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JPS6246292Y2 - - Google Patents

Info

Publication number
JPS6246292Y2
JPS6246292Y2 JP583179U JP583179U JPS6246292Y2 JP S6246292 Y2 JPS6246292 Y2 JP S6246292Y2 JP 583179 U JP583179 U JP 583179U JP 583179 U JP583179 U JP 583179U JP S6246292 Y2 JPS6246292 Y2 JP S6246292Y2
Authority
JP
Japan
Prior art keywords
light
emitting
light emitting
display device
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP583179U
Other languages
Japanese (ja)
Other versions
JPS55105968U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP583179U priority Critical patent/JPS6246292Y2/ja
Publication of JPS55105968U publication Critical patent/JPS55105968U/ja
Application granted granted Critical
Publication of JPS6246292Y2 publication Critical patent/JPS6246292Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Description

【考案の詳細な説明】 本考案は発光ダイオード(LED)を光源とす
る発光表示装置に関するものである。
[Detailed Description of the Invention] The present invention relates to a light emitting display device using a light emitting diode (LED) as a light source.

従来、この種の発光表示装置としては、第1図
に示すように、LEDチツプ44を取り付けた発
光体45を、例えばエポキシ樹脂からなる集光体
46の凹部47に嵌め込んで接着一体化したもの
が提供されている。
Conventionally, as shown in FIG. 1, in this type of light emitting display device, a light emitting body 45 to which an LED chip 44 is attached is fitted into a recess 47 of a condensing body 46 made of, for example, epoxy resin and bonded together. things are provided.

ところが、このものでは発光体45と集光体4
6とを接着剤を用いて接着するとき、その境界面
の空気が逃げ場を失い、そのために気泡が発生
し、発光面48全体の輝度が低下するという欠点
がある。この気泡は発光体45と集光体46との
間の接着層が薄ければ薄いほど拡大する傾向があ
る。
However, in this case, the light emitter 45 and the condenser 4
6 using an adhesive, there is a drawback that air at the interface has nowhere to escape, resulting in the generation of air bubbles and a reduction in the brightness of the entire light emitting surface 48. The bubbles tend to expand as the adhesive layer between the light emitter 45 and the light collector 46 becomes thinner.

また、集光体46として熱硬化性のエポキシ樹
脂を使用すると、成形時間が長くかかりコスト高
になるという欠点がある。
Further, when a thermosetting epoxy resin is used as the light condenser 46, there is a drawback that the molding time is long and the cost is high.

そこで、熱可塑性のアクリル樹脂を使用する
と、成形時間が短縮されるものの、発光面48の
中央部に“ひけ”が生じ、この“ひけ”のために
発光面48の周縁部が暗くなるという欠点があ
る。
Therefore, when thermoplastic acrylic resin is used, the molding time is shortened, but it has the drawback that "sink" occurs in the center of the light emitting surface 48, and the peripheral part of the light emitting surface 48 becomes dark due to this "sink". There is.

本考案は上記従来の欠点に鑑みてなされたもの
で、発光面全体の輝度の低下を抑制するととも
に、生産性をあげるため、熱可塑性の樹脂を使用
しても発光面の周縁部が暗くなることのない発光
表示装置を提供することを目的とする。
The present invention was developed in view of the above-mentioned drawbacks of the conventional light emitting surface, and in order to suppress the decrease in brightness of the entire light emitting surface and increase productivity, even if thermoplastic resin is used, the periphery of the light emitting surface remains dark. The purpose of the present invention is to provide a light-emitting display device with no problems.

以下、本考案の実施例を添付図面にしたがつて
説明する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

第2図は、この考案にかかる発光表示装置を用
いた照光式押釦スイツチを分解して示したもの
で、これは概略としてケースと、このケースの上
部に引き抜き可能に装着される操作部と、このケ
ースの下部に固着されるスイツチ部とに大別され
る。
FIG. 2 shows an exploded view of an illuminated push button switch using a light emitting display device according to the present invention, which roughly consists of a case, an operating section removably attached to the top of the case, and It is roughly divided into a switch part that is fixed to the lower part of the case.

