JP5685372B2 - Metal ink, metal-containing film using the same, and method for producing the same - Google Patents
Metal ink, metal-containing film using the same, and method for producing the same Download PDFInfo
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- JP5685372B2 JP5685372B2 JP2009246907A JP2009246907A JP5685372B2 JP 5685372 B2 JP5685372 B2 JP 5685372B2 JP 2009246907 A JP2009246907 A JP 2009246907A JP 2009246907 A JP2009246907 A JP 2009246907A JP 5685372 B2 JP5685372 B2 JP 5685372B2
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- metal
- weight
- metal particles
- parts
- ink
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- 229910052751 metal Inorganic materials 0.000 title claims description 98
- 239000002184 metal Substances 0.000 title claims description 98
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000002923 metal particle Substances 0.000 claims description 79
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 36
- 229910052709 silver Inorganic materials 0.000 claims description 34
- 239000004332 silver Substances 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 33
- 238000000576 coating method Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 229920000728 polyester Polymers 0.000 claims description 18
- 238000007639 printing Methods 0.000 claims description 17
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 150000001408 amides Chemical class 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000010422 painting Methods 0.000 claims description 4
- 239000000976 ink Substances 0.000 description 64
- 239000010408 film Substances 0.000 description 53
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 38
- 229920000570 polyether Polymers 0.000 description 31
- 239000004721 Polyphenylene oxide Substances 0.000 description 30
- -1 aliphatic aldehydes Chemical class 0.000 description 28
- 239000003795 chemical substances by application Substances 0.000 description 28
- 239000002245 particle Substances 0.000 description 26
- 239000003431 cross linking reagent Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 19
- 238000009835 boiling Methods 0.000 description 18
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- 239000002585 base Substances 0.000 description 15
- 239000000084 colloidal system Substances 0.000 description 15
- 150000002736 metal compounds Chemical class 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 14
- 239000002202 Polyethylene glycol Substances 0.000 description 13
- 239000006185 dispersion Substances 0.000 description 13
- 238000002156 mixing Methods 0.000 description 12
- 229920001223 polyethylene glycol Polymers 0.000 description 12
- 239000003638 chemical reducing agent Substances 0.000 description 10
- 239000002609 medium Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002932 luster Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 6
- 108010010803 Gelatin Proteins 0.000 description 6
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 239000008273 gelatin Substances 0.000 description 6
- 229920000159 gelatin Polymers 0.000 description 6
- 235000019322 gelatine Nutrition 0.000 description 6
- 235000011852 gelatine desserts Nutrition 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 229920001451 polypropylene glycol Polymers 0.000 description 6
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 5
- 235000001014 amino acid Nutrition 0.000 description 5
- 150000001413 amino acids Chemical class 0.000 description 5
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 235000018102 proteins Nutrition 0.000 description 5
- 108090000623 proteins and genes Proteins 0.000 description 5
- 102000004169 proteins and genes Human genes 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 239000011593 sulfur Substances 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- 102000011632 Caseins Human genes 0.000 description 4
- 108010076119 Caseins Proteins 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000002518 antifoaming agent Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 239000002612 dispersion medium Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000003759 ester based solvent Substances 0.000 description 3
- 239000004210 ether based solvent Substances 0.000 description 3
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920001748 polybutylene Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 3
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- ODJQKYXPKWQWNK-UHFFFAOYSA-N 3,3'-Thiobispropanoic acid Chemical compound OC(=O)CCSCCC(O)=O ODJQKYXPKWQWNK-UHFFFAOYSA-N 0.000 description 2
- 244000215068 Acacia senegal Species 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- 229920000084 Gum arabic Polymers 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- AMIMRNSIRUDHCM-UHFFFAOYSA-N Isopropylaldehyde Chemical compound CC(C)C=O AMIMRNSIRUDHCM-UHFFFAOYSA-N 0.000 description 2
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 241000208125 Nicotiana Species 0.000 description 2
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 239000003490 Thiodipropionic acid Substances 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 235000010489 acacia gum Nutrition 0.000 description 2
- 239000000205 acacia gum Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N alpha-ketodiacetal Natural products O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 239000005018 casein Substances 0.000 description 2
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 2
- 229940071162 caseinate Drugs 0.000 description 2
- 235000021240 caseins Nutrition 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- UFULAYFCSOUIOV-UHFFFAOYSA-N cysteamine Chemical compound NCCS UFULAYFCSOUIOV-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- IFQUWYZCAGRUJN-UHFFFAOYSA-N ethylenediaminediacetic acid Chemical compound OC(=O)CNCCNCC(O)=O IFQUWYZCAGRUJN-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 150000007974 melamines Chemical class 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000010979 pH adjustment Methods 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- YCOZIPAWZNQLMR-UHFFFAOYSA-N pentadecane Chemical compound CCCCCCCCCCCCCCC YCOZIPAWZNQLMR-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001470 polyketone Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- 239000012279 sodium borohydride Substances 0.000 description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 description 2
- 229940080237 sodium caseinate Drugs 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 2
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 2
- 235000019303 thiodipropionic acid Nutrition 0.000 description 2
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 2
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- NMRPBPVERJPACX-UHFFFAOYSA-N (3S)-octan-3-ol Natural products CCCCCC(O)CC NMRPBPVERJPACX-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- IBDVWXAVKPRHCU-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCCOC(=O)C(C)=C IBDVWXAVKPRHCU-UHFFFAOYSA-N 0.000 description 1
- KKKKCPPTESQGQH-UHFFFAOYSA-N 2-(4,5-dihydro-1,3-oxazol-2-yl)-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=NCCO1 KKKKCPPTESQGQH-UHFFFAOYSA-N 0.000 description 1
- QEEZSWGDNCHFKC-UHFFFAOYSA-N 2-(4,5-dihydro-1,3-oxazol-2-ylmethyl)-4,5-dihydro-1,3-oxazole Chemical compound N=1CCOC=1CC1=NCCO1 QEEZSWGDNCHFKC-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- LYIIBVSRGJSHAV-UHFFFAOYSA-N 2-aminoacetaldehyde Chemical compound NCC=O LYIIBVSRGJSHAV-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- OFLNEVYCAMVQJS-UHFFFAOYSA-N 2-n,2-n-diethylethane-1,1,1,2-tetramine Chemical compound CCN(CC)CC(N)(N)N OFLNEVYCAMVQJS-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 description 1
- ORTNTAAZJSNACP-UHFFFAOYSA-N 6-(oxiran-2-ylmethoxy)hexan-1-ol Chemical compound OCCCCCCOCC1CO1 ORTNTAAZJSNACP-UHFFFAOYSA-N 0.000 description 1
- ALEBYBVYXQTORU-UHFFFAOYSA-N 6-hydrazinyl-6-oxohexanoic acid Chemical compound NNC(=O)CCCCC(O)=O ALEBYBVYXQTORU-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- 229920001817 Agar Polymers 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- GUBGYTABKSRVRQ-XLOQQCSPSA-N Alpha-Lactose Chemical compound O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@@H](CO)O[C@H](O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-XLOQQCSPSA-N 0.000 description 1
- 239000004475 Arginine Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 241000288673 Chiroptera Species 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 description 1
- GUBGYTABKSRVRQ-QKKXKWKRSA-N Lactose Natural products OC[C@H]1O[C@@H](O[C@H]2[C@H](O)[C@@H](O)C(O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@H]1O GUBGYTABKSRVRQ-QKKXKWKRSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- IPTNXMGXEGQYSY-UHFFFAOYSA-N acetic acid;1-methoxybutan-1-ol Chemical compound CC(O)=O.CCCC(O)OC IPTNXMGXEGQYSY-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000008272 agar Substances 0.000 description 1
- 235000010419 agar Nutrition 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 235000013334 alcoholic beverage Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- 125000005365 aminothiol group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003868 ammonium compounds Chemical class 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- GUBGYTABKSRVRQ-QUYVBRFLSA-N beta-maltose Chemical compound OC[C@H]1O[C@H](O[C@H]2[C@H](O)[C@@H](O)[C@H](O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@@H]1O GUBGYTABKSRVRQ-QUYVBRFLSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 229910052799 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- HDFRDWFLWVCOGP-UHFFFAOYSA-N carbonothioic O,S-acid Chemical class OC(S)=O HDFRDWFLWVCOGP-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 1
- 235000018417 cysteine Nutrition 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 239000004815 dispersion polymer Substances 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 239000012493 hydrazine sulfate Substances 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 229940079826 hydrogen sulfite Drugs 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- NFMHSPWHNQRFNR-UHFFFAOYSA-N hyponitrous acid Chemical compound ON=NO NFMHSPWHNQRFNR-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000008101 lactose Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- KXGCNMMJRFDFNR-WDRJZQOASA-N linaclotide Chemical compound C([C@H](NC(=O)[C@@H]1CSSC[C@H]2C(=O)N[C@H]3CSSC[C@H](N)C(=O)N[C@H](C(N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=4C=CC(O)=CC=4)C(=O)N2)=O)CSSC[C@H](NC(=O)[C@H](C)NC(=O)[C@@H]2CCCN2C(=O)[C@H](CC(N)=O)NC3=O)C(=O)N[C@H](C(NCC(=O)N1)=O)[C@H](O)C)C(O)=O)C1=CC=C(O)C=C1 KXGCNMMJRFDFNR-WDRJZQOASA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- CYEBJEDOHLIWNP-UHFFFAOYSA-N methanethioamide Chemical compound NC=S CYEBJEDOHLIWNP-UHFFFAOYSA-N 0.000 description 1
- 229930182817 methionine Natural products 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- QJQAMHYHNCADNR-UHFFFAOYSA-N n-methylpropanamide Chemical compound CCC(=O)NC QJQAMHYHNCADNR-UHFFFAOYSA-N 0.000 description 1
- 210000000282 nail Anatomy 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- AXLMPTNTPOWPLT-UHFFFAOYSA-N prop-2-enyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCC=C AXLMPTNTPOWPLT-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- KOUKXHPPRFNWPP-UHFFFAOYSA-N pyrazine-2,5-dicarboxylic acid;hydrate Chemical compound O.OC(=O)C1=CN=C(C(O)=O)C=N1 KOUKXHPPRFNWPP-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 210000003491 skin Anatomy 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 235000014214 soft drink Nutrition 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- ACTRVOBWPAIOHC-UHFFFAOYSA-N succimer Chemical compound OC(=O)C(S)C(S)C(O)=O ACTRVOBWPAIOHC-UHFFFAOYSA-N 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000000271 synthetic detergent Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003556 thioamides Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Chemically Coating (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
本発明は、金属粒子を配合した金属インキに関する。また、その金属インキを用いた金属含有膜の製造方法に関する。更に、この金属含有膜の具体的用途である装飾膜、電極、配線パターンに関する。 The present invention relates to a metal ink containing metal particles. Moreover, it is related with the manufacturing method of the metal containing film | membrane using the metal ink. Furthermore, it is related with the decoration film | membrane, electrode, and wiring pattern which are the specific uses of this metal containing film | membrane.
金属粒子を溶媒に分散し、必要に応じてバインダーや分散剤、粘度調整剤などの添加剤を更に配合した金属インキは、その金属的性質を活用して、例えば電気的導通を確保するため、あるいは帯電防止、電磁波遮蔽又は金属光沢、抗菌性等を付与するためなどの種々の用途に用いられてきた。近年になって、配合する金属粒子として平均粒子径が1〜200nm程度のナノサイズの金属粒子が用いられるようになってきたため、その用途は多方面に拡大し、例えば、微細な電極、回路配線パターンを形成する技術が提案されている。これは、金属粒子を配合した金属インキを、スクリーン印刷、インクジェット印刷等の塗装手法で基板上に電極や回路配線パターン状に塗布した後、加熱して金属粒子を融着させるもので、プリント配線基板の製造に応用されつつある。更に、金属粒子はナノオーダーになるとそのサイズ効果によりバルク材の融点より低い温度においても容易に粒子の融着が進行するため、簡便な金属色調面の作製技術として、意匠・装飾用途においても注目されている。 Metallic ink, in which metal particles are dispersed in a solvent, and further blended with additives such as binders, dispersants, viscosity modifiers, etc., as necessary, uses its metallic properties to ensure electrical continuity, for example. Alternatively, they have been used for various purposes such as antistatic, electromagnetic shielding or metallic luster, antibacterial properties and the like. In recent years, since nano-sized metal particles having an average particle diameter of about 1 to 200 nm have been used as the metal particles to be blended, their uses have expanded to various fields, such as fine electrodes and circuit wiring. A technique for forming a pattern has been proposed. This is a method in which a metal ink containing metal particles is applied onto a substrate in the form of an electrode or circuit wiring pattern by a coating technique such as screen printing or ink jet printing, and then heated to fuse the metal particles. It is being applied to the manufacture of substrates. Furthermore, when the metal particles are nano-order, the size effect of the particles facilitates the fusion of the particles even at a temperature lower than the melting point of the bulk material. Has been.
