JPH04310266A - Rotary substrate treatment apparatus - Google Patents

Abstract

PURPOSE:To reduce the labor required when new substrate treatment procedure is formed. CONSTITUTION:When a processing step (heat treatment step) for setting a process parameter (variable parameter) is indicated, a parameter setting screen for urging the setting of all of the process parameters related to the heat treatment step is displayed. When the parameter values of all of process parameters (heat treatment temp., a heat treatment time, heat treatment-related non- treatment time, a heat treatment-related treatment time, substrate temp. promising correction quantity) to be set are inputted by an input key, the data input of the heat treatment step is completed. Thereafter, new substrate treatment procedure for the setting input of the parameter values of process parameters and the reading of an initial parameter is formed with respect to the remaining treatment step in the same way to be stored.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention transports substrates such as semiconductor wafers and glass plates for liquid crystal panels to a plurality of processing equipment, supplies the required processing liquid to the transported substrates, performs substrate cleaning, thin film formation, etc. The present invention relates to a rotary substrate processing apparatus that performs rotational processing on a substrate.

0002

2. Description of the Related Art A rotary substrate processing apparatus of this type includes a plurality of processing devices that are driven based on a substrate processing procedure to process a substrate, as well as a substrate transport device for transporting the substrate to each processing device. These multiple processing devices include, for example,
Rotary processing equipment that supplies various processing solutions such as photoresist, developer, or ultrapure water to a rotating substrate and performs various rotational treatments on the substrate, and heat treatment such as hot plates and cool plates that perform heat treatment on the substrate. Examples include equipment. In addition, the order of substrate transfer to each processing device, the substrate processing conditions in each processing device, and various control parameters that are the control conditions of each processing device (substrate rotation speed, processing temperature, specification of processing liquid to be used, processing liquid discharge amount A plurality of substrate processing procedures for specifying (e.g.) are created individually depending on the desired substrate quality and stored in advance in the storage device of the rotary substrate processing apparatus.

[0003] When a certain substrate processing procedure is designated, the rotary substrate processing apparatus sequentially transports the substrates to the corresponding processing equipment based on the substrate transport order in the designated substrate processing procedure. In each processing device, the processing device is driven based on the control parameters in the substrate processing procedure, and the substrate is rotated.

0004

[Problems to be Solved by the Invention] By the way, when creating a new substrate processing procedure in accordance with the desired new substrate quality, it is necessary to check each control parameter included in the substrate processing procedure, such as heat processing temperature, processing liquid discharge amount, substrate Currently, the rotational speed, the deviation from the target value when performing so-called PID control, the integral amount, the differential amount, etc. are all inputted.

However, since a substrate processing procedure includes not only the above-mentioned control parameters but also a wide variety of other control parameters, creating a new substrate processing procedure requires a great deal of effort.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to reduce the labor involved in creating a new substrate processing procedure.

[0007]

[Means for Solving the Problems] The means adopted by the present invention to achieve the above object includes a plurality of processing equipment including a rotational processing equipment that performs rotational processing on a substrate using a required processing liquid; storage means for storing a plurality of substrate processing procedures including control parameters for the plurality of processing apparatuses, and a storage means for storing a plurality of substrate processing procedures including control parameters for the plurality of processing apparatuses, based on a substrate processing procedure specified from among the plurality of stored substrate processing procedures. A rotary substrate processing apparatus for controlling and processing a substrate, wherein control parameters of the processing equipment are changed to a common parameter as a control parameter common to the plurality of substrate processing procedures, and a common parameter as a control parameter common to the plurality of substrate processing procedures. parameter distinguishing means for distinguishing between a variable parameter and a variable parameter as a possible control parameter;
parameter input means for inputting the differentiated variable parameters; substrate processing procedure creation means for creating a substrate processing procedure including the input variable parameters and the common parameter; and storage means for storing the created substrate processing procedure. The gist thereof is to include a substrate processing procedure adding means for adding and storing substrate processing procedures.

Here, in distinguishing control parameters into common parameters and variable parameters, control parameters related to substrate processing conditions in each processing equipment (substrate rotation speed, processing temperature, processing liquid used, etc.) that directly affect substrate quality should be considered. designation, processing liquid discharge amount, etc.) are variable parameters that are frequently changed depending on the desired substrate quality, and control parameters related to the control conditions of each processing equipment (deviation from the target value when performing PID control and its integral amount) , differential quantity, control range upper limit value, lower limit value when performing temperature control, etc.) are set as common parameters common to multiple substrate processing procedures because they are rarely changed for each desired substrate quality.

