JP5329299B2 - 光学レンズ - Google Patents
光学レンズ Download PDFInfo
- Publication number
- JP5329299B2 JP5329299B2 JP2009116727A JP2009116727A JP5329299B2 JP 5329299 B2 JP5329299 B2 JP 5329299B2 JP 2009116727 A JP2009116727 A JP 2009116727A JP 2009116727 A JP2009116727 A JP 2009116727A JP 5329299 B2 JP5329299 B2 JP 5329299B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- resin
- resin composition
- optical lens
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims description 56
- 229920000647 polyepoxide Polymers 0.000 claims description 53
- 239000003822 epoxy resin Substances 0.000 claims description 51
- 239000011342 resin composition Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- -1 hexa fluoro phosphate ions Chemical compound 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 18
- 125000003700 epoxy group Chemical group 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 12
- 125000002723 alicyclic group Chemical group 0.000 claims description 10
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 9
- 150000001450 anions Chemical class 0.000 claims description 8
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 8
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 238000012663 cationic photopolymerization Methods 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- 150000002921 oxetanes Chemical class 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 125000000129 anionic group Chemical group 0.000 claims 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000002845 discoloration Methods 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 230000009477 glass transition Effects 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 4
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Chemical group 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- LFKLPJRVSHJZPL-UHFFFAOYSA-N 1,2:7,8-diepoxyoctane Chemical compound C1OC1CCCCC1CO1 LFKLPJRVSHJZPL-UHFFFAOYSA-N 0.000 description 1
- MQOOPAYPXFMXGW-UHFFFAOYSA-N 1-(3-ethyloxetan-3-yl)-4-[(3-ethyloxetan-3-yl)methoxy]-3,3-dimethylbutan-2-ol Chemical compound C1OCC1(CC)CC(O)C(C)(C)COCC1(CC)COC1 MQOOPAYPXFMXGW-UHFFFAOYSA-N 0.000 description 1
- ZVVZJRGGIIJWBL-UHFFFAOYSA-N 1-(3-ethyloxetan-3-yl)-5-[(3-ethyloxetan-3-yl)methoxy]pentan-2-ol Chemical compound C1OCC1(CC)CC(O)CCCOCC1(CC)COC1 ZVVZJRGGIIJWBL-UHFFFAOYSA-N 0.000 description 1
- ALADOYDDKFXPNF-UHFFFAOYSA-N 1-[(3-ethyloxetan-3-yl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CCC1(COC1)CN2C(=O)NC(=O)NC2=O ALADOYDDKFXPNF-UHFFFAOYSA-N 0.000 description 1
