JP6696025B1 - Laminating apparatus for laminating device, laminating method and laminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding device for sealing an effective sealing region of a plurality of elements with no bubbles than a fill material, even if the supply amount of the fill material to an enclosed space is increased, the seal is not broken by the expanding pressure of the fill material. I will provide a. SOLUTION: A first substrate 1 and a second substrate 2 in which a plurality of elements E are arranged, a seal 3 provided on one or both of the substrates, and a predetermined amount of a filling material in an enclosed space S surrounded by the seal 3. The constant amount discharge part 4 for supplying F, the drive part 5 for extending the fill material F in the enclosed space S by the relative approach movement of the first substrate 1 and the second substrate 2, the constant amount discharge part 4, and the drive part 5. The control unit 6 for controlling the operation of the seal 3 has a dam portion 3a provided so as to surround the effective sealing region S1 of the plurality of elements E in the enclosed space S, and the leakage flow path 31. Then, the control unit 6 causes the fill material F supplied to the enclosed space S to be expanded by the approach movement of the first substrate 1 and the second substrate 2 and flow into the leakage flow path 31 from the effective sealing region S1. Control. [Selection diagram] Figure 1

Description

  The present invention supplies a fill material between a pair of substrates such as a light emitting diode display (LED display) in which micro elements such as micro LEDs are arranged, and the fill material is extended by bonding the two substrates. The present invention relates to a bonding device for a bonding device to be sealed, a bonding method for producing a bonding device, and a bonding device.

Conventionally, as this type of dropping injection method, an annular (rectangular) main seal is formed in one of the pair of substrates so as to surround the enclosed space, and liquid crystal is dropped into the enclosed space to reduce the pressure between the pair of substrates. There is a method of manufacturing a liquid crystal display panel in which a pair of substrates that have been bonded to each other are returned to atmospheric pressure after being bonded to each other under a predetermined distance, and a main seal is cured to enclose liquid crystal (for example, a patent document). Reference 1).
Due to the close movement of the substrates due to the bonding of the one substrate and the other substrate and the compression due to the pressure difference from the reduced pressure to the atmospheric pressure, the liquid crystal dropped in the enclosed space is extended to every corner of the main seal, and the liquid crystal is enclosed. The entire space is filled without gaps. As a result, the filling time of the liquid crystal can be significantly shortened as compared with the vacuum injection method in which the liquid crystal is filled by utilizing the pressure difference and the capillary phenomenon.
Further, as an element mounting substrate for an LED display or the like, a large number of light emitting diode elements densely arranged on the first substrate are transferred from the first substrate to a temporary holding member and held, and then each light emitting diode element is mounted. There is a transfer method of forming a resin-formed chip (element chip) by coating a resin around the element for each element and forming an electrode pad on each light-emitting diode element fixed by the resin (for example, see Patent Document 2). ).
The light emitting diode element covered with the resin is individually cut out by dicing, and is made into a state of a resin-formed chip to be transferred to a mounting step. Wiring is provided on the resin-formed chip, and a defective light emitting diode element is detected by performing a light emission test after the wiring is completed.
Further, in Patent Document 2, since a light emitting diode used for an LED display is expensive, a micro LED having a size of several tens μm × several tens μm is used to reduce the cost of an image display device such as an LED display (paragraph). [0004]), and in a display using LEDs as a light emission source, when defective pixels do not light after mounting, the defective light emitting diode element is removed (see paragraph [0006]).

JP, 2002-328382, A Japanese Patent No. 3747807

Under such a situation, the filling time of the fill material (liquid crystal) was significantly shortened by using the dropping injection method described in Patent Document 1, and a large number were arranged by using the transfer method described in Patent Document 2. It is conceivable that cost can be reduced by collectively covering the filling material (resin) even for minute elements including micro LEDs.
In detail, after forming a seal so as to surround a large number of elements arrayed and held on the first substrate, a filling material is dropped and supplied into an enclosed space surrounded by the seal, and is bonded to the second substrate under reduced pressure. The liquid crystal dripped into the enclosed space is extended to every corner of the seal by the close movement of the substrates accompanying each other and the compression caused by the pressure difference from the reduced pressure to the atmospheric pressure, and the entire enclosed space is sealed without any gap. After sealing with a fill material, it is desired to individually cut out a large number of elements by dicing.
However, in many elements arrayed and held in the enclosed space surrounded by the seal, the required fill amount differs for each element due to factors such as the size difference of each element and the displacement of the electrode pads.
In particular, when only the defective element detected by performing a light emission test or the like is removed, the drop amount of the fill material dropped in the enclosed space surrounded by the seal tends to vary from sheet to sheet.
For this reason, if a large amount of the filling material is dropped, the seal will be broken. Conversely, if the dropping amount of the filling material is small, voids will occur in the effective sealing area in the enclosed space, resulting in a decrease in yield. there were.

In order to solve such a problem, the bonding device of the bonding device according to the present invention is one or both of a first substrate on which a plurality of elements are arranged or a second substrate facing the first substrate, or both. A seal that surrounds the plurality of elements, a fixed-quantity discharge unit that supplies a predetermined amount of fill material to the enclosed space surrounded by the seal, and a relative amount of the first substrate and the second substrate under reduced pressure. A drive unit that extends the fill material in the enclosed space by various close movements, and a control unit that controls the operation of the constant-volume discharge unit and the drive unit, and the seal includes the plurality of seals in the enclosed space. A dam portion provided so as to surround an effective sealing region of the element, and provided so as to pass through the fill material which is opened in a part of the dam portion and which has progressed due to the close movement of the first substrate and the second substrate. And a leakage flow path that is provided outside the dam portion and is provided so as to communicate with the effective sealing region through the outflow port. supplying the said fill material, with, extending to every corner of the dam portion by the approach movement of the first substrate and the second substrate, and overflows from the effective sealing area through the outlet, and at least the It is characterized in that it is controlled so as to flow into the leak flow path that opens when passing through the outflow port .
Furthermore, in order to solve such a problem, the bonding method for a bonding device according to the present invention is one of a first substrate on which a plurality of elements are arranged or a second substrate facing the first substrate. Alternatively, a seal forming step in which a seal is provided to surround the plurality of elements on both sides, a fill supplying step of supplying a predetermined amount of a fill material to an enclosed space surrounded by the seal, the first substrate and the A compression step of extending the fill material in the enclosed space by relative movement of a second substrate, wherein the seal surrounds an effective sealing area of the plurality of elements in the enclosed space. A dam portion provided, an outlet opening provided in a part of the dam portion so that the fill material developed by the approach movement of the first substrate and the second substrate passes, and an outside of the dam portion anda leakage flow path that is provided so as to communicate through the outlet port and the effective sealing area is located, said at compression step, the fill material supplied to the enclosed space, said first causes stretched throughout the dam portion by the approach movement of the first substrate and the second substrate, the effective from the sealing region through the outlet by overflow, and an opening at least at the time of passage of the outlet the It is characterized in that it is made to flow into the leakage channel.
Further, in order to solve such a problem, the bonding device according to the present invention, the first substrate on which a plurality of elements are arranged or the second substrate facing the first substrate, either one or both A bonding device in which a seal is provided so as to surround a plurality of elements, and a predetermined amount of a filler material supplied to an enclosed space surrounded by the seal extends and is bonded so as to seal the plurality of elements. The dam portion is disposed so as to surround an effective sealing region of the plurality of elements in the enclosed space, and a dam portion provided so that the fill material in the enclosed space extends to every corner, and the dam portion. is opened in a part of and communicates through an outlet of the fill material which is extended to all corners of the dam portion is provided so as to pass through, the outlet port and the effective sealing area on the outer side of the dam portion are arranged to, at least said is open during the passage of the outlet of the fill material, the outlet of the leakage flow path which is provided so as to enter the fill material flow overflowing from the effective sealing area through And are included.

