JP5106467B2 - Organic EL device - Google Patents

Description

  The present invention relates to an organic EL device, and more particularly to an organic EL device having a uniform in-plane temperature distribution and suppressing generation of heat spots.

  In recent years, display devices and illumination devices using organic EL (EL) elements as organic light emitting elements have been developed for practical use. Conventionally, an organic EL element has been significantly deteriorated by moisture and therefore needs to be moisture-proof. For this reason, an organic EL element mounted on a substrate is sealed with a sealing plate or the like.

  Conventionally, as a method of sealing an organic EL element, for example, the substrate surface on which the organic EL element is mounted is sealed with a sealing can via a sealing material, and a gas such as an inert gas is sealed in the sealed internal space. A hollow sealing technique for filling is known (for example, see Patent Document 1). Alternatively, a liquid sealing technique is known in which a substrate surface on which an organic EL element is mounted is sealed with a sealing can through a sealing material, and the sealed internal space is filled with a filler made of a liquid such as silicone oil. (For example, refer to Patent Document 2) In addition, a fluid sealant such as a resin is applied to the substrate surface, and a glass plate or the like is stacked to cure the sealant by a method such as UV light irradiation or heating. Solid sealing technology for sealing is known. (For example, refer to Patent Document 3 and Patent Document 4.)

  Conventionally, an organic EL lighting panel in which a flexible film or a wire is used as a lead wire and a power source is connected to the organic EL element is known. As shown in FIG. 18, in the conventional organic EL device 1a, an organic EL layer sandwiched between an anode and a cathode is disposed on a substrate 100, and, like a display panel, one of four sides of a square panel or The anode terminal electrode EA is provided on all four sides, and the cathode terminal electrode EK is arranged at the corner of the diagonal line. The anode is connected to the anode terminal electrode EA, and the cathode is connected to the cathode terminal electrode EK. For example, a flexible cable is provided on the anode terminal electrode EA and the cathode terminal electrode EK, and is connected to a terminal of the flexible cable.

  In the conventional organic EL device 1a, as shown in FIG. 18, a current concentration portion 44 of the anode-cathode current that conducts the anode terminal electrode EA and the cathode terminal electrode EK is generated particularly in the peripheral portion surrounding the cathode terminal electrode EK. To do. The current concentration portion 44 generates significant heat and forms a heat spot by positive feedback in which the current density further increases as the temperature rises. In-plane non-uniform heat distribution of the organic EL panel, non-uniform in-plane of the organic EL panel Cause an illumination distribution and element destruction. This is because the conventional organic EL device 1a is provided with a portion for equalizing the in-plane temperature distribution of the organic EL panel and a portion for supplying current.

  Further, the conventional organic EL device 1a requires a connector and a terminal block for connecting lead wires and parts for fixing the panel separately, and there is a problem that the structure is complicated and the cost is increased. Further, since the structure is complicated, it is difficult to attach and detach the panel, and there is a problem that the panel replacement operation is not easy.

JP 11-214152 A JP 2003-173868 A JP 2005-32682 A JP 2000-195660 A

  The object of the present invention is to suppress the generation of heat spots on the organic EL panel and to be able to connect electrically, to enable high-intensity lighting with a high current density, and to simplify the structure and facilitate thinning. The object is to provide an organic EL device.

  According to one aspect of the present invention, a substrate, an organic EL element disposed on the substrate and having an anode layer and a cathode layer, an adhesive layer disposed to cover the organic EL element, and the adhesive layer A sealing substrate that seals the organic EL element, a first groove and a second groove, a soaking plate disposed on the sealing substrate, and disposed in the first groove, An insulating first elastic body having a first metal plate connected to the anode layer, and a second elastic body having a second metal plate disposed in the second groove and connected to the cathode layer at the top And an organic EL device including a main body substrate disposed on the soaking plate.

  According to the present invention, the generation of heat spots in the organic EL panel can be suppressed, electrical connection is possible, the current density is high, and high-intensity lighting is possible, and the structure is simplified and thinning is easy. An organic EL device can be provided.

