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JPS5754068A - Ultra high precision adhering method in single surface lapping and polishing of wafer - Google Patents

Ultra high precision adhering method in single surface lapping and polishing of wafer

Info

Publication number
JPS5754068A
JPS5754068A JP55125018A JP12501880A JPS5754068A JP S5754068 A JPS5754068 A JP S5754068A JP 55125018 A JP55125018 A JP 55125018A JP 12501880 A JP12501880 A JP 12501880A JP S5754068 A JPS5754068 A JP S5754068A
Authority
JP
Japan
Prior art keywords
adhesives
wafer
thickness
base plate
filter member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55125018A
Other languages
English (en)
Inventor
Kenji Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP55125018A priority Critical patent/JPS5754068A/ja
Publication of JPS5754068A publication Critical patent/JPS5754068A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP55125018A 1980-09-09 1980-09-09 Ultra high precision adhering method in single surface lapping and polishing of wafer Pending JPS5754068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55125018A JPS5754068A (en) 1980-09-09 1980-09-09 Ultra high precision adhering method in single surface lapping and polishing of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55125018A JPS5754068A (en) 1980-09-09 1980-09-09 Ultra high precision adhering method in single surface lapping and polishing of wafer

Publications (1)

Publication Number Publication Date
JPS5754068A true JPS5754068A (en) 1982-03-31

Family

ID=14899815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55125018A Pending JPS5754068A (en) 1980-09-09 1980-09-09 Ultra high precision adhering method in single surface lapping and polishing of wafer

Country Status (1)

Country Link
JP (1) JPS5754068A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608070A (ja) * 1983-06-28 1985-01-16 株式会社アイジ−技術研究所 複合板製造装置
JPH04115864A (ja) * 1990-09-07 1992-04-16 Nikko Kyodo Co Ltd 塗布方法
US5304418A (en) * 1991-12-30 1994-04-19 Nitto Denko Corporation Dicing-die bonding film
US5891285A (en) * 1996-05-10 1999-04-06 Tefco International Co., Ltd. Process for manufacturing electroformed patterns
US8263220B2 (en) 2004-08-06 2012-09-11 Nitto Denko Corporation Work subject material, surface protection sheet and method of working

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608070A (ja) * 1983-06-28 1985-01-16 株式会社アイジ−技術研究所 複合板製造装置
JPS6319348B2 (ja) * 1983-06-28 1988-04-22 Ig Gijutsu Kenkyusho Kk
JPH04115864A (ja) * 1990-09-07 1992-04-16 Nikko Kyodo Co Ltd 塗布方法
US5304418A (en) * 1991-12-30 1994-04-19 Nitto Denko Corporation Dicing-die bonding film
US5476565A (en) * 1991-12-30 1995-12-19 Nitto Denko Corporation Dicing-die bonding film
US5891285A (en) * 1996-05-10 1999-04-06 Tefco International Co., Ltd. Process for manufacturing electroformed patterns
US8263220B2 (en) 2004-08-06 2012-09-11 Nitto Denko Corporation Work subject material, surface protection sheet and method of working

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