JPH05261923A - Inkjet printer head - Google Patents

Abstract

(57) [Summary] [Object] To provide an inkjet printer head capable of forming an electrode at a low cost by increasing an ink ejection amount. [Configuration] A resin material having a property that a proportion of tin of a Pd.Sn complex compound adsorbed when a catalyzing treatment of electroless plating is performed is larger than that when a similar treatment is applied to the piezoelectric member 2. The lower layer 15, the piezoelectric member 2 polarized in the plate thickness direction, the plurality of grooves 3 formed from the surface of the piezoelectric member 2 to the lower layer 15, and the plurality of columns 4 arranged on both sides of these grooves 3. And an electrode 8 formed by electroless plating on the surface of the pillar 4 excluding the lower layer 15 in the groove 3.
And a plurality of pressure chambers 14 formed by closing the opening surface of the groove 3 with the top plate 10 joined to the piezoelectric member 2.
By forming it in a part of, the amount of strain of the entire column 4 is increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an on-demand type ink jet printer head.

[0002]

2. Description of the Related Art An ink jet printer head has an invention disclosed in Japanese Patent Laid-Open No. 2-150355. This will be described below with reference to FIG. 30 is a bottom sheet.
The bottom sheet 30 has a polarity in the direction of the arrow, and has a large number of parallel grooves 31 and side walls 32 located on both sides of these grooves 31.
And a bottom surface 33. Then, the top sheet 35 is joined to the top 34 of the side wall 32 with the adhesive layer 36 to close the top opening surface of each groove 31. Further, metal electrodes 37 are formed by vapor deposition on the inner surface of the side wall 32, which is both inner surfaces of each groove 31, in a range of approximately half of the total height on the side of the top sheet 35.

That is, the bottom sheet 30 is held by a jig in a vacuum vapor deposition apparatus, and a parallel beam of vapor-deposited metal atoms is guided toward the bottom sheet 30 at an angle δ with respect to the side wall 32, as shown in FIG. As a result, a metal film is vapor-deposited on a part of one surface of the side wall 32. continue,
In the state where the bottom sheet 30 is rotated 180 degrees in the horizontal direction in FIG. 8, a parallel beam of vapor-deposited metal atoms is guided to the bottom sheet 30 in the same manner as the operation described above. As a result, the metallized electrodes 37 are formed in the upper half of both side surfaces of the side wall 32.
Is deposited. At this time, the metal film deposited on the top portion 34 of the side wall 32 is removed in the next process.

Pressure chambers are formed by closing each groove 31 with the top sheet 35. A supply port connected to the ink supply unit is provided at one end of these pressure chambers, and ink is provided at the other end of the pressure chambers. The inkjet printer head is completed by providing the ejection ports for ejecting.

In such an ink jet printer head, when voltages of opposite potentials are applied to the electrodes 37 of two adjacent side walls 32, the side walls 32 of this portion are applied.
Receives a potential in a direction orthogonal to the polarity of the bottom sheet 30 in the direction of the arrow and causes shear strain as shown by the dotted line in FIG. As a result, the volume of the pressure chamber (groove 31) between the side walls 32 in which the shear strain has occurred is rapidly reduced, the pressure of the pressure chamber is increased, and the ink is ejected from the ejection port.

Next, the invention described in JP-A-63-247051 will be described. As shown in FIG. 9A, the flow path 42 is formed by being surrounded by the bottom wall 38, the hard wall 39, the ceiling wall 40, and the actuator 41. The actuator 41 formed of piezoelectric ceramics and polarized in the Z-axis direction is a strip contacting the top wall 40.
A seal 43 is provided at one end and the lower end is joined to the bottom wall 38. Further, electrodes 44, 4 are provided on both sides of the actuator 41.
5 is formed. Further, a nozzle 46 is formed at the tip of the flow path 42. Therefore, when ink is supplied from the ink supply unit to the flow path 42 and an electric field is applied to the electrodes 44 and 45, the actuator 41 is distorted and the volume of the flow path 42 is compressed, as shown in FIG. Ink is ejected from the nozzle 46.

