JP7572837B2 - Component Mounting System - Google Patents

Description

The present invention relates to a component mounting system.

Conventionally, there is a known method for identifying the cause of a component not being mounted in the proper position (hereinafter referred to as misalignment) on a component mounting line where multiple mounting machines that mount components on a board are arranged along the board transport direction. For example, Patent Document 1 describes a method for identifying the cause of misalignment by capturing an image of the board with a camera installed on each mounting machine and detecting differences between the images captured by each camera and master data when components are properly mounted on the board.

JP 2008-103411 A

By the way, using the method described in Patent Document 1, the following processing must be performed before identifying that the cause of misalignment is in the process of transporting the board to the downstream component mounter. Specifically, first, an image of the board before it is transported to the downstream component mounter is captured, and the image before transport is compared with the corresponding master data to confirm that no differences have been detected. Then, an image of the board after it has been transported to the downstream mounter is captured, and the image after transport is compared with the corresponding master data to confirm that no differences have been detected. In other words, it is necessary to compare both the image before transport and the image after transport with the master data, and it is not possible to efficiently identify the cause of misalignment.

This disclosure has been made to solve these problems, and its main purpose is to efficiently identify the cause of misalignment when misalignment occurs during the transport process of transporting the board to a downstream component mounter after components have been mounted.

The component mounting system of the present disclosure comprises:
a component mounting line in which n (n is an integer of 2 or more) component mounters that hold boards and mount components on the boards are arranged along a conveying direction of the boards;
an imaging device provided for each of the component mounters, which captures an image of the board held by the component mounter;
a control device that inputs a pre-transport image before the board is transported from the kth (k is an integer equal to or greater than 1 and equal to or less than (n-1)) component mounter from the upstream side in the transport direction to the (k+1)th component mounter and a post-transport image after the board is transported from the kth component mounter from the upstream side in the transport direction to the (k+1)th component mounter, and uses the pre-transport image and the post-transport image to determine a positional deviation amount before and after transport of at least some of the components mounted by the kth component mounter and the component mounter arranged upstream of the kth component mounter, and performs a defect judgment that determines that a defect has occurred during the kth transport process from the kth component mounter to the (k+1)th component mounter if the positional deviation amount exceeds an allowable positional deviation range;
It is equipped with the following:

In this component mounting system, the control device inputs a pre-transport image before the board is transported from the kth component mounter from the upstream side in the transport direction to the (k+1)th component mounter, and a post-transport image after the board is transported from the kth component mounter from the upstream side in the transport direction to the (k+1)th component mounter. The control device also uses the pre-transport image and the post-transport image to determine the amount of positional deviation before and after transport of at least a part of the components mounted by the kth component mounter and the component mounter arranged upstream of the kth component mounter. Furthermore, if the amount of positional deviation exceeds the positional deviation tolerance range, the control device determines that a defect has occurred in the kth transport process from the kth component mounter to the (k+1)th component mounter. That is, by comparing the image captured by the component mounter located upstream in the transport direction with the image captured by the component mounter located downstream, it is determined whether or not a defect has occurred in the transport process. Therefore, when identifying the transport process in which the defect has occurred, it is not necessary to compare the images before and after transport with the master data. This makes it possible to efficiently identify the cause of the situation in which the amount of misalignment exceeds the allowable range of positional misalignment, and determine whether it is due to a problem in the transport process.

FIG. 1 is a perspective view showing a schematic configuration of a component mounting system 1. FIG. 2 is an external perspective view of the component mounter 10. FIG. 2 is a block diagram showing the electrical connection between a control device 60 and a management device 80. 11 is a flowchart showing an example of a component mounting routine. 2 is a diagram showing a state in which components are mounted by a component mounter 10; FIG. 13 is a diagram showing an example of target mounting position data 95. 4 is a flowchart showing an example of a malfunction determination routine. FIG. 13 is a diagram showing an example of a pre-transport image Im1. FIG. 13 is a diagram showing an example of a post-transport image Im2. FIG. 13 is a diagram showing an example of a post-transport image Im2. FIG. 9 is a diagram showing an example of an inspection result 90.

