JPH0613443A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To set the work information in accordance with a product type of a semiconductor pellet and of a lead frame. CONSTITUTION:Using a camera 44 which picks up an image of a product type recognizing section which is installed on each of a semiconductor pellet 2 and a lead frame 3, a picture processing device 45 which processes an image picked up by the camera 44, a setting section 52 which sets a reference pattern for each product type judging section installed on each of the plurality of types of the semiconductor pellets 2 and the lead frames 3, and an image pattern which has been processed by the picture processing device 45, a reference pattern which is the same as this image pattern is found out from the plurality of the reference patterns set in the setting section 52. In order to do this job, a comparing section 53 which recognizes a product type of the semiconductor pellets 2 and the lead frames 3 and a displaying section 55 which displays the product type recognized by the comparing section 53 are installed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus.

[0002]

2. Description of the Related Art For example, in a wire bonding apparatus used as a semiconductor device manufacturing apparatus, a capillary is attached to the tip of a bonding arm which is supported by a bonding head and is driven to swing, and a wire inserted through the capillary is used. The work of electrically connecting the electrodes of the semiconductor pellet and the leads of the lead frame is performed.

By the way, the bonding information (bonding position coordinates, bonding load, etc.) for driving and controlling the bonding apparatus must be set in accordance with the type of semiconductor pellet or lead frame.

Conventionally, therefore, the bonding information corresponding to the combination of the semiconductor pellet and the lead frame for each product type is set in advance in the setting section of the wire bonding apparatus, and the bonding work is started.
The operator inputs the product type information by key operation or the like.

Here, the type information is discriminated by relying on the type identification symbol attached to the semiconductor pellet or the lead frame. This is because, for example, in the case of a semiconductor pellet, the pattern 5 in FIG. 6 and FIG.
A product type identification code such as that shown in No. 6 is attached, but this product type identification code was determined by the operator observing it using a microscope.

[0006]

However, since the type identification code attached to the semiconductor pellet or the lead frame is made up of extremely small letters, marks, etc., it is necessary to use the microscope as described above to identify this. Since the detailed work of reading by using it is required, a great deal of fatigue is given to the worker.

Further, since the reading work by the operator has been conventionally performed, there is a high possibility that a reading error such as a character is made. If the mistake causes the bonding work with wrong bonding information, a large amount of defective products will be produced. There was a problem of producing.

Further, since the product type information for setting the bonding information is key-inputted by the operator's manual operation, there is a risk that wrong bonding information may be set by an operation mistake. Was there.

It is a first object of the present invention to provide a semiconductor device manufacturing apparatus capable of easily setting work information according to the types of semiconductor pellets and lead frames.

A second object of the present invention is to provide a semiconductor device manufacturing apparatus capable of reliably setting work information according to the types of semiconductor pellets and lead frames.
The purpose of.

[0011]

According to a first aspect of the present invention, there is provided an image pickup means for picking up an image of a type discrimination portion provided on each of a semiconductor pellet and a lead frame, and an image for processing an image picked up by this image pickup means. A processing unit, a setting unit for setting a reference pattern of a plurality of types of the semiconductor pellets and the individual lead frame type determination regions, and an image pattern processed by the image processing unit are set in the setting unit. Find a reference pattern that matches this image pattern from the multiple reference patterns,
Accordingly, it is characterized in that it has a type discriminating means for discriminating the type of each of the semiconductor pellets and the lead frame, and a display means for displaying the type discriminated by the type discriminating means.

According to a second aspect of the present invention, there are provided a plurality of types of image pickup means for picking up an image of the type discrimination portion provided on each of the semiconductor pellet and the lead frame, an image processing means for processing an image picked up by the image pickup means. Of the semiconductor pellets and the lead frame, reference patterns of individual product type identification parts, and setting means for setting work information corresponding to a plurality of combinations of the semiconductor pellets and the lead frame, and the image processing means. On the basis of the image pattern processed in step 1, a reference pattern matching the image pattern is found out of the plurality of reference patterns set in the setting means, and thereby the semiconductor pellet and the lead frame type are discriminated respectively. Product type discrimination means and the product of the semiconductor pellets discriminated by the product type discrimination means And characterized by having a control means for driving and controlling a working unit based on the task information corresponding to the combination of varieties of the lead frame in the task information obtained from the setting unit.

