JP7503363B2 - Method and device for cutting workpiece - Google Patents

Description

The present invention relates to a cutting method for cutting a workpiece attached to a tape with a cutting blade.

Conventionally, in order to facilitate handling of wafers that have been cut into individual pieces using a cutting blade, it has been known to apply tape to the backside of the wafer before cutting (see, for example, Patent Document 1).

When a circular wafer is cut and divided into individual chips, scrap chips called triangular chips are formed near the outer edge of the wafer. Scrap chips have a smaller area than chips on which devices are formed, and because the outer edge of the wafer is chamfered and arc-shaped in the thickness direction, the adhesive strength between the scrap chips and the tape is weak. For this reason, there is a concern that scrap chips may peel off from the tape and fly off during cutting, causing so-called chip fly-off. If the peeled chips collide with the cutting blade, it could damage the cutting blade.

Therefore, Patent Document 1 discloses a configuration in which the adhesive strength (stickiness) of the glue on the outer periphery of the wafer is stronger than that of other areas.

JP 2013-21109 A

However, special tapes with areas of different adhesive strength are expensive. Also, when strengthening the adhesive strength of the outer edge of the wafer to prevent the above-mentioned triangular chips from flying off, the area with strong adhesive strength must be precisely aligned with the outer edge of the wafer before it is attached, and improvements were desperately needed.

In consideration of the above problems, the present invention provides a new cutting method that can prevent chipping without using special tape.

The problem that this invention aims to solve is as described above, and next we will explain the mechanism for solving this problem.

According to one aspect of the present invention,
A method for cutting a workpiece by using a cutting blade, comprising the steps of:
A tape application step of applying a workpiece to a tape having a base material and a glue layer formed thereon;
a heating step for heating the tape after the tape application step to improve the adhesive strength of the tape to the workpiece;
a holding step of holding the workpiece on a holding table via the tape after the heating step is performed;
a cutting step of cutting the workpiece with a cutting blade while cutting the tape after the holding step is performed;
The cutting method for a workpiece comprises the steps of:

According to another aspect of the present invention,
The cutting device including the holding table has a heating unit,
The heating step is carried out in the heating unit;
This is a method for cutting a workpiece.

According to another aspect of the present invention,
The method further includes a preheating step of heating the tape after the tape application step and before the heating step.
This is a method for cutting a workpiece.

According to another aspect of the present invention,
A cutting apparatus for carrying out the above-mentioned method for cutting a workpiece,
a holding table that holds the workpiece attached to the tape via the tape;
a spindle to which a cutting blade for cutting the workpiece held by the holding table is detachably attached;
a moving mechanism for moving the holding table relative to the spindle;
a cassette placement table on which a cassette capable of accommodating a plurality of the workpieces is placed;
a heating unit for heating the tape attached to the workpiece;
a conveying mechanism for conveying the workpiece from the cassette placed on the cassette placement table to the heating unit and from the heating unit to the holding table;
The cutting device is equipped with:

According to one aspect of the present invention, the contact area between the workpiece and the tape is increased, improving the adhesive strength per unit area between the two, making it possible to prevent chipping near the outer edge, and eliminating the need to use a special tape with areas of different adhesive strength.

Furthermore, according to one aspect of the present invention, the adhesive strength between the workpiece and the tape can be improved immediately before cutting by the cutting unit of the cutting device, making it possible to perform cutting while maintaining the adhesive strength, and more effectively preventing chipping.

Furthermore, according to one aspect of the present invention, by going through the pre-heating step, a second heating is performed in the heating step, and the adhesive strength between the workpiece and the tape can be further improved compared to when the pre-heating step is not performed.

Furthermore, according to one aspect of the present invention, it is possible to perform the heating step using the cutting device alone, and the adhesive strength between the workpiece and the tape can be improved immediately before cutting processing using the cutting unit of the cutting device.

