JP5058520B2 - Substrate gripping structure, substrate gripping jig, and substrate gripping method - Google Patents

Description

  The present invention relates to a substrate gripping structure, a substrate gripping jig, and a substrate gripping method, and transports a semiconductor substrate such as a silicon substrate or a substrate such as a glass substrate, or forms a film on a substrate, develops it, or cleans it. It is applied to place a substrate and hold it by vacuum suction when performing predetermined processing such as processing, and in particular, a substrate holding structure for holding an amorphous substrate, a relatively small substrate, and a substrate The present invention relates to a gripping jig and a substrate gripping method.

Conventionally, when a substrate to be processed such as a silicon substrate is supplied to a substrate processing apparatus such as a spinner, for example, a transfer robot takes out the substrate from a cassette in which a large number of substrates are stored on a shelf. Then, it is handed over to the substrate processing apparatus.
The transfer robot has a finger as a transfer jig provided with a holding mechanism for holding the substrate by vacuum suction at the tip (see, for example, Patent Document 1), and the tip of the finger is a cassette. Then, for example, the center part of the back surface of the substrate is sucked and the finger is retracted to take out the substrate.

The transfer robot rotates the finger holding the substrate about the rotation axis and moves it up and down to transfer the substrate to the suction surface of the substrate chuck of the substrate processing apparatus.
In the substrate processing apparatus, the substrate is adsorbed and held on the adsorption surface, the chemical solution is supplied to the substrate, and the substrate is cleaned with the chemical solution, or the chemical solution is applied to the substrate.
That is, in the substrate chuck, the flat suction surface is formed on the upper surface, and suction is performed along the suction path to the ejector through the suction hole, and the substrate is sucked, and The substrate chuck is driven to rotate at a predetermined number of revolutions, and in this state, a chemical solution is supplied to the substrate from a nozzle to perform cleaning of the substrate, application of the chemical solution to the substrate, and the like (for example, see Patent Document 2). .)
JP-A-7-106399 JP 2004-16887 A

The first problem to be solved is that the above prior art can only handle a substrate having a size within a predetermined range, and in particular, cannot hold a damaged irregularly shaped substrate or a relatively small substrate. That is the point.
For example, substrates such as III-V compound semiconductors (gallium arsenide, etc.), silicon, sapphire, and the like are easily cracked during handling, and even if a small broken piece can be used (for example, an integrated circuit can be formed) Also, it had to be disposed of.
The second problem is that in the above-described prior art, it is necessary to prepare at least a plurality of types of cassettes for storing substrates according to the size of the substrates. For this reason, the work is complicated and the cost in the processing process is increased.

The present invention has been made in view of the above-described circumstances, and in particular, can hold an irregularly shaped substrate or a relatively small substrate, for example, to increase the utilization rate of the substrate regardless of damage or the like. A first object is to provide a substrate holding structure, a substrate holding jig, and a substrate holding method.
A second object is to provide a substrate gripping structure, a substrate gripping jig, and a substrate gripping method capable of improving versatility of a cassette or the like and reducing the cost in the processing process.

In order to solve the above-mentioned problems, the invention described in claim 1 relates to a substrate gripping structure for sucking and gripping a substrate by sucking air along an intake path, and has a predetermined shape and area. has, together with the first suction surface of the first suction port for sucking the substrate having any shape and size are provided is formed in the interior, the leading to the first suction port via one of the substrate gripping jig intake path is formed, the second suction surface of the second suction port for sucking-gripping the substrate and the substrate gripping jig is provided is formed respectively together are, inside, by each branch of the second bifurcated fingers second intake paths are formed respectively extending to the suction port, the substrate is adsorbed and grasped, the said first suction surface substrate is placed, the substrate gripping said each second suction surface In a state in which the jig is mounted, said first intake path and said each second intake passage is communicated, along with the first intake passage said each second intake passage, the air When suction is performed, the substrate is attracted to the first suction surface of the substrate gripping jig, and the back surface of the substrate gripping jig is attached to the second suction surface of each branching portion of the bifurcated finger. By adsorbing the attracted surface, the substrate is gripped by each branching portion of the bifurcated finger , and the mounting shelf on which the substrate is placed via the substrate gripping jig has the bifurcated portion. The second suction surface of each branch portion of the finger is inserted into the suction surface on the back surface of the substrate gripping jig , and each branch portion of the bifurcated finger is mounted on the substrate while the substrate is suctioned and gripped. first and second recesses are provided for enabling be withdrawn from the shelf It is characterized in that there.

