JP7306095B2 - Piezoelectric device and method for manufacturing piezoelectric device - Google Patents

Description

The present invention relates to a piezoelectric device and its manufacturing method, and more particularly to a piezoelectric device capable of sharing a package and its manufacturing method.

A surface-mounted piezoelectric oscillator, which is a piezoelectric device, for example, a temperature compensated crystal oscillator (TCXO) is provided in a base (container) made of an insulating material, as shown in Patent Document 1. It has a structure in which a crystal piece, which is a piezoelectric vibrating piece, is accommodated in the upper concave portion of the upper and lower concave portions, and an integrated circuit element (IC) is accommodated in the lower concave portion. The external connection terminals for surface mounting are formed on the upper surface of the frame surrounding the lower concave portion in which the integrated circuit element is accommodated, that is, on the four corners of the outer bottom surface of the temperature-compensated crystal oscillator.

The external connection terminals at the four corners of the outer bottom surface of this temperature-compensated crystal oscillator are electrically connected to the integrated circuit element housed in the recess on the lower side. connected to the device.

On the other hand, in a surface-mounted piezoelectric vibrator, for example, a crystal vibrator with a built-in temperature sensor, as disclosed in Patent Document 2, a piezoelectric vibrating piece is placed in a first concave space of an element mounting member corresponding to the base. A thermistor element is mounted in the second recessed space, and external connection terminals for surface mounting are formed on the bottom surface of the element mounting member, that is, at the four corners of the outer bottom surface of the piezoelectric vibrator.

A piezoelectric vibrating piece and a thermistor element are connected to external connection terminals at four corners of the outer bottom surface of the piezoelectric vibrator.

JP 2016-208192 A Japanese Patent No. 5101651

As described above, in the temperature-compensated crystal oscillator, which is a piezoelectric oscillator, the external connection terminals at the four corners of the outer bottom surface of the base are connected to the integrated circuit element, and the crystal blank is not directly connected. On the other hand, in a crystal oscillator incorporating a temperature sensor, which is a piezoelectric oscillator, a crystal blank is directly connected to external connection terminals on the outer bottom surface of the base.

As described above, the piezoelectric oscillator and the piezoelectric vibrator have different connection modes of the external connection terminals on the base, and therefore cannot share the base.

Therefore, it is necessary to prepare and manufacture bases respectively corresponding to the piezoelectric oscillator and the piezoelectric vibrator, which increases management costs and manufacturing costs.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the cost of a piezoelectric device by making it possible to share a base.

In order to achieve the above object, the present invention is configured as follows.

(1) The piezoelectric device of the present invention is an insulative device having at least one housing recess in which a piezoelectric vibrating piece is housed and at least one type of electronic component selected from at least two types of electronic components can be housed. comprising a base and a lid that hermetically seals the opening of the storage recess of the base;
A pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted and one type of electronic component selected from the two types of electronic components can be mounted on the inner surface of the storage recess. a plurality of electrodes for mounting electronic components are formed,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
first and second connections for electrically connecting the first and second electronic component mounting electrodes to the third and fourth electronic component mounting electrodes among the plurality of remaining electronic component mounting electrodes, respectively; having a department,
The other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes,
The first and second connection portions can be cut off, and the electrical connection between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes can be cut off. is.

According to the piezoelectric device of the present invention, the first and second electronic component mounting electrodes electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted are external connection electrodes for surface mounting. The pair of piezoelectric vibrating reed mounting electrodes are electrically connected to the third and fourth electronic component mounting electrodes electrically connected to the terminals via the first and second connection portions. , and are directly connected to the external connection terminals, the piezoelectric vibrating reed can be mounted on the pair of piezoelectric vibrating reed mounting electrodes to form a piezoelectric vibrator. Further, a plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes are electrically connected to external connection terminals, and are selected from two types of electronic component. Since one type of electronic component can be mounted, by mounting the other type of electronic component, for example, a temperature sensor element or the like, a piezoelectric vibrator or the like with a built-in temperature sensor can be configured.

The first and second electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted by disconnecting the cuttable first and second connecting portions. and cut off electrical connection with the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting. one type of electronic component selected from two types of electronic components, such as a piezoelectric A piezoelectric oscillator or the like can be configured by mounting an integrated circuit element or the like including an oscillation circuit connected to the vibrating bars.

In this way, a piezoelectric vibrator, a piezoelectric vibrator with a built-in temperature sensor, or the like can be constructed using a base in which the first and second connection portions are not cut off. A piezoelectric oscillator or the like can be configured using the base with the cut part. That is, since the base can be shared by the piezoelectric vibrator and the piezoelectric oscillator, the cost of the piezoelectric device can be reduced.

(2) In a preferred aspect of the present invention, the first and second connection portions are wiring patterns.