[0013]

According to the first aspect of the present invention, the image of the semiconductor pellet taken in by the image pickup means and the image of the product type discrimination portion provided on each of the lead frames is processed by the image processing means. Then, in the product type discriminating means, based on the image pattern processed by the image processing means, a reference pattern that matches the image pattern is found from among the plurality of reference patterns set in the setting means, and thereby the semiconductor pellet and The type of the lead frame is discriminated and the result is displayed on the display means.

According to the second aspect of the present invention, the image of the semiconductor pellets taken in by the image pickup means and the image of the type discrimination portion provided on each of the lead frames is processed by the image processing means. Then, in the type discrimination means,
Based on the image pattern processed by the image processing means, find a reference pattern that matches the image pattern from the plurality of reference patterns set in the setting means, thereby the type of the semiconductor pellet and the lead frame Each is determined. When the type is determined, the work information corresponding to the determined combination of types is automatically taken in from the setting means to the control means, and the working unit is drive-controlled based on this work information.

[0015]

Embodiments of the present invention will be described with reference to the drawings. 1 is a configuration diagram of a wire bonding apparatus according to the present invention, FIG. 2 is a configuration diagram of essential parts of FIG. 1, FIG. 3 is a correspondence table between semiconductor pellets and reference patterns, and FIG. 4 is correspondence between lead frames and reference patterns. Table, FIG. 5 is a matrix table showing bonding information corresponding to the combination of the semiconductor pellet and the lead frame, and FIG. 6 is an enlarged view of a main part of the semiconductor pellet.
FIG. 7 is an enlarged view of a main part of the lead frame.

1 and 2, a wire bonding apparatus 1 includes a supply unit 10 for supplying a lead frame 3 on which a semiconductor pellet 2 is mounted, a conveying means 20 for conveying the supplied lead frame 3, and a wire bonding device. Storage section 30 for storing the lead frame 3 with
And a bonding head 40 for performing wire bonding on the semiconductor pellets 2 and the lead frame 3 and a controller 50, which are located in the middle of the transportation of the lead frame 3 by the transportation means 20.

The supply unit 10 stores a lead frame 3 on which the semiconductor pellets 2 are mounted at a predetermined pitch interval, and a magazine 11 that moves the magazine 11 up and down at a predetermined pitch interval and is stored at a predetermined position. An elevating mechanism 12 for positioning the lead frame 3 at the carrying level of the carrying means 20 and a pushing mechanism 13 for sending the lead frame 3 positioned at the carrying level onto the carrying means 20.

The carrying means 20 has a pair of carrying rails 21 for carrying and guiding the lead frame 3, and carries the lead frame 3 by a feeding mechanism (not shown).

The accommodating section 30 accommodates the lead frame 3 to which wire bonding is applied at a predetermined pitch interval, and raises and lowers the magazine 31 at a predetermined pitch interval, and also at a predetermined lead frame in the magazine 31. An elevating mechanism 32 for positioning the storage position at the carrying level of the carrying means 20.

The bonding head 40 is mounted on a movable table 41 which is movable in the horizontal direction, and is attached to the tip of the bonding arm 42 which is swingably driven in the vertical direction, and the wire 4 is inserted therethrough. And a capillary 43. The bonding head 40 has a camera 44 fixed almost directly above the capillary 43.
Is provided and is connected to the control device 50 via the image processing device 45.

The control unit 50 controls the operation of the wire bonding apparatus 1, and includes a control unit 51, a setting unit 52,
The comparison unit 53 and the storage unit 54 are included.

Here, the following information is set in advance in the setting section 52.