- HTJFSXYVAKSPNF-UHFFFAOYSA-N 2-[2-(oxiran-2-yl)ethyl]oxirane Chemical compound C1OC1CCC1CO1 HTJFSXYVAKSPNF-UHFFFAOYSA-N 0.000 description 1
- MKNOYISMZFDLQP-UHFFFAOYSA-N 3-[1-[2-(oxetan-3-yl)butoxy]butan-2-yl]oxetane Chemical compound C1OCC1C(CC)COCC(CC)C1COC1 MKNOYISMZFDLQP-UHFFFAOYSA-N 0.000 description 1
- WWJKCARUHXVBFE-UHFFFAOYSA-N 3-ethyl-1-(3-ethyloxetan-3-yl)-3-[(3-ethyloxetan-3-yl)methoxymethyl]heptan-2-ol Chemical compound C1OCC1(CC)CC(O)C(CC)(CCCC)COCC1(CC)COC1 WWJKCARUHXVBFE-UHFFFAOYSA-N 0.000 description 1
- YJCMPXJZAZXTTN-UHFFFAOYSA-N 3-ethyl-3-[[2-[(3-ethyloxetan-3-yl)methoxy]phenoxy]methyl]oxetane Chemical compound C=1C=CC=C(OCC2(CC)COC2)C=1OCC1(CC)COC1 YJCMPXJZAZXTTN-UHFFFAOYSA-N 0.000 description 1
- OKXBYAYFELNJLV-UHFFFAOYSA-N 3-ethyl-3-[[2-[2-[(3-ethyloxetan-3-yl)methoxy]phenyl]phenoxy]methyl]oxetane Chemical group C=1C=CC=C(C=2C(=CC=CC=2)OCC2(CC)COC2)C=1OCC1(CC)COC1 OKXBYAYFELNJLV-UHFFFAOYSA-N 0.000 description 1
- FHFOJGCIXOUQMZ-UHFFFAOYSA-N 3-ethyl-3-[[3-[(3-ethyloxetan-3-yl)methoxy]phenoxy]methyl]oxetane Chemical compound C=1C=CC(OCC2(CC)COC2)=CC=1OCC1(CC)COC1 FHFOJGCIXOUQMZ-UHFFFAOYSA-N 0.000 description 1
- UIKLBTKZWQVZIR-UHFFFAOYSA-N 3-ethyl-3-[[3-[(3-ethyloxetan-3-yl)methoxymethyl]-2-bicyclo[2.2.1]heptanyl]methoxymethyl]oxetane Chemical compound C1C2CCC1C(COCC1(CC)COC1)C2COCC1(CC)COC1 UIKLBTKZWQVZIR-UHFFFAOYSA-N 0.000 description 1
- OUOXFTBHVIBCEI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxy]phenoxy]methyl]oxetane Chemical compound C=1C=C(OCC2(CC)COC2)C=CC=1OCC1(CC)COC1 OUOXFTBHVIBCEI-UHFFFAOYSA-N 0.000 description 1
- NXHOXSAEFJONFO-UHFFFAOYSA-N 3-ethyl-3-[[4-[4-[(3-ethyloxetan-3-yl)methoxy]phenyl]phenoxy]methyl]oxetane Chemical group C=1C=C(C=2C=CC(OCC3(CC)COC3)=CC=2)C=CC=1OCC1(CC)COC1 NXHOXSAEFJONFO-UHFFFAOYSA-N 0.000 description 1
- YHPAMUSAWICJEZ-UHFFFAOYSA-N 3-ethyl-3-[[6-[(3-ethyloxetan-3-yl)methoxy]-2,2,3,3,4,4,5,5-octafluorohexoxy]methyl]oxetane Chemical compound C1OCC1(CC)COCC(F)(F)C(F)(F)C(F)(F)C(F)(F)COCC1(CC)COC1 YHPAMUSAWICJEZ-UHFFFAOYSA-N 0.000 description 1
- VOLHPVISRZJKBP-UHFFFAOYSA-N 3-ethyl-3-[[7-[(3-ethyloxetan-3-yl)methoxy]naphthalen-2-yl]oxymethyl]oxetane Chemical compound C=1C=C2C=CC(OCC3(CC)COC3)=CC2=CC=1OCC1(CC)COC1 VOLHPVISRZJKBP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical group FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229940085991 phosphate ion Drugs 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyethers (AREA)
Description
(A)1分子中に2個以上のエポキシ基を有し、かつフルオレン骨格を有するエポキシ樹脂、および1分子中に2個以上のエポキシ基を有する脂環式エポキシ樹脂。
(B)へキサフルオロリン酸イオンをアニオン成分とする、トリアリールスルホニウム塩。
(A)1分子中に2個以上のエポキシ基を有し、かつフルオレン骨格を有するエポキシ樹脂、および1分子中に2個以上のエポキシ基を有する脂環式エポキシ樹脂。