According to this embodiment, the first and second connection portions formed by the wiring patterns are cut by, for example, a laser to form the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes. can cut off the electrical connection with each.

(3) In one embodiment of the present invention, the one type of electronic component selected from the two types of electronic components is an integrated circuit element, and the other type of electronic component is a temperature sensor element. is.

According to this embodiment, a piezoelectric device such as a piezoelectric oscillator incorporating an integrated circuit element or a piezoelectric device such as a piezoelectric vibrator incorporating a temperature sensor can be constructed.

(4) In another embodiment of the present invention, the first and second connection portions are cut off, respectively, and the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes are connected to each other. and the one type of electronic component selected from the two types of electronic components is mounted on the plurality of electronic component mounting electrodes.

According to this embodiment, the first and second electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted by disconnecting the first and second connecting portions. The electrical connection between the mounting electrodes and the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting is interrupted. That is, the electrical connection between the piezoelectric vibrating piece and the external connection terminal is cut off, and one type of electronic component selected from two types of electronic components is mounted on the plurality of electronic component mounting electrodes. Therefore, by using the electronic component as an integrated circuit element including an oscillation circuit connected to the piezoelectric vibrating reed, a piezoelectric oscillator can be constructed.

(5) In still another embodiment of the present invention, the first and second connection portions are connected to the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes without being cut off. are electrically connected to the mounting electrodes, and the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes are selected from the two types of electronic components. The other type of electronic component is mounted.

According to this embodiment, the first and second electronic component mounting electrodes electrically connected to the piezoelectric vibrating reed mounting electrodes are the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals. The piezoelectric vibrating reed mounting electrodes are electrically connected to the component mounting electrodes via the first and second connection portions, that is, the piezoelectric vibrating reed mounting electrodes are directly connected to the external connection terminals, and the third and fourth Since the remaining electronic component mounting electrodes other than the electronic component mounting electrodes are mounted with the other type of electronic component selected from the two types of electronic components, the electronic component is subjected to temperature By using the sensor element, a piezoelectric vibrator with a built-in temperature sensor can be configured.

(6) In one embodiment of the present invention, the first and second connection portions are connected to the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes without being cut off. The electrodes are electrically connected to each other, and none of the electronic component mounting electrodes are mounted on the plurality of electronic component mounting electrodes.

According to this embodiment, the piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reeds are mounted are directly connected to the external connection terminals, and the plurality of electronic component mounting electrodes can accommodate any type of electronic component. Since it is not mounted, a piezoelectric vibrator is configured.

(7) In a preferred embodiment of the present invention, the base includes a substrate portion, a first frame portion formed on the outer peripheral portion of one main surface side of the substrate portion, and the other main surface side of the substrate portion. and a second frame portion formed on the outer peripheral portion of the housing portion, and the substrate portion and the first frame portion constitute a first housing recess portion for housing the piezoelectric vibrating reed as the housing recess portion. In addition, the substrate portion and the second frame portion constitute a second storage recess capable of storing the electronic component, and the opening of the first storage recess is airtightly sealed by the lid. The pair of piezoelectric vibrating reed mounting electrodes are formed on the inner surface of the first housing recess, and the plurality of electronic component mounting electrodes are formed on the inner surface of the second housing recess.

According to this embodiment, the base has a substantially H-shaped cross-section with storage recesses on both sides, so that the piezoelectric vibrating reed and the electronic component can be stored in separate storage spaces.

(8) In another embodiment of the present invention, the substrate portion has a rectangular shape in plan view, and the external connection terminals for surface mounting are formed along an outer peripheral portion of the substrate portion which has a rectangular shape in plan view. provided at the four corners of the end surface of the second frame portion.

According to this embodiment, the external connection terminals are provided at the four corners of the second frame portion which is rectangular in plan view, so that it can be applied to a piezoelectric device having a general arrangement of external connection terminals, and has high versatility. becomes.

(9) In still another embodiment of the present invention, the other type of electronic component is projected onto the second housing recess by projecting the piezoelectric vibrating piece housed in the first housing recess. A temperature sensor element as is housed and arranged.

According to this embodiment, the temperature sensor element as the electronic component is arranged in the projection area obtained by projecting the piezoelectric vibrating piece housed in the first housing recess onto the second housing recess. can be accurately and quickly detected by the temperature sensor element.

(10) The method of manufacturing a piezoelectric device according to the present invention has at least one housing recess in which the piezoelectric vibrating piece is housed and in which one type of electronic component selected from at least two types of electronic components can be housed. A method for manufacturing a piezoelectric device comprising an insulating base and a lid for hermetically sealing an opening of a storage recess of the base, comprising:
comprising a first step of pre-preparing the base;
The base includes a pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted, and one type of electronic component selected from the two types of electronic components. are formed with a plurality of electrodes for mounting electronic components that can be mounted,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
The base electrically connects the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes of the plurality of remaining electronic component mounting electrodes, respectively. , comprising a second connection,
The other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes of the base. can be,
a second step of mounting the piezoelectric vibrating piece on the base prepared in the first step;
In the step performed as necessary, the first and second connection portions are cut to separate the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes. and a third step of breaking the electrical connection.