ケース1は合成樹脂からなり、取付基板上に表
出するフランジを前端に有する四角筒状をなし、
またその側面には取付用板ばね2,2が装着され
ている。
The case 1 is made of synthetic resin and has a square cylindrical shape with a flange exposed on the mounting board at the front end.
Furthermore, mounting leaf springs 2, 2 are attached to the side surfaces thereof.

スイツチ部は2つの接点機構をオルタネイトあ
るいはモーメンタリ方式で動作させるタイプのも
ので、3,3は各接点に連続する常閉端子,常開
端子および共通端子が圧入された端子台、4,4
は上記端子台3,3に組み込まれる可動接点片、
5は上記可動接点片4,4を動作させる操作片
で、この操作片5は両側へ突出する支点が上記端
子台3,3に穿設された凹部に嵌合して回動可能
に支持されるとともに、先端の突起と上記可動接
点片4,4との間にコイルスプリング6,6が張
設されており、上記突起が押圧されると、上記可
動接点片4,4がスナツプアクシヨンする(第3
図参照)。
The switch part is of a type that operates two contact mechanisms in an alternate or momentary manner. 3, 3 is a terminal block in which a normally closed terminal, a normally open terminal, and a common terminal are press-fitted into each contact; 4, 4
is a movable contact piece incorporated into the terminal blocks 3, 3,
Reference numeral 5 denotes an operating piece for operating the movable contact pieces 4, 4, and this operating piece 5 is rotatably supported by a fulcrum protruding to both sides that fits into a recess formed in the terminal blocks 3, 3. At the same time, coil springs 6, 6 are stretched between the protrusion at the tip and the movable contact pieces 4, 4, and when the protrusion is pressed, the movable contact pieces 4, 4 engage in snap action. (3rd
(see figure).

7は後述する発光表示装置に接続する端子が圧
入されたLED端子台で、このLED端子台7は上
端がL字状に折曲形成されてスイツチ部上面を覆
う平面部をなす一方、その平面部の中央には上方
に向けてばね性を付与された接触片8が配置さ
れ、かつ、一側にはくの字状をなして内側に向け
ばね性を有する接触片9が立設されている。10
は上記ケース1の内側面に設けられたガイド(図
示せず)に沿つて上下動する摺動片で、その側面
にはオルタネイト機構用のカム溝が形成されてい
る。上記端子台3,3およびLED端子台7はそ
の側面に設けられた突起および凹部を互いに嵌合
して密着し、またLED端子台7の平面部の切欠
に摺動片10が支持されてスイツチ部を形成し、
このスイツチ部がケース1の下方より挿入され、
かつケース1内の突起(図示せず)と端子台側面
が係合してケース1下部に固定されている。な
お、11はオルタネイト機構用のばねで、その先
端が上記カム溝を移動することによつてオルタネ
イト方式となり、また、このばねを取り除けばモ
ーメンタリ方式となつて、いずれかの方式を選択
使用することができる。
Reference numeral 7 denotes an LED terminal block into which terminals to be connected to a light emitting display device (to be described later) are press-fitted. A contact piece 8 with spring properties is placed in the center of the part, and a contact piece 9 with spring properties is placed on one side in a dogleg shape and has spring properties. There is. 10
is a sliding piece that moves up and down along a guide (not shown) provided on the inner surface of the case 1, and a cam groove for an alternate mechanism is formed on the side surface. The terminal blocks 3, 3 and the LED terminal block 7 are brought into close contact with each other by fitting the protrusions and recesses provided on the side surfaces thereof, and the sliding piece 10 is supported in the cutout of the flat part of the LED terminal block 7, so that the switch can be operated. forming a section;
This switch part is inserted from the bottom of the case 1,
In addition, a protrusion (not shown) inside the case 1 and a side surface of the terminal block are engaged with each other and fixed to the lower part of the case 1. Reference numeral 11 is a spring for the alternate mechanism, and when its tip moves through the cam groove, it becomes an alternate system, and if this spring is removed, it becomes a momentary system, and you can select and use either system. I can do it.