(B)へキサフルオロリン酸イオンをアニオン成分とする、トリアリールスルホニウム塩。
(a)ビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン社製、商品名「エピコート827」)
(b)水添ビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン社製、商品名「エピコートYX−8000」)
(c)フルオレン型エポキシ樹脂(長瀬産業社製、商品名「オンコートEX−1020」)
(d)フルオレン型エポキシ樹脂(長瀬産業社製、商品名「オンコートEX−1040」)
(e)脂環式エポキシ樹脂(ダイセル化学社製、商品名「セロキサイド2021P」)
(a)3−エチル−3−フェノキシメチルオキセタン(東亞合成社製、商品名「アロオキセタンOXT−211」)
(b)ビス(3−エチル−3−オキセタニルメチル)エーテル(東亞合成社製、商品名「アロオキセタンOXT−221」)
(a)へキサフルオロリン酸イオンのトリアリールスルホニウム塩(ダウケミカル社製、商品名「UVI−6992」)
(b)ヘキサフルオロリン酸イオンのトリアリールスルホニウム塩(サンアプロ社製、商品名「CPI−100P」)
(c)ヘキサフルオロリン酸イオンのトリアリールスルホニウム塩(日本シイベルヘグナー社製、商品名「Escure1064」)
(d)ヘキサフルオロアンチモン酸イオンのトリアリールスルホニウム塩(サンアプロ社製、商品名「CPI−101A」)
(e)へキサフルオロアンチモン酸イオンのトリアリールスルホニウム塩(アデカ社製、商品名「SP−170」)
上記各成分を、後記の表1および表2に示す割合で配合し、加熱溶融混合を行い、目的とする樹脂組成物(一液性の紫外線硬化性透明樹脂組成物)を得た。
2. 5cm×3. 5cm×厚み500μmのパイレックス(登録商標)ガラス基板上に、上記調製の樹脂組成物(紫外線硬化性透明樹脂組成物)をポッティングし、その後、2cm×3cm×深さ600μmのキャビティーを有する透明シリコーン樹脂製の加工型を、上記樹脂組成物を介して上記ガラス基板に押し当てた。このようにして、上記加工型のキャビティー内に樹脂組成物の充填を行った後、水銀ランプを用いて紫外線を30mW×500秒間照射(紫外線量15000mJ/cm2 )し、上記樹脂組成物を硬化させた。そして、上記加工型を取り除き(脱型し)、上記ガラス基板上に、2cm×3cm×厚み600μmの樹脂成形物(試験片)を得た(図1参照)。
12 基板
Claims (6)
- 下記(A)成分を主成分とし、下記(B)成分の光カチオン重合開始剤を含有するとともに、ゴム変性樹脂を含有しない紫外線硬化性透明樹脂組成物の硬化体からなることを特徴とする光学レンズ。
(A)1分子中に2個以上のエポキシ基を有し、かつフルオレン骨格を有するエポキシ樹脂、および1分子中に2個以上のエポキシ基を有する脂環式エポキシ樹脂。
(B)へキサフルオロリン酸イオンをアニオン成分とする、トリアリールスルホニウム塩。 - ガラス、ポリイミド樹脂、シリコーン樹脂のいずれかからなる透明基板上に、下記(A)成分を主成分とし、下記(B)成分の光カチオン重合開始剤を含有するとともに、ゴム変性樹脂を含有しない紫外線硬化性透明樹脂組成物からなるレンズ状硬化体が一体化されてなることを特徴とする光学レンズ。
(A)1分子中に2個以上のエポキシ基を有し、かつフルオレン骨格を有するエポキシ樹脂、および1分子中に2個以上のエポキシ基を有する脂環式エポキシ樹脂。
(B)へキサフルオロリン酸イオンをアニオン成分とする、トリアリールスルホニウム塩。 - 上記紫外線硬化性透明樹脂組成物における、1分子中に2個以上のエポキシ基を有し、かつフルオレン骨格を有するエポキシ樹脂の含有割合が、樹脂組成物中の全樹脂量の10〜50重量%の範囲に設定されている請求項1または2記載の光学レンズ。
- 上記紫外線硬化性透明樹脂組成物における、(B)成分のトリアリールスルホニウム塩の含有割合が、樹脂組成物中の全樹脂量100重量部に対し、0.5〜4重量部の範囲に設定されている請求項1〜3のいずれか一項に記載の光学レンズ。
- 上記紫外線硬化性透明樹脂組成物における(C)成分の含有割合が、1分子中に2個以上のエポキシ基を有するエポキシ樹脂と(C)成分との合計量の5〜40重量%の範囲である請求項5記載の光学レンズ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009116727A JP5329299B2 (ja) | 2009-05-13 | 2009-05-13 | 光学レンズ |
EP10162703A EP2258741A1 (en) | 2009-05-13 | 2010-05-12 | Resin composition for optical components and optical component using the same |
CN2010101809602A CN101885899A (zh) | 2009-05-13 | 2010-05-13 | 光学部件用树脂组合物和使用其的光学部件 |
TW099115335A TWI445758B (zh) | 2009-05-13 | 2010-05-13 | 光學元件用樹脂組合物及使用其之光學元件 |
US12/779,339 US20100292358A1 (en) | 2009-05-13 | 2010-05-13 | Resin composition for optical components and optical component using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009116727A JP5329299B2 (ja) | 2009-05-13 | 2009-05-13 | 光学レンズ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010265360A JP2010265360A (ja) | 2010-11-25 |
