JPS6174205A - Anisotropically electroconductive composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention is applicable to connections between circuits of a printed circuit, or between one detecting section and a control section of a printed circuit, as well as a connector. 19 relates to a crude product for conductive electrodes.

(Next technology) Recently, as the connectors used for connecting parts related to printed circuits have become smaller and the number of terminals has increased, it has become impossible to connect by soldering or caulking to take out the terminals. Connectors with gold-plated stainless steel wire embedded in silicone rubber, elastomer connectors made of multiple layers of conductors and insulating plates, connectors with many parallel printed conductors rolled into a pipe shape, anisotropically conductive pressure-sensitive rubber A connector using a sheet or the like is used. Among these, an anisotropically conductive pressure-sensitive rubber sheet is a rubber sheet containing a certain amount of conductive fine particles, and is used by connecting two circuits having parallel conductors, such as printed circuits. It is attracting attention as a connector that is conductive in the direction of thickness and insulating in the direction perpendicular to the thickness.

However, conventional connectors like this are made by mixing metal powder with a certain particle size (about 1 μm) in plastic and roll-forming it into a sheet. Due to the limits of conductivity due to the thickness of the roll-formed sheet and the amount of metal powder mixed in, it was expected that the thickness would be less than a certain level, and the appearance of a paint type product with extremely thin scratches was eagerly awaited.

An example of this type of paint is Tokuko Showa 5tsu-1 2179.
The number etc. are known. However, the technology disclosed in this specification uses conductive fine particles having a normal shape, and even if a compound containing the conductive particles is interposed between electrical members by applying pressure, the conductive anisotropy can be effectively achieved. can't keep it.

The inventor of the present invention conducted intensive research to solve these problems, and as a result, the inventor found that the product has a large number of protrusions and a size of ¥1. By using two types of conductive particles and using a hot melt resin (thermoplastic resin) and a printing solvent as binders, we have created a conductive composition that exhibits extremely effective anisotropy when applied as a paint. A patent application was filed for the product (Japanese Patent Application No. 58-227057).

(Object of the Invention) However, since the above-mentioned anisotropically conductive composition according to the inventor's earlier application uses a hot melt resin as a binder, it has poor heat resistance and adhesive strength.

There were always problems with solubility, which limited its use.

The purpose of the present invention is to obtain anisotropic conductivity by using two types of conductive particles, large and small, and selecting the type of resin that will serve as the binder, as in the previous application, and to create a composition with improved characteristics as described above. It's all about providing.

(Structure of the Invention) The present inventor solves the problems of the anisotropically conductive composition according to the prior application by using a thermosetting resin in whole or in part instead of a hot melt resin as a binder. The present invention has been particularly successful in that the conductive particles having a particle size of 0.5 μm or less 0.2 to 1% 1 particle size 1.01 i
2J conductive element having a large number of protrusions of 10 to 75%.

A solid component consisting of 30 to 80% by weight of a thermosetting resin composition soluble in a printing solvent and 0 to 70% by weight of a juvenile resin insoluble in a printing solvent, and blended so that the total amount is 100% by weight. It is an anisotropically conductive composition consisting of an appropriate amount of a printing solvent and a suitable amount of a printing solvent.

Carbon black and graphite are generally used as conductive particles with a particle size of 0.5 μm or less, but chemical j?
Metal powders such as colloidal gold, platinum, rhodium, ruthenium, palladium, and iridium, which can be produced by pyrolytic vapor deposition, or colloidal titanium are also used.

Particles and conductive particles having a large number of protrusions with a particle diameter of 1.0 μm or more include metal particles such as nickel, cobalt, iron, etc., which are characterized by the manufacturing method and are produced by the carbonyl method, or by the atomization method or the stamp method. Metal particles such as alloys, resistant materials, nitrides, carbides, borides as abrasive grains, such as Al 203, Si 02
, SiC.

Pigment particles such as WC, Ta c, and Si 3 Na are plated with highly conductive metals such as nickel, copper, silver, gold, platinum, rhodium, ruthenium, osmium, and palladium.
Examples include m-sized particles.