Further, the invention according to claim 2 relates to the substrate gripping structure according to claim 1, wherein the substrate gripping jig is made of a disc-shaped rigid member, and the back surface is the suction surface. A base that is in contact with a surface; and a substrate mounting portion that is formed on the base and is made of a disk-like elastic member, and whose surface is used as the first suction surface. A suction hole extending from the back surface of the substrate to the surface of the substrate mounting portion is formed inside as the first intake path.

  According to a third aspect of the present invention, there is provided a substrate gripping structure according to the second aspect, wherein a plurality of the substrates can be adsorbed on the surface of the substrate platform as the first adsorption surface. The first suction port is formed.

  According to a fourth aspect of the present invention, there is provided a substrate holding jig used for adsorbing and holding a substrate by suctioning air along an intake path. It is characterized by comprising a substrate gripping jig constituting the described substrate gripping structure.

According to a fifth aspect of the present invention, there is provided a substrate gripping method for sucking and gripping a substrate by sucking air along an intake path, and has a predetermined shape and area, and has an arbitrary shape. A first suction surface provided with a first suction port for sucking the substrate having the shape and size is formed, and a first intake path leading to the first suction port is formed therein . through the substrates grasping jig, the second suction surface of the second suction port for sucking-gripping the substrate and the substrate gripping jig is provided are formed, the internal in the by each branch of the second bifurcated fingers second intake paths are formed respectively extending to the suction port, the substrate and the adsorbent-grasping, wherein the first intake passage each second intake passage The substrate is placed on the first suction surface so as to communicate with each other. And, wherein the placing the substrate gripping jig to each second adsorption surface, along with the first intake passage said each second intake passage, by performing the suction of air, the substrate By adsorbing to the first adsorption surface of the substrate holding jig and adsorbing the adsorption surface of the back surface of the substrate holding jig to the second adsorption surface of each branch portion of the bifurcated finger, said substrate while held by the branch portion of the bifurcated fingers, to placing shelf which the substrate is placed through the substrate gripping jig, preliminarily, the second adsorption of each branch portion of the bifurcated fingers In order to insert the surface up to the attracted surface on the back surface of the substrate gripping jig and to extract each branching portion of the bifurcated finger from the mounting shelf while attracting and gripping the substrate It is characterized in that preferably provided with first and second recesses

According to the configuration of the present invention, the substrate on the mounting shelf is attracted and gripped by the gripping mechanism via the substrate gripping jig, and therefore, in particular, it can grip an irregularly shaped substrate or a relatively small substrate. For example, the utilization factor of the substrate can be increased regardless of damage or the like.
Further, for example, by using a substrate holding jig having a relatively large area and using a cassette for storing a substrate that matches the size of the substrate holding jig, substrates of different sizes can be mixed in the same type of cassette. Can be handled like a substrate of the same size, for example, the versatility of a cassette or the like can be improved and the cost in the processing step can be reduced.

By attracting and gripping a substrate with a gripping mechanism via a substrate gripping jig, it is possible to grip an indeterminately shaped substrate or a relatively small substrate. The first purpose of increasing the rate was realized.
Further, for example, by using a substrate holding jig having a relatively large area and using a cassette for storing a substrate that matches the size of the substrate holding jig, substrates of different sizes can be mixed in the same type of cassette. The second purpose of, for example, enhancing the versatility of cassettes and the like and reducing the cost in the processing steps has been realized.

  FIG. 1 is a plan view showing the configuration of a substrate holding jig according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing the configuration of the substrate holding jig, and FIG. FIG. 4 is a cross-sectional view showing a state where the substrate is held via the substrate holding jig, FIG. 4 is a cross-sectional view showing a state where the substrate is held via the substrate holding jig during substrate processing, and FIG. FIG. 6 is an explanatory diagram for explaining a method of transporting the substrate from the storage cassette to the substrate processing apparatus by the transport robot, and FIG. 6 is a block diagram for explaining the configuration of the transport robot and the substrate processing apparatus. 7 is a cross-sectional view showing the configuration of the mounting shelf of the storage cassette, FIG. 8 is a cross-sectional view showing the configuration of the substrate processing apparatus, and FIG. 9 is the configuration of the substrate delivery jig of the substrate processing apparatus FIG.

