JPWO2020185360A5 - - Google Patents
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- JPWO2020185360A5 JPWO2020185360A5 JP2021551898A JP2021551898A JPWO2020185360A5 JP WO2020185360 A5 JPWO2020185360 A5 JP WO2020185360A5 JP 2021551898 A JP2021551898 A JP 2021551898A JP 2021551898 A JP2021551898 A JP 2021551898A JP WO2020185360 A5 JPWO2020185360 A5 JP WO2020185360A5
- Authority
- JP
- Japan
- Prior art keywords
- porous plate
- pores
- showerhead assembly
- processing chamber
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (20)
支持特徴を備えた支持構造、及び
少なくとも約50W/(mK)の熱伝導率を有し、かつ約100μm未満の平均直径を有する複数のポアを備えた多孔性プレートであって、該多孔性プレートのエッジの少なくとも一部が前記支持特徴上にある、多孔性プレート
を含む、シャワーヘッドアセンブリ。 A showerhead assembly for a processing chamber comprising:
A porous plate comprising: a support structure comprising supporting features; and a plurality of pores having a thermal conductivity of at least about 50 W/(mK) and having an average diameter of less than about 100 μm, a porous plate having at least a portion of its edge on said support feature.
基板を支持するように構成された基板支持体、
前記処理チャンバの内部にガスを流すように構成されたシャワーヘッドアセンブリであって、該シャワーヘッドアセンブリが、
支持特徴を備えた支持構造と、
少なくとも約50W/(mK)の熱伝導率を有し、かつ約100μm未満の直径を有する複数のポアを備えた多孔性プレートであって、該多孔性プレートのエッジの少なくとも一部が前記支持特徴上にある、多孔性プレートと
を備えている、シャワーヘッドアセンブリ、及び
プロセスガスを前記シャワーヘッドアセンブリに供給するように構成されたガス供給源
を含む、処理チャンバ。 a processing chamber,
a substrate support configured to support a substrate;
A showerhead assembly configured to flow gas into the processing chamber, the showerhead assembly comprising:
a support structure with support features;
A porous plate having a thermal conductivity of at least about 50 W/(mK) and comprising a plurality of pores having a diameter of less than about 100 μm, wherein at least a portion of the edges of the porous plate are aligned with the support features. a showerhead assembly comprising an overlying porous plate; and a gas supply source configured to supply process gas to the showerhead assembly.
不規則なパターンに従って配置された複数のポアと、 a plurality of pores arranged according to an irregular pattern;
前記複数のポアから形成された複数の連続した経路と a plurality of continuous pathways formed from the plurality of pores;
を備え、前記複数の連続した経路が、前記多孔性プレートの第1の表面から第2の表面まで延び、wherein said plurality of continuous paths extend from a first surface to a second surface of said porous plate;
前記多孔性プレートが少なくとも約50W/(mK)の熱伝導率を有する、多孔性プレート。 A porous plate, wherein said porous plate has a thermal conductivity of at least about 50 W/(mK).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962815581P | 2019-03-08 | 2019-03-08 | |
US62/815,581 | 2019-03-08 | ||
PCT/US2020/018679 WO2020185360A1 (en) | 2019-03-08 | 2020-02-18 | Porous showerhead for a processing chamber |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022523541A JP2022523541A (en) | 2022-04-25 |
JPWO2020185360A5 true JPWO2020185360A5 (en) | 2023-02-28 |
JP7680361B2 JP7680361B2 (en) | 2025-05-20 |
Family
ID=72336172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021551898A Active JP7680361B2 (en) | 2019-03-08 | 2020-02-18 | Porous showerhead for processing chamber - Patents.com |
Country Status (7)
Country | Link |
---|---|
US (1) | US11111582B2 (en) |
JP (1) | JP7680361B2 (en) |
KR (1) | KR20210126130A (en) |
CN (1) | CN113490765A (en) |
SG (1) | SG11202108196QA (en) |
TW (1) | TWI816990B (en) |
WO (1) | WO2020185360A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024191656A1 (en) * | 2023-03-15 | 2024-09-19 | Silfex, Inc. | Porous showerheads for substrate processing systems |
Family Cites Families (26)
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KR950020993A (en) | 1993-12-22 | 1995-07-26 | 김광호 | Semiconductor manufacturing device |
JPH0878192A (en) * | 1994-09-06 | 1996-03-22 | Fujitsu Ltd | Plasma processing apparatus and plasma processing method |