[0007]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The invention disclosed in Japanese Patent Publication No. 5 has the following four problems. The first problem is that the strain amount (displacement amount) of the side wall 32 cannot be increased. That is, the side wall 32
37 is provided with an electrode 37 in a part (approximately half of the depth of the groove 31), and a voltage is applied to a pair of electrodes 37 facing each other with the groove 31 in between, whereby an electric field perpendicular to the polarization direction of the bottom sheet 30 is generated. Then, the side wall 32 is distorted, but at this time, the side wall 32 distorts the upper part (the part where the electrode 37 is formed) of the lower part (electrode 37).
Deforms in the state where it is received at the part where is not formed). As a result, the lower portion of the side wall 32 becomes a resistance when the upper portion of the side wall 32 is distorted. Further, since the side walls 32 themselves are all made of the same material (piezoelectric material) and have high rigidity, the side walls 3
The strain amount of 2 cannot be increased. As a result, the volume change amount of the pressure chamber also becomes small.

The second problem is that the electrode forming method is complicated and the cost is high. First, the manufacturing cost becomes high because the electrode 37 is formed using an expensive vacuum vapor deposition apparatus. Further, in order to form the electrode 37 only on a part of the side wall 32 (approximately half the depth of the groove 31), the parallel beam of vapor-deposited metal atoms is emitted by regulating the angle δ with respect to the side wall 32. Since the electrode 37 is formed on one surface of the side wall 32, the bottom sheet 30 is rotated by 180 degrees and the parallel beam is emitted again, and the electrode 37 is formed on the other surface of the side wall 32. The cost will be higher.

A third problem is that it is not possible to apply a uniform electric field to the bottom sheet 30 made of a piezoelectric material. That is, since the piezoelectric material that is the material of the bottom sheet 30 is generally a fired member in which crystal grains are gathered, the ground surface formed to form the groove 31 is a rough ground surface in which the crystal grains appear as they are. .. On the other hand, the vapor deposition of the metal by the vacuum vapor deposition device for forming the electrode 37 is not vapor-deposited on the portion which does not face the vapor deposition metal atom emission source. Therefore, the metal is vapor-deposited only on the convex portion on the surface of the ground surface of the groove 31, and is not vapor-deposited on the concave portion, and the concave portion becomes a pin hole. Therefore, it is not possible to apply a uniform electric field to the bottom sheet 30.

A fourth problem is that it is necessary to form a protective film because the ground surface of the groove 31 is corroded by contact with ink, but it is difficult to form the protective film. As described above, the bottom sheet 30 is formed by the firing member in which the crystal grains are collected, and the ground surface having the unevenness formed when the groove 31 is formed corrodes when it comes into contact with the ink. However, because of the above-described reason, the electrode 37 has a pinhole, so that it cannot be expected to function as a protective film.

Next, the invention described in Japanese Patent Laid-Open No. 63-247051 will be described. The first problem is Figure 9
As shown in, the strip seal 43 having a size corresponding to the cross-sectional shape of the actuator 41 must be fixed to one end of many actuators 41, which requires a great number of steps.

The second problem is that the actuator 41, the bottom wall 38, and the hard wall 39 are in contact with ink, and no measure is taken to prevent corrosion by ink. It is possible to select a material that does not corrode from the relatively wide range of materials for the top wall 40, and the plate-shaped surface can be easily coated with a corrosion-resistant protective film by itself. 41, the bottom wall 38, and the hard wall 39 are formed by cutting a groove (flow path 42) in an integral piezoelectric ceramic, and the electrode 45 is provided in the groove. As described above, the method of providing the electrode 45 only on a part of the surface in the groove made of the same material can be considered only by the above-described vacuum deposition or sputtering in consideration of the width dimension of the groove, and therefore, the electrode 45. There are pinholes in. Further, since the bottom wall 38 and the hard wall 39 are in contact with the ink, corrosion by the ink is expected. Therefore, it is possible to cover the inside of the groove with a protective film, but a general method such as a vacuum deposition method or a sputtering method is one in which the coating film is formed only on the surface facing the evaporation source of the coating material. Yes, actuator 41, bottom wall 3
8. A protective film cannot be formed on the uneven cut surface of the hard wall 39.

[0013]

According to the present invention, Pd adsorbed when a catalyzing process of electroless plating is performed.
A lower layer made of a resin material having a higher proportion of tin in the complex compound of Sn than in the case where the same treatment is applied to the piezoelectric member, and the piezoelectric member polarized in the plate thickness direction and fixed to the lower layer. And a plurality of grooves formed from the surface of the piezoelectric member to the inside of the lower layer and a plurality of columns arranged on both sides of these grooves, and on the surface of the column except the lower layer in the groove. Electrodes formed by electroless plating, and a plurality of pressure chambers formed by closing the opening surface of the groove with a top plate joined to the piezoelectric member and connected to the ink supply unit and the ink ejection unit, respectively. Composed by.

