JP5977042B2 - Coating device, substrate holding device, and substrate holding method - Google Patents

Description

  The present invention relates to substrates for electronic paper, glass substrates for organic EL display devices, glass substrates for liquid crystal display devices, panel substrates for solar cells, glass substrates for PDP, glass substrates for photomasks, substrates for optical disks, etc. The present invention relates to a coating apparatus for coating a coating liquid, and a substrate holding apparatus and a substrate holding method that can be suitably applied to the coating apparatus.

  A coating apparatus for coating a substrate with a coating liquid is relatively in a horizontal direction with respect to a stage on which the substrate is placed and a surface of the substrate placed on the stage. And a slit nozzle that applies the coating liquid to the surface of the substrate by moving. When applying the coating liquid, the flatness of the surface of the substrate greatly affects the coating accuracy. Therefore, a stone surface plate with a flatness of about several micrometers is used as the stage, and the substrate is placed on this stage. It is trying to hold it by adsorption.

  However, when the size of the substrate is increased or the thickness of the substrate is thick, warpage is likely to occur in the vicinity of the peripheral portion of the substrate. Further, even in a substrate such as an electronic paper substrate, warpage often occurs in the vicinity of the peripheral edge of the substrate. When such a warp occurs in the substrate, it becomes impossible to suck and hold the entire region of the substrate on the stage. For this reason, conventionally, the vicinity of the peripheral edge of the substrate is pressed against the stage using a pressing member (see Patent Document 1, Patent Document 2, and Patent Document 3).

JP 2011-47984 A JP 2003-340787 A JP 2004-235386 A

  For example, an electronic paper substrate has a configuration in which a support layer, an adhesive layer, and an electronic paper film are laminated in this order. The size of the electronic paper film is slightly smaller than the size of the support layer, and the edge of the electronic paper film is disposed about 10 mm inside the edge of the support layer. In this electronic paper substrate, in order to improve the accuracy of the product, contact with the electronic paper film is forbidden. When the electronic paper substrate is transported, the periphery of the support layer is on the electronic paper film side. Contact is allowed only to the part. In addition to the electronic paper substrate, the substrate generally has a central portion as a non-contactable region and a peripheral portion as a contactable region.

  For this reason, when the vicinity of the periphery of the substrate is pressed against the stage as in the prior art, the pressing member may come into contact with the non-contactable area of the substrate. In such a case, the substrate cannot be used as a product. Further, as described in Patent Document 3, when the stress is applied from the edge side of the substrate to press the vicinity of the peripheral portion of the substrate against the stage, the substrate may be loaded and the substrate may be damaged. is there.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a coating apparatus, a substrate holding apparatus, and a substrate holding method capable of suitably holding a substrate on a stage.

According to the first aspect of the present invention, there is provided a stage on which a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region is placed, and in a state close to the surface of the substrate placed on the stage A slit nozzle that applies a coating liquid to the surface of the substrate by moving in a horizontal direction relative to the substrate, and a peripheral portion of the substrate placed on the stage A substrate holding mechanism that presses the substrate toward the stage, the substrate holding mechanism including an abutting member that positions the substrate by abutting against an edge of the substrate placed on the stage, and the contact on the surface of the substrate. A pressing member that presses a region separated from the contact position between the contact member and the edge of the substrate toward the center of the substrate by a predetermined distance toward the stage, and supports the contact member and the pressing member. The first branch A holding portion, a second support portion slidably provided with respect to the first support portion, a spring disposed between the first support portion and the second support portion, and the contact A contact position where the member contacts the edge of the substrate placed on the stage and the pressing member faces a peripheral edge of the substrate placed on the stage; the contact member and the pressing member; A horizontal movement mechanism that moves the first support part and the second support part between a retreat position that retreats from an edge of the substrate placed on the stage, and the pressing member is placed on the stage. The first support portion and the second support portion between a pressing position that presses the peripheral portion of the substrate and a separation position where the pressing member separates from the peripheral portion of the substrate placed on the stage. An elevating mechanism for moving, and the contact member is in the contact position The arrangement state in, characterized in that lowering the first support and the second support portion by the elevating mechanism to the pressing position from the separation position.

According to a second aspect of the present invention, there is provided a stage on which a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region is placed, and in a state close to the surface of the substrate placed on the stage A slit nozzle that applies a coating liquid to the surface of the substrate by moving relative to the substrate in a horizontal direction,
A substrate holding mechanism that presses the peripheral edge of the substrate placed on the stage toward the stage, and the substrate holding mechanism positions the substrate by contacting the edge of the substrate placed on the stage. And a pressing member that presses, toward the stage, a region separated by a predetermined distance from the contact position between the contact member and the edge of the substrate on the surface of the substrate toward the center of the substrate. A first support portion that supports the contact member and the pressing member, a second support portion that is slidable with respect to the first support portion, and the contact member mounted on the stage. Abutting position where the pressing member is in contact with an edge of the placed substrate and the pressing member is opposed to a peripheral edge of the substrate placed on the stage; and the contacting member and the pressing member are placed on the stage Retract from the edge of the printed board A horizontal movement mechanism for moving the first support portion and the second support portion between the retraction position, a pressing position where the pressing member presses the peripheral edge portion of the substrate placed on the stage, and the pressing An elevating mechanism that moves the first support portion and the second support portion between a position where the member is separated from the peripheral edge portion of the substrate placed on the stage, and the elevating mechanism causes the pressing member to be An abutting member moving mechanism for moving the abutting member in a direction away from an edge of the substrate placed on the stage with respect to the pressing member after moving from the separation position to the pressing position; The abutting member moving mechanism includes a pair of wedge-shaped members disposed in a state in which inclined surfaces facing each other are in contact with each other, and one of the pair of wedge-shaped members is coupled to the first support portion. With The other serial pair of wedge-shaped member is characterized in that it is connected to the second support member.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the substrate holding mechanism is provided in a plurality of recesses formed in the stage around the substrate placed on the stage. , Respectively.

