JPS5785994A - Resin composition for plating - Google Patents
Resin composition for platingInfo
- Publication number
- JPS5785994A JPS5785994A JP16090280A JP16090280A JPS5785994A JP S5785994 A JPS5785994 A JP S5785994A JP 16090280 A JP16090280 A JP 16090280A JP 16090280 A JP16090280 A JP 16090280A JP S5785994 A JPS5785994 A JP S5785994A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- resin composition
- metallic
- sulfide
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To provide a resin composition which permits application of electroplating directly by excluding electroplating by compounding respective prescribed ratios of a thermoplastic polyurethane, carbon black, sulfur, and metallic powder or metallic sulfide with a thermoplastic resin.
CONSTITUTION: A resin composition for plating consisting of compounding 1W 30pts.wt. a thermoplastic polyurethane, 15W70pts.wt. carbon black, 0.05W7pts.wt. sulfur and 1W20pts.wt. metallic powder or metallic sulfide to thermoplastic resin 100pts.wt.. Powder of Ni, iron or the like is used for said metallic powder and zinc sulfide, antimony sulfide, etc. are used for the metallic sulfide, respectively. This resin composition excludes electroless plating (chemical plating) processes completely and permits direct electroplating. When strike nickel plating is applied on the moldings of this resin composition, the moldings exhibit ≥2.0kg/ cm plating adhesive strength within 5min/dm2 throwing power time, and have a good appearance free from pinholes and the like.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16090280A JPS5950259B2 (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16090280A JPS5950259B2 (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5785994A true JPS5785994A (en) | 1982-05-28 |
JPS5950259B2 JPS5950259B2 (en) | 1984-12-07 |
Family
ID=15724810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16090280A Expired JPS5950259B2 (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5950259B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5945336A (en) * | 1982-09-07 | 1984-03-14 | Toshiba Chem Corp | Synthetic resin molding material for shielding electromagnetic wave |
US4466912A (en) * | 1982-09-30 | 1984-08-21 | Mobay Chemical Corporation | Conductive thermoplastic compositions |
JPH01118571A (en) * | 1987-10-30 | 1989-05-11 | Toray Ind Inc | Polyphenylene sulfide resin composition |
US5336303A (en) * | 1991-05-15 | 1994-08-09 | C-Innovations, Inc. | Electrochemically active paint for cathodic protection of engineering structures |
EP0757078A1 (en) | 1995-08-01 | 1997-02-05 | BASF Aktiengesellschaft | Impact-resistent thermoplastic moulding compositions |
US5854330A (en) * | 1996-03-07 | 1998-12-29 | Minnesota Mining And Manufacturing Company | Capstan comprising polyacetal-based polymer composition for magnetic tape cartridge |
WO2001009241A1 (en) * | 1999-07-29 | 2001-02-08 | Shanghai Genius Advanced Material Co. Ltd. | High fluidible, impact resistant conductive acrylonitrile-butadiene-styrene terpolymer material and preparing method thereof |
-
1980
- 1980-11-17 JP JP16090280A patent/JPS5950259B2/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5945336A (en) * | 1982-09-07 | 1984-03-14 | Toshiba Chem Corp | Synthetic resin molding material for shielding electromagnetic wave |
US4466912A (en) * | 1982-09-30 | 1984-08-21 | Mobay Chemical Corporation | Conductive thermoplastic compositions |
JPH01118571A (en) * | 1987-10-30 | 1989-05-11 | Toray Ind Inc | Polyphenylene sulfide resin composition |
US5336303A (en) * | 1991-05-15 | 1994-08-09 | C-Innovations, Inc. | Electrochemically active paint for cathodic protection of engineering structures |
EP0757078A1 (en) | 1995-08-01 | 1997-02-05 | BASF Aktiengesellschaft | Impact-resistent thermoplastic moulding compositions |
US5854330A (en) * | 1996-03-07 | 1998-12-29 | Minnesota Mining And Manufacturing Company | Capstan comprising polyacetal-based polymer composition for magnetic tape cartridge |
WO2001009241A1 (en) * | 1999-07-29 | 2001-02-08 | Shanghai Genius Advanced Material Co. Ltd. | High fluidible, impact resistant conductive acrylonitrile-butadiene-styrene terpolymer material and preparing method thereof |
JP2003529626A (en) * | 1999-07-29 | 2003-10-07 | 上海▲傑▼事▲傑▼新材料股▲分▼有限公司 | High fluidity impact resistant conductive acrylonitrile-butadiene-styrene three-dimensional copolymer composition and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5950259B2 (en) | 1984-12-07 |
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