JP5183991B2 - Position confirmation device and position confirmation method - Google Patents

Description

  The present invention relates to a position confirmation device and a position confirmation method that can be used in a die bonder or the like that mounts a semiconductor chip or the like on a lead frame or the like.

  When manufacturing a semiconductor device, die bonding for mounting a semiconductor chip on a lead frame as a mounted member is performed. For this die bonding, a die bonder having a collet for adsorbing chips is used.

  As shown in FIG. 5, such a die bonder includes a bonding arm (not shown) having a collet 3 for attracting the semiconductor chip 1 of the supply unit 2 and a recognition camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. And a recognition camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

  The supply unit 2 includes a semiconductor wafer, and the semiconductor wafer is divided into a large number of semiconductor chips 1. Further, the bonding arm holding the collet 3 can be moved between the pickup position and the bonding position via the conveying means.

  Further, the collet 3 is vacuum-sucked through the suction holes opened in the lower end surface thereof, and the chip 1 is adsorbed on the lower end surface of the collet 3. If this vacuum suction (evacuation) is released, the chip 1 is detached from the collet 3.

  Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed with a recognition camera arranged above the supply unit 2, and the collet 3 is positioned above the chip 1 to be picked up, and then the collet 3 as indicated by an arrow A. Is lowered to pick up the chip 1. Thereafter, the collet 3 is raised as shown by the arrow B.

  Next, the recognition camera 12 disposed above the bonding position is used to observe the island portion 5 of the lead frame 4 to be bonded, the collet 3 is moved in the direction of arrow C, and the island portion 5 is Then, the collet 3 is moved downward as indicated by an arrow D to supply the chip 1 to the island portion 5. In addition, after the chip is supplied to the island portion 5, the collet 3 is raised as indicated by the arrow E and then returned to the standby position above the pip-up position as indicated by the arrow F.

  That is, by moving the collet 3 sequentially as indicated by arrows A, B, C, D, E, and F, the chip 1 positioned based on the observation of the pickup recognition camera is picked up by the collet 3. The chip 1 is mounted on the island portion 5.

  However, when the substrate side is heated and the bonding operation is performed in a high temperature atmosphere (for example, about 400 ° C. to 500 ° C.), a positive flame is generated in the space between the camera and the substrate. In this way, when a hot flame occurs, the recognition image is affected by the hot flame, and the recognition of the chip and the island portion becomes unstable, so that a highly accurate bonding operation cannot be performed.

  Therefore, various countermeasures against the hot flame have been conventionally taken. As one of countermeasures against the heat flame, there is one in which a blow air flow is generated and the heat flame is blown off by this blow air flow (Patent Document 1). In addition, the interval between the recognition camera and the object to be photographed is shortened. It is possible to propose a method of sealing a space for generating a hot flame by arranging a rod lens or the like between the recognition camera and the object to be photographed.

  As shown in FIG. 6, the apparatus described in Patent Document 1 includes a mounting table 10 on which the lead frame 4 is mounted, a cover 11 that also covers the work space S on the mounting table 10, and a work hole 11 a in the cover 11. Illumination (ring illumination) 12 disposed above, a lens barrel 13 having a recognition camera located above the illumination 12, and a flame prevention blow mechanism 14 disposed near the work hole 11a of the cover 11. Prepare. In FIG. 6, reference numeral 1 denotes a semiconductor chip on the lead frame 4.

  A heater (not shown) is disposed on the mounting table 10. With this heater, the work table S in the mounting table 10 and the cover 11 is maintained at a high temperature during the bonding process. Further, in order to prevent the lead frame 4 and the like from being oxidized in the work space S, nitrogen gas which is an inert gas is blown.

At this time, nitrogen gas flows out from the work hole 11a of the cover 11, but since the room temperature is 20 ° C., for example, a positive flame is generated due to the temperature difference between the nitrogen gas and the room temperature. Therefore, an inert gas is injected from the prevention blow mechanism 14 toward the hot flame rising from the work hole 11 a of the cover 11. This blows off the hot flame from the camera's field of view and improves the recognition accuracy of the camera.
JP 2003-7759 A

  The one provided with the hot flame prevention blow mechanism 14 as shown in FIG. 6 blows off the hot flame between the cover 11 and the illumination 12. However, the hot flame is also generated in the work hole 11a and in the work hole 11a of the work space S or in the vicinity thereof, and this hot flame cannot be blown off, and the recognition accuracy of the camera cannot be improved. Moreover, there is a possibility that the nitrogen gas blown off in this way may be supplied to a site that is adversely affected by the nitrogen gas.

