JPH06132448A - External terminal of semiconductor device - Google Patents

Abstract

PURPOSE:To obtain an external terminal of semiconductor device which can be connected easily with the metal case of semiconductor device at high reliability. CONSTITUTION:An external terminal 6 is split into two parts at the tip thereof and provided, respectively, with a first forked clip part 7 directing in the longitudinal direction of the external terminal 6 and a second forked clip part 8 directing upward with respect to the first clip part 7. The first clip part 7 clips the ground part of a board 3 whereas the second clip part 8 clips a metal case 1 when soldering is carried out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an external terminal of a semiconductor device, and more particularly, to a shape of the external terminal of a semiconductor device sandwiching a metal case for soldering.

[0002]

2. Description of the Related Art FIG. 7 is a sectional view of a semiconductor device mounted by using a conventional external terminal. In the figure, 1 is a metal case, 2 is a GND (ground) external terminal, and 3 is a part not shown. Substrate 4 on which an electric circuit is mounted and solder 5 is a metal base, and solder 4 fixes external terminal 2 and metal case 1, and further external terminal 2 and metal base 5.

As shown in FIG. 7, the external terminal 2 is a terminal for grounding the metal case 1 and the metal base 5 to GND, and the GND (not shown) of the substrate 3 and the metal case 1 are provided.
And the metal base 5 must be connected so that a good electrical condition can be obtained.

[0004]

In the conventional external terminal, the metal case 1 and the metal base 5 are connected as described above, and when the metal case and the external terminal are soldered,
Since the connection between the mounting hole of the metal case and the external terminal is fixed by soldering, it is necessary to fill the gap between the metal case and the external terminal with solder.If this gap is wide, the soldering iron Soldering work becomes very difficult, the connection between the external terminal and the metal case becomes uncertain, and a good electrical state cannot be obtained between the GND of the board and the metal case, which is not reliable. There was a problem. The present invention has been made to solve the above problems, and an object thereof is to obtain a highly reliable external terminal of a semiconductor device, which can easily connect an external terminal and a metal case. There is.

[0005]

An external terminal of a semiconductor device according to the present invention has its tip divided into two parts, each of which has a bifurcated clip shape, and one clip-shaped tip part of the external terminal. The GND portion of the board is sandwiched in the longitudinal direction, the other clip-shaped tip portion is bent upward to sandwich the metal case, and each is soldered and connected, so that the metal case can be grounded to GND.

[0006]

According to the present invention, the two clip-shaped tips provided at the tips of the external terminals sandwich the metal case and the GND of the board, respectively, and solder them.
The external terminal and the metal case can be securely connected, and the GN of the board
An electrically good condition can be obtained between D and the metal case,
Improves reliability.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. Example 1. 1 is a plan view of an external terminal of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a side view of the external terminal shown in FIG. 1, and FIG. It is sectional drawing of a semiconductor device. In these figures, the same reference numerals as those in FIG.
With the external terminal divided into two parts, the first clip portion 7 is a first connecting portion that is opened in a bifurcated shape facing the longitudinal direction of the external terminal 6, and faces upward with respect to the first clip portion 7. And a second clip portion 8 which is a second connecting portion opened in a bifurcated shape. As shown in FIG. 3, the external terminal 6 of the present embodiment has the GN of the substrate 3 by the first clip portion 7.
After connecting to D and sandwiching the substrate 3 and sandwiching the side wall 9 of the metal case 1 by the second clip portion 8, soldering is performed with solder 4 for connection.

As described above, according to this embodiment, the tip portion is
One clip part is used for soldering the GND of the board, and the other clip part is used for soldering by sandwiching the metal case, so that the external terminal and the metal case can be reliably connected, and the GND of the board can be connected. A good electrical state is obtained between the metal case and the metal case, and high reliability is obtained.

Example 2. FIG. 4 is a plan view of an external terminal of a semiconductor device according to a second embodiment of the present invention, and FIG.
7 is a side view of the external terminal shown in FIG. 6, and FIG. 6 is a cross-sectional view of the semiconductor device to which the external terminal shown in FIG. 4 is connected. In these figures, the same reference numerals as those in FIG. 7 indicate the same or corresponding parts,
Reference numeral 10 denotes a bifurcated lead forming portion for sandwiching the side wall 9 of the metal case 1. The lead forming portion 10 sandwiches the substrate 3 with the first clip portion 7 for soldering and then cuts the lead forming portion 10. It is formed so that it can be deformed, mold-matched, etc. so that it can be formed so as to fit the side wall 9 and can be sandwiched by bending.

As shown in FIG. 6, such an external terminal 6
After sandwiching the GND portion of the substrate 3 with the first clip portion 7 for soldering, the lead forming portion 10 is processed by forming it so as to fit the side wall 9 of the metal case 1, and then sandwiching the side wall 9 and soldering. I attach it and connect it. Therefore, when soldering both terminals, GN of the board
There is an effect that it is not necessary to position the external terminal at a required position and perform soldering so that D and the side wall of the metal case can be sandwiched in a stable state.

[0011]

As described above, according to the present invention, the tip portion of the external terminal is divided into two, each tip portion is formed into a bifurcated shape, and one bifurcated shape sandwiches the GND of the substrate, and the other is formed. Since the metal case is sandwiched and soldered in a bifurcated shape, the external terminal and the metal case can be easily and surely connected, and an electrically good state can be obtained between the GND of the substrate and the metal case. There is an effect that the reliability of the semiconductor device can be improved.

[Brief description of drawings]

FIG. 1 is a plan view showing an external terminal of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a side view showing an external terminal of the semiconductor device according to the first embodiment.

FIG. 3 is a cross-sectional view showing a semiconductor device to which an external terminal of Example 1 is connected.

FIG. 4 is a plan view showing an external terminal of a semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a side view showing an external terminal of the semiconductor device of Example 2.

FIG. 6 is a cross-sectional view showing a semiconductor device to which an external terminal of Example 2 is connected.

FIG. 7 is a cross-sectional view showing a conventional semiconductor device to which external terminals are connected.

[Explanation of symbols]

 1 Metal Case 2 External Terminal 3 Board 4 Solder 5 Metal Base 6 External Terminal 7 First Clip Part 8 Second Clip Part 10 Lead Forming Part

Claims (2)

[Claims] 1. In an external terminal of a semiconductor device for connecting a ground portion of a substrate on which a component is mounted and a metal case covered with the substrate, the tip of the external terminal is divided into two, and one tip portion thereof. A first fork-shaped connecting portion, which is formed on the first terminal and is connected to the ground portion with the substrate sandwiched between them, and which is open in the longitudinal direction of the external terminal; An external terminal of a semiconductor device, comprising: a second fork-shaped connecting portion that is open upward with respect to the first connecting portion and is connected to the metal case with the metal case interposed therebetween. 2. The external terminal of the semiconductor device according to claim 1, wherein the second connection portion can be formed and connected to the metal case after connecting the first connection portion to the substrate. An external terminal of a semiconductor device characterized by being processed.