According to a fourth aspect of the present invention, in the coating apparatus according to any one of the first to third aspects, the hole formed in the stage and the abutting member abut against the edge of the substrate. Later, before the pressing member presses the peripheral edge of the substrate , an exhaust unit that exhausts air from the hole, and a hole facing the vicinity of the center of the substrate among the holes formed in the stage A first pressure gauge that measures the degree of vacuum of the part, and a second pressure gauge that measures the degree of vacuum of the hole facing the vicinity of the edge of the substrate among the holes formed in the stage. When the second pressure gauge detects that the degree of vacuum of the hole formed in the vicinity of the edge of the substrate does not reach a certain value, the lifting mechanism moves the pressing member from the separation position. Move to the pressing position.

According to a fifth aspect of the invention, in the invention according to any one of the first to fourth aspects, the substrate is for electronic paper in which a support layer, an adhesive layer, and an electronic paper film are laminated in this order. It is a substrate.

The invention according to claim 6 is a substrate holding device that presses a peripheral portion of a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region toward the stage, and is placed on the stage. A contact member that positions the substrate by contacting the edge of the substrate and a contact position between the contact member and the edge of the substrate on the surface of the substrate by a predetermined distance toward the center of the substrate. A pressing member that presses the region toward the stage, a support portion that supports the contact member and the pressing member, and the support portion. The support member is disposed on the stage on which the contact member is placed on the stage. A horizontal movement mechanism that moves between a contact position that contacts the edge and a retreat position that retreats from an edge of the substrate placed on the stage, and the support portion, the pressing member is mounted on the stage. Press to press the surface of the placed substrate Position, a lifting mechanism for moving between a distant position away from the surface of the substrate placed on the stage, and the hole formed in the stage, the edge of the abutment member is the substrate those After the contact, before the pressing member presses the peripheral edge of the substrate, the exhaust means for exhausting air from the hole and the hole formed in the stage face the vicinity of the center of the substrate. A first pressure gauge for measuring the degree of vacuum of the hole to be measured, and a second pressure gauge for measuring the degree of vacuum of the hole facing the vicinity of the edge of the substrate among the holes formed in the stage. And when the second pressure gauge detects that the degree of vacuum of the hole facing the vicinity of the edge of the substrate has not reached a certain value, the lifting mechanism moves the pressing member from the separation position. It moves to a press position, It is characterized by the above-mentioned.

The invention according to claim 7 is a substrate holding method for sucking and holding on a stage a substrate having a central portion as an inaccessible region and a peripheral portion as a contactable region, wherein the substrate is placed on the stage. A placement step; a gas ejection step for ejecting gas from a hole formed in the stage; and an abutting member abutting against an edge of the substrate placed on the stage to position the substrate Positioning step, evacuation step of exhausting from the hole formed in the stage , out of the holes formed in the stage, the degree of vacuum of the hole facing the vicinity of the center of the substrate, and the substrate if the vacuum degree measuring step of measuring the edge near the degree of vacuum holes facing each degree of vacuum holes which faces the vicinity of the periphery of the substrate does not reach a constant value, the surface of the substrate Between the contact member and the substrate Characterized by comprising a region spaced by a predetermined distance in the central portion of the substrate from the contact position with the edge by the pressing member and a pressing step of pressing toward the stage.

According to the first aspect of the present invention, only the contactable area of the substrate is pressed by the pressing member without contacting the noncontactable area of the substrate, so that the entire area of the substrate is in contact with the stage. It is possible to hold it. Further, it is possible to perform positioning and pressing of the substrate by simultaneously moving the contact member and the pressing member by the horizontal movement mechanism and the lifting mechanism. Further, the pressing force of the substrate by the pressing member can be maintained at a predetermined size by the action of the spring disposed between the first support portion and the second support portion.

According to the invention described in claim 2, by pressing only the contactable area of the substrate by the pressing member without contacting the non-contactable area of the substrate, the substrate is placed on the stage in a state where the entire area is in contact with the stage. It is possible to hold it. Further, it is possible to perform positioning and pressing of the substrate by simultaneously moving the contact member and the pressing member by the horizontal movement mechanism and the lifting mechanism. Further, the contact member moving mechanism having a pair of wedge-shaped members can prevent the contact member and the edge of the substrate from sliding.

According to the third aspect of the present invention, the substrate can be held on the stage without affecting the coating liquid coating operation.