Furthermore, even if the control parameters are related to the substrate processing conditions in each processing equipment that directly affect the substrate quality, if they are changed infrequently for each desired substrate quality, they can be used as common parameters common to multiple substrate processing procedures. Good too. In other words, the common parameters and variable parameters may be distinguished as appropriate depending on the influence of the control parameters on the substrate quality, the frequency at which changes are required, and the like.

0010

[Operation] The rotary substrate processing apparatus of the present invention having the above-mentioned configuration is configured such that when a variable parameter among the common parameters and variable parameters distinguished by the parameter distinguishing means is inputted from the parameter inputting means, the inputted variable parameter and A new substrate processing procedure including the common parameters is created by a substrate processing procedure creation means. Then, the newly created substrate processing procedure is added to and stored in the storage means by the substrate processing procedure adding means.

[0011] In other words, input of control parameters necessary for creating a new substrate processing procedure can be accomplished only by inputting variable parameters.

0012

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a preferred embodiment of the rotary substrate processing apparatus according to the present invention will be described with reference to the drawings. First, the outline of the rotary substrate processing apparatus of this embodiment will be briefly explained using FIG. 1, which is a schematic perspective view of the apparatus.

The rotary substrate processing apparatus 1 is an apparatus for rotating a substrate such as a semiconductor wafer, and applying a photoresist or the like onto the surface of the substrate and subjecting it to heat treatment.As shown in FIG. 2 and a substrate processing section 3. In the following description, in order to clearly distinguish between the two, the former substrate supply section 2 will be referred to as the substrate transfer unit 2, and the substrate processing section 3 will be referred to as the process processing unit 3.
It will be called.

The substrate transfer unit 2 takes out the substrates W from the cassettes C1 to C4 storing the substrates W in multiple stages and transfers them to the substrate transfer position P, which is a substrate transfer position, and transfers the substrates W from the substrate transfer position P. Then, the substrate W is stored in any cassette that can accommodate the substrate. The process processing unit 3 includes a plurality of various types of processing equipment, including a rotational processing equipment that supplies the required processing liquid to the substrate and performs the rotational processing, as will be described later, and processes the substrate by driving each of these processing equipment, etc. do.

Next, each of the above units will be explained. As shown in FIG. 1, the substrate transfer unit 2 has two cassettes C1 and C2 storing substrates W in multiple stages and two cassettes C3 and C4 not storing substrates on the upper surface of the cassette installation stand 4.
Equipped with Further, a substrate transfer device 6 for taking out the substrate W from each cassette and storing the substrate W in each cassette is provided so as to be horizontally movable in the direction of arrow D in the figure along the arrangement of the cassettes C1 to C4.

A main operation panel 5 is built into the front of the cassette installation stand 4 for giving various instructions to the substrate transfer unit 2 and the process processing unit 3, which will be described later. The main operation panel 5 includes a keyboard 5a (see FIG. 2) for making various settings and numerical inputs, a display 5b (see FIG. 2) for displaying various screens based on instructions from the keyboard 5a, and a touch screen. and a switch.

As shown in FIG. 1, the substrate transfer device 6 includes a substrate suction arm 7 that sucks and adsorbs the substrate W on its lower surface.
It is movable up and down along the direction in which the substrates W are stacked in the cassette, and the arrow E in the figure extends between the standby position in front of the cassette and the take-out position shown in the cassette.
It is equipped to be able to move forward and backward in the direction.

For this purpose, the substrate transfer device 6 is moved horizontally in the direction of arrow D in the figure to the front of the desired cassette, and
After that, the substrate suction arm 7 rises to a height corresponding to the substrate storage groove of the desired stage in the cassette, the substrate suction arm 7 enters into the cassette, the substrate suction arm 7 rises slightly again, and the substrate suction arm 7 rises again. Retract, substrate suction arm 7
By sequentially lowering the substrates W, the removal of the substrates W from the cassette is completed. Also, by reversing this procedure, remove the substrate suction arm 7.
By moving the substrate W, storage of the substrate W into the cassette is completed.

In this way, the substrate taken out from the cassette is transferred to the substrate transfer position P by the substrate transfer device 6, and then transferred to the substrate transfer device 37 attached to the process processing unit 3, which will be described later. It is sequentially conveyed to a spin coating device and processed. Further, the processed substrate that has been processed is returned to the substrate transfer position P by the substrate transfer device 37, and then stored in a predetermined cassette by the substrate transfer device 6.