Next, a form for implementing the invention of this disclosure will be described with reference to the drawings. FIG. 1 is a schematic diagram of a component mounting system 1 of this embodiment. FIG. 2 is an external perspective view of a component mounter 10, and FIG. 3 is a block diagram showing the electrical connection relationship between a control device 60 and a management device 80. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in FIGS. 1 and 2.

As shown in FIG. 1, the component mounting system 1 includes a printer 2, a print inspection machine 3, a component mounting line 12, an appearance inspection device 13, and a management device 80 that manages the entire system. The printer 2 prints solder on a board S to form a circuit pattern. The print inspection machine 3 inspects the state of the solder printed by the printer 2. A plurality of component mounters 10 perform a mounting operation to mount components on the board S, and also perform mounting inspection to determine whether or not the components have been mounted on the board S. The printer 2, print inspection machine 3, component mounting line 12, and appearance inspection device 13 are installed side by side in the transport direction of the board S (from left to right) to form a production line.

As shown in FIG. 1, the component mounting line 12 has n (n is an integer of 2 or more, here 5) component mounters 10 arranged along the transport direction (X-axis direction) of the board S. As shown in FIG. 2, the component mounter 10 includes a component supply device 21 that supplies components, a board transport device 22 that transports the board S, a head 40 having a suction nozzle that picks up the components, a head moving device 30 that moves the head 40 in the X-axis direction and the Y-axis direction, and a control device 60 (see FIG. 3) that controls the entire mounter. In addition to these, the component mounter 10 also includes a part camera 23 for capturing an image of the suction posture of the component picked up by the suction nozzle, a nozzle station 24 that houses a replacement suction nozzle, and a mark camera 43 for capturing an image of the board S. The mark camera 43 is a camera whose lower part is an imaging area and which reads reference marks M1 and M2 attached to the board S that indicate the reference position of the board S and the reference position for placing components. In addition, the n component mounters 10 arranged on the component mounting line 12 will be referred to as the first component mounter 10, the second component mounter 10, ..., the nth component mounter 10, in order from upstream in the transport direction of the board S.

The visual inspection device 13 is disposed downstream of the component mounting line 12. The visual inspection device 13 is an inspection device that uses a camera (not shown) to capture an image of the board S transported from the nth component mounter 10 from above, and determines, based on the captured image, whether the amount of deviation between the actual mounting position and a predetermined target mounting position for each component on the board S falls within the visual inspection tolerance range.

The component supply device 21 is configured as a tape feeder that includes, for example, a tape reel on which a carrier tape containing components at predetermined intervals is wound, and a tape feed mechanism that pulls out the carrier tape from the tape reel by driving a drive motor and feeds it to a component supply position. This component supply device 21 (tape feeder) is detachably attached to a feeder table (not shown) that the component mounter 10 includes.

The board transport device 22 has a pair of conveyor rails spaced apart in the Y-axis direction, and transports the board S from left to right (transport direction) in FIG. 1 by driving the pair of conveyor rails.

As shown in FIG. 2, the head moving device 30 includes a pair of X-axis guide rails 31, an X-axis slider 32, an X-axis actuator 33 (see FIG. 3), a pair of Y-axis guide rails 35, a Y-axis slider 36, and a Y-axis actuator 37 (see FIG. 3). The pair of Y-axis guide rails 35 are installed on the upper stage of the housing 11 so as to extend parallel to each other in the Y-axis direction. The Y-axis slider 36 is hung on the pair of Y-axis guide rails 35 and moves in the Y-axis direction along the Y-axis guide rails 35 by driving the Y-axis actuator 37. The pair of X-axis guide rails 31 are installed on the lower surface of the Y-axis slider 36 so as to extend parallel to each other in the X-axis direction. The X-axis slider 32 is hung on the pair of X-axis guide rails 31 and moves in the X-axis direction along the X-axis guide rails 31 by driving the X-axis actuator 33. A head 40 is attached to the X-axis slider 32, and the head moving device 30 moves the head 40 in the X-axis and Y-axis directions by moving the X-axis slider 32 and the Y-axis slider 36.