It is explanatory drawing which shows the whole bonding apparatus and bonding method of the bonding device which concerns on embodiment (1st embodiment) of this invention, (a) is a transverse plane of the bonding device at the time of supply of a fill material. Figure, (b) is a vertical sectional front view with the same portion enlarged, (c) is a cross-sectional plan view of the bonding device at the start of the expansion of the fill material, (d) is a vertical sectional front view with the same portion enlarged, (e) is a fill It is a cross-sectional top view of the bonding device at the time of the completion | finish of extension of the material, (f) is the longitudinal cross-sectional front view which expanded the same part. It is an explanatory view showing a modification of a first embodiment, and is a transverse expansion top view of a pasting device at the time of completion of extension of a fill material. It is explanatory drawing which shows the modification of 1st embodiment, (a) is a cross-sectional plan view of the bonding device at the time of supply of a fill material, (b) is a cross-sectional plan view at the time of extension start of a fill material, (c). FIG. 6 is a transverse plan view at the end of the extension of the fill material. It is explanatory drawing which shows the whole structure of the bonding apparatus and bonding method of the bonding device which concerns on 2nd embodiment of this invention, (a) is a transverse plane view of the bonding device at the time of supply of a fill material, (b) ) Is a longitudinally enlarged front view of the same portion, (c) is a cross-sectional plan view of the bonding device at the time of starting the expansion of the filling material, (d) is a longitudinally enlarged front view of the same portion, and (e) is the end of the expansion of the filling material. FIG. 4A is a cross-sectional plan view of the bonding device at the time, and FIG. It is an explanatory view showing a modification of a second embodiment, and is a transverse expansion top view of a pasting device at the time of completion of extension of a fill material. It is explanatory drawing which shows the whole bonding apparatus and bonding method of the bonding device which concerns on 3rd embodiment of this invention, Comprising: It is a transverse expansion plan view of the bonding device at the time of the completion | finish of extension of the fill material. It is explanatory drawing which shows the modification of 3rd embodiment, Comprising: It is a transverse expansion plan view of the bonding device at the time of the completion | finish of extension of the fill material. It is explanatory drawing which shows the modified example of the bonding apparatus and bonding method of the bonding device which concern on 4th embodiment of this invention, (a) is a transverse plane view of the bonding device at the time of supply of a fill material, (b) 8A is a cross-sectional plan view at the start of extension of the fill material, and FIG. 8C is a cross-sectional plan view of the bonding device at the end of extension of the fill material. It is explanatory drawing which shows the modification of 4th embodiment, Comprising: It is a transverse expansion plan view of the bonding device at the time of the completion | finish of extension of the fill material.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 9, the bonding apparatus B of the bonding device A according to the embodiment of the present invention is configured to fill a space between the first substrate 1 and the second substrate 2 on which a plurality of elements E are arranged. This is a bonding device manufacturing apparatus in which the material F is supplied and the fill material F is extended by the approach movement of the first substrate 1 and the second substrate 2 under reduced pressure to seal the plurality of elements E. In particular, after the first substrate 1 and the second substrate 2 are moved relatively close to each other in a vacuum state to bond them together, the pressure difference evenly presses between the first substrate 1 and the second substrate 2 to a predetermined gap. It is preferable that the device is a vacuum bonding device that bonds without air bubbles.
More specifically, the bonding apparatus B of the bonding device A according to the embodiment of the present invention includes a seal 3 provided on one or both of the first substrate 1 and the second substrate 2 surrounding a plurality of elements E. And a fixed amount discharge part 4 for supplying the fill material F to the enclosed space S surrounded by the seal 3, and a drive part for extending the fill material F in the enclosed space S by the approach movement of the first substrate 1 and the second substrate 2. 5 and a control unit 6 that controls the operation of the constant-volume discharge unit 4 and the drive unit 5 are provided as main components.
Further, a transformation chamber C such as a vacuum chamber in which the first substrate 1 and the second substrate 2 are housed so that they can be freely taken in and out, and a carry-in for bringing the first substrate 1 and the second substrate 2 into the transformation chamber C from an external space (not shown). A member (not shown) and a carry-out member (not shown) for carrying out the bonding device A from which the sealing of the plurality of elements E by the fill material F has been completed to the external space are provided.
The first substrate 1 and the second substrate 2 are usually arranged so as to face each other in the vertical direction. In the illustrated example, the first substrate 1 is arranged below and the second substrate 2 is arranged above. Here, the direction in which the first substrate 1 and the second substrate 2 face each other is hereinafter referred to as “Z direction”. Hereinafter, the direction along the first substrate 1 and the second substrate 2 which intersects the Z direction is referred to as “XY direction”.