操作部において、押釦12は白色透光性樹脂に
より成形され、必要に応じてその表面に文字を書
き込むことができるもので、その二側面からは、
後述するLEDホルダのガイド凹部を挾んでこれ
に保持されるとともに、一定距離摺動可能にガイ
ドされる脚片13,13が垂下し、また一側面に
は上記摺動片10の上端に当接する突起14が形
成されている。
In the operation section, the push button 12 is molded from a white translucent resin, and characters can be written on its surface if necessary, and from its two sides,
The leg pieces 13, 13 are held by sandwiching the guide recess of the LED holder, which will be described later, and are guided so as to be able to slide for a certain distance. A protrusion 14 is formed.

15は発光体16と集光体39とからなる発光
表示装置(第5図〜第7図参照)である。発光体
16は、第8図に示すごとく略円環状リード17
を有するリードフレーム43の各リードに各1個
ずつ計4個のLEDチツプ32と抵抗体33とを
取り付け、これらをワイヤ34にて配線するとと
もに、エポキシ樹脂にて一体に低圧成形し、この
後一点鎖線Aで保持片35を含んでフレーム43
を切り落としたものである。第8図はLEDチツ
プ32と抵抗体33が第11図イで示すように接
続された5V用の場合を示し、第9図,第10図
はそれぞれ第11図ロ,ハで示すように接続され
たもので、各々15V用,24V用の場合である。す
なわち、配線および切断位置を適宜変更するだけ
でリードフレームを共用することができるように
なつている。なお、24V用の場合は抵抗体33が
不要である。この低抗体33は、各LEDチツプ
32への電流配分がアンバランスにならないよう
に設けられたもので、発光状態の変動をなくし、
かつ、電流集中に基づく熱暴走による破壊を防止
するものである。上記リードフレームの円環状リ
ード17は放熱板としての機能を有する。円環状
リードから外方に延びる2本の端子36,37に
ついては、第5図から第7図に示すように、一方
の端子36は巾広で、先端に係合孔38を有し、
下方に折曲され、他方の端子37は一旦横方向に
延長し、先端部が下方に折曲される。集光体39
は透明な、例えば、アクリル樹脂等の熱可塑性樹
脂からなり、下部が下方に向かつて小径となつた
円錐面39aで、上端発光面40が四角形形状と
なつている。集光体39の中央には上下に貫通
し、かつ、上方に至るに従い漸次小径な貫通孔4
1が設けられており、この貫通孔41の底部に上
記発光体16の上部を密着嵌合させ、貫通孔41
内に透明な溶融樹脂42を注入して固化させるこ
とにより、発光体16と集光体39とを容易に、
かつ、正確に一体化するようになつている。発光
体16は貫通孔41を通じて外気と連通している
ため、樹脂注入により貫通孔内の空気は上方に無
理なく押し出され、気泡が発生せず、かつ、集光
体39の円錐面39aを反射体として上面全体を
発光表示部としてある。なお、上記溶融樹脂42
としてはエポキシ樹脂のほかアクリル樹脂でもよ
い。上記のごとく発光表示装置15を形成した状
態において、LEDチツプ32は発光面40の対
角線上に現れ、LEDチツプ32が発光したとき
集光体39の上面である発光面40が均一な輝度
を有するようになつている。
Reference numeral 15 denotes a light emitting display device (see FIGS. 5 to 7) comprising a light emitter 16 and a condenser 39. The light emitting body 16 has a substantially annular lead 17 as shown in FIG.
A total of four LED chips 32 and a resistor 33 are attached to each lead of the lead frame 43, which is wired with a wire 34, and is integrally molded with epoxy resin at low pressure. Frame 43 including holding piece 35 along dashed line A
It is cut off. Figure 8 shows the case for 5V where the LED chip 32 and resistor 33 are connected as shown in Figure 11 A, and Figures 9 and 10 are connected as shown in Figure 11 B and C, respectively. These are for 15V and 24V, respectively. In other words, the lead frame can be shared by simply changing the wiring and cutting positions as appropriate. Note that in the case of 24V, the resistor 33 is not necessary. This low antibody 33 is provided so that the current distribution to each LED chip 32 does not become unbalanced, and eliminates fluctuations in the light emission state.
In addition, it prevents damage caused by thermal runaway due to current concentration. The annular lead 17 of the lead frame has a function as a heat sink. Regarding the two terminals 36 and 37 extending outward from the annular lead, as shown in FIGS. 5 to 7, one terminal 36 is wide and has an engagement hole 38 at the tip,
The terminal 37 is bent downward, and the other terminal 37 is once extended in the lateral direction, and its tip is bent downward. Light collector 39
is made of a transparent thermoplastic resin such as acrylic resin, has a conical surface 39a whose lower part is downwardly tapered, and whose upper end light emitting surface 40 has a rectangular shape. A through hole 4 is formed in the center of the condenser 39, passing through it vertically and gradually becoming smaller in diameter as it goes upward.
1 is provided, and the upper part of the light emitting body 16 is tightly fitted into the bottom of the through hole 41.
By injecting transparent molten resin 42 into the interior and solidifying it, the light emitting body 16 and the light condensing body 39 can be easily connected.
And they are becoming more accurately integrated. Since the light emitting body 16 communicates with the outside air through the through hole 41, the air inside the through hole is pushed upwards by resin injection without any force, bubbles are not generated, and the conical surface 39a of the light collector 39 is reflected. The entire upper surface is used as a light emitting display section. Note that the molten resin 42
In addition to epoxy resin, acrylic resin may also be used. In the state in which the light emitting display device 15 is formed as described above, the LED chips 32 appear diagonally on the light emitting surface 40, and when the LED chips 32 emit light, the light emitting surface 40, which is the upper surface of the condenser 39, has uniform brightness. It's becoming like that.