The head 40 is equipped with a Z-axis actuator 41 (see FIG. 3) that moves the suction nozzle in the Z-axis (up and down) direction, and a θ-axis actuator 42 (see FIG. 3) that rotates the suction nozzle around the Z axis. The head 40 can suck up a component by applying negative pressure to the suction port by connecting a negative pressure source to the suction port of the suction nozzle. The head 40 can also release the suction of the component by applying positive pressure to the suction port by connecting a positive pressure source to the suction port of the suction nozzle.

As shown in FIG. 3, the control device 60 is configured as a microprocessor centered on the CPU 61, and in addition to the CPU 61, it includes a ROM 62, a HDD 63, a RAM 64, and an input/output interface 65. These are electrically connected via a bus 66. The control device 60 receives a position signal from the X-axis position sensor 34 that detects the position of the X-axis slider 32, a position signal from the Y-axis position sensor 38 that detects the position of the Y-axis slider 36, an image signal from the mark camera 43, an image signal from the parts camera 23, and the like, via the input/output interface 65. On the other hand, the control device 60 outputs a control signal to the part supply device 21, a control signal to the board transport device 22, a drive signal to the X-axis actuator 33, a drive signal to the Y-axis actuator 37, a drive signal to the Z-axis actuator 41, a drive signal to the θ-axis actuator 42, a control signal to the parts camera 23, a control signal to the mark camera 43, and the like, via the input/output interface 65. The control device 60 is also connected to the management device 80 so as to be able to communicate bidirectionally, and exchanges data and control signals with each other.

The management device 80 is, for example, a general-purpose computer, and as shown in FIG. 3, includes a CPU 81, a ROM 82, a HDD 83 (or SSD), a RAM 84, an input/output interface 85, and the like. These are electrically connected via a bus 86. An input signal is input to the management device 80 from an input device 87 such as a mouse or keyboard via the input/output interface 85. The management device 80 is connected to the appearance inspection device 13 so as to be able to communicate bidirectionally. In addition, an image signal is output from the management device 80 to a display 88 via the input/output interface 85. The HDD 83 stores the production job of the board S. Here, the production job of the board S includes a production schedule, such as which components are to be mounted on the board S in which order in each component mounter 10, and how many boards S with components mounted in this way are to be produced. The management device 80 generates a production job based on data input by the operator via the input device 87, and sends the generated production job to each component mounter 10, thereby instructing each component mounter 10 to start production.

Next, the operation of the component mounter 10 in the component mounting system 1 of this embodiment thus configured will be described with reference to Figures 4 to 6. Figure 4 is a flowchart showing an example of a component mounting routine, Figure 5 is a diagram showing how components are mounted by the component mounter 10, and Figure 6 is a diagram showing an example of target mounting position data 95. Note that in this embodiment, the left-right direction (X-axis) and the front-back direction (Y-axis) are as shown in Figure 5 (the up-down direction (Z-axis) is perpendicular to the paper).

The component mounting routine is stored in the ROM 62 of the control device 60 provided in each of the 1st to nth component mounters 10, and is started when the board S is transported to the component mounter 10. The component mounting routine is executed in each of the 1st to nth component mounters 10. When this routine is started, the CPU 61 of the mth component mounter 10 (m is an integer from 1 to n) first captures the post-transport image Im2 (S100). Specifically, the CPU 61 controls the mark camera 43 to capture an image of the board S immediately after being transported to the component mounter 10, that is, in state A shown in FIG. 5, and stores the image in the HDD 63. Next, the CPU 61 detects the position of the board S (S110). Specifically, the reference marks M1 and M2 are detected from the post-transport image Im2, and the position of the board S is detected based on the positions of the reference marks M1 and M2.

Next, the CPU 61 outputs the post-transport image Im2 to the management device 80 (S120). The CPU 81 of the management device 80 then stores the post-transport image Im2 in the HDD 83 in association with the m-th component mounter 10.

Then, the CPU 61 mounts the components on the board S (S130). Specifically, the CPU 81 first obtains the target mounting positions of the components P1 to P4 on the board S from the target mounting position data 95 stored in the HDD 83. Here, the target mounting position data 95 is data in which, as shown in FIG. 6, the X-axis coordinate of the center of each component, the Y-axis coordinate of the center of each component, and the angle Q (see FIG. 9) between the long side of each component and a line parallel to the Y-axis are stored in association with the components when the board S is an XY plane with the front left corner of the board S as the origin O. Then, the CPU 81 controls the head moving device 30 and the head 40 so that the components P1 to P4 are mounted at the target mounting positions obtained from the target mounting position data 95 with respect to the position of the board S obtained in S110.

Then, the CPU 61 captures a pre-transport image Im1 (S140). Specifically, the CPU 61 controls the mark camera 43 to capture an image of the substrate S immediately before being transported downstream in the transport direction, i.e., in state B shown in FIG. 5, and stores the image in the HDD 63.

Then, the CPU 61 outputs the pre-transport image Im1 to the management device 80 (S150). The CPU 81 of the management device 80 then associates the pre-transport image Im1 with the m-th component mounter 10 and stores it in the HDD 83. The CPU 61 then controls the board transport device 22 to transport the board S downstream (S160), and ends this routine.

Next, the operation of the visual inspection device 13 will be described. The visual inspection device 13 takes an image of the board S transported from the nth component mounter 10 from above using a camera (not shown), and based on the captured image, inspects whether the deviation between the actual mounting position and the predetermined target mounting position of each component on the board S is within the visual inspection tolerance range, and outputs the inspection results to the management device 80. Specifically, if there is a component whose position deviation exceeds the visual inspection tolerance range, the visual inspection device 13 outputs to the management device 80 that there was an abnormality in the inspection, and if there is no such component, it outputs to the management device 80 that the inspection was good.

Next, the operation of the management device 80 will be described with reference to Figs. 7 to 11. Fig. 7 is a flowchart showing an example of a defect determination routine, Fig. 8 is a diagram showing an example of the kth pre-transport image Im1, Figs. 9 and 10 are diagrams showing an example of the kth post-transport image Im2, and Fig. 11 is a diagram showing an example of the inspection result 90.

The defect determination routine is stored in the ROM 82 of the management device 80. This routine is started when an input is received from the visual inspection device 13 indicating that an inspection abnormality has occurred.

When this routine is started, the CPU 81 of the management device 80 first sets k to an initial value of 1 (S200) and calculates the positional deviation before transport in the kth transport process (S210). Specifically, the CPU 81 detects the position of the board S based on the positions of the reference marks M1 and M2 in the pre-transport image Im1 input to the management device 80 by the kth component mounter 10. Next, the CPU 81 obtains the center X-axis coordinate value, center Y-axis coordinate value, and angle Q for each of the components P1 to P4 on the board S. At this time, the components P1 to P4 on the board S are components mounted by the kth component mounter 10 or components mounted by a component mounter 10 arranged upstream of the kth. Next, the CPU 81 obtains the X-axis coordinate value of the target mounting position of the components P1 to P4, the Y-axis coordinate value of the target mounting position, and the target angle Q from the target mounting position data 95. Next, the CPU 81 calculates the difference between the X-axis coordinate of the target mounting position and the X-axis coordinate of the actual mounting position, the difference between the Y-axis coordinate of the target mounting position and the Y-axis coordinate of the actual mounting position, and the difference between the target angle Q and the actual angle Q (pre-transport positional deviation) for each of the components P1 to P4 on the board S. The CPU 81 then stores the components and pre-transport positional deviations in association with each other in the HDD 83, as shown in the pre-transport positional deviation column 90a in FIG. 11.

Then, the CPU 81 calculates the positional deviation after transport in the kth transport process (S220). Specifically, the CPU 81 performs the same process as S210 on the post-transport image Im2 input by the (k+1)th component mounter 10, and obtains the post-transport positional deviation for each of the components P1 to P4 on the board S after transport to the (k+1)th component mounter 10. The CPU 81 then stores the components and the post-transport positional deviation in the HDD 83 in association with each other, as shown in the post-transport positional deviation column 90b in FIG. 11.