According to the piezoelectric device manufacturing method of the present invention, in the base prepared in the first step, the first and second electrodes electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reeds are mounted. The electronic component mounting electrodes are electrically connected to the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting via the first and second connection portions. there is That is, the pair of electrodes for mounting the piezoelectric vibrating reed is directly connected to the external connection terminal.

A third step of cutting the first and second connection portions to cut off the electrical connection between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes is required. , the electrical connection between the piezoelectric vibrating reed mounting electrode and the external connection terminal can be cut off or maintained.

By performing the third step, it is possible to manufacture a piezoelectric oscillator or the like using the base in which the electrical connection between the piezoelectric vibrating reed mounting electrode and the external connection terminal is cut off. A piezoelectric vibrator or the like can be manufactured using a base that maintains electrical connection between the piezoelectric vibrating reed mounting electrodes and the external connection terminals.

In this way, a piezoelectric oscillator or a piezoelectric vibrator can be manufactured depending on whether or not the third step is performed. Cost can be reduced.

(11) In a preferred embodiment of the present invention, the third step is performed to attach the two types of electronic components to the plurality of electronic component mounting electrodes of the base from which the first and second connection portions have been cut. and a fourth step of mounting the one type of electronic component selected from among.

According to this aspect, the third step is performed to disconnect the first and second connection portions, and the second electrode electrically connected to the pair of piezoelectric vibrating reed mounting electrodes on which the piezoelectric vibrating reed is mounted. Electrical connection between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals for surface mounting is interrupted. That is, the electrical connection between the piezoelectric vibrating piece and the external connection terminal is cut off, and one type of electronic component selected from two types of electronic components is mounted on the plurality of electronic component mounting electrodes. A piezoelectric oscillator or the like can be manufactured by using, for example, an integrated circuit element or the like including an oscillator circuit connected to a piezoelectric vibrating piece as the electronic component.

(12) In another embodiment of the present invention, the remaining plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes of the base are provided with the A fourth step of mounting the other type of electronic component selected from the two types of electronic components is included.

According to this embodiment, the first and second electronic component mounting electrodes electrically connected to the piezoelectric vibrating reed mounting electrodes are the third and fourth electronic component mounting electrodes electrically connected to the external connection terminals. It is electrically connected to the component mounting electrode through the first and second connection portions. That is, the piezoelectric vibrating reed mounting electrodes are directly connected to the external connection terminals, and the rest of the plurality of electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes are used for two types of electronic component mounting electrodes. Since the other type of electronic component selected from the above is mounted, by using the electronic component as, for example, a temperature sensor element or the like, a piezoelectric vibrator or the like with a built-in temperature sensor can be manufactured.

According to the present invention, a piezoelectric vibrator, a piezoelectric vibrator with a built-in temperature sensor, or the like can be configured by using a base in which the first and second connecting portions are not cut off. A piezoelectric oscillator or the like can be constructed by using the base with the two connection portions cut off. That is, since the base can be shared by the piezoelectric vibrator and the piezoelectric oscillator, the cost of the piezoelectric device can be reduced.

FIG. 1 is a schematic cross-sectional view of a crystal oscillator with a built-in temperature sensor according to one embodiment of the present invention. FIG. 2 is a plan view of the crystal oscillator with a built-in temperature sensor in FIG. 1 with the lid removed. FIG. 3 is a bottom view of the crystal oscillator incorporating the temperature sensor of FIG. FIG. 4 is a bottom view of the crystal oscillator with a built-in temperature sensor in FIG. 1 before the thermistor is mounted. FIG. 5 is a plan view of an IC chip mounted instead of the thermistor. FIG. 6 is a schematic cross-sectional view of a temperature-compensated crystal oscillator according to one embodiment of the present invention. 7 is a bottom view of the temperature compensated crystal oscillator of FIG. 6. FIG. FIG. 8 is a bottom view of the temperature-compensated crystal oscillator of FIG. 6 before mounting an IC chip.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

In the piezoelectric device according to the present invention, the base can be shared by the piezoelectric vibrator and the piezoelectric oscillator. In this embodiment, a case where a crystal oscillator with a built-in temperature sensor as a piezoelectric oscillator and a temperature compensated crystal oscillator (TCXO) as a piezoelectric oscillator share a base will be described.