[0014]

According to the present invention, a voltage is applied to the electrodes formed on the surface of the supporting column to distort the supporting column and the pressure in the pressure chamber is changed to eject the ink from the ink ejecting section, but the upper portion of the piezoelectric member is used. Since the support pillar can be formed by the support pillar and the lower support pillar made of a resin lower layer whose rigidity is considerably smaller than that of the piezoelectric member, it is possible to reduce the resistance of the lower support pillar to the strain of the upper support pillar. It is possible to improve the ejection characteristics of the ink droplets by increasing the strain amount of the entire column.

Further, the lower layer has a property that the proportion of tin in the Pd.Sn complex compound adsorbed when the catalyzing treatment of the electroless plating is performed is larger than that when the piezoelectric member is subjected to the same treatment. Since it is made of a resin material, the electrodes can be formed only on the upper pillars by the piezoelectric member, which further reduces the rigidity of the lower pillars as compared with the case where the electrodes are formed on the entire surface of the groove. Therefore, it is possible to further increase the strain amount of the entire column and further improve the ejection characteristics of the ink droplets.

Further, since the electrodes are formed by electroless plating, uniform electrodes without pinholes are formed on the surface of the piezoelectric member having irregularities, and therefore a uniform electric field is applied to the piezoelectric member. Since the electrodes can separate the piezoelectric member from the ink,
Corrosion of the piezoelectric member can be prevented. Furthermore, since the electrode forming method by electroless plating is a chemical treatment,
A large amount of processing can be performed at one time, which can reduce manufacturing costs.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. First, the configuration of the inkjet printer head will be described with reference to FIGS.
As shown in FIG. 3A, a resin-based adhesive containing an epoxy resin having a high adhesive strength as a main component is applied onto a substrate 1 formed of aluminum or glass having a high rigidity and a low thermal deformation. The piezoelectric member 2 polarized in the plate thickness direction is brought into contact with the adhesive and the adhesive is cured, whereby the substrate 1, the lower layer 15 made of the adhesive, and the piezoelectric member 2 are formed.
And are joined in a three-layer structure. As the adhesive used as the lower layer 15, a general structural adhesive is used, but defoaming treatment is performed to avoid inclusion of air bubbles. In addition, the piezoelectric member 2
In order to prevent polarization deterioration of the adhesive, the curing temperature of the adhesive is 130 ℃
The following is desired. In this embodiment, the product name Scotchweld 183 manufactured by Sumitomo 3M Limited is used.
An adhesive of 8B / A was used.

Subsequently, as shown in FIG. 3 (b), a large number of grooves 3 extending from the surface of the piezoelectric member 2 to the inside of the lower layer 15 are ground in parallel at predetermined intervals. Prior to the above, the bottom surface of the substrate 1 is cut with the surface of the piezoelectric member 2 as a reference to make the sum of the thicknesses of the substrate 1, the lower layer 15 and the piezoelectric member 2 constant, and the substrate 1 having high rigidity and no warping is cut. The depth of each groove 3 can be made constant by fixing to the bed of the machine and determining the grinding feed amount based on this bed. Of course, the same purpose can be achieved even if the grinding feed amount is determined on the basis of the upper surface of the piezoelectric member 2 without performing pre-grooving. In this process, the struts 4 located on both sides of the groove 3 are also formed, but these struts 4 are composed of the upper struts 4a formed by the piezoelectric member 2 and the lower layer 15 having low rigidity.
And the lower support column 4b. In this embodiment, the width of the grooves 3 is 86 μm, the arrangement pitch of the grooves 3 is 169 μm, the depth of the grooves 3 is 375 μm, and the thickness of the piezoelectric member 2 is 240 μm. The tool used for cutting the groove 3 is a diamond wheel of a dicing saw that cuts a wafer when forming a substrate for an IC. In this embodiment, NBCZ1080 or 10 manufactured by DISCO CORPORATION is used.
90 2-inch blade at 30,000 rpm. p. m. It was rotated and rotated at the number of revolutions of.