このような金属インキとして例えば、特許文献1には、一次粒子の平均粒径がナノサイズの金属粒子の表面をポリビニルピロリドン、ポリビニルアルコール、ポリエチレングリコール、ポリエチレンオキシド、デンプン、ゼラチンなどの高分子分散剤で覆い、溶媒として主鎖に2以上のヒドロキシル基を有するポリオールを含む有機溶媒を用いることにより分散性に優れた金属粒子分散溶液が得られること、該分散溶液を用いて、加熱により高分子分散剤を分解することで導電性に優れた塗膜を製造できることを記載している。
また、特許文献2は、一次粒子径が30nm以下の金属粒子及び分散媒からなる金属粒子分散体であって、分散媒として直鎖状脂肪族ポリエーテル化合物を含有する金属粒子分散体を用いると、常圧下での加熱により分散媒を分解することで低抵抗の金属薄膜が製造できることが記載されている。
As such a metal ink, for example, Patent Document 1 discloses a polymer dispersant such as polyvinyl pyrrolidone, polyvinyl alcohol, polyethylene glycol, polyethylene oxide, starch, gelatin on the surface of metal particles having an average primary particle size of nano-size. By using an organic solvent containing a polyol having two or more hydroxyl groups in the main chain as a solvent, a metal particle dispersion solution having excellent dispersibility can be obtained, and polymer dispersion can be performed by heating using the dispersion solution. It describes that a coating film excellent in conductivity can be produced by decomposing the agent.
Patent Document 2 is a metal particle dispersion composed of metal particles having a primary particle size of 30 nm or less and a dispersion medium, and a metal particle dispersion containing a linear aliphatic polyether compound is used as the dispersion medium. In addition, it is described that a low-resistance metal thin film can be produced by decomposing a dispersion medium by heating under normal pressure.
特許文献1の金属粒子分散溶液において、高分子分散剤は、金属粒子の表面を被覆することで溶液状態では金属粒子を分散させるため、比較的分子量の小さいものを用いる必要があり、塗膜製造時の加熱により分解される結果、塗膜と基材との密着性が十分でなく、塗膜強度が脆弱であるという問題がある。そのため、クラック等の表面欠陥や剥離等の欠損が生じやすく、導電性の低下や商品価値の低下を招く。
特許文献2の金属微粒子分散体は、分散媒として直鎖状脂肪族ポリエーテル化合物、特に分子量が150〜600のものを配合しているが、上述の特許文献1の発明と同様の課題をもつ。
上述のような金属粒子を分散させた塗料を直接基材に塗着する方法においては、得られる金属塗膜の基材に対する密着性が低いという問題点がある。
また、近年の金属粒子の用途の拡大においては、比較的低温で塗膜の形成が可能であるという性質からさまざまな基材への適用が検討されているが、特に、樹脂やガラスなどの低耐熱性基材と金属塗膜とは概して接着性が悪く、柔軟性を持つ基材では変形に伴い剥離等の欠陥が容易に生じるという問題点もある。
In the metal particle dispersion solution of Patent Document 1, since the polymer dispersant is dispersed in a solution state by coating the surface of the metal particles, it is necessary to use a polymer having a relatively low molecular weight. As a result of being decomposed by heating, there is a problem that the adhesion between the coating film and the substrate is not sufficient, and the coating film strength is fragile. Therefore, surface defects such as cracks and defects such as peeling are likely to occur, leading to a decrease in conductivity and a decrease in commercial value.
The metal fine particle dispersion of Patent Document 2 contains a linear aliphatic polyether compound, particularly one having a molecular weight of 150 to 600, as a dispersion medium, but has the same problems as the invention of Patent Document 1 described above. .
In the method of directly applying the coating material in which the metal particles are dispersed as described above to the substrate, there is a problem that the adhesion of the obtained metal coating film to the substrate is low.
Also, in recent expansion of the use of metal particles, application to various base materials has been studied due to the property that a coating film can be formed at a relatively low temperature. The heat-resistant base material and the metal coating film generally have poor adhesion, and a flexible base material has a problem that defects such as peeling easily occur with deformation.
本発明者らは、上記の問題を解決すべく鋭意研究を重ねた結果、特定量のポリエーテルと密着性付与剤とを配合し、それらの合量を特定の範囲とすることにより、基材との強固な密着性を有し、しかも、金属光沢等の仕上がり外観にも優れた金属含有膜が得られることを見出し、本発明の完成に至った。 As a result of intensive studies to solve the above problems, the present inventors have blended a specific amount of polyether and an adhesion-imparting agent, and the total amount thereof is within a specific range. In addition, the inventors have found that a metal-containing film having a strong adhesiveness and excellent finished appearance such as metallic luster can be obtained, and the present invention has been completed.
即ち、本発明は、
(1)金属粒子と溶媒と、前記の金属粒子100重量部に対して0.5〜20重量部のポリエーテルと、前記の金属粒子100重量部に対して0.1〜20重量部の密着性付与剤とを少なくとも含み、ポリエーテルと密着性付与剤との合量が金属粒子100重量部に対し0.6〜20.5重量部である金属インキであり、
(2)ポリエーテルがポリエチレンオキシドである金属インキであり、
(3)密着性付与剤がCO二重結合を単位構造に持つポリマーである金属インキであり、
(4)CO二重結合を単位構造に持つポリマーがポリエステルである金属インキであり、
(5)アミド系溶媒を含む金属インキであり、
(6)金属粒子の構成成分が、銅、銀、金、ニッケル、パラジウム及び白金から選ばれる少なくとも一種である金属インキであり、
(7)前記(1)〜(6)のいずれかに記載の金属インキを基材に印刷又は塗装する金属含有膜の製造方法であり、
(8)前記(1)〜(6)のいずれかに記載の金属インキを基材に印刷又は塗装した後、200℃以下の温度で加熱処理する金属含有膜の製造方法であり、
(9)前記(1)〜(6)のいずれかに記載の金属インキを用いて作製される装飾膜であり、
(10)分光色彩計での入射角及び反射角20度の条件で測定した鏡面光沢度が400以上の塗膜を有する装飾膜であり、
(11)前記(1)〜(6)のいずれかに記載の金属インキを用いて作製される電極、配線パターンであり、
(12)前記(9)〜(11)のいずれかに記載の装飾膜、電極又は配線パターンを有する部品である。
That is, the present invention
(1) 0.1-20 parts by weight of metal particles, a solvent, 0.5-20 parts by weight of polyether with respect to 100 parts by weight of the metal particles, and 0.1-20 parts by weight with respect to 100 parts by weight of the metal particles A metal ink containing at least a property-imparting agent, wherein the total amount of the polyether and the adhesion-imparting agent is 0.6 to 20.5 parts by weight with respect to 100 parts by weight of the metal particles,
(2) a metal ink in which the polyether is polyethylene oxide,
(3) a metal ink in which the adhesion-imparting agent is a polymer having a CO double bond in a unit structure;
(4) A metal ink in which the polymer having a CO double bond in the unit structure is polyester,
(5) A metal ink containing an amide solvent,
(6) The constituent component of the metal particles is a metal ink that is at least one selected from copper, silver, gold, nickel, palladium and platinum,
(7) A method for producing a metal-containing film, wherein the metal ink according to any one of (1) to (6) is printed or coated on a substrate.
(8) A method for producing a metal-containing film in which the metal ink according to any one of (1) to (6) is printed or coated on a substrate and then heat-treated at a temperature of 200 ° C. or lower.
(9) A decorative film produced using the metal ink according to any one of (1) to (6),
(10) A decorative film having a coating film with a specular gloss of 400 or more measured under conditions of an incident angle and a reflection angle of 20 degrees in a spectrocolorimeter,
(11) An electrode and a wiring pattern produced using the metal ink according to any one of (1) to (6),
(12) A component having the decorative film, electrode, or wiring pattern according to any one of (9) to (11).
本発明の金属インキは、ポリエーテルと密着性付与剤の両者を配合することにより、加熱処理を行わない場合でも、また、加熱処理を行った場合は更に、ごく少量の添加でも基材との密着性が良好となり、平滑性や金属光沢等の仕上がり外観にも優れた金属膜が得られる。また、特に樹脂やガラスなどの低耐熱性材料を基材として用いる場合でも密着性が良く、剥離等の欠陥が生じ難い。このため、金属膜の表面欠陥や脱落、欠損などによる不良品が生じ難く、電気的導通を確保する材料、あるいは帯電防止、電磁波遮蔽又は金属光沢を付与する材料などに信頼性良く用いられるほか、特に、金属膜の導電性を活用したプリント配線基板等の微細電極及び回路配線パターンの形成、金属膜の鏡面を活用した意匠・装飾用途に用いられる。
また、本発明の金属インキは、粘度付与剤であるポリエーテルの量を適宜調整することで、種々の印刷方法、塗装方法に適した粘度の範囲に調整することができ、汎用の印刷機、塗装機を用いて、印刷ムラ、塗装ムラを生ずることなく基材に印刷又は塗装することができる。
Even if the heat treatment is not performed by adding both the polyether and the adhesion-imparting agent, the metal ink according to the present invention can be added to the base material even if a very small amount is added. Adhesiveness is improved, and a metal film excellent in finished appearance such as smoothness and metallic luster can be obtained. In particular, even when a low heat resistant material such as resin or glass is used as a base material, adhesion is good and defects such as peeling are unlikely to occur. For this reason, it is difficult to produce defective products due to surface defects, dropouts, defects, etc. of the metal film, and it is used reliably for materials that ensure electrical continuity, or materials that provide antistatic, electromagnetic shielding or metallic luster, etc. In particular, it is used for the formation of fine electrodes such as printed wiring boards and circuit wiring patterns utilizing the conductivity of metal films, and for design and decoration applications utilizing the mirror surface of metal films.
Moreover, the metal ink of the present invention can be adjusted to a range of viscosity suitable for various printing methods and coating methods by appropriately adjusting the amount of the polyether as a viscosity-imparting agent. Using a coating machine, printing or coating can be performed on a substrate without causing printing unevenness and coating unevenness.
本発明の金属インキは、一般にコーティング剤、塗料、ペースト、インク、分散液などと称される組成物を包含し、少なくとも(1)金属粒子と、(2)溶媒と、(3)前記の金属粒子100重量部に対して0.5〜20重量部のポリエーテルと、(4)前記の金属粒子100重量部に対して0.1〜20重量部の密着性付与剤とを少なくとも含み、さらに(3)と(4)との合量を金属粒子100重量部に対して0.6〜20.5重量部とする。 The metal ink of the present invention includes a composition generally referred to as a coating agent, paint, paste, ink, dispersion, etc., and includes at least (1) metal particles, (2) a solvent, and (3) the metal described above. 0.5 to 20 parts by weight of polyether with respect to 100 parts by weight of particles, and (4) at least 0.1 to 20 parts by weight of an adhesion-imparting agent with respect to 100 parts by weight of the metal particles, The total amount of (3) and (4) is 0.6 to 20.5 parts by weight with respect to 100 parts by weight of the metal particles.