First, a crystal oscillator with a built-in temperature sensor will be described. FIG. 1 is a cross-sectional view showing a schematic configuration of a crystal oscillator 1 with a built-in temperature sensor as a piezoelectric device according to an embodiment of the present invention, and FIG. 3 is a bottom view of the crystal oscillator 1 with a built-in temperature sensor, and FIG. 4 is a crystal oscillation before a thermistor 9 as a temperature sensor element is mounted. 2 is a bottom view of child 1. FIG.

The package 2 of the crystal oscillator 1 of this embodiment includes a base 5 having first and second storage recesses 3 and 4 on the top and bottom, and an opening of the first storage recess 3 of the base 5 with a seam ring 6 interposed therebetween. and a lid 7 as a lid that hermetically seals the first storage recess 3 . The package 2 has a substantially rectangular parallelepiped shape and is rectangular in plan view.

A crystal vibrating piece 8 as a piezoelectric vibrating piece is housed in the first housing recess 3 which is recessed on the upper side of the base 5 . In the second storage recess 4 which is recessed on the lower side of the base 5, 1 is selected from two types of electronic components corresponding respectively to a crystal oscillator 1 with a built-in temperature sensor and a temperature-compensated crystal oscillator to be described later. A variety of electronic components can be stored. In this example, a thermistor 9 as a temperature sensor element, which is the other type of electronic component corresponding to the crystal oscillator 1 with a built-in temperature sensor, is accommodated.

The base 5 is made of an insulating material, and includes a substrate portion 5a having a rectangular flat plate shape in a plan view, and a substrate portion 5a protruding upward along the outer peripheral portion of one main surface side (upper side in FIG. 1) of the substrate portion 5a. A first frame portion 5b having a rectangular frame shape in a plan view and a second frame having a rectangular frame shape in a plan view projected downward along the outer peripheral portion of the other main surface side (lower side in FIG. 1) of the substrate portion 5a. It has a portion 5c and has a substantially H-shaped cross section.

The substrate portion 5a and the first frame portion 5b on the upper side constitute the first recessed portion 3 for storing the crystal vibrating piece 8, and the thermistor 9 is formed by the substrate portion 5a and the second frame portion 5c on the lower side. A second storage recess 4 for storage is configured.

In this way, the crystal vibrating piece 8 and the thermistor 9 are housed in the first and second housing recesses 3 and 4, which are separate spaces. This has the effect of making it less susceptible to noise.

The base 5 is made of a ceramic material such as alumina, and is formed by laminating ceramic green sheets and integrally firing them.

The first housing recess 3 is substantially rectangular in plan view, and on one end side of its inner bottom surface (the left side in FIGS. 1 and 2) are provided excitation electrodes 8a, 8a ( In FIG. 2, only the surface side is shown), and a pair of crystal vibrating piece mounting electrodes 3a, 3a electrically connected to each other are formed in parallel.

One end of the crystal vibrating piece 8 connected to the excitation electrodes 8a, 8a of the crystal vibrating piece 8 is conductively bonded to and mounted on the pair of crystal vibrating piece mounting electrodes 3a, 3a via a conductive adhesive 10. FIG.

The second storage recess 4 of the base 5 of this embodiment is configured as follows so that the base 5 can be shared by the crystal resonator 1 with a built-in temperature sensor and a temperature-compensated crystal oscillator, which will be described later. .

As shown in FIGS. 3 and 4, the second storage recess 4 is substantially rectangular in plan view. On the inner bottom surface of the second housing recess 4, one type of electronic component selected from the two types of electronic components shown in FIG. A plurality of first to sixth electronic component mounting electrodes 4a to 4f, six in this example, are formed so that an IC chip 11 as a certain integrated circuit element can be mounted. The first to sixth electronic component mounting electrodes 4a to 4f correspond to the first to sixth electrode pads 11a to 11f of the IC chip 11, respectively.

As shown in FIGS. 3 and 4, third, first and fifth electronic component mounting electrodes 4c, 4a and 4e are formed along the upper long side toward the inner bottom surface of the second housing recess 4. , sixth, second and fourth electronic component mounting electrodes 4f, 4b and 4d are formed along the lower long side toward the inner bottom surface of the second housing recess 4. As shown in FIG. In this example, the third, first and fifth electronic component mounting electrodes 4c, 4a and 4e are rectangular wiring patterns extending downward, and the sixth, second and fourth electronic component mounting electrodes 4c, 4a and 4e are rectangular wiring patterns extending downward. The electrodes 4f, 4b, and 4d are rectangular wiring patterns extending upward. Note that the number of electronic component mounting electrodes is formed according to the electrode pads of the mounted IC chip, so six or more may be configured according to the additional function of the IC chip.