The substrate transfer device 6 includes the substrate suction arm 7
In addition, in order to horizontally support the substrate W taken out from the cassette by the substrate suction arm 7, three support pins (not shown) are provided on the base 9 so as to be movable up and down. In addition, in order to align the center of the substrate W supported by each of these support pins, a position is provided with four guide pins protruding from each other in an arrangement that has approximately the same curvature as the outer diameter of the substrate W. A mating plate 10 is provided on both sides of the base 9 so as to be horizontally reciprocatable. Therefore, when each alignment plate 10 is horizontally reciprocated with the substrate W supported by each support pin raised from the base 9, each guide pin comes into contact with and separates from the outer periphery of the substrate W, so that the substrate The center alignment of W is completed.

Further, on the top surface of the cassette installation table 4, there is a cassette for inputting the procedure number numeric code necessary to identify the cassette containing the substrate to be processed, the substrate processing procedure, the processing order for each cassette, etc. A cassette control panel 18 (see FIG. 2) is provided. Further, a substrate detection optical sensor 24 (see FIG. 2) is provided to detect the presence or absence of a substrate W housed in each cassette. This optical sensor 24 is connected to the optical sensor elevating mechanism 2
5 (see FIG. 2), the presence or absence of substrates in the cassette is detected all at once in correspondence with the number of stages of substrate storage grooves in the cassette. Note that the correspondence with the number of stages of the substrate storage grooves is performed using pulses generated by the timing detection sensor 42 (see FIG. 2) based on the movement state of the slits having the same pitch as the substrate storage grooves of the cassette.

The process processing unit 3 that receives the substrate from the substrate transfer unit 2 and processes it is shown in FIG.
As shown in , there are spin coating devices 31 and 32 that drop a processing liquid onto the surface of a rotating substrate to form a thin film of the processing liquid, and heat treatment devices that heat treat (heat and cool) the substrate before and after processing with the spin coating device. 33, 34, and 35. Furthermore, each spin coating device 31, 32 and heat treatment device 33, 34, 3
A substrate transport device 37 is provided which is horizontally movable in the direction of arrow A in the figure along the line 5. Note that, as shown in the figure, each heat treatment device includes a heating heat treatment device in the upper stage and a cooling heat treatment device in the lower stage.

[0023] These spin coating equipment and heat treatment equipment are as follows:
It is provided with a separate controller (described later) that receives loads of various control parameters in a substrate processing procedure from a main controller 50 (see FIG. 2), which will be described later, and a rotation speed sensor, a temperature sensor, etc. (not shown). Then, each spin coating equipment and heat treatment equipment receives feedback from the controller attached to each processing equipment based on the detection signals of these sensors and the control parameters (control command values) related to the processing conditions in the loaded substrate processing procedure, which will be described later. controlled.

The substrate transfer device 37 is equipped with a head 39 that is rotatable in the direction of arrow B in the figure on the upper surface of a stage 38 that is horizontally movable in the direction of arrow A in the figure by a drive system (not shown). Letter-shaped board support arms 37a, 3
7b in two stages, upper and lower. Further, each substrate support arm 37a, 37b is configured to be able to move in and out from the head 39.

The process processing unit 3 configured as described above controls the drive of the substrate transfer device 37 based on the transfer process in a predetermined substrate processing procedure, and moves the substrate transfer device 37 from the substrate transfer position P in the substrate transfer unit 2, such as the above-mentioned spin coating device. The substrates are sequentially transported to the necessary processing equipment among the plurality of processing equipment. Then, the substrate is processed by the spin coating equipment, etc. to which the substrate was transported, based on the processing conditions of the substrate processing procedure, and the processed substrate, which has been processed in each processing equipment, is returned to the substrate transfer position P. do.

Next, the control system in the above-mentioned rotary substrate processing apparatus 1 will be explained using the block diagram shown in FIG. This control system in this embodiment includes a main controller 50 that centrally controls the entire rotary substrate processing apparatus 1.
In addition, as a sub-controller, a board transfer unit controller 60 that controls the board transfer unit 2,
A substrate transport equipment controller 37A, which is a controller for each processing equipment constituting the process processing unit 3;
Spin coating device controller 31A for each spin coating device,
32A and heat treatment equipment controller 3 for each heat treatment equipment
3A, 34A, and 35A.