1 is a diagram showing an embodiment of a cutting device for implementing the present invention; 13A and 13B are diagrams illustrating an embodiment of a cassette mounting mechanism. 1A is a diagram showing one embodiment of a heating unit, and FIG. 1B is a diagram showing a state in which a work unit is placed on the heating unit. 1 is a flowchart showing an embodiment of a cutting method according to the present invention. 1 is a diagram showing an embodiment of a work unit in which a workpiece, which is an object to be processed, is attached to a tape. FIG. 1A is a diagram illustrating a holding step, and FIG. 1B is a diagram illustrating a cutting step. FIG. 13 is a diagram showing the work unit after a cutting step has been performed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
In the following description, an XYZ Cartesian coordinate system is set as shown in Fig. 1, and the positional relationship of each part is described with reference to this XYZ Cartesian coordinate system. One end direction in a horizontal plane is the X-axis direction, a direction perpendicular to the X-axis direction in the horizontal plane is the Y-axis direction, and a direction perpendicular to both the X-axis direction and the Y-axis direction is the Z-axis direction. The X-Y plane including the X-axis and Y-axis is parallel to the horizontal plane. The Z-axis direction perpendicular to the X-Y plane is the vertical direction.

The cutting device 1 shown in FIG. 1 is a dicer that cuts a workpiece W. The workpiece W is not particularly limited, but may be, for example, a semiconductor wafer, an optical device wafer, an inorganic material substrate, a ductile resin material substrate, or any other type of processing material. The workpiece W and an annular frame F are attached to a tape T and handled as a work unit U.

As shown in FIG. 1, the cutting device 1 comprises a device body 2, a cassette mounting table 3, a first gate-type column 4, and a second gate-type column 5. The device body 2 is formed in a rectangular parallelepiped shape. The cassette mounting table 3 is disposed in a rectangular shape on the upper surface of the device body 2. The first gate-type column 4 and the second gate-type column 5 are disposed on the upper surface of the device body 2 so as to be parallel to each other with a gap therebetween.

The cassette 10 placed on the cassette placement table 3 contains multiple workpieces W before and after processing, and is placed on the cassette placement table 3, which rises and falls. The cassette 10 has an opening 10b (Figure 2) on the side facing the transport mechanism 60.

The cutting device 1 includes a holding table 20, a processing unit 30, a cleaning and drying mechanism 40, a temporary placement mechanism 50, a transport mechanism 60, an X-axis movement mechanism (not shown), a Y-axis movement mechanism 80, and a Z-axis movement mechanism 90.

The holding table 20 has a holding surface 21 that suction-holds the workpiece W. The holding table 20 is moved for processing in the X-axis direction relative to the device body 2 by an X-axis movement mechanism (not shown). The holding surface 21 of the holding table 20 is positioned at a loading/unloading position where the workpiece W is loaded and unloaded, and at a processing start position where the workpiece W is processed by the processing unit 30. The holding table 20 is rotatably mounted around an axis parallel to the Z-axis direction relative to the device body 2.

The processing unit 30 processes the workpiece W held on the holding table 20. Two processing units 30 are arranged at a distance in the Y-axis direction, sandwiching the holding table 20. The processing unit 30 is moved along a movement path parallel to the Y-axis direction by the Y-axis movement mechanism 80, and moved along a movement path parallel to the Z-axis direction by the Z-axis movement mechanism 90.

The processing unit 30 includes a cutting blade 31a, a spindle 31b, and a housing 31c. The cutting blade 31a is a cutting grindstone formed in an extremely thin, disk-like and annular shape. The cutting blade 31a is detachably attached to the spindle 31b. The housing 31c has a drive source such as a motor, and supports the spindle 31b so that it can rotate around an axis parallel to the Y-axis direction. The housing 31c is supported by the second gate-shaped column 5 so that it can move parallel to the Y-axis direction and parallel to the Z-axis direction. The housing 31c positions the cutting blade 31a at a processing start position where cutting is performed on the workpiece W, and at a retracted position before and after cutting is performed on the workpiece W.

The cleaning and drying mechanism 40 cleans and dries the workpiece W after machining. The cleaning and drying mechanism 40 sprays a cleaning liquid such as pure water toward the workpiece W held on the cleaning table 41 to clean it, and sprays clean air (compressed air) toward the workpiece W to dry it. The cleaning table 41 suction-holds the workpiece W in the same way as the holding table 20.

The temporary placement mechanism 50 temporarily places the workpiece W transferred from the cassette 10 placed on the cassette placement table 3. The temporary placement mechanism 50 has a pair of guide rails 51 that support the workpiece W transferred from the cassette 10, and the distance between the guide rails 51 in the X-axis direction is adjusted by an adjustment mechanism (not shown).

Specifically, the pair of guide rails 51 are positioned at a temporary placement position where the work unit U is temporarily placed, a centering position where the distance between them is narrower in the X-axis direction than at the temporary placement position and the work unit U is centered, and a separation position where the work unit U can pass between the guide rails and the distance is set wider than at the temporary placement position.

