JPH0244702A - Resistance regulation method for thick film hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To broaden the regulation range of a resistance and to facilitate the regulation by connecting a plurality of resistors in series, short-circuiting both end resistors by the use of a conductor pattern, and cutting the pattern. CONSTITUTION:In a thick film hybrid integrated circuit, a plurality of resistors 2a-2c are connected in series, the resistors 2a, 2c of both ends of them are short-circuited by a conductor pattern 1, and the printed resistors are trimmed in combination by cutting the pattern 1. For example, if there is possibility that the resistance value or the shape of the resistor (the ratio of the length: the width) is altered, a cutting part 3 is so cut that the resistance vale (R1+R2) between A-B becomes a predetermined value R. If a target resistance value cannot be obtained by this regulating method so that the resistance value becomes high, the resistor R3 is shortcircuited by omitting the cutting of the conductor cutting part 4, and the part 3 of the resistor 2b is cut to be regulated, thereby reducing the resistance value only by the resistance value R3 of the resistor 2c. Thus, the regulation range of the resistance by trimming is broadened to facilitate the regulation.

Description

[Detailed description of the invention] A. Industrial application field The present invention relates to a method for adjusting the resistance of a thick film hybrid integrated circuit.

B1 Summary of the Invention This invention provides a method for adjusting the resistance of a thick film hybrid integrated circuit, in which a plurality of resistors are connected in series, the conductor patterns at both ends are short-circuited, and the conductor patterns are cut. It has a wide range and is easy to adjust.

C1 Prior Art In thick film hybrid integrated circuits, a laser trimming method (hereinafter simply referred to as trimming) is often used to adjust the resistance value by cutting the resistor with a laser. Figure 4 shows an example of conventional trimming.
1 is a conductor pattern, 2 is a resistor, and 3 is an inverted cut portion cut by a laser. In addition, A- in the figure
It is assumed that the resistance value between 8 and 8 is R2 due to trimming.

Although it is possible to increase the resistance value by trimming,
(Since it is not possible to subtract the value, it is best to design the resistance value to be lower than this R (for example, 40 to 60% of R) and make the value of R2 closer to R by trimming. -8 Problems to be Solved by the Invention The adjustment method described above has the following problems.

(1) If the resistance value becomes higher than a predetermined value due to variations in printed resistance or excessive laser cutting, the resistance value cannot be lowered.

(2) Because the value R is considerably lower than the predetermined value R due to design or manufacturing reasons, it may not be possible to adjust it by trimming alone.

In the above case, all printed circuit boards must be discarded and remade, resulting in a significant loss.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method for adjusting the resistance of a thick film hybrid integrated circuit, which widens the adjustment range of the resistance by trimming and facilitates the adjustment. .

81 Means for Solving the Problems This invention is a thick film hybrid integrated circuit, in which a plurality of resistors are connected in series, the resistors at both ends are short-circuited with a conductor pattern, and the conductor pattern is cut. This method is characterized by trimming the resistor.

When the F5 action resistance value becomes higher than a predetermined value, stop cutting the cut portion of the conductor pattern5. When the resistance value becomes low, the conductor pattern is cut to reach a predetermined resistance value.

G. Example An embodiment of the present invention will be described below based on the drawings.

1 to 3 explain the method of adjusting the resistance value according to the present invention, 1 in the figure is a conductor pattern, 2a, 2b
, 2c is a resistor (shaded portion in the figure). Note that the values of the resistors are R1, R2, and R3, respectively. Reference numeral 3 designates an inverted cut portion obtained by cutting the resistor 2b with a laser. 4
and 5 are conductor cut portions obtained by cutting the conductor pattern with a laser.

In the above embodiment, first, the resistance value or the shape of the resistor (
If there is a possibility that the length (ratio of two wheels) may be changed, the pattern shown in FIG. 1 is formed in advance. In FIG. 1, the conductor pattern 1 is cut at the conductor cut portion 4, so A-
The resistance value between 8 is the sum of R1+R2. The cut portion 3 is cut so that this resistance value becomes a predetermined value R. Check for thick film mixed accumulation. If the desired resistance value can be obtained using this adjustment method, all parts will be adjusted using this method.
If the desired resistance value cannot be obtained with this adjustment method and becomes high, adjust it as follows.

(1) When the resistance value becomes higher than a predetermined value, if the cutting of the conductor cut portion 4 shown in FIG. 1 is omitted, the resistor R3 becomes short-circuited. FIG. 2 shows a pattern showing this state. In FIG. 2, the resistance value between A and 8 is adjusted by cutting the cut portion 3 of the resistor 2b so that it becomes a predetermined value R.

By adjusting in this way, the resistance value can be lowered by the resistance value R3 of the resistor 2c.

(2) If the resistance value is too low by the above adjustment method and cannot be adjusted by trimming alone, the conductor pattern is cut using the conductor cutting section 4.5 as shown in FIG. As a result, the resistance value between A-8 becomes R1+R2+R3, which is a predetermined value R. The resistance value at this time is R compared to that in Figure 1.
The resistance value increases by 1.

If carried out as described above, conventional trimming will not be able to lower the resistance value when it exceeds a predetermined value R (also, even if the resistance value is much lower than R, trimming alone will result in poor adjustment). For example, when designing with 40% of R,
The adjustment range by trimming is 0.4R-R, but in the embodiment of the present invention, as shown in FIG.
), the resistance adjustment range is (
R2+R3) -R3~R] + (R2+R3), and the adjustment range becomes wider. Furthermore, since the value of R2 can be adjusted by trimming, the adjustment range can be further widened.

Effects of the H8 Invention As described above, the present invention has the advantage that the adjustment range of the resistance value can be made very wide and the resistance value can also be made low. Furthermore, even after printing the thick-film hybrid integrated circuit, it is possible to flexibly change the resistance value, so there is no need to remake it again, which has the advantage of not affecting manufacturing costs and delivery times. Furthermore, since only the program of the trimming device is changed, no special equipment or manufacturing process is required, which is extremely useful in practice.

[Brief explanation of the drawing]

1 to 3 are block diagrams illustrating a method for adjusting a resistance value according to an embodiment of the present invention, and FIG. 4 is an explanatory diagram showing trimming for adjusting a resistance value in a conventional example. 1... Conductor pattern, 2a, 2b, 2c...
- Resistor, 3... Inverted cut part, 4... Conductor cut part. Figure 1: Configuration diagram of the embodiment Figure 2: Configuration diagram of the embodiment a D c l

Claims (1)

[Claims] (1) In thick film hybrid integrated circuits, printed resistors are trimmed by connecting multiple resistors in series, shorting the resistors at both ends with a conductor pattern, and cutting the conductor pattern. A method for adjusting the resistance of thick film hybrid integrated circuits.