As mentioned above, conductive particles with a particle diameter of 0.5 mμ or less have a diameter of 0.5 mμ or less.
2-201 fH%, preferably 1-15% ω content
To FJ! However, below this range, the conductivity is insufficient, and beyond this range, the insulation in the required direction decreases, the adhesive strength decreases, and the seal resistance value becomes large, and the variation in the resistance (direction) is reduced. Such a particle size of 0.5μ
Examples of conductive fine particles smaller than m! The resistance value when mixed on one finger is as follows.

Table 1 Conductive substances with a particle size of 1.0 μm or more and many protrusions on the surface are coarse particles commonly referred to as abrasive particles. is large and the variation is large, 75! rim
%, the adhesive strength will be weak and it will be difficult to form a practical coating film. The characteristics of particles (examples of conductive particles of ¥1.0 μm or more) are as follows.

Table 2 In this case, if the particle size is increased, printability deteriorates, but the bonding resistance between the electrodes is small, and it is possible to make a material with a small change over time. In addition, when using these particles, conductive particles with a particle size of 1.0 μm or more, the specific particles should be selected in the gap between the circuits.

Thickness of anisotropically conductive composition film, adhesive strength, opposing ′c
It is determined by taking into consideration characteristics such as the resistance value between t2 electrodes and the resistance value between adjacent electrodes, the method of forming the conductive film, and the method of thermocompression bonding.

The thermosetting resin used as the binder used in the present invention has a melting point of 50 to 150°C and a gelation time of 1 second to 30 minutes at 170°C, preferably 5 seconds to 2 minutes.
For example, epoxy resins, unsaturated polyester resins, phenol resins, melamine resins, thermosetting acrylic resins, diallyl phthalate resins, urethane resins, or modified resins thereof may be used alone or as a mixture. In addition, reactive monomers, curing agents, catalysts, curing accelerators, and the like are used to harden the thermosetting resin. Other additives include rosin derivatives, tackifying agents such as terpene resins, cyclohexane, ethyl cellosolve, benzyl alcohol, diacetone alcohol, terpineol, and other solvents that can be dried to the touch at temperatures below the curing temperature of the resin. A flexibility imparting agent, a flame resistance imparting agent, a flame resistance aid, etc. are used as necessary. The above-mentioned epoxy resins include bisphenol A type, F type, hydrogenated bisphenol A type, and tetrabromobisphenol A type.

Phenol novolac type, brominated phenol novolac type, cresol novolac type, glycidyl 7mine type, hydantoin type, triglycidyl isocyanurate, ■
Examples include type 1.

Examples of the curing agent include aliphatic amines such as diethylenetriamine, metaxylylene diamine, and polyamide resins, and cycloaliphatic amines such as paramenthanediamine and 2-ethyl-4-methylimidazole.

Aromatic f! such as meta-phenylenediamine, 4-4'-diaminodiphenylmethane, etc. 1fQX amine, phthalic anhydride,
Nazikll! Acid anhydrides such as anhydrides, tertiary amines, boronic trifluoride-7noethylamine, dicyandiamide, molecular sieve curing agents.

? A latent curing agent such as a microcapsule curing agent is used. A cationic polymerization type Lewis acid catalyst can also be used.

Unsaturated polyester resins include unsaturated dibasic acids such as maleic anhydride, fumaric acid, itaconic acid, citraconic acid, glutamic acid, mesaconic acid, etc., and saturated dibasic acids such as succinic acid and glutaric acid. Acid, adipic acid, l:7 aliphatic dicarboxylic acid such as bacic acid, dodecanedicarboxylic acid, one or more of the following: terephthalic acid, isophthalic acid, orthophthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, glycol component: Ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol.

One or more of 1.3-butylene glycol, 2.3-butylene glycol, neopentyl glycol, hexylene glycol, octylene glycol, bisphenol A, hydrogenated sphenol A, and styrene as the crosslinking monomer. , divinylbenzene, diallyl phthalate,
One or more of triallyl cyanurate, (meth)acrylic acid and its alkyl ester, acrylonitrile, vinyl acetate, acryl 7mide, etc. are used. Common curing catalysts include peroxides such as benzoyl peroxide, methyl ethyl ketone peroxide,
Tertiary-butyl perbenzoate and the like are used.

In addition, accelerators such as cobalt naphthenate and cobalt oxylate, and polymerization inhibitors such as hydroquinone may be added as necessary.