As shown in FIGS. 1A to 1F and the like, each of the plurality of elements E is a light-emitting diode (a square or thin quadrilateral having a right angle including a rectangle) formed in a thin plate shape. It is a semiconductor diode such as an LED or a laser diode (LD). In the case of a semiconductor diode, a chip LED of red, green or blue is also included.
As a specific example of the plurality of elements E, mainly referred to as a micro LED, the thickness is 50 μm × 50 μm or less and the thickness is less than 50 μm, more specifically, the thickness is less than 30 μm × 30 μm, the thickness is less than 30 μm. Examples include LED chips and LD chips having a size of less than μm.
Other examples of the plurality of elements E include, for example, a LED chip of about 100 μm square called a mini LED, a general LED chip of 200 to 300 μm square, or a semiconductor diode of a general size such as an LD chip. It is also possible.
In general chip handling, a plurality of elements E are arrayed and formed on an element-forming substrate or wafer made of a material such as silicon in a predetermined cycle in the XY directions, and the array state is maintained by a dividing process such as dicing. Are separated into After this separation, it is transferred to the first substrate 1 to be described later and the mounting process is started. In the mounting step, a plurality of elements E are connected by wiring to electrode pads (not shown) formed on the surface 1a of the first substrate 1 which will be described later, and are integrally assembled.
In the illustrated example, for the sake of explanation, as the array of the plurality of elements E, the rectangular elements E are all set to the same size. Although not shown as another example, the array shape of the plurality of elements E and the size of the elements E can be changed to those other than the illustrated example.

The bonding device A is a thin plate-like structure in which components are integrally assembled, such as a light emitting diode display (LED display) in which a plurality of elements E including micro elements such as micro LEDs are arranged. is there.
The first substrate 1 is formed of a hard material such as glass or a material having a high rigidity similar to it in a plate shape such as a substantially rectangular shape, and a plurality of elements E are arranged and mounted on a surface 1a of the TFT in a predetermined arrangement state. Is the element substrate. By mounting (wiring connection) a plurality of elements E on the smooth surface 1a in a protruding shape, the first substrate 1 has an uneven surface on a surface facing a second substrate 2 to be described later.
The second substrate 2 is a cover glass, a touch panel, or the like formed of a hard material such as glass or a material having a high rigidity similar thereto such as a substantially rectangular plate, and a plurality of elements E mounted on the first substrate 1. It is attached for the purpose of surface protection.
A seal 3 described below is provided so as to surround the plurality of elements E between the surface 1a of the first substrate 1 and the plurality of elements E having the uneven shape and the surface 2a of the second substrate 2.
In the case where the bonding device A is shown in FIGS. 1 to 9 as a specific example, a plurality of elements E having a rectangular (square) planar shape are formed on the surface 1a of the first substrate 1 having a rectangular (square) planar shape. The same number of elements E are arranged in the XY directions. Therefore, the outer shape of the chip group including a plurality (a large number) of elements E is arranged to be a rectangle (square). For a first substrate 1 on which a plurality (a large number) of elements E are mounted, a second substrate 2 having the same size as the first substrate 1 and having a rectangular planar shape (square) is superposed in the Z direction and bonded. Is going.
Further, the first substrate 1 and the second substrate 2 on which a plurality of elements E are mounted in advance are separately carried into the variable pressure chamber C by a carrying-in member.
Although not shown as another example, the planar shape of the first substrate 1 and the second substrate 2 may be changed to a rectangular shape or another shape instead of a square shape, and the arrangement number or arrangement shape of the plurality of elements E may be changed. It is also possible to change the number of arrays or the array shape other than the illustrated example.

The seal 3 is made of a liquid dam material that can be crushed and deformed as the first substrate 1 and the second substrate 2 move closer to each other. The seal 3 has a plurality of elements for either the surface 1a of the first substrate 1 or the surface 2a of the second substrate 2, or both the surface 1a of the first substrate 1 and the surface 2a of the second substrate 2. It is applied in a ring around E.
The seal 3 has a dam portion 3a provided around the plurality of elements E and an outlet 3b opened in a part of the dam portion 3a.
The dam material forming the seal 3 is formed by a plurality of elements E for one or both of the surface 1a of the first substrate 1 and the surface 2a of the second substrate 2 by using a dispenser drawing method or a screen printing method. It is formed in a ring shape surrounding the. The viscosity of the dam material of the seal 3 is set higher than the viscosity of the fill material F described later. A specific example of the dam material of the seal 3 is a photo-curable adhesive such as a UV-curable optical transparent resin (OCR) which is cured by absorbing light energy such as ultraviolet rays and is polymerized to develop adhesiveness. Agents, thermosetting adhesives, two-component mixed curing adhesives, and the like are used.
For this reason, the periphery of the plurality of elements E becomes the enclosed space S surrounded by the dam portion 3a, and the filled material F is supplied to the enclosed space S by the fixed amount discharge unit 4 described later. The fill material F supplied to the enclosed space S is expanded by the approach movement of the first substrate 1 and the second substrate 2 by the driving unit 5 described later. As a result, a portion inside the dam portion 3a and outside a chip group including a plurality (a large number) of elements E arranged in the dam portion 3a becomes an effective sealing region S1 with the fill material F. That is, the dam portion 3a is provided so as to surround the effective sealing region S1 of the plurality of elements E in the enclosed space S.
In addition, a gap material (not shown) such as a spacer ball is mixed in advance with the dam material of the seal 3 so that a predetermined distance is provided between the surface 1a of the first substrate 1 and the surface 2a of the second substrate 2 that are bonded together. It is preferable to make a gap. In addition, by disposing a gap spacer (not shown) on either one or both of the surface 1a of the first substrate 1 and the surface 2a of the second substrate 2, the surface 1a of the bonded first substrate 1 and It is also possible to form a predetermined gap between the surface 2 a of the second substrate 2.
Further, the formation of the seal 3 on the surface 1a of the first substrate 1 can be performed after loading into the variable pressure chamber C, but since the internal structure of the variable pressure chamber C becomes complicated, before the loading into the variable pressure chamber C. It is preferable to carry out.