次に、本発明の金属インキに配合する各成分について説明する。
(1)金属粒子
本発明で用いる金属粒子は、その構成成分には特に制限はなく、用途に応じて適宜選択することができる。金属成分としては周期表VIII族(鉄、コバルト、ニッケル、ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金)及びIB族(銅、銀、金)からなる群より選ばれる少なくとも1種であれば、導電性が高いので好ましく、中でも、銅、銀、金、ニッケル、パラジウム及び白金から選ばれる少なくとも一種が鏡面光沢の表面が得られ易いため好ましい。また、銀、金、白金、パラジウム、銅は特に導電性が高くより好ましく、電極、回路配線パターン形成に用いるには、導電性とコストのバランスから銀又は銅が特に好ましい。また、1種の金属であっても、合金にしたり積層したりするなどして2種以上の金属で構成されても良い。なお、金属粒子には、製法上不可避の酸素、異種金属等の不純物を含有していても良く、あるいは、金属粒子の急激な酸化防止のために必要に応じて予め酸素、金属酸化物や有機化合物などが含まれていても良い。
Next, each component mix | blended with the metal ink of this invention is demonstrated.
(1) Metal particles The metal particles used in the present invention are not particularly limited in their constituent components, and can be appropriately selected according to the application. As the metal component, if it is at least one selected from the group consisting of Group VIII (iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium, platinum) and Group IB (copper, silver, gold) as the metal component, It is preferable because it has high conductivity, and among them, at least one selected from copper, silver, gold, nickel, palladium and platinum is preferable because a mirror-glossy surface can be easily obtained. Silver, gold, platinum, palladium, and copper are particularly preferable because of high conductivity, and silver or copper is particularly preferable for use in forming electrodes and circuit wiring patterns because of the balance between conductivity and cost. Moreover, even if it is 1 type of metal, it may be comprised by 2 or more types of metals by making it an alloy or laminating | stacking. The metal particles may contain impurities such as oxygen and foreign metals that are unavoidable in the manufacturing process, or oxygen, metal oxide, and organic in advance as necessary to prevent rapid oxidation of the metal particles. A compound etc. may be contained.
金属粒子の粒子径は、入手し易いことから1nm〜10μm程度の平均粒子径を有する金属粒子を適宜用いるのが好ましく、1nm〜1μm程度の平均粒子径の金属粒子がより好ましく、多方面の用途に用いることができることから1〜100nm程度の平均粒子径を有する金属粒子が更に好ましく、より微細な電極、回路配線パターンや優れた鏡面光沢の表面を得るためには、1〜50nmの範囲の平均粒子径を有する金属粒子を用いるのが更に好ましい。本発明では1種の金属粒子を用いても良いし、2種以上の金属粒子を混合して用いても良く、例えば平均粒子径が異なる2種以上の金属粒子、構成成分が異なる2種以上の金属粒子を混合して用いても良い。金属粒子の平均粒子径は、電子顕微鏡写真より1000個の粒子それぞれの粒子径を測定し、個数平均を算出して求める。 Since the particle size of the metal particles is easily available, it is preferable to appropriately use metal particles having an average particle size of about 1 nm to 10 μm, more preferably metal particles having an average particle size of about 1 nm to 1 μm, and various uses. Metal particles having an average particle diameter of about 1 to 100 nm are more preferable, and in order to obtain finer electrodes, circuit wiring patterns and excellent specular gloss surfaces, the average in the range of 1 to 50 nm More preferably, metal particles having a particle size are used. In the present invention, one kind of metal particles may be used, or two or more kinds of metal particles may be mixed and used. For example, two or more kinds of metal particles having different average particle diameters, two or more kinds having different constituent components. These metal particles may be mixed and used. The average particle size of the metal particles is determined by measuring the particle size of each of 1000 particles from an electron micrograph and calculating the number average.
金属粒子は、公知の方法を用いて製造することができ、例えば、(1)金属を真空中で蒸発させて、気相中から金属粒子を凝結させる方法、(2)金属化合物溶液に還元剤を添加して、液相中から金属粒子を析出させる方法などを用いることができ、(2)の方法では廉価に金属粒子が得られるため、より好ましい方法である。(2)の方法において、金属粒子を製造するための原料である金属化合物は、例えば、前記金属の塩化物、硫酸塩、硝酸塩、炭酸塩、酸化物等を用いることができる。金属化合物を溶解する媒液には、水又はアルコール等の有機溶媒、あるいはこれら2種以上の混合溶媒を用いることができる。金属化合物の媒液中の濃度は、金属化合物が溶解する範囲であれば特に制約はないが、工業的には5ミリモル/リットル以上とすることが好ましい。金属化合物が水に難溶のものであれば、金属成分と可溶性の錯体を形成する化合物を加えて用いることもできる。 The metal particles can be produced using a known method. For example, (1) a method in which a metal is evaporated in a vacuum to condense the metal particles from a gas phase, and (2) a reducing agent is added to the metal compound solution. Can be used, and metal particles can be precipitated from the liquid phase. The method (2) is more preferable because the metal particles can be obtained at a low cost. In the method (2), as the metal compound that is a raw material for producing metal particles, for example, the metal chloride, sulfate, nitrate, carbonate, oxide, and the like can be used. An organic solvent such as water or alcohol, or a mixed solvent of two or more of these can be used for the medium for dissolving the metal compound. The concentration of the metal compound in the liquid medium is not particularly limited as long as the metal compound can be dissolved, but is preferably 5 mmol / liter or more industrially. If the metal compound is hardly soluble in water, a compound that forms a soluble complex with the metal component can be added and used.
液相での反応に用いる還元剤としては公知のものを用いることができ、例えば、(1)ヒドラジン又はその水和物、(2)ヒドラジン系化合物(例えば、塩酸ヒドラジン、硫酸ヒドラジン等)、(3)アルデヒド類((a)脂肪族アルデヒド類(例えば、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ブチルアルデヒド、イソブチルアルデヒド等)、(b)芳香族アルデヒド類(例えば、ベンズアルデヒド等)、(c)複素環式アルデヒド類等)、(4)アミン類((a)1級アミン類(例えば、ブチルアミン、エチルアミン、プロピルアミン、エチレンジアミン等)、(b)2級アミン類(例えば、ジブチルアミン、ジエチルアミン、ジプロピルアミン等)、(c)3級アミン類(例えば、トリブチルアミン、トリエチルアミン、トリプロピルアミン等)等)、(5)アミノアルデヒド類(例えば、アミノアセトアルデヒド等)、(6)アルカノールアミン類(例えば、エタノールアミン、ジエタノールアミン、トリエタノールアミン等)、(7)還元糖(例えば、ショ糖、トレパース、マルトース、ラクトース等)、(8)水素化合物(例えば、水素化ホウ素ナトリウム等)、(9)低次無機酸素酸(例えば、亜硫酸、亜硝酸、次亜硝酸、亜リン酸、次亜リン酸等)及びその水化物(例えば、亜硫酸水素)又はそれらの塩(例えば、ナトリウム等のアルカリ金属塩)等が挙げられ、これらを1種又は2種以上を用いても良い。 As the reducing agent used in the reaction in the liquid phase, known ones can be used. For example, (1) hydrazine or a hydrate thereof, (2) hydrazine compounds (for example, hydrazine hydrochloride, hydrazine sulfate, etc.), ( 3) Aldehydes ((a) aliphatic aldehydes (eg, formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isobutyraldehyde, etc.), (b) aromatic aldehydes (eg, benzaldehyde, etc.), (c) heterocyclic Aldehydes), (4) amines ((a) primary amines (eg, butylamine, ethylamine, propylamine, ethylenediamine), (b) secondary amines (eg, dibutylamine, diethylamine, dipropylamine) Etc.), (c) tertiary amines (for example, tributylamine, triethyl) (5) aminoaldehydes (for example, aminoacetaldehyde), (6) alkanolamines (for example, ethanolamine, diethanolamine, triethanolamine, etc.), (7) reducing sugar ( (E.g., sucrose, treperth, maltose, lactose, etc.), (8) hydrogen compounds (e.g., sodium borohydride, etc.), (9) low-order inorganic oxygen acids (e.g., sulfurous acid, nitrous acid, hyponitrous acid, phosphorous) Acid, hypophosphorous acid, etc.) and hydrates thereof (for example, hydrogen sulfite) or salts thereof (for example, alkali metal salts such as sodium), etc., and these may be used alone or in combination. .
還元反応は任意の温度で行うことができ、水性媒液中で行う場合には、5〜90℃の範囲の温度であれば、反応が進み易いので好ましい。還元剤の添加量は金属に還元できる範囲であれば適宜設定することができ、金属化合物1モルに対して、0.2〜50モルであることが好ましい。添加量が0.2モル未満では還元反応が十分に進行し難いため好ましくなく、50モルを超えると生成した金属粒子の分散が不安定になり易いため好ましくない。 The reduction reaction can be carried out at any temperature, and when carried out in an aqueous medium, a temperature in the range of 5 to 90 ° C. is preferred because the reaction can proceed easily. The addition amount of the reducing agent can be appropriately set as long as it can be reduced to a metal, and is preferably 0.2 to 50 mol with respect to 1 mol of the metal compound. If the addition amount is less than 0.2 mol, it is not preferable because the reduction reaction does not proceed sufficiently, and if it exceeds 50 mol, the dispersion of the generated metal particles tends to become unstable, which is not preferable.
金属化合物と還元剤の混合液のpHを8〜14の範囲に調整すると、金属化合物が媒液中に均一に分散し、還元反応が生じ易いので好ましい。更に好ましいpHの範囲は8〜13であり、8〜12であれば一層好ましい。具体的には、例えば、金属化合物を含む媒液のpHを調整した後、金属化合物を還元しても良く、あるいは、還元剤を混合した後、pHを調整しても良い。pH調整には、例えば、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム等のアルカリ金属又はアルカリ土類金属の水酸化物や炭酸塩、アンモニア等のアンモニウム化合物、アミン類等の塩基性化合物を用いることができる。このようにして得られた金属粒子は、媒液のpHを5以下にすると容易に凝集するので、吸引ろ過、沈降分離等の比較的簡単な操作でろ別できる。より好ましいpHの範囲は0〜5である。ろ別した金属コロイド粒子は常法により洗浄することができ、可溶性塩類や残存する還元剤を十分に除去できる。pH調整には、例えば、塩酸、硫酸、硝酸等の無機酸、ギ酸、酢酸、プロピオン酸等の有機酸等の酸性化合物を用いることができる。 It is preferable to adjust the pH of the mixed solution of the metal compound and the reducing agent to a range of 8 to 14 because the metal compound is uniformly dispersed in the medium and a reduction reaction is likely to occur. A more preferable pH range is 8 to 13, and 8 to 12 is more preferable. Specifically, for example, after adjusting the pH of the liquid medium containing the metal compound, the metal compound may be reduced, or after mixing the reducing agent, the pH may be adjusted. For pH adjustment, for example, a basic compound such as an alkali metal or alkaline earth metal hydroxide or carbonate such as sodium hydroxide, potassium hydroxide or calcium hydroxide, an ammonium compound such as ammonia, or an amine is used. be able to. Since the metal particles obtained in this way easily aggregate when the pH of the liquid medium is 5 or less, they can be separated by a relatively simple operation such as suction filtration or sedimentation separation. A more preferable pH range is 0-5. The colloidal metal colloid particles can be washed by a conventional method, and soluble salts and remaining reducing agent can be sufficiently removed. For pH adjustment, for example, an inorganic compound such as hydrochloric acid, sulfuric acid or nitric acid, or an acidic compound such as organic acid such as formic acid, acetic acid or propionic acid can be used.
前記の金属粒子の表面には、硫黄、窒素、リンから選ばれる少なくとも1種の元素を含む化合物(以下、配位化合物と記載することもある)を存在させるのが好ましい。硫黄、窒素、リンのそれぞれの元素は金属粒子の表面に配位し化学結合するため、硫黄、窒素、リンの元素を含む化合物は、これらの元素を介して金属粒子の表面に配位する。これらの元素の中でも硫黄が金属粒子との化学結合力が強いので好ましい。 A compound containing at least one element selected from sulfur, nitrogen, and phosphorus (hereinafter sometimes referred to as a coordination compound) is preferably present on the surface of the metal particles. Since each element of sulfur, nitrogen, and phosphorus is coordinated and chemically bonded to the surface of the metal particle, the compound containing the elements of sulfur, nitrogen, and phosphorus is coordinated to the surface of the metal particle through these elements. Among these elements, sulfur is preferable because it has a strong chemical bonding force with metal particles.