In the substrate gripping jig 1 of this example, as shown in FIG. 5, for example, a substrate S such as a silicon substrate having an arbitrary shape and size is taken out from a storage cassette 3 in which the transfer robot 2 stores the substrate S. Used to hold the substrate S when the substrate S is transported to the substrate processing apparatus 4 such as a spinner or when the substrate processing apparatus 4 performs a predetermined process on the substrate S, as shown in FIGS. In addition, a substrate placing portion 7 made of a disk-like member on which the substrate S is placed is formed on the base portion 6 made of a disk-like member (for example, lining processed), and is schematically configured.
The base 6 and the substrate platform 7 are both formed with suction holes 6a and 7a at the center, and the base 6 and the substrate platform 7 are overlapped and joined so that the suction holes 6a and 7a communicate with each other. ing.

  As shown in FIG. 3, the substrate gripping structure 9 in this example is configured so that the substrate gripping jig 1 on which the substrate S is placed on the suction surface 7 b on the front side is the tip of the finger 16 of the transport robot 2. In a state of being placed on the suction surface 16a formed in the part, it is sucked and gripped by the finger 16, and is configured schematically. The substrate S is placed on the suction surface 7b and the suction hole 7a is closed, and the back surface side is closed. The suction surface 6b is placed on the suction surface 16a of the finger 16 so that the suction hole 6a and the suction hole 16b communicate with each other. By vacuum suction, air is sucked along the suction holes 6a and 7a and the suction path 28, and the finger is sucked. The substrate gripping jig 1 is attracted to 16 and the substrate S is pressed against the substrate gripping jig 1, whereby the substrate S and the substrate gripping jig 1 are attracted and gripped by the finger 16.

  In addition, as shown in FIG. 4, the substrate gripping structure 11 at the time of substrate processing in this example includes a substrate gripping jig 1 on which the substrate S is placed on the suction surface 7 b on the front surface side. In a state of being placed on the suction surface 36a of the chuck 36, the substrate chuck 36 is sucked and gripped, and the substrate S is placed on the suction surface 7b to close the suction hole 7a. The suction surface 6b is placed on the suction surface 36a of the substrate chuck 36, the suction hole 6a and the suction hole 36b are communicated with each other, and is sucked along the suction holes 6a and 7a and the suction path 47 by vacuum suction. The substrate gripping jig 1 is attracted to the chuck 36 and the substrate S is pressed against the substrate gripping jig 1, whereby the substrate S and the substrate gripping jig 1 are attracted and gripped to the substrate chuck 36.

  The base portion 6 of the substrate gripping jig 1 is made of, for example, a disk-shaped member made of stainless steel as a rigid member, has a relatively large area (in this example, a diameter of about 50 mm), and has a thickness of the substrate S (this In the example, the thickness is approximately the same as the thickness of approximately 300 μm (in this example, approximately 0.5 mm). Further, as the base portion 6, a substrate in which warpage or burr is not generated or removed from the peripheral end surface is used. In this example, the surface of the base 6 is coated with a fluorine resin (PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer) or the like).

The substrate mounting portion 7 has a hardness that does not damage the silicon substrate as a material constituting the substrate S, for example, and has a relatively high friction coefficient with respect to the silicon substrate, for example. An elastic material having a high resistance to (a chemical used in the substrate processing apparatus 4) and a relatively high heat conduction coefficient is selected. For example, a perfluoroelastomer or the like is used.
The substrate mounting portion 7 is formed on the base portion 6 by lining processing or the like, and in this example, has a diameter of about 16 mm and a thickness similar to that of the substrate S (in this example, about 0.5 mm). Is done.
Further, in this example, the diameters of the suction holes 6a and 7a are slightly smaller than the diameters of the suction holes 16b formed at the tip of the finger 16 and the suction holes 36b formed on the upper surface of the substrate chuck 36 (for example, approximately 3 mm) is set.

  As shown in FIG. 5, the transport robot 2 is attached to a body portion 13 that can be displaced along the vertical direction (z-axis direction) and a distal end portion of the body portion 13, and around a rotation axis that is parallel to the vertical direction. First arm 14 that is pivotable to the first arm 14, a second arm 15 that is attached to the tip of the first arm 14 and that can pivot about a pivot axis parallel to the vertical direction, and a tip of the second arm 15. Is a flat plate that is rotatable about a rotation axis parallel to the vertical direction, and has a suction surface 16a for suctioning and gripping the substrate gripping jig 1 and the substrate S by vacuum suction at the tip. A finger 16, a body drive unit 17, a first arm drive unit 18, a second arm drive unit 19, a finger drive unit 21, and a robot controller 22 are included. Here, the thickness of the finger 16 is set smaller than the gap between the mounting shelves 32 of the storage cassette 3.