JP5329299B2 true JP5329299B2 (ja) | 2013-10-30 |
Family
ID=42664857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009116727A Active JP5329299B2 (ja) | 2009-05-13 | 2009-05-13 | 光学レンズ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100292358A1 (ja) |
EP (1) | EP2258741A1 (ja) |
JP (1) | JP5329299B2 (ja) |
CN (1) | CN101885899A (ja) |
TW (1) | TWI445758B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6026347B2 (ja) | 2013-04-23 | 2016-11-16 | 日東電工株式会社 | 感光性エポキシ樹脂組成物および光導波路コア層形成用硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP2014224205A (ja) * | 2013-05-17 | 2014-12-04 | 日東電工株式会社 | 光学部品用光硬化型樹脂組成物およびそれを用いた光学部品、並びに光学部品の製法 |
JP6364187B2 (ja) | 2013-12-19 | 2018-07-25 | 新日鉄住金化学株式会社 | 光学用エポキシ樹脂組成物およびその硬化物 |
JP6418673B2 (ja) * | 2014-03-31 | 2018-11-07 | 日東電工株式会社 | 光学部品用樹脂組成物およびそれを用いた光学部品 |
JP6418672B2 (ja) * | 2014-03-31 | 2018-11-07 | 日東電工株式会社 | 光学部品用樹脂組成物およびそれを用いた光学部品 |
JP6448083B2 (ja) * | 2014-11-28 | 2019-01-09 | 協立化学産業株式会社 | 光硬化性樹脂組成物及び高屈折性樹脂硬化体 |
JP6286396B2 (ja) | 2015-08-13 | 2018-02-28 | 株式会社ダイセル | 硬化性組成物及びその硬化物 |
JP6726053B2 (ja) * | 2016-03-24 | 2020-07-22 | 大阪ガスケミカル株式会社 | エポキシ樹脂組成物及びその硬化物 |
JP7008398B2 (ja) * | 2016-03-31 | 2022-01-25 | 株式会社Adeka | 硬化性組成物、硬化物の製造方法、およびその硬化物 |
JP6698717B2 (ja) * | 2018-02-05 | 2020-05-27 | 株式会社ダイセル | 硬化性組成物及びその硬化物 |
CN108485184B (zh) * | 2018-02-11 | 2020-11-24 | 东莞爱的合成材料科技有限公司 | 一种可用于临床医学的耐高温透明光敏树脂及其制备方法 |
CN112625217B (zh) * | 2020-12-23 | 2022-07-12 | 江南大学 | 一种含硫含芴结构高折射率光学树脂的制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4139655A (en) * | 1978-05-09 | 1979-02-13 | W. R. Grace & Co. | Photocurable epoxy compositions containing thiopyrylium salts |
US4339567A (en) * | 1980-03-07 | 1982-07-13 | Ciba-Geigy Corporation | Photopolymerization by means of sulphoxonium salts |
ES2154352T3 (es) * | 1994-10-31 | 2001-04-01 | Minnesota Mining & Mfg | Sistema epoxi, curable con luz visible, con profundidad de curado aumentada. |
US5877229A (en) * | 1995-07-26 | 1999-03-02 | Lockheed Martin Energy Systems, Inc. | High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators |
JPH11140279A (ja) * | 1997-10-31 | 1999-05-25 | Toagosei Co Ltd | 活性エネルギー線硬化型組成物 |
JP2001166127A (ja) * | 1999-09-30 | 2001-06-22 | Toray Ind Inc | カラーフィルター用硬化性樹脂溶液組成物、カラーフィルター、および、液晶表示装置 |
US7452611B2 (en) * | 2001-12-27 | 2008-11-18 | Transitions Optical, Inc. | Photochromic optical article |
JP4490183B2 (ja) * | 2004-02-16 | 2010-06-23 | 日東電工株式会社 | 光導波路およびその製造方法 |
EP1760102B1 (en) * | 2004-06-17 | 2013-04-24 | Three Bond Co., Ltd. | Cationically photopolymerizable composition and optoelectronic component using same |