Further, in the second housing recess 4, a thermistor 9 as a temperature sensor element, which is the electronic component of the other type selected from the above two types of electronic components, is mounted at the right end of the upper long side. The fifth electronic component mounting electrode 4e extends longer than the first and third electronic component mounting electrodes 4a and 4c toward the lower side, that is, toward the opposing long side, and extends to the left end of the lower long side. The sixth electronic component mounting electrode 4f extends longer than the second and fourth electronic component mounting electrodes 4b and 4d, that is, toward the opposing long sides. As a result, the thermistor 9 can be mounted by joining the external terminals 9a, 9a at both ends thereof to the fifth and sixth electronic component mounting electrodes 4e, 4f by soldering or the like.

The thermistor 9 mounted on the fifth and sixth electronic component mounting electrodes 4e and 4f projects the rectangular crystal vibrating piece 8 housed in the first housing recess 3 onto the second housing recess 4. Since it is located in the rectangular projection area, the temperature of the crystal vibrating piece 8 can be detected accurately and quickly.

Furthermore, in this embodiment, the first electronic component mounting electrode 4a at the center of the upper long side of the second housing recess 4 and the third electronic component mounting electrode 4c at the left end serve as the first connecting portion 13. are electrically connected by a wiring pattern of The second electronic component mounting electrode 4b in the center of the lower long side and the fourth electronic component mounting electrode 4d on the right end are electrically connected by a wiring pattern as the second connecting portion 14. there is

3 and 4, for convenience of explanation, the hatching directions of the first to fourth electronic component mounting electrodes 4a to 4d and the first and second connection portions 13 and 14 are different. The first to fourth electronic component mounting electrodes 4a to 4d and the first and second connection portions 13 and 14 are formed in the same wiring pattern forming step.

The first and second connection portions 13 and 14 formed of wiring patterns can be cut by a laser or the like, respectively. Electrical connection with the electrodes 4c and 4d can be cut off.

The first and second electronic component mounting electrodes 4a and 4b at the centers of the upper and lower long sides of the second housing recess 4 are connected to the pair of crystal resonator plate mounting electrodes 4a and 4b via wiring inside the base 5. are electrically connected to the electrodes 3a, 3a. That is, the first and second electronic component mounting electrodes 4a and 4b are electrically connected to the excitation electrodes 8a and 8a of the crystal vibrating piece 8 housed in the first housing recess 3, respectively.

At the lower end surface of the second frame portion 5c of the base 5, that is, at the four corners of the outer bottom surface of the base 5, there are surface-mounting surfaces for surface-mounting the crystal oscillator 1 with the built-in temperature sensor on an external circuit board or the like. are formed of four first to fourth external connection terminals 15a to 15d.

Among the first to sixth electronic component mounting electrodes 4a to 4f formed on the inner bottom surface of the second housing recess 4, they are electrically connected to a pair of crystal vibrating piece mounting electrodes 3a, 3a, respectively. The remaining third to sixth electronic component mounting electrodes 4c to 4f other than the first and second electronic component mounting electrodes 4a and 4b are close to the four corners of the inner bottom surface, and are connected to the wiring inside the base 5. are electrically connected to the first to fourth external connection terminals 15a to 15d, respectively.

In this embodiment, as described above, the first and second electronic component mounting electrodes 4a and 4b electrically connected to the pair of crystal vibrating piece mounting electrodes 3a and 3a are connected to the first and second connection electrodes. Since they are electrically connected to the third and fourth electronic component mounting electrodes 4c and 4d through the portions 13 and 14, respectively, the pair of crystal vibrating piece mounting electrodes 3a and 3a are connected to the first and second electrodes. To the first and second external connection terminals 15a and 15b through the electronic component mounting electrodes 4a and 4b, the first and second connection portions 13 and 14, and the third and fourth electronic component mounting electrodes 4c and 4d, respectively. They are electrically connected to each other. That is, the first and second external connection terminals 15 a and 15 b are crystal terminals (Xtal, Xtal) connected to the crystal vibrating piece 8 .

The thermistor 9 mounted on the fifth and sixth electronic component mounting electrodes 4e and 4f is connected to the third and fourth external connection terminals 15c and 15d via the fifth and sixth electronic component mounting electrodes 4e and 4f. are electrically connected to each other. That is, the third and fourth external connection terminals 15c and 15d are thermistor terminals (TH, TH).

In this way, the crystal vibrating piece 8 is mounted on the crystal vibrating piece mounting electrodes 3a, 3a on the inner bottom surface of the first housing recess 3 of the base 5, and the fifth and fifth electrodes of the second housing recess 4 of the base 5 are mounted. 6 By mounting a thermistor 9 on the electronic component mounting electrodes 4e and 4f and hermetically sealing the first housing recess 3 with a lid 7, the surface mount type temperature sensor built-in crystal shown in FIG. A vibrator 1 can be configured.