According to the invention described in claim 4 , it becomes possible to suck and hold the positioned substrate on the stage. At this time, since the substrate is pressed by the pressing member only when the edge of the substrate is not sucked and held by the stage due to the warp of the substrate, the sucking and holding work of the substrate can be performed efficiently.

According to the fifth aspect of the present invention, the electronic paper substrate that is likely to be warped can be suitably held on the stage.

According to the invention described in claim 6, by pressing only the contactable area of the substrate by the pressing member without contacting the non-contactable area of the substrate, the substrate is placed on the stage in a state where the entire area is in contact with the stage. It is possible to hold it. At this time, since the substrate is pressed by the pressing member only when the edge of the substrate is not sucked and held by the stage due to the warp of the substrate, the sucking and holding work of the substrate can be performed efficiently.

According to the seventh aspect of the invention, the substrate can be sucked and held on the stage after the substrate is easily moved and positioned by the action of the gas ejected from the hole. Then, only the contactable area of the substrate is pressed by the pressing member without contacting the noncontactable area of the substrate, and the edge of the substrate can be sucked and held on the stage. At this time, since the substrate is pressed by the pressing member only when the edge of the substrate is not sucked and held by the stage due to the warp of the substrate, the sucking and holding work of the substrate can be performed efficiently.

It is a perspective view of the coating device concerning this invention. It is a side surface schematic diagram of the coating device concerning this invention. 3 is a schematic diagram showing the relationship between holes 98 and 99 and suction grooves 91 and 92 formed on the surface of the stage 11. FIG. It is a schematic diagram showing exhaust to the holes 98 and 99 and a gas supply system. It is a side view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding | maintenance mechanism 40 which concerns on 1st Embodiment of this invention. It is a side view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding | maintenance mechanism 40 which concerns on 1st Embodiment of this invention. It is a side view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding mechanism 40 which concerns on 1st Embodiment of this invention. It is a side view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding | maintenance mechanism 40 which concerns on 1st Embodiment of this invention. It is a side view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding | maintenance mechanism 40 which concerns on 1st Embodiment of this invention. It is a side view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding | maintenance mechanism 40 which concerns on 1st Embodiment of this invention. It is a front view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding mechanism 60 which concerns on 2nd Embodiment of this invention. It is a front view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding mechanism 60 which concerns on 2nd Embodiment of this invention. It is a front view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding mechanism 60 which concerns on 2nd Embodiment of this invention. It is a front view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding mechanism 60 which concerns on 2nd Embodiment of this invention. It is a front view which shows the operation | movement which hold | maintains the board | substrate 100 for electronic paper by the board | substrate holding mechanism 60 which concerns on 2nd Embodiment of this invention. 3 is a schematic plan view of a substrate holding mechanism 60. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a coating apparatus according to the present invention. FIG. 2 is a schematic side view of the coating apparatus according to the present invention. In FIG. 1, a nozzle cleaning mechanism 31 and a pre-dispensing mechanism 34, which will be described later, are not shown. In FIG. 2, the carriage 14 and the like which will be described later are not shown.

  As will be described later, this coating apparatus is for applying a coating solution to an electronic paper substrate 100 in which an electronic paper film and a support layer are bonded by an adhesive layer. That is, the electronic paper substrate 100 to which the coating solution is applied by this coating apparatus has a configuration in which a support layer, an adhesive layer, and an electronic paper film are laminated in this order. Such an electronic paper substrate 100 has a characteristic that warpage is likely to occur.

  This coating apparatus includes a stage 11 for holding the electronic paper substrate 100 by suction. As this stage 11, a stone surface plate or the like whose flatness of the upper surface is about several micrometers is used. A suction groove, which will be described later, is formed on the surface of the stage 11. Further, as will be described later, the stage 11 is formed with eight recesses 12 for accommodating the substrate holding mechanisms 40 and 60 according to the present invention. The electronic paper substrate 100 sucked and held on the stage 11 is pressed toward the stage 11 by the substrate holding mechanisms 40 and 60. The stage 11 is provided with a plurality of lift pins (not shown) at appropriate intervals. The lift pins support the electronic paper substrate 100 from below and lift it above the surface of the stage 11 when the electronic paper substrate 100 is carried in and out.

  Above the stage 11, a carriage 14 is provided that extends substantially horizontally from both sides of the stage 11. The carriage 14 includes a nozzle support portion 15 for supporting the slit nozzle 13 and a pair of left and right lifting mechanisms 16 for supporting both ends of the nozzle support portion 15. In addition, a pair of running rails 17 extending in parallel to the substantially horizontal direction are disposed at both ends of the stage 11. These running rails 17 reciprocate the carriage 14 in the X direction shown in FIG. 1 by guiding both ends of the carriage 14.

  A pair of linear motors 20 each provided with a stator 21 and a moving element 22 are disposed along both side edges of the stage 11 at both side portions of the stage 11 and the carriage 14. A pair of linear encoders 23 each having a scale portion and a detector are fixed to both sides of the stage 11 and the carriage 14. The linear encoder 23 detects the position of the carriage 14.