A. Reference patterns of different product identification symbols 5 attached to the semiconductor pellets 2 of a plurality of products (see FIG. 3).
reference)

In this embodiment, four types of semiconductor pellets 2 are used.
Images of different product identification symbols assigned to a to 2d are individually captured by the camera 44, and the image patterns after the captured images are image-processed by the image processing device 45 are set as reference patterns Pa to Pd. It is something to set. In addition, each of the reference patterns Pa to Pd corresponds to each of the semiconductor pellets 2a.
It is stored and set together with the image pickup position coordinates of the camera 44 that should capture the image of the product type identification symbol in 2d.

B. Reference patterns of different product type identification symbols 6 attached to the lead frames 3 of a plurality of product types (see FIG. 4)

In this embodiment, four types of lead frames 3 are used.
Images of different product identification symbols assigned to a to 3d are individually captured by the camera 44, and the image patterns after the captured images are processed by the image processing device 45 are set as the reference patterns Fa to Fd. To do. The reference patterns Fa to Fd correspond to the lead frames 3a to 3d.
The image of the product identification code in 3d is stored and set together with the image capturing position coordinates of the camera 44 that should capture the image.

C. Semiconductor pellets 2a to 2d for each product type
Information corresponding to a plurality of combinations of the lead frames 3a to 3d (see FIG. 5)

In FIG. 5, if the type of semiconductor pellet is 2b and the type of lead frame is 3c, for example, B
It means that the operation of the wire bonding apparatus 1 is controlled by the bonding information f. In the figure, the type of semiconductor pellet is 2c and the type of lead frame is 3a.
In such a case, the bonding information is indicated by diagonal lines, which means that the same combination cannot exist.

In FIG. 2, reference numeral 55 is a display unit,
The types of the semiconductor pellets 2 and the lead frame 3 determined by the comparison unit 53 as described later are displayed.

Next, the operation of the wire bonding apparatus 1 will be described.

First, a magazine 11 for accommodating the lead frame 3 on which the semiconductor pellets 2 are mounted is provided in the supply section 10.
Then, the lead frame 3 located at the lowest position in the magazine 11 is positioned at the carrying level of the carrying means 20 by the operation of the elevating mechanism 12. Next, the lead frame 3 is pushed onto the transport rail 21 by the pushing mechanism 13. The lead frame 3 extruded onto the transport rail 21 is transported on the transport rail 21 at a predetermined pitch and positioned at the bonding position of the bonding head 40.

When the lead frame 3 is positioned at the bonding position, the work of discriminating the types of the lead frame 3 and the semiconductor pellet 2 is carried out as follows.

First, in the work for discriminating the type of the lead frame 3, the movement table 41 is drive-controlled by a command from the control unit 51 of the control device 50, and the image pickup position coordinates of the reference pattern Fa set in the setting unit 52. First, the camera 44 moves to the position. Then, as shown in FIG. 7, the camera 44 captures the image within the field of view 44 a at this position, the captured image is processed by the image processing device 45, and the image pattern is stored in the storage unit 54. Next, the comparison unit 53 compares the image pattern now stored in the storage unit 54 with the reference pattern Fa. At this time, when it is confirmed that the two patterns match, it is determined that the type of the supplied lead frame 3 is 3a, and the type is displayed on the display unit 55. When it is confirmed that the two patterns do not match, the camera 44 next moves to the position of the image pickup position coordinate of the reference pattern Fb.
Then, similarly to the above, the image pattern captured by the camera 44 and processed by the image processing device 45 is compared with the reference pattern Fb. When it is confirmed that the two patterns match, it is determined that the type of the lead frame 3 is 3b. If the two patterns do not match again, the camera 44 sequentially moves to respective positions of the image pickup position coordinates of the reference pattern Fc and the image pickup position coordinates of the reference pattern Fd until the match is confirmed. Then, the discrimination work is performed. The camera 44 moves to the position of the image pickup position coordinate of the reference pattern Fd, and here, the image pattern based on the image picked up by the camera 44 and the reference pattern F are displayed.
If the match with d is not confirmed, the operator may be notified by an alarm or the like and the apparatus may be stopped.