硫黄化合物としては例えば、(a)メルカプトカルボン酸類(例えば、メルカプトプロピオン酸、メルカプト酢酸、チオジプロピオン酸、メルカプトコハク酸、ジメルカプトコハク酸、チオ酢酸、チオジグリコール酸等)、(b)チオグリコール類(例えば、メルカプトエタノール、チオジエチレングリコール等)、(c)アミノチオール類(アミノエチルメルカプタン、チオジエチルアミン等)、(d)チオアミド類(例えば、チオホルムアミド等)、(e)含硫黄アミノ酸類(例えば、システイン、メチオニン等)が挙げられる。中でも、メルカプトプロピオン酸、メルカプト酢酸、チオジプロピオン酸、メルカプトコハク酸、メルカプトエタノール、チオジエチレングリコール、チオジグリコール酸、アミノエチルメルカプタン、チオジエチルアミンから選ばれる少なくとも1種が好ましく、特にメルカプトプロピオン酸、メルカプト酢酸、メルカプトエタノールは、金属粒子、とりわけ金属コロイド粒子に分散安定性を付与する効果が高くより好ましい。 Examples of the sulfur compound include (a) mercaptocarboxylic acids (eg, mercaptopropionic acid, mercaptoacetic acid, thiodipropionic acid, mercaptosuccinic acid, dimercaptosuccinic acid, thioacetic acid, thiodiglycolic acid, etc.), (b) thio Glycols (eg, mercaptoethanol, thiodiethylene glycol, etc.), (c) aminothiols (aminoethyl mercaptan, thiodiethylamine, etc.), (d) thioamides (eg, thioformamide, etc.), (e) sulfur-containing amino acids ( For example, cysteine, methionine, etc.). Among them, at least one selected from mercaptopropionic acid, mercaptoacetic acid, thiodipropionic acid, mercaptosuccinic acid, mercaptoethanol, thiodiethylene glycol, thiodiglycolic acid, aminoethyl mercaptan, and thiodiethylamine is preferable, and mercaptopropionic acid, mercapto Acetic acid and mercaptoethanol are more preferred because they are effective in imparting dispersion stability to metal particles, particularly metal colloid particles.
また、窒素化合物としては、(a)アミノ酸類(例えば、グリシン、アラニン等の中性アミノ酸類、ヒスチジン、アルギニン等の塩基性アミノ酸類、アスパラギン酸、グルタミン酸等の酸性アミノ酸類)、(b)アミノポリカルボン酸類(例えば、エチレンジアミンテトラ酢酸(EDTA)、ニトリロトリ酢酸(NTA)、イミノジ酢酸(IDA)、エチレンジアミンジ酢酸(EDDA)、エチレングリコールジエチルエーテルジアミンテトラ酢酸(GEDA)等)、(c)アルカノールアミン類(例えば、エタノールアミン、ジエタノールアミン、トリエタノールアミン等)、(d)アミン類(エチレンジアミン、ジエチレントリアミン、トリアミノトリエチルアミン等)が挙げられる。 Examples of nitrogen compounds include (a) amino acids (for example, neutral amino acids such as glycine and alanine, basic amino acids such as histidine and arginine, and acidic amino acids such as aspartic acid and glutamic acid), (b) amino Polycarboxylic acids (for example, ethylenediaminetetraacetic acid (EDTA), nitrilotriacetic acid (NTA), iminodiacetic acid (IDA), ethylenediaminediacetic acid (EDDA), ethylene glycol diethyl etherdiaminetetraacetic acid (GEDA), etc.), (c) alkanolamine (For example, ethanolamine, diethanolamine, triethanolamine, etc.) and (d) amines (ethylenediamine, diethylenetriamine, triaminotriethylamine, etc.).
また、リン化合物としては、アルキルホスフィン(−PR3:Rはアルキル基)などが挙げられる。
更に、金属粒子の表面には保護コロイドが存在しても良い。
保護コロイドとしては、例えば、ゼラチン、アラビアゴム、カゼイン、カゼイン酸ソーダ、カゼイン酸アンモニウム等のタンパク質系、デンプン、デキストリン、寒天、アルギン酸ソーダ等の天然高分子や、ヒドロキシエチルセルロース、カルボキシメチルセルロース、メチルセルロース、エチルセルロース等のセルロース系、ポリビニルアルコール、ポリビニルピロリドン等のビニル系、ポリアクリル酸ソーダ、ポリアクリル酸アンモニウム等のアクリル酸系、ステアリン酸等の高級脂肪酸、ポリエチレングリコール等の合成高分子、クエン酸等の多価カルボン酸、アニリン又はそれらの誘導体等が挙げられ、これらを1種又は2種以上を用いても良い。高分子の保護コロイドは分散安定化の効果が高いので、これを用いるのが好ましく、水系媒液中で反応させる場合、水溶性のものを用いるのが好ましく、特にゼラチン、ポリビニルアルコール、ポリビニルピロリドン、ポリエチレングリコールが好ましい。なかでも、石灰処理ゼラチンは金属粒子の分散能力と酸化防止力が高いため好ましい。
As the phosphorus compound, an alkyl phosphine (-PR 3: R is an alkyl group).
Furthermore, a protective colloid may be present on the surface of the metal particles.
Examples of protective colloids include protein systems such as gelatin, gum arabic, casein, sodium caseinate, ammonium caseinate, natural polymers such as starch, dextrin, agar, sodium alginate, hydroxyethylcellulose, carboxymethylcellulose, methylcellulose, and ethylcellulose. Cellulose type such as polyvinyl alcohol, vinyl type such as polyvinyl alcohol, polyvinyl pyrrolidone, acrylic acid type such as sodium polyacrylate and ammonium polyacrylate, higher fatty acid such as stearic acid, synthetic polymer such as polyethylene glycol, and many such as citric acid Examples thereof include monovalent carboxylic acids, anilines or derivatives thereof, and one or more of these may be used. Since the protective colloid of a polymer has a high effect of dispersion stabilization, it is preferable to use this, and when reacting in an aqueous medium, it is preferable to use a water-soluble one, particularly gelatin, polyvinyl alcohol, polyvinyl pyrrolidone, Polyethylene glycol is preferred. Of these, lime-processed gelatin is preferable because of its high metal particle dispersion ability and antioxidant ability.
金属粒子の表面に、前記の配位化合物又は保護コロイド(以降、「配位化合物等」と記載することもある)を予め化学結合させるには、金属粒子を分散した媒液中に配位化合物等を添加し混合するか、あるいは、前記の金属化合物と還元剤とを液相中で反応させる際に配位化合物等を存在させても製造することができる。後者の方法では還元反応の際に前記の配位化合物等が存在しており、より高度に分散した金属粒子が得られ、特に微細な金属コロイド粒子が得られるため好ましい方法である。このことから、金属化合物と配位化合物等とを媒液に溶解した溶液と還元剤とを混合して還元する方法、金属化合物と配位化合物等とを媒液に溶解した溶液に還元剤を添加して還元する方法などがより好ましい方法である。
配位化合物等は金属粒子100重量部に対し、0.1〜15重量部程度の範囲で存在していれば、所望の効果が得られるので好ましく、更に好ましい範囲は0.1〜10重量部程度である。なお、保護コロイドを用いる場合、密着性付与剤と同種であっても、添加する工程の違いから機能も異なるため、密着性付与剤の量には加算しない。
In order to chemically bond the coordination compound or protective colloid (hereinafter sometimes referred to as “coordination compound etc.”) to the surface of the metal particles in advance, the coordination compound is dispersed in a liquid medium in which the metal particles are dispersed. Or the like, or when a metal compound and a reducing agent are reacted in a liquid phase, a coordination compound or the like is present. The latter method is a preferable method because the above-mentioned coordination compound and the like are present in the reduction reaction, and highly dispersed metal particles can be obtained, and particularly fine metal colloidal particles can be obtained. From this, a method of reducing by mixing a reducing agent with a solution in which a metal compound and a coordination compound are dissolved in a medium, a reducing agent is added to a solution in which a metal compound and a coordination compound are dissolved in a medium. A method of adding and reducing is a more preferable method.
A coordination compound or the like is preferably present in a range of about 0.1 to 15 parts by weight with respect to 100 parts by weight of the metal particles because a desired effect can be obtained, and a more preferable range is 0.1 to 10 parts by weight. Degree. In addition, when using a protective colloid, even if it is the same kind as an adhesive imparting agent, since the function is different due to the difference in the step of addition, it is not added to the amount of the adhesive imparting agent.
(2)溶媒
金属インキに配合する溶媒は、水及び/又は有機溶媒を用いることができる。有機溶媒には、通常使用される有機溶媒を適宜選択して用いることができる。有機溶媒としては、具体的にはトルエン、キシレン、ソルベントナフサ、ノルマルヘキサン、イソヘキサン、シクロヘキサン、メチルシクロヘキサン、ノルマルヘプタン、トリデカン、テトラデカン、ペンタデカン等の炭化水素系溶媒、メタノール、エタノール、ブタノール、IPA(イソプロピルアルコール)、ノルマルプロピルアルコール、2−ブタノール、TBA(ターシャリーブタノール)、ブタンジオール、エチルヘキサノール、ベンジルアルコール、テルピネオール(沸点:217〜218℃)、ジヒドロテルピネオール(沸点:約200℃)等のアルコール系溶媒、アセトン、メチルエチルケトン、メチルイソブチルケトン、DIBK(ジイソブチルケトン)、シクロヘキサノン、DAA(ジアセトンアルコール)等のケトン系溶媒、酢酸エチル、酢酸ブチル、酢酸メトキシブチル、酢酸セロソルブ、酢酸アミル、酢酸ノルマルプロピル、酢酸イソプロピル、乳酸メチル、乳酸エチル、乳酸ブチル等のエステル系容媒、メチルセロソルブ、セロソルブ、ブチルセロソルブ、ジオキサン、MTBE(メチルターシャリーブチルエーテル)、ブチルカルビトール(沸点:230.6℃)等のエーテル系溶媒、エチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコール等のグリコール系溶媒、ジエチレングリコールモノメチルエーテル(沸点:194℃)、トリエチレングリコールモノメチルエーテル(沸点:249℃)、ジプロピレングリコールモノメチルエーテル(沸点:189〜190℃)、3−メトキシ−3−メチル−1−ブタノール等のグリコールエーテル系溶媒、エチレングリコールモノメチルエーテルアセテート、PMA(プロピレングリコールモノメチルエーテルアセテート)、ジエチレングリコールモノエチルエーテルアセテート(沸点:217.4℃)、ジエチレングリコールモノブチルエーテルアセテート(沸点:246.8℃)等のグリコールエステル系溶媒、ホルムアミド(沸点:210℃)、N−メチルホルムアミド(沸点:197℃)、N,N−ジメチルホルムアミド(沸点:197℃)、アセトアミド、N−メチルアセトアミド(沸点:205℃)、N,N−ジメチルアセトアミド、N−メチルプロピオンアミド、N−メチルピロリドン(沸点:202℃)、1,3−ジメチル−2−イミダゾリジノン(沸点:226℃)、フルフラール(沸点:161℃)等のアミド系溶媒から選ばれる少なくとも1種を用いることができる。本発明では、エーテル系溶媒、グリコールエステル系溶媒、アミド系溶媒から選ばれる1種が好ましく、アミド系溶媒がより好ましい。また、有機溶媒の沸点に関して、比較的高い沸点を有するものが好ましく、沸点が185〜250℃のものがより好ましく、200〜250℃のものが更に好ましい。
(2) Solvent Water and / or an organic solvent can be used for the solvent mix | blended with metal ink. As the organic solvent, a commonly used organic solvent can be appropriately selected and used. Specific examples of the organic solvent include toluene, xylene, solvent naphtha, normal hexane, isohexane, cyclohexane, methylcyclohexane, normal heptane, tridecane, tetradecane, pentadecane and other hydrocarbon solvents, methanol, ethanol, butanol, IPA (isopropyl). Alcohols such as alcohol), normal propyl alcohol, 2-butanol, TBA (tertiary butanol), butanediol, ethylhexanol, benzyl alcohol, terpineol (boiling point: 217-218 ° C), dihydroterpineol (boiling point: about 200 ° C) Ketones such as solvents, acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, DAA (diacetone alcohol) Solvent, ethyl acetate, butyl acetate, methoxybutyl acetate, cellosolve acetate, amyl acetate, normal propyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, butyl lactate, and other ester solvents, methyl cellosolve, cellosolve, butyl cellosolve, dioxane, MTBE (Methyl tertiary butyl ether), ether solvents such as butyl carbitol (boiling point: 230.6 ° C), glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, diethylene glycol monomethyl ether (boiling point: 194 ° C) , Triethylene glycol monomethyl ether (boiling point: 249 ° C), dipropylene glycol monomethyl ether (boiling point: 189-190 ° C), 3-methoxy-3-methyl-1-buta Glycol ether solvents such as ethylene glycol monomethyl ether acetate, PMA (propylene glycol monomethyl ether acetate), diethylene glycol monoethyl ether acetate (boiling point: 217.4 ° C), diethylene glycol monobutyl ether acetate (boiling point: 246.8 ° C) Glycol ester solvents such as formamide (boiling point: 210 ° C), N-methylformamide (boiling point: 197 ° C), N, N-dimethylformamide (boiling point: 197 ° C), acetamide, N-methylacetamide (boiling point: 205 ° C) ), N, N-dimethylacetamide, N-methylpropionamide, N-methylpyrrolidone (boiling point: 202 ° C.), 1,3-dimethyl-2-imidazolidinone (boiling point: 226 ° C.), furfural (boiling point) : 161 ° C.) of at least one selected from an amide solvent or the like can be used. In the present invention, one selected from ether solvents, glycol ester solvents and amide solvents is preferred, and amide solvents are more preferred. Moreover, what has a comparatively high boiling point is preferable regarding the boiling point of an organic solvent, a thing with a boiling point of 185-250 degreeC is more preferable, and a thing with 200-250 degreeC is still more preferable.