JP4417198B2 (ja) * | 2004-08-02 | 2010-02-17 | 日東電工株式会社 | 光導波路の製造方法 |
WO2006029095A1 (en) * | 2004-09-03 | 2006-03-16 | Henkel Corporation | Photoinitiated cationic epoxy compositions |
JP4589211B2 (ja) * | 2005-09-20 | 2010-12-01 | 日東電工株式会社 | 光学用紫外線硬化型液状樹脂組成物 |
JP2008081573A (ja) * | 2006-09-27 | 2008-04-10 | Toyo Ink Mfg Co Ltd | 樹脂組成物およびそれを用いた積層体 |
JP3926380B1 (ja) | 2006-12-07 | 2007-06-06 | マイルストーン株式会社 | 撮像レンズ |
JP5401767B2 (ja) * | 2007-06-14 | 2014-01-29 | 東亞合成株式会社 | 硬化性組成物および光学デバイス |
TWI427117B (zh) * | 2008-05-30 | 2014-02-21 | Nitto Denko Corp | 光學元件用樹脂組成物、使用其之光學元件及光學鏡片之製造方法 |
-
2009
- 2009-05-13 JP JP2009116727A patent/JP5329299B2/ja active Active
-
2010
- 2010-05-12 EP EP10162703A patent/EP2258741A1/en not_active Withdrawn
- 2010-05-13 TW TW099115335A patent/TWI445758B/zh active
- 2010-05-13 US US12/779,339 patent/US20100292358A1/en not_active Abandoned
- 2010-05-13 CN CN2010101809602A patent/CN101885899A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20100292358A1 (en) | 2010-11-18 |
JP2010265360A (ja) | 2010-11-25 |
CN101885899A (zh) | 2010-11-17 |
TW201105735A (en) | 2011-02-16 |
TWI445758B (zh) | 2014-07-21 |
EP2258741A1 (en) | 2010-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5329299B2 (ja) | 光学レンズ | |
US8304470B2 (en) | Resin composition for optical components, optical component using the same and production method of optical lens | |
JP5401767B2 (ja) | 硬化性組成物および光学デバイス | |
JP2014224205A (ja) | 光学部品用光硬化型樹脂組成物およびそれを用いた光学部品、並びに光学部品の製法 | |
JP5070131B2 (ja) | 光学部品用樹脂組成物およびそれを用いた光学部品 | |
US8575227B2 (en) | Photocurable resin composition and optical component using the same | |
JP5222036B2 (ja) | 光学部品の製法 | |
JP6418672B2 (ja) | 光学部品用樹脂組成物およびそれを用いた光学部品 | |
US8557891B2 (en) | Photocurable resin composition and optical component using the same | |
JP5184336B2 (ja) | 紫外線硬化型樹脂組成物およびそれを用いて得られる光学レンズ | |
JP2009288598A (ja) | 光学レンズの製法およびそれにより得られた光学レンズ | |
WO2021049443A1 (ja) | 紫外線硬化性樹脂組成物、硬化物及び光学レンズ | |
JP6418673B2 (ja) | 光学部品用樹脂組成物およびそれを用いた光学部品 | |
TWI516517B (zh) | 光硬化樹脂組合物及使用其之光學元件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111201 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130215 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130402 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130528 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130528 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130716 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130724 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5329299 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |