JP6269203B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device such as a power supply device.

  For example, a switching power supply device is used as the power supply device, and electronic components such as a transformer, a coil, and an aluminum electrolytic capacitor are provided inside the switching power supply device. Among these electronic components, for example, transformers, coils, semiconductor elements, etc. are heat generating components that generate more heat than other components, and a metal housing is used to dissipate the heat generated by these components to the outside. May be used.

However, when a metal casing is used, there is a problem that it is difficult to reduce the size of the power supply device because it is necessary to secure an insulation distance between the casing and the electrical component.
On the other hand, for example, as shown in Patent Document 1, a configuration using a resin-made casing as a casing of a power supply device is disclosed. By using such a casing made of resin, insulation from an electrical component is disclosed. Therefore, it is possible to reduce the size from the viewpoint of insulation.

  Moreover, since the housing can be mass-produced by resin molding, the cost can be reduced.

JP 2000-208968 A

However, the conventional configuration has the following problems.
That is, when trying to reduce the size, heat tends to be trapped in the apparatus, and therefore, there is a problem that it is difficult to sufficiently dissipate heat when the casing is formed of a resin having a lower thermal conductivity than metal. Furthermore, if it is going to respond to the request | requirement of high capacity | capacitance in recent years, since the emitted-heat amount will increase, it will become more difficult for heat dissipation.

Also, among the electronic components provided in the power supply device, the life of aluminum electrolytic capacitors, especially when the temperature rises too much, is shortened. Therefore, when trying to increase the capacity and reduce the size, an appropriate power supply device equivalent to the conventional one is used. There is a risk that it will not be possible to ensure the service life.
An object of the present invention is to provide an electronic device that can be miniaturized and has good heat dissipation and can ensure an appropriate life.

  The electronic device according to the first aspect of the present invention includes a housing, a heat generating component, a heat radiating member, an aluminum electrolytic capacitor, and a heat insulating portion. The housing is made of resin. The heat generating component is disposed inside the housing. The heat dissipating member is disposed along the outer surface of the housing, has a higher thermal conductivity than the resin forming the housing, has a plate shape, and releases heat generated by the heat-generating component to the outside. The aluminum electrolytic capacitor is disposed inside the housing. The heat insulating part is provided between the heat radiating member and the housing and facing the aluminum electrolytic capacitor, and blocks heat transfer from the heat radiating member to the aluminum electrolytic capacitor. The heat generating component is in contact with the heat dissipation member indirectly through the housing, and when the heat transfer member is disposed in direct contact with the heat generation component, the heat generation component is indirectly in contact with the heat dissipation member through the heat transfer member. When a heat transfer member arranged in direct contact with the contact or heat generating component is provided, the heat transfer member and the housing indirectly contact the heat dissipation member or directly contact the heat dissipation member.

Since the housing is formed of resin in this way, it is not necessary to secure an insulation distance from the electronic component, so that the size can be reduced.
In addition, by disposing the heat dissipating member along the outer surface of the housing, the heat generated by the heat generating component spreads in the surface direction of the heat dissipating member and is released from the whole heat dissipating member to the outside, so that good heat dissipation Can be obtained.

  On the other hand, the provision of the heat insulating part can prevent the heat transmitted along the heat dissipation member from being transmitted to the aluminum electrolytic capacitor as much as possible, so that the life of the aluminum electrolytic capacitor is shortened. It can be suppressed, and the lifetime of the electronic device equivalent to or longer than that of the conventional device can be realized. Here, the heat insulation does not need to completely block the heat transfer from the heat radiating member, as long as the heat transfer can be reduced at least. Further, the heat generating component is an electronic component that transfers heat to the heat radiating member during the steady operation of the electronic device. When an aluminum electrolytic capacitor is used for the electronic device, it may be a component that generates a larger amount of heat than the aluminum electrolytic capacitor. In addition, among the components used in the electronic device, components included in the upper half when viewed in descending order of the calorific value may be used. The heat generating component includes one of a transformer, a semiconductor component, and a coil. The heat transfer member is a member having a higher thermal conductivity than the gas inside the housing such as air. Also included are those in which a plurality of these members are stacked in direct contact with each other. In this case, the case where the member arranged on the side in contact with the other member is a sheet-like member such as paper or a resin sheet that is more slidable with respect to the other member than when it is not arranged. . As a result, heat can be efficiently radiated to the housing rather than providing a space without arranging a heat transfer member.

As described above, heat generated by the heat-generating component can be released to the outside, and heat transfer to the aluminum electrolytic capacitor can be blocked as much as possible.
For this reason, it is possible to provide electric air that can be miniaturized and has good heat dissipation and can ensure an appropriate life.

An electronic device according to a second aspect is the electronic device according to the first aspect, wherein the heat insulating portion is provided in a recess formed on the surface of the housing on the heat radiating member side.
Thereby, since the heat transfer from a heat radiating member to a housing | casing can be interrupted | blocked, the heat transfer from a heat radiating member to an aluminum electrolytic capacitor can be reduced. In addition, the heat insulating portion can be formed with a simple configuration in which a recess is formed in the housing.

An electronic device according to a third aspect is the electronic device according to the first aspect, wherein the heat insulating portion is formed by air in the recess.
Since the thermal conductivity of air is very small, the heat insulation effect is high. Thereby, the heat transfer from a heat radiating member to a housing | casing can be interrupted | blocked effectively.
An electronic device according to a fourth aspect is the electronic device according to the first aspect, wherein the heat generating component is a transformer.
Thereby, the heat from the transformer can be radiated to the outside of the electronic device via the heat radiating member. Since the amount of heat generated in this transformer is large, it is possible to efficiently prevent the temperature inside the electronic device from rising by dissipating the heat generated by the transformer to the outside.

An electronic device according to a fifth aspect of the present invention is the electronic device according to the first aspect of the present invention, wherein the heat transfer member is a heat radiating gel sheet and has a higher thermal conductivity than the heat insulating portion.
Here, since the heat-dissipating gel sheet is likely to be in close contact with the heat-generating component, the use of such a heat transfer member can more efficiently transmit the heat generated by the heat-generating component to the heat-dissipating member.

An electronic device according to a sixth invention is the electronic device according to the first invention, wherein the heat transfer member is a heat sink.
Thereby, the heat of the heat generating component in contact with the heat sink can be efficiently transmitted to the heat radiating member by transmitting the heat of the heat sink to the heat radiating member.
An electronic apparatus according to a seventh aspect is the electronic apparatus according to the first aspect, wherein the heat transfer member is disposed between the heat generating component and the casing and is in direct contact with the casing.
As a result, the heat generating component comes into contact with the heat radiating member indirectly through the heat transfer member and the housing, and the heat generated in the heat generating component is transmitted to the heat radiating member through the heat transfer member and the housing. Then, it is transmitted in the surface direction of the heat radiating member and radiated to the outside.