  Further, as shown in FIG. 2, a nozzle cleaning mechanism 31 is disposed on the side of the stage 11. The nozzle cleaning mechanism 31 includes a cleaning block 32 and a standby pod 33. In this coating apparatus, the slit nozzle 13 is cleaned by the nozzle cleaning mechanism 31 before or after the coating operation is performed.

  Further, as shown in FIG. 2, a pre-dispensing mechanism 34 is disposed on the side of the stage 11. The pre-dispensing mechanism 34 includes a pre-dispensing roller 36 in which a part thereof is immersed in the cleaning liquid stored in the storage tank 35 and a doctor blade 37. The pre-dispensing roller 36 and the doctor blade 37 have a length equal to or longer than that of the slit nozzle 13 in the Y direction. The pre-dispensing roller 36 is rotated by driving a motor (not shown). In this coating apparatus, before performing the coating operation, a small amount of coating liquid is discharged from the slit nozzle 13 moved above the pre-dispensing roller 36, so that the coating liquid containing the cleaning liquid at the time of cleaning by the nozzle cleaning mechanism 31. Is removed from the slit nozzle 13.

  FIG. 3 is a schematic diagram showing the relationship between the holes 98 and 99 and the suction grooves 91 and 92 formed on the surface of the stage 11. FIG. 4 is a schematic view showing an exhaust and gas supply system to the holes 98 and 99.

  As shown in FIG. 3, a hole 99 is formed in the stage 11 at a position facing the vicinity of the center of the electronic paper substrate 100. In addition, suction grooves 92 communicating with the hole 99 are formed in a number of rectangular shapes at positions facing the vicinity of the central portion of the electronic paper substrate 100 on the stage 11. On the other hand, a hole 98 is formed in the stage 11 at a position facing the vicinity of the periphery of the electronic paper substrate 100. Further, suction grooves 91 communicating with the holes 98 are formed in a plurality of rectangular shapes so as to surround the suction grooves 92 at positions facing the vicinity of the periphery of the electronic paper substrate 100 on the stage 11. ing.

  Each hole 99 communicates with the chamber 94 shown in FIG. As shown in FIG. 4, the chamber 94 is connected to a nitrogen gas supply source (not shown) via a switching valve 96a. The chamber 94 is connected to an exhaust means such as a vacuum pump (not shown) via a switching valve 96a and an on-off valve 97a. A pressure gauge 95a is disposed between the chamber 94 and the switching valve 96a. On the other hand, each hole 98 communicates with the chamber 93. The chamber 93 is connected to a nitrogen gas supply source (not shown) via a switching valve 96b. The chamber 93 is connected to an exhaust means such as a vacuum pump (not shown) via a switching valve 96b and an on-off valve 97b. A pressure gauge 95b is disposed between the chamber 93 and the switching valve 96b.

  Note that the chamber 93 communicating with the hole 98 formed at a position facing the vicinity of the periphery of the electronic paper substrate 100 may be a single one having a shape surrounding the chamber 94, and is divided into a plurality of parts. It may be what was done. FIG. 4 shows a case where the chamber 93 is divided into two parts.

In this coating apparatus, when positioning the electronic paper substrate 100 described later, nitrogen gas is supplied into the chambers 93 and 94 by switching the switching valves 96a and 96b, and the nitrogen gas is ejected from the holes 98 and 99. . As a result, the electronic paper substrate 100 can be easily moved in the horizontal direction on the stage 11. On the other hand, when the electronic paper substrate 100 is suction-held on the stage 11, by switching the switching valves 96a and 96b and opening the on-off valves 97a and 97b, the holes 98 and 99 and the suction grooves 91 communicating with the holes 98 and 99, Exhaust is performed from 92.

  In this case, as will be described later, the opening / closing valve 97a is first opened and the central portion of the electronic paper substrate 100 is sucked and held on the stage 11, and then the opening / closing valve 97b is opened to surround the electronic paper substrate 100. The part is sucked and held on the stage 11. The degree of vacuum of the chambers 93 and 94 at this time, that is, the degree of vacuum in the region between the electronic paper substrate 100 and the stage 11 is measured by pressure gauges 95a and 95b.

  When the coating operation is performed by the coating apparatus having the above-described configuration, the electronic paper substrate 100 is sucked and held on the stage 11. In this case, the peripheral portion of the electronic paper substrate 100 is pressed toward the stage 11 by the substrate holding mechanisms 40 and 60 disposed in the eight recesses 12 as necessary. The slit nozzle 13 is moved along the surface of the electronic paper substrate 100 by driving the linear motor 20 in a state where the slit nozzle 13 is brought close to the surface of the electronic paper substrate 100 adsorbed and held on the stage 11. At the same time, the coating liquid is supplied to the surface of the electronic paper substrate 100. Thereby, a thin film of the coating liquid is formed on the surface of the electronic paper substrate 100.

  Next, the structure of the substrate holding mechanism which is a characteristic part of the present invention will be described. 5 to 10 are explanatory views showing the operation of holding the electronic paper substrate 100 by the substrate holding mechanism 40 according to the first embodiment of the present invention. Here, FIGS. 5, 6, 7, and 9 are side sectional views of the substrate holding mechanism 40. 8 is a cross-sectional view taken along the line AA in FIG. 7, and FIG. 10 is a cross-sectional view taken along the line AA in FIG.

