JP7550721B2 - Printing material and its manufacturing method - Google Patents

Description

The present invention relates to a printing substrate and a method for manufacturing the same.

Conductive wiring patterns formed by printing technology are used in devices such as sensor sheets and heat seal connectors. Conductive wiring patterns with narrower line widths are required to improve the performance and reduce the size of devices. For example, Patent Document 1 discloses a heat seal connector in which a conductive paste is applied to a printed substrate by screen printing to form conductive wiring with a pitch of 0.10 to 0.20 mm, and a method for manufacturing the same.
The conductive paste screen-printed onto the solvent absorbing member provided on the surface of the printing substrate maintains a low viscosity that provides good printability until it passes through the screen, and then the viscosity instantly increases upon contact with the solvent absorbing member, preventing the conductive paste from dripping in the width direction, thereby producing a heat seal connector with a clear conductive wiring pattern.

Special Publication No. 6-85333

However, the technology disclosed in Patent Document 1 makes it difficult to form a high-definition conductive wiring pattern with conductive wiring thinner than 100 μm.

The present invention provides a printed material and a manufacturing method thereof that can form a conductive wiring pattern with higher resolution than conventional methods.

[1] A printed object comprising a printed substrate and a solvent absorbing layer formed on at least a portion of the surface of the printed substrate, the solvent absorbing layer being a resin layer capable of absorbing a solvent component contained in a conductive paste applied to its surface, the solvent absorbing layer being a cured product of a resin composition containing a urethane (meth)acrylate polymer and a (meth)acrylate monomer.
[2] The printing medium according to [1], wherein the resin composition contains a (meth)acrylic resin different from the urethane (meth)acrylate polymer.
[3] The printing material according to [1] or [2], wherein the surface of the solvent absorbing layer is water repellent, and the contact angle θ ₁ of water with respect to the surface is 60 to 90°.
[4] The printing material according to any one of [1] to [3], wherein the surface of the solvent absorbing layer has oil repellency, and the contact angle θ ₂ of ethylene glycol monobutyl ether acetate with respect to the surface is 4 to 20°.
[5] The printing medium according to any one of [1] to [4], wherein the solvent absorbing layer has a thickness of 5 to 30 μm.
[6] A method for producing a printed material, comprising the steps of applying a resin composition to at least a part of a surface of a printed substrate, drying the applied resin composition, and then irradiating the applied resin composition with active energy rays or heating the applied resin composition to form a solvent absorbing layer on the surface, the resin composition comprising a urethane (meth)acrylate polymer, a (meth)acrylate monomer, and a photopolymerization initiator or a thermal polymerization initiator.
[7] The method for producing a printing material according to [6], wherein the resin composition further contains a (meth)acrylic resin different from the urethane (meth)acrylate polymer.
[8] The method for producing a printed material according to [6] or [7], wherein the resin composition further contains a mineral oil.
[9] A method for producing a printed material according to [6], comprising a preparatory step of preparing a composition containing 60 to 70% by mass of the urethane (meth)acrylate polymer, 25 to 35% by mass of the (meth)acrylate monomer, 1 to 5% by mass of the photopolymerization initiator or the thermal polymerization initiator, 0.001 to 1% by mass of mineral oil, and an appropriate amount of a solvent as necessary, so that the total of the components is 100% by mass, and adding a (meth)acrylic resin different from the urethane (meth)acrylate polymer to this composition, thereby obtaining the resin composition.
[10] The method for producing a printing material according to [9], wherein the content of the (meth)acrylic resin relative to the total mass of the resin composition is in the range of 0.5 to 10 mass %.

The present invention provides a printed material and a manufacturing method thereof that can form a conductive wiring pattern with higher resolution than conventional methods.

This invention is believed to contribute to SDG Goal 12, "Responsible Consumption and Production."

1 is a cross-sectional view of a printing medium according to the present invention and conductive wiring formed on the surface thereof, cut in the thickness direction. 1 is a photograph of the top surface of an example of a conductive wiring pattern produced in an example.

<Printing substrate>
The first aspect of the present invention is a printed material comprising a printed substrate and a solvent absorbing layer formed on at least a part of the surface of the printed substrate. Fig. 1 is an example of a cross-sectional view in the thickness direction of the printed substrate, and the printed material 10 shown in the example comprises a printed substrate 1 and a solvent absorbing layer 2 formed on the entire one side of the printed substrate, and a conductive wiring 3 is formed on the surface of the solvent absorbing layer 2.