Then, the CPU 81 calculates the amount of misalignment before and after the kth transport step (S230). Specifically, the CPU 81 obtains the difference between the misalignment before transport acquired in S210 and the misalignment after transport acquired in S220 for each of the components P1 to P4, and obtains the amount of misalignment (the difference in the X coordinate value, the difference in the Y coordinate value, and the difference in the angle Q value before and after transport). The CPU 81 then stores the amount of misalignment in the HDD 83 in association with the components, as shown in the misalignment amount column 90c in FIG. 11. In the kth transport step, in addition to the components mounted by the kth component mounter 10, components mounted by a component mounter 10 located upstream of the kth component mounter 10 may also be misaligned, and the amount of misalignment for these components is calculated in S230.

Next, the CPU 81 judges whether or not a malfunction has occurred in the kth transport process (S240). Specifically, if at least one of the difference in the X-axis coordinate value, the difference in the Y-axis coordinate value, and the difference in the angle Q value among the misalignment amounts acquired in S230 exceeds a predetermined misalignment tolerance range, the CPU 81 judges that a malfunction has occurred in the kth transport process. For example, if the pre-transport image Im1 of the kth transport process is an image as shown in FIG. 8, the post-transport image Im2 is an image as shown in FIG. 9, and the misalignment amount before and after transport is a value as shown in FIG. 11, it is determined that a malfunction has occurred in the kth transport process, since the X-axis coordinate value of the center of the part P4 and the angle Q of the part P4 before and after transport exceed the predetermined misalignment tolerance range. On the other hand, if none of the difference in the X-axis coordinate value, the difference in the Y-axis coordinate value, and the difference in the angle Q value among the misalignment amounts calculated in S230 exceed the predetermined misalignment tolerance range, it is determined that a malfunction has not occurred in the kth transport process. For example, if the pre-transport image Im1 of the kth transport process is an image as shown in FIG. 8, and the post-transport image Im2 is an image as shown in FIG. 10, it is determined that the amount of positional deviation is within the allowable positional deviation range, and no malfunction has occurred in the kth transport process.

If it is determined in S240 that a malfunction has occurred in the kth transport step, the CPU 81 stores in the HDD 83 the fact that a malfunction has occurred in the kth transport step (S250). Thereafter, the CPU 81 increments the value of k by 1 (S260), determines whether k has reached n (S270), and if k has not reached n, executes the processes from S210 onwards. On the other hand, if k has reached n in S260, the CPU 81 displays the result of the malfunction determination on the display 88 (S280) and ends this routine.

In S250, if the transport process in which the malfunction occurred is stored in the HDD 83, the CPU 81 causes the display 88 to display in which transport process the malfunction occurred. On the other hand, if the HDD 83 does not store even one transport process in which the malfunction occurred, the CPU 81 causes the display 88 to display that no malfunction occurred in any transport process.

Here, the correspondence between the components of this embodiment and those of this disclosure will be clarified. The component mounting system 1 of this embodiment corresponds to the component mounting system of this disclosure, the component mounting line 12 corresponds to the component mounting line, the component mounter 10 corresponds to the component mounter, the mark camera 43 corresponds to the imaging device, and the management device 80 corresponds to the control device. Also, the appearance inspection device 13 corresponds to the appearance inspection device.

In the component mounting system 1 described above in detail, the management device 80 inputs a pre-transport image Im1 before the board S is transported from the kth component mounter 10 to the (k+1)th component mounter 10 from the upstream side in the transport direction, and a post-transport image Im2 after the board S is transported from the kth component mounter 10 to the (k+1)th component mounter 10 from the upstream side in the transport direction. In addition, the management device 80 uses the pre-transport image Im1 and the post-transport image Im2 to determine the positional deviation amount before and after the transport of the components P1 to P4 mounted by the component mounter 10 arranged upstream of the kth component mounter 10. Furthermore, if the positional deviation amount exceeds the positional deviation tolerance range, the management device 80 determines that a defect has occurred during the kth transport process from the kth component mounter to the (k+1)th component mounter. That is, by comparing the image captured by the component mounter 10 located upstream in the transport direction with the image captured by the component mounter 10 located downstream, it is determined whether or not a defect has occurred during the transport process. Therefore, when identifying the transport process in which the defect occurred, it is not necessary to compare the pre-transport image Im1 and the post-transport image Im2 with the master data. Therefore, it is possible to efficiently identify the cause of the situation in which the amount of deviation exceeds the position deviation tolerance range as being due to the transport process in which the defect occurred.