The transport mechanism 60 includes a first transport mechanism 61 and a second transport mechanism 62 for transporting the work unit U.

The first transport mechanism 61 transports the work unit U between the cassette 10, the temporary placement mechanism 50, the holding table 20, and the cleaning table 41 of the cleaning/drying mechanism 40. Specifically, the first transport mechanism 61 is configured to be movable in the Y-axis direction and the Z-axis direction, and transports the work unit U that has been removed from the cassette 10 and temporarily placed in the temporary placement mechanism 50 to the holding table 20. The first transport mechanism 61 also transports the work unit U from the cleaning table 41 of the cleaning/drying mechanism 40 to the temporary placement mechanism 50.

The second transport mechanism 62 transports the work unit U between the holding table 20 and the cleaning table 41 of the cleaning/drying mechanism 40. The second transport mechanism 62 is configured to be movable in the Y-axis direction and the Z-axis direction, and transports the work unit U out of the holding table 20 and into the cleaning table of the cleaning/drying mechanism 40.

The Y-axis movement mechanism 80 moves the processing unit 30 relative to the device body 2 in parallel to the Y-axis direction (corresponding to the indexing feed direction). The Y-axis movement mechanism 80 is composed of a linear motion mechanism including a ball screw, a pulse motor, a guide rail, etc. The Y-axis movement mechanism 80 is equipped with a Y-axis movable base 81 that is supported so as to be movable parallel to the Y-axis direction relative to the second gate-shaped column 5.

The Z-axis movement mechanism 90 moves the processing unit 30 relative to the device body 2 in parallel to the Z-axis direction (corresponding to the cutting feed direction). The Z-axis movement mechanism 90 is composed of a linear motion mechanism similar to the Y-axis movement mechanism 80, including a ball screw, a pulse motor, a guide rail, etc. The Z-axis movement mechanism 90 is equipped with a Z-axis movable base 91 that is supported so as to be movable parallel to the Z-axis direction relative to the Y-axis movable base 81. The processing unit 30 is provided at the lower end of the Z-axis movable base 91 in the Z-axis direction, and by moving the Z-axis movable base 91 parallel to the Z-axis direction, the processing unit 30 moves parallel to the Z-axis direction.

The various mechanisms constituting the cutting device 1 described above are controlled by the controller 100, and workpiece transportation, cutting processing, etc. are performed automatically.

Next, as shown in FIG. 2, the cassette mounting mechanism 32 that supports the cassette mounting table 3 so that it can be raised and lowered will be described. The cassette mounting mechanism 32 includes a heating unit 34 disposed below the cassette mounting table 3, and a lifting mechanism 35 for moving the cassette mounting table 3 in the up and down direction. The heating unit 34 and the lifting mechanism 35 are controlled by the controller 100.

The heating unit 34 is for heating the tape T to which the workpiece W is attached, and is provided in a chamber 33a formed by the housing 33. The housing 33 is fixed to the top of the support table 36 and rises and falls together with the support table 36.

An opening 33b is formed in the housing 33 on the side facing the clamp mechanism 61a of the first conveying mechanism 61 (Figure 1). The work unit U, whose annular frame F is clamped by the first conveying mechanism 61, is carried into the chamber 33a through the opening 33b, and is also carried out of the chamber 33a through the opening 33b.

The lower end of the support base 36 is provided with a guided portion 36a that is guided by a guide rail 35a that is provided vertically along the side wall 2b of the device body 2, and a nut portion 36b through which a ball screw 35b that is provided vertically is inserted. When the ball screw 35b is driven to rotate by the pulse motor 35c, the support base 36 moves vertically along the guide rail 35a. The support base 36 and the lifting mechanism 35 are housed in the internal space 2a of the device body 2 (Figure 1).

The housing 33 rises and falls together with the support base 36, the cassette mounting base 3 that constitutes the top plate of the housing 33 rises and falls, and the cassette 10 placed on the cassette mounting base 3 also rises and falls.

The cassette 10 has multiple stages of placement shelves 10a on which the work units U are placed, and the work units U are slid into each placement shelf 10a through the opening 10b of the cassette 10.

The opening 10b of the cassette 10 is positioned to face the clamp mechanism 61a of the first conveying mechanism 61 (Figure 1). The work unit U, whose annular frame F is clamped by the first conveying mechanism 61, is carried into the cassette 10 through the opening 10b, and is also carried out of the cassette 10 through the opening 10b.