In this example, the body drive unit 17, the first arm drive unit 18, the second arm drive unit 19, and the finger drive unit 21 have a servo motor or the like.
As shown in FIG. 6, the robot controller 22 includes a main control unit 23 having a CPU (central processing unit) and the like, and a storage unit for storing processing programs executed by the main control unit 23, various data, and the like. 24, an operation unit 25, a body drive unit 17, a first arm drive unit 18, a second arm drive unit 19, and a motor drive unit 26 for controlling and driving a servo motor and the like constituting the finger drive unit 21. It is comprised by information processing apparatus, such as a computer provided with.

In the transfer robot 2, the first arm 14, the second arm 15, and the finger 16 rotate simultaneously around the respective rotation axes, so that the tip of the finger 16 becomes a predetermined straight line or curve on the horizontal plane. Displaces along.
A suction path 28 for sucking air is formed in each of the body 13, the first arm 14, the second arm 15, and the finger 16 constituting the transfer robot 2. In the transport robot 2 of this example, the suction path 16a is operated by operating a decompression device (such as an ejector) (not shown) in a state where the suction surface 16a at the tip of the finger 16 is brought close to the suction surface 6b of the base 6. The air is sucked along 28, and the substrate gripping jig 1 and the substrate S are sucked and gripped by the suction surface 16 a of the finger 16.
The diameter of the suction hole 16b at the tip of the suction path 28 is set to be slightly larger than the diameter of the suction holes 6a and 7a, so that the rear side edge of the suction hole 6a is adsorbed.

The transfer robot 2 stores the finger 16 in the storage cassette 3 and inserts it below the substrate gripping jig 1 on which the substrate S is placed. By sucking the back side edge of the suction hole 6a of the jig 1 and pressing the substrate S against the board holding jig 1, the back side edge of the suction hole 6a of the board holding jig 1 is By sucking, the substrate S and the substrate gripping jig 1 are sucked and gripped by the fingers 16, and the substrate S and the substrate gripping jig 1 are taken out.
Thereafter, the substrate S is placed on the placement portion 51 a of the substrate delivery jig 51 of the substrate delivery portion 41 of the substrate processing apparatus 4, and the substrate S is delivered.

As shown in FIGS. 5 and 7, the storage cassette 3 has a large number of shelf-shaped storage units 31, 31,... For storing a large number of substrates S to be processed so as to be arranged along the vertical direction. Each storage unit 31 has a mounting shelf 32 for mounting the peripheral portion of the attracted surface 6b on the back surface side of the substrate gripping jig 1 on which the substrate S is mounted. The tip of the finger 16 is inserted, and has a substantially U-shaped recess 33 for guiding and contacting the tip of the finger 16 to the center of the attracted surface 6b of the substrate gripping jig 1.
Each mounting shelf 32 has a relatively small friction coefficient (sliding property) with respect to stainless steel or the like constituting the substrate gripping jig 1 such as PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer). (Relatively expensive) material.
Here, the finger 16 of the transfer robot 2 is inserted into a gap formed between the storage units 31, and the substrate gripping jig 1 on which the substrate S is placed is taken out from the storage unit 31.

  The substrate processing apparatus 4 supplies a chemical solution to a substrate S to be processed such as a silicon substrate, and cleans the substrate S with a chemical solution, applies a chemical solution to the substrate S, and the like. 5, 6, and 8, the substrate chuck 36 that is accommodated in the container 35 and grips the substrate S by vacuum suction, and the substrate chuck drive unit 37 that rotationally drives the substrate chuck 36. A chemical solution supply unit 39 including a nozzle 38 for supplying a chemical solution to the substrate S, a substrate delivery unit 41 that receives the substrate S from the finger 16 of the transfer robot 2 and delivers it to the substrate chuck 36, and a spinner that controls each component. And a controller 42.