(3)ポリエーテル
ポリエーテルは金属インキの粘度を増粘させるためのものである。
ポリエーテルは、主鎖にエーテル結合−R−O−R−をもつ線状高分子であり、繰り返し単位が炭素数2〜6のアルキレン基であることが好ましい。このようなポリエーテルとしてはポリエチレンオキシド、ポリエチレングリコール、ポリプロピレンオキシド、ポリプロピレングリコール、ポリブチレングリコールなどが挙げられ、ポリエチレンオキシド、ポリエチレングリコールが添加効果が高いためより好ましい。また、ポリエーテルは、2元以上のポリエーテルコポリマーやポリエーテルブロックコポリマーであってもよい。例えば、エチレングリコール/プロピレングリコール、エチレングリコール/ブチレングリコールの2元コポリマー、エチレングリコール/プロピレングリコール/エチレングリコール、プロピレングリコール/エチレングリコール/プロピレングリコール、エチレングリコール/ブチレングリコール/エチレングリコールなどの直鎖状の3元コポリマーが挙げられる。また、ブロックコポリマーとしては、ポリエチレングリコールポリプロピレングリコール、ポリエチレングリコールポリブチレングリコールのような2元ブロックコポリマー、ポリエチレングリコールポリプロピレングリコールポリエチレングリコール、ポリプロピレングリコールポリエチレングリコールポリプロピレングリコール、ポリエチレングリコールポリブチレングリコールポリエチレングリコールのような3元ブロックコポリマーなどが挙げられる。
(3) Polyether Polyether is for increasing the viscosity of the metal ink.
The polyether is a linear polymer having an ether bond —R—O—R— in the main chain, and the repeating unit is preferably an alkylene group having 2 to 6 carbon atoms. Examples of such polyethers include polyethylene oxide, polyethylene glycol, polypropylene oxide, polypropylene glycol, polybutylene glycol, and the like. Polyethylene oxide and polyethylene glycol are more preferable because of their high additive effect. Further, the polyether may be a binary copolymer or polyether block copolymer. For example, ethylene glycol / propylene glycol, ethylene glycol / butylene glycol binary copolymer, ethylene glycol / propylene glycol / ethylene glycol, propylene glycol / ethylene glycol / propylene glycol, ethylene glycol / butylene glycol / ethylene glycol, etc. Ternary copolymers are mentioned. The block copolymer includes binary block copolymers such as polyethylene glycol polypropylene glycol and polyethylene glycol polybutylene glycol, polyethylene glycol polypropylene glycol polyethylene glycol, polypropylene glycol polyethylene glycol polypropylene glycol, polyethylene glycol polybutylene glycol polyethylene glycol 3 and the like. For example, original block copolymer may be used.
また、ポリエーテルは、その化学構造にもよるが、粘度平均分子量が100,000〜5,000,000程度が好ましい。粘度平均分子量が100,000より小さいと、単位添加重量部あたりの増粘効果が小さく、20重量部を超えて添加する必要があり、膜の鏡面光沢、導電性等の特性が低下し易くなる。一方、粘度平均分子量が5,000,000より大きいと、インキの製造時や、印刷、塗装時の取り扱いが困難になる。より好ましくは100,000〜4,000,000の範囲であり、さらに好ましくは、500,000〜3,000,000の範囲である。
粘度平均分子量Mvは、温度30℃のポリエチレンオキシド水溶液の極限粘度数ηを求め、式:η=K・Mvαにより求めることができる。極限粘度数ηの測定方法は「JIS K7367-3 1999」に規定されている。
Moreover, although a polyether is based also on the chemical structure, its viscosity average molecular weight is preferable about 100,000-5,000,000. When the viscosity average molecular weight is less than 100,000, the effect of thickening per unit added weight part is small, and it is necessary to add more than 20 parts by weight, and the characteristics such as mirror gloss and conductivity of the film are likely to be deteriorated. . On the other hand, if the viscosity average molecular weight is larger than 5,000,000, handling during ink production, printing and painting becomes difficult. More preferably, it is the range of 100,000-4,000,000, More preferably, it is the range of 500,000-3,000,000.
The viscosity average molecular weight Mv can be determined by calculating the intrinsic viscosity number η of a polyethylene oxide aqueous solution at a temperature of 30 ° C., and using the formula: η = K · Mv α . The measuring method of the intrinsic viscosity η is defined in “JIS K7367-3 1999”.
(4)密着性付与剤
密着性付与剤は、金属粒子と基材との密着性を向上させるためのものであり、バインダー作用のあるポリマーなどの密着性を付与する効果を有するものであればいずれのものでも使用できる。
(4) Adhesion imparting agent
The adhesion-imparting agent is for improving the adhesion between the metal particles and the base material, and any one can be used as long as it has an effect of imparting adhesion such as a polymer having a binder action.
本発明の配合量の範囲で良好な効果を有する密着性付与剤としては、CO二重結合を単位構造に持つポリマーが好ましく、具体的にはポリエステル、蛋白質、ポリケトン、ポリアミド等を用いることができる。
ポリエステルは主鎖にエステル結合−CO−O−をもつ高分子であり、多価カルボン酸(ジカルボン酸)とポリアルコール(ジオール)との重縮合体であるポリエステル樹脂や、ポリエステル樹脂にポリアルキレングリコール、ジカルボン酸等を共重合した共重合ポリエステル、ポリエステル樹脂とビニル重合性モノマーを反応させたビニル変性、エポキシ化合物によるエポキシ樹脂変性、又はイソシアネート化合物でウレタン変性した変性ポリエステルや、芳香族ジカルボン酸と炭素数2〜6の脂肪族ジオールとを反応させたポリエステルジオールなどを用いることができる。
蛋白質はペプチド結合−CO−NH−をもつ高分子であり、蛋白質を更に加水分解した生成物を含む。具体的にはゼラチンやゼラチンを更に加水分解した生成物、アラビアゴム、カゼイン、カゼイン酸ソーダ、カゼイン酸アンモニウム等を用いることができる。
ポリケトンはケトン基をもつオレフィンと一酸化炭素の共重合体であり、エチレン−一酸化炭素共重合体、エチレン−プロピレン−一酸化炭素共重合体等を用いることができる。
ポリアミドは、アミド結合−CO−NH−の繰り返しによって主鎖が構成される線状高分子であり、ナイロン6のような脂肪族ポリアミド、ケブラー(登録商標)のような芳香族ポリアミド等を用いることができる。
As the adhesion-imparting agent having a good effect in the range of the blending amount of the present invention, a polymer having a CO double bond in the unit structure is preferable, and specifically, polyester, protein, polyketone, polyamide and the like can be used. .
Polyester is a polymer having an ester bond —CO—O— in the main chain, and is a polycondensate of polycarboxylic acid (dicarboxylic acid) and polyalcohol (diol), or polyalkylene glycol in the polyester resin. , Copolyesters copolymerized with dicarboxylic acids, etc., vinyl modified by reacting polyester resins with vinyl polymerizable monomers, epoxy resins modified with epoxy compounds, or urethane modified with isocyanate compounds, aromatic dicarboxylic acids and carbon The polyester diol etc. which reacted with the aliphatic diol of several 2-6 can be used.
A protein is a polymer having a peptide bond —CO—NH—, and includes a product obtained by further hydrolyzing the protein. Specifically, gelatin, a product obtained by further hydrolyzing gelatin, gum arabic, casein, sodium caseinate, ammonium caseinate and the like can be used.
The polyketone is a copolymer of an olefin having a ketone group and carbon monoxide, and an ethylene-carbon monoxide copolymer, an ethylene-propylene-carbon monoxide copolymer, or the like can be used.
Polyamide is a linear polymer whose main chain is composed of repeating amide bonds —CO—NH—, and uses an aliphatic polyamide such as nylon 6 or an aromatic polyamide such as Kevlar (registered trademark). Can do.
密着性付与剤は、ポリエステル、蛋白質から選ばれる少なくとも一種が好ましく、ポリエステルがより好ましい。
ポリエステルを用いると、要因は不明であるが、粘度付与剤であるポリエーテルと組み合わされることで、密着性付与効果が著しく高まるため好ましい。具体的には、東洋紡株式会社製バイロン、バイロナール等の共重合ポリエステル樹脂を挙げることができる。
The adhesiveness imparting agent is preferably at least one selected from polyester and protein, and more preferably polyester.
When polyester is used, the factor is unknown, but it is preferable to combine with a polyether as a viscosity-imparting agent because the adhesion-imparting effect is remarkably enhanced. Specific examples include copolymer polyester resins such as Byron and Byronal manufactured by Toyobo Co., Ltd.
(5)その他の成分
本発明の金属インキには、その他の成分として、架橋剤、表面調整剤(レベリング剤)、消泡剤、界面活性剤、高分子分散剤、非界面活性型分散剤、硬化性樹脂、可塑剤、防カビ剤等の添加剤を、必要に応じて適宜配合することもできる。
(5) Other components In the metal ink of the present invention, as other components, a crosslinking agent, a surface conditioner (leveling agent), an antifoaming agent, a surfactant, a polymer dispersant, a non-surface active dispersant, Additives such as a curable resin, a plasticizer, and an antifungal agent can be appropriately blended as necessary.