The main controller 50 is configured as a logic operation circuit mainly including a well-known CPU 51 that executes logic operations, a ROM 52 that pre-stores various programs for controlling the CPU, and a RAM 53 that temporarily stores various data. It has a built-in storage disk 54 on which data can be written and data can be held at any time, and which stores a large amount of data in advance, which will be described later.

[0028] This main controller 50 is
An input/output port 56 interconnected with the CPU, etc. via a common bus 55 allows input/output with the outside, e.g.
Data is transferred between the main operation panel 5 described above, the substrate transfer unit controller 60, the substrate transfer equipment controller 37A, and the controllers 31A to 35A for each processing equipment.

The substrate transfer unit controller 60 is connected not only to the optical sensor 24 and the timing detection sensor 42, but also to the substrate transfer device 6, the cassette control panel 18, the optical sensor lifting mechanism 25, and the like. Then, signals from each of these sensors and the cassette control panel 18, as well as arithmetic operation data obtained by the controller, are output to the main controller 50. The cassette control panel 18, optical sensor 24, timing detection sensor 42, optical sensor lifting mechanism 25, etc. are mounted on the cassette installation stand 4.
Each of the four cassettes C1 to C4 is provided on the upper surface of the cassette, and each is connected to the board transfer unit controller 60.

Next, a substrate processing procedure for driving and controlling each of the above-mentioned processing equipment will be explained. There are multiple types of substrate processing procedures, and as shown in Figure 3, each of them corresponds to a procedure number numerical code for specifying each substrate processing procedure and control parameters related to processing conditions or control conditions in each processing equipment. The information is written and stored in the storage disk 54 in advance.

To explain in more detail, as shown in FIG. 3, for each procedure number numerical code, for each necessary processing step, the process symbol representing the process in each process step, and the processing equipment that performs the process. , and control parameters in that process are written.

In other words, the symbols in the column of process symbols for each treatment step correspond to the respective process names, with the process symbol AD representing the heating step before applying the treatment liquid, AC representing the cooling step before applying the treatment liquid, and SC representing the cooling step before applying the treatment liquid. SB represents a treatment liquid application step, and SB represents a heating step after application of the treatment liquid. Also, when multiple processing devices (processing devices 1, 2, etc.) are written in the same processing step (heating heat processing devices 33a, 34a of processing step 1 in procedure number numerical code 01)
indicates that processing can be performed with any processing device. However, the smaller the numerical value of the processing device, the more preferentially it will be used. For example, in the case of the procedure number numerical code 01, the heating heat treatment equipment 33a in the processing equipment 1 column is used with priority, and if the heating heat treatment equipment 33a is currently being processed and cannot be used, the processing equipment 2 The heating heat treatment equipment 34a in the column is used.

[0033] Processing steps other than processing step 3 are heat treatment steps before and after applying the processing liquid, as indicated by the process symbols AD, AC, SB, etc., and as described in the processing conditions column, the corresponding processing equipment is used. It includes numerical data representing various control parameters (control command values) such as processing temperature and processing time when controlling the process.

Processing step 3 of each processing step is as follows:
As can be seen from the process symbol SC, this is a processing liquid application process using a rotary processing device, and since the processing liquid application is repeated, the processing step is further divided into the first step part, second step part, etc. It has separate data.

That is, in processing step 3, which is a processing liquid application process, the processing liquid is applied while rotating the substrate, so the designation of multiple types of processing liquids, processing rotation speed, rotational acceleration, processing liquid discharge time ( In addition to being executed based on a large number of control parameters (control command values) such as discharge amount), rotation processing using different processing liquids (chemical liquids) is repeatedly performed. For this reason, processing step 3 includes many types of condition data, much more than other processing steps, but care has been taken to ensure that all of this can be stored without any trouble.

As described above, the storage disk 54 records a plurality of types of substrate processing procedure condition data including a huge amount of processing condition data. Then, when a certain procedure number numerical code, for example, a procedure number numerical code of 00, is specified, the substrate processing procedure at this time is to first perform heat treatment in the heating heat treatment equipment 33a before applying the treatment liquid (processing step 1). ), then a cooling treatment is performed using the cooling heat treatment equipment 33b (processing step 2), followed by a treatment liquid application process using the rotary coating equipment 32 (processing step 3), and a heat treatment is performed after applying the treatment liquid. This is carried out using the heating heat treatment equipment 35a (processing step 4). Of course, if data is created and stored for processing step 5 and subsequent steps, processing will be performed accordingly.