第2図において、18は上記発光表示装置15
を保持するLEDホルダで、中央に発光表示装置
15の下部が嵌合する円筒部を有し、両側には押
釦12の脚片13,13が係合するガイド凹部1
9,19を、また対角線上の二箇所には切り込み
を設けて弾性を付与したスナツプ部20,20を
有している。また、このホルダ18には上記端子
36,37が上方から嵌入する凹部21および貫
通孔22が形成されており、凹部21の側面には
端子36の係合孔38と係合して位置決めする小
突起(図示せず)が設けられているとともに、底
面から上記の円筒部底面に貫通し、かつ後述する
接触子が係止するように段差を有した溝23が形
成されている(第3図参照)。24は上記LEDホ
ルダ18の形状に対応して略H字状をなすセラミ
ツク基板上に抵抗25およびその配線26を印刷
形成した印刷配線基板(第4図参照)で、中央部
にスリツト27が穿設されていて、接触子28が
このスリツト27を通つて上記溝23に係止する
ことによつて、上記印刷配線基板24は上記
LEDホルダ18の裏面に密着して保持される。
上記接触子28は導電性金属片からなり、基端に
抜け止め用の爪片29を有するとともに、両側へ
突出する鍔片30,30を有し、先端はL字状に
折曲されて上記接触片8に対する接触部をなして
いる。
In FIG. 2, 18 is the light emitting display device 15.
It has a cylindrical part in the center into which the lower part of the light emitting display device 15 fits, and a guide recess 1 on both sides in which the leg pieces 13 of the push button 12 engage.
9 and 19, and snap portions 20 and 20 provided with elasticity by providing notches at two diagonal locations. The holder 18 is also formed with a recess 21 and a through hole 22 into which the terminals 36 and 37 fit from above, and a small hole 22 on the side surface of the recess 21 that engages with the engagement hole 38 of the terminal 36 for positioning. A protrusion (not shown) is provided, and a groove 23 is formed which penetrates from the bottom surface to the bottom surface of the above-mentioned cylindrical portion and has a step so that a contactor, which will be described later, is engaged (see FIG. 3). reference). Reference numeral 24 denotes a printed wiring board (see FIG. 4) in which a resistor 25 and its wiring 26 are printed on a ceramic board having a substantially H shape corresponding to the shape of the LED holder 18, and a slit 27 is bored in the center. The printed wiring board 24 is connected to the groove 23 by passing through the slit 27 and engaging the contact 28 in the groove 23.
It is held in close contact with the back surface of the LED holder 18.
The contactor 28 is made of a conductive metal piece, and has a claw piece 29 at the base end to prevent it from coming off, and has collar pieces 30, 30 projecting to both sides, and the tip is bent into an L-shape. It forms a contact part for the contact piece 8.