架橋剤は、膜を作製した際に架橋反応を行い得るものであって、基材との密着性がより一層向上するため必要に応じて配合することができる。架橋剤としては、オキサゾリン基(−CONC2)、カルボジイミド基(−N=C=N−)、ブロックイソシアネート基、エポキシ基(−COC)、カルボニル基(−C=O)等から選ばれる少なくとも1種の活性基を持つ架橋剤が好ましい。また、架橋剤としてメラミン、メラミン誘導体から選ばれる1種の化合物も用いることができる。具体的には、オキサゾリン系架橋剤としては、2、2’−ビス(2オキサゾリン)、2、2’−メチレン−ビス(2オキサゾリン)、2、2’−エチレン−ビス(4、4’ジメチル−2オキサゾリン)、2、2’−フェニレン−ビス(2オキサゾリン)、ビス(2−オキサゾリンシクロヘキサノン)スルフィド等が挙げられる。カルボジイミド系架橋剤としては、キシレンジイソシアネート、ヘキサメチレンジイソシアネート、トリレンジイソシアネート、イソホロンジイソシアネート等のジイソシアネート化合物の縮合物が挙げられる。ブロックイソシアネート系架橋剤としては、先に挙げたジイソシアネート化合物のイソシアネート基(−N=C=O)をアルコール系、フェノール系、オキシム系、酸アミド系等のブロック剤でブロックしたものが挙げられる。エポキシ系架橋剤としては、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、1、6−ヘキサンジオールグリシジルエーテル、グリシジルアクリレート等が挙げられる。カルボニル系架橋剤としては、ホルムアルデヒド、グリオキサール、グルタールアルデヒド等のアルデヒド系化合物、ジアセトン、シクロペンタジオン、ダイアセトンアクリルアミド、アジピン酸ヒドラジド、アセトアセトキシエチルメタクリレート、アセト酢酸アリル等のケトン系化合物等が挙げられる。メラミン系架橋剤としては、メラミン、メラミンとホルムアルデヒドを縮合して得られるメチロール化メラミン誘導体、メチロール化メラミンに低級アルコールを反応させて部分的あるいは完全にエーテル化した化合物、及びこれらの混合物が挙げられる。これらの活性基は1種の架橋剤中に1種又は2種以上含まれていても良く、異なる活性基を有する架橋剤を2種以上用いることも、同種の活性基を有する異種の架橋剤を2種以上用いることもできる。 The cross-linking agent can perform a cross-linking reaction when a film is produced, and can be blended as necessary because the adhesion to the substrate is further improved. The crosslinking agent is at least one selected from an oxazoline group (—CONC 2 ), a carbodiimide group (—N═C═N—), a blocked isocyanate group, an epoxy group (—COC), a carbonyl group (—C═O), and the like. Cross-linking agents with some active groups are preferred. Moreover, 1 type of compounds chosen from a melamine and a melamine derivative can also be used as a crosslinking agent. Specifically, as the oxazoline-based crosslinking agent, 2,2′-bis (2oxazoline), 2,2′-methylene-bis (2oxazoline), 2,2′-ethylene-bis (4,4′dimethyl) -2oxazoline), 2,2'-phenylene-bis (2oxazoline), bis (2-oxazolinecyclohexanone) sulfide, and the like. Examples of the carbodiimide-based crosslinking agent include condensates of diisocyanate compounds such as xylene diisocyanate, hexamethylene diisocyanate, tolylene diisocyanate, and isophorone diisocyanate. Examples of the blocked isocyanate crosslinking agent include those obtained by blocking the isocyanate group (—N═C═O) of the above-mentioned diisocyanate compound with a blocking agent such as alcohol, phenol, oxime, or acid amide. Examples of the epoxy-based crosslinking agent include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol glycidyl ether, and glycidyl acrylate. Examples of carbonyl crosslinking agents include aldehyde compounds such as formaldehyde, glyoxal, and glutaraldehyde, ketone compounds such as diacetone, cyclopentadione, diacetone acrylamide, adipic acid hydrazide, acetoacetoxyethyl methacrylate, and allyl acetoacetate. It is done. Examples of the melamine crosslinking agent include melamine, a methylolated melamine derivative obtained by condensing melamine and formaldehyde, a compound partially or completely etherified by reacting a methylolated melamine with a lower alcohol, and a mixture thereof. . These active groups may be contained in one or more kinds of cross-linking agents, and two or more cross-linking agents having different active groups may be used, or different types of cross-linking agents having the same active group. Two or more of these can also be used.
架橋剤を配合する場合には、密着性付与剤にポリエステルを用いると、相互に反応し密着性が更に向上するため好ましく、分子末端に水酸基を持つポリエステルを用いるのがより好ましい。基材にプラスチックフィルム、特にPET(ポリエチレンテレフタレート)やPEN(ポリエチレンナフタレート)などを用いる場合にはより一層効果的である。 When blending a cross-linking agent, it is preferable to use a polyester as the adhesion-imparting agent because it reacts with each other to further improve the adhesion, and it is more preferable to use a polyester having a hydroxyl group at the molecular end. This is even more effective when a plastic film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) is used as the substrate.
表面調整剤は金属インキの表面張力をコントロールして、ハジキ、クレーター等の欠陥を防止するものであり、アクリル系表面調整剤、ビニル系表面調整剤、シリコーン系表面調整剤、フッ素系表面調整剤等が挙げられる。また、消泡剤は、金属インキに配合する各成分を混合する際に生じる気泡の発生量を抑制するためのものであって、シリコーン系消泡剤等を用いることができる。界面活性剤は金属粒子の分散安定性を更に高める作用や、金属インキのレオロジー特性を制御し、塗工性を改良する作用を有するので好ましく、具体的には、第4級アンモニウム塩等のカチオン系、カルボン酸塩、スルホン酸塩、硫酸エステル塩、リン酸エステル塩等のアニオン系、エーテル型、エーテルエステル型、エステル型、含窒素型等のノニオン系等の公知の界面活性剤を用いることができ、高分子分散剤は、金属粒子同士の凝集を抑制するためのものであって、公知のものを用いることができる。これらから選ばれる1種以上を用いることができる。表面調整剤(レベリング剤)、消泡剤、界面活性剤等の配合量は、金属インキ組成に応じて適宜設定することができるが、一般的には金属粒子100重量部に対し、0.01〜0.5重量部程度の範囲が好ましい。 The surface conditioner controls the surface tension of the metal ink to prevent defects such as repellency and crater. Acrylic surface conditioner, vinyl surface conditioner, silicone surface conditioner, fluorine surface conditioner Etc. The antifoaming agent is for suppressing the amount of bubbles generated when the components to be blended in the metal ink are mixed, and a silicone-based antifoaming agent or the like can be used. Surfactants are preferable because they have the effect of further improving the dispersion stability of metal particles and the effect of controlling the rheological properties of metal inks and improving the coating properties. Specifically, cations such as quaternary ammonium salts are preferred. Use of known surfactants such as anion, ether, ether ester, ester, nitrogen-containing nonionics such as carboxylic acid, carboxylate, sulfonate, sulfate ester, phosphate ester, etc. The polymer dispersant is for suppressing aggregation of metal particles, and a known one can be used. One or more selected from these can be used. The blending amount of the surface conditioner (leveling agent), antifoaming agent, surfactant and the like can be appropriately set according to the metal ink composition, but is generally 0.01 with respect to 100 parts by weight of the metal particles. A range of about 0.5 parts by weight is preferred.
本発明の金属インキは、所定量の金属粒子、溶媒、ポリエーテル、密着性付与剤、必要に応じてその他配合物とを公知の方法により混合して、金属粒子を溶媒に分散させる。混合方法としては、例えば、ディスパー等の撹拌機を用いた撹拌混合、ミキサー、サンドミル、コロイドミル等の湿式粉砕混合などの方法を用いることができる。 In the metal ink of the present invention, a predetermined amount of metal particles, a solvent, a polyether, an adhesion-imparting agent, and, if necessary, other blends are mixed by a known method to disperse the metal particles in the solvent. As a mixing method, for example, a method such as stirring and mixing using a stirrer such as a disper, or wet pulverization and mixing such as a mixer, a sand mill, or a colloid mill can be used.
金属インキに配合する金属粒子、ポリエーテル、密着性付与剤、溶媒などの配合量は、用いる印刷機又は塗装機に応じて必要とされるインキ粘度、得られる金属含有膜の性能等に応じて以下のように設定するのが好ましい。 The amount of metal particles, polyether, adhesion promoter, solvent, etc. to be blended in the metal ink depends on the ink viscosity required depending on the printing machine or coating machine used, the performance of the resulting metal-containing film, etc. It is preferable to set as follows.
ポリエーテルは金属インキの粘度を増粘させるためのものであり、含有量を適宜調整することにより、印刷機、塗装機に応じた粘度に調整することができる。金属粒子の量や溶媒の量にも依存するが、ポリエーテルの含有量を多くするとインキ粘度は高くなり使用できる印刷機、塗装機の選定が容易になるものの、金属含有膜の鏡面光沢、導電性等の特性が低下し易くなる。一方、ポリエーテルの含有量を少なくすると金属含有膜の鏡面光沢や導電性等の特性は高くなるものの、インキ粘度が低くなり使用できる印刷機、塗装機の選定が難しくなり易い。このため、ポリエーテルの含有量は、前記の金属粒子100重量部に対して0.5〜20重量部の範囲が重要であり、0.5〜10重量部の範囲が好ましい。 The polyether is used to increase the viscosity of the metal ink, and can be adjusted to a viscosity according to the printing machine or coating machine by appropriately adjusting the content. Although depending on the amount of metal particles and the amount of solvent, increasing the polyether content increases the ink viscosity and makes it easy to select a usable printing machine or coating machine. The characteristics such as properties are likely to deteriorate. On the other hand, if the content of the polyether is reduced, the properties such as mirror gloss and conductivity of the metal-containing film are enhanced, but the ink viscosity is lowered and it is difficult to select a usable printing machine or coating machine. For this reason, the range of 0.5-20 weight part with respect to 100 weight part of said metal particles is important for content of polyether, and the range of 0.5-10 weight part is preferable.
密着性付与剤の含有量も適宜調整することができるが、含有量を多くすると密着性は良くなるものの、金属含有膜の鏡面光沢、導電性等の特性が低下し易い。一方、密着性付与剤の含有量を少なくすると金属含有膜の鏡面光沢や導電性等の特性は高くなるものの、密着性が低くなり易い。このため、密着性付与剤の含有量は金属粒子100重量部に対して0.1〜20重量部の範囲が重要であり、0.1〜6重量部の範囲が好ましい。 The content of the adhesion-imparting agent can also be adjusted as appropriate. However, when the content is increased, the adhesion is improved, but the properties such as mirror gloss and conductivity of the metal-containing film are likely to deteriorate. On the other hand, if the content of the adhesiveness-imparting agent is reduced, the metal-containing film has properties such as specular gloss and conductivity, but the adhesiveness tends to be lowered. For this reason, the range of 0.1-20 weight part is important with respect to 100 weight part of metal particles, and the range of 0.1-6 weight part is preferable with respect to 100 weight part of metal particles.
ポリエーテルと密着性付与剤の合量も適宜調整することができるが、合量を多くしすぎると、金属含有膜の鏡面光沢、導電性等の特性が低下し易い。一方、合量が少なすぎるとポリエーテルと密着性付与剤の密着性に及ぼす相乗効果が認められ難い。このため、ポリエーテルと密着性付与剤の合量は金属粒子100重量部に対して0.6〜20.5重量部の範囲が重要であり、0.6〜10.5重量部の範囲が好ましい。 The total amount of the polyether and the adhesion-imparting agent can be adjusted as appropriate. However, if the total amount is too large, characteristics such as mirror gloss and conductivity of the metal-containing film are likely to deteriorate. On the other hand, if the total amount is too small, it is difficult to recognize a synergistic effect on the adhesion between the polyether and the adhesion-imparting agent. For this reason, the total amount of the polyether and the adhesion-imparting agent is important in the range of 0.6 to 20.5 parts by weight with respect to 100 parts by weight of the metal particles, and the range of 0.6 to 10.5 parts by weight. preferable.
架橋剤は必要に応じて配合することができるが、その含有量は金属粒子100重量部に対して5重量部以下が好ましく、特に、密着性付与剤としてポリエステルを用いる場合には、2重量部以下がより好ましい。架橋剤が5重量部より多いと鏡面光沢が得られにくく、導電性等の特性も低下する。さらに、架橋剤を配合する場合には、ポリエーテル、密着性付与剤及び架橋剤の合量が20重量部以下であることが好ましい。 The crosslinking agent can be blended as necessary, but the content thereof is preferably 5 parts by weight or less with respect to 100 parts by weight of the metal particles, and particularly 2 parts by weight when using polyester as an adhesion promoter. The following is more preferable. When the amount of the crosslinking agent is more than 5 parts by weight, it is difficult to obtain a specular gloss and the properties such as conductivity are also deteriorated. Furthermore, when mix | blending a crosslinking agent, it is preferable that the total amount of a polyether, adhesiveness imparting agent, and a crosslinking agent is 20 weight part or less.
金属粒子の含有量も適宜調整することができ、含有量が多いほどインキ粘度は高くなり、金属含有膜の光沢、導電性も良好になる。このため、金属粒子の含有量は金属インキに対して5重量%以上が好ましい。一方、金属粒子の含有量が多過ぎると、インキ粘度が高くなりすぎ印刷性、塗装性が阻害されるため、90重量%以下が好ましい。 The content of the metal particles can also be adjusted as appropriate. The higher the content, the higher the ink viscosity, and the better the gloss and conductivity of the metal-containing film. For this reason, the content of the metal particles is preferably 5% by weight or more based on the metal ink. On the other hand, if the content of the metal particles is too large, the ink viscosity becomes too high and the printability and paintability are hindered, so 90% by weight or less is preferable.