The control parameters (hereinafter referred to as process parameters) that directly affect substrate quality, such as the substrate rotation speed and processing temperature, can be changed as necessary for each substrate processing procedure. In addition, in heat treatment steps such as processing steps 1, 2, and 4, in addition to the set processing temperature, the substrate surface temperature is set in consideration of the difference between the temperature of the plate making up the heat treatment equipment and the actual substrate surface temperature. Correction amount for temperature (estimated board temperature correction amount)
are also stored as control parameters.

Control parameters related to control conditions for maintaining the control state of each processing device in the control state indicated by the above process parameters (hereinafter, these control parameters are referred to as initial parameters) are changed for each desired substrate quality. Although there is very little need to do this and it is common to multiple substrate processing procedures, it can be changed like the process parameters described above.

The initial parameters include the deviation from the target value when performing PID control of the processing equipment, its integral amount, and differential amount, the upper limit of the control range when performing substrate processing,
In addition to those related to control conditions such as lower limits, parameters that contribute to equipment maintenance by notifying the presence or absence of abnormal situations in each processing equipment, such as temperature abnormalities and rotation abnormalities (alarm upper and lower limits, alarm upper and lower limits) rotation speed, etc.).

In addition to the data regarding the plurality of types of substrate processing procedures described above, the storage disk 54 stores data for each process in each substrate processing procedure, such as a heat treatment process, a treatment liquid coating process, etc. , an initial parameter map as shown in FIG. 4, in which the above-mentioned initial parameters and their parameter values are associated with each other, is stored. These initial parameters are stored for each process such as a heat treatment process, a treatment liquid application process, etc., and are included together with process parameters for each process step in the substrate processing procedure.

Note that the initial parameters may be stored for each process such as a heat treatment process, a treatment liquid application process, etc. without being associated with each process step in the substrate processing procedure. In this case, data for reading the initial parameters may be entered in the data column of each processing step in the substrate processing procedure shown in FIG. 3, and the initial data may be read based on the data each time the substrate is processed.

As shown in FIG. 4, the initial parameters in the heat treatment process include temperature control parameter P (deviation), temperature control parameter I (integral amount), and temperature control parameter D (differential) when performing PID control of heat treatment equipment. quantity), as well as
The upper and lower limit parameters of the appropriate processing temperature control range centered on the set processing temperature, and the abnormality for determining and reporting the occurrence of temperature abnormalities (excessive temperature rise state or state of temperature not rising to the set processing temperature) The upper and lower limit parameters of the notification temperature are included. Initial parameter values (a0, b0, etc.) are set in advance for each of these initial parameters. In addition, the initial parameters in the processing liquid coating process include each parameter when performing PID control of the spin coating equipment, as well as the upper and lower limit parameters of the appropriate control range centered on the set processing liquid temperature and the set substrate rotation speed, and the processing Examples include abnormality notification upper and lower limit parameters for reporting abnormality in liquid temperature and abnormality in substrate rotation.

Data is written to the storage disk 54 by inputting data from the main operation panel 5, as will be described later. In addition, the above data is input in advance to an external storage device 70 (see FIG. 2) that writes and stores data on a storage medium such as a magnetic tape or a flexible disk, and then the input/output port 56 from this external storage device 70 is connected. Data may also be written to the storage disk 54 by data transfer via a computer.

[0044] Selection of a desired substrate processing procedure from among the plurality of substrate processing procedures stored in this manner is performed by key inputting the numerical value of the procedure number numeric code on the cassette control panel 18, main operation panel 5, etc. Executed by

[0045] When the procedure number numerical code is specified when starting substrate processing, each parameter (process parameter and initial parameter) in each processing step of the corresponding substrate processing procedure is transmitted from the main controller 50 to the corresponding processing equipment. Loaded into the included controller. For example, when a procedure number numerical code of 00 is specified, each parameter in processing step 1 and processing step 2 is loaded into the heat processing equipment controller 33A attached to the heat processing equipment 33, which has the heating heat processing equipment 33a and the cooling heat processing equipment 33b. . Similarly, each parameter in processing step 3 is loaded into the spin coating device controller 31A attached to the spin coating device 31, and each parameter in processing step 4 is loaded into the heating heat treatment device 35a.
is loaded into the heat treatment equipment controller 35A attached to the heat treatment equipment 35 having the following.