When the type of the lead frame 3 is discriminated in this way, the type of semiconductor pellet 2 on the lead frame 3 is discriminated. This work is performed almost in the same way as the above-described work of discriminating the type of the lead frame 3, and the camera 44 first moves to the position of the image pickup position coordinate of the reference pattern Pa, and as shown in FIG. The image in the field of view 44a is captured. Then, the captured image is processed by the image processing device 45 and stored in the storage unit 54, and this image pattern is compared with the reference pattern Pa by the comparison unit 53. As a result, when it is confirmed that the two patterns match, it is determined that the type of the semiconductor pellet 2 is 2a, and that type is displayed on the display unit 55.
Is displayed in. If a discrepancy between the two patterns is confirmed, the same process is repeated until the camera 44 is confirmed.
Is the imaging position coordinate of the reference pattern Pb, the reference pattern Pc
And the image pickup position coordinates of the reference pattern Pd are sequentially moved to perform the determination work. In addition, the camera 44
Moves to the position of the image pickup position coordinate of the reference pattern Pd, and if the image pattern based on the image picked up by the camera 44 and the reference pattern Pd are not confirmed here, the operator is notified by an alarm or the like, and The device may be stopped.

When the types of the semiconductor pellet 2 and the lead frame 3 are discriminated in this way, the control unit 51
Calls the bonding information corresponding to the combination of both types from the setting unit 52. Specifically, in FIG.
For example, when it is determined that the types of the semiconductor pellet 2 and the lead frame 3 are 2a and 3a, the bonding information Ba is called. Then, the control unit 51 controls the operation of the bonding head 40 based on the called bonding information Ba and performs the bonding work. In addition, when the bonding information corresponding to the combination of the determined type of the semiconductor pellets 2 and the lead frame 3 cannot exist (for example, in FIG. 5, the semiconductor pellets of the type 2c and the type 3a).
In the case of the lead frame combination), the control unit 5
1 may output an abnormality detection signal, notify the operator by an alarm or the like, and stop the apparatus.

Bonded lead frame 3
After that, the pitch is moved by the carrier means 20, and when the bonding work is completed for all the semiconductor pellets 2 on the lead frame 3, the lead frame 3
Are transported to the storage unit 30. At this time, the magazine 31 of the storage unit 30 is positioned at the upper limit position by the elevating mechanism 32, and the lead frame 3 that has been transported is stored at the lowest position of this magazine 31. After that, the lifting mechanism 3
By the action of 2, the pitch is lowered by 1 pitch.

After that, the bonding work is performed according to the above-mentioned bonding information until the lead frames 3 housed in the magazine 11 on the side of the supply unit 10 are exhausted.

The operation of discriminating the type of the semiconductor pellet 2 and the lead frame 3 described above is performed every time the magazine 11 in the supply unit 10 is replaced.

According to the above-described embodiment, the semiconductor pellets 2 positioned at the bonding position and the product identification symbols provided on the lead frame 3 are sequentially picked up by the camera 44 before the bonding work, and based on the picked-up images, respectively. The variety of is discriminated. Then, the determined product type is displayed on the display unit 55, and the bonding information corresponding to the combination of the product types is automatically read out, and the bonding work is performed based on the read out information.

As described above, since the product type is automatically discriminated based on the image picked up by the camera 44, the intervention of the operator is not required for the discrimination, and the fatigue of the operator can be greatly reduced. . Further, for the same reason, it is possible to prevent erroneous recognition by the operator.

Further, in the above-mentioned embodiment, since the bonding information corresponding to the determined combination of types is automatically read, it is possible to prevent the operator from making an operation error.

Therefore, according to this embodiment, the bonding information according to the types of the semiconductor pellet 2 and the lead frame 3 can be set easily and surely.

In the above embodiment, when the type of the semiconductor pellet 2 and the lead frame 3 is determined, the bonding information corresponding to the combination of this type is automatically read out. Even if the operation is performed in the same manner as in the embodiment and the operator relies on the product type displayed on the display unit 55 to key in the product type from an operation panel (not shown) provided in the wire bonding apparatus 1 or the like, The first object of the invention can be sufficiently achieved. In this case, the control device 50 subsequently obtains the bonding information from the setting unit 52 based on the product type input signal.