そして、上記発光表示装置15、LEDホルダ
18、印刷配線基板24、および接触子28によ
つてLEDユニツト31が構成され、このLEDユ
ニツト31に押釦12が嵌められて操作部とな
り、さらにこれを上記のごとくスイツチ部の固着
されたケース1の上部より押し込めばケース1内
の突起とスナツプ部20,20が係合して引き抜
き可能に固定される。この時、接触片8に接触子
28に、また接触片9は端子36に接触し、一方
押釦12の突起14は摺動片10の上端に当接し
て、この照光式押釦スイツチが構成される。
The light emitting display device 15, the LED holder 18, the printed wiring board 24, and the contact 28 constitute an LED unit 31, and the push button 12 is fitted into the LED unit 31 to form an operation section, which is further described above. If the switch part is pushed in from the upper part of the case 1 to which it is fixed, the protrusions inside the case 1 and the snap parts 20, 20 will engage and be fixed in a removable manner. At this time, the contact piece 8 contacts the contactor 28, and the contact piece 9 contacts the terminal 36, while the protrusion 14 of the push button 12 contacts the upper end of the sliding piece 10, forming this illuminated push button switch. .

次に、上記LEDユニツト31の組立手順を詳
細に説明すると、LEDホルダ18の裏面に印刷
配線基板24を配置し、これのスリツト27、お
よび溝23に接触子28の貫通させれば、爪片2
9が溝23の段差によつて係止され、かつ鍔片3
0,30が印刷配線基板24を保持して、三者が
一体となる。次に発光表示装置15を、端子3
6,37が各々凹部21、貫通孔22に嵌入する
ようLEDホルダ18に差し込んで抜け止めし、
下面において端子37の先端を第4図に示すよう
に印刷配線26の一端にハンダ付けして、電気的
導通をなすとともに、発光表示装置15の保持を
なし、同時に接触子28の基部を印刷配線26の
もう一端にハンダ付けして端子37から接触子2
8へと導電がなされる。また一方の端子36はそ
のままLEDホルダ18の側面に露出して、接触
片9への接触部となる。
Next, to explain in detail the assembly procedure of the LED unit 31, the printed wiring board 24 is placed on the back side of the LED holder 18, and the contact piece 28 is passed through the slit 27 and the groove 23 of the printed wiring board 24, and then the claw piece 2
9 is locked by the step of the groove 23, and the collar piece 3
0 and 30 hold the printed wiring board 24, and the three are integrated. Next, connect the light emitting display device 15 to the terminal 3
6 and 37 are inserted into the LED holder 18 so that they fit into the recess 21 and the through hole 22, respectively, and are prevented from coming off.
On the lower surface, the tip of the terminal 37 is soldered to one end of the printed wiring 26 as shown in FIG. 4 to establish electrical continuity and to hold the light emitting display device 15. At the same time, the base of the contact 28 is soldered to one end of the printed wiring 26. Solder the other end of 26 and connect the terminal 37 to contact 2.
Conduction is made to 8. Further, one terminal 36 is exposed as it is on the side surface of the LED holder 18 and becomes a contact portion to the contact piece 9.

従つて、このLEDユニツト31の組立は、接
着剤等を用いることなく単に3箇所のハンダ付け
を行うだけでなされ、また、そのハンダ付けも、
LEDホルダ18と印刷配線基板24が既に接触
子28によつて一体化されているので容易に行え
る。しかもその接触子28は、かしめなどによつ
て形成した端子と比較して、それ自体弾性を有し
ているので接触性が良好であり、かしめのように
印刷配線基板24に圧力を加えないので、基板2
4が割れるおそれもない。
Therefore, this LED unit 31 can be assembled by simply soldering at three points without using adhesive or the like, and the soldering is also simple.
Since the LED holder 18 and the printed wiring board 24 are already integrated by the contacts 28, this can be done easily. Furthermore, compared to terminals formed by caulking or the like, the contact 28 itself has elasticity and has good contact properties, and does not apply pressure to the printed wiring board 24 unlike caulking. , substrate 2
There is no fear that 4 will break.