Each of the controllers 37A, 31A to 35A that has received the control parameters loaded in this manner performs substrate processing while performing feedback control on each processing device based on the loaded control parameters and detection signals from the sensors. Note that, like the main controller 50, the controller attached to each processing device is a well-known CPU, RO
Although it is configured as a logical operation circuit mainly including M, RAM, etc., detailed explanation thereof will be omitted.

Next, substrate processing procedure creation control performed by the rotary substrate processing apparatus 1 of this embodiment having the above-described configuration will be explained based on the flowcharts of FIGS. 5 and 6. The flowchart in FIG. 5 is an initial parameter setting routine that is executed interruptively every time a predetermined key operation on the keyboard 5a or a touch switch or the like operation on the main operation panel 5 (initial parameter setting ON operation) is performed to set the initial parameters. represents. Further, the flowchart in FIG. 6 represents a new substrate processing procedure creation routine that is interruptedly executed every time a new substrate processing procedure creation ON operation is performed using the touch switch or the like.

As shown in the flowchart of FIG. 5, the initial parameter setting routine, when the above-mentioned initial parameter setting ON operation is performed, first performs a process for each process content in which initial parameters are edited, such as a heat treatment process, a treatment liquid coating process, etc. Whether or not a process such as a process has been designated is determined based on whether or not a predetermined key on the keyboard 5a or a touch switch on the main operation panel 5 is operated (
Step 100 (hereinafter step will simply be referred to as S). Then, it waits until a processing step is specified. In the following description of the initial parameter setting routine, a case will be described in which a heat treatment process is designated in S100.

Thereafter, the initial parameters regarding the instructed process (heat treatment process) are read from the initial parameter map shown in FIG. 4 (S110), and are displayed on the display 5b as shown in FIG. 7 (S120). In addition, when displaying, the character string at the top of the initial screen (temperature control parameter P) is displayed in reverse video so as to prompt the user to input changes to the initial parameters one after another.

After this initial screen is displayed, whether or not it is necessary to change the parameter value of each initial parameter in the processing step (heat treatment step) specified in S100 is determined based on the presence or absence of numerical key input from the numeric keypad on the keyboard 5a and the main The determination is made based on whether or not a touch switch (next screen, top menu, end of editing work) is pressed on the operation panel 5 (S130). Here, if there is a numerical key input, it is determined that the parameter value of the initial parameter needs to be changed, and the process moves to the next step S140. Note that processing when each of the touch switches is pressed will be described later.

[0051] If there is a numerical key input in S130, it is determined that the parameter value in the highlighted character string is to be changed, and the input numerical value is updated as a new parameter value in the highlighted character string. Remember(
S140). That is, the initial parameter map in FIG. 4 is rewritten. After that, the process moves to S130.

For example, if a numerical value a1 is input while the character string on the top row is highlighted (initial screen), it is determined that the parameter value a0 is to be changed to the input numerical value a1, and the temperature control parameter P a1 as the parameter value of
and stores it (S140). In this way, when a parameter value is changed in the character string in the top row that was previously highlighted, the inverted display column is becomes the character string (temperature control parameter I) of the next stage. Then, if there is a numeric key input again in S130, the parameter value in the highlighted character string (temperature control parameter I) in the next row is changed to the input numeric value and stored.

[0053] Before inputting the numerical keys, the main operation panel 5
When the down arrow key (not shown) is pressed,
It is determined that it is not necessary to change the parameter value in the inverted character string, and the inverted character string is set as the character string in the next stage, and prompting to input a change in the initial parameter in the next stage.

That is, by repeating the processing in S130 and S140, the setting of parameter values for all initial parameters in the processing step (heat treatment step) specified in S100 is completed. Specifically, parameter value settings for the six types of initial parameters displayed are completed. Note that setting a parameter value means that the corresponding parameter value is either changed or maintained.

On the other hand, in S130, instead of inputting numerical values, touch switches on the main operation panel 5 (next screen,
When either the top menu or the end of editing work is pressed, it is determined that parameter values have been set for all initial parameters in the processing step (heat treatment step) specified in S100, and processing is performed based on each switch. Do the following.

In other words, in S130, when a touch switch is pressed instead of inputting a numerical value, the process moves to S131. In S131, it is determined whether the pressed touch switch is for the next screen, and whether it is the next screen, For example, in the processing of this routine, a control signal is output for displaying a screen for setting initial parameters in the next processing step. Therefore, when the next screen switch is pressed, it is determined that the parameter values of the initial parameters in the next processing step, such as the processing liquid application step, are to be set, and the process moves to S100, and the subsequent steps described above are performed. Process.