As the phenol resin, a resol resin obtained by reacting phenol and formalin in the presence of an alkali catalyst or a novolak resin obtained in the presence of an acid catalyst are used.

Melamine resin is made of melamine and formalin.
A liquid or a-terminal resin obtained by heating reaction at a temperature of 17 or more is used.

The diallyl phthalate resin includes a prepolymer produced from diallyl orthophthalate, diallyl isophthalate, diallyl terephthalate, etc. alone or in a mixture, or a vinyl monomer copolymerizable with the diallyl phthalate.

Brepoly 7- copolymerized with an allyl monomer or the like is used.

As the urethane resin, a molecule m2000 to 4000 obtained by reacting polyisocyanate with polyglycol or a polyester polyol containing hydroxyl groups at both ends is used.
A prepolymer having isocyanate groups at both ends or two or more as a crosslinking agent, polyethylene glycol,
Or polyester or polyamine having hydroxyl groups at both ends.

It is used by adding a compound having two or more active hydrogens such as polycarboxylic acid.

Examples of polyisocyanates include tolylene diisocyanate, 3,3'-1-lylene-4,4' diisocyanate, diphenylmethane 4,4'-diisocyanate, triphenylmethane pp'l)''-triisocyanate, 2,4-tolylene dimer. .

Naphthalene-1,5-diisocyanate, tris(4-
phenyl isocyanate) thiophosphate, tolylene diisocyanate trimer, dicyclohexamethane 4,4
′ -diisocyanate.

Meta-xylene diisocyanate, hexahydrometa-xylene diisocyanate, hexamethylene diisocyanate, trimethylpropane-1-methyl-2-isocyano-4-carbamate, polymethylene polyphenylisocyanate.

Examples include 3.3'-dimethoxy4.4'-Schiff I diisocyanate, which has hydroxyl groups at both ends of the molecule.
Polyisocyanate 1- may be added to polyester polyol, polyether polyol, etc. to be used.

Examples of thermosetting acrylic resins include acrylic resins into which two or more carboxylic acid groups or their anhydrides, epoxy groups, amino groups, and other polymerizable functional groups are introduced.
What is necessary is to add an appropriate curing agent to each functional group and heat curing.

For flexible terminal connections, the above resins cannot satisfy the adhesive strength, but thermoplastic resins and elastomer resins are blended to improve the impact resistance, flexibility, and initial adhesive strength of thermosetting resins. Composite thermosetting resins may also be used. Examples of such resins include phenol polyvinyl acetal resin, phenol-synthetic rubber, epoxy-nylon, epoxy-nitrile rubber, and epoxy-polybutene.

In addition, in the present invention, a silent powder resin is added to the printing solvent from θ to 7
0 weight percent is used, and blending this resin in a specified manner is because anisotropic conductive ink requires a certain amount of pigment from the viewpoint of printability, for reasons explained later. If mixed in, the adhesive force will be reduced, and conductive pigments will reduce the insulation, so a solvent-insoluble powder resin can be used as a substitute for the same pigment without reducing the adhesive force. The particle size is 70 .mu.m or less, which is the size that passes through the screen, and preferably in the range of 2 to 10 .mu.m, and a thermoplastic resin or thermosetting resin that does not dissolve or swell in a solvent is used.

By mixing these powder resins, air bubbles during printing, which improve printability, can be eliminated, adhesive strength can be increased, and seal resistance can be reduced. For example, nylon 12 (product name T
450P-L (Daicel Chemical Industries, Ltd.) is used as such a resin, and saturated polyester (trade name: Vylon G) is also used as such a resin.
M-900, Toyobo Teisha), epoxy resin (trade name: TEPIG, Nissan Chemical Co., Ltd.), polyurethane resin (trade name: Eurobolymer 200, Nomura Office), and the like.

An example of applying the composition according to the present invention between conductors such as a printed circuit is shown in FIG. 1 and FIG. 2. First, connect multiple parallel conductors to the surface of the insulating film F + B + CI
If the composition of the present invention is screen printed on the conductive particles of 1.0 μm or more [0.5 between 1
PP electrically conductive particles of .mu.m or less are mixed together, and these particles are coated with thermosetting resin silk composition H as a binder.