Next, as pretreatment before forming electrodes by electroless plating, cleaning, catalyzing, and accelerating treatments are performed. The cleaning is carried out for the purpose of activating the plating forming surface and hydrophilizing it so that the catalyst liquid or the plating liquid can easily enter the groove 3. In this embodiment, the cleaning is performed by using the ethanol liquid. It was The catalyzing treatment is palladium chloride, stannous chloride,
It is performed for the purpose of immersing it in a catalyst solution such as concentrated hydrochloric acid and adsorbing a complex compound of Pd.Sn on the surface of the groove 3. When the catalyzing process is performed, the Pd / Sn complex compound is adsorbed on the surfaces of the upper strut 4a and the lower strut 4b on the groove 3 side, but the lower strut 4 is different due to the difference in the material forming the strut 4.
The complex compound of b is a complex compound having a larger amount of tin than the complex compound of the upper support column 4a. Then, the acceleration processing is performed. This treatment is performed by immersing in a liquid such as hydrochloric acid and removing tin from the complex adsorbed by the catalyzing treatment to metallize P.
This is a process performed for the purpose of leaving only d. When this treatment is performed, the complex compound adsorbed on the upper support column 4a becomes metallized Pd, and the complex compound adsorbed on the surface of the lower support column 4b on the groove 3 side has a large amount of tin adsorption. Remains unremoved. When the above catalyzing treatment and accelerating treatment are carried out at a relative velocity of the object to be plated and the treatment liquid of 0.2 m / s or more, the pretreatment in the narrow groove 3 can be favorably performed, and plating without spots can be performed. It is formed. In this example, the surface roughening process, which is usually performed as a pretreatment for plating, was not performed. The reason is that since the cleaning method using no surfactant is used in the cleaning process, the surfactant does not remain on the surface of the groove 3 and the surface of the piezoelectric member is rough even if the surface roughening process is not performed. This is because the adhesion of plating is sufficient and the surface roughening process is not necessary.

Next, a mask is applied to the surface of the piezoelectric member 2 except the wiring pattern forming portion. In this method, as shown in FIG. 3C, a dry film 5 is attached to the surface of the piezoelectric member 2. Further, as shown in FIG. 4A, a resist mask 6 is placed thereon and exposure and development processes are performed. As a result, as shown in FIG. 4B, a resist film 7 made of a dry film is formed on the surface of the piezoelectric member 2 except the wiring pattern forming portion and the upper portion of the groove 3. And
Metallized Pd is present on the wiring pattern forming portion of the piezoelectric member 2 and on the surface of the upper pillar 4a on the groove 3 side.
A complex of Pd.Sn is present on the surface of the groove b on the side of the groove 3.

Next, the above-mentioned treatment is immersed in a plating solution to carry out electroless plating. The plating solution is composed of a main component composed of a metal salt and a reducing agent and auxiliary components composed of a pH adjusting agent, a buffering agent, a complexing agent, an accelerator, a stabilizer, an improving agent and the like. When the object to be plated consisting of the substrate 1, the lower layer 15 and the piezoelectric member 2 is dipped in this plating solution, plating is generated using metallized Pb as a catalytic nucleus, and plating is not generated in other portions. That is, the plating can be generated only on the surface of the upper support 4a on the groove 3 side and the surface of the piezoelectric member 2 on which the metalized Pb is adsorbed and the wiring pattern forming portion. In FIG. 5A, 8 is an electrode, 9 is a wiring pattern, and these are formed by electroless plating. In this embodiment, when a nickel-phosphorus-based low-temperature plating solution was used as the plating solution, the surface of the piezoelectric member 2 having irregularities formed of particles of 2 to 4 μm was plated, and there was no pinhole. Thickness is 1 to 2μ
m uniform nickel plated film was produced.

Next, as shown in FIG. 5 (b), the resist film 7 attached to the surface of the piezoelectric member 2 is peeled off, and subsequently, as shown in FIG. 5 (c), the surface of the piezoelectric member 2 is removed. The top plate 10 is adhered to the upper surface of the groove 3, and the nozzle plate 12 having a large number of ink ejection openings 11 as ink ejection portions communicating with the tips of the grooves 3 is fixed to the side surfaces of the substrate 1, the piezoelectric member 2, and the top plate 10. Then, the ink-jet printer head is completed by attaching the ink supply pipe 13 that supplies ink from the ink supply unit (not shown) to each groove 3 to the top plate 10. At this time, as shown in FIG. 1, the groove 3 is closed by the top plate 10 to form the pressure chamber 14.