In addition, in S131, if the pressed touch switch is not for the next screen, that is, if the touch switch for the top menu or end of editing work was pressed, the initial parameter setting routine shown in FIG. 5 is terminated. do. The top menu switch outputs a control signal to end the currently executed routine and display a screen for selecting this routine or another routine not shown, and the editing work end switch outputs a control signal to display the screen for selecting this routine or another routine not shown. A control signal indicating that the editing work has been completed is output. Therefore, when these two switches are pressed, it is assumed that parameter value settings for all initial parameters in all processing steps, including the processing step (heat treatment step) specified in S100, have been completed, and this routine starts. end.

Next, the new substrate processing procedure creation routine will be explained based on the flowchart of FIG. As shown in the flowchart of FIG. 6, this new substrate processing procedure creation routine starts with a processing step of setting process parameters (variable parameters) when the above-mentioned new substrate processing procedure creation ON operation is performed. Whether a processing step such as processing step 1 or processing step 2 in FIG. 3 has been designated is determined based on the presence or absence of a predetermined key operation on the keyboard 5a or an operation of a touch switch or the like on the main operation panel 5 (S200). Then, it waits until a processing step is specified. In the following description of the new substrate processing procedure creation routine, we will explain the case where a heat treatment step (any of processing steps 1, 2, 4, etc. in FIG. 3), which is one of the heat treatment steps, is specified in S200. explain.

Thereafter, a parameter setting screen for prompting setting of all process parameters related to the instructed processing step (heat treatment step) is displayed on the display 5b as shown in FIG. 8 (S210). As shown in the figure, this display screen displays the initial parameters set for the heat treatment step, which is a process related to this heat treatment step, in the initial parameter setting routine described above, and the process parameters to be set (heat treatment temperature, heat treatment time, heat treatment-related non-treatment time). , heat treatment-related processing time, and estimated substrate temperature correction amount).

[0060] Also, on the initial screen, the initial value 0 is displayed as the parameter value of each of the above-mentioned process parameters. Note that here, the heat treatment-related processing time is
When performing other treatments in parallel with heat treatment, for example, when applying a treatment liquid to the substrate surface or irradiating ultraviolet rays, etc. while performing heat treatment, these treatments (treatment liquid application, ultraviolet irradiation, etc.) should be performed in parallel. It's time. The heat treatment-related non-processing time determines the start timing of these parallel processes. That is, after the time specified by the heat treatment-related non-processing time has elapsed from the start of the heat treatment, parallel processing is performed for the time specified by the heat treatment-related processing time. As mentioned above, the estimated substrate temperature correction amount is
This is a correction amount (correction temperature) for adjusting the substrate surface temperature to the set processing temperature in consideration of the difference between the ambient temperature and the actual substrate surface temperature.

[0061] After this screen is displayed, in order to set a desired numerical value to the parameter value of each process parameter in the processing step (heat treatment step) specified in S200, it is determined whether or not there is a numerical key input from the numeric keypad on the keyboard 5a. (S220) and waits until there is a numerical key input.

[0062] If there is a numerical key input here, the parameter value of the process parameter (heat treatment time) at the top row is rewritten to the input numerical value and this is stored (S23).
0). At this time, the input numerical value is also displayed on the display screen.

[0063] Thereafter, it is determined whether parameter values have been set for all process parameters in the processing step (heat treatment step) specified in S200 (S240), and if a negative determination is made, that is, all process parameters have been set. If the parameter value setting for is not completed, the process moves to the above S220.

That is, by repeating the processing in S220 and S230, the setting of parameter values for all process parameters in the processing step (heat treatment step) specified in S200 is completed. Specifically, parameter value settings for the five types of process parameters displayed are completed.

[0065] When it is determined in S240 that parameter value settings for all process parameters have been completed, parameter value settings for process parameters are completed for all processing steps including the processing step (heat treatment step) specified in S200. It is determined whether or not the process has been completed (S250). This judgment is made by pressing the next screen switch or the editing work end switch described above. In other words, when the next screen switch is pressed, it is determined that the parameter values of the process parameters in the next processing step, such as processing step 3 (processing liquid application step) in FIG. 3, are to be set, and the process moves to S200. The following processes described above are performed.