1 to 9 as specific examples of the dam portion 3a and the outflow port 3b that form the seal 3, a plurality (a large number) of dam portions 3a arranged on the surface 1a of the first substrate 1 are arranged. It is formed in a rectangular (square) frame shape surrounding the outside of the chip group including the element E. Four outlets 3b are opened at the corners of the dam 3a.
On the outside of the seal 3, a dummy seal 3'is provided in an annular shape surrounding the dam portion 3a. The dummy seal 3 ′ is kept in a vacuum state or a reduced pressure state close to a vacuum with the inner seal 3 to protect the shapes of the inner dam portion 3 a and the leakage flow passage 31.
Although not shown as another example, the dam of the seal 3 is provided on the surface 2a of the second substrate 2 or both the surface 1a of the first substrate 1 and the surface 2a of the second substrate 2 instead of the surface 1a of the first substrate 1. It is also possible to form the part 3a and the outflow port 3b. Further, the dam portion 3a of the seal 3 may be changed to a rectangle or another shape instead of a square, the shape of the dummy seal 3'may be changed to a shape other than the illustrated example, or the dummy seal 3'may be omitted. It can be changed.

In addition to this, the seal 3 has a leakage flow path 31 provided in a part of the dam portion 3a so as to communicate with the enclosed space S and the effective sealing region S1 via the outflow port 3b.
The leakage flow path 31 is provided at the final extension position of the fill material F extended by the approaching movement of the first substrate 1 and the second substrate 2 in the enclosed space S by the drive unit 5 described later. That is, the leakage flow path 31 is disposed at a position farthest from the supply position of the fill material F supplied by the constant-quantity discharge unit 4, which will be described later, and is a fill film extended as the first substrate 1 and the second substrate 2 move closer to each other. The material F is configured so as to finally flow into the leakage channel 31.
The leak passage 31 is preferably provided with an opening 32 that is always open, a closing lid 33 that is always closed, and a crushing lid 34 that closes when the seal 3 is crushed and deformed.
It is desirable that the opening 32, the closing lid 33, and the crushing lid 34 are installed in the leak passage 31 in the middle of the inflow direction of the fill material F. Specifically, it is preferable to arrange the opening 32, the closing lid 33, and the crushing lid 34 on the front end side in the inflow direction of the fill material F in the leakage channel 31.

In the example shown in FIGS. 1A to 1F, FIG. 2 and FIGS. 3A to 3C as an example of the leakage flow path 31, radial projections are formed from the corner portions of the rectangular (square) dam portion 3a. A first leakage flow path 31a flowing out in the XY directions from the outlet 3b.
As another example of the leakage flow path 31, in the example shown in FIGS. 4A to 4F, FIG. 5 and FIGS. 8A to 8C, the dam from the corner portion of the rectangular (square) dam portion 3 a is changed. Along the four sides of the portion 3a, a second leakage flow path 31b is formed which branches from the outlet 3b in a plurality of directions (X direction and Y direction) and flows out.
Further, in the example shown in FIGS. 6, 7, and 9, one direction (X direction or Y direction) from the outlet 3b is provided along two opposing sides of the dam portion 3a from the corner portion of the rectangular (square) dam portion 3a. Forming a third leakage flow path 31c that flows out only in the direction).
Although not shown as another example, it is also possible to change the shape of the leakage flow path 31 to a shape other than the illustrated example.

The fixed amount discharge part 4 is a device that supplies a predetermined amount of the fill material F toward the enclosed space S surrounded by the dam part 3a of the seal 3, and is configured by, for example, a dispenser or the like, and its operation is controlled by the control part 6 described later. To be done.
As the fill material F, a photo-curable adhesive agent such as an optical transparent resin (OCR) having poor compatibility with the dam material of the seal 3 is used. The viscosity of the fill material F is set to a liquid having a lower viscosity than the dam material of the seal 3.
It is preferable to use the drop injection method (ODF method) described in Japanese Patent No. 3747807 (Patent Document 1) or the like as the constant-quantity discharge unit 4. In the drop injection method, a predetermined amount of the fill material F is dropped in the central portion of the enclosed space S, and then the drive unit 5 moves the first substrate 1 and the second substrate 2 closer to each other to seal the fill material F to the seal 3. Fill every corner by spreading and spreading.
For this reason, the supply amount (dropping amount) of the fill material F from the fixed amount discharge unit 4 is larger than the volume of the enclosed space S when the bonding of the first substrate 1 and the second substrate 2 is completed by the driving unit 5 described later. It is set a little more. More specifically, the supply amount (dripping amount) of the fill material F is based on the volume that the open port 32, the closing lid 33, and the crushing lid 34 of the leakage flow path 31 can structurally allow.
Further, the fixed amount discharge part 4 is installed in the variable pressure chamber C, holds the first substrate 1 carried into the variable pressure chamber C immovably, and directs the fixed amount discharge part 4 from the fixed amount discharge part 4 to the enclosed space S in the atmosphere AP. It is also possible to supply the fill material F.

In the case shown in FIGS. 1A to 1F, etc. as an example of the fixed amount discharge part 4, the filler material F is dropped from the fixed amount discharge part 4 only to the center position of the enclosed space S in the XY direction and compared. This is an example of a single-point dropping in which a relatively large dot shape (generally a hemispherical shape) is filled.
4A to 4F as another example of the fixed amount discharge part 4, the fill material F is directed from the fixed amount discharge part 4 to a plurality of positions (four positions in the illustrated example) of the enclosed space S. This is an example of multi-point dropping in which droplets are dropped at predetermined intervals and are filled in relatively small dots (generally hemispherical shape).
Accordingly, not only single-point dropping as shown in FIGS. 1A to 1F but also multi-point dropping as shown in FIGS. As the two substrates 2 move closer to each other, the fill material F remains diffused and extended radially from the dropping position in the XY directions. As for the extension of the fill material F, as shown in FIGS. 1 (c) and (e) and FIGS. 4 (c) and 4 (e), the arrival at the corners of the seal 3 (corners of the dam portion 3a) is delayed. become.
Although not shown as a modified example of the fixed-quantity discharge part 4 other than that, it is possible to change from single-point dropping to multi-point dropping in FIGS. 1 (a) to 1 (f), and to FIGS. 4 (a) to 4 (f). It is also possible to change the multi-point dropping to the single-point dropping and to change the dropping positions in the multi-point dropping to two places, three places, five places or more other than the illustrated example.