溶媒の含有量は適宜設定することができ、例えば金属インキに対して95重量%以下が好ましい。有機溶媒の含有量が95重量%より多いと金属インキの粘度が低くなりすぎるため好ましくない。 The content of the solvent can be appropriately set. For example, it is preferably 95% by weight or less based on the metal ink. If the content of the organic solvent is more than 95% by weight, the viscosity of the metal ink becomes too low, which is not preferable.
本発明の金属インキは、前述の範囲で各種材料の配合を適宜設定することにより、広い範囲の粘度に調整することができる。
具体的には、回転粘度計(ブルックフィールド社製DV−I+)にて25℃、せん断速度7.5sec−1で測定した粘度で表したとき、500〜200000mPa・sの範囲に調整することができる。1000〜10000mPa・sの範囲が好ましく、1000〜5000mPa・sの範囲がより好ましい。
The metal ink of the present invention can be adjusted to a wide range of viscosities by appropriately setting the blending of various materials within the aforementioned range.
Specifically, it can be adjusted to a range of 500 to 200,000 mPa · s when expressed by a viscosity measured at 25 ° C. and a shear rate of 7.5 sec −1 with a rotational viscometer (DV-I + manufactured by Brookfield). it can. The range of 1000 to 10000 mPa · s is preferable, and the range of 1000 to 5000 mPa · s is more preferable.
次に、本発明の金属インキを基材に印刷又は塗装した後、溶媒を除去すると金属含有膜を得ることができる。 Next, after printing or painting the metal ink of the present invention on a substrate, the metal-containing film can be obtained by removing the solvent.
基材への印刷に用いる汎用の印刷機としては、例えばスクリーン印刷機、グラビア印刷機、フレキソ印刷機、インクジェット印刷機又はオフセット印刷機等が挙げられる。また、塗装に用いる汎用の塗装機としては、スプレー塗装機、スリットコーター、カーテンコーター、バーコーター、又はスピンコーター等が挙げられ、その他にも刷毛、ヘラ、コテ、ローラー、ペン又は筆等を用いて塗装することもできる。なお、本発明の金属インキは、特にスクリーン印刷機に適したものである。 Examples of the general-purpose printing machine used for printing on the substrate include a screen printing machine, a gravure printing machine, a flexographic printing machine, an inkjet printing machine, and an offset printing machine. In addition, as a general-purpose coating machine used for painting, a spray coating machine, a slit coater, a curtain coater, a bar coater, a spin coater, etc. can be mentioned, and in addition, a brush, a spatula, a trowel, a roller, a pen, a brush or the like is used. Can also be painted. The metal ink of the present invention is particularly suitable for a screen printing machine.
また、必要に応じて、本発明の金属インキを基材に印刷又は塗装して作製した金属含有膜を加熱してもよい。該加熱により、ポリエーテル及び密着性付与剤及び/又は架橋剤等のインキに配合した有機化合物が相互に架橋等の反応を起こして密着性が向上すると共に、金属粒子が一部融着し、金属含有膜の鏡面光沢、導電性等の特性がより向上すると推測される。
加熱温度は、基材の耐熱温度や金属種にも依存するが、適宜設定することができ、例えば、200℃以下が好ましく、50〜150℃程度がより好ましい。加熱時間も適宜設定することができ、例えば、5分〜10時間程度が適当である。
雰囲気も適宜設定することができ、不活性ガス雰囲気下又は還元性ガス雰囲気下、酸素含有雰囲気下(大気中など)で実施することもできる。不活性ガスにはN2ガス、Arガス、Heガス等を用いることができる。
Moreover, you may heat the metal containing film | membrane produced by printing or coating the metal ink of this invention on a base material as needed. By the heating, organic compounds blended in the ink such as the polyether and the adhesion-imparting agent and / or the cross-linking agent cause a reaction such as cross-linking with each other to improve the adhesion, and the metal particles are partially fused. It is presumed that characteristics such as mirror gloss and conductivity of the metal-containing film are further improved.
The heating temperature depends on the heat-resistant temperature of the substrate and the metal species, but can be set as appropriate. For example, the heating temperature is preferably 200 ° C. or lower, and more preferably about 50 to 150 ° C. The heating time can also be appropriately set, and for example, about 5 minutes to 10 hours is appropriate.
The atmosphere can also be set as appropriate, and can also be carried out in an inert gas atmosphere, a reducing gas atmosphere, or an oxygen-containing atmosphere (such as in the air). As the inert gas, N 2 gas, Ar gas, He gas, or the like can be used.
このようにして得られた膜は、電気的導通、帯電防止、電磁波遮蔽又は金属光沢、鏡面光沢の付与等に用いることができ、更には、電極、回路配線パターン等に用いることができる。
特に、本発明の金属インキは装飾膜を形成して金属鏡面光沢を付与するために好適に用いられ、金属粒子の金属色や鏡面光沢を基材表面に付与した装飾物品として用いることができる。金属インキを用いて基材の表面の少なくとも一部に、あるいは、基材表面の全面にわたって着色し光沢を付与することができるほか、基材表面の一部分に意匠、標章、ロゴマークを形成したり、その他の文字、図形、記号を形成したりすることもできる。また、本発明の金属インキを用いて作製した金属含有膜は、基材との密着性に優れるため、膜の形成後の変形加工にも耐えることができる。そのため、製品の製造段階におけるいずれの段階でも金属含有膜形成工程を導入することができ、基材を使用物品に加工する前の原料基材に膜を形成して装飾を施すこともでき、あるいは、基材を加工した後のあらゆる物品に装飾を施すこともできる。更に、それらの基材表面に予め塗装したものの表面に金属インキを用いて装飾を施すこともできる。
The film thus obtained can be used for electrical continuity, antistatic, electromagnetic wave shielding or metallic luster, specular gloss, and the like, and further can be used for electrodes, circuit wiring patterns, and the like.
In particular, the metal ink of the present invention is suitably used for forming a decorative film and imparting a metallic specular gloss, and can be used as a decorative article in which the metal color of the metal particles and the specular gloss are imparted to the substrate surface. In addition to coloring and giving gloss to at least part of the surface of the base material or the entire surface of the base material using metal ink, a design, a mark, or a logo mark is formed on a part of the surface of the base material. Or other characters, figures and symbols can be formed. Moreover, since the metal containing film produced using the metal ink of this invention is excellent in adhesiveness with a base material, it can also endure the deformation process after film formation. Therefore, it is possible to introduce a metal-containing film forming process at any stage in the production stage of the product, and to form a film on the raw material base material before processing the base material into a use article, or to decorate it, or It is also possible to decorate any article after processing the substrate. Furthermore, it is also possible to decorate the surfaces of those substrates previously coated with metal ink.
得られた金属含有膜の鏡面光沢は分光色彩計を用いて判断できる。本発明の金属インキを用いると、JIS Z 8741に従い、入射角、反射角ともに20度の条件にて測定したときに光沢度が400以上の金属含有膜を作製することができ、金属鏡面として加飾用途に使用することができる。 The specular gloss of the obtained metal-containing film can be judged using a spectral colorimeter. When the metal ink of the present invention is used, a metal-containing film having a glossiness of 400 or more can be produced according to JIS Z 8741 when the incident angle and the reflection angle are measured at 20 degrees. Can be used for decoration purposes.
得られた金属含有膜をJIS K 5600−5−6に準拠した方法(カッターナイフで碁盤目を作り、セロハンテープを貼付し、次いで、セロハンテープを剥離し、その後に残存する塗膜片の数を表記)で評価すると、70%以上の碁盤目が残存し、工業的に十分な密着性を有する。残存率は80%以上であるとより好ましい。 A method in accordance with JIS K 5600-5-6 for the obtained metal-containing film (making a grid with a cutter knife, applying a cellophane tape, then peeling the cellophane tape, and the number of coating film pieces remaining thereafter 70% or more of grids remain and have industrially sufficient adhesion. The residual rate is more preferably 80% or more.
基材としては、金属、ガラス、セラミック、コンクリートなどの無機質材料、ゴム、プラスチック、紙、木、皮革、布、繊維などの有機質材料、無機質材料と有機質材料とを併用あるいは複合した材料を用いることができる。 As the base material, use inorganic materials such as metals, glass, ceramics, concrete, organic materials such as rubber, plastic, paper, wood, leather, cloth, and fibers, and materials that use a combination of inorganic materials and organic materials or composite materials. Can do.
装飾を施す物品の具体例としては、
(1)自動車、トラック、バスなどの輸送機器の外装、内装、バンパー、ドアノブ、サイドミラー、フロントグリル、ランプの反射板、表示機器等、
(2)テレビ、冷蔵庫、電子レンジ、パーソナルコンピューター、携帯電話、カメラなどの電化製品の外装、リモートコントロール、タッチパネル、フロントパネル等、
(3)家屋、ビル、デパート、ストアー、ショッピングモール、パチンコ店、結婚式場、葬儀場、神社仏閣などの建築物の外装、窓ガラス、玄関、表札、門扉、ドア、ドアノブ、ショーウインド、内装等、
(4)照明器具、家具、調度品、トイレ機器、仏壇仏具、仏像などの家屋設備、
(5)金物、食器などの什器、
(6)飲料水、タバコなどの自動販売機、
(7)合成洗剤、スキンケア、清涼飲料水、酒類、菓子類、食品、たばこ、医薬品などの容器、
(8)表装紙、ダンボール箱などの梱包用具、
(9)衣服、靴、鞄、メガネ、人口爪、人口毛、宝飾品などの衣装・装飾品、
(10)野球のバット、ゴルフのクラブなどのスポーツ用品、つり具などの趣味用品、
(11)鉛筆、色紙、ノート、年賀はがきなどの事務用品、机、椅子などの事務機器、
(12)書籍類のカバーやオビ等、人形、ミニカーなどのおもちゃ、定期券などのカード類、CD、DVDなどの記録媒体、などが挙げられる。また、人間の爪、皮膚、眉毛、髪の毛などを基材とすることができる。
As a specific example of an article to be decorated,
(1) Exteriors, interiors, bumpers, door knobs, side mirrors, front grills, lamp reflectors, display devices, etc. for transportation equipment such as automobiles, trucks, and buses,
(2) Exteriors of electrical appliances such as TVs, refrigerators, microwave ovens, personal computers, mobile phones, cameras, remote controls, touch panels, front panels, etc.
(3) Houses, buildings, department stores, stores, shopping malls, pachinko shops, wedding halls, funeral halls, exteriors of buildings such as shrines and temples, window glass, entrances, nameplates, gates, doors, doorknobs, show windows, interiors, etc. ,
(4) Lighting equipment, furniture, furniture, toilet equipment, Buddhist altar tools, Buddhist statues and other home equipment
(5) Fixtures such as hardware and tableware,
(6) Vending machines for drinking water, tobacco, etc.
(7) Containers for synthetic detergents, skin care, soft drinks, alcoholic beverages, confectionery, food, tobacco, pharmaceuticals,
(8) Packing tools such as cover paper and cardboard boxes,
(9) Costumes and accessories such as clothes, shoes, bags, glasses, artificial nails, artificial hair, jewelry,
(10) Sports equipment such as baseball bats and golf clubs, hobby goods such as fishing equipment,
(11) Office supplies such as pencils, colored paper, notebooks, New Year postcards, desks and chairs,
(12) Books covers and covers, dolls, toys such as minicars, cards such as commuter passes, recording media such as CDs and DVDs, and the like. In addition, human nails, skin, eyebrows, hair, and the like can be used as a base material.
以下に実施例を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例によって制限されるものではない。 The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.