On the other hand, when the editing end switch is pressed, an affirmative determination is made in S250, assuming that the parameter value setting work for all process parameters in all processing steps shown in FIG. 3 has been completed. Note that even if the editing work end switch is pressed before the setting input of parameter values for all process parameters (5 types) in FIG. 8 is completed, an affirmative determination is not made in S250 and it is processed as an operation error.

When the parameter value setting work for all the process parameters in all the process steps shown in FIG. (S260), and waits until the corresponding numeric key input is made. If there is a numeric key input, the input numeric value is stored as a procedure number numeric code, and then initial parameter data for each process is updated and stored in the initial parameter setting routine described above (Figure 4). (S270).

After that, data is constructed for each processing step based on the parameter values of the read initial parameters and the process parameters set for each processing step as described above to create a new substrate processing procedure. , this is added to the storage disk 54 and stored in association with the procedure number numerical code input in S270 (S2
80). In other words, in the substrate processing procedure data shown in FIG.
Records worth of data (all data related to new substrate processing procedures) are added. Thereafter, the processing of this routine ends.

As explained above, according to the rotary substrate processing apparatus 1 of this embodiment, the process parameters can be set for each processing step necessary for new substrate processing.
Since a new substrate processing procedure can be created, the labor involved is significantly reduced.

Moreover, in this embodiment, since initial parameters common to substrate processing procedures are also set, processing equipment can be precisely controlled for a wide variety of substrate processing. As a result, the stability of substrate quality can be improved, for example, by providing upper and lower temperature limits of the appropriate processing temperature control range around the set processing temperature.

Although one embodiment of the present invention has been described above, the present invention is not limited to this embodiment in any way, and can be implemented in various ways without departing from the gist of the present invention. Of course. For example, in the above embodiment, the process parameter is the amount of correction for adjusting the substrate surface temperature to the set processing temperature by taking into account the difference between the ambient temperature and the actual substrate surface temperature, but this parameter is set as the initial parameter. Good too. Furthermore, although the configuration is such that initial parameters are also set, it is of course possible to configure the initial parameters to remain fixed and not change.

[0072]

[Effects of the Invention] As explained above, according to the rotary substrate processing apparatus of the present invention, among all the control parameters for each processing step necessary for substrate processing, the control parameters that are common to the substrate processing procedure that determines the substrate processing are A new substrate processing procedure can be created by simply inputting settings for parameters other than the parameters to be used. As a result, it is not necessary to input the settings of the common parameters for each processing step, and it is possible to reduce the effort required to create a new substrate processing procedure.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view of a rotary substrate processing apparatus 1 according to an embodiment.

FIG. 2 is a block diagram of a control system centered on a main controller 50 in the rotary substrate processing apparatus 1.

FIG. 3 is an explanatory diagram for explaining a substrate processing procedure when rotating a substrate in the process processing unit 3.

FIG. 4 is an explanatory diagram for explaining the substrate processing procedure and processing in the initial parameter setting routine.

FIG. 5 is a flowchart showing an initial parameter setting routine.

FIG. 6 is a flowchart showing a new substrate processing procedure creation routine.

FIG. 7 is an explanatory diagram for explaining processing in a new substrate processing procedure creation routine.

FIG. 8 is an explanatory diagram for explaining processing in a new substrate processing procedure creation routine.

[Explanation of symbols]

1 Rotary substrate processing device 2 Substrate transfer unit 3 Process processing unit 4 Cassette installation stand 5 Main operation panel 5b Display 50 Main controller 60 Substrate transfer unit controller C1, C2, C
3, C4 cassette W board

Claims (1)

[Claims] 1. Storage means for storing a plurality of processing devices, including a rotational processing device that performs rotational processing on a substrate using a required processing liquid, and a plurality of substrate processing procedures including control parameters for the plurality of processing devices. A rotary substrate processing apparatus that processes a substrate by controlling the plurality of processing equipment based on a substrate processing procedure specified from among the plurality of stored substrate processing procedures, the processing equipment parameter distinguishing means for distinguishing the control parameters into common parameters as control parameters common to the plurality of substrate processing procedures and variable parameters as control parameters changeable for each of the plurality of substrate processing procedures; parameter input means for inputting the input variable parameters; substrate processing procedure creation means for creating a substrate processing procedure including the input variable parameters and the common parameter; and adding the created substrate processing procedure to the storage means. 1. A rotary substrate processing apparatus, comprising: a substrate processing procedure addition means for adding and storing substrate processing procedures.