The drive unit 5 is a mechanism that holds and moves the first substrate 1 and the second substrate 2 toward each other so that the fill material F supplied to the enclosed space S extends. The drive unit 5 includes a contact / separation drive source 51 that relatively moves either the first substrate 1 or the second substrate 2 or both the first substrate 1 and the second substrate 2. ..
The contact / separation drive source 51 is composed of an actuator or the like that can reciprocate in the Z direction, and its operation is controlled by the controller 6 described later. As an example of the control of the contact / separation drive source 51, after the filling material F is supplied from the constant amount discharge part 4, relative movement of the first substrate 1 and the second substrate 2 is started, and the first substrate 1 and the second substrate 2 are moved. Pressure is applied until the space between the two substrates 2 becomes a predetermined width. After reaching the predetermined width between the first substrate 1 and the second substrate 2, the pressure is released to return to the initial state.
Further, the drive unit 5 includes a room pressure adjusting source (not shown) for adjusting the inside of the variable pressure chamber C from the air atmosphere AP to the depressurized atmosphere DP having a predetermined vacuum degree.
The chamber pressure adjusting source is configured by a vacuum pump or the like, and after the control unit 6 described later supplies the fill material F to the enclosed space S by the constant amount discharge unit 4, the pressure inside the variable pressure chamber C is reduced to the depressurized atmosphere DP, and the contact is made. After release of the pressure by the separation drive source 51, the operation is controlled to return to the atmospheric atmosphere AP. Due to this pressure difference, the space between the first substrate 1 and the second substrate 2 is evenly pressed up to a predetermined gap.

The control unit 6 is a controller that is electrically connected to the fixed-quantity discharge unit 4 and the drive unit 5 (contact / separation drive source 51, room pressure adjustment source).
In addition to this, the controller is electrically connected to a drive source (not shown) for opening / closing an inlet / outlet (not shown) of the variable pressure chamber C, a drive source (not shown) for the carry-in member and the carry-out member, and the like.
The controller serving as the control unit 6 sequentially controls the operation at preset timings according to a preset program in its control circuit (not shown).

Then, the program set in the control circuit of the control unit 6 will be described as a bonding method of the bonding device A.
In the bonding method for the bonding device A according to the embodiment of the present invention, the seal 3 is provided on the one or both of the first substrate 1 and the second substrate 2 on which the plurality of elements E are arranged. Sealing is provided by enclosing, a fill supplying step of supplying a predetermined amount of fill material F to the enclosed space S surrounded by the seal 3, and relative sealing movement of the first substrate 1 and the second substrate 2. The main process includes a compression process of expanding the fill material F in the space S.
In the fill supply step, as shown in FIGS. 1A and 1B, etc., the fill material F is filled into the enclosed space S at the end of the bonding of the first substrate 1 and the second substrate 2 by the operation of the fixed amount discharge part 4. It is supplied (dropped) a little more than the volume of.
In the compression process, first, as shown in FIGS. 1C and 1D, the contact-separation drive source 51 is operated in a depressurized state of the depressurized atmosphere DP having a constant vacuum degree in the variable pressure chamber C by the operation of the chamber pressure adjusting source. The first substrate 1 and the second substrate 2 are moved relative to each other by the operation of, and pressure is applied in the Z direction until the space between the first substrate 1 and the second substrate 2 becomes a predetermined width. After the space between the first substrate 1 and the second substrate 2 reaches a predetermined width, the pressure from the contact / separation drive source 51 is released. Subsequently, as shown in FIGS. 1E and 1F, the reduced pressure atmosphere DP is returned to the atmospheric atmosphere AP by the operation of the room pressure adjusting source. Due to this pressure difference, the space between the first substrate 1 and the second substrate 2 is evenly pressed up to a predetermined gap.
As a subsequent step of the compressing step, the first substrate 1 and the second substrate are kept in a state where the filler 3 is cured by UV or the like together with the seal 3 and the first substrate 1 and the second substrate 2 are held in a predetermined gap. The pasting of No. 2 is completed and the pasting device A is obtained. The completed bonding device A is separated for each element E by dicing or the like after being carried out and is used.

By the way, in the plurality of elements E mounted on the first substrate 1, an error is likely to occur in the cut size of each element E when divided by dicing or the like before being transferred to the first substrate 1. Further, an error may occur in the thickness size of each element E due to an error in the thickness of the element forming substrate or wafer used when forming each element E. Furthermore, even when each element E is mounted on the first substrate 1, a positional deviation (error in the amount of protrusion) of each element E with respect to the surface 1a (electrode pad) of the first substrate 1 is likely to occur.
Such an error in the cut size or thickness of each element E or an error in the amount of protrusion becomes a remarkable error in the case of a micro element such as a micro LED. In addition to this, when the element E that has been detected as having a light emission failure by performing a light emission test after mounting is removed, or when an alternative element having a good light emission is additionally provided while leaving the element E having the light emission failure as a function stop is there. Therefore, in the first substrate 1 on which the plurality of elements E are mounted, the uneven shape formed by the plurality of elements E is likely to vary from one sheet to another, and variations easily occur. ), Variations are likely to occur for each sheet, and the volume of the enclosed space S also changes for each sheet due to these variations.
If, for example, a seal is formed in an annular shape as described in Japanese Patent Application Laid-Open No. 2002-328382 (Patent Document 1) and a predetermined amount of fill material is supplied to an enclosed space whose four corners are closed. Has the following problems.
Since the mounting state of the plurality of elements E is different for each sheet of the substrate and the volume of the enclosed space S is changed, if the supply amount of the fill material to the enclosed space S is excessive, the internal pressure of the enclosed space closed by the seal is increased. Will be higher than necessary with excess fill material. As a result, the seal is deformed by the fill material, and even if the dam material of the seal is set to have a viscosity higher than that of the fill material, the seal may not withstand the extension pressure of the fill material and may break.
On the contrary, if the supply amount of the fill material is insufficient even a little, the extension of the fill material is completed before the fill material reaches all the corners (four corners) of the seal, and voids are generated in the effective sealing area in the enclosed space. I will remain.
Under such circumstances, it is desired to simultaneously prevent the seal 3 from collapsing and prevent the void V from being generated in the effective sealing region S1.