  If the distance between the recognition camera and the object to be photographed is shortened so that there is no influence of the heat, there is a possibility that the work space cannot be secured. In addition, even when a rod lens or the like is arranged between the recognition camera and the object to be photographed to seal the space where the heat is generated, the rod lens cannot secure a work space, It is necessary to increase the sealing performance, which increases the cost.

  In view of the above problems, the present invention provides a position confirmation device and a position confirmation method capable of confirming the position of an observation site in an environment where the heat is generated without removing the heat.

The first position confirmation device of the present invention is a position confirmation device for confirming the position of the observation region in an atmosphere in which the image of the observation region of the recognition camera fluctuates, and a fixing unit in the vicinity of the observation region A reference target provided on the recognition target, the recognition camera capable of observing the reference target and the observation site at the same time, an image of the reference target by the recognition camera in a state of fluctuation, and a known fixed position of the reference target And a position detection means for detecting an actual position of the observation site from the image of the reference target and the observation site by the recognition camera in the state where the fluctuation occurs based on the information. Here, the reference target is not limited as long as it can be recognized by the recognition camera, and can be constituted by a mark portion, a projection portion, a recess portion, or the like having a color different from the color of other portions.

  According to the position confirmation device of the present invention, it is possible to simultaneously observe the reference target and the observation site with the recognition camera, and if the reference target and the observation site are observed in a state where fluctuation occurs, the reference target and An image is taken in a state where the observation site is fluctuating as a whole. In this case, the observation site is an image that is shifted by the same amount as the shift of the reference target. Therefore, if the deviation of the reference target is taken into account, the deviation of the observation site due to the fluctuation can be corrected. That is, since the reference target is provided in the fixed portion, the actual position of the reference target is known, and this known position is compared with the image position of the reference target in a swaying state, and the amount of deviation is calculated. The actual position of the observation site can be detected by calculating and adding this shift amount to the image position of the observed site in a swaying state, that is, subtracting the shift amount.

The second position confirmation device according to the present invention provides workpiece supply position information based on the position of the observation region and the workpiece position of the workpiece supplied to the observation region in an atmosphere in which the image of the observation region of the recognition camera fluctuates. A reference target provided in a fixed part in the vicinity of the observation site, the recognition camera capable of simultaneously observing the reference target and the observation site, and fluctuations occurring Fluctuation occurs based on the image of the reference target by the recognition camera, the known fixed position information of the reference target, and the known relative positional relationship information between the workpiece conveying means for supplying the workpiece to the observation site and the reference target A position detection means for detecting the workpiece supply position information from the image of the reference target and the observation site by the recognition camera in the state where Here, the workpiece supply position information is information on the positional relationship between the position of the workpiece transfer means and the observation site.

  The second position confirmation device of the present invention can simultaneously observe the reference target and the observation site with the recognition camera, and if the reference target and the observation site are observed in a state where the fluctuation occurs, the reference target An image is taken in a state where the observation site is fluctuating as a whole. In this case, the observation site is an image that is shifted by the same amount as the shift of the reference target. Therefore, if the deviation of the reference target is taken into consideration, it is possible to confirm the workpiece supply position information where the deviation is caused by the fluctuation. That is, since the reference target is provided in the fixed portion, the actual position of the reference target and the relative positional relationship between the reference target and the work transporting unit are known, and this known information and the image position in a wobbling state are known. The workpiece supply position information can be detected by calculating the amount of deviation and adding the amount of deviation to the image position of the observed portion in the swayed state, that is, subtracting the amount of deviation. For this reason, by adjusting the position on the workpiece conveying means side or adjusting the position on the observation site based on the workpiece supply position information, the work on the observation site (for example, the observation site is set to the island part of the lead frame). If so, an operation of supplying a semiconductor chip to the island portion can be performed.

  The fluctuation is based on the positive heat of the airflow generated by heating the observation site. Moreover, it is preferable to provide at least two reference targets.

  The reference target can be configured by an irradiation unit using laser light irradiated from the vicinity of the observation site. In other words, an irradiation part is formed by irradiating a laser beam from the vicinity of the observation part, and this irradiation part becomes a reference target provided in the fixed part, and the observation part and the observation part can be simultaneously observed by the recognition camera. Become.

  The position confirmation device can be used for a die bonder in which the observation site is an island portion of a lead frame, and the workpiece conveying means is provided with a suction collet that sucks the workpiece.

The first position confirmation method of the present invention is a position confirmation method for confirming the position of the observation part in an atmosphere in which the image of the observation part of the recognition camera fluctuates, and in the state where the fluctuation has occurred, In the recognition camera, a step of simultaneously photographing the observation site and a reference target provided in a fixed portion near the observation site, an image of the reference target and the observation site in a state where fluctuations occur, and a reference And a position calculating step for calculating the actual position of the observation site based on the known fixed position information of the target.

  According to the first position confirmation method of the present invention, an observation site and a reference target provided in a fixed part near the observation site can be photographed with a recognition camera. If the reference target and the observation site are observed in a state where the fluctuation is occurring, an image in a state in which the reference target and the observation site are fluctuated as a whole is taken. Compare the actual position of the known reference target with the image position in the swaying state, calculate the amount of deviation, and add this amount of deviation to the image position of the observing part in the swaying state, that is, the amount of deviation By subtracting only this, the actual position of the observation site can be detected. That is, the first position confirmation method of the present invention can be implemented using the first position confirmation device.

According to the second position confirmation method of the present invention, workpiece supply position information based on the position of the observation portion and the workpiece position of the workpiece supplied to the observation portion in an atmosphere in which the image of the observation portion of the recognition camera fluctuates. A measurement step of measuring a positional relationship between a workpiece suction collet holding a workpiece and a reference target provided in a fixed part near the observation site in a state where fluctuation does not occur , A step of simultaneously photographing the observation site and a reference target provided in a fixed portion in the vicinity of the observation site with the recognition camera in a state where the fluctuation is occurring, and for recognition in a state where the fluctuation is occurring Based on the image of the reference target and observation part by the camera, the known fixed position information of the reference target, and the known relative positional relationship information of the workpiece conveying means and the reference target, the workpiece supply It is obtained by a position calculating step of detecting location information.

  According to the second position confirmation method of the present invention, the observation site and the reference target provided in the fixed part near the observation site can be photographed with the recognition camera. If the reference target and the observation site are observed in a state where the fluctuation is occurring, an image in a state in which the reference target and the observation site are fluctuated as a whole is taken. The actual position of the reference target and the relative positional relationship between the reference target and the work transport means are known, and this known information is compared with the image position in a wobbling state to calculate the deviation amount of the reference target. The workpiece supply position information can be calculated by adding the deviation amount to the image position of the observed portion in the swayed state, that is, subtracting the deviation amount. That is, the second position confirmation method of the present invention can be implemented using the second position confirmation device.

  In the present invention, the actual position of the observation region can be detected without being affected by the fluctuation even in an atmosphere in which the image of the observation region of the recognition camera fluctuates. For this reason, observation (position observation) of this observation part can be performed correctly, and subsequent processing to this observation part can be performed correctly. If the workpiece supply position information can be detected, observation can be performed by adjusting the position on the workpiece transfer means side or adjusting the position on the observation site based on the workpiece supply position information. Work on the part (for example, if the observation part is the island part of the lead frame) can be performed. That is, the accuracy of chip bonding work can be improved.

  By providing at least two reference targets, the position of the observation site can be calculated from a large amount of known data, and the position can be confirmed with higher accuracy.

  If the reference target is configured by the laser light irradiation unit, it is not necessary to form the reference target directly in the vicinity of the observation site, and the apparatus can be simplified. In addition, it is possible to change the position of the laser light irradiation unit that is the reference target, and to adjust the position of the reference target in accordance with the shape, size, and the like of the observation site.

  Embodiments of the present invention will be described below with reference to FIGS.

  FIG. 1 shows a die bonder, which performs die bonding for mounting a semiconductor chip 21 on a lead frame 24.

  Such a die bonder includes a bonding arm 30 having a collet 23 for adsorbing the semiconductor chip 21 of the supply unit 22, a recognition camera 26 for observing the semiconductor chip 21 of the supply unit 22, and an island portion of the lead frame 24 at the bonding position. And a recognition camera 32 for observing 25.