The component mounting system 1 also includes an appearance inspection device 13 that is provided downstream of the component mounting line 12 in the transport direction and determines whether the amount of deviation from a predetermined target position for each component on the board S transported from the nth component mounter 10 is within the appearance inspection tolerance range, and if the appearance inspection device 13 determines that the appearance inspection tolerance range has been exceeded, the management device 80 performs a defect judgment for each of the first to (n-1)th transport processes. Therefore, when the appearance inspection device 13 exceeds the appearance inspection tolerance range, a defect judgment can be performed for the transport process. This makes it possible to suppress a decrease in production efficiency caused by identifying defects.

It goes without saying that the present disclosure is in no way limited to the above-described embodiments, and may be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the above-described embodiment, the pre-transport positional deviation is obtained from the pre-transport image Im1, the post-transport positional deviation is obtained from the post-transport image Im2, the amount of positional deviation is calculated from the difference between the pre-transport positional deviation and the post-transport positional deviation, and a defect judgment is performed based on the amount of positional deviation, but this is not limited to the above. For example, a difference image between the pre-transport image Im1 and the post-transport image Im2 may be obtained, and a defect judgment may be performed based on the difference image. In this way, there is no need to calculate the deviation of the mounting position of each component relative to the target mounting position on the board S.

In the above embodiment, the defect determination routine is started when the visual inspection device 13 inputs an inspection result indicating that the positional deviation from the target mounting position for each component mounted on the board S exceeds a predetermined visual inspection tolerance range, but this is not limited to this. For example, the component mounting system 1 may be equipped with a timing setting device that arbitrarily sets the timing for defect determination during the transport process, and the timing setting device may be capable of arbitrarily setting the timing for starting the defect determination routine. In this way, for example, when the timing is set to the start of operation of the component mounting line 12, it is possible to start operation after checking whether or not a defect has occurred during the transport process. In this case, the timing setting device may be provided as a device separate from the management device 80, or the management device 80 may also serve as the timing setting device.

In the above-described embodiment, the pre-transport image is captured (S140) and the pre-transport image is output (S150) to the management device 80 at all times in the component mounting routine, but this is not limited to the above. For example, the pre-transport image may be captured (S140) and the pre-transport image may be output (S150) to the management device 80 only when the appearance inspection device 13 inputs an inspection result indicating that the positional deviation from the target mounting position of each component mounted on the board S by each component mounter 10 exceeds a predetermined appearance inspection tolerance range. In addition, the post-transport image may be output (S120) to the management device 80 only when the inspection result indicates that the positional deviation from the target mounting position exceeds a predetermined appearance inspection tolerance range.

In the above-described embodiment, the nth mounter 10 may output a pre-transport image Im1 to the management device 80, and the visual inspection device 13 may output a post-transport image Im2 to the management device 80. In this case, the management device 80 may perform the processes of S210 to S240 and perform a defect determination as to whether or not a defect has occurred during the transport process from the nth mounter 10 to the visual inspection device 13.

In the above-described embodiment, the visual inspection device 13 may identify a component whose positional deviation exceeds the visual inspection tolerance range and output a message indicating that an abnormality occurred in the inspection. In this case, it may be possible to determine whether a malfunction occurred during the transport process from the component mounter 10 that mounted the component to the component mounter 10 immediately below it.

In the above embodiment, the components on the board S to be subjected to the calculation of the positional deviation amount (hereinafter referred to as the target components) include all the components mounted by the kth component mounter 10 and all the components mounted by the component mounter 10 arranged upstream of the kth component mounter, but it may also include some of those components. For example, the target components may include all the components mounted by the kth component mounter 10, some of them, or none of them. Also, the target components may include all the components mounted by the component mounter 10 arranged upstream of the kth component mounter, some of them, or none of them. However, the target components include at least one component. The target components may be appropriately selected by the operator from among the components mounted on the board S before transportation and input to the management device 80. Alternatively, the target components may be set to the components that have been found to be abnormal by the appearance inspection device 13.