Figures 3(A) and (B) are diagrams showing an example of the configuration of the heating unit 34. Figure 3(A) shows a side view in the YZ-axis plane, similar to Figure 2, and Figure 3(B) shows a side view in the XZ-axis plane. Figure 3(A) shows a state in which the work unit U is not placed, and Figure 3(B) shows a state in which the work unit U is placed.

As shown in Figures 3(A) and (B), the heating unit 34 is installed in a housing 33 disposed below the cassette mounting table 3. The heating unit 34 is configured to include a support base 34a, a heating table 34b provided on the upper part of the support base 34a, and a pair of support rails 34c provided on the upper part of the heating table 34b.

The heating table 34b is formed with a flat heating surface 34d on which the back surface of the tape T of the work unit U is placed. In this embodiment, the area of the heating surface 34d is configured to be larger than the area of the tape T to which the work W is attached, and is configured so that the area including the outer periphery of the work W can be efficiently heated in a short time.

The heating table 34b is provided with a heater 34e for raising the temperature of the heating surface 34d. In this embodiment, the heater 34e is installed below the heating surface 34d and is configured as a surface heater that can simultaneously heat a large area approximately equal to that of the heating surface 34d. The surface heater can be configured, for example, as an electric heating coil wound in a spiral shape.

The heating table 34b can be made of a metal with high thermal conductivity, such as SUS, to efficiently transfer heat from the heater 34e to the heating surface 34d.

As shown in FIG. 3B, a pair of support rails 34c are provided at both ends of the heating table 34b in the X-axis direction for placing the annular frame F of the work unit U. The support rails 34c are configured with a roughly L-shaped cross section, and when the work unit U is placed on the support rails 34c, the annular frame F is disposed between the vertical wall surfaces of both support rails 34c, and the work W is positioned so that it is located above the heating surface 34d.

As shown in FIG. 3(A), the support rail 34c is arranged to extend in the Y-axis direction and is configured to guide the annular frame F when the work unit U is transported in the Y-axis direction by the first transport mechanism 61 (FIG. 2).

Next, we will explain the processing method using the device configuration described above and the procedure shown in Figure 4.

<Tape application step S1>
As shown in FIG. 5, this is a step in which a workpiece W is attached to the tape T having a base material Ta and an adhesive layer Tb formed thereon.

The workpiece W in the example shown in Figure 5 is a semiconductor wafer made of silicon as a base material, and on the surface Wa of the disk-shaped workpiece W, devices Wd such as ICs and LSIs are formed in multiple areas partitioned in a grid pattern by multiple streets Ws (planned division lines).

The back surface Wb of the workpiece W is attached to an adhesive layer Tb formed on the substrate Ta of the tape T. The substrate Ta is, for example, polyolefin, polyvinyl chloride, or polyethylene terephthalate. The adhesive layer Tb is, for example, an acrylic or rubber-based pressure-sensitive adhesive.

An annular frame F made of a metal such as SUS is attached to the adhesive layer Tb of the tape T so as to surround the workpiece W.

In this manner, a work unit U is formed in which the work W, the annular frame F, and the tape T are integrated. As shown in FIG. 1, the work unit U is housed in a cassette 10, and the cassette 10 is supplied to the cassette mounting table 3.

<Heating step S2>
After the tape application step, the tape T is heated to improve the adhesive strength between the tape T and the workpiece W.

Specifically, in the configuration of Figures 1 to 3, the cassette mounting table 3 is raised and lowered, and the height position of the work unit U to be processed contained in the cassette 10 is positioned at a height opposite the clamp mechanism 61a of the first transport mechanism 61. Next, the clamp mechanism 61a moves forward toward the work unit U to be processed, enters the cassette 10, clamps the work unit U, and then retreats.

The cassette placement table 3 then rises, and the opening 33b of the housing 33 is positioned at a height opposite the clamp mechanism 61a of the first transport mechanism 61. The clamp mechanism 61a, which had been retracted, then advances, causing the work unit U to enter the chamber 33a and to load the work unit U onto the heating table 34b of the heating unit 34.

As shown in FIG. 3B, the workpiece W is placed on the heating surface 34d via the tape T, and heating of the tape T is started by energizing the heater 34e. The heating conditions are set according to the type and size of the tape T and workpiece W, and for example, heating is performed at 90°C for 15 minutes.