  The supply unit 22 includes a semiconductor wafer 28 mounted and supported on a wafer support device 27. The semiconductor wafer 28 is divided into a large number of semiconductor chips 21. The collet 23 is connected to a collet holder 29, and the collet 23, the collet holder 29, and the like constitute a bonding arm 30. The bonding arm 30 can be moved between the pickup position and the bonding position via the conveying means 31. The transport unit 31 can drive the bonding arm 30 in the X, Y, θ, and Z directions.

  Further, the chip 21 is vacuum-sucked through the suction holes opened in the lower end surface of the collet 23, and the chip 21 is adsorbed on the lower end surface of the collet 23. If this vacuum suction (evacuation) is released, the chip 21 is detached from the collet 23.

  Next, a die bonding method using a die bonder apparatus will be described. First, the chip 21 to be picked up is observed with the recognition camera 26 arranged above the supply unit 22, the collet 23 is positioned above the chip 21 to be picked up, and then the let 23 is lowered. The lever chip 21 is picked up.

  Further, the recognition camera 32 arranged above the bonding position observes the island portion 25 of the lead frame 24 to be bonded, moves the collet 23 onto the island portion 25, and then lowers the collet 24. Then, the chip 21 is supplied to the island portion 25.

  That is, the chip 21 confirmed based on the observation by the recognition camera 26 is picked up by the collet 23 of the bonding arm 30 and is transported to the lower part of the camera 32 for recognizing the island part. Is recognized by the camera 32 and the position is measured. Then, feedback control is performed, the bonding arm 30 is driven, and the chip 21 is mounted on the island portion 25 at the measured position. For this reason, the collet 13 moves as indicated by an arrow A1 shown in FIG.

  By the way, although not shown, the lead frame 24 is mounted on a mounting table. A heating means (for example, a heater) is disposed on the mounting table, and the lead frame 24 is heated. For this reason, the lead frame 24 is placed in a high-temperature atmosphere, and a positive flame 40 is generated from the island portion 25 of the lead frame 24 as shown in FIG.

  Therefore, the position confirmation device of the present invention is configured to detect the actual position of the observation region 42 (island portion 25) even when the hot flame 40 is generated. Therefore, a reference target 41 is provided in a fixed part (for example, a part of a transport rail (not shown) or an arm extended from the transport rail) near the island part 25, and the reference camera 41 is connected to the reference target 41. Observation with the observation part 42 is enabled. The recognition camera 32 is connected to position detection means 43 (see FIG. 1) for detecting the position of the observation site from the image obtained by the recognition camera. The reference target 41 is not limited as long as it can be recognized by the recognition camera 32, and can be constituted by a mark portion, a protrusion portion, a recess portion, or the like having a color different from the color of other portions (lead frame 24). .

  The position detection means 43 is constituted by, for example, a microcomputer, and the fluctuation is detected based on the image of the reference target by the recognition camera 32 in the state where the fluctuation is occurring and the known fixed position information of the reference target 41. The position of the observation region 42 is detected from the image obtained by the recognition camera 32 in the state in which it occurs.

  That is, as shown in FIG. 3, the position confirmation method using the position confirmation device includes a heated imaging step 51 and a position calculation step 52 that calculates the position of the observation region 42 based on the image in step 51.

  Specifically, first, in the imaging step 51 in a heated state, the reference target 41 and the island part 25 (observation site 42) are imaged simultaneously, and the reference target 41 and the observation site 42 are observed simultaneously. In this state, since fluctuation is occurring, an image in a state where the reference target 41 and the observation site 42 fluctuate together is photographed.

  Further, the reference target 41 is provided in the fixed part, and its position is constant and known. For this reason, in the position calculation step 52, the reference target 41 is compared with a state where the fluctuation is not occurring and a state where the fluctuation is occurring, and the displacement amount is calculated. On the image, the observation site 42 is displaced by the same amount as this displacement.

  Therefore, in the position calculation step 52, the position of the observation region 42 in the non-fluctuating state can be calculated (detected) by subtracting the displacement amount from the image in the fluctuating state. As a result, accurate information on the observation region 42 can be obtained.