JPH1027784A (en) * | 1996-05-08 | 1998-01-27 | Tokyo Electron Ltd | Apparatus for low-pressure processing |
US6182603B1 (en) | 1998-07-13 | 2001-02-06 | Applied Komatsu Technology, Inc. | Surface-treated shower head for use in a substrate processing chamber |
JP2003007682A (en) | 2001-06-25 | 2003-01-10 | Matsushita Electric Ind Co Ltd | Electrode member for plasma processing equipment |
US20050081788A1 (en) * | 2002-03-15 | 2005-04-21 | Holger Jurgensen | Device for depositing thin layers on a substrate |
JP2003282462A (en) | 2002-03-27 | 2003-10-03 | Kyocera Corp | Shower plate, method of manufacturing the same, and shower head using the same |
JP2004352513A (en) * | 2003-05-27 | 2004-12-16 | Sumitomo Electric Ind Ltd | Parts for semiconductor manufacturing apparatus using aluminum nitride porous body and semiconductor manufacturing apparatus |
JP2004356124A (en) | 2003-05-27 | 2004-12-16 | Sumitomo Electric Ind Ltd | Parts for semiconductor manufacturing equipment and semiconductor manufacturing equipment using porous ceramics |
JP4312063B2 (en) * | 2004-01-21 | 2009-08-12 | 日本エー・エス・エム株式会社 | Thin film manufacturing apparatus and method |
US20050279384A1 (en) * | 2004-06-17 | 2005-12-22 | Guidotti Emmanuel P | Method and processing system for controlling a chamber cleaning process |
JP5010234B2 (en) * | 2006-10-23 | 2012-08-29 | 北陸成型工業株式会社 | Shower plate in which gas discharge hole member is integrally sintered and manufacturing method thereof |
JP2008205219A (en) * | 2007-02-20 | 2008-09-04 | Masato Toshima | Showerhead, and cvd apparatus using the same showerhead |
CN100577866C (en) * | 2007-02-27 | 2010-01-06 | 中微半导体设备(上海)有限公司 | Gas shower head assembly used in plasma reaction chamber, its manufacturing method and its refurbishment and reuse method |
US20090226614A1 (en) * | 2008-03-04 | 2009-09-10 | Tokyo Electron Limited | Porous gas heating device for a vapor deposition system |
EP2362001A1 (en) * | 2010-02-25 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and device for layer deposition |
KR101249999B1 (en) * | 2010-08-12 | 2013-04-03 | 주식회사 디엠에스 | Apparatus for chemical vapor deposition |
US8911553B2 (en) | 2010-10-19 | 2014-12-16 | Applied Materials, Inc. | Quartz showerhead for nanocure UV chamber |
JP6002149B2 (en) * | 2010-12-23 | 2016-10-05 | ネクター セラピューティクス | Polymer-sunitinib conjugate |
US20120312234A1 (en) * | 2011-06-11 | 2012-12-13 | Tokyo Electron Limited | Process gas diffuser assembly for vapor deposition system |
US9449795B2 (en) | 2013-02-28 | 2016-09-20 | Novellus Systems, Inc. | Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor |
US10741365B2 (en) | 2014-05-05 | 2020-08-11 | Lam Research Corporation | Low volume showerhead with porous baffle |
US10378107B2 (en) * | 2015-05-22 | 2019-08-13 | Lam Research Corporation | Low volume showerhead with faceplate holes for improved flow uniformity |
TW201717262A (en) * | 2015-10-26 | 2017-05-16 | 應用材料股份有限公司 | High productivity PECVD tool for wafer processing of semiconductor manufacturing |
US10186400B2 (en) * | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
CN208098420U (en) * | 2018-02-11 | 2018-11-16 | 佛山华派机械科技有限公司 | A kind of plate superposing type porous nozzle |
-
2020
- 2020-02-18 WO PCT/US2020/018679 patent/WO2020185360A1/en active Application Filing
- 2020-02-18 KR KR1020217030971A patent/KR20210126130A/en active Pending
- 2020-02-18 JP JP2021551898A patent/JP7680361B2/en active Active
- 2020-02-18 SG SG11202108196QA patent/SG11202108196QA/en unknown
- 2020-02-18 CN CN202080016998.8A patent/CN113490765A/en active Pending
- 2020-03-03 US US16/808,046 patent/US11111582B2/en active Active
- 2020-03-06 TW TW109107436A patent/TWI816990B/en active
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