そして、発光色を変更する必要がある場合に
は、押釦12を前方より引き抜き、脚片13,1
3に挾持されて同時に引き抜かれるLEDユニツ
ト31を他色のLEDユニツト31と交換すれば
よく、発光表示装置15の電流特性が違つていて
も、それに適した印刷抵抗25が一体的に交換さ
れるので極めて簡単に行え、また従来の抵抗器に
代えて印刷抵抗25を用いたために一層の小型化
を図ることができる。
If it is necessary to change the emitting color, pull out the push button 12 from the front, and then
It is only necessary to replace the LED unit 31 that is held in the LED unit 3 and pulled out at the same time with an LED unit 31 of a different color, and even if the current characteristics of the light emitting display device 15 are different, a suitable printed resistor 25 can be replaced integrally. This can be done extremely easily, and since the printed resistor 25 is used in place of the conventional resistor, further miniaturization can be achieved.

第12図は本考案にかかる発光表示装置の他の
実施例を示し、集光体39に上端が大きく開口し
た貫通孔41を設け、この貫通孔41に溶融樹脂
42を充填して固化させたものである。この場
合、溶融樹脂42が固化して形成される発光面4
0は極めて平滑となり、発光面40の輝度の均一
化がさらに向上する。
FIG. 12 shows another embodiment of the light emitting display device according to the present invention, in which a through hole 41 with a large upper end is provided in the condenser 39, and a molten resin 42 is filled in the through hole 41 and solidified. It is something. In this case, the light emitting surface 4 formed by solidifying the molten resin 42
0 is extremely smooth, and the uniformity of the brightness of the light emitting surface 40 is further improved.

また、上記両実施例において、発光体16の上
面に予め拡散層を設けておいてもよく、この拡散
層によつて光が拡散され、集光体39との相乗作
用によつて発光面40の発光状態が更に向上す
る。さらに、上記の説明ではコストの面から集光
体として熱可塑性樹脂を用いた場合を説明した
が、熱可塑性樹脂にも適用できるのはいうまでも
ない。
Furthermore, in both of the above embodiments, a diffusion layer may be provided in advance on the upper surface of the light emitting body 16, and the light is diffused by this diffusion layer, and synergistically with the light condensing body 39, the light emitting surface 40 The light emitting state of the light is further improved. Further, in the above explanation, a case where thermoplastic resin was used as the light condenser was explained from the viewpoint of cost, but it goes without saying that thermoplastic resin can also be applied.

以上の説明から明らかなように、本考案によれ
ば、透明樹脂からなる集光体の下部を、下方に向
かつて小径となつた円錐面とする一方、集光体に
上下に貫通する貫通孔を設け、貫通孔の底部に発
光体を密着嵌合させるとともに、貫通孔内に溶融
樹脂を流し込んで集光体と発光体とを一体化する
ようにしたので、集光体と発光体との位置決めが
容易であるばかりか、集光体に熱可塑性樹脂を使
用でき、成形時間は短縮されてコストの低減を図
ることができるとともに、発光面の“ひけ”は上
記貫通孔に吸収されてほとんど発生せず、発光面
の周縁部が暗くなることがない。また、溶融樹脂
は貫通孔内に注入されるため、貫通孔内の空気は
外部に押し出され気泡が発生せず、たとえ気泡が
発生しても拡大することがない。したがつて、気
泡による悪影響はほとんどなく、かつ集光体は透
明体であり、その下部外面の円錐面を反射面とし
て機能すること、発光体が貫通孔に密着嵌合し
て、光の横方向への漏れがないことおよび上記気
泡がないことと相まつて集光体上面の発光表示部
の輝度を従来のものより向上させることができ
る。
As is clear from the above explanation, according to the present invention, the lower part of the light condenser made of transparent resin is formed into a conical surface that becomes smaller in diameter toward the bottom, and the through hole passes vertically through the light condenser. The light-emitting body is closely fitted to the bottom of the through-hole, and molten resin is poured into the through-hole to integrate the light-concentrating body and the light-emitting body. Not only is positioning easy, thermoplastic resin can be used for the light concentrator, molding time is shortened and costs can be reduced, and the "sink" on the light emitting surface is absorbed by the above-mentioned through hole, making it possible to reduce costs. This does not occur, and the peripheral edge of the light emitting surface does not become dark. Furthermore, since the molten resin is injected into the through-hole, the air within the through-hole is pushed out and no bubbles are generated, and even if bubbles are generated, they do not expand. Therefore, there is almost no negative effect due to air bubbles, the condensing body is a transparent body, the conical surface on the lower outer surface functions as a reflecting surface, and the light emitting body is tightly fitted into the through hole, allowing the light to flow horizontally. In combination with the absence of directional leakage and the absence of the above-mentioned bubbles, the brightness of the light emitting display section on the upper surface of the condenser can be improved compared to the conventional one.

