JP6574404B2 - ヒートシンク構造 - Google Patents
ヒートシンク構造 Download PDFInfo
- Publication number
- JP6574404B2 JP6574404B2 JP2016131802A JP2016131802A JP6574404B2 JP 6574404 B2 JP6574404 B2 JP 6574404B2 JP 2016131802 A JP2016131802 A JP 2016131802A JP 2016131802 A JP2016131802 A JP 2016131802A JP 6574404 B2 JP6574404 B2 JP 6574404B2
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- Prior art keywords
- heat
- heat pipe
- planar
- tubular
- sink structure
- Prior art date
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
10 平面型ヒートパイプ
12 管状ヒートパイプ
17 放熱フィン
20 付勢部材
Claims (5)
- 複数の発熱体上に載置されることで該複数の発熱体と熱的に接続され、前記複数の発熱体と熱的に接続する受熱部以外の平面部が、放熱部として機能する平面型ヒートパイプと、管状ヒートパイプと、を備え、該平面型ヒートパイプの放熱部として機能する、該平面型ヒートパイプの平面状である周縁部に、該管状ヒートパイプの一方の端部が受熱部として熱的に接続されたヒートシンク構造であり、
前記管状ヒートパイプの受熱部が、扁平加工されており、平面視において平面型ヒートパイプに沿って延在し、
前記管状ヒートパイプの放熱部に放熱フィンが設けられ、
前記管状ヒートパイプは、平面視において前記複数の発熱体と重なり合わない部位に位置し、前記放熱フィンと前記平面型ヒートパイプとの間に送風ファンが配置され、前記送風ファンの冷却風により、前記放熱フィンと前記平面型ヒートパイプが冷却されるヒートシンク構造。 - 前記管状ヒートパイプが、前記平面型ヒートパイプよりも前記複数の発熱体の方向に配置される請求項1に記載のヒートシンク構造。
- 前記複数の発熱体のうち、高さ方向の寸法が小さい前記発熱体と前記平面型ヒートパイプとの間に熱伝導性部材が挿入されている請求項1または2に記載のヒートシンク構造。
- 前記放熱フィン及び/または前記管状ヒートパイプの放熱部が、送風ファンの冷却風により冷却される請求項1乃至3のいずれか1項に記載のヒートシンク構造。
- 前記平面型ヒートパイプに付勢部材が設けられ、該付勢部材が、前記発熱体の支持部材に固定される請求項1乃至4のいずれか1項に記載のヒートシンク構造。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016131802A JP6574404B2 (ja) | 2016-07-01 | 2016-07-01 | ヒートシンク構造 |
PCT/JP2017/024069 WO2018003958A1 (ja) | 2016-07-01 | 2017-06-30 | ヒートシンク構造 |
CN201790000986.XU CN209524789U (zh) | 2016-07-01 | 2017-06-30 | 散热器结构 |
TW106122199A TWI649529B (zh) | 2016-07-01 | 2017-07-03 | Radiator construction |
JP2018140658A JP6928588B2 (ja) | 2016-07-01 | 2018-07-26 | ヒートシンク構造 |
US16/237,283 US20190137187A1 (en) | 2016-07-01 | 2018-12-31 | Heat sink structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2016131802A JP6574404B2 (ja) | 2016-07-01 | 2016-07-01 | ヒートシンク構造 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018140658A Division JP6928588B2 (ja) | 2016-07-01 | 2018-07-26 | ヒートシンク構造 |
Publications (2)
Publication Number | Publication Date |
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JP2018004164A JP2018004164A (ja) | 2018-01-11 |
JP6574404B2 true JP6574404B2 (ja) | 2019-09-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016131802A Active JP6574404B2 (ja) | 2016-07-01 | 2016-07-01 | ヒートシンク構造 |
Country Status (1)
Country | Link |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11963339B2 (en) * | 2020-09-14 | 2024-04-16 | Nvidia Corporation | Unified fan-less radiator for datacenter cooling systems |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3564560B2 (ja) * | 1994-09-14 | 2004-09-15 | アクトロニクス株式会社 | 柔軟性薄形プレートヒートパイプ |
JPH10267571A (ja) * | 1997-03-20 | 1998-10-09 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとそれを用いた冷却構造 |
JP2000161878A (ja) * | 1998-11-30 | 2000-06-16 | Furukawa Electric Co Ltd:The | 平面型ヒートパイプ |
JP2003068957A (ja) * | 2001-08-27 | 2003-03-07 | Matsushita Electric Ind Co Ltd | 冷却モジュール |
JP2003336976A (ja) * | 2002-05-17 | 2003-11-28 | Furukawa Electric Co Ltd:The | ヒートシンクおよびその実装構造 |
JP2005032771A (ja) * | 2003-07-07 | 2005-02-03 | Fujikura Ltd | 電子素子の冷却装置 |
JP2010092977A (ja) * | 2008-10-06 | 2010-04-22 | Panasonic Corp | 半導体装置及びその製造方法 |
JP4745439B2 (ja) * | 2009-11-20 | 2011-08-10 | 株式会社東芝 | 電子機器 |
US20110297355A1 (en) * | 2010-06-07 | 2011-12-08 | Celsia Technologies Taiwan, Inc. | Heat-conducting module and heat-dissipating device having the same |
JP2012141082A (ja) * | 2010-12-28 | 2012-07-26 | Fujitsu Ltd | 冷却装置及び電子機器 |
FR3027379B1 (fr) * | 2014-10-15 | 2019-04-26 | Euro Heat Pipes | Caloduc plat avec fonction reservoir |
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2016
- 2016-07-01 JP JP2016131802A patent/JP6574404B2/ja active Active
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