Next, a temperature-compensated crystal oscillator that shares the package 2 with the crystal oscillator 1 with a built-in temperature sensor will be described.

FIG. 6 is a cross-sectional view showing a schematic configuration of a temperature compensated crystal oscillator 21 as a piezoelectric device according to one embodiment of the present invention, FIG. 7 is a bottom view of the temperature compensated crystal oscillator 21, and FIG. 2 is a bottom view of the temperature-compensated crystal oscillator 21 before the IC chip 11 is mounted. FIG.

In these FIGS. 6 to 8, the same or corresponding reference numerals are given to the same or corresponding portions as those of the crystal oscillator 1 with built-in temperature sensor.

A crystal vibrating piece 8 is mounted in the first housing recess 3 of the base ₅₁ in the same manner as the crystal vibrator 1 with a built-in temperature sensor.

The IC chip 11 shown in FIG. 5 is mounted in the second housing recess _4-1 of the base _5-1 . This IC chip 11 has an oscillating circuit unit connected to the crystal unit 1, a temperature detecting unit for detecting temperature, and a temperature compensating circuit unit for compensating temperature based on the detected temperature, all integrated into one chip. is an integrated circuit element of

This IC chip 11 includes first and second electrode pads 11a and 11b (Xtal, Xtal) for crystal, a third electrode pad 11c (VAFC) for AFC (Auto Frequency Control) voltage input, It has a fourth electrode pad 11d (CSOUT) for oscillation output, a fifth electrode pad 11e (VSS) for ground, and a sixth electrode pad 11f (VDD) for power supply.

When such an IC chip 11 is mounted in the second housing recess _4-1 of the base _5-1 , the wiring pattern as the first and second connection portions 13 and 14 on the inner bottom surface of the base 5 shown in FIG. are cut by a laser, and as shown in FIG. It is divided into first and second connecting portions 13c and 14d on the side of electrodes 4c and 4d, respectively. In this example, the central portions of the first and second connecting portions 13 and 14 are cut by laser along the short side direction of the base ₅₁ (vertical direction in FIG. 8).

As a result, electrical connections between the first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d are cut off, respectively, and the first to fourth electronic component mounting electrodes The electrodes 4a to 4d are electrically isolated from each other.

After the first to fourth electronic component mounting electrodes 4a to 4d are electrically isolated from each other in this way, the IC chip 11 is inserted into the first to sixth electronic component mounting electrodes ₄₁ of the second housing recess 41. Mounted on the electrodes 4a to 4f.

At this time, the first to sixth electrode pads 11a to 11f of the IC chip 11 are connected to the first to sixth electronic component mounting electrodes _4a to 4f of the second housing recess 41 of the base ₅₁ , respectively. It is mounted by bonding with bumps or solder.

Specifically, the first and second electrode pads 11a and 11b (Xtal, Xtal) for crystal of the IC chip 11 are electrically connected to the electrodes 3a and 3a for mounting the crystal vibrating piece. 2 are electrically connected to the electronic component mounting electrodes 4a and 4b, respectively.

A third electrode pad 11c (VAFC) for AFC voltage input of the IC chip 11 is electrically connected to a first external connection terminal 15a on the outer bottom surface of the base ₅₁ , and a third electronic component mounting electrode 4c. , and the fourth electrode pad 11d (CSOUT) for oscillation output of the IC chip 11 is electrically connected to the fourth electronic component mounting electrode 4d electrically connected to the second external connection terminal 15b. and the fifth electrode pad 11e (VSS) for grounding the IC chip 11 is electrically connected to the fifth electronic component mounting electrode 4e electrically connected to the third external connection terminal 15c, A sixth electrode pad 11f (VDD) for the power supply of the IC chip is electrically connected to the sixth electronic component mounting electrode 4f electrically connected to the fourth external connection terminal 15d.

Therefore, the first external connection terminal 15a on the outer bottom surface of the base ₅₁ serves as an AFC voltage input terminal (VAFC), the second external connection terminal 15b serves as an oscillation output terminal (OUTPUT), and the third external connection terminal 15b serves as an oscillation output terminal (OUTPUT). The terminal 15c serves as a ground terminal (GND), and the fourth external connection terminal 15d serves as a power supply terminal (Vcc).

In this way, the electrodes 3a, 3a for mounting the crystal vibrating piece on the inner bottom surface of the first housing recess 3 of the base 51 are cut off from the _first and second connecting portions 13, 14 of the second housing recess 4 of the base 5. The crystal vibrating piece 8 is mounted on the base ₅₁ , and the IC chip 11 is mounted on _the first to sixth electronic component mounting electrodes 4a to 4f of the second housing recess 41 of the base 51. 3 is hermetically sealed with a lid 7, a surface mount type temperature compensated crystal oscillator 21 shown in FIG. 6 can be configured.

Therefore, by cutting the first and second connecting portions 13 and 14 of the second housing recess 4 of the base 5 of the crystal oscillator 1 with a built-in temperature sensor with a laser or the like, the temperature compensated crystal oscillator 21 can be obtained. It can be shared as the base ₅₁ .

As a result, a base corresponding to a crystal oscillator with a built-in temperature sensor and a base corresponding to a temperature-compensated crystal oscillator are prepared, respectively, and a crystal oscillator with a built-in temperature sensor and a temperature-compensated crystal oscillator are manufactured. Management costs and manufacturing costs can be reduced compared to the example.

The temperature-sensor built-in crystal oscillator 1 and the temperature-compensated crystal oscillator 21 sharing the base 5 as described above can be manufactured by the following procedure.

That is, a method of manufacturing a piezoelectric device according to one embodiment of the present invention includes first to third steps.

In the first step, the base 5 shown in FIGS. 1 to 4 is prepared in advance.

In the second step, the crystal vibrating piece 8 is mounted in the first housing recess 3 of the base 5 prepared in the first step.

The third step is a step that is performed as necessary. In this third step, the first and second connecting portions 13 and 14 on the inner bottom surface of the second housing recess 4 of the base 5 are cut, Electrical connection between the first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d is cut off.

In manufacturing the crystal oscillator 1 with a built-in temperature sensor, the electrodes 3a, 3a for mounting the crystal resonator element must be electrically connected to the first and second external connection terminals 15a, 15b. The first and second electronic component mounting electrodes 4a and 4b and the third and fourth electronic component mounting electrodes 4c and 4d are electrically connected via the first and second connecting portions 13 and 14. ing.

On the other hand, the third step is performed in manufacturing the temperature-compensated crystal oscillator 21 in which the first to sixth electronic component mounting electrodes 4a to 4f must be electrically separated.

After that, when manufacturing the crystal oscillator 1 with a built-in temperature sensor, as a fourth step, the inner bottom surface of the second housing recess 4 of the base 5, other than the third and fourth electronic component mounting electrodes 4c and 4d, is removed. A thermistor 9 is mounted on the fifth and sixth electronic component mounting electrodes 4e and 4f.

Further, the opening of the first housing portion 3 in which the crystal vibrating piece 8 is mounted is airtightly sealed with the lid 7 to obtain the crystal vibrator 1 with a built-in temperature sensor.

Further, in the case of manufacturing the temperature compensated crystal oscillator 21, after the third step is performed, as the fourth step, the first to _{sixth electronic component mounting electrodes of the second housing recess 41 of} the base 51 are formed. An IC chip 11 is mounted on 4a to 4f.

Further, the opening of the first housing portion 3 in which the crystal vibrating piece 8 is mounted is airtightly sealed with the lid 7 to obtain the temperature compensated crystal oscillator 21 .

The order of performing the second step, the third step, and the fourth step is not limited to the above. A third step of cutting 14 may be performed, and a fourth step of mounting the thermistor 9 may be performed before the second step.

[Other embodiments]
The present invention can also be implemented in the following forms.

(1) In the above embodiment, the base has a substantially H-shaped cross section with the first and second storage recesses on both main surface sides of the substrate portion, but the storage recesses are provided only on one main surface side. A crystal vibrating piece and an electronic component such as a thermistor may be housed and mounted in this housing recess.

(2) In the above embodiments, a thermistor is used as the temperature sensor element, but other temperature sensor elements such as diodes may be used.

(3) In the above embodiment, the temperature sensor element is mounted in the second housing recess to form a crystal oscillator with a built-in temperature sensor. , may be a crystal oscillator.

(4) In the above embodiments, the present invention is applied to a temperature-compensated crystal oscillator, but it may be applied to a voltage-controlled crystal oscillator or a crystal oscillator other than a temperature-compensated crystal oscillator.

(5) In the above embodiments, the present invention is applied to crystal resonators and crystal oscillators, but the present invention is not limited to crystals, and is applicable to piezoelectric devices such as piezoelectric resonators and piezoelectric oscillators using various piezoelectric materials. It is possible.