A similar substrate, that is, a substrate with a plurality of parallel conductors Δ2, B2, and C2 on an insulating film F, is connected to the parallel conductor A.
+ B + CI When placed opposite each other, A
There is conductive contact between lA2, Bl 82, and C+02, and AI A2 and Bl 82.

8182 and C+0217! ] indicates anisotropic conductivity of 8 in terms of insulation.

In the present invention, by using two types of electroconductive particles, large and small, it is possible to maintain constant conductivity in the thickness direction and insulation in the surface direction in the form of a coating film without variation. The reason for this is that in order for a coating film to exhibit conductivity, conductive particles must be in contact with each other, but if only small conductive particles of 0.5 μm or less are used, it is not possible to mix a large amount of conductive particles as in the past. , the content range that satisfies conductivity between opposing circuits while insulating adjacent circuits is narrow; conversely, if only one large 3JP conductive particle of 1.0μII1 or more is insulated between particles, the resistance value will decrease. However, when two types of conductive particles, large and small, are combined as in the present invention, small conductive particles are inserted between large conductive particles, making each particle electrically conductive. Since it can be connected to a

In this case, since a thermosetting resin is used, during the process of curing the resin during thermocompression bonding, the particle size is 0.5 μf between the opposing electrodes.
At IJII pressure when conductive particles of f1 or less and conductive particles of particle size 1.0 μm or more are heat-sealed, they are insulated in the planar direction by the resin in the curing process, and conductivity increases between the upper and lower opposing electrodes by applying pressure. The particles can provide electrical continuity between the conductors. That is, in this case, large-diameter conductive particles,
If there is one row, the second row will have multi-wave unevenness on the surface.
To ΔII in the figure, it is difficult to move between the electrodes 2, 8182, and CIC2, and the resin content is mainly pushed out and flows into the G part, which has a larger gap, so the resin content m in this part increases, and the gap between AlA2 and AlA2 increases.

It acts conductively between BI B2 and CI 02, and AlA2
and BI B2 , and between BI 82 and CI C2 act insulatively and exhibit anisotropic conductivity. The face 1 with abrasive grains has a movement that prevents displacement when the resin melts during heat sealing and exhibits fluidity.

FIG. 3 is a graph showing the relationship between the conductive particles' 2 m and the resistance value.

For example, ■ is when only carbon black with a particle size of 1 yen or less than 0.5 μm is blended, and for roasting, when only conductive particles with a particle size of 1 μm or more are blended. An example of the invention is shown.

Points Qe and Qc in Fig. 3 are the contents that do not exhibit conductivity due to the Hall effect or contact resistance before thermocompression bonding, and during thermocompression bonding, adjacent conductors A, B, C... Insulated, thickness direction AI A2.8+82, CI C2...
・Containing ff1PA that shows conductivity only.

Move to Pa and Pc. In the case of Fig. 3, in order to make the resistance value between A, B, C, etc. as small as possible and make it insulating, move the QA point or 08 point to the left (in other words, reduce the content of each particle). ), it is not possible to maintain the PA point or Pa point in the charged region during thermocompression bonding. On the other hand, if the QA point or 08 point is moved to the right (that is, if the content of each particle is set to dog), A
, 8. C... cannot provide sufficient insulation between them. In other words, since the range that satisfies both is narrow, slight differences in manufacturing conditions can cause defects.

Therefore, the conductive particles ``■'' and ``■'' in FIG. 3 were combined to form ``■'' in FIG. The conductive particles constituting the graph in Figure 3 (■) do not need to be carbon black as long as they exhibit colloidal conductivity, and the content of each in the anisotropic conductive composition is F5 contact conductor 171 insulation. Select the composition QA point.

Next, the conductive particles that make up the graph in Figure 3 (■) are rough conductive particles suitable as abrasive grains, including nickel powder produced by the carbonyl method, nickel alloy powder produced by the stamp method, and nickel alloy powder produced by the atomy method.

Or low grain (S! C, Al 203, WC.

S! 3N4. TaC) etc.'7 /L/, gold,
Use iF+8 or one plated with platinum group metal.

This also depends on the conductive particles, and since the content Q8 of inter-adjacent particles differs depending on the conductive particles, the appropriate value is determined by experiment.