In the embodiment, the magazine 1 of the supply unit 10 is also used.
Although the type discrimination work is performed only on the lead frame 3 to the semiconductor pellets 2 firstly supplied from 1, the lead frame 3 supplied from the magazine 11
This determination work may be performed every time. In this case, if different types of lead frames are mixed in the magazine 11 if an error signal is output when the discriminated product type is different from the past even though they are supplied from the same magazine 11. But you can figure it out before bonding.

Further, in the above embodiment, when the wire bonding apparatus 1 is incorporated in-line and the setting of the bonding information is performed by the command from the host computer, the types of the semiconductor pellet 2 and the lead frame 3 are different. It is also possible to use the determination result of the check function for the check function. This is a comparison unit for the type information of the semiconductor pellet 2 and the lead frame 3 to be bonded according to the bonding information designated by the host computer, and the semiconductor pellet 2 and the lead frame 3 actually supplied to the wire bonding apparatus 1. The information is compared with the product type identification information determined by 53 to confirm whether or not they match.

Further, in the embodiment, the example in which the present invention is applied to the wire bonding apparatus has been described, but the application target of the present invention is not limited to the wire bonding apparatus, and may be, for example, a pellet bonding apparatus.
In this case, the type of the lead frame is determined in the same manner as in the above embodiment, and in the case of semiconductor pellets, the type identification code attached to the semiconductor pellet positioned at the supply position or the semiconductor pellet in the wafer state is set to this supply position. It is preferable that an image is picked up by a recognition camera provided and the type of semiconductor pellet is discriminated based on the picked-up image.

[0047]

According to the present invention, work information can be easily set according to the types of semiconductor pellets and lead frames, and moreover, can be set reliably.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a wire bonding apparatus according to the present invention.

FIG. 2 is a configuration diagram of a main part of FIG.

FIG. 3 is a correspondence table of semiconductor pellets and reference patterns.

FIG. 4 is a correspondence table of lead frames and reference patterns.

FIG. 5 is a matrix table showing bonding information corresponding to a combination of a semiconductor pellet and a lead frame.

FIG. 6 is an enlarged view of a main part of a semiconductor pellet.

FIG. 7 is an enlarged view of a main part of a lead frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wire bonding apparatus 2 (a-d) Semiconductor pellet 3 (a-d) Lead frame 5 Type identification code attached to a semiconductor pellet 6 Type identification symbol attached to a lead frame 10 Supply part 20 Conveying means 30 Storage part 40 Bonding head 42 Bonding arm 43 Capillary 44 Camera (imaging means) 45 Image processing device (image processing means) 50 Control device 51 Control section 52 Setting section (setting means) 53 Comparison section (product type determination means) 54 Storage section 55 Display section ( Display means)

Claims (2)

[Claims] 1. An image pickup means for picking up an image of a product type discrimination portion provided on each of the semiconductor pellet and the lead frame, and an image processing means for processing an image picked up by the image pickup means.
Setting means for setting a reference pattern of a plurality of types of semiconductor pellets and individual lead frame type discrimination parts, and a plurality of references set in the setting means based on the image pattern processed by the image processing means A reference pattern that matches the image pattern is found from the patterns, and a type determination unit that determines the type of each of the semiconductor pellet and the lead frame by this, and a display unit that displays the type determined by the type determination unit. An apparatus for manufacturing a semiconductor device having. 2. An image pickup means for picking up an image of a product type discrimination portion provided on each of the semiconductor pellet and the lead frame, and an image processing means for processing an image picked up by the image pickup means.
A plurality of types of the semiconductor pellets and the reference pattern of the type discrimination portion of each of the lead frames, and setting means for setting work information corresponding to a plurality of combinations of the semiconductor pellets and the lead frame for each type,
Based on the image pattern processed by the image processing means, a reference pattern that matches the image pattern is found from among the plurality of reference patterns set by the setting means, and by this, the type of the semiconductor pellet and the lead frame. And the work information corresponding to the combination of the type of the semiconductor pellet and the type of the lead frame, which are determined by the type determining unit, is obtained from the setting unit, and the working unit is determined based on this work information. An apparatus for manufacturing a semiconductor device, comprising: a control unit that controls driving.