  In FIG. 3, the observation part 42 is the island part 25, and in order to supply the chip 21 as a workpiece to the island part 25, the position of the island part 25 is confirmed using this position confirmation device. . On the other hand, you may make it confirm the position of the chip | tip 21 supplied to the island part 25 using this position confirmation apparatus.

  In this case, the island portion 25 and the chip 21 supplied to the island portion 25 may be used as the observation site 42. Also in this case, the actual position of the chip 21 supplied to the island portion 25 can be confirmed under the environment where the fluctuation occurs by performing the same process as that in FIG.

  In the above embodiment, the positional relationship between the suction collet 23 for supplying the chip 21 is not considered, but in the process shown in FIG. 4, the positional relationship between the suction collet 23 and the reference target 41 is considered. The supply accuracy of the chip 21 to the island portion 25 is improved.

  That is, the process shown in FIG. 4 includes a measurement process 50 for measuring the positional relationship between the reference target 41 and the collet 23 before heating (a state in which no fluctuation occurs). For this reason, the imaging | photography process 51 of a heating state image | photographs the reference | standard target 41 and the island part 25 (observation site | part) simultaneously, and observes the reference | standard target 41 and the observation site | part 42 simultaneously. In this state, since fluctuation is occurring, an image in a state where the reference target 41 and the observation site 42 fluctuate together is photographed. Further, in the position calculating step 52, the reference target 41 is compared with a state where no fluctuation is occurring and a state where the fluctuation is occurring, and the amount of displacement is calculated. On the image, the observation site is displaced by the same amount as this displacement.

  The actual position of the reference target 41 and the relative positional relationship between the reference target 41 and the adsorption collet 23 are known. Therefore, in the position calculation step 52, the known information is compared with the image position in the swaying state to calculate a deviation amount of the reference target 41, and the image position of the observation region 42 in the swaying state is calculated. In other words, the amount of deviation is subtracted. As a result, it is possible to obtain accurate information on the position status (work supply position information) for supplying the chip 21 to the island portion 25, and the chip 21 can be supplied to the island portion 25 based on this information. . That is, the workpiece supply position information is information on the positional relationship between the position of the workpiece transfer means 31 (suction collet) and the observation site 41.

  In the present invention, the actual position of the observation region 42 can be detected without being affected by the fluctuation even in an atmosphere in which the image of the observation region of the recognition camera 32 fluctuates. For this reason, observation (position observation) of this observation part 42 can be performed correctly, and subsequent processing to this observation part 42 can be performed correctly. Further, when the workpiece supply position information can be detected, by performing the position adjustment on the workpiece conveying means side or the position adjustment on the observation site 42 side based on the workpiece supply position information, Work on the observation site can be performed (for example, if the observation site 42 is the island portion 25 of the lead frame 24, the semiconductor chip 21 is supplied to the island portion 25). That is, the accuracy of the bonding work of the chip 21 can be improved.

  Since the two reference targets 41 are provided, the position of the observation region 42 can be calculated from a lot of known data, and the position can be confirmed with higher accuracy.

  The reference target 41 can be configured by a laser beam irradiation unit. That is, as indicated by the phantom line in FIG. 2, a laser oscillator 55 that irradiates laser light is disposed in the vicinity of the island portion 25. Then, the laser oscillator 55 irradiates a fixed portion (for example, a part of a transport rail (not shown) or an arm extended from the transport rail) near the island portion 25.

  If the fixed part is irradiated with laser light, an irradiation part is formed, and this irradiation part can be simultaneously observed with the observation part 42 by the recognition camera 32. Thereby, the irradiation part of a laser beam can comprise the said reference | standard target.

  In this way, by using the laser light irradiation portion as the reference target 41, it is not necessary to form the reference target 41 directly in the vicinity of the observation site, and the apparatus can be simplified. In addition, the position of the laser light irradiation unit that is the reference target 41 can be changed, and the position of the reference target 41 can be adjusted to the observation site 42 according to the shape, size, and the like.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the observation site 42 is limited to the island portion 25 of the lead frame 24. It is not a thing, but it can be applied to the place where you want to check the position in the atmosphere where the hot flame occurs. For this reason, fluctuations are not limited to those based on the positive heat of the airflow generated by heating the observation region 42. The number of reference targets 41 may also be at least one and may be three or more. Further, the color, size, shape, etc. of the reference target 41 are also arbitrary. When there are a plurality of reference targets 41, all the reference targets 41 are all the same color, the same size, and the same shape. The color, size, shape, and the like may be different for each reference target, or any number of the quasi-targets 41 among all the reference targets 41 may have different colors, sizes, shapes, and the like.

