrinks the crystalline polymer and restores the connection between the conductive particles, so that the current flows smoothly.

FIG. 10 is a view showing a process of mounting a package 300 of a battery protection circuit module according to another embodiment of the present invention to a battery pack as a modified embodiment of FIG. 5, The battery protection circuit module package according to another embodiment of the present invention is connected to an electrode terminal of a battery bare cell.

9, the package 300 of the battery protection circuit module including the protection circuit structure 200a having the structure as described above is formed on the upper surface of the battery bare cell built in the battery can 400, The battery pack 600 is inserted between the case 500 and the battery pack 600 as shown in FIG.

10 and 11, the lead frame 50 constituting the package 300 of the battery protection circuit module is electrically connected to the electrode terminal of the battery bare cell via the PTC structure. For example, the lead B- for the second internal connection terminal of the lead frame 50 may be electrically connected to the negative terminal 410 of the battery bare cell via the PTC structure. That is, the lead B- for the second internal connection terminal of the lead frame 50 is bonded to the metal layer 320 and is electrically connected to the cathode of the battery bare cell via the conductive connecting members 330 and 340 via the PTC element 310. [ And is electrically connected to the terminal 410. In this case, the metal layer 320 is defined within the upper surface of the PTC device 310, and the connecting members 330 and 340 are formed on the lower surface of the PTC device 310, As shown in FIG. Particularly, the connection member 340 may be formed of any one selected from the group consisting of laser welding, resistance welding, soldering and conductive adhesive (for example, conductive epoxy) and conductive tape to the negative electrode terminal 410 of the battery bare cell As shown in Fig.

The length of the lead frame 50 in the package 300 of the battery protection circuit module including the protection circuit structure 200a having the structure as described above is set such that the lead frame 50 is located at the center of the upper surface of the battery bare cell For example, the negative electrode terminal 410). Further, the package 300 of the battery protection circuit module to which the PTC structure shown in FIG. 9 is coupled is arranged on one side with respect to the center of the upper surface of the battery bare cell (for example, the negative terminal 410) . For example, the length of the package 300 of the battery protection circuit module to which the PTC structure is coupled may be half the total length L of the cap plate 430 (L / 2).

Since the electrical connection between the lead B- for the second internal connection terminal and the PTC device 310 is realized by the metal layer 320 disposed in the upper surface on the upper surface of the PTC device 310 as described above, The PTC element 310 may be disposed directly below the lead B- for the internal connection terminal. Therefore, it becomes possible to reduce the length of the package 300 of the battery protection circuit module to which the PTC structure is coupled to, for example, half (L / 2) of the total length L of the cap plate 430. If the PTC device 310 is not disposed immediately below the lead B- for the second internal connection terminal but is spaced apart in the longitudinal direction, the length of the package 300 of the battery protection circuit module to which the PTC structure is coupled Is relatively increased. Since the PTC device 310 is disposed immediately below the lead B- for the second internal connection terminal, the lead 300 for the first internal connection terminal B + Can be folded into a hanging form.

According to the embodiment of the present invention described above, the battery protection circuit module package can be mounted using only one side region of the cap plate 430 with respect to the negative terminal 410 of the battery, have. For example, by forming a cell on the other side of the negative electrode terminal 410 where the package 300 of the battery protection circuit module is not disposed, the battery capacity can be increased or a chip or the like having other additional functions can be disposed. It can contribute to downsizing of an application product having a battery.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

20: Battery protection circuit
50: Lead frame
110a: a pair of field effect transistor elements
120a: Protection integrated circuit element
130a: Boost integrated circuit element
220: Bonding wire
250: Encapsulant
300: Battery protection circuit module package
310: PTC element
320: metal layer
330, 340: connecting member

Claims (10)

A battery protection circuit in which one side is electrically connected to a battery bare cell and the other side is electrically connected to a charger or an electronic device,
A pair of field effect transistors having a common drain, the field effect transistor comprising a first field effect transistor and a second field effect transistor;
(V-terminal) for sensing charging / discharging and over-current conditions, a terminal (VDD terminal) for applying charging voltage and discharging voltage and sensing battery voltage, a reference terminal (VSS terminal) , the first discharge is generated off the field effect transistor off signal output terminal (D _O terminal), a charging shutoff signal output terminal for turning off the second field effect transistor in the overcharged state (C _O terminal) in the over-discharge state A protection integrated circuit (IC); And
A boost integrated circuit which is interposed between the pair of field effect transistors and the protection integrated circuit and electrically connected to the gate of the first field effect transistor or the gate of the second field effect transistor, (boost IC);
And a battery protection circuit. A battery protection circuit module package in which one side is electrically connected to a battery bare cell and the other side is electrically connected to a charger or an electronic device,
A pair of field effect transistor elements having a common drain and being constituted by a first field effect transistor element and a second field effect transistor element;
(V-terminal) for sensing charging / discharging and over-current conditions, a terminal (VDD terminal) for applying charging voltage and discharging voltage and sensing battery voltage, a reference terminal (VSS terminal) said first field effect transistor device discharge is generated off the blocking signal output terminal (D _O terminal), the second charge blocking for turning off the field effect transistor element in the overcharged state signal output terminal (C _O terminal in the over-discharge state A protection integrated circuit device comprising:
A boost integrated circuit which is interposed between the pair of field effect transistors and the protection integrated circuit and electrically connected to the gate of the first field effect transistor or the gate of the second field effect transistor, device; And
A sealing material for sealing the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element;
And a battery protection circuit module package. 3. The method of claim 2,
A lead frame including a plurality of spaced leads and electrically connected to an electrode terminal of the battery bare cell and having the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element mounted thereon; And
An electrical connecting member for electrically connecting any two selected from the group consisting of the pair of field effect transistor elements, the protection integrated circuit element, the boost integrated circuit element, and the plurality of leads;
So that a battery protection circuit is constructed without using a separate printed circuit board,
Battery protection circuit module package. The method of claim 3,
The pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element are not inserted and fixed in the form of a separate semiconductor package on the lead frame, but may be mounted on the surface of the lead frame Is packaged and fixed in the form of a chip die that is not sealed with a separate encapsulant on at least a portion of the package. The method of claim 3,
Wherein the electrical connecting member comprises a bonding wire or a bonding ribbon. The method of claim 3,
The lead frame includes:
A lead for a first internal connection terminal and a lead for a second internal connection terminal which are respectively disposed at both edge portions and are directly connected to the electrode terminals of the battery bare cell;
A lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals; And
Wherein the field effect transistor element, the protection integrated circuit element, and the boost integrated circuit element are disposed between the leads for the first internal connection terminal and the leads for the second internal connection terminal, lead;
And a battery protection circuit module package. The method according to claim 6,
Wherein the electrode terminal of the battery bare cell includes a first polarity plate and a second polarity electrode cell disposed in the center of the first polarity plate,
Wherein the lead for the first internal connection terminal is electrically connected to the plate of the first polarity and the lead for the second internal connection terminal is electrically connected to the electrode cell of the second polarity, Module Packages. 8. The method of claim 7,
Wherein a length of the lead frame corresponds to a length from one end of the plate of the first polarity to the electrode cell of the second polarity. The method according to claim 6,
Wherein the sealing material exposes at least a part of the lead for the external connection terminal to expose the lead for the first internal connection terminal and the lead for the second internal connection terminal and to form the plurality of external connection terminals, package. 3. The method of claim 2,
And a printed circuit board (PCB) electrically connected to the electrode terminal of the battery bare cell, wherein the pair of field effect transistor elements, the protection integrated circuit element, and the boost integrated circuit element are mounted , Battery protection circuit module package.

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