(Printing substrate)
The printing substrate may be any substrate that supports the solvent absorbing layer, and may be, for example, a resin (polymer) molded body. The shape of the resin molded body is not particularly limited, and may be, for example, a film (sheet). Examples of materials constituting the printing substrate include polyimide, polyethylene terephthalate, polycarbonate, polyphenylene sulfide, polybutylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexane dimethylene terephthalate, polyarylate, and liquid crystal polymer.
When the printing substrate is a film, the thickness is, for example, 1 to 100 μm.

(Solvent Absorbing Layer)
The solvent absorbing layer is a resin layer capable of absorbing the solvent component contained in the conductive paste applied to its surface. When the printing substrate is a film, the solvent absorbing layer is provided on at least one of the front and back surfaces of the film. The solvent absorbing layer may be provided on the entire front or back surface of the film, or may be provided only in an optional region.
The thickness of the solvent absorbing layer is, for example, 1 μm to 100 μm, and preferably 5 μm to 30 μm. When the thickness is in the suitable range, cracks in the solvent absorbing layer can be prevented.

The solvent absorbing layer is preferably a cured product of a resin composition containing a urethane (meth)acrylate polymer and a (meth)acrylate monomer. This cured product has both water repellency and oil repellency, and appropriately absorbs the solvent contained in the applied conductive paste to suppress bleeding, allowing the formation of thin conductive wiring without defects such as cracks or chips.

Generally, urethane acrylate refers to an oligomer or monomer having a moiety with a urethane bond formed by reacting an isocyanate group with a hydroxyl group, and an acrylic group (acryloyl group: CH ₂ ═CH—C(═O)—). A urethane acrylate polymer is obtained by polymerizing the acrylic groups of the urethane acrylate with each other.

The urethane (meth)acrylate polymer in this embodiment means at least one of a urethane acrylate polymer and a urethane methacrylate polymer.
The degree of polymerization of the urethane (meth)acrylate polymer of this embodiment is not particularly limited, and a degree of polymerization similar to that of a commonly used urethane acrylate polymer can be applied. The molecular weight, which is a measure of the degree of polymerization, can be, for example, 10,000 to 1,000,000.

The (meth)acrylate monomer in this embodiment means at least one of an acrylate monomer and a methacrylate monomer.
The (meth)acrylate monomer of this embodiment may be any monomer having an acrylic group or a methacrylic group.

(Resin composition)
The resin composition forming the solvent absorbing layer preferably contains, for example, 60 to 70% by mass of the urethane (meth)acrylate polymer, 25 to 35% by mass of the (meth)acrylate monomer, 1 to 5% by mass of a polymerization initiator, and an appropriate amount of a solvent as necessary, with the total of the components being 100% by mass. By using this resin composition, it is possible to easily form the cured product that has both water repellency and oil repellency, appropriately absorbs the solvent contained in the applied conductive paste to suppress bleeding, and is capable of forming conductive wiring with a narrow line width without defects such as cracks or chips.

The polymerization initiator is a known polymerization initiator capable of polymerizing (meth)acrylic groups together, and may be a photopolymerization initiator that initiates polymerization by active energy rays such as ultraviolet rays, or a thermal polymerization initiator that initiates polymerization by heating.

It is preferable that the resin composition further contains mineral oil. The content of mineral oil is preferably 0.001 to 1 mass % based on the total mass of the resin composition.

The resin composition preferably further contains a (meth)acrylic resin different from the urethane (meth)acrylate polymer. Here, the (meth)acrylic resin means at least one of an acrylic resin and a methacrylic resin.
The (meth)acrylic resin is preferably one that does not have a urethane bond, and commercially available surface conditioners can be used. An example is Disparlon OX-881 from Kusumoto Chemical Co., Ltd. The acrylic resin that constitutes Disparlon OX-881 is colorless to pale yellow and transparent when dissolved in xylene at 30% by mass, and has a density of 0.892 g/cm ³ (20° C.) and a viscosity of 7.0 cP (20° C.).

When the (meth)acrylic resin is added to the resin composition, the content of the (meth)acrylic resin relative to the total mass of the resin composition is preferably 0.5 to 10 mass%, more preferably 1 to 9 mass%, even more preferably 2 to 8 mass%, particularly preferably 3 to 7 mass%, and most preferably 4 to 6 mass%.
As the concentration is increased within the above range, the contact angle of the solvent absorption layer with water and ethylene glycol monobutyl ether acetate (EGBEA) becomes larger, and the cured product can be more easily formed, which has both water repellency and oil repellency, appropriately absorbs the solvent contained in the applied conductive paste to suppress bleeding, and is capable of forming conductive wiring with a narrow line width without defects such as cracks or chips.