The Qc point is estimated by combining the above QA and day 0. The state of the rIfI surface of the anisotropically conductive composition as a connector at the Qc point is as shown in Figure 1, with sufficient insulation between the adjacent connectors, and when the two connectors are aligned and thermocompressed as shown in Figure 2, the third As shown in the graph in the figure, the Qc point is determined by the conductive particle content ffiO and AI A2.8+ 82.0I 02- as the resin flows out to the G section in Figure 2 during thermocompression bonding.
The low resistance field in between moves to point Pc, and that region is definitely a conductive region. Hence the adjacent directions A, B.

C1... maintains sufficient insulation of 10VJΩ or more, and the junction resistance is 0 between AI A2.8182.0I 02...
．． 5~1.5Ω/0. It becomes IX 4ww2. Furthermore, when considering the characteristics of adhesiveness and anisotropic conductivity, there are cases where the compositional balance of conductive particles, lSl resin, and solvent as an ink is inappropriate due to the selection of resin. Generally, if the amount of conductive particles is reduced to improve adhesion, the resulting ink lacks thixotropy and tends to generate viscous bubbles, resulting in a film that is prone to pinholes. Therefore, it is preferable to use a thermosetting or thermoplastic powder resin that does not dissolve in solvents as a substitute for the conductive particles. This powder resin does not dissolve in solvents and acts as a pigment when the printed film is dry to the touch, so that the surface does not become sticky, and it melts during thermocompression bonding to improve adhesion.

The embodiments will be described below. Depending on the purpose, the anisotropically conductive composition of the present invention may be of a two-part type, in which a curing agent and catalyst are added immediately before use, or a one-part type, in which a latent curing agent is added. The thermosetting resin may be completely cured in the thermocompression bonding process, or may be temporarily bonded (semi-cured) in the thermocompression bonding process and then heated at a constant temperature S or the like to skip post-curing. In addition, if the component is not a heat-resistant component that can be placed in a constant temperature chamber, an anisotropically conductive composition is prepared in which the main component of the thermosetting resin and the curing agent catalyst are mixed separately.
It may be coated in two layers, or it may be applied separately to opposing circuit terminals, and both corrugated surfaces may be brought into close contact and cured in a short time.

(Effects of the Invention) The anisotropically conductive composition according to the present invention is a combination of two types of conductive particles, one having a small diameter of 0.5 μm or less and a large diameter of 1.0 μm or more having numerous protrusions, and a solvent-soluble or liquid thermosetting composition. By properly using two types of thermosetting resin and solvent-insoluble thermosetting or thermoplastic resin, and by combining them properly, anisotropic conduction can be achieved with sufficient insulation in the adjacent direction of the conductor and conductivity in the opposite direction during hot pressing. A sexual film is obtained.

Printing on one board that is easy to print and drying it to the touch can be used not only for circuit connectors that are to be joined, but also for passive elements of electronic components (condensers, coils).
It can be used for terminal connection of active elements (IC, diode, transistor).

Further, a tape-shaped passive element or an active element whose terminal portions are coated with ink or varnish of an anisotropically conductive composition can be bonded to the printed circuit board side. 2
Electrical objects.

To physically join them, one of the two substrates described above is used as a hot plate, and the anisotropically conductive composition is sandwiched between them and heat sealed. In other words, the weight of the part itself is used, a weight is placed on the part and the part is heat-sealed in a thermostatic oven, or the part is passed through a heat roll for sealing.

The heat source is a heating plate kept at a constant temperature, as well as electrical heating.

A hot melt bonding method such as dielectric heating or partial heating using ultrasonic waves, microwave bonding, or ultrasonic bonding method can be used as a substitute.

The application fields of connector bonding using anisotropically conductive compositions can be classified as shown in Table 3.

Table 3 In particular, since the anisotropically conductive composition of the present invention uses a thermosetting resin as a binder, the circuit shown in FIG. Direction 9 circuit The 7 separation strength in the right angle direction is 2~
The tensile shear/v point strength, heat resistance, shear resistance, and solvent resistance were also significantly improved. Examples will be described below. Note that %1 parts in the examples represent weighted %9m parts unless otherwise specified.