Next, a bonding apparatus B for the bonding device A according to the first to fourth embodiments of the present invention and respective modified examples will be described with reference to FIGS. 1 to 9.
In the leakage channel 31 according to the first embodiment of the present invention, as shown in FIGS. 1 (a) to 1 (f), FIG. 2 and FIGS. 3 (a) to 3 (c), from the corner portion of the dam portion 3a An opening 32, a closing lid 33, and a crushing lid 34 are provided for the first leakage flow path 31a that projects radially.
In the example shown in FIGS. 1A to 1F, the open port 32 that is always open is formed on the front end side (terminal end) in the inflow direction of the fill material F in the first leakage flow path 31a.
In the initial stage of compression shown in FIGS. 1C and 1D, the relative movement of the first substrate 1 and the second substrate 2 is performed by the contact / separation drive source 51, and FIGS. At the end of compression shown in (1), a pressure difference occurs from the reduced pressure atmosphere DP to the atmospheric atmosphere AP due to the room pressure adjusting source. By the compression of the first substrate 1 and the second substrate 2 in the Z direction by these, the filler material F is radially diffused and extended from the supply position (dropping position) in the XY directions.
Along with this, the voids (vacuum voids) V and the fill material F in the enclosed space S flow into the first leakage flow passage 31a through the outlets 3b formed at the corners of the dam portion 3a of the seal 3. As a result, the void V is extruded by the fill material F from the opening 32 of the first leakage flow path 31a, and the entire fillable area S1 is filled with the fill material F.
In the example shown in FIG. 2, the configuration in which the closing lid 33 that is always closed is formed in the first leakage flow path 31a is different from the example shown in FIGS. 1 (a) to 1 (f).
In the illustrated example, the closing lid 33 is arranged on the front end side (end) in the inflow direction of the fill material F in the first leakage flow path 31a.
As a result, at the end of compression shown in FIG. 2, the void V pushed out by the fill material F into the first leakage flow path 31a flows into the flow path closed by the closing lid 33, in the illustrated example, the flow of the fill material F. Remains on the tip side (end). However, the fill material F is filled in the entire effective sealing region S1.
In the example shown in FIGS. 3A to 3C, the configuration in which the crushing lid 34 that is closed along with the crush deformation of the seal 3 is formed in the first leakage flow channel 31a is configured as shown in FIGS. And the example shown in FIG.
In the illustrated example, the crush lid 34 is arranged on the front end side (end) in the inflow direction of the fill material F in the first leakage flow path 31a.
As a result, in the initial stage of compression of the first substrate 1 and the second substrate 2 in the Z direction shown in FIG. 3B, the void V is pushed out of the first leakage flow channel 31a by the fill material F. However, at the end of compression shown in FIG. 3C, the crushing lid 34 is closed by joining due to the crushing deformation of the seal 3 that constitutes the first leakage flow path 31a. Therefore, the void V extruded into the first leakage flow path 31a may remain. However, the fill material F is filled in the entire effective sealing region S1.

In the leakage flow path 31 according to the second embodiment of the present invention, as shown in FIGS. 4 (a) to 4 (f) and FIG. 5, etc., the leakage flow path 31 branches out in a plurality of directions along the four sides of the dam portion 3a and flows out. The configuration in which the opening 32, the closing lid 33, and the crushing lid 34 are provided for the two leakage flow paths 31b is different from the above-described first embodiment, and the other configurations are the same as those in the first embodiment.
In the example shown in FIGS. 4A to 4F, the rectangular surrounding basin portion 3c is provided outside the four sides of the dam portion 3a, and the second leakage channel 31b is provided between the dam portion 3a and the surrounding lantern portion 3c. Is formed. The closing lid 33 is an intermediate portion of the four sides of the peripheral support portion 3c facing the continuous portion of the adjacent second leakage flow paths 31b.
As a result, at the final stage of compression shown in FIG. 4E, the void V extruded by the fill material F into the second leakage flow path 31b is the front side of the fill material F closed in the closing lid 33 in the inflow direction ( Remains at the end). However, the fill material F is filled in the entire effective sealing region S1.
In the example shown in FIG. 5, the planar L-shaped outer feeding portion 3d is provided outside the corner portion of the dam portion 3a, and the second leakage flow path 31b is formed between the dam portion 3a and the outer feeding portion 3d. The configuration in which the crush lid 34 is formed in the second leakage flow path 31b is different from the example shown in FIGS. 4 (a) to 4 (f).
In the illustrated example, the crushing lid 34 is arranged on the front end side (terminal end) in the inflow direction of the fill material F in the second leakage flow path 31b.
As a result, at the final stage of compression shown in FIG. 5, the crushing deformation of the seal 3 forming the second leakage flow passage 31b closes the crush lid 34, and the void V pushed out to the second leakage flow passage 31b remains. There is a possibility. However, the fill material F is filled in the entire effective sealing region S1.
Although not shown as another example, it is also possible to make changes such as forming the opening 32 and the closing lid 33 in place of the crushing lid 34 shown in FIG.

In the leakage flow passage 31 according to the third embodiment of the present invention, as shown in FIG. 6 and FIG. 7, the third leakage flow passage 31c flows out in only one direction along two opposing sides of the dam portion 3a. On the other hand, the configuration in which the opening 32, the closing lid 33, and the crushing lid 34 are provided is different from the first embodiment described above, and the other configurations are the same as those in the first embodiment.
In the example shown in FIG. 6, continuous dam portions 3e are provided over the ends of the two opposite sides in the dam portion 3a in the X direction or the Y direction, and the third leakage occurs between the dam portion 3a and the continuous dam portion 3e. The flow path 31c is formed. The closing lid 33 is formed at an intermediate portion on four sides of the continuous jetty portion 3e facing the continuous portion between the adjacent third leakage flow paths 31c.
As a result, in the final stage of compression shown in FIG. 6, the void V pushed out by the fill material F into the third leakage flow path 31c is directed toward the leading end side (end) of the fill material F closed by the closing lid 33. To remain. However, the fill material F is filled in the entire effective sealing region S1.
In the example shown in FIG. 7, a hook-shaped jetty portion 3f is provided at each end of two opposite sides in the dam portion 3a in the X direction or the Y direction, and the third leakage flow is provided between the dam portion 3a and the hook-shaped jetty portion 3f. The configuration in which the passage 31c is formed and the crush cover 34 is formed in the third leakage flow passage 31c is different from the example shown in FIG.
In the illustrated example, the crush lid 34 is arranged on the front end side (end) in the inflow direction of the fill material F in the third leakage flow path 31c.
As a result, in the final stage of compression shown in FIG. 7, the collapse lid 34 is closed due to the crushing deformation of the seal 3 constituting the third leakage flow passage 31c, and the void V pushed out to the third leakage flow passage 31c remains. there's a possibility that. However, the fill material F is filled in the entire effective sealing region S1.
Although not shown as another example, it is also possible to make changes such as forming the opening 32 and the closing lid 33 in place of the crushing lid 34 shown in FIG. 7.