This heating causes the base material Ta and adhesive layer Tb that make up the tape T to soften due to the increased temperature, increasing the contact area between the workpiece W and the tape T and improving the adhesive strength per unit area between the two. In particular, by increasing the adhesive strength over a wide area up to the point corresponding to the outer periphery of the workpiece W, it is possible to prevent chipping near the outer periphery, as described below.

<Retention step S3>
As shown in FIG. 6A, this is a step in which the workpiece W is held by the holding table 20 via the tape T after the heating step S2 is performed.

Specifically, as shown in FIG. 2, the work unit U is clamped by the clamp mechanism 61a of the first transport mechanism 61 and transported out of the housing 33, and as shown in FIG. 1, the work unit U is temporarily placed on the temporary placement mechanism 50 and positioned by a pair of guide rails 51. Next, the first transport mechanism 61 transports the work unit U placed on the guide rails 51 to the holding table 20.

As shown in FIG. 6(A), on the holding table 20, the back surface Wb of the workpiece W is suction-held to the holding surface 21 of the holding table 20 via the tape T, and the annular frame F is held by the clamp 22.

<Cutting step S4>
As shown in FIG. 6B, after the holding step S3 is performed, the cutting blade 31a is caused to cut into the tape T while cutting the workpiece W with the cutting blade 31a.

Specifically, the cutting blade 31a is positioned at a predetermined cutting height in the Z-axis direction and rotated at high speed, the position of the cutting blade 31a in the Y-axis direction (Figure 1) is aligned with the position of the street Ws (Figure 5) of the workpiece W, and the holding table 20 is fed for processing in the X-axis direction to perform cutting processing on the workpiece W.

The index feed of the cutting blade 31a in the Y-axis direction and the processing feed of the holding table 20 in the X-axis direction are repeated to perform cutting processing on all the streets Ws (Figure 5) extending in the first direction, and then the holding table 20 is rotated 90 degrees and similar cutting processing is performed on the streets Ws (Figure 5) extending in the second direction perpendicular to the first direction.

By performing the cutting process as described above, the workpiece W is divided into individual chips C, as shown in Figure 7. During this cutting process, scrap chips Ca (triangular chips) are formed near the outer edge of the workpiece W, and these scrap chips Ca have a small contact area with the tape T. However, by undergoing the heating step S2 described above, the adhesive strength is increased, so it is possible to prevent the scrap chips Ca from peeling off from the tape T and flying away.

<Preheating Step Sa>
In the above embodiment, as shown in FIG. 4, a pre-heating step Sa for heating the tape may be carried out between the tape applying step S1 and the heating step S2.

This pre-heating step Sa need only be performed between the tape application step S1 and the heating step S2, and is not limited to any particular method.

For example, before being stored in the cassette 10 (Fig. 1), multiple work units U may be heated in a closed heating device (oven), or one work unit U may be heated in an open heating device (hot plate). The heating conditions are not particularly limited, but may be, for example, heating at 90°C for 30 minutes. After heating, the work units are stored in the cassette 10 (Fig. 1), and the cassette 10 is supplied to the cassette loading table 3.

Also, the preheating step Sa may be performed by the heating unit 34. That is, the preheating step Sa is performed by transporting the work unit U from the cassette 10 to the heating unit 34, heating it, and then returning it to the cassette 10.

In the above-described preheating step Sa, as in the heating step S2, the base material Ta and adhesive layer Tb that constitute the tape T soften due to the increase in temperature, increasing the contact area between the workpiece W and the tape T, thereby improving the adhesive strength per unit area between the two.

By going through the pre-heating step Sa, a second heating is performed in the heating step S2, and the adhesive strength between the workpiece W and the tape T can be further improved compared to when the pre-heating step Sa is not performed.

The present invention can be realized in the above manner.
That is, as shown in FIGS.
A method for cutting a workpiece W, which is a workpiece, with a cutting blade 31a, comprising the steps of:
A tape application step S1 in which a workpiece W is applied to a tape T having a base material Ta and an adhesive layer Tb formed thereon;
After performing the tape application step S1, a heating step S2 is performed in which the tape T is heated to improve the adhesive strength of the tape T with the workpiece W;
After the heating step S2 is performed, a holding step S3 is performed in which the workpiece W is held on the holding table 20 via the tape T.
After carrying out the holding step S3, a cutting step S4 is carried out in which the cutting blade 31a is caused to cut into the tape T while cutting the workpiece W with the cutting blade 31a;
The cutting method for the workpiece W is provided with the above.