さらに、集光体と発光体とは別部材であるた
め、貫通孔下部形状が一定であれば、ケース等の
形状変更により集光体の形状が変わつても共通の
発光体を使用でき、それだけ生産性を高めること
ができる。
Furthermore, since the light condenser and light emitter are separate members, as long as the shape of the lower part of the through hole is constant, even if the shape of the light condenser changes due to changes in the shape of the case, etc., a common light emitter can be used. Productivity can be increased.

さらにまた、上記のように、集光体と発光体と
を一体化するにあたり、容易に位置決めができる
ため、集光性能を均一のものとすることができ
る。
Furthermore, as described above, when integrating the light condensing body and the light emitting body, positioning can be easily performed, so that the light condensing performance can be made uniform.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の発光表示装置の分解図、第2図
以下は本考案を示し、第2図は本考案にかかる発
光表示装置を用いた照光式押釦スイツチの分解斜
視図、第3図はその縦断面図、第4図はLEDユ
ニツトの裏面を示す拡大図、第5図は発光表示装
置の正面図、第6図は第5図の−線断面図、
第7図は第5図の−線断面図、第8図,第9
図,第10図はそれぞれ5V用,12V用および24V
用のリードとリードフレームの平面図、第11図
イ,ロ,ハはそれぞれ5V用,12V用および24V用
の結線図、第12図は発光表示装置の他の実施例
の断面図である。 15……発光表示装置、16……発光体、17
……リード、32……LEDチツプ、33……抵
抗体、34……ワイヤ、36,37……端子、3
9……集光体、39a……円錐面、40……発光
面、41……貫通孔、42……溶融樹脂、43…
…リードフレーム。
Fig. 1 is an exploded view of a conventional light emitting display device, Fig. 2 and the following shows the present invention, Fig. 2 is an exploded perspective view of an illuminated push button switch using the light emitting display device according to the present invention, and Fig. 3 is an exploded view of a light emitting display device according to the present invention. 4 is an enlarged view showing the back side of the LED unit, FIG. 5 is a front view of the light emitting display device, and FIG. 6 is a sectional view taken along the line - in FIG. 5.
Figure 7 is a - line sectional view of Figure 5, Figures 8 and 9.
Figure and Figure 10 are for 5V, 12V and 24V, respectively.
11A, 11B and 11C are connection diagrams for 5V, 12V and 24V, respectively, and FIG. 12 is a sectional view of another embodiment of the light emitting display device. 15...Light-emitting display device, 16...Light-emitting body, 17
... Lead, 32 ... LED chip, 33 ... Resistor, 34 ... Wire, 36, 37 ... Terminal, 3
9... Light collector, 39a... Conical surface, 40... Light emitting surface, 41... Through hole, 42... Molten resin, 43...
…Lead frame.