Example 1 10 to 20% of the conductive particles having the composition shown in Table 5 were mixed into the thermosetting resin composition shown in Table 4 to prepare an anisotropic conductive composition. Flexible copper clad board with polyester film base material (
Polyester 50μm.

Regular etching method on electrolytic copper foil (35 μm): conductor circuit width 0.5 m, distance between adjacent circuits 1. Ow, circuit length 50m
A wiring pattern consisting of 22 circuits was created, and the above anisotropically conductive composition was used for the terminals to form a wiring pattern with a width of 5 cm and a thickness of 30 μm.
The printed paper was printed on the paper and dried by heating at 120° C. for 10 minutes.

Next, the above wiring pattern was formed on a 0.8vm thick glass cloth base material and an epoxy resin single-sided copper clad board.A flexible printed wiring board on which the above anisotropically conductive composition was printed was then wired onto a printed wiring board that was also created using the same etching method. 200 according to the position
℃ and 10k11/cj for 20 seconds. Table 6 shows the characteristics of this product. Conductive particle content is 15%
Table 19 shows the performance in the case of . Note that particles with a particle size of 0.5 μm in the conductive particles accounted for 16%.

Table 4 Resin composition table 5 Conductive particle table 6 Example 2 An anisotropically conductive composition was prepared by mixing 40 to 60% of the conductive particles shown in Table 8 in the epoxy resin composition shown in Table 7 in terms of solid 9% σ. . The particle size of the conductive particles was 0.5 μl 1 LJ, and the lower particles were 4%.

Table 7 Resin composition Epoxy resin (Epototh YD-128, Takuto Kaseisha)
70 parts Table 8 Conductive particle carbon black (EC>
1 part carbon black (AB>
3. .

Nickel (#287 Nickel, Inco Co., Ltd.) 3611 nickel alloy (Fukurodai FR401, Fukuda Kinzoku Co., Ltd.)
60! ! Next, in the same manner as in Example 1, printed wiring boards were heated at 200°C using the anisotropically conductive composition.

After heating and pressing at 10 to 9/r:rj for 20 seconds,
It/Ii conversion was performed at 150° C. for 2 hours in a constant temperature chamber. Table 9 shows the characteristics of this product.

Table 9 Table 19 shows the performance when the content of conductive particles was 45%.

Example 3 Phenol resin composition 9 shown in Table 10 A printed wiring board was heated to 250° C. in the same manner as in Example 1, except that conductive particles not shown in Table 11 were used.

After heating and pressing at 5r/ai for 10 seconds, heat and press in a thermostat for 15 seconds.
Post-curing was performed at 0° C. for 30 minutes. Note that the content of particles with a particle size of 0.5 μm or less in the conductive powder was 16%.

Table 10 Resin composition phenolic resin (Mire Kobu RN, Mitsui Toatsu Chemical Co., Ltd.) 6
0 parts hexamethylenetetramine
3n epoxy resin (TEPIC, Nissan Chemical Co., Ltd.) 37
1! ethyl cellosolve
30# cyclohexane
30//Table 11 Conductive particle carbon black (EC)
2 I! Carbon black (AB >
4'' Table 12 From Table 12, the most preferable value for the content Φ of the conductive particles can be determined between 40 and 50%.

Table 19 shows the performance when the conductive material content is 45%.

Example 4 An anisotropic conductive composition was prepared by using the polyurethane resin composition shown in Table 13 as an inder and mixing 48% of the conductive particles shown in Table 14 in terms of resin solid content. The proportion of particles with a particle size of 0.5 μm or less was 13%.

Table 13 Resin composition Polyester polyol (Desmorphen 610, Sumitomo Baneel) 60 parts Aliphatic polyisocyanate (Sumidur N75, Sumitomo Bayer) 40# Ethyl cellosolve
201! cyclohexane
20I! Table 14
Conductive particles Other nickel (Ni #287.
Inco) 78 parts Silica (Aerosil R-9722 Nippon Aerosil) 10! l Colloidal titanium (black titanium, Mitsubishi Kinminsha) 10. .

Carbon black (EC)
2 II This anisotropic conductive composition was printed with a width of 40 nm on a printed circuit board using a metal mask screen (thickness 75 μm), dried to the touch at 80°C for 10 minutes, and then heated at 150°C: scoop/d for 20 seconds. It was crimped. The mark 1611 circuit board used here is a polyester film (thickness 15 μm) with a silver resin film coated with a circuit width of 0. 1Wl, circuit distance 0.1m, circuit length 60n+, number of circuits printed 30, the resistance of the silver resin film is Ro = 0.05Ω, and the resistance between the opposing electrodes after thermocompression bonding is 10~ The resistance between adjacent electrodes was 1012Ω or more. The voltage resistance was 100V with no abnormality. Table 19 shows the characteristics of this product.

Example 5 Commercially available modified acrylic adhesive (Bondconiset AG-
1, Table 15 for the main agent and braimer of Konishi Co., Ltd.
An anisotropically conductive composition was prepared by mixing 48% of the conductive particles shown in . Note that the proportion of particles with a particle size of 0.5 μm or less in the conductive particles was 6%. This adhesive was applied to the terminals of the printed wiring board of Example 1 with a width of 5 m, and a primer with a thickness of 5 μm.

The main material is 100μ thick using a metal mask screen.
Immediately print at 50℃ and 20℃ at 29/Crj.
It was crimped for seconds. Table 19 shows the properties of this product.

Table 15 Conductive particles nickel (#287 Nickel, Inco) 74 parts Silicon carbide (#8000Si C, Showa Denko) 201! Carbon Black (EC) 2〃Carbon Black (AB) '4No! Example 6 Using an epoxy resin composition containing the cation m-type catalyst (Lewis acid type) shown in Table 16 as a binder,
A gastric conductive crude material was prepared in which 45% of the conductive particles shown in No. 7 were mixed in solid form. Note that the particle size of the η-electric particles is 0.
5 μm particles are required at 20%. 200 meshes of this adhesive were applied to the printed wiring board of Example 1, and the thickness was 120 Im.
A width of 5n was marked using a tii11 screen. After drying this to the touch at 90°C for 8 minutes, 220°C, 8 phantom/d
Thermocompression bonding was carried out for 10 seconds. The variation in resistance value of the counter electrode was as good as 0.1% or less. Table 1 shows the performance of this product.
9.

Table 16 i Ma fat composition alicyclic epoxy resin (CY-179, Asahi Denka Co., Ltd. > 100 parts melting medium (
700C, Asahi Denka) 1,2 Eil Cellosolve 20
, 7 Table 17 Conductive Particles and Others Comparative Example 1 40% of the conductive particles of Example 2 were mixed in the thermoplastic resin composition shown in Table 18 in terms of solid content to prepare an anisotropically conductive composition.

Table 18 Resin Composition Number The printed wiring boards of Example 1 were bonded together by thermocompression at 100° C. and 3 cm/cd for 10 seconds using the above anisotropically conductive composition in the same manner as in Example 1. Table 19 shows the characteristics of this product.

As shown in the table above, this comparative example has good insulation between adjacent electrodes and good conductivity between opposing electrodes, but is inferior in adhesive strength and heat resistance compared to each of the examples.

Comparative Example 2 Nickel alloy (Fukudaloy FR) was added to the binder of Example 1.
-401. Fukuda Metal Co., Ltd.) with the composition shown in Table 20,
The printed wiring boards were bonded together by thermocompression in the same manner as in Example 1. This product cannot be used as a connector when the resistance between adjacent electrodes is 1010 Ω or more because the resistance between opposing electrodes is large and uneven.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of a substrate having three parallel conductors (circuits) coated with the composition of the present invention, and Fig. 2 is a cross-sectional view of the composition of the present invention coated between two similar substrates. Figure 3 is a graph showing the relationship between conductive particle content and resistance value, Figure 4 I and I [are tensile shear strength and peel strength (circuit direction) shown in Table 19. FIG. 2 is a schematic diagram of a test piece used for

Claims (1)

[Claims] 0.2 to 20% by weight of conductive particles with a particle size of 0.5 μm or less
, 10 to 75% by weight of conductive particles having a large number of protrusions with a particle diameter of 1.0 μm or more, 30 to 80% by weight of a thermosetting resin composition soluble in a printing solvent, and 0% of a powder resin insoluble in a printing solvent. An anisotropically conductive composition comprising a solid component and an appropriate amount of a printing solvent blended so that the total amount is 100% by weight.