  The substrate holding mechanism 40 is for pressing the peripheral portion of the electronic paper substrate 100 in which the electronic paper film 101 and the support layer 102 are laminated via the adhesive layer toward the stage 11. Are disposed in each of the eight recesses 12 formed in each.

  The substrate holding mechanism 40 is a roller-shaped member that is used to position the electronic paper substrate 100 by being in contact with the edge of the electronic paper substrate 100 and is rotatable about a vertical axis. The contact member 41 which consists of is provided. The substrate holding mechanism 40 is separated from the contact position between the contact member 41 on the surface of the electronic paper substrate 100 and the edge of the electronic paper substrate 100 by a predetermined distance from the center of the electronic paper substrate 100. A pressing member 42 made of an O-ring wound around a rod-shaped member 47 is used to press the region thus pressed toward the stage 11.

  The contact member 41 is supported by the first support portion 43. Further, the pressing member 42 is supported by the first support portion 43 via a rod-shaped member 47. The first support portion 43 is configured to be slidable with respect to the pair of guide shafts 44 disposed on the second support portion 45. As shown in FIGS. 8 and 10, a spring 46 is disposed between the shaft 48 disposed on the second support portion 45 and the first support portion 43.

  Here, the distance between the contact position of the contact member 41 and the edge of the electronic paper substrate 100 and the pressing position of the surface of the electronic paper substrate 100 by the pressing member 42 is set to about 5 mm, for example. Yes. That is, the distance between the contact position of the contact member 41 and the edge of the electronic paper substrate 100 and the pressing position of the surface of the electronic paper substrate 100 by the pressing member 42 is the electronic paper for the electronic paper substrate 100. The distance is set to be smaller than the distance between the edge of the film 101 and the edge of the support layer 102.

  The first support portion 43 is mounted on the stage 11 with a pressing position where the pressing member 42 presses the surface of the electronic paper substrate 100 placed on the stage 11 by an air slider 51 including an air cylinder and a guide member. It raises / lowers between the separated positions separated from the surface of the placed electronic paper substrate 100. Further, the air slider 51 includes a contact position where the contact member 41 contacts the edge of the electronic paper substrate 100 placed on the stage 11 by the air slider 52 fixed on the base 53, and the stage. 11 is moved between a retreat position and a retreat position where the electronic paper substrate 100 is retreated from an edge of the electronic paper substrate 100. Further, a contact member 54 that can change the position of its upper end by the action of the screw 55 is disposed on the base 53.

  Next, a pressing operation for pressing the peripheral portion of the electronic paper substrate 100 toward the stage 11 by the substrate holding mechanism 40 will be described.

  When the electronic paper substrate 100 is transported onto the stage 11 by a transport mechanism (not shown) in order to apply the coating liquid to the electronic paper substrate 100, the substrate holding mechanism 40 enters a standby state shown in FIG. ing. When a pressing operation for pressing the peripheral edge of the electronic paper substrate 100 toward the stage 11 is started, first, the switching valves 96a and 96b and the on-off valves 97a and 97b shown in FIG. Nitrogen gas is ejected from the hole 98 and the hole 99 formed in the above. This facilitates the horizontal movement of the electronic paper substrate 100 on the stage 11.

  In this state, as shown in FIG. 6, the first support portion 43 and the second support portion 45 are raised together with the contact member 41 and the pressing member 42 by the action of the air slider 51. Then, as shown in FIG. 7, the air slider 51 is moved in the direction close to the electronic paper substrate 100 placed on the stage 11 by the action of the air slider 52. Thus, the contact member 41 is in contact with the edge of the electronic paper substrate 100 from the retracted position retracted from the edge of the electronic paper substrate 100 together with the first and second support portions 43 and 45 and the like. Move to position. As the contact member 41 moves, the electronic paper substrate 100 is positioned on the stage 11.

  Next, exhaust is performed from the hole 99 communicating with the chamber 94 by operating the switching valve 96a and the on-off valve 97a shown in FIG. As a result, air is exhausted from the suction groove 92 communicating with the hole 99, and the vicinity of the central portion of the electronic paper substrate 100 is suction-held on the stage 11. Then, if a certain time has passed in this state, the switching valve 96b and the on-off valve 97b shown in FIG. 4 are operated to exhaust air from the hole 98 communicating with the chamber 93. As a result, exhaust is also performed from the suction groove 91 communicating with the hole 98, and the vicinity of the peripheral portion of the electronic paper substrate 100 is suction-held on the stage 11.

  At this time, the suction holding state of the electronic paper substrate 100 with respect to the stage 11 can be confirmed by the measured values of the atmospheric pressure in the chambers 93 and 94 by the pressure gauges 95a and 95b. When it is confirmed from the measured values of the atmospheric pressure in the chambers 93 and 94 by the pressure gauges 95a and 95b that the entire area of the electronic paper substrate 100 is adsorbed and held on the stage 11, the coating liquid is applied as it is. Start operation.