The component mounting system of the present disclosure may be configured as follows:

The component mounting system of the present disclosure may include an appearance inspection device that is provided downstream of the component mounting line in the transport direction and determines whether or not the deviation from a predetermined target position for each of the components on the board transported from the nth component mounter is within an appearance inspection tolerance range, and the control device may perform the defect judgment for each of the first to (n-1)th transport processes if the appearance inspection device determines that the appearance inspection tolerance range has been exceeded. In this way, a defect judgment can be performed for the transport process when the appearance inspection device exceeds the appearance inspection tolerance range. This makes it possible to suppress a decrease in production efficiency caused by identifying defects.

The component mounting system of the present disclosure may be provided with a timing setting device that arbitrarily sets the timing for performing the defect judgment in the kth transport process. In this way, for example, when the timing is set to the start of operation of the mounting line, operation can be started after checking whether or not a defect has occurred in the transport process.

In the component mounting system of the present disclosure, the amount of positional deviation may be the difference between the deviation of the mounting position of the component mounted by the kth component mounter relative to the target position on the board before being transported to the (k+1)th component mounter, and the deviation of the mounting position of the component mounted by the kth component mounter relative to the target position on the board after being transported to the (k+1)th component mounter.

In the component mounting system of the present disclosure, the amount of positional deviation may be calculated based on the difference between the pre-transport image and the post-transport image. In this way, there is no need to determine the deviation of the mounting position of the component relative to the target position on the board.

The present invention can be used in component mounting devices and component mounting systems incorporating component mounting devices.

1 Component mounting system, 2 Printing machine, 3 Printing inspection machine, 10 Component mounting machine, 11 Housing, 12 Component mounting line, 13 Visual inspection device, 21 Component supply device, 22 Board transport device, 23 Parts camera, 24 Nozzle station, 30 Head moving device, 31 X-axis guide rail, 32 X-axis slider, 33 X-axis actuator, 34 X-axis position sensor, 35 Y-axis guide rail, 36 Y-axis slider, 37 Y-axis actuator, 38 Y-axis position sensor, 40 Head, 41 Z-axis actuator, 42 θ-axis actuator, 43 Mark camera, 60 Control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 Input/output interface, 66 Bus, 80 Management device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 Input/output interface, 86 Bus, 87 input device, 88 display, 90 inspection results, 95 target mounting position data, D transfer direction, Im1 pre-transfer image, Im2 post-transfer image, M1 reference mark, M2 reference mark, O origin, P1-P4, P11, P12 components, Q angle, S board.

Claims (3)

a component mounting line in which n mounters (n is an integer of 2 or more) that hold boards and mount components on the boards are arranged along a conveying direction of the boards;
an imaging device provided for each of the component mounters, which captures an image of the board held by the component mounter;
a control device that inputs a pre-transport image before the board is transported from the kth (k is an integer equal to or greater than 1 and equal to or less than (n-1)) component mounter from the upstream side in the transport direction to the (k+1)th component mounter and a post-transport image after the board is transported from the kth component mounter from the upstream side in the transport direction to the (k+1)th component mounter, and uses the pre-transport image and the post-transport image to determine a positional deviation amount before and after transport of at least some of the components mounted by the kth component mounter and the component mounter arranged upstream of the kth component mounter, and performs a defect judgment that determines that a defect has occurred during the kth transport process from the kth component mounter to the (k+1)th component mounter if the positional deviation amount exceeds an allowable positional deviation range;
wherein the control device obtains a difference image between the pre-transport image and the post-transport image, and performs the defect determination based on the difference image . The component mounting system according to claim 1 ,
a visual inspection device that is provided downstream of the component mounting line in the transport direction and that determines whether or not a deviation from a predetermined target position of each of the components on the board transported from the n-th component mounter falls within a visual inspection tolerance range;
the control device performs the defect determination for each of the first to (n-1)th conveying steps when it is determined by the appearance inspection device that the appearance inspection tolerance range has been exceeded;
Component mounting system. 3. The component mounting system according to claim 1,
A component mounting system comprising a timing setting device that arbitrarily sets a timing for performing the defect determination in the k-th transport process.

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