A case in which ink is ejected from the central pressure chamber 14 in FIG. 1 in such a configuration will be described. Ink is supplied to each of the pressure chambers 14 from the ink supply pipe 13 shown in FIG. Here, a voltage A is applied between the electrode 8 of the central pressure chamber 14 and the electrode 8 of the pressure chamber 14 adjacent on the left side via the wiring pattern 9 so as to be adjacent to the electrode 8 of the central pressure chamber 14 on the right side. The voltage B is applied between the pressure chamber 14 and the electrode 8 of the pressure chamber 14. The polarities of the voltages A and B are opposite, and an electric field is applied to the upper support column 4a in a direction orthogonal to the polarization direction indicated by the arrow. As a result, the left column 4 of the central pressure chamber 14 is distorted to the left and the right column 4 is distorted to the right, increasing the volume of the central pressure chamber 14 and decreasing the volume of the pressure chambers 14 on both sides thereof.

FIG. 2 shows the relationship between the applied states of the voltages A and B and the time. The voltages A and B are gradually increased during a certain period a, so that the left and right pressure chambers 14 having a reduced volume are formed. Ink does not fly from the ink ejection port 11. The internal pressure of the central pressure chamber 14 decreases due to the increase in volume, and the meniscus of the ink ejection port 11 slightly retracts to suck ink from the communicating ink supply portion. At the time point of b in FIG. 2, a voltage opposite to the above is suddenly applied to the electrode 8, so that the left column 4 of the central pressure chamber 14 is distorted to the right side and the right column 4 is distorted to the left side. The volume of the pressure chamber 14 is rapidly reduced. As a result, the ink discharge port 1 of the central pressure chamber 14
Ink is ejected from 1. The voltage at this time is applied for a certain period as indicated by c in FIG. 2, and during this period, the tail portion of the flying ink droplet is not separated from the ink ejection port 11. When the voltage application to the electrode 8 is suddenly cut off at the time of d in FIG. 2, the distorted support column 4 returns to its original posture, so that the internal pressure of the central pressure chamber 14 sharply decreases, and therefore the ink ejection port 11 Ink is sucked inward and the tail portion of the flying ink droplet is separated. At the moment when the power supply to the electrode 8 is cut off, the internal pressure of the pressure chambers 14 on the left and right sides of the central pressure chamber 14 rises, but does not reach the pressure at which the ink is ejected from the ink ejection port 11.

As described above, the support column 4 includes the top plate 10.
A part of the side (upper pillar 4a) is formed by the piezoelectric member 2 having high rigidity, and the remaining part (lower pillar 4b) is formed by the lower layer 15 having lower rigidity than the piezoelectric member 2. The resistance force of the lower support column 4b against the strain force generated in the second upper support column 4a is small, so that the strain amount of the support column 4 is large and the ink droplet ejection characteristics are improved.

The present invention is not limited to the above embodiment. This will be described with some examples. First, electroless plating is not limited to nickel. Especially when using an ink that corrodes nickel, it is desirable to specify gold as electroless plating. Alternatively, the electrode 8 may be formed by electroless plating using an inexpensive metal, and a metal having corrosion resistance may be plated thereon.

Further, in the above embodiment, as shown in FIG.
The substrate 1, the lower layer 15, the piezoelectric member 2, and the top plate 10 are joined to form four layers to form an inkjet printer head. As shown in FIG. 6, the lower layer 16 and the piezoelectric member 2 top plate 10 are three layers. The inkjet printer head may be configured by being bonded to. The lower layer 16 is the same as the lower layer 15 in the above-mentioned embodiment, and the other structures are the same as those in the above-mentioned embodiment. In this case, the number of parts can be reduced.

Furthermore, although an adhesive containing an epoxy resin as a main component is used as the material for the lower layers 15 and 16, the present invention is not limited to this, and any resin having the following properties can be used.

First, according to the present invention, when the complexed substance attached to the surface of the piezoelectric member 2 is converted to metallized Pb by the acceleration processing, the complexed substance attached to the lower layers 15 and 16 is still a complexed substance. Utilizing that, the piezoelectric member 2
The electrode 8 is formed only on the above. Therefore, the characteristics required for the lower layers 15 and 16 are as follows. First, the complex compound adsorbed on the surface of the lower layers 15 and 16 in the catalyzing process is made of tin more than the complex compound adsorbed on the surface of the piezoelectric member 2. It is necessary that the ratio is high. As such a material, in addition to an adhesive containing an epoxy resin as a main component, a polyamide resin, a polyamide resin adhesive, etc. may be mentioned. The second required characteristic is that the rigidity of the material of the lower layers 15 and 16 must be smaller than the rigidity of the piezoelectric member in order to achieve the problem that the strain of the pillar 4 becomes large. The rigidity of most resins is the rigidity of the piezoelectric member 2.
Since it is one- ^{tenth of} 7 × 10 ¹⁰ N / m ² , most resins can be used as the lower layers 15 and 16.