  On the other hand, in the case of the electronic paper substrate 100 having a large warp, the vicinity thereof may not be attracted and held on the stage 11. In this case, the atmospheric pressure in the chamber 93 corresponding to the peripheral portion of the electronic paper substrate 100 does not drop. When the pressure gauge 95 b detects such a state, the peripheral portion of the electronic paper substrate 100 is pressed toward the stage 11 by the pressing member 42 in the substrate holding mechanism 40.

  That is, as shown in FIG. 9, the first support portion 43 and the second support portion 45 are moved down together with the contact member 41 and the pressing member 42 by the action of the air slider 51. As a result, the pressing member 42 moves from a separation position separated from the surface of the electronic paper substrate 100 placed on the stage 11 to a pressing position that presses the surface of the electronic paper substrate 100 placed on the stage 11. As a result, the entire surface of the electronic paper substrate 100 comes into contact with the stage 11, and the entire surface of the electronic paper substrate 100 is sucked and held on the stage 11.

  At this time, the pressing force of the surface of the electronic paper substrate 100 by the pressing member 42 is maintained at a predetermined magnitude by the action of the spring 46. The magnitude of the pressing force at this time can be adjusted to an appropriate value by changing the height position of the contact member 54.

As described above, according to the substrate holding mechanism 40 according to the first embodiment, the contact position between the contact member 41 and the edge of the electronic paper substrate 100, and the surface of the electronic paper substrate 100 by the pressing member 42. Is set to be smaller than the distance between the edge of the electronic paper film 101 in the electronic paper substrate 100 and the edge of the support layer 102 in the electronic paper substrate 100. It is possible to press only the support layer 102 that is the contactable area of the electronic paper substrate 100 with the pressing member 42 without contacting the electronic paper film 101 that is the non-contactable area.

  At this time, the electronic paper substrate 100 is pressed by the pressing member 42 only when the edge of the electronic paper substrate 100 is not attracted and held by the stage 11 due to the warp of the electronic paper substrate 100. It is possible to efficiently perform the suction holding operation of the substrate 100.

Next, the configuration of a substrate holding mechanism according to another embodiment of the present invention will be described. 11 to 15 are explanatory views showing the operation of holding the electronic paper substrate 100 by the substrate holding mechanism 60 according to the second embodiment of the present invention. FIG. 16 is a schematic plan view of the substrate holding mechanism 60. In addition, about the member similar to the board | substrate holding mechanism 40 which concerns on 1st Embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

In the substrate holding mechanism 60 according to the second embodiment, the electronic paper substrate placed on the stage 11 with respect to the pressing member 42 after the pressing member 42 has moved from the separation position to the pressing position. An abutting member moving mechanism including wedge-shaped members 61 and 62 for moving in a direction away from the edge of 100 is provided.

The pair of wedge-shaped members 61 and 62 are provided with inclined surfaces facing each other, and the inclined surfaces are in contact with each other. The wedge-shaped member 61 is connected to the first support portion 43, and the wedge-shaped member 62 is connected to the second support portion 45. Further, the wedge-shaped members 61 and 62 are urged by the spring 63 through the first support portion 43 and the second support portion 45 in the direction in which the inclined surface always abuts. In the substrate holding mechanism 60, the contact member 41 made of a roller-like member that can rotate around the vertical axis is disposed on a connecting member 64 connected to the wedge-shaped member 62.

  Next, a pressing operation for pressing the peripheral portion of the electronic paper substrate 100 toward the stage 11 by the substrate holding mechanism 60 will be described.

  When the electronic paper substrate 100 is transported onto the stage 11 by a transport mechanism (not shown) in order to apply the coating solution to the electronic paper substrate 100, the substrate holding mechanism 60 enters a standby state shown in FIG. ing. When the pressing operation for pressing the peripheral edge of the electronic paper substrate 100 toward the stage 11 is started, first, as in the case of the first embodiment described above, first, the switching valves 96a and 96b and the on-off valve 97a shown in FIG. , 97b is operated to blow out nitrogen gas from the hole 98 and hole 99 formed on the stage 11. This facilitates the horizontal movement of the electronic paper substrate 100 on the stage 11.

  In this state, as shown in FIG. 12, the first support portion 43 and the second support portion 45 are raised together with the contact member 41 and the pressing member 42 by the action of the air slider 51. Then, as shown in FIG. 13, the air slider 51 is moved in the direction close to the electronic paper substrate 100 placed on the stage 11 by the action of the air slider 52. Accordingly, the contact member 41 is in contact with the edge of the electronic paper substrate 100 from the retracted position retracted from the edge of the electronic paper substrate 100 together with the first and second support portions 43 and 45 and the like. Move to position. As the contact member 41 moves, the electronic paper substrate 100 is positioned on the stage 11.

  Next, exhaust is performed from the hole 99 communicating with the chamber 94 by operating the switching valve 96a and the on-off valve 97a shown in FIG. As a result, air is exhausted from the suction groove 92 communicating with the hole 99, and the vicinity of the central portion of the electronic paper substrate 100 is suction-held on the stage 11. Then, if a certain time has passed in this state, the switching valve 96b and the on-off valve 97b shown in FIG. 4 are operated to exhaust air from the hole 98 communicating with the chamber 93. As a result, exhaust is also performed from the suction groove 91 communicating with the hole 98, and the vicinity of the peripheral portion of the electronic paper substrate 100 is suction-held on the stage 11.