(Water contact angle)
The water contact angle _θ1 on the surface of the solvent absorbing layer of this embodiment is preferably 60° or more, more preferably 70° or more, and even more preferably 80° or more. The upper limit of the water contact angle _θ1 may be, for example, 90° or less, 88° or less, or 85° or less.
Here, the water contact angle θ ₁ is the average value of six measurements made according to the measurement method in accordance with the JIS standard described below.
When the water contact angle _θ1 is within the above range, the surface of the solvent absorbing layer has sufficient water repellency, and the solvent contained in the applied conductive paste is appropriately absorbed to suppress bleeding, and the cured product can be more easily formed to form conductive wiring with a narrow line width without defects such as cracks or chips.

(Contact angle of EGBEA)
The contact angle _θ2 of ethylene glycol monobutyl ether acetate (EGBEA) on the surface of the solvent absorbing layer of this embodiment is preferably 4° or more, more preferably 7° or more, even more preferably 10° or more, and particularly preferably 11° or more. The upper limit of the contact angle _θ2 of EGBEA may be, for example, 20° or less, 18° or less, or 15° or less.
Here, the contact angle _θ2 of EGBEA is the average value of six measurements made according to the measurement method in accordance with the JIS standard described below.
When the contact angle _θ2 of EGBEA is within the above range, the surface of the solvent absorption layer has appropriate oil repellency, and the solvent contained in the applied conductive paste is appropriately absorbed to suppress bleeding, so that the cured product can be more easily formed into a conductive wiring having a narrow line width without defects such as cracks or chips.

<Method for manufacturing printed material>
A second aspect of the present invention is a method for producing a printed material, comprising the steps of applying a resin composition to at least a portion of the surface of a printed substrate, drying the applied resin composition, and then irradiating the applied resin composition with active energy rays or heating the applied resin composition to form a solvent absorbing layer on the surface.

The resin composition contains a urethane (meth)acrylate polymer, a (meth)acrylate monomer, and a photopolymerization initiator or a thermal polymerization initiator. The explanation of each component contained in the resin composition overlaps with the explanation of the first embodiment, so it will be omitted.

The manufacturing method of this embodiment may include a step of preparing the resin composition. For example, it is preferable to prepare a composition containing 60 to 70% by mass of the urethane (meth)acrylate polymer, 25 to 35% by mass of the (meth)acrylate monomer, 1 to 5% by mass of the photopolymerization initiator or the thermal polymerization initiator, 0.001 to 1% by mass of mineral oil, and an appropriate amount of solvent as necessary, so that the total of the components is 100% by mass, and to obtain the resin composition by adding a (meth)acrylic resin different from the urethane (meth)acrylate polymer to this composition.

The method of applying the resin composition to the substrate to be printed is not particularly limited, and for example, a known method of applying a general resin composition to a polymer film to coat it can be used. Specific examples include a method of applying the resin composition with various coaters, a method of immersing the substrate to be printed in the resin composition and removing it, a method of spraying the resin composition onto the substrate to be printed, and a method of printing the resin composition onto the substrate to be printed.

The resin composition applied to the substrate to be printed forms a coating film having a thickness that takes into account the thickness after drying and curing. There are no particular limitations on the method for drying the volatile components such as the solvent contained in the coating film, and examples of the method include drying with heat or wind using an infrared heater, a blower, etc. Alternatively, it may be allowed to dry naturally.

When the dried coating film contains a photopolymerization initiator, the coating film is irradiated with active energy rays such as UV rays or electron beams to polymerize the (meth)acrylic groups contained in the coating film, thereby curing the coating film.
The method of irradiating the active energy rays is not particularly limited, and any known method of irradiating a coating film of a resin composition containing an acrylate monomer can be used.

When the dried coating film contains a thermal polymerization initiator, the coating film is heated to polymerize the (meth)acrylic groups contained in the coating film, thereby curing the coating film.
The heating method is not particularly limited, and any known method for heating and curing a coating film of a resin composition containing an acrylate monomer can be applied. The heating temperature and time are appropriately set depending on the type of thermal polymerization initiator used.