Claims (1)

【実用新案登録請求の範囲】 (1) リードに載置された発光素子チツプを有する
発光体と、上面に発光面を有し、発光体からの
光を発光面に集光する集光体とからなる発光表
示装置において、上記集光体を透明樹脂で構成
し、かつ、下部が下方に向かつて小径となつた
円錐面とするとともに、この集光体に上下に貫
通する貫通孔を設け、貫通孔の底部に上記発光
体の発光部を密着嵌合させた状態で上記貫通孔
内に透明な溶融樹脂を充填して発光体と集光体
とを一体化してなる発光表示装置。 (2) 上記集光体の発光面を四角形形状とし、4個
の発光素子チツプを発光面の対角線上に現れる
ように配置したことを特徴とする実用新案登録
請求の範囲第1項記載の発光表示装置。 (3) 複数の発光素子チツプが載置されたリードと
一体に、上記チツプを取り囲むように略円環状
のリードを設け、上記チツプを適宜配線し、か
つ、上記各部品を一体にモールドすることによ
り発光体を構成したことを特徴とする実用新案
登録請求の範囲第1項又は第2項記載の発光表
示装置。 (4) 上記リードの外方に巾広な端子を一体に延在
させ、該端子を下方に折曲してその側面を外部
導電部材との接触部としたことを特徴とする実
用新案登録請求の範囲第1項ないし第3項のい
ずれかに記載の発光表示装置。
[Claims for Utility Model Registration] (1) A light-emitting body having a light-emitting element chip mounted on a lead, and a light-emitting body having a light-emitting surface on the upper surface and concentrating light from the light-emitting body on the light-emitting surface. In the light emitting display device, the light condenser is made of a transparent resin, and has a conical surface with a lower part facing downward and becoming smaller in diameter, and a through hole is provided in the light condenser that passes vertically, A light-emitting display device in which a light-emitting portion of the light-emitting body is closely fitted into the bottom of the through-hole, and a transparent molten resin is filled in the through-hole to integrate the light-emitting body and the condenser. (2) The light emitting device according to claim 1 of the utility model registration claim, characterized in that the light emitting surface of the light condenser has a rectangular shape, and four light emitting element chips are arranged so as to appear diagonally on the light emitting surface. Display device. (3) A substantially annular lead is provided integrally with the lead on which a plurality of light emitting element chips are mounted so as to surround the chip, the chips are appropriately wired, and each of the above components is integrally molded. A light-emitting display device according to claim 1 or 2, characterized in that a light-emitting body is constructed by: (4) A request for registration of a utility model characterized in that a wide terminal is integrally extended to the outside of the lead, and the terminal is bent downward so that its side surface is used as a contact portion with an external conductive member. The light emitting display device according to any one of items 1 to 3.
JP583179U 1979-01-19 1979-01-19 Expired JPS6246292Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP583179U JPS6246292Y2 (en) 1979-01-19 1979-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP583179U JPS6246292Y2 (en) 1979-01-19 1979-01-19

Publications (2)

Publication Number Publication Date
JPS55105968U JPS55105968U (en) 1980-07-24
JPS6246292Y2 true JPS6246292Y2 (en) 1987-12-12

Family

ID=28812059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP583179U Expired JPS6246292Y2 (en) 1979-01-19 1979-01-19

Country Status (1)

Country Link
JP (1) JPS6246292Y2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642564B2 (en) * 1983-02-15 1994-06-01 日本デンヨ−株式会社 LED lamp
JP2642618B2 (en) * 1986-03-06 1997-08-20 富士電機株式会社 Indicator light device
JP2003158302A (en) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd Light emitting diode
EP1453107A4 (en) * 2001-11-16 2008-12-03 Toyoda Gosei Kk Light-emitting diode, led light, and light apparatus
JP4816707B2 (en) * 2002-03-20 2011-11-16 豊田合成株式会社 Light emitter and automobile backlight
KR100828891B1 (en) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 LED Package
JP6693044B2 (en) * 2015-03-13 2020-05-13 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP7007606B2 (en) * 2020-04-15 2022-01-24 日亜化学工業株式会社 Light emitting device and its manufacturing method

Also Published As

Publication number Publication date
JPS55105968U (en) 1980-07-24

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