An electronic device according to an eighth aspect is the electronic device according to the first aspect, wherein the housing has a through hole, and the heat transfer member is disposed between the heat generating component and the heat dissipation member. And is in direct contact with the heat dissipation member through the through hole.
As a result, the heat generating component comes into contact with the heat radiating member indirectly through the heat transfer member, and heat generated in the heat generating component is transmitted to the heat radiating member through the heat transfer member, and further, It is transmitted in the surface direction and radiated to the outside.

  ADVANTAGE OF THE INVENTION According to this invention, while aiming at size reduction, the electronic device which has favorable heat dissipation and can ensure a suitable lifetime can be provided.

The perspective view of the front side of the power supply device in Embodiment 1 which concerns on this invention. The perspective view of the back side of the power supply device of FIG. The exploded view of the power supply device of FIG. (A), (b), (c), (d), (e) Front view, right side view, left side view, top view, bottom view of the case body of the power supply device of FIG. The perspective view which shows the power supply circuit unit of the power supply device of FIG. The left view which shows the internal structure of the power supply device of FIG. FIG. 7 is a cross-sectional view taken along the line AA in FIG. 6. FIG. 7 is a cross-sectional view taken along the line BB in FIG. 6. The exploded view for demonstrating the manufacturing method of the power supply device of FIG. The disassembled perspective view which shows the power supply device of the modification of Embodiment 1 which concerns on this invention. Sectional drawing which shows the power supply device of the modification of Embodiment 1 which concerns on this invention. (A), (b) The perspective view which shows the power supply device of the modification of Embodiment 1 which concerns on this invention. (A) Sectional drawing which shows the power supply device of FIG. 12, (b) G section enlarged view of Fig.13 (a). The exploded view which shows the power supply device of FIG. The perspective view which shows the power supply device of the modification of Embodiment 1 which concerns on this invention. (A) Sectional drawing which shows the power supply device of FIG. 15, (b) G part enlarged view of Fig.13 (a). The exploded view which shows the power supply device of FIG. The perspective view which shows the power supply device of the modification of Embodiment 1 which concerns on this invention. The left view which shows the internal structure of the power supply device of FIG. (A) Arrow cross-sectional view between CCs in FIG. 18, (b) Arrow cross-sectional view between DDs in FIG. (A) The figure which shows the slide sheet of the power supply device of the modification of Embodiment 1 which concerns on this invention, (b) The figure which shows the power supply circuit unit of the power supply device of the modification of Embodiment 1 which concerns on this invention, (c) The figure which shows the state in which the power supply circuit unit shown in FIG.21 (b) was covered with the slide sheet | seat shown to Fig.21 (a).

Hereinafter, a power supply device according to an embodiment of the present invention will be described with reference to the drawings.
(Embodiment 1)
<1. Configuration of Power Supply Device 100>
FIG. 1 is a front perspective view of the power supply apparatus 100 according to the first embodiment. FIG. 2 is a perspective view of the back side of the power supply apparatus 100 of FIG. FIG. 3 is an exploded view of the power supply apparatus 100 of FIG.

The power supply apparatus 100 according to the first embodiment is a switching power supply apparatus, and can convert a commercial power supply input into high-frequency power using a semiconductor switching action to obtain a predetermined direct current.
As shown in FIGS. 1 to 3, the power supply device 100 according to the first embodiment includes a case 1, heat radiating plates 2 a and 2 b disposed outside both side surfaces of the case 1, and a power supply housed in the case 1. The circuit unit 3, the heat dissipating gel sheet 4 (see FIGS. 5 and 7 to be described later) and the slide sheet 5 (see FIGS. 5 and 7 to be described later) disposed on the heat generating components of the power circuit unit 3, and the heat sink 2 from the aluminum Heat insulation portions 6a and 6b (see FIG. 1) for interrupting heat transfer to the electrolytic capacitors 35 and 37 are provided. In FIG. 1, the support rail 9 to which the power supply device 100 according to the first embodiment is attached is indicated by a dotted line.

Hereafter, each structure is demonstrated in order.
(1-1. Case 1)
As shown in FIG. 3, the case 1 includes a case main body 10 and a case front portion 11.
4 (a), 4 (b), 4 (c), 4 (d), and 4 (e) are respectively a front view, a right side view, a left side view, and a top view of the case body 10. FIG.

  As shown in FIGS. 3 and 4 (a) to 4 (e), the case main body 10 has a box shape having an opening 17 on the front side, and includes a right side surface 12, a left side surface 13, an upper surface 14, a bottom surface 15, And a back surface 16. In the present specification, up / down / left / right and front / rear are defined with reference to the power supply device 100 attached to the support rail 9. The left-right direction indicates the left-right direction when the case front portion 11 is viewed from the front. Further, the front side is the case front portion 11 side, and the rear side is the back surface 16 side.

(1-1-1. Case body 10)
(1-1-1-1. Right side surface 12)
As shown in FIG. 4B, the right side surface 12 is formed with fitting holes 12a and 12b into which claws 11a and 11b (described later) of the case front portion 11 are fitted. The fitting holes 12a and 12b are formed at two positions on the right side 12 on the front end 12f side.

(1-1-1-2. Left side 13)
As shown in FIG. 4C, fitting holes 13 a and 13 b are formed in the left side surface 13 so that claws 11 c and 11 d (described later) of the case front portion 11 are fitted. The fitting holes 13a and 13b are formed at two places on the left side 13 on the front end 13f side. The left side surface 13 is formed with a first recess 13c and a second recess 13d on the outer surface 13s side.

The first recess 13c is formed on the upper end side of the left side surface 13 and on the front end 13f side. The first recess 13c is formed to face and cover three aluminum electrolytic capacitors 37 (described later).
The second recessed portion 13d is formed on the lower end side of the left side surface 13 and on the back surface 16 side. The second recess 13d covers the aluminum electrolytic capacitor 35 so as to face a part of the side surface 35a of the aluminum electrolytic capacitor 35 (described later) arranged so that a part of the side surface 35a faces the first substrate 31a. Is formed.

(1-1-1-3. Upper surface 14)
As shown in FIG. 4D, the upper surface 14 is formed with a fitting hole 14a into which a claw portion 11e (described later) of the case front portion 11 is fitted. The fitting hole 14 a is formed on the front end 14 f side of the upper surface 14. Further, as shown in FIGS. 1, 3 and 4D, a vent hole 141 for releasing heat generated in the power supply circuit unit 3 to the outside is formed in the upper surface 14. The ventilation hole 141 has a substantially hexagonal ventilation hole 141a and a linear ventilation hole 141b. If the end on the right side 12 of the upper surface 14 is the right end 14c, the end on the left side 13 side of the upper surface 14 is the left end 14d, and the end on the back 16 side of the upper surface 14 is the rear end 14e, the vent hole 141b is the right end 14c. Two are provided along the right end 14c and the left end 14d at positions closer to the left end 14d. Further, a plurality of vent holes 141a are provided between the vent holes 141b formed along the right end 14c and the left end 14d so as to form a honeycomb structure in the front-rear direction (front end 14f to rear end 14e). .