  Then, as in the case of the first embodiment, the suction holding state of the electronic paper substrate 100 with respect to the stage 11 is confirmed by the measured pressure values in the chambers 93 and 94 by the pressure gauges 95a and 95b. When it is confirmed from the measured values of the atmospheric pressure in the chambers 93 and 94 that the entire area of the electronic paper substrate 100 is adsorbed and held on the stage 11, the coating liquid coating operation is started as it is. On the other hand, when the atmospheric pressure in the chamber 93 corresponding to the peripheral portion of the electronic paper substrate 100 does not drop, the peripheral portion of the electronic paper substrate 100 is pressed toward the stage 11 by the pressing member 42 in the substrate holding mechanism 60. To do.

  That is, as shown in FIG. 14, the first support portion 43 and the second support portion 45 are moved down together with the contact member 41 and the pressing member 42 by the action of the air slider 51. As a result, the pressing member 42 moves from a separation position separated from the surface of the electronic paper substrate 100 placed on the stage 11 to a pressing position that presses the surface of the electronic paper substrate 100 placed on the stage 11. As a result, the entire surface of the electronic paper substrate 100 comes into contact with the stage 11, and the entire surface of the electronic paper substrate 100 is sucked and held on the stage 11. At this time, the contact member 41 is disposed at a contact position that contacts the edge of the electronic paper substrate 100.

  In this state, when the first support portion 43 and the second support portion 45 are further lowered by the action of the air slider 51, the wedge-shaped member 62 and the wedge-shaped member 61 and the first support are moved together with the second support portion 45. It descends relative to the portion 43. Accordingly, the wedge-shaped member 62 moves in the right direction shown in FIG. 15 together with the second support portion 45 by the action of the inclined surfaces of the pair of wedge-shaped members 61 and 62. Accordingly, the connecting member 64 connected to the wedge-shaped member 62 disposed on the connecting member 64 also moves in the right direction. For this reason, the contact member 41 moves from a contact position that contacts the edge of the electronic paper substrate 100 to a retracted position that retracts from the edge of the electronic paper substrate 100. For this reason, it becomes possible to prevent the contact member 41 and the edge of the electronic paper substrate 100 from sliding.

Also in the substrate holding mechanism 60 according to the second embodiment, the contact position between the contact member 41 and the edge of the electronic paper substrate 100 and the pressing position of the surface of the electronic paper substrate 100 by the pressing member 42 are determined. Since the distance is set to be smaller than the distance between the edge of the electronic paper film 101 and the edge of the support layer 102 in the electronic paper substrate 100, it is a non-contactable area of the electronic paper substrate 100. Without contacting the electronic paper film 101, it is possible to press only the support layer 102 that is a contactable region of the electronic paper substrate 100 with the pressing member 42.

DESCRIPTION OF SYMBOLS 11 Stage 12 Recessed part 13 Slit nozzle 14 Carriage 15 Support part 17 Traveling rail 20 Linear motor 23 Linear encoder 31 Nozzle cleaning mechanism 34 Pre-dispensing mechanism 40 Substrate holding mechanism 41 Contact member 42 Press member 43 First support part 44 Guide shaft 45 First 2 Supporting part 46 Spring 51 Air slider 52 Air slider 54 Contact member 60 Substrate holding mechanism 61 Wedge-shaped member 62 Wedge-shaped member 63 Spring 64 Connecting member 91 Adsorption groove 92 Adsorption groove 93 Chamber 94 Chamber 95 Chamber 95 Pressure gauge 96 Switching valve 97 Open / close valve 98 hole 99 hole 100 substrate for electronic paper 101 film for electronic paper 102 support layer

Claims (7)