1 is a schematic plane pattern configuration diagram of an organic EL device according to a first embodiment of the present invention. FIG. FIG. 2 is a schematic cross-sectional structure diagram taken along line II in FIG. 1. The typical plane pattern block diagram seen from the heat equalizing plate side of the organic electroluminescent apparatus which concerns on the 1st Embodiment of this invention. FIG. 4 is a schematic sectional view taken along line II-II in FIG. 3. FIG. 4 is a schematic sectional view taken along line III-III in FIG. 3. FIG. 2 is a schematic cross-sectional structure diagram for explaining one step of the method for manufacturing the organic EL device according to the first embodiment of the invention (part 1). Typical cross-section FIG. (2) explaining 1 process of the manufacturing method of the organic electroluminescent apparatus concerning the 1st Embodiment of this invention. Typical cross-section FIG. (3) explaining 1 process of the manufacturing method of the organic electroluminescent apparatus concerning the 1st Embodiment of this invention. Typical cross-section FIG. (4) explaining 1 process of the manufacturing method of the organic electroluminescent apparatus concerning the 1st Embodiment of this invention. Typical cross-section FIG. (5) explaining 1 process of the manufacturing method of the organic electroluminescent apparatus concerning the 1st Embodiment of this invention. Typical cross-section FIG. (6) explaining 1 process of the manufacturing method of the organic electroluminescent apparatus concerning the 1st Embodiment of this invention. Typical cross-section FIG. (7) explaining 1 process of the manufacturing method of the organic electroluminescent apparatus based on the 1st Embodiment of this invention. The photograph of the organic electroluminescent panel of 6x8 matrix structure formed using the organic electroluminescent apparatus which concerns on the 1st Embodiment of this invention. The enlarged view of 1 panel part of the organic electroluminescent panel of FIG. The photograph showing the part of the main body board which affixs the heat equalizing plate of the organic electroluminescent apparatus which concerns on the 1st Embodiment of this invention. FIG. 17 is an enlarged view of the substrate main body portion of FIG. 16. The characteristic view showing the relationship between the brightness | luminance of the organic electroluminescent apparatus which concerns on the 1st Embodiment of this invention, and an electric current. The typical plane pattern block diagram explaining the electric current concentration part of the conventional organic EL apparatus.

  Next, a first embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Also, the following first to sixth embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention are components. The material, shape, structure, arrangement, etc. are not specified below. Various modifications can be made to the embodiment of the present invention within the scope of the claims.

(First embodiment)
(Organic EL device)
A schematic planar pattern configuration example of the organic EL device 1 according to the first embodiment of the present invention is expressed as shown in FIG. A schematic cross-sectional structure taken along line II in FIG. 1 is expressed as shown in FIG.

  In the organic EL device 1 according to the first embodiment, a schematic plane pattern configuration example viewed from the heat equalizing plate 18 side from which the main body substrate 22 is removed is expressed as shown in FIG. Moreover, the schematic cross-sectional structure along the II-II line of FIG. 3 is represented as shown in FIG. 4, and the schematic cross-sectional structure along the III-III line of FIG. 3 is represented as shown in FIG.

  As shown in FIGS. 1 to 5, the organic EL device 1 according to the first embodiment is disposed on the ITO substrate 10 and the organic EL element 40 having the anode layer 12 and the cathode layer 14. An adhesive layer 16 disposed so as to cover the organic EL element 40, a sealing substrate 17 that seals the organic EL element 40 via the adhesive layer 16, and a groove 8a and a groove 8b. The soaking plate 18 disposed above, the insulating elastic body 28a having the metal plate 34 disposed in the groove 8a and connected to the anode layer 12 on the upper side, and the cathode 8 disposed on the upper side in the groove 8b. An elastic body 28 b having a metal plate 36 connected to the layer 14 and a main body substrate 22 disposed on the soaking plate 18 are provided.

  The elastic body 28b− has insulation or conductivity.

  The metal plate 34 is connected to the anode layer 12 via the anode wiring 26, the metal plate 36 is connected to the cathode layer 14 via the cathode wiring 24, the anode wiring 26 is in the groove 8a, and the cathode wiring 24 is in the groove 8b. Is arranged.

  A hollow gap 20 is provided between the organic EL element 40 and the adhesive layer 16.

  The main body substrate 22 includes a groove 8c and an insulating elastic body 29 that is disposed in the groove 8c and has a metal plate 35 on the top.

  The elastic body 28 a, the elastic body 28 b and the elastic body 29 are compressed by screwing the heat equalizing plate 18 and the main body substrate 22, and the metal plate 35 is connected to the metal plate 34 and the anode lead-out wiring 27. Is connected to the main board 22 (see FIG. 12).

  As shown in FIGS. 1 to 2, the organic EL device 1 according to the first embodiment includes an ITO substrate 10, an organic EL element 40 disposed on the ITO substrate 10, a sealing substrate 17, and a seal. And an adhesive layer 16 disposed on the stop substrate 17. A hollow gap 20 is disposed between the organic EL element 40 and the adhesive layer 16. The organic EL element 40 includes an anode layer 12 disposed on the ITO substrate 10, an organic EL layer 30 disposed on the anode layer 12, and a cathode layer 14 disposed on the organic EL layer 30. The organic EL layer 30 includes a hole transport layer 32 disposed on the anode layer 12, a light emitting unit (not shown) disposed on the hole transport layer 32, and an electron transport layer 31 disposed on the light emitting unit. With.

  That is, in the organic EL device 1 according to the first embodiment, the sealing substrate 17 is disposed so as to face the ITO substrate 10, and the ITO substrate 10 and the sealing substrate 17 are bonded together via the adhesive layer 16. It has a configuration. Thereby, the organic EL element 40 can be prevented from coming into contact with moisture or moisture from the outside and can be protected from an impact from the outside.

  Furthermore, the organic EL device 1 according to the first embodiment includes a soaking plate 18 disposed on the sealing substrate 17 and a main substrate 22 disposed on the soaking plate 18. The soaking plate 18 is provided with an elastic body 28a having a metal plate 34 at the top in the groove 8a for arranging the anode electrode A.

  On the other hand, the main body substrate 22 is provided with an elastic body 29 having a metal plate 35 on the upper side in a groove 8c facing the groove 8a for forming the anode electrode A.

  The elastic body 28a having the metal plate 34 on the upper side and the elastic body 29 having the metal plate 35 on the upper side have screw holes (41, 42: see FIGS. 3 and 16) for fixing the heat equalizing plate 18 and the main body substrate 22. The elastic bodies 28a and 29 are compressed by screwing them through, and the metal plate 34 and the metal plate 35 are electrically connected. An anode lead-out wiring 27 is connected between the metal plate 34 and the metal plate 35 via solder. The anode lead-out wiring 27 is disposed in the groove 8c formed in the main body substrate 22 (see FIG. 16). In order to insulate the anode lead-out wiring 27 from the heat equalizing plate 18 and the main body substrate 22, the anode lead-out wiring 27 may have a covering structure that secures an electrical shield.

  The metal plates 34 and 35 can be formed of, for example, a copper plate.

  Since the organic EL device 1 according to the first embodiment is configured so that light is emitted from the ITO substrate 10 side, the ITO substrate 10 is a transparent substrate that transmits light. An example of the material of the ITO substrate 10 is glass. The thickness is preferably about 0.1 to 1.1 mm, for example. The ITO substrate 10 can be made flexible by using a transparent resin such as polycarbonate or polyethylene terephthalate. In this case, a gas barrier layer (not shown) may be disposed between the ITO substrate 10 and the adhesive layer 16 in order to prevent intrusion of water vapor, oxygen, or the like that causes the life of the organic EL device 1 to deteriorate. preferable. Examples of the gas barrier layer include metal oxides such as silicon oxide and aluminum oxide, or metal nitrides such as aluminum nitride and silicon nitride.

  The anode layer 12 can transmit light and is made of a transparent electrode made of ITO (indium-tin oxide) having a thickness of about 150 to 160 nm, for example.

  In the organic EL layer 30, a hole transport layer 32, a light emitting unit (not shown), and an electron transport layer 31 are sequentially stacked from the ITO substrate 10 side.

  The hole transport layer 32 is for smoothly transporting holes injected from the anode layer 12 to the light emitting part. For example, NPB (N, N-di (naphthalyl)-) having a thickness of about 60 nm is used. N, N-diphenyl-benzidene).

The electron transport layer 31 is for smoothly transporting electrons injected from the cathode layer 14 to the light emitting portion, and is made of, for example, Alq ₃ (aluminum quinolinol complex) having a thickness of about 35 nm.

The light emitting portion is for emitting light by recombination of injected holes and electrons. For example, about 1% of a coumarin compound (C545T) which is a light emitting species is doped, and the thickness is about 30 nm. consisting of Alq _3.

  The organic EL layer 30 may be configured using a layer other than the hole transport layer 32 and the electron transport layer 31, for example, a hole injection layer, an electron injection layer, or the like.

  The cathode layer 14 has a thickness of about 150 nm, for example, and is made of, for example, aluminum.

  The adhesive layer 16 for bonding the sealing substrate 17 and the ITO substrate 10 seals the organic EL layer 30 and transmits Joule heat generated in the organic EL layer 30 to the sealing substrate 17 side to dissipate the heat. It is. The adhesive layer 16 has a thickness of about 3 to 500 μm, for example.

The material of the adhesive layer 16 is not particularly limited as long as it has the above-described function, and examples thereof include a thermoplastic resin, a thermosetting resin, and a UV curable resin. From the viewpoint of reliability, it is more preferable to use a UV curable resin or a thermosetting resin. As the UV curable resin or the thermosetting resin, for example, an epoxy resin can be applied. Examples of the thermoplastic resin include resins such as vinyl chloride resin, polyethylene, polypropylene, acrylic, polyethylene terephthalate, polyamide, and polycarbonate. The thermoplastic resin preferably has fluidity than the organic EL layer 30 in a state where it is softened by heating. The viscosity of the thermoplastic resin may be, for example, less than about 1 × 10 ⁴ Pa · s (pascal second) when softened by heating. Preferably, the range is about 1 × 10 to 1 × 10 ⁴ Pa · s. Examples of the thermosetting resin include an epoxy resin, a phenol resin, a polyurethane resin, and a melamine resin. Examples of the UV curable resin include acrylic resins, epoxy resins, and polyester resins.

  Moreover, in 1st Embodiment, the hollow sealing structure which has the hollow gap 20 with a small gap space | interval to the extent which can ensure thermal conductivity is disclosed. Even in the hollow sealing structure, for example, when a narrow gap structure of about 10 μm to about 15 μm is realized, sufficient thermal conductivity can be secured with a high yield. The hollow gap 20 may be filled with, for example, nitrogen or an inert gas.

  Further, since the sealing substrate 17 has a function of radiating the heat transmitted from the adhesive layer 16 to the outside, a material having high thermal conductivity is desirable.

  As shown in FIGS. 3 and 4, the organic EL device 1 according to the first embodiment includes a groove 8 a for arranging the anode electrode A in the heat equalizing plate 18 arranged on the sealing substrate 17. Inside, an elastic body 28a having a metal plate 34 at the top is disposed, and further, an elastic body 28b having a metal plate 36 at the top is disposed in the groove 8b for disposing the cathode electrode K therein. Cathode wiring 24 is connected to the metal plate 36 via solder 36 a, and the cathode wiring 24 is connected to the cathode layer 14 through a groove 8 b formed in the soaking plate 18. The cathode wiring 24 may be provided with a covering structure that ensures an electrical shield.

  Similarly to the metal plates 34 and 35, the metal plate 36 can be formed of, for example, a copper plate.

  As shown in FIGS. 3 and 5, the organic EL device 1 according to the first embodiment includes an anode wiring 26 connected to a metal plate 34 via a solder 34 a, and the anode wiring 26 is a soaking plate. 18 is connected to the anode layer 12 through a groove 8a formed in the groove 18a. In order to insulate the anode wiring 26 from the soaking plate 18 and the main body substrate 22, the anode wiring 26 may have a covering structure that secures an electrical shield.

  The anode-side elastic body 28a may be an insulating elastic body, and the cathode-side elastic body 28b may be a conductive or insulating elastic body. Specifically, as the insulating elastic body, for example, an insulating spring formed of foamed silicon sponge, silicone resin or the like can be used. As the conductive elastic body, for example, a metallic spring is used. Can be used. As another insulating elastic body, for example, a piston structure can be used.

  Specifically, the soaking plate 18 for suppressing the heat spot is formed of copper (Cu) having a high thermal conductivity.

  Similarly to the soaking plate 18, the main body substrate 22 may be made of, for example, copper (Cu) having a high thermal conductivity and the same potential as the cathode electrode K.

  Therefore, in the organic EL device 1 according to the first embodiment, the soaking plate 18 and the main body substrate 22 are both electrically conductive, for example, copper (Cu), at the same potential as the cathode electrode K that is normally held at the ground potential. As the conductive elastic body 28b on the cathode side, a metallic spring or the like can be used.

  Note that the overall thickness of the structure from which the main body substrate 22 shown in FIG. 4 is removed is, for example, about 4.5 mm, and is thinned.

  The operation of the organic EL device 1 according to the first embodiment is as follows.

  First, a constant voltage is applied between the anode layer 12 and the cathode layer 14 of the organic EL device 1. As a result, holes are injected from the anode layer 12 into the light emitting part through the hole transport layer 32, and electrons are injected from the cathode layer 14 into the light emitting part through the electron transport layer 31. Light is emitted by recombination of holes and electrons injected into the light emitting portion. The emitted light is emitted to the outside through the ITO substrate 10.

(Method for manufacturing organic EL device)
The manufacturing method of the organic EL device according to the first embodiment is expressed as shown in FIGS.

  As shown in FIGS. 6 to 12, the method of manufacturing the organic EL device according to the first embodiment includes a step of forming the grooves 8 a and 8 b in the soaking plate 18, the soaking plate 18 and the sealing substrate. The step of thermocompression bonding 17, the step of forming the adhesive layer 16 on the surface of the sealing substrate 17, the step of forming the organic EL element 40 having the anode layer 12 and the cathode layer 14 on the ITO substrate 10, and the adhesive layer 16, the step of bonding the ITO substrate 10 and the sealing substrate 17 through 16; the step of disposing the insulating elastic body 28a in the groove 8a; and the step of disposing the insulating or conductive elastic body 28b in the groove 8b. A step of disposing a metal plate 34 connected to the anode wiring 26 on the elastic body 28a, a metal plate 36 connecting the cathode wiring 24 to the elastic body 28b, and connecting the anode wiring 26 to the anode layer 12. The cathode wiring 24 is connected to the cathode layer 14. And a step of connecting, the step of screwing the main circuit board 22 to the heat equalizing plate 18.

  Furthermore, it has the process of forming the groove | channel 8c in the main body board | substrate 22, and the process of arrange | positioning the insulating elastic body 29 which has the metal plate 35 connected to the anode extraction wiring 27 in the upper part in the groove | channel 8c. May be.

  The method for manufacturing the organic EL device according to the first embodiment will be described in detail below.

(A) First, as shown in FIG. 6, a soaking plate 18 having grooves 8a for arranging the anode electrode A and grooves 8b for arranging the cathode electrode K is formed on the sealing substrate 17 with a heat conductive resin. Crimping is performed through (not shown) or the like. The pressure bonding temperature is about 60 ° C., for example.

(B) Next, on the surface of the sealing substrate 17 made of glass having a substantially rectangular shape in plan view, the viscosity is about 1 × 10 to 1 × 10 ⁴ Pa · s in a state where the viscosity is softened by heating, for example. The adhesive layer 16 made of about a thermoplastic resin is formed uniformly with a thickness of, for example, about 3 to 500 μm. The adhesive layer 16 having high fluidity in a high temperature state can be formed using, for example, spin coating, dispenser, spray application, dipping, flexographic printing, or screen printing. On the other hand, after the adhesive layer 16 having low fluidity formed into a pellet shape when the temperature is low is placed on the sealing substrate 17, it can be formed in close contact by heating and reflowing. Alternatively, the adhesive layer 16 previously formed into a sheet shape can be formed on the sealing substrate 17 by a laminator.

(C) On the other hand, after forming the anode layer 12 on the ITO substrate 10, the hole transport layer 32, the light emitting part, and the electron transport layer 31 are formed in this order, and then the cathode layer 14 is formed to form an organic EL element. 40 is formed.

(D) Next, as shown in FIG. 7, the sealing substrate 17 having the adhesive layer 16 formed on the top surface and the ITO substrate 10 having the organic EL element 40 mounted on the top surface are combined with the sealing substrate 17 and the organic EL device 40. Are aligned so as to face each other and heated at about 60 ° C. to soften the adhesive layer 16.

(E) Next, the pressure is returned to atmospheric pressure, and with the adhesive layer 16 softened, a pressure of about 100 kPa is applied to the upper portion of the ITO substrate 10, and the adhesive layer 16, the organic EL element 40, and the ITO substrate 10 are applied. And the sealing substrate 17 are brought into close contact with each other. Since heating is performed from the sealing substrate 17 side, heat transfer to the adhesive layer 16 is fast, and the heating time can be shortened.

(F) Next, it cools to room temperature, the adhesive layer 16 is hardened, and the structure shown in FIG. 7 is formed. In the case where a thermosetting resin is used as the adhesive layer 16, it is cured by heating after being bonded to the organic EL element 40 in a softened state, and does not soften even when the temperature rises. Further, when a UV curable resin is used as the adhesive layer 16, it is cured by irradiating with UV light and does not soften even when the temperature rises.

(G) Next, as shown in FIGS. 8 (a) and 8 (b), elastic bodies 28a and 28b in which a double-sided pressure-sensitive adhesive tape 28c is pasted on the upper and lower surfaces are produced.

(H) Next, as shown in FIG. 9, the elastic body 28a is arranged in the groove 8a for arranging the anode electrode A, and the elastic body 28b is arranged in the groove 8b for arranging the cathode electrode K. In FIG. 9, the double-sided tape 28c is not shown.

(I) Next, as shown in FIGS. 10 (a) and 10 (b), solders 36a and 34a are respectively formed on the metal plates 36 and 34 punched into a circle. Here, the cathode wiring 24 is soldered to the solder 36 a on the metal plate 36, and the anode wiring 26 is soldered to the solder 34 a on the metal plate 34. For the cathode wiring 24 and the anode wiring 26, wiring with insulation coating is used in order to ensure electrical insulation from the soaking plate 18. In FIG. 10, the cathode wiring 24 and the anode wiring 26 are not shown.

(J) Next, as shown in FIG. 11, the metal plate 34 is affixed on the elastic body 28a, and the metal plate 36 is affixed on the elastic body 28b. In FIG. 11, illustration of the solder 36a and the cathode wiring 24, the solder 34a and the anode wiring 26 is omitted.

(K) Next, as shown in FIG. 12, the cathode wiring 24 and the cathode layer 14 are connected, and the anode wiring 26 and the anode layer 12 are connected (see FIG. 5). The soaking plate 18 is at the same potential as the cathode electrode K and also serves as the cathode electrode. When soldering the cathode wiring 24 directly to the soaking plate 18, it is difficult to raise the soaking plate 18 to a temperature at which the solder layer melts because the soaking plate 18 has a large heat capacity. For this reason, it is necessary to give more heat to the soaking plate 18 by using a hot plate or the like instead of a soldering iron. However, if it is a small electrode, it can be soldered easily.

(L) Next, as shown in FIG. 12, the main body substrate 22 is connected to the heat equalizing plate 18 by screws. Here, the elastic body 28 b is compressed, and the metal plate 36 to which the cathode wiring 24 is connected is connected to the main body substrate 22. Similarly, the elastic bodies 28 a and 29 are compressed, and the metal plate 34 to which the anode wiring 26 is connected is connected to the metal plate 35. As shown in FIG. 2, the metal plates 34 and 35 are compressed to each other, and the anode lead-out wiring 27 is connected thereto.

  According to the method of manufacturing the organic EL device according to the first embodiment, when the adhesive layer 16 comes into contact with the organic EL element 40, the adhesive layer 16 is in a softened state. Even if there is a foreign substance on the surface of the organic EL element 40, the adhesive layer 16 takes in a foreign substance such as dust or dust, so that the organic EL element 40 can be bonded without damaging it. Further, when the manufacturing process is performed with the organic EL element 40 facing downward, the possibility that foreign matters such as dust adhere to the organic EL element 40 is reduced. As a result, the yield can be improved even in a manufacturing environment in which foreign matter such as dust or dust exists.

  Moreover, according to the manufacturing method of the organic EL device according to the first embodiment, since the sheet-like thermosetting resin, thermoplastic resin, or the like is used for the adhesive layer 16, the shape of the adhesive layer 16 is maintained at room temperature. be able to. This is advantageous in terms of manufacturing process for increasing the size of the organic EL device.

  Moreover, according to the manufacturing method of the organic EL device according to the first embodiment, since a sheet-like thermosetting resin, a thermoplastic resin, or the like is used as the adhesive layer 16, a roll-type supply form is used in the manufacturing process. Can take. This makes it possible to improve the efficiency of the manufacturing process.

  According to the manufacturing method of the organic EL device according to the first embodiment, the yield can be improved.

  An organic EL panel having a 6 × 8 matrix configuration formed by using the organic EL device and the manufacturing method thereof according to the first embodiment is expressed as shown in FIG. Further, an enlarged view of one panel portion is represented as shown in FIG. 13 and 14, the size of one panel portion is about 4 cm × about 4 cm, but the size can be further expanded to about 15 cm × about 15 cm or more.

  The portion of the main body substrate 22 to which the heat equalizing plate 18 of the organic EL device 1 according to the first embodiment is attached is expressed as shown in FIG. Further, an enlarged view of a portion of the main board 22 in FIG. 15 is expressed as shown in FIG. As shown in FIGS. 2, 15, and 16, the main body substrate 22 has an elastic body 29 and a metal plate 35 disposed in the groove 8 c, and an anode lead wire 27 is soldered to the metal plate 35. Yes. In the examples of FIGS. 15 and 16, the anode lead-out wiring 27 is illustrated as being wired to one panel portion of the organic EL panel. That is, in the organic EL panel having the matrix configuration of FIG. 13, the anode lead-out wiring 27 is formed so that each panel of the organic EL device 1 can be electrically driven independently. On the other hand, in the organic EL panel having the matrix configuration of FIG. 13, the organic EL panel in the row direction or the column direction may be formed to have a common anode lead-out wiring 27.

The luminance characteristics representing the relationship between the luminance L (cd / m ² ) and the current I _L (A) of the organic EL device according to the first embodiment are expressed as shown in FIG. As is apparent from FIG. 17, a wide range of current I _L (A) of about 0.25 A to 2.0 A can be conducted. Further, for such a wide range of current I _L (A), a high luminance L of about 20,000 cd / m ² to about 120,000 cd / m ² is obtained, and the luminance dynamic range is wide. Recognize.

  According to the organic EL device according to the first embodiment, a structure capable of suppressing the heat spot generation of the organic EL panel and making electrical connection is realized, and more current is conducted to the organic EL panel. Therefore, high-intensity lighting is possible. At the same time, the lighting unit can be made thin.

  According to the organic EL device according to the first embodiment, even if the anode wiring 26 for the anode electrode A and the cathode wiring 24 for the cathode electrode K are provided, the elastic body 28a, 28b is arranged. At the same time, the elastic bodies 28a, 28b and 29 having a spring function and heat resistance (Tg> = 100 ° C.) are compressed in order to make the main body substrate 22 and the soaking plate 18 conductive. Realizes layering and high brightness.

  According to the organic EL device according to the first embodiment, the temperature distribution of the organic EL device 1 is made uniform, and the cathode electrode K is applied to the soaking plate 18 for suppressing the generation of heat spots that cause local thermal runaway. And the electrode structure of the anode electrode A is incorporated. Since the electrode structure of the anode electrode A and the cathode electrode K has a planar electrode structure disposed in the groove 8a and the groove 8b formed in the soaking plate 18, the unit of the organic EL device 1 is made thin. Can do.