In the leakage flow channel 31 according to the fourth embodiment of the present invention, as shown in FIGS. 8A to 8C, 9 and the like, substantially the entire leakage flow channel 31 is accompanied by the crush deformation of the seal 3. The configuration in which the closing cover 34 is provided is different from that of the first embodiment described above, and the other configurations are the same as those of the first embodiment.
In the example shown in FIGS. 8A to 8C, the planar L-shaped outer feeding portion 3d is provided outside the corner portion of the dam portion 3a, and the second leakage occurs between the dam portion 3a and the outer feeding portion 3d. The flow path 31b is formed, and the crushing lid 34 is formed over substantially the entire second leakage flow path 31b.
As a result, at the end of compression shown in FIG. 8C, the collapse lid 34 is closed due to the crushing deformation of the seal 3 that constitutes the second leakage flow path 31b, and the void V becomes the second leakage flow from the outlet 3b. It may remain on the way to the road 31b. However, the fill material F is filled in the entire effective sealing region S1.
In the example shown in FIG. 9, hook-shaped jetty portions 3f are respectively provided at the ends of two sides facing each other in the X direction or the Y direction in the dam portion 3a, and the third leakage flow is provided between the dam portion 3a and the hook-shaped jetty portion 3f. The configuration in which the passage 31c is formed and the crush cover 34 is formed over substantially the entire third leakage passage 31c is different from the example shown in FIGS. 8 (a) to 8 (c).
As a result, in the final stage of compression shown in FIG. 9, the crushing lid 34 is closed due to the crushing deformation of the seal 3 that constitutes the third leakage flow passage 31c, and the void V flows from the outlet 3b to the third leakage flow passage 31c. May remain on the way. However, the fill material F is filled in the entire effective sealing region S1.
Although not shown as another example, a modification such as forming the crush lid 34 over substantially the entire first leakage flow path 31a shown in FIGS. 3A to 3C is also possible.

According to the bonding apparatus B and the bonding method of the bonding device A according to the embodiment of the present invention as described above, the filling material F is filled in the enclosed space S from the constant-volume discharge unit 4, and the first substrate 1 and the second substrate 2 are combined. By supplying a larger amount than the volume of the enclosed space S at the end of the bonding, the fill material F in the enclosed space S is moved along with the relative movement of the first substrate 1 and the second substrate 2 by the driving unit 5. The seal 3 extends to every corner of the dam portion 3a. Following this, the fill material F in the enclosed space S overflows from the effective sealing region S1 of the plurality of elements E and flows into the leakage flow path 31.
Therefore, the internal pressure of the enclosed space S is not increased more than necessary by the excess fill material F, and the excessive extension pressure of the fill material F is not applied to the dam portion 3a of the seal 3. As a result, excess fill material F and voids V in the enclosed space S are pushed out to the leakage channel 31, and the entire effective sealing area S1 is filled with the fill material F without any gap.
Therefore, even if the supply amount (dropping amount) of the fill material F with respect to the enclosed space S is increased, the dam portion 3a of the seal 3 is not broken by the extension pressure of the fill material F, and the effective sealing area S1 of the plurality of elements E is reduced. Can be sealed from the fill material F without bubbles.
As a result, due to the variation factors such as the cutting size error and the thickness size error of the plurality of elements E mounted on the first substrate 1 and the removal or addition after the inspection, the phase of each uneven surface of the plurality of elements E is different. Even if there is a difference or a difference in the distance (gap) between the first substrate 1 and the second substrate 2 for each sheet, the leakage flow path 31 can absorb the variation in the required supply amount of the fill material F, and the seal 3 It is possible to simultaneously prevent the dam portion 3a from collapsing and prevent the generation of the void V in the effective sealing region S1.
Therefore, the bonding device A with high accuracy can be manufactured, and the yield can be improved.

In particular, as shown in FIGS. 1A, 1C, 1E, etc., it is preferable that the leakage flow path 31 has an opening 32.
In this case, by disposing the opening 32 on the tip side in the inflow direction of the fill material F in the leakage flow path 31, the fill material F and the void V overflowing from the effective sealing region S1 in the enclosed space S are It flows from the inside of the enclosed space S into the leakage flow path 31 and flows toward the opening 32.
Therefore, the void V in the enclosed space S is pushed out from the opening 32 of the leakage channel 31, and the entire effective sealing region S1 is filled with the fill material F.
Therefore, the void V in the enclosed space S can be discharged from the opening 32 and the effective sealing region S1 can be reliably filled with the fill material F with a simple flow path structure.
As a result, a more accurate bonding device A can be manufactured, and the yield can be further improved.

Further, as shown in FIG. 2 and the like, it is preferable that the leakage channel 31 has a closing lid 33.
In this case, by disposing the closing lid 33 on the leading end side in the inflow direction of the fill material F in the leakage flow path 31, the fill material F and the void V overflowing from the effective sealing region S1 in the enclosed space S are From the inside of the enclosed space S, it flows into the leakage channel 31 and flows toward the closing lid 33.
Therefore, although the void V pushed out to the leakage flow channel 31 remains between the closing lid 33 and the void V, the entire effective sealing region S1 is filled with the fill material F.
Therefore, the void V in the enclosed space S can be pushed into the vicinity of the closing lid 33 of the leakage channel 31 to reliably fill the effective sealing region S1 with the fill material F with a simple channel structure.
As a result, a more accurate bonding device A can be manufactured, and the yield can be further improved.

Further, as shown in FIGS. 3A to 3C and the like, the seal 3 is made of a material that is crushed and deformed as the first substrate 1 and the second substrate 2 move closer to each other, and the leakage channel 31 seals. It is preferable to have a crushing lid 34 that closes by the crushing deformation of 3.
In this case, by disposing the crush cover 34 on the tip side in the inflow direction of the fill material F in the leakage flow path 31, the fill material F and the void V overflowing from the effective sealing region S1 in the enclosed space S are From the inside of the enclosed space S, it flows into the leakage channel 31 and flows toward the crush lid 34.
Therefore, although the void V pushed out to the leakage flow path 31 remains between the collapse lid 34 and the collapse lid 34, the entire effective sealing region S1 is filled with the fill material F.
Therefore, the void V in the enclosed space S can be pushed into the vicinity of the crushing lid 34 of the leakage flow path 31 and the effective sealing region S1 can be reliably filled with the fill material F with a simple flow path structure.
As a result, a more accurate bonding device A can be manufactured, and the yield can be further improved.