This increases the contact area between the workpiece W and the tape T, improving the adhesive strength per unit area between the two, making it possible to prevent chipping near the outer edge and eliminating the need to use a special tape with areas of different adhesive strength.

Also, as shown in FIGS.
The cutting device 1 equipped with the holding table 20 has a heating unit 34,
The heating step S2 is to be carried out by the heating unit 34.

This makes it possible to improve the adhesive strength between the workpiece W and the tape T immediately before cutting by the cutting unit 30 of the cutting device 1, making it possible to perform cutting while maintaining high adhesive strength, and more effectively preventing chipping.

Also, as shown in FIG.
After performing the tape application step S1 and before performing the heating step S2, a pre-heating step Sa of heating the tape T is further provided.

In this way, by going through the pre-heating step Sa, a second heating is performed in the heating step S2, and the adhesive strength between the workpiece W and the tape T can be further improved compared to when the pre-heating step Sa is not performed.

Also, as shown in FIGS.
A cutting device 1 for performing a cutting method for a workpiece W,
A holding table 20 that holds the work W attached to the tape T via the tape T;
A spindle 31b to which a cutting blade 31a for cutting the workpiece W held by the holding table 20 is detachably attached;
a moving mechanism (X-axis moving mechanism) (not shown) that moves the holding table 20 relative to the spindle 31b;
A cassette mounting table 3 on which a cassette 10 capable of accommodating a plurality of works W is mounted;
a heating unit 34 for heating the tape T attached to the workpiece W;
The cutting device 1 is equipped with a conveying mechanism (first conveying mechanism 61) that conveys the workpiece W from the cassette 10 placed on the cassette mounting table 3 to the heating unit 34 and from the heating unit 34 to the holding table 20.

This makes it possible to perform the heating step using the cutting device 1 alone, and improves the adhesive strength between the workpiece W and the tape T immediately before cutting processing using the cutting unit 30 of the cutting device 1.

1 Cutting device 2 Device body 3 Cassette placement table 10 Cassette 20 Holding table 30 Processing unit 31a Cutting blade 31b Spindle 32 Cassette placement mechanism 33 Housing 33a Chamber 33b Opening 34 Heating unit 34a Support table 34b Heating table 34c Support rail 34d Heating surface 34e Heater 35 Lifting mechanism 61 First conveying mechanism 61a Clamping mechanism C Chip Ca Scrap chip F Annular frame S1 Tape application step S2 Heating step S3 Holding step S4 Cutting step Sa Preheating step T Tape Ta Substrate Tb Glue layer U Work unit W Work Wa Front surface Wb Back surface Wd Device Ws Street

Claims (3)

A method for cutting a workpiece by using a cutting blade, comprising the steps of:
a tape application step of applying a workpiece to a tape having a base material and a glue layer formed thereon to form a work unit ;
a heating step of, after carrying out the tape application step, storing the work unit in a cassette, placing the cassette storing the work unit on a cassette placement table, removing the work unit from the cassette, and heating the tape to improve the adhesive strength of the tape to the workpiece;
a holding step of holding the workpiece on a holding table via the tape after the heating step is performed;
a cutting step of cutting the workpiece with a cutting blade while cutting the tape after the holding step is performed;
A method for cutting a workpiece , comprising:
The cutting device having the holding table has a heating unit provided in a housing having the cassette mounting table as a top plate ,
The heating step is carried out in the heating unit;
A method for cutting a workpiece , comprising : After performing the tape application step, the method further includes a preheating step of heating the tape before the work unit is accommodated in a cassette .
2. The method for cutting a workpiece according to claim 1 . A cutting apparatus for carrying out the method for cutting a workpiece according to claim 1 or 2 ,
a holding table that holds the workpiece attached to the tape via the tape;
a spindle to which a cutting blade for cutting the workpiece held by the holding table is detachably attached;
a moving mechanism for moving the holding table relative to the spindle;
a cassette placement table on which a cassette capable of accommodating a plurality of the workpieces is placed;
a heating unit provided in a housing having the cassette mounting table as a top plate, the heating unit heating the tape attached to the workpiece;
a conveying mechanism for conveying the workpiece from the cassette placed on the cassette placement table to the heating unit and from the heating unit to the holding table;
A cutting device comprising: