JPS6430888U - - Google Patents
Info
- Publication number
- JPS6430888U JPS6430888U JP12584787U JP12584787U JPS6430888U JP S6430888 U JPS6430888 U JP S6430888U JP 12584787 U JP12584787 U JP 12584787U JP 12584787 U JP12584787 U JP 12584787U JP S6430888 U JPS6430888 U JP S6430888U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- wire
- pin
- clamp mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Landscapes
- Supports For Pipes And Cables (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
第１図は本考案に係るワイヤクランプ機構の実
施例を示す斜視図、第２図は同じくワイヤクラン
パを示す斜視図、第３図は従来例を示す斜視図、
第４図は同じく他の従来例を示す斜視図、第５図
は従来のワイヤクランパを示す斜視図である。
１……プリント基板、２……ワイヤ、５……ワ
イヤクランパ、５ａ……取付け部、５ｂ……台部
、５ｃ……ピン。
FIG. 1 is a perspective view showing an embodiment of the wire clamp mechanism according to the present invention, FIG. 2 is a perspective view similarly showing a wire clamper, and FIG. 3 is a perspective view showing a conventional example.
FIG. 4 is a perspective view of another conventional example, and FIG. 5 is a perspective view of a conventional wire clamper. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Wire, 5... Wire clamper, 5a... Mounting part, 5b... Base part, 5c... Pin.
Claims (1)
イヤクランプ機構において、 ワイヤクランパは上記プリント基板に穿設した
孔に貫挿されるとともに予備半田された取付け部
を有する台部と、 この台部に植設されたワイヤ巻込み用のピンと
を備え、 上記取付け部を他の電子部品とともに上記プリ
ント基板に半田にて固定した後、複数本の上記ワ
イヤを上記ピンで巻き込んで束ねるようにしたこ
とを特徴とするワイヤクランプ機構。[Scope of Utility Model Registration Claim] In a wire clamp mechanism for bundling wires arranged on a printed circuit board, the wire clamper is inserted into a hole drilled in the printed circuit board and has a base part having a pre-soldered mounting part. and a pin for wire winding embedded in this base part, and after fixing the mounting part to the printed circuit board together with other electronic components with solder, the plurality of wires are wound with the pin. A wire clamp mechanism that is characterized by being bundled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12584787U JPS6430888U (en) | 1987-08-19 | 1987-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12584787U JPS6430888U (en) | 1987-08-19 | 1987-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430888U true JPS6430888U (en) | 1989-02-27 |
Family
ID=31376812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12584787U Pending JPS6430888U (en) | 1987-08-19 | 1987-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430888U (en) |
-
1987
- 1987-08-19 JP JP12584787U patent/JPS6430888U/ja active Pending
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