On the other hand, according to the bonding device A according to the embodiment of the present invention, the volume of the filling space S when the bonding of the first substrate 1 and the second substrate 2 is completed by filling the filling material F into the filling space S. By supplying more than that, the fill material F in the enclosed space S extends to every corner of the dam portion 3a of the seal 3 as the first substrate 1 and the second substrate 2 relatively move closer to each other. Following this, the fill material F in the enclosed space S overflows from the effective sealing region S1 of the plurality of elements E and flows into the leakage flow path 31.
Therefore, the internal pressure of the enclosed space S is not increased more than necessary by the excess fill material F, and the excessive extension pressure of the fill material F is not applied to the dam portion 3a of the seal 3. As a result, excess fill material F and voids V in the enclosed space S are pushed out to the leakage channel 31, and the entire effective sealing area S1 is filled with the fill material F without any gap.
Therefore, it is possible to provide a bonding device A capable of sealing the effective sealing region S1 of a plurality of elements E from the fill material F without bubbles without the dam portion 3a of the seal 3 being broken by the extension pressure of the fill material F. You can
As a result, due to the variation factors such as the cutting size error and the thickness size error of the plurality of elements E mounted on the first substrate 1 and the removal or addition after the inspection, the phase of each uneven surface of the plurality of elements E is different. Even if there is a difference or a difference in the distance (gap) between the first substrate 1 and the second substrate 2 for each sheet, the leakage flow path 31 can absorb the variation in the required supply amount of the fill material F, and the seal 3 It is possible to simultaneously prevent the dam portion 3a from collapsing and prevent the generation of the void V in the effective sealing region S1.
Therefore, the highly accurate bonding device A can be obtained, and the yield at the time of manufacturing can be improved.

In the illustrated example in the above-described embodiments (first to fourth embodiments), the first substrate 1 on which the plurality of elements E are arranged is arranged below, and the second substrate 2 is arranged above. However, the present invention is not limited to this, and the first substrate 1 on which the plurality of elements E are arranged may be arranged above, and the second substrate 2 provided with the seal 3 may be arranged below.
In this case, after the fill material F is supplied to the enclosed space S surrounded by the seal 3 of the second substrate 2, the fill material in the enclosed space S is moved by the approach movement of the first substrate 1 and the second substrate 2. Extend F. As a result, even in this case, the same actions and advantages as those of the first to fourth embodiments described above can be obtained.
Further, the seals 3 are respectively provided on both the surface 1a of the first substrate 1 and the surface 2a of the second substrate 2 so as to face each other in the Z direction, and the seals 3 are respectively moved by approaching movement of the first substrate 1 and the second substrate 2. The seal 3 may be joined so that the seal 3 is crushed and deformed.

A Laminating device B Laminating apparatus 1 First substrate 2 Second substrate 3 Seal 3a Dam part 31 Leakage flow path 32 Opening port 33 Closing lid 34 Crushing lid 4 Constant discharge part 5 Driving part 6 Control part E Element F Fill material S Enclosed space S1 Effective sealing area

Claims (5)

A seal provided to surround the plurality of elements on either or both of a first substrate on which a plurality of elements are arranged or a second substrate facing the first substrate,
A fixed-quantity discharge unit that supplies a predetermined amount of fill material to the enclosed space surrounded by the seal,
A drive unit for extending the fill material in the enclosed space by relative approach movement of the first substrate and the second substrate under reduced pressure,
A control unit that controls the operation of the constant-volume discharge unit and the drive unit;
The seal has a dam portion provided so as to surround an effective sealing area of the plurality of elements in the enclosed space, and an opening in a part of the dam portion so that the first substrate and the second substrate move closer to each other. An outlet provided so that the fill material that has progressed by the passage, and a leakage flow passage provided outside the dam portion so as to communicate with the effective sealing region through the outlet. Have,
The control unit causes the fill material supplied to the enclosed space to extend to every corner of the dam portion due to the approach movement of the first substrate and the second substrate, and the outlet from the effective sealing region. through to overflow, and at least the outlet of the passage during bonding apparatus bonding device being controlled so as to flow into the leakage flow path which opens at.   The bonding apparatus for a bonding device according to claim 1, wherein the leakage flow path has an opening.   2. The seal is made of a material that collapses and deforms as the first substrate and the second substrate move closer to each other, and the leakage flow path has a crushing lid that closes due to the crushing deformation of the seal. A bonding device for the bonding device described. A seal creating step in which a seal is provided to surround the plurality of elements on either or both of a first substrate on which a plurality of elements are arranged or a second substrate facing the first substrate,
A fill supply step of supplying a predetermined amount of fill material to the enclosed space surrounded by the seal,
A compression step of extending the fill material in the enclosed space by relative approach movement of the first substrate and the second substrate under reduced pressure,
The seal has a dam portion provided so as to surround an effective sealing area of the plurality of elements in the enclosed space, and an opening in a part of the dam portion so that the first substrate and the second substrate move closer to each other. An outlet provided so that the fill material that has progressed by the passage, and a leakage flow passage provided outside the dam portion so as to communicate with the effective sealing region through the outlet. Have,
In the compression step, the fill material supplied to the enclosed space is extended to every corner of the dam portion by the approach movement of the first substrate and the second substrate, and at the same time, from the effective sealing area to the outflow port. and overflowed through, and at least the outlet bonding method lamination device for causing to flow into the leakage flow passage which opens during the passage of. A seal is provided to surround the plurality of elements on either or both of a first substrate on which a plurality of elements are arranged or a second substrate facing the first substrate, and in a sealed space surrounded by the seal. A bonding device in which a predetermined amount of the supplied filler material is spread and bonded so as to seal the plurality of elements,
The seal is arranged so as to surround an effective sealing region of the plurality of elements in the enclosed space, and a dam portion provided so that the fill material in the enclosed space extends to every corner,
An outlet that is opened in a part of the dam portion and is provided so that the fill material that extends to every corner of the dam portion passes through,
It is arranged outside the dam portion so as to communicate with the effective sealing region via the outflow port, opens at least when the fill material passes through the outflow port, and passes through the outflow port to the effective seal. laminating device characterized by having a leakage flow path which is provided as the fill material overflowing from the retaining region is inflows.

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