A stage on which a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region is placed, and in a state of being close to the surface of the substrate placed on the stage, relative to the substrate in the horizontal direction. A slit nozzle that applies a coating liquid onto the surface of the substrate by moving to a coating device,
A substrate holding mechanism that presses the peripheral edge of the substrate placed on the stage toward the stage;
The substrate holding mechanism is
An abutting member for positioning the substrate by abutting against an edge of the substrate placed on the stage;
A pressing member that presses a region separated from the contact position between the contact member and the edge of the substrate on the surface of the substrate by a predetermined distance toward the center of the substrate toward the stage;
A first support portion for supporting the contact member and the pressing member;
A second support portion slidably provided with respect to the first support portion;
A spring disposed between the first support portion and the second support portion;
The abutting member abuts against an edge of the substrate placed on the stage, the abutting position where the pressing member faces the peripheral edge of the substrate placed on the stage, the abutting member, and A horizontal movement mechanism for moving the first support part and the second support part between a retreat position in which the pressing member retreats from an edge of the substrate placed on the stage;
Between the pressing position where the pressing member presses the peripheral edge of the substrate placed on the stage and the separation position where the pressing member separates from the peripheral edge of the substrate placed on the stage. An elevating mechanism for moving the first support part and the second support part;
With
The coating apparatus, wherein the first support part and the second support part are lowered from the separation position to the pressing position by the lifting mechanism in a state where the contact member is disposed at the contact position . A stage on which a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region is placed, and in a state of being close to the surface of the substrate placed on the stage, relative to the substrate in the horizontal direction. A slit nozzle that applies a coating liquid onto the surface of the substrate by moving to a coating device,
A substrate holding mechanism that presses the peripheral edge of the substrate placed on the stage toward the stage;
The substrate holding mechanism is
An abutting member for positioning the substrate by abutting against an edge of the substrate placed on the stage;
A pressing member that presses a region separated from the contact position between the contact member and the edge of the substrate on the surface of the substrate by a predetermined distance toward the center of the substrate toward the stage;
A first support portion for supporting the contact member and the pressing member;
A second support portion slidably provided with respect to the first support portion;
The abutting member abuts against an edge of the substrate placed on the stage, the abutting position where the pressing member faces the peripheral edge of the substrate placed on the stage, the abutting member, and A horizontal movement mechanism for moving the first support part and the second support part between a retreat position in which the pressing member retreats from an edge of the substrate placed on the stage;
Between the pressing position where the pressing member presses the peripheral edge of the substrate placed on the stage and the separation position where the pressing member separates from the peripheral edge of the substrate placed on the stage. An elevating mechanism for moving the first support part and the second support part;
After the pressing member is moved from the separation position to the pressing position by the lifting mechanism, the contact member is moved in a direction away from the edge of the substrate placed on the stage with respect to the pressing member. A contact member moving mechanism,
The abutting member moving mechanism includes a pair of wedge-shaped members disposed in a state in which inclined surfaces facing each other are in contact with each other, and one of the pair of wedge-shaped members is coupled to the first support portion. In addition, the other of the pair of wedge-shaped members is connected to the second support member . In the coating device according to claim 1 or 2 ,
The substrate holding mechanism is a coating apparatus that is respectively disposed in a plurality of recesses formed on the stage around the substrate placed on the stage. In the coating device in any one of Claims 1-3 ,
A hole formed in the stage;
Exhaust means for exhausting air from the hole before the pressing member presses the peripheral edge of the substrate after the contact member contacts the edge of the substrate;
A first pressure gauge that measures the degree of vacuum of a hole facing the vicinity of the center of the substrate among the holes formed in the stage;
A second pressure gauge that measures the degree of vacuum of the hole facing the vicinity of the edge of the substrate among the holes formed in the stage;
Further comprising a,
When the second pressure gauge detects that the degree of vacuum of the hole formed in the vicinity of the edge of the substrate does not reach a certain value, the elevating mechanism causes the pressing member to be pressed from the separation position. coating device Before moving to the position. In the coating device in any one of Claims 1-4 ,
The said board | substrate is a coating device which is a board | substrate for electronic paper which laminated | stacked the support layer, the contact bonding layer, and the film for electronic paper in this order. A substrate holding device that presses a peripheral portion of a substrate having a central portion as a non-contactable region and a peripheral portion as a contactable region toward a stage,
An abutting member for positioning the substrate by abutting against an edge of the substrate placed on the stage;
A pressing member that presses a region separated from the contact position between the contact member and the edge of the substrate on the surface of the substrate by a predetermined distance toward the center of the substrate toward the stage;
A support portion for supporting the contact member and the pressing member;
The support is moved between a contact position where the contact member contacts the edge of the substrate placed on the stage and a retreat position where the support member retreats from the edge of the substrate placed on the stage. A horizontal movement mechanism,
An elevating mechanism for moving the support portion between a pressing position where the pressing member presses the surface of the substrate placed on the stage and a separation position separated from the surface of the substrate placed on the stage; ,
A hole formed in the stage;
Exhaust means for exhausting air from the hole before the pressing member presses the peripheral edge of the substrate after the contact member contacts the edge of the substrate;
A first pressure gauge that measures the degree of vacuum of a hole facing the vicinity of the center of the substrate among the holes formed in the stage;
A second pressure gauge that measures the degree of vacuum of the hole facing the vicinity of the edge of the substrate among the holes formed in the stage;
With
When the second pressure gauge detects that the degree of vacuum of the hole facing the vicinity of the edge of the substrate does not reach a certain value, the lifting mechanism moves the pressing member from the separation position to the pressing position. A substrate holding device, wherein the substrate holding device is moved . A substrate holding method for adsorbing and holding on a stage a substrate having a central part as a non-contactable area and a peripheral part as a contactable area,
A placing step of placing the substrate on the stage;
A gas ejection step for ejecting gas from the hole formed in the stage;
A positioning step of positioning the substrate by bringing a contact member into contact with an edge of the substrate placed on the stage;
An exhaust process for exhausting from the hole formed in the stage ;
Of the holes formed in the stage, the degree of vacuum of the hole formed at a position facing the vicinity of the center of the substrate and the vacuum of the hole formed at a position facing the edge of the substrate A vacuum measurement process for measuring the degree of each ,
When the degree of vacuum of the hole facing the edge of the substrate does not reach a certain value, the center of the substrate from the contact position of the contact member and the edge of the substrate on the surface of the substrate A pressing step of pressing a region separated by a predetermined distance toward the stage by a pressing member;
A substrate holding method comprising:

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