Further, in the above-described embodiment, the voltage applying method shown in FIG. 2 is adopted as a method for energizing the ink jet printer head in order to stabilize the flying droplets. The voltage application method of 1 may be adopted.

[0031]

According to the present invention, the proportion of tin in the Pd.Sn complex compound adsorbed when the electroless plating catalyzing treatment is performed is larger than that when the piezoelectric member is subjected to the same treatment. A lower layer made of a resin material, a piezoelectric member polarized in the plate thickness direction and fixed to the lower layer, a plurality of grooves formed from the surface of the piezoelectric member to the inside of the lower layer, and these grooves. A plurality of pillars arranged on both sides of the groove, electrodes formed by electroless plating on the surface of the pillar except the lower layer in the groove, and a top plate in which the opening surface of the groove is joined to the piezoelectric member. Since it is formed by a plurality of pressure chambers that are respectively formed by blocking with the ink supply unit and the ink ejection unit, the columns are distorted by applying a voltage to the electrodes formed on the surface of the columns. Change the pressure of Although the ink is ejected from the ink ejecting portion, the support pillar can be formed by the upper support pillar made of a piezoelectric member and the lower support pillar made of a resin material having a rigidity considerably smaller than that of the piezoelectric member. Of the Pd.Sn complex compound, which is adsorbed when the electroless plating catalyzing treatment is performed, is applied to the piezoelectric member. Since it is made of a resin material that has more properties than in the case of, the electrodes can be formed only on the upper pillars of the piezoelectric member. The structure of the support pillar can be further reduced, and therefore, the distortion amount of the entire support pillar can be further increased and the ejection characteristics of the ink droplets can be extremely improved. Since the poles are formed by electroless plating, it is possible to form a uniform electrode without pinholes on the surface of the uneven piezoelectric member, and thus to apply a uniform electric field to the piezoelectric member. Moreover, since the piezoelectric member can be separated from the ink by the electrode, the corrosion of the piezoelectric member can be prevented. Furthermore, since the electrode forming method by electroless plating is a chemical treatment, a large amount of treatment can be performed at one time, which has the effect of reducing the manufacturing cost.

[Brief description of drawings]

FIG. 1 is a vertical sectional front view showing an embodiment of the present invention.

FIG. 2 is a timing chart showing applied voltages to electrodes.

FIG. 3 is a perspective view showing a process of forming an inkjet printer head.

FIG. 4 is a perspective view showing a process of forming an inkjet printer head.

FIG. 5 is a perspective view showing a process of forming an inkjet printer head.

FIG. 6 is a vertical sectional front view showing a modified example.

FIG. 7 is a vertical sectional front view showing a conventional example.

FIG. 8 is a front view showing a method of forming electrodes.

FIG. 9 is a vertical sectional front view showing another conventional example.

[Explanation of symbols]

 2 Piezoelectric member 3 Groove 4 Strut 8 Electrode 10 Top plate 11 Ink ejection part 14 Pressure chamber 15, 16 Lower layer

Front Page Continuation (72) Inventor Toshihiro Tsukamoto 985 Hodozawa, Gotemba City, Shizuoka Prefecture

Claims (1)

[Claims] 1. A resin material having a higher proportion of tin in a Pd.Sn complex compound adsorbed when a catalyzing treatment of electroless plating is applied than when a piezoelectric member is subjected to a similar treatment. A lower layer, a piezoelectric member polarized in the plate thickness direction and fixed to the lower layer, a plurality of grooves formed from the surface of the piezoelectric member to the inside of the lower layer, and arranged on both sides of these grooves. A plurality of pillars formed on the surface of the groove, electrodes formed by electroless plating on the surface of the pillar except the lower layer in the groove, and an opening surface of the groove is closed by a top plate joined to the piezoelectric member. And a plurality of pressure chambers that are respectively connected to the ink supply unit and the ink ejection unit.