  When the reference target 41 is constituted by the laser light irradiation part, when the optical path of the laser light is long in the atmosphere in which the hot flame is generated, the laser light is affected by the hot flame and is in a swaying state. The reference target 41 may not be configured. For this reason, it is necessary to set the optical path of the laser beam as short as possible. In addition, since the irradiation part should just be observable with the camera 32 for recognition, the kind of laser beam, a wavelength, etc. can be selected arbitrarily.

It is a simplified perspective view of the die bonder using the position confirmation apparatus which shows embodiment of this invention. It is a simplified perspective view of the position confirmation device. It is a simplified process diagram of a position confirmation method showing an embodiment of the present invention. It is a simplified process diagram of a position confirmation method showing another embodiment of the present invention. It is a simplified diagram showing a bonding method. It is a simplified diagram of a conventional bonding apparatus.

Explanation of symbols

24 Lead frame 25 Island part 31 Conveying means 32 Recognition camera 41 Reference target 42 Observation site 43 Position detecting means 50 Measuring process 51 Imaging process 52 Position calculating process

Claims (8)

A position confirmation device for confirming the position of the observation part in an atmosphere in which fluctuation occurs in the image of the observation part of the recognition camera,
A reference target provided in a fixed part near the observation site;
The recognition camera capable of simultaneously observing the reference target and the observation site;
Based on the image of the reference target by the recognition camera in the state where the fluctuation is occurring and the known fixed position information of the reference target, the image of the reference target and the observation site by the recognition camera in the state where the fluctuation is occurring And a position detecting means for detecting the actual position of the observation site. A position confirmation device for confirming workpiece supply position information based on the position of the observation portion and the workpiece position of the workpiece supplied to the observation portion in an atmosphere in which fluctuation occurs in the image of the observation portion of the recognition camera,
A reference target provided in a fixed part near the observation site;
The recognition camera capable of simultaneously observing the reference target and the observation site;
The image of the reference target by the recognition camera in the state where the fluctuation occurs, the known fixed position information of the reference target, the known relative positional relationship information between the workpiece conveying means for supplying the workpiece to the observation site and the reference target And a position detection means for detecting workpiece supply position information from an image of a reference target and an observation site by a recognition camera in a state where fluctuation occurs.   The position confirmation apparatus according to claim 1, wherein the fluctuation is based on a positive flame of an airflow generated by heating the observation site.   The position confirmation device according to claim 1, wherein at least two reference targets are provided.   The position confirmation device according to any one of claims 1 to 4, wherein the reference target is configured by an irradiation unit using laser light irradiated from the vicinity of an observation site.   The position confirmation apparatus according to claim 2, wherein the observation site is an island portion of a lead frame, and the work transport unit includes a suction collet that sucks the work. In an atmosphere in which fluctuation occurs in the image of the observation site of the recognition camera, a position confirmation method for confirming the position of the observation site,
A step of simultaneously photographing the observation site and a reference target provided in a fixed portion in the vicinity of the observation site with the recognition camera in a state where fluctuations are generated;
A position calculation step of calculating an actual position of the observation site based on an image of the reference target and the observation site in a state where fluctuations are generated, and known fixed position information of the reference target. The location confirmation method. A position confirmation method for confirming workpiece supply position information based on the position of the observation portion and the workpiece position of the workpiece supplied to the observation portion in an atmosphere in which fluctuation occurs in the image of the observation portion of the recognition camera,
In a state where fluctuation does not occur, a measurement process for measuring the positional relationship between a workpiece suction collet holding a workpiece and a reference target provided in a fixed part near the observation site,
A step of simultaneously photographing the observation site and a reference target provided in a fixed portion in the vicinity of the observation site with the recognition camera in a state where fluctuations are generated;
Based on the image of the reference target and the observation site by the recognition camera in the state where the fluctuation has occurred, the known fixed position information of the reference target, and the known relative positional relationship information of the workpiece transfer means and the reference target, A position confirmation method comprising: a position calculation step of detecting workpiece supply position information.

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