<Use of printed substrate>
The printing substrate of the present invention has a solvent absorbing layer and has appropriate water repellency and oil repellency, so that the solvent of the conductive paste applied to the surface can be appropriately absorbed, and a highly precise conductive wiring pattern can be formed. The line width of the conductive wiring can be, for example, 30 μm to 70 μm.

Methods for applying the conductive paste to the surface of the solvent absorption layer include printing methods such as screen printing and gravure printing, as well as various coater methods such as roll coating, bar coating, knife coating, spray coating and spin coating, and immersion methods. From the viewpoint of forming a highly precise conductive wiring pattern, printing methods are preferred, and screen printing is more preferred.

Examples of screens used for screen printing include plain or twill weaves of iron alloys such as stainless steel with wire diameters of 10 to 50 μm, and electroformed plates formed into a grid shape by nickel plating or the like, stretched over a rigid frame. In order to form a highly precise conductive wiring pattern, the ratio of aperture ratio to gauze thickness is preferably 0.8 or more, more preferably 1.5 or more, from the viewpoint of facilitating the passage of conductive paste. In addition, the aperture ratio is preferably 30% or more, more preferably 60% or more.

The thickness of the conductive paste applied may be adjusted appropriately, for example, within the range of 0.1 μm to 50 μm.

The conductive paste applied to the printing substrate of the present invention contains a solvent and conductive particles.
As the solvent, for example, ethylene glycol monobutyl ether acetate (EGBEA), methyl acetate, ethyl acetate, isopropyl acetate, isobutyl acetate, butyl acetate, amyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl isoamyl ketone, methyl amyl ketone, ethyl amyl ketone, isobutyl ketone, methoxymethyl pentanone, cyclohexanone, diacetone alcohol, methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, methoxybutyl acetate, methyl carbitol acetate, ethyl carbitol acetate, dibutyl carbitol acetate, trichloroethane, trichloroethylene, n-butyl ether, diisoamyl ether, n-butylphenyl ether, propylene oxide, furfural, isopropyl alcohol, isobutyl alcohol, amyl alcohol, cyclohexanol, benzene, toluene, xylene, isopropyl benzene, petroleum spirit, petroleum naphtha, etc. may be used.

The solvent preferably contains EGBEA, since this provides suitable absorption for the solvent absorbing layer. The content of EGBEA is preferably 60 to 100% by mass, more preferably 80 to 100% by mass, and even more preferably 90 to 100% by mass, based on the total mass of the solvent. If the solvent absorbing layer has suitable absorption for the solvent, it can suppress appearance defects such as mottled stains and streaks during drying or curing of the coating film formed by applying the conductive paste, and can suppress defects such as deformation, cracking, and loosening. If the solvent is absorbed slowly, appearance defects, bleeding, sagging, etc. are likely to occur, and if the solvent is absorbed quickly, the above-mentioned defects are likely to occur.

The viscosity of the conductive paste is preferably 50 to 1000 poise, and the thixotropy (viscosity 20 rotations/200 rotations) is preferably adjusted to 2 to 15.

The content of the solvent in the conductive paste is preferably from 10 to 50% by mass, more preferably from 15 to 40% by mass, and even more preferably from 20 to 30% by mass.
When the amount is within the above preferred range, the solvent is easily absorbed to an appropriate degree into the solvent absorbing layer.

The conductive particles may be at least one selected from metal particles such as silver, silver-plated copper, copper, gold, nickel, and alloys thereof, carbon particles such as carbon black such as furnace black and channel black, graphite powder, and conductive polymer particles including conductive polymers such as PEDOT-PSS, etc. As the metal particles, silver particles are preferred because of their excellent dispersibility and conductivity in EGBEA.
The conductive particles may have, for example, a granular, scaly, plate-like, dendritic, or cubic shape.
The conductive particles may have an average particle size of, for example, 1 μm to 100 μm. From the viewpoint of narrowing the line width of the conductive wiring to be formed, the smaller the average particle size, the more preferable. From the viewpoint of preventing high viscosity, the average particle size is preferably 5 μm or more, and in consideration of balance, 5 μm to 10 μm is particularly preferable. Here, the average particle size is the arithmetic mean of the measured values of the length (major axis) of the longest part of 20 particles randomly selected from the conductive particles, observed with a magnifying observation means such as an electron microscope.

The conductive paste preferably contains a binder resin that binds the conductive particles together. Specific examples include vinyl chloride resin, vinyl acetate resin, acrylic resin, polyester, polyurethane, polybutadiene, polyimide, epoxy resin, alkyd resin, and phenol resin. Among these, polyester is preferred because of its excellent binding property to silver particles.
The content of the binder resin relative to the total mass of the conductive paste is, for example, 1 to 20% by mass, and preferably 5 to 10% by mass.

The conductive paste may contain additives such as curing agents such as isocyanates, amines, and acid anhydrides, curing accelerators, leveling agents, dispersion stabilizers, defoamers, thixotropic agents, and metal deactivators.

The present invention will be explained in more detail below with reference to examples, but the present invention is not limited to the following examples.

[Example 1]
A composition containing 66% by weight of a commercially available urethane acrylate polymer, 30% by weight of a commercially available acrylate monomer, 3% by weight of a commercially available photopolymerization initiator, and 1% by weight of a commercially available mineral oil (total 100% by weight) was prepared.
An acrylic resin (manufactured by Kusumoto Chemical Industries, Ltd., model number: Disparlon OX-881) was added as a surface conditioner to the above composition in an amount of 1 mass % to obtain a resin composition.

A polyethylene terephthalate film having a thickness of 25 μm was used as a printing substrate, and the above-mentioned resin composition was applied to the entire surface of one side of the film using a kiss coater, dried in a dryer, and then cured by ultraviolet irradiation to form a solvent absorbing layer (thickness: 20 μm), thereby obtaining a printing substrate. Here, the integrated light amount of the ultraviolet irradiation was 600 J/ ^cm2 .

Next, a commercially available conductive paste was screen-printed onto part of the surface of the solvent absorption layer of the printed material obtained above to form a checkerboard-like conductive pattern, and the pattern was dried for 5 minutes in a dryer set to a surface temperature of 130 to 150°C. A screen with a #500 mesh and a line width design of 45 μm was used.

The conductive paste used above contains silver particles with an average particle size of about 10 μm, ethylene glycol monobutyl ether acetate (EGBEA), binder resin (polyester), and carbon black, with the EGBEA content being about 30% by mass.

A photograph of the surface of the formed conductive pattern observed from above with a microscope is shown in Figure 2. There were no defects such as distortion, disconnection, sagging, or bleeding in the conductive wires constituting the conductive pattern.
Next, the line width of the conductive wiring was measured. Specifically, the line width of the midpoint between any intersection of the conductive wirings in the grid pattern and the adjacent intersection was measured. The line width was measured at a total of 10 points, and the average value was calculated to be about 66 μm. Here, the theoretical design value of the line width when the applied conductive paste does not spread at all is 40 μm.

In addition, the contact angles of water and ethylene glycol monobutyl ether acetate (EGBEA) were measured for the surface of the solvent absorbing layer in the portion where the conductive pattern was not formed, using a portable contact angle meter (manufactured by Kyowa Interface Science Co., Ltd., model number: PCA-1) at 25° C. in accordance with JIS R 3257:1999 (sessile drop method).
The contact angle of water was 68.7° (error: 1.9° in the + direction, 1.3° in the - direction) as an average value of six measurements.
The contact angle of EGBEA was 4.6° (error: 0.2° in the + direction, 0.2° in the - direction) as an average value of six measurements.

[Example 2]
A printed material was manufactured and a conductive pattern was formed in the same manner as in Example 1, except that the content of the acrylic resin added to the resin composition forming the solvent absorption layer was adjusted to 2 mass %.
When the surface of the formed conductive pattern was observed from above with a microscope, no defects such as distortion, disconnection, sagging, or bleeding were found in the conductive wires.
The line width of the conductive wiring was measured in the same manner as in Example 1, and the average value was calculated to be about 48 μm. The contact angle was measured in the same manner as in Example 1.
The contact angle of water was 73.5° (error: 2.0° in the + direction, 3.2° in the - direction) as an average value of six measurements.
The contact angle of EGBEA was 8.2° (error: +0.1°, −0.1°) as an average value of six measurements.

[Example 3]
A printed material was manufactured and a conductive pattern was formed in the same manner as in Example 1, except that the content of the acrylic resin added to the resin composition forming the solvent absorption layer was adjusted to 3 mass %.
When the surface of the formed conductive pattern was observed from above with a microscope, no defects such as distortion, disconnection, sagging, or bleeding were found in the conductive wires.
The line width of the conductive wiring was measured in the same manner as in Example 1, and the average value was calculated to be about 50 μm. The contact angle was measured in the same manner as in Example 1.
The contact angle of water was 77.6° (error: 3.4° in the + direction, 1.4° in the - direction) as an average value of six measurements.
The contact angle of EGBEA was 8.9° (error: 0.5° in the + direction, 0.3° in the - direction) as an average value of six measurements.

[Example 4]
A printed material was manufactured and a conductive pattern was formed in the same manner as in Example 1, except that the content of the acrylic resin added to the resin composition forming the solvent absorption layer was adjusted to 4 mass %.
When the surface of the formed conductive pattern was observed from above with a microscope, no defects such as distortion, disconnection, sagging, or bleeding were found in the conductive wires.
Moreover, the line width of the conductive wiring was measured in the same manner as in Example 1, and the average value was calculated to be about 47 μm.
The contact angle was measured in the same manner as in Example 1.
The contact angle of water was 79.8° (error: 1.9° in the + direction, 1.3° in the - direction) as an average value of six measurements.
The contact angle of EGBEA was 10.8° (error: +0.1°, -0.1°) as an average value of six measurements.

[Example 5]
A printed material was manufactured and a conductive pattern was formed in the same manner as in Example 1, except that the content of the acrylic resin added to the resin composition forming the solvent absorption layer was adjusted to 5 mass %.
When the surface of the formed conductive pattern was observed from above with a microscope, no defects such as distortion, disconnection, sagging, or bleeding were found in the conductive wires.
Moreover, the line width of the conductive wiring was measured in the same manner as in Example 1, and the average value was calculated to be about 43 μm.
The contact angle was measured in the same manner as in Example 1.
The contact angle of water was 81.2° (error: 1.2° in the + direction, 0.9° in the - direction) as an average value of six measurements.
The contact angle of EGBEA was 11.5° (error: 0.3° in the + direction, 0.3° in the - direction) as an average value of six measurements.

These results show that increasing the content of the acrylic resin that forms the solvent absorption layer, increasing the contact angle of water, and increasing the contact angle of EGBEA reduces the bleeding of the conductive paste that forms the conductive wiring, and the line width of the formed conductive wiring approaches the theoretical value.

1...printed substrate, 2...solvent absorption layer, 3...conductive wiring pattern

Claims (7)

A printing substrate comprising a printing substrate and a solvent absorbing layer formed on at least a portion of a surface of the printing substrate,
The solvent absorbing layer is a resin layer capable of absorbing a solvent component contained in the conductive paste applied to its surface, and is a cured product of a resin composition containing a urethane (meth)acrylate polymer , a (meth)acrylate monomer, mineral oil, and a (meth)acrylic resin different from the urethane (meth)acrylate polymer . 2. The printing material according to claim 1, wherein the surface of the solvent absorbing layer is water repellent, and the contact angle θ ₁ of water with respect to the surface is 60 to 90°. 3. The printing material according to claim 1 , wherein the surface of the solvent absorbing layer has oil repellency, and the contact angle θ ₂ of ethylene glycol monobutyl ether acetate with respect to the surface is 4 to 20°. 4. The printing material according to claim 1 , wherein the solvent absorbing layer has a thickness of 5 to 30 μm. The method includes a step of applying a resin composition to at least a part of a surface of a printing substrate, drying the applied resin composition, and then irradiating the applied resin composition with active energy rays or heating the applied resin composition to form a solvent absorbing layer made of a cured product of the resin composition on the surface of the printing substrate;
A method for producing a printed material, wherein the resin composition comprises a urethane (meth)acrylate polymer, a (meth)acrylate monomer, a mineral oil, a photopolymerization initiator or a thermal polymerization initiator, and a (meth)acrylic resin different from the urethane (meth)acrylate polymer . 6. The method for producing a printed material according to claim 5, further comprising a preparatory step of preparing a composition containing 60 to 70% by mass of the urethane (meth)acrylate polymer, 25 to 35% by mass of the (meth)acrylate monomer, 1 to 5% by mass of the photopolymerization initiator or the thermal polymerization initiator, 0.001 to 1% by mass of mineral oil, and an appropriate amount of a solvent as necessary, so that the total of the components is 100% by mass, and adding a (meth)acrylic resin different from the urethane (meth)acrylate polymer to this composition, thereby obtaining the resin composition. The method for producing a printing material according to claim 6 , wherein the content of the (meth)acrylic resin relative to the total mass of the resin composition is in the range of 0.5 to 10 mass %.

Images