1 Crystal oscillator (piezoelectric device) with built-in temperature sensor
2, _{2 1} package 3 first housing recess 3a crystal resonator element mounting electrode 4, 4 ₁ second housing recess 4a to 4f first to sixth electronic component mounting electrodes 5, 5 ₁ base 7 lid )
8 crystal vibrating piece 9 thermistor (temperature sensor element)
11 IC chip (integrated circuit element)
13 First connection portion 14 Second connection portion 15a to 15d First to fourth external connection terminals 21 Temperature compensated crystal oscillator (piezoelectric device)

Claims (12)

An insulative base that houses a piezoelectric vibrating reed and has at least one storage recess capable of storing one type of electronic component selected from at least two types of electronic components; and an opening of the storage recess of the base. and a lid that hermetically seals the part,
A pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted and one type of electronic component selected from the two types of electronic components can be mounted on the inner surface of the storage recess. a plurality of electrodes for mounting electronic components are formed,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
first and second connections for electrically connecting the first and second electronic component mounting electrodes to the third and fourth electronic component mounting electrodes among the plurality of remaining electronic component mounting electrodes, respectively; having a department,
The other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes,
The first and second connection portions can be cut off, and the electrical connection between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes can be cut off. is
A piezoelectric device characterized by: wherein the first and second connection parts are wiring patterns,
A piezoelectric device according to claim 1 . The one type of electronic component selected from the two types of electronic components is an integrated circuit element, and the other type of electronic component is a temperature sensor element.
The piezoelectric device according to claim 1 or 2. The first and second connection portions are cut, respectively, and the electrical connection between the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes is interrupted. , the one type of electronic component selected from the two types of electronic components is mounted on the plurality of electronic component mounting electrodes;
A piezoelectric device according to any one of claims 1 to 3. The first and second connection portions electrically connect the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes, respectively, without being cut off. ,
The other type of electronic component selected from the two types of electronic components is mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes.
A piezoelectric device according to any one of claims 1 to 3. The first and second connection portions electrically connect the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes, respectively, without being cut off. ,
None of the electronic component mounting electrodes are mounted on the plurality of electronic component mounting electrodes,
A piezoelectric device according to any one of claims 1 to 3. The base includes a substrate portion, a first frame portion formed on an outer peripheral portion on one main surface side of the substrate portion, and a second frame portion formed on an outer peripheral portion on the other main surface side of the substrate portion. As the storage recess, the substrate portion and the first frame portion constitute a first storage recess portion in which the piezoelectric vibrating piece is stored, and the substrate portion and the second frame A second storage recess that can store the electronic component is configured by the part,
The opening of the first storage recess is hermetically sealed by the lid,
the pair of piezoelectric vibrating reed mounting electrodes are formed on the inner surface of the first housing recess,
The plurality of electronic component mounting electrodes are formed on the inner surface of the second housing recess,
A piezoelectric device according to any one of claims 1 to 6. The substrate portion has a rectangular shape in plan view,
The external connection terminals for surface mounting are provided at the four corners of the end surface of the second frame formed along the outer periphery of the board having a rectangular shape in plan view,
The piezoelectric device according to claim 7. a temperature sensor element as the other type of electronic component is housed and arranged in a projection area obtained by projecting the piezoelectric vibrating piece housed in the first housing recess onto the second housing recess,
The piezoelectric device according to claim 7 or 8. An insulative base that houses a piezoelectric vibrating reed and has at least one storage recess capable of storing one type of electronic component selected from at least two types of electronic components; and an opening of the storage recess of the base. A method for manufacturing a piezoelectric device including a lid that hermetically seals a portion,
comprising a first step of pre-preparing the base;
The base includes a pair of piezoelectric vibrating reed mounting electrodes on which the stored piezoelectric vibrating reed is mounted, and one type of electronic component selected from the two types of electronic components. are formed with a plurality of electrodes for mounting electronic components that can be mounted,
first and second electronic component mounting electrodes among the plurality of electronic component mounting electrodes are electrically connected to the pair of piezoelectric vibrating reed mounting electrodes, respectively;
The outer bottom surface of the base is provided with a plurality of external connection terminals for surface mounting which are electrically connected to the remaining plurality of electronic component mounting electrodes other than the first and second electronic component mounting electrodes. and
The base electrically connects the first and second electronic component mounting electrodes and the third and fourth electronic component mounting electrodes of the plurality of remaining electronic component mounting electrodes, respectively. , comprising a second connection,
The other type of electronic component selected from the two types of electronic components can be mounted on the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes of the base. can be,
a second step of mounting the piezoelectric vibrating piece on the base prepared in the first step;
In the step performed as necessary, the first and second connection portions are cut to separate the first and second electronic component mounting electrodes from the third and fourth electronic component mounting electrodes. and a third step of breaking the electrical connection;
A method of manufacturing a piezoelectric device, characterized by: By performing the third step, one type of electronic component selected from the two types of electronic components is applied to the plurality of electronic component mounting electrodes of the base from which the first and second connection portions have been cut. Including a fourth step of mounting electronic components,
A method of manufacturing a piezoelectric device according to claim 10 . without performing the third step, the plurality of remaining electronic component mounting electrodes other than the third and fourth electronic component mounting electrodes of the base are selected from the two types of electronic components; including a fourth step of mounting the other type of electronic component,
A method of manufacturing a piezoelectric device according to claim 10 .

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