(金属コロイド粒子の調製)
金属化合物として硝酸銀50g、配位化合物として3−メルカプトプロピオン酸1.6gを純水220ミリリットルに溶解し、28%アンモニア水70ミリリットルを加え、pHを11.6に調整した。一方、還元剤として水素化ホウ素ナトリウム2.1gを、28%アンモニア水4ミリリットルを加えた295ミリリットルの純水に溶解した。両者を30分間かけて600ミリリットルの純水中に撹拌しながら同時に滴下し、硝酸銀を還元して、3−メルカプトプロピオン酸が表面に存在する銀コロイド粒子を媒液中に生成させた。次いで、得られた銀コロイド粒子の媒液を、硝酸(30%)を用いて媒液のpHを2.5に調整し、銀コロイド粒子を沈降させ、真空ろ過機で銀コロイド粒子(銀コロイド粒子1000重量部に対し、メルカプトプロピオン酸を3重量部含む。銀コロイド粒子の平均粒子径は約10nm)をろ別し、ろ液の比導電率が10μS/cm以下になるまで水洗した後、N−メチルホルムアミド中に再分散して、銀コロイド溶液(銀コロイド粒子を70重量%含有)を得た。
(Preparation of metal colloidal particles)
50 g of silver nitrate as a metal compound and 1.6 g of 3-mercaptopropionic acid as a coordination compound were dissolved in 220 ml of pure water, and 70 ml of 28% ammonia water was added to adjust the pH to 11.6. On the other hand, 2.1 g of sodium borohydride as a reducing agent was dissolved in 295 ml of pure water to which 4 ml of 28% ammonia water was added. Both were dripped simultaneously in 600 milliliters of pure water over 30 minutes, and silver nitrate was reduced to produce silver colloidal particles having 3-mercaptopropionic acid on the surface in the medium. Next, the medium liquid of the obtained silver colloid particles is adjusted to pH 2.5 with nitric acid (30%), the silver colloid particles are settled, and the silver colloid particles (silver colloid particles are collected by a vacuum filter). 3 parts by weight of mercaptopropionic acid with respect to 1000 parts by weight of the particles.The average particle diameter of the silver colloidal particles is about 10 nm), and after washing with water until the specific conductivity of the filtrate is 10 μS / cm or less, Re-dispersion in N-methylformamide gave a silver colloid solution (containing 70% by weight of silver colloid particles).
(ビヒクルの調製)
プラスチック製カップに、ホルムアミド2.23g、表面張力調整剤(ビックケミー社BYK−190)0.07g、密着性付与剤として水分散ポリエステル(東洋紡社製 バイロナール(登録商標) MD−1100 ポリエステル含有分30重量%)1.85gを計り取り、撹拌した後、これに、ポリエチレンオキシド(住友精化製 PEO(登録商標)−3Z、分子量600,000〜1,100,000)1.03gを、N−メチルホルムアミド4.80gに溶解した溶液を加え、撹拌脱泡機にて混合し、ビヒクルを得た。
(Vehicle preparation)
In a plastic cup, formamide 2.23 g, surface tension modifier (BYK-190 BYK-190) 0.07 g, water-dispersed polyester (Toyobo Co., Ltd. Vylonal (registered trademark) MD-1100, polyester content 30 weight) %) 1.85 g was measured and stirred, and then 1.03 g of polyethylene oxide (PEO (registered trademark) -3Z, manufactured by Sumitomo Seika Chemical Co., Ltd., molecular weight: 600,000 to 1,100,000) was added to N-methyl. A solution dissolved in 4.80 g of formamide was added and mixed with a stirring deaerator to obtain a vehicle.
(インキの調製)
上記方法で得た銀コロイド溶液7.2g、ビヒクル1.8g、N−メチルホルムアミド0.9gを撹拌脱泡機にて混合し、本発明の銀インキを得た。
(Preparation of ink)
The silver colloid solution 7.2g obtained by the said method, the vehicle 1.8g, and N-methylformamide 0.9g were mixed with the stirring defoamer, and the silver ink of this invention was obtained.
実施例1において、ポリエチレンオキシドを分子量1,700,000〜2,200,000のポリエチレンオキシド(住友精化製 PEO−8Z)0.78gに替えること以外は、実施例1と同じ条件で、本発明の銀インキを得た。 In Example 1, except that polyethylene oxide is replaced with 0.78 g of polyethylene oxide having a molecular weight of 1,700,000 to 2,200,000 (PEO-8Z manufactured by Sumitomo Seika), the same conditions as in Example 1 are used. An inventive silver ink was obtained.
実施例1において、水分散ポリエステルの使用量を1.85gから5.55gに替えること以外は、実施例1と同じ条件で、本発明の銀インキを得た。 In Example 1, the silver ink of this invention was obtained on the same conditions as Example 1 except having changed the usage-amount of water-dispersed polyester from 1.85g to 5.55g.
実施例1において、更に架橋剤として、ブロックイソシアネート(第一工業製薬社製 エラストロン(登録商標)BN−77)を0.02g(銀100重量部に対し0.4重量部)添加したこと以外は、実施例1と同じ条件で、本発明の銀インキを得た。 In Example 1, 0.02 g (0.4 parts by weight with respect to 100 parts by weight of silver) of a blocked isocyanate (Elastotron (registered trademark) BN-77 manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) was further added as a crosslinking agent. The silver ink of the present invention was obtained under the same conditions as in Example 1.
比較例1
実施例1において、水分散ポリエステルの使用量を1.85gから65.0gに替えること以外は、実施例1と同じ条件で、比較用の銀インキを得た。
Comparative Example 1
In Example 1, the comparative silver ink was obtained on the same conditions as Example 1 except having changed the usage-amount of water-dispersed polyester from 1.85g to 65.0g.
比較例2
実施例1において、水分散ポリエステルを添加しないこと以外は、実施例1と同じ条件で、比較用の銀インキを得た。
Comparative Example 2
In Example 1, the comparative silver ink was obtained on the same conditions as Example 1 except not adding water-dispersed polyester.
比較例3
実施例1において、ポリエチレンオキシドを用いないこと以外は、実施例1と同じ条件で、比較用の銀インキを得た。
Comparative Example 3
In Example 1, a comparative silver ink was obtained under the same conditions as in Example 1 except that polyethylene oxide was not used.
比較例4
実施例1において、水分散ポリエステル及びポリエチレンオキシドを添加しないこと以外は、実施例1と同じ条件で、比較用の銀インキを得た。
Comparative Example 4
In Example 1, the comparative silver ink was obtained on the same conditions as Example 1 except not adding water-dispersed polyester and polyethylene oxide.
(粘度測定)
回転粘度計(ブルックフィールド社製DV−I+)にて25℃、せん断速度7.5sec−1の条件で測定した。
(Viscosity measurement)
The measurement was performed with a rotational viscometer (DV-I + manufactured by Brookfield) at 25 ° C. and a shear rate of 7.5 sec −1 .
銀100重量部に対する各配合物の配合量は表1の通りである。 Table 1 shows the blending amount of each blend with respect to 100 parts by weight of silver.
また、それぞれの銀インキの粘度を表1に示す。本発明の銀インキは粘度を適宜調整することができ、具体的にはポリエーテル量の若干の調整のみでも1500〜2500mPa・sの範囲に調整できることがわかる。 Table 1 shows the viscosity of each silver ink. It can be seen that the viscosity of the silver ink of the present invention can be adjusted as appropriate, and specifically, it can be adjusted in the range of 1500 to 2500 mPa · s only by slightly adjusting the amount of polyether.
(塗膜の作製)
得られたインキをPETフィルム(東レ社製 ルミラー(登録商標)T60)上に垂らし、バーコーター(#3)を用いて厚み約7μmに広げ、オーブン中100℃、30分間加熱することで、銀塗膜を作製した。
(Preparation of coating film)
The obtained ink was dropped on a PET film (Lumilar (registered trademark) T60 manufactured by Toray Industries, Inc.), spread to a thickness of about 7 μm using a bar coater (# 3), and heated in an oven at 100 ° C. for 30 minutes to produce silver. A coating film was prepared.
(密着性の評価)
得られた銀塗膜をJIS K5600−5−6に準拠して、カッターナイフで25マスの碁盤目を作り、セロハンテープを貼付した後、剥離し、その後に残存する塗膜碁盤目片の数で評価した。全部剥離すれば0/25、全部残存すれば25/25であり、この数値が大きい程、銀含有膜と基材との密着性が高いことを示す。
(Evaluation of adhesion)
According to JIS K5600-5-6, the obtained silver coating film is made of 25 square grids with a cutter knife, applied with cellophane tape, peeled off, and the number of coating grid grid pieces remaining thereafter It was evaluated with. It is 0/25 when all peels and 25/25 when all remains, and the larger this value, the higher the adhesion between the silver-containing film and the substrate.
(金属鏡面光沢度の評価)
得られた銀塗膜をJIS Z 8741に準拠した方法で、入射角、反射角ともに20度の条件にて光沢度を測定した。測定には日本電色工業社製分光色彩計(SD5000)を用いた。
(Evaluation of metallic mirror gloss)
The glossiness of the obtained silver coating film was measured by a method based on JIS Z 8741 under the condition that both the incident angle and the reflection angle were 20 degrees. A spectrocolorimeter (SD5000) manufactured by Nippon Denshoku Industries Co., Ltd. was used for the measurement.
(外観の評価)
得られた銀塗膜の色調と均質性を目視により観察した。均質性は、塗膜の色むらやハジキの有無で判断した。
(Appearance evaluation)
The color tone and homogeneity of the obtained silver coating film were visually observed. The homogeneity was judged by the presence or absence of uneven color and repellency of the coating film.
実施例で得られた銀含有膜のクロスカット試験での碁盤目片残存率は85〜100%であり、十分な密着性が得られていることがわかる。 The cross-cut piece residual rate in the cross-cut test of the silver-containing film obtained in the example is 85 to 100%, which indicates that sufficient adhesion is obtained.
また、実施例で得られた銀含有膜の鏡面光沢度はいずれも800以上であり、十分な金属光沢が得られていることがわかる。 In addition, the specular gloss of the silver-containing films obtained in the examples is 800 or more, and it can be seen that sufficient metallic luster is obtained.
さらに、実施例で得られた銀含有膜には色むら、ハジキ等が認められず、銀色の色調を有することがわかる。 Furthermore, it can be seen that the silver-containing films obtained in the examples have no color unevenness, repelling, etc., and have a silver color tone.
本発明では、ポリエーテルと密着性付与剤の両者を一定量配合することで、高粘度の金属インキを作製できるだけでなくその金属インキを用いた金属含有膜の基材との密着性と外観とを両立させることができ、個別にポリエーテルや密着性付与剤を添加するよりも少量でその効果が生じることがわかる。
In the present invention, by blending a certain amount of both the polyether and the adhesion-imparting agent, not only can a high-viscosity metal ink be produced, but also the adhesion and appearance of the metal-containing film using the metal ink and the substrate It can be seen that these effects can be achieved in a smaller amount than when a polyether or an adhesion-imparting agent is individually added.
本発明の金属インキは、スクリーン印刷機、グラビア印刷機、フレキソ印刷機、インクジェット印刷機又はオフセット印刷機等の汎用の印刷機、スプレー、スリットコーター、カーテンコーター、バーコーター、又はスピンコーター等の汎用の塗装機、刷毛、ヘラ、コテ、ローラー、ペン又は筆等を用いて、印刷ムラ、塗装ムラもなく基材に印刷又は塗装することができるため、電気的導通を確保する材料、あるいは帯電防止、電磁波遮蔽又は金属光沢を付与する材料などの用途に幅広く用いられる。また、比較的低温での加熱によっても優れた導電性、金属光沢を有する塗膜が得られることから、近年活発に開発が進められている電極、回路配線パターンの形成といったナノテクノロジーの新規用途にも適用でき、また、金属鏡面光沢による意匠性、装飾性の付与などのメッキ技術の代替用途にも適用できる。 The metal ink of the present invention is a general-purpose printing machine such as a screen printing machine, a gravure printing machine, a flexographic printing machine, an inkjet printing machine or an offset printing machine, a general-purpose machine such as a spray, slit coater, curtain coater, bar coater, or spin coater. A material that ensures electrical continuity, or is antistatic, because it can be printed or coated on a substrate without uneven printing or coating using a coating machine, brush, spatula, trowel, roller, pen or brush, etc. Widely used for applications such as electromagnetic shielding or metallic luster. In addition, a coating film with excellent conductivity and metallic luster can be obtained by heating at a relatively low temperature, so that it can be applied to new applications of nanotechnology such as formation of electrodes and circuit wiring patterns that have been actively developed in recent years. Can also be applied, and can also be applied to alternative uses of plating technology such as design and decorativeness by metallic mirror gloss.
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