  According to the organic EL device according to the first embodiment, a heat spot generated when the organic EL panel is turned on is suppressed by the above-described structure, so that more current can be conducted and high-intensity lighting is performed. Became possible.

  In the first embodiment, the organic EL panel having a planar structure having a quadrangle as a basic pattern has been mainly disclosed. However, the organic EL panel body is not limited to these, and the organic EL panel body has a cylindrical structure, a spherical structure, A fullerene structure or the like may be used. The basic pattern of the organic EL panel is not limited to a quadrangle, and may be a pentagon, hexagon, polygon, circle, ellipse, or a combination pattern thereof. The organic EL panel may be arranged as a pattern structure such as a Penrose tile.

  Further, in the first embodiment, the hollow sealing structure having the hollow gap 20 having a gap distance small enough to ensure thermal conductivity is disclosed, but the present invention is not limited to this, and the solid sealing is not limited thereto. It is also possible to apply a structure and a liquid sealing structure.

  According to the first embodiment, the generation of heat spots in the organic EL panel is suppressed, electrical connection is possible, high current density is possible, high brightness lighting is possible, the structure is simplified, and the thin layer An organic EL device that can be easily manufactured can be provided.

(Other embodiments)
As described above, the present invention has been described according to the first embodiment. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

  The organic EL device of the present invention is applicable to the field of flexible electronics such as the organic EL display field and the organic EL lighting field.

DESCRIPTION OF SYMBOLS 1 ... Organic EL apparatus 8a, 8b, 8c ... Groove 10 ... ITO substrate 12 ... Anode layer 14 ... Cathode layer 16 ... Adhesive layer 17 ... Sealing substrate 18 ... Heat equalizing plate 20 ... Hollow gap 22 ... Body substrate 24 ... Cathode wiring 26 ... Anode wiring 27 ... Anode lead-out wiring 28a, 28b, 29 ... Elastic body 28c ... Double-sided tape 30 ... Organic EL layer 31 ... Electron transport layer 32 ... Hole transport layers 34, 35, 36 ... Metal plates 34a, 36a ... Solder 40 ... Organic EL elements 41, 42 ... Fixing screw hole A ... Anode electrode K ... Cathode electrode

Claims (9)

A substrate,
An organic EL device disposed on the substrate and having an anode layer and a cathode layer;
An adhesive layer disposed so as to cover the organic EL element;
A sealing substrate for sealing the organic EL element via the adhesive layer;
A soaking plate having a first groove and a second groove and disposed on the sealing substrate;
An insulating first elastic body having a first metal plate disposed in the first groove and connected to the anode layer at an upper portion;
A second elastic body disposed in the second groove and having a second metal plate connected to the cathode layer at an upper portion;
An organic EL device comprising: a main body substrate disposed on the soaking plate.   The organic EL device according to claim 1, wherein the second elastic body has an insulating property.   The organic EL device according to claim 1, wherein the second elastic body has conductivity.   The first metal plate is connected to the anode layer via an anode wiring, the second metal plate is connected to the cathode layer via a cathode wiring, and the anode wiring is connected to the cathode wiring in the first groove. The organic EL device according to claim 1, wherein the organic EL device is disposed in the second groove.   The organic EL device according to claim 1, wherein a hollow gap is provided between the organic EL element and the adhesive layer.   The organic body according to claim 1, wherein the main body substrate includes a third groove and an insulating third elastic body disposed in the third groove and having a third metal plate on an upper portion thereof. EL device.   The organic EL device according to claim 2, wherein the first elastic body and the second elastic body are formed of silicon sponge.   The organic EL device according to claim 3, wherein the first elastic body is formed of a silicon sponge, and the second elastic body is formed of a metal spring.   The first elastic body, the second elastic body, and the third elastic body are compressed by screwing the heat equalizing plate and the main body substrate, and the third metal plate is the first metal plate and the anode. The organic EL device according to claim 6, wherein the organic EL device is connected to a lead wiring and the second metal plate is connected to the main body substrate.