(1-1-1-4. Bottom 15)
As shown in FIG. 4E, the bottom surface 15 is formed with a fitting hole 15a into which a claw portion 11f (described later) of the case front portion 11 is fitted. The fitting hole 15 a is formed on the front end 15 f side of the bottom surface 15. Further, as shown in FIGS. 1, 3, and 4 (e), a vent hole 151 for releasing heat generated in the power supply circuit unit 3 to the outside is formed in the bottom surface 15. The vent 151 has a substantially hexagonal vent 151a and a linear vent 151b. If the end of the bottom surface 15 on the right side 12 side is the right end 15c, the end of the bottom surface 15 on the left side 13 side is the left end 15d, and the end of the bottom surface 15 on the back 16 side is the rear end 15e, the vent hole 151b is the right end 15c. Two are provided along the right end 15c and the left end 15d at positions closer to the left end 15d. A plurality of vent holes 151a are provided between the vent holes 151b formed along the right end 15c and the left end 15d so as to form a honeycomb structure in the front-rear direction (front end 15f to rear end 15e). .

(1-1-1-5. Back 16)
As shown in FIG. 2, the back surface 16 is provided with an attachment portion 160 for attachment to the support rail 9. The attachment portion 160 is formed in a concave shape in the left-right direction at a substantially central portion in the up-down direction. More specifically, the back surface 16 has a top surface 16a, a substantially central surface 16b, and a bottom surface 16c in the vertical direction. The surface 16b is located in front of the lower end of the surface 16a and the upper end of the surface 16c. A locking portion 16d formed so as to protrude downward is formed at the lower end of the surface 16a. Further, a recessed portion 16e formed so as to be recessed upward is formed in the step portion between the surface 16a and the surface 16b.

On the other hand, a locking portion 16f formed in the upward direction is provided at the center upper end portion in the left-right direction of the surface 16c, and an inclined surface 16g is formed on the front surface of the locking portion 16f. Yes. The inclined surface 16g is inclined so that the position on the surface thereof is positioned forward as it goes upward. Further, the locking portion 16f has elasticity so as to bend in the front-rear direction.
The upper end portion 9a (see FIG. 1) of the support rail 9 is fitted into the recess 16e, and the lower end portion 9b (see FIG. 1) is fitted over the inclined surface 16g of the locking portion 16f, whereby the upper end portion 9a is locked. The lower end portion 9b is locked by the locking portion 16f. As a result, the power supply device 100 is supported by the support rail 9. The support rail 9 is formed to be long in the left-right direction, and the left-right direction in FIG. 1 is an example of the longitudinal direction of the support rail 9.

(1-1-2. Case Front 11)
As shown in FIG. 3, the case front portion 11 is formed in a lid shape that closes the opening 17 of the case main body 10, and fits with the case main body 10. As shown in FIGS. 1 to 3, the case front portion 11 has a front surface 110, a right surface 112, a left surface 113, an upper surface 114, and a lower surface 115. In a state where the case front part 11 is fitted to the case body 10, the right surface 112, the left surface 113, the upper surface 114, and the lower surface 115 of the case front part 11 are respectively connected to the right side surface 12, the left side surface 13, and the upper surface 14 of the case body 10. And the bottom surface 15 and the end surfaces are adjacent to each other.

  The case front part 11 is formed with projecting parts 11g and 11h projecting rearward from the edge 11k on the left side 13 side of the rear end thereof, and in the fitting holes 13a and 13b of the left side 13 at the tip thereof. Claw portions 11c and 11d to be fitted are provided. The claw portions 11c and 11d have inclined surfaces 111c and 111d on the outside, and are formed so that the width in the left-right direction becomes narrower toward the rear.

  As shown in FIGS. 1 and 2, the case front portion 11 is formed with a protruding portion (not shown) protruding rearward from the edge 11j on the right side surface 12 side of the rear end. Claw portions 11a and 11b that fit into the fitting holes 12a and 12b of the surface 12 are provided (see FIG. 2). In addition, the shape of the protrusion part in which the nail | claw parts 11a and 11b are provided is the same shape as the protrusion parts 11g and 11h shown in FIG.

  As shown in FIG. 3, the case front portion 11 is formed with a plate-like protrusion 11 i that protrudes rearward from the edge 11 m on the upper surface 14 side of the rear end, and the plate-like protrusion 11 i A claw portion 11e that fits in the fitting hole 14a of the upper surface 14 is provided on the outer surface. The claw portion 11e has an inclined surface 111e on the outer side, and is formed so that the thickness in the vertical direction decreases toward the rear.

Further, as shown in FIG. 2, the case front portion 11 is formed with a plate-like protruding portion (not shown) protruding rearward from the edge 11 n on the bottom surface 15 side at the rear end. A claw portion 11f that fits in the fitting hole 15a is provided (see FIG. 2). In addition, the shape of the protrusion part in which the nail | claw part 11f is provided is the same shape as the protrusion part 11i shown in FIG.
Further, as shown in FIG. 3, the first wiring connection portion 39 a of the power supply circuit unit 3 is disposed in the vicinity of the upper end inside the case front portion 11. A through hole 11o for tightening or loosening the screw 390 of the first wiring connection portion 39a is provided in the front surface 110 of the case front portion 11. Further, a through hole 11p for inserting a wiring is provided in the upper surface 114.
Similarly, in the vicinity of the lower end inside the case front portion 11, the second wiring connection portion 39 b of the power circuit unit 3 is arranged. A through hole 11q for tightening or loosening the screw 390 of the second wiring connection portion 39b is provided in the front surface 110 of the case front portion 11. Furthermore, a through hole 11r (see FIG. 3) for inserting a wiring is provided on the lower surface 115 (see FIG. 2).

(1-2. Heat sink 2a, 2b)
In this embodiment, the heat sinks 2a and 2b are plate-like members formed of aluminum. The heat sinks 2a and 2b are the outer surface 12s of the right side surface 12 of the case body 10 (see FIG. 4B, see FIG. 8B described later) and the outer surface 13s of the left side surface 13 (see FIG. 4C). 8 (b), which will be described later), is attached with an adhesive, and the heat sink on the right side surface 12 side is 2a, and the heat sink on the left side surface 13 side is 2b.

The heat radiating plate 2 a is formed in substantially the same outer shape as the right side surface 12 so as to cover the entire right side surface 12 of the case body 10. Further, the heat radiating plate 2b is formed to have substantially the same outer shape as the left side surface 13 so that the entire left side surface 13 of the case body 10 also covers the first concave portion 13c and the second concave portion 13d.
Further, the heat sink 2a is formed with notches 21 and 22 so as not to block the fitting holes 12a and 12b formed on the right side surface 12, and the heat sink 2b is also formed on the left side surface 13. Cutouts 21 and 22 are formed so as not to block the fitting holes 13a and 13b.
Moreover, as an adhesive agent which attaches heat sink 2a, 2b to the right side surface 12 and the left side surface 13, a double-sided tape etc. are mentioned, However, The one where heat conductivity is higher than the case main body 10 after adhesion hardening is preferable.

(1-3. Power supply circuit unit 3)
FIG. 5 is a perspective view of the power supply circuit unit 3 of the power supply apparatus 100 according to the first embodiment. FIG. 6 is a side view showing the internal configuration of the power supply apparatus 100 according to the first embodiment. In FIG. 6, the internal configuration is indicated by a dotted line. 7 is a cross-sectional view taken along the line AA in FIG. 8 is a cross-sectional view taken along the line BB in FIG.
As shown in FIGS. 5 and 6, the power supply circuit unit 3 is housed in the case 1 and has a first substrate 31a and a second substrate 31b.

(1-3-1. First substrate 31a)
The first substrate 31 a is disposed so as to cover the entire inner side of the right side surface 12 along a direction parallel to the right side surface 12 of the case body 10. As shown in FIG. 7 to be described later, the first substrate 31a is slid and inserted into and supported by groove-shaped support portions 14m and 15m formed in the vicinity of the right side surface 12 on the inside of the upper surface 14 and the lower surface 15, respectively. ing. In addition, the description of "parallel" in this specification does not show a strict meaning.

On the first substrate 31a, a switching element 32, a heat sink 33a, a transformer 34, an aluminum electrolytic capacitor 35, a rectifier diode 30, a heat sink 33b, a bridge diode 36, an aluminum electrolytic capacitor 37, a coil 38, and the like are arranged as main components. ing. These components are arranged on the surface on the left side surface 13 side of the first substrate 31a.
The switching element 32 is a MOSFET (metal-oxide-semiconductor field-effect transistor) or the like, and is disposed on the back surface 16 side of the first substrate 31a. The heat sink 33a is plate-shaped and dissipates heat generated by the switching element 32. The heat sink 33 a is disposed along a direction in which the plate-like surface 33 as is perpendicular to the first substrate 31 a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10. In addition, the description of "vertical" in this specification does not show a strict meaning.

  The transformer 34 and the aluminum electrolytic capacitor 35 are disposed on the opening 17 side (front side) of the heat sink 33a of the first substrate 31a. A transformer 34 is disposed on the upper surface 14 side, and an aluminum electrolytic capacitor 35 is disposed on the bottom surface 15 side of the transformer 34. The aluminum electrolytic capacitor 35 has a cylindrical shape and includes a side surface 35a, an end surface 35b, and an end surface 35c. Terminals are provided on the end face 35b as shown in FIG. 7, and are electrically connected to the first substrate 31a. In the present embodiment, the aluminum electrolytic capacitor 35 has an end surface 35 b and an end surface 35 c arranged along a direction parallel to the top surface 14 and the bottom surface 15. It can also be said that the aluminum electrolytic capacitor 35 is arranged such that a part of the side surface 35a thereof faces the first substrate 31a.

The heat sink 33 b is provided to dissipate heat from the rectifier diode 30. The heat sink 33 b has a shape obtained by bending a plate-like member into an L shape, and is disposed on the opening 17 side of the transformer 34. Further, the heat sink 33 b is disposed along a direction in which the plate-like surface 33 bs is perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.
The bridge diode 36 is disposed below the heat sink 33b. The bridge diode 36 has a plate shape, and a surface 36 a (see FIG. 6) is arranged along a direction perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

Three aluminum electrolytic capacitors 37 are arranged in the vertical direction (opposite direction of the top surface 14 and the bottom surface 15). As shown in FIG. 8, each aluminum electrolytic capacitor 37 has a side surface 37a, an end surface 37b, and an end surface 37c. A terminal (not shown) is provided on the end surface 37b and is electrically connected to the first substrate 31a. In the present embodiment, the aluminum electrolytic capacitor 37 is arranged such that the end surface 37 b and the end surface 37 c are parallel to the right side surface 12 and the left side surface 13. As shown in FIGS. 6 and 8, the end surface 37 c on which no terminal is provided faces the left side surface 13.
A coil 38 is disposed on the bottom surface 15 side of these aluminum electrolytic capacitors 37.

(1-3-2. Second substrate 31b)
The second substrate 31b is arranged on the case front part 11 side (not shown in FIG. 5 but shown in FIG. 6) from the three aluminum electrolytic capacitors 37 and the coil 38, as shown in FIG. It arrange | positions so that the opening 17 of the case main body 10 may be plugged up. In addition, the second substrate 31 b is disposed on the front side of the first substrate 31 a along a direction perpendicular to the first substrate 31 a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

  The second substrate 31b is mainly provided with a first wiring connection portion 39a and a second wiring connection portion 39b. The first wiring connection portion 39a and the second wiring connection portion 39b are provided on the front surface 110 side surface of the second substrate 31b. When the case body 10 and the case front portion 11 are combined, the case front portion 11 is combined. Placed inside. The first wiring connection portion 39a and the second wiring connection portion 39b are each divided so that a plurality of wirings can be connected.

  Screws 390 for fixing the wiring for each section are inserted into the first wiring connecting portion 39a from the front surface 110 side, and wiring for fixing the wiring fixed with the screws 390 is inserted into the upper surface 114 side. A portion 391 is provided. The second wiring connection portion 39b has the same structure as the first wiring connection portion 39a, but the wiring insertion portion 391 is provided on the lower surface 115 side.

(1-4. Heat dissipation gel sheet 4)
The heat radiating gel sheet 4 of Embodiment 1 has insulating properties, heat transfer properties, elasticity, and adhesiveness.
As shown in FIGS. 5 to 7, in the power supply device 100 according to the first embodiment, the heat radiating gel sheet 4 is disposed in close contact with the surface 34a of the transformer 34 that generates a large amount of heat (see arrow Y1 in FIG. 5). The surface 34a is a surface on the left side surface 13 side. The heat-dissipating gel sheet 4 has a rectangular parallelepiped shape as shown in FIG. 5, and has a first surface 4a and a second surface 4b facing each other as shown in FIG. The heat dissipating gel sheet 4 is in direct contact with the surface 34a of the transformer 34 on the first surface 4a. Moreover, the thermal radiation gel sheet 4 is in direct contact with the slide sheet 5 described later on the second surface 4b.

(1-5. Slide sheet 5)
(1-5-1. Configuration and Arrangement of Slide Sheet 5)
The slide sheet 5 shown in FIGS. 5 to 8 is formed of resin or the like. The slide sheet 5 is disposed between the heat radiating gel sheet 4 and the inner surface 13i of the left side surface 13 in direct contact with the heat radiating gel sheet 4 and the left side surface 13 (see arrow Y2 in FIGS. 7 and 5).

  The slide sheet 5 is used to insert the power supply circuit unit 3 in a state where the heat-dissipating gel sheet 4 having adhesive properties is disposed into the case body 10. For this reason, the slide sheet 5 is formed of a resin or the like, and preferably has a higher slidability with respect to the inner surface of the case body 10, particularly the inner surface 13 i of the left side surface 13, and at least the second surface 4 b of the heat dissipation gel sheet 4. It is preferable that the slidability relative to the inner surface 13i is higher.

  With the above configuration, the heat generated in the transformer 34 is transmitted to the heat radiating plate 2b through the heat radiating gel sheet 4, the slide sheet, and the case 1 (specifically, the left side surface 13). The heat transmitted to the heat radiating plate 2 b spreads in the surface direction of the heat radiating plate 2 b and is radiated to the outside of the power supply device 100.

(1-5-2. Manufacturing Method of Power Supply Device 100 Using Slide Sheet 5)
FIG. 9 is an exploded view for explaining a method of manufacturing the power supply device 100 according to the first embodiment.
First, the heat radiating gel sheet 4 is disposed on the surface 34a of the transformer 34 of the power supply circuit unit 3 (see arrow Y1 in FIG. 5). Next, the slide sheet 5 is arrange | positioned at the thermal radiation gel sheet 4 (refer arrow Y2 of FIG. 5). Here, since the heat radiating gel sheet 4 has adhesiveness, when the slide sheet 5 is pressed against the heat radiating gel sheet 4, the slide sheet 5 is in close contact with the heat radiating gel sheet 4 and is not easily separated.

Next, the power supply circuit unit 3 in a state in which the slide sheet 5 and the heat radiating gel sheet 4 are arranged is inserted into the case body 10 while being slid (see arrow E).
Next, the case main body 10 and the case front part 11 are connected by fitting the respective claw portions 11a, 11b, 11c, 11d, and 11e into the fitting holes 12a, 12b, 13a, 13b, 14a, and 15a, respectively. Is formed. The claw portion 11c will be described in detail as an example. When the case front portion 11 is attached to the case body 10 from the direction of arrow E, the inclined surface 111c comes into contact with the front end 13f and slides on each other. At the same time, the protruding portion 11g bends inward, the claw portion 11c enters the inside of the case body 10, and the claw portion 11c fits into the fitting hole 13a. The same applies to the other claws.

Then, the heat radiating plates 2 a and 2 b are bonded to the outer surface 12 s of the right side surface 12 and the outer surface 13 s of the left side surface 13 of the case body 210, respectively. As described above, the power supply device 100 of this embodiment can be manufactured.
As described above, since the heat-dissipating gel sheet 4 has adhesiveness, when the heat-dissipating gel sheet 4 is disposed without the slide sheet 5 and the power supply circuit unit 3 is inserted into the case body 10, the heat-dissipating gel sheet 4 is disposed. Is in close contact with the inner surface of the case body 10 and is difficult to slide.
Therefore, by disposing the slide sheet 5 on the second surface 4 b side of the heat radiating gel sheet 4, the heat radiating gel sheet 4 can be inserted into the case body 10 in a state where the heat radiating gel sheet 4 is disposed in the transformer 34 of the power supply circuit unit 3.

(1-6. Heat insulation part 6a, 6b)
In the power supply device 100 of the present embodiment, the heat insulating portions 6 a and 6 b that face the aluminum electrolytic capacitor 35 and the aluminum electrolytic capacitor 37 are provided. The heat insulating part on the aluminum electrolytic capacitor 37 side is referred to as a heat insulating part 6a, and the heat insulating part on the aluminum electrolytic capacitor 35 side is referred to as a heat insulating part 6b.

As described above, the heat generated by the heat generating components such as the transformer 34 is transmitted to the heat radiating plates 2a and 2b, but the heat insulating portions 6a and 6a, so that heat is not transmitted from the heat radiating plate 2b to the aluminum electrolytic capacitors 35 and 37, 6b is provided.
A space between the left side surface 13 and the heat radiating plate 2b is formed by the first recess 13c shown in FIG. 4C, and the heat insulating portion 6a is formed by air existing in the space. As shown in FIG. 6, the first recess 13 c is formed so as to cover the end surfaces 37 c of the three aluminum electrolytic capacitors 37 arranged in a line in the vertical direction when viewed from the direction perpendicular to the heat radiating plate 2 b. ing. That is, the first recess 13c is formed so as to cover the region where the aluminum electrolytic capacitor 37 is disposed.

By forming the recess 13c in this manner, the heat insulating portion 6a is formed between the heat radiating plate 2b and the left side surface 13 in the region of the heat radiating plate 2b facing the region where the aluminum electrolytic capacitor 37 is disposed. .
In addition, a space is formed between the left side surface 13 and the heat radiating plate 2b by the second recess 13d shown in FIG. 4C, and the heat insulating portion 6b is formed by the air existing in the space. As shown in FIG. 6, the second recess 13 d is formed so as to cover the side surface 35 a of the aluminum electrolytic capacitor 35 when viewed from the direction perpendicular to the heat radiating plate 2 b. That is, the second recess 13d is formed so as to cover the region where the aluminum electrolytic capacitor 35 is disposed.

By forming the second recess 13d in this manner, the heat insulating portion 6b is formed between the heat radiating plate 2b and the left side surface 13 in the region of the heat radiating plate 2b facing the region where the aluminum electrolytic capacitor 35 is disposed. It will be different.
As described above, by providing the heat insulating portions 6a and 6b in the region of the heat radiating plate 2b facing the region where the aluminum electrolytic capacitors 35 and 37 are disposed, the heat from the heat radiating plate 2b to the aluminum electrolytic capacitors 35 and 37 is transmitted. Transmission can be blocked.
Thus, the heat from the transformer 34, which is a heat generating component, is efficiently radiated to the outside of the power supply device 100 through the heat radiating plate 2b, and the heat transfer from the heat radiating plate 2b to the aluminum electrolytic capacitors 35 and 37 that are vulnerable to heat. Can be blocked.

<3. Main features>
As described above, the power supply device 100 (an example of an electronic device) according to the present embodiment includes a case 1 (an example of a housing), a transformer 34 (an example of a heat generating component), a heat sink 2b, an aluminum electrolytic capacitor 35, 37 and heat insulating portions 6a and 6b. Case 1 is formed of resin. The transformer 34 is disposed inside the case 1. The heat radiating plate 2b is disposed along the outer surface 13s (an example of the outer surface) of the case 1 and indirectly through the heat radiating gel sheet 4 (an example of the heat transfer member) and the case 1 disposed in direct contact with the transformer 34. In contact with the transformer 34, the heat conductivity is higher than that of the resin forming the case 1, and the heat generated by the transformer 4 is released to the outside. Aluminum electrolytic capacitors 35 and 37 are arranged inside case 1. The heat insulating portions 6a and 6b are provided between the heat radiating plate 2b and the case 1 so as to face the aluminum electrolytic capacitors 35 and 37, and block heat transfer from the heat radiating plate 2b to the aluminum electrolytic capacitors 35 and 37.

In this embodiment, in detail, the heat radiating plate 2 b is in contact with the transformer 34 indirectly through the heat radiating gel sheet 4, the slide sheet 5 and the case 1.
Since the case 1 is formed of resin in this way, it is not necessary to secure an insulation distance from the electronic component such as the transformer 34, so that the size can be reduced. Further, by disposing the heat radiating plate 2b along the outer surface 13s of the left side surface 13 of the case main body 10, the heat generated by the transformer 34 spreads in the surface direction of the heat radiating plate 2b and goes from the entire heat radiating plate 2b to the outside. Since it is released, good heat dissipation can be obtained. On the other hand, since the heat insulating portions 6a and 6b are provided, the heat transmitted along the heat radiating plate 2b can be blocked from being transmitted to the aluminum electrolytic capacitors 35 and 37 as much as possible. It is possible to suppress the lifespans of 35 and 37 from being shortened, and it is possible to realize the lifespan of the power supply apparatus 100 that is equal to or longer than that of the conventional one. As described above, heat generated by the transformer 34 can be released to the outside, and heat transfer to the aluminum electrolytic capacitors 35 and 37 can be blocked as much as possible.
Therefore, it is possible to provide a power supply device that can be downsized and has good heat dissipation and can ensure an appropriate life.

<4. Other embodiments>
In the following description of other embodiments, the same components as those in the above embodiment will be described with the same reference numerals.

(A)
Lattice-like ribs 13cb and 13db may be formed in the first recess 13c and the second recess 13d forming the heat insulating portions 6a and 6b described in the above embodiment.
FIG. 10 is a diagram showing a state in which lattice-like ribs 13cb and 13db are formed in the first recess 13c and the second recess 13d. It can be said that the first recess 13c and the second recess 13d shown in FIG. 10 are formed of a plurality of recesses 13ca and 13da separated by ribs 13cb and 13db.
The thickness of the case 1 is reduced by forming the recesses 13c and 13d in the case 1, but the strength can be ensured by forming the recesses 13c and 13d so as to leave the ribs 13cb and 13db.

(B)
Moreover, in the said embodiment, although the heat insulation effect is exhibited with the air provided in the 1st recessed part 13c and the 2nd recessed part 13d, the heat insulating material which contains air in part like glass wool, airgel, etc. is the recessed part 13c. , 13d may be disposed to form a heat insulating part.

(C)
Moreover, in the said embodiment, as shown in FIG.7 and FIG.8, although the inner surface 13i of the left side 13 is formed in the plane, it is not restricted to this. For example, when the case 1 is formed of polycarbonate, a thickness of about 0.5 mm is required to ensure the strength, but the required thickness cannot be ensured by forming the first recess 13c and the second recess 13d. As shown in FIG. 11, the case 1 may protrude inward. That is, in FIG. 11, in order to ensure the thickness of the left side surface 13 of the case 1, the portion of the left side surface 13 that forms the second recess 13 d protrudes inward. This protruding portion is illustrated as 13de.
Thereby, the thickness required for the strength of the case 1 can be ensured. Similarly to the second recess 13d, a portion of the left side surface 13 that forms the first recess 13c may protrude inward.

(D)
In the above embodiment, the transformer 34, which is an example of the heat generating component, indirectly contacts the heat radiating plate 2b via the heat radiating gel sheet 4, the slide sheet 5, and the case 1, and the heat from the transformer 34 is transferred to the heat radiating plate 2b. Although it was transmitted, it is not limited to such a configuration. In short, a configuration in which a heat generating component comes into contact with a heat sink regardless of direct or indirect, and heat from the heat generating component is transferred to the heat sink. If it is. The heat generating component can also be said to be an electronic component that applies heat to the heat sink 2b when the power supply device is in a steady state.

Hereinafter, various configurations of indirect or direct contact between the heat generating component and the heat radiating plate 2b will be described as modified examples of the present embodiment.
(D1)
In the above embodiment, the heat radiating gel sheet 4 disposed in direct contact with the transformer 34 is in indirect contact with the heat radiating plate 2b via the slide sheet 5 and the case 1, but for example, the slide sheet 5 May not be provided. This configuration corresponds to an example in which the heat generating component is in contact with the heat sink indirectly through the heat transfer member and the housing.

  FIG. 12A is a perspective view of the power supply device 200 having such a configuration, and FIG. 12B is a perspective view showing the internal configuration of the case main body 210 of FIG. . FIG. 13A is a front cross-sectional view of the power supply device 200 shown in FIG. 12A, which is a cross-sectional view parallel to the front surface 110 and passing through the transformer 34 and the electrolytic capacitor 35. FIG.13 (b) is the G section enlarged view of Fig.13 (a). FIG. 14 is an exploded view of the power supply apparatus 200.

  As shown in FIG. 13B, in the power supply device 200, the first surface 4 a of the heat radiating gel sheet 4 directly contacts the surface 34 a of the transformer 34, and the second surface 4 b of the heat radiating gel sheet 4 is within the left side surface 13. It is in direct contact with the surface 13i. In the power supply device 200, heat generated by the transformer 34 is transmitted to the heat radiating plate 2b via the heat radiating gel sheet 4 and the left side surface 13, and spreads in the surface direction by the heat radiating plate 2b and is released to the outside.

  Here, since the heat dissipation gel sheet 4 has adhesiveness, if the power supply circuit unit 3 is slid and inserted as described with reference to FIG. Sticks to the inner surface 13i of the left side surface 13 and is difficult to insert. Therefore, in the power supply apparatus 200, the case main body 210 of the case 201 is formed by joining two members 210a and 210b. One member 210 a includes the right side surface 12. The other member 210 b includes the left side surface 13. In other words, it can be said that the case main body 210 shown in FIG. 12A is obtained by dividing the case main body 10 of the first embodiment (see FIG. 4) into two parts.

  The case body 210 is cut along a plane parallel to the left side surface 13 and the right side surface 12. As shown in FIG. 14, this plane is a plane that passes between the vent hole 141b on the left side surface 13 side and the plurality of hexagonal vent holes 141a. A joined portion S obtained by joining the cut surfaces is shown in FIGS. 12 (a) and 13 (a). As shown in FIG. 12, the power supply device 200 is the same as the power supply device shown in FIG. 1 except for the joint portion S in a state where the heat radiation plates 2 a and 2 b are attached to the case 201.

As shown in FIG. 14, after the power supply circuit unit 3 is housed in the second member 210b with the heat dissipating gel sheet 4 disposed on the transformer 34, the second member 210b is joined to the first member 210a with an adhesive or the like. By doing so, the power supply circuit unit 3 can be accommodated in the case body 210 with the heat-dissipating gel sheet 4 attached.
The joining of the first member 210a and the second member 210b is not limited to the adhesive, and may be performed with a screw or the like, or may be configured to fit each other.

  Further, as described above, in the power supply apparatus 200, the case main body 210 is divided into two members (first member 210a and second member 210b) in order to store the power supply circuit unit 3 in the case main body 210. A box-shaped case main body 10 like the power supply device 100 may be used. However, in this case, it becomes difficult to insert the power supply circuit unit 3 into the case body 10 due to the adhesiveness of the heat-dissipating gel sheet 4, so that it takes a little time for manufacturing. Moreover, when using the box-shaped case main body 10 in this way, it is preferable to use a heat-dissipating gel sheet 4 having a weak adhesiveness.

(D2)
In the above embodiment, the heat radiating gel sheet 4 arranged in direct contact with the transformer 34 is in indirect contact with the heat radiating plate 2b via the slide sheet 5 and the case 1, but directly with the heat radiating plate 2b. It may be in contact. This configuration corresponds to an example in which the heat generating component is in contact with the heat sink indirectly through the heat transfer member.

  FIG. 15 is a perspective view of the power supply apparatus 300 having such a configuration. The power supply device 300 of FIG. 15 is different from the power supply device 100 in that the slide sheet 5 is not provided and that an opening 13e is formed in the left side surface 313 of the case 301. FIG. 16A is a front sectional view of the power supply device 300 shown in FIG. 15, which is a cut surface parallel to the front surface 110 and passing through the transformer 34 and the electrolytic capacitor 35. FIG.16 (b) is the F section enlarged view of Fig.16 (a). FIG. 17 is an exploded view of the power supply device 300.

  As shown in FIGS. 15 to 17, in the case 301 of the power supply apparatus 300, an opening 13 e is formed on the left side surface 313 of the case main body 310 so as to face the transformer 34. The opening 13 e penetrates the outside and the inside of the left side surface 13. As shown in FIG. 16 (b), in the power supply device 300, the first surface 4a of the heat radiating gel sheet 4 is in direct contact with the surface 34a of the transformer 34, and the heat radiating gel sheet 4 has its second through the opening 13e. The surface 4b is in direct contact with the heat sink 2b. With such a configuration, heat generated by the transformer 34 is transmitted from the heat radiating gel sheet 4 to the heat radiating plate 2b, spreads in the surface direction by the heat radiating plate 2b, and is released to the outside.

  When assembling the power supply device 300, the power supply circuit unit 3 is first inserted into the main body case 310 without disposing the heat dissipating gel sheet 4. Thereafter, the heat-dissipating gel sheet 4 is disposed on the transformer 34 through the opening 13e (see arrow T in FIG. 17). Thereafter, the case front portion 11 is attached to the case main body 310, and the heat radiating plates 2a and 2b are attached to the right side surface 12 and the left side surface 313 with a double-sided tape.

(D3)
In the above (D2), a heat dissipation gel sheet 4 as an example of a heat transfer member is disposed in direct contact with a transformer 34 as an example of a heat generating component, and the heat dissipation gel sheet 4 is in direct contact with the heat dissipation plate 2b. As described above, the heat generating component is not limited to the transformer 34, and the heat transfer member is not limited to the heat radiating gel sheet 4.

For example, the heat sink 33b (an example of a heat transfer member) for radiating heat from the rectifier diode 30 (an example of a heat generating component) may be in direct contact with the heat radiating plate 2b. This configuration corresponds to an example in which the heat generating component is in contact with the heat sink indirectly through the heat transfer member.
FIG. 18 is a perspective view of the power supply apparatus 400 having such a configuration. FIG. 19 is a left side view showing the internal configuration of the power supply apparatus 400 of FIG. 20A is a cross-sectional view taken along the CC line in FIG. 19, and FIG. 20B is a cross-sectional view taken along the DD line in FIG.

  The power supply device 400 of FIG. 18 differs from the power supply device 200 shown in FIG. 12A in that an opening 13f for the heat sink 33b to directly contact the heat radiating plate 2b is formed in the left side surface 413. . As shown in FIG. 19, FIG. 20 (a), and FIG. 20 (b), the heat sink 33b has a shape obtained by bending a plate-like member into an L shape. As shown, the first portion 33ba disposed along the direction perpendicular to the first substrate 31a and the tip of the first portion 33ba (the end on the left side 413 side) along the direction parallel to the first substrate 31a. The second portion 33bc is formed. The second portion 33bc is in direct contact with the heat sink 2b.

  In this power supply device 400, since the heat sink 33b needs to be inserted into the opening 13f, the case main body 410 of the case 401 is connected to the first member 410a like the power supply device 200 shown in FIGS. The second member 210b is joined. The first member 410a has the same configuration as the first member 210a of FIGS. 12 to 14 except for the opening 13f.

When the heat sink 33b is in direct contact with the heat radiating plate 2b as described above, it is necessary that the heat sink 33b and the rectifier diode 30 be insulated or the rectifier diode 0 itself be insulated.
In the power supply device 400, the heat sink 33b is in direct contact with the heat radiating plate 2b. However, the heat radiating gel sheet 4 may be disposed between the heat sink 33b and the heat radiating plate 2b in direct contact with each other. .

Moreover, the opening part 13f is not formed in the left side surface 413, and the heat sink 33b may contact the heat sink 2b indirectly through the heat dissipation gel sheet 4 and the left side surface 413.
Furthermore, the heat sink 33b may be in direct contact with the left side surface 413 without the heat dissipation gel sheet 4 interposed therebetween.
In addition, the heat sink 33a may be used as an example of a heat transfer member similarly to the heat sink 33b and may be in direct contact with the heat radiating plate 2b directly or through a case.
When the electronic component itself is insulated as described above, an opening may be formed in the case so that the electronic component is brought into direct contact with the heat sink 2b. Such a configuration corresponds to an example in which the heat generating component is in direct contact with the heat sink.

(E)
In the above embodiment, the slide sheet 5 is described as being formed of resin. However, the slide sheet 5 may be formed of glass, paper, or other materials. It is not limited to resin. It is preferable that it is solid and has a strength that does not break even when housed in the housing while being in contact with the inner surface of the housing.

(F)
In the above embodiment, for example, as shown in FIGS. 6 and 9, the slide sheet 5 having a size that covers at least the heat radiating gel sheet 4 is used. A slide sheet that also covers the surface may be used. FIG. 21A is a perspective view showing such a slide sheet 700. FIG. 21B is a perspective view schematically showing the power supply circuit unit 3. FIG. 21C is a diagram illustrating a state where the power supply circuit unit 3 is covered with the slide sheet 700.

  A slide sheet 700 shown in FIG. 21A has a front surface portion 701, a right side surface portion 702, a left side surface portion 703, and a back surface portion 704. The right side surface portion 702 is formed so as to cover the entire side of the power supply circuit unit 3 that is disposed on the right side surface 12. The other front surface portion 701, left side surface portion 703, and back surface portion 704 cover a part of the power circuit unit 3 on the front surface 110 side, the left side surface 13 side, and the back surface 16 side. Further, as shown in FIG. 21A, an insertion claw 704a formed toward the front surface 701 side is formed on the back surface portion 704 of the slide sheet 700, and the heat sink 33a shown in FIG. It inserts in insertion hole 33a1 'formed in'. By inserting the insertion claw 704a into the insertion hole 33a1 ′ in this way, it becomes easy to maintain the state where the power supply circuit unit 3 is covered with the slide sheet 700. The power supply circuit unit 3 is inserted into the case main body 10 shown in FIG. 8 while being covered with the slide sheet 700 as described above. Note that the shape is not limited to the shape as shown in FIG. 21A, and for example, the entire left side 13 side of the power supply circuit unit 3 may be covered.

(G)
In the above embodiment and the above (D3), the transformer 34 and the rectifier diode 30 are exemplified as an example of the heat generating component. However, the present invention is not limited thereto, and may be, for example, the coil 38 or the like.
(H)
In the said embodiment, although the heat sink 2a, 2b was formed with aluminum, another metal may be sufficient and it does not need to be restricted to a metal. In short, it is only necessary to use a heat radiating plate having a higher thermal conductivity than the resin forming the cases 1, 201, 301, 401 (particularly the case main bodies 10, 210, 310, 410).

(I)
In the said embodiment, although the heat sink 2a, 2b was attached to the right side surface 12 and the left side surface 13 by adhesion | attachment, you may be attached by fitting or fastening.
(J)
In the said embodiment, although the heat sink 2a was arrange | positioned also at the right side surface 13, it does not need to be arrange | positioned.

(K)
Although the power supply device as an example of the electronic device has been described in the above embodiment, the power supply device is not limited to the power supply device, and the above-described structure can be applied to an electronic device having a heat generating component.

  The electronic device of the present invention is effective as a power supply device, particularly a switching power supply device and the like because it has the effect of reducing the size and ensuring good heat dissipation and an appropriate life.

1 Case (example of housing)
2, 2a, 2b Heat dissipation plate (an example of heat dissipation member)
3 Power supply circuit unit 4 Heat dissipation gel sheet (an example of heat transfer member)
4a 1st surface 4b 2nd surface 5 Slide sheet (an example of a sheet-like member)
6, 6a, 6b Heat insulation part 9 Support rail 9a Upper end part 9b Lower end part 10 Case body 11 Case front part 11a, 11b, 11c, 11d, 11e, 11f Claw part 11g, 11i Protruding part 11j Edge on right side 11k Left side surface Side edge 11m top surface side edge 11n bottom surface side edge 11o, 11p, 11q, 11r through hole 12 right side surface 12a, 12b fitting hole 12f front end 12s outer surface 13 left side surface 13a, 13b fitting hole 13c first recess 13ca Recessed portion 13cb Rib 13d Second recessed portion 13da Recessed portion 13db Rib 13e Opening portion 13f Opening portion 13f Front end 13s Outer surface (an example of outer surface)
13i inner surface 14 upper surface 14a fitting hole 14c right end 14d left end 14e rear end 14f front end 14m support portion 15 bottom surface 15a fitting hole 15c right end 15d left end 15e rear end 15f front end 15m support portion 16 back surface 16b substantially upper surface 16b Surface 16c Lower end surface 16d Locking portion 16e Recessed portion 16f Locking portion 16g Inclined surface 17 Opening 21, 22 Notch 30 Rectifier diode 31a First substrate 31b Second substrate 32 Switching element 33a, 33b Heat sink (an example of heat transfer member) )
33ba 1st part 33bc 2nd part 33as, 33bs Surface 34 Transformer (an example of heat-generating component)
34a Surface 35 Aluminum electrolytic capacitor 35a Side surface 35b, 35c End surface 36 Bridge diode 36a Surface 37 Aluminum electrolytic capacitor 37a Side surface 37b, 37c End surface 38 Coil 39a First wiring connection portion 39b Second wiring connection portion 100 Power supply device 110 Front surface 111c, 111e Inclined surface 112 Right surface 113 Left surface 114 Upper surface 115 Lower surface 141, 141a, 141b Vent hole 151, 151a, 151b Vent hole 160 Mounting portion 200 Power supply device 201 Case 210 Case body 210a First member 210b Second member 300 Power supply device 301 Case 310 Case body 313 Left side 390 Screw 391 Wiring insertion part 400 Power supply device 401 Case 410 Case body 410a First member 413 Left side

Claims (8)

A housing made of resin;
A heat generating component disposed inside the housing;
A plate-like heat dissipating member that is disposed along the outer surface of the casing and has a higher thermal conductivity than the resin forming the casing, and releases heat generated by the heat-generating component to the outside;
An aluminum electrolytic capacitor disposed inside the housing;
A heat insulating portion provided between the heat radiating member and the housing and facing the aluminum electrolytic capacitor, and blocking heat transfer from the heat radiating member to the aluminum electrolytic capacitor;
With
The heat generating component is
Indirectly contacting the heat dissipation member via the housing,
In the case where a heat transfer member disposed in direct contact with the heat generating component is provided, the heat dissipation member is contacted indirectly via the heat transfer member,
In the case where a heat transfer member disposed in direct contact with the heat generating component is provided, the heat transfer member and the housing indirectly contact with the heat dissipation member,
Or directly in contact with the heat dissipation member,
Electronics. The heat insulating portion is provided in a recess formed on the surface of the housing on the heat radiating member side,
The electronic device according to claim 1. The heat insulating portion is formed by air in the concave portion,
The electronic device according to claim 2. The heat generating component is a transformer.
The electronic device according to claim 1. The heat transfer member is a heat dissipation gel sheet,
Higher thermal conductivity than the heat insulating part,
The electronic device according to claim 1. The heat transfer member is a heat sink,
The electronic device according to claim 1. When the heat generating component is in contact with the heat radiating member indirectly through the heat transfer member disposed in direct contact with the heat generating component and the housing,
The heat transfer member is disposed between the heat generating component and the housing, and is in direct contact with the housing.
The electronic device according to claim 1. When the heat generating component is in contact with the heat radiating member indirectly through a heat transfer member disposed in direct contact with the heat generating component,
A through hole is formed in the housing,
The heat transfer member is disposed between the heat generating component and the heat dissipation member, and is in direct contact with the heat dissipation member via the through hole.
The electronic device according to claim 1.

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