Further, the outer wall portion 43 of the container 35 is formed in a cup shape so as to surround the substrate chuck 36 supporting the substrate S in order to prevent the chemical solution from scattering. Further, a waste liquid storage section 44 is formed at the bottom of the container 35, and a discharge pipe 45 for discharging the chemical liquid is connected to a predetermined portion of the bottom of the waste liquid storage section 44. FIG. 8 shows a state in which the substrate S of the substrate processing apparatus 1 is removed.
The waste liquid storage unit 44 has a substantially cylindrical shape with an annular cross-section in which the rotation axis of the substrate chuck 36 and the rotational symmetry axis are common.

Here, a chemical funnel receiving member 46 having a reverse funnel shape (a shape in which the funnel is turned down) is connected to the upper portion of the inner wall portion 44 a of the waste liquid storage portion 44 so as to surround the rotation shaft of the substrate chuck 36.
Note that a flange portion 46a that is inclined downward at a predetermined inclination angle toward the outer peripheral side with respect to the horizontal plane is formed on the upper portion of the chemical solution receiving member 46. Even if the chemical solution is sprayed on the upper surface of the flange portion 46a, the chemical solution Is made to flow downward toward the outer peripheral side, so that the chemical solution is prevented from entering the rotation axis side of the substrate chuck 36.
Further, the bottom surface 44b of the waste liquid storage section 44 is formed to be inclined with respect to the horizontal plane so that the chemical liquid flows down toward the inlet of the discharge pipe 45.

The substrate chuck 36 is formed with a flat suction surface 36a on the upper surface, and suction is performed along the suction path 47 from the suction hole 36b at the tip portion to the ejector, whereby the substrate S is sucked. The diameter of the suction hole 36b is set to be slightly larger than the diameter of the suction holes 6a and 7a, so that the back side edge of the suction hole 6a is adsorbed.
The substrate chuck drive unit 37 includes an AC servo motor, and rotates the substrate chuck 36 at a predetermined rotation speed (for example, several tens of rpm to several thousand rpm).

The chemical liquid supply unit 39 includes a nozzle 38 that constitutes a dispenser in which the chemical liquid is dropped toward the substrate S, a chemical liquid supply pump (not shown) that sends the chemical liquid to the nozzle 38, and a nozzle drive unit 49 that displaces the nozzle 38. Have.
The nozzle drive unit 49 includes, for example, a U-shaped arm (not shown) in which the nozzles 38 are attached to both tip portions with a predetermined separation, and a rotation axis along the vertical direction passing through the base portion of the arm. For example, a stepping motor that rotates the arm in a predetermined angle range is provided.

As shown in FIG. 8, the substrate delivery unit 41 is in a state where the substrate delivery jig 51 on which the substrate gripping jig 1 on which the substrate S is placed is placed and the substrate delivery jig 51 are suspended by the shaft 52. A support portion 53 that is supported by the actuator, an elevating actuator 54 for displacing the support portion 53 along the vertical direction, and a horizontal movement actuator 55 for displacing the support portion 53 along the horizontal plane together with the elevating actuator 54. have.
As shown in FIG. 9, the substrate delivery jig 51 has a placement portion 51 a for placing the peripheral portion of the attracted surface 6 b on the back side of the substrate gripping jig 1 on which the substrate S is placed, The mounting portion 51a has a substantially U-shaped recess 51b for inserting the tip of the finger 16 holding the substrate holding jig 1 and avoiding interference with the suction surface 36a of the substrate chuck 36. Yes.

  Here, the finger 16 descends from above with respect to the substrate delivery jig 51, and the tip of the finger 16 passes through the recess 51b. At the same time, the substrate gripping jig 1 on which the substrate S is placed is placed on the placement portion. The substrate delivery jig 51 placed on the substrate 51a and on which the substrate gripping jig 1 on which the substrate S is placed is lowered from above with respect to the suction surface 36a of the substrate chuck 36, and the recess 51b is sucked. Simultaneously with passing around the surface 36a, the substrate gripping jig 1 on which the substrate S is placed is placed on the suction surface 36a.

  As shown in FIG. 6, the spinner controller 42 includes a main control unit 57 having a CPU (central processing unit) and the like, and a storage unit for storing processing programs executed by the main control unit 57, various data, and the like. 58, an operation unit 59, a motor drive unit 61 for controlling and driving the motors constituting the substrate chuck drive unit 37 and the nozzle drive unit 49, and the electromagnetic components constituting the lift cylinder actuator 54 and the horizontal movement cylinder actuator 55. It is constituted by an information processing device such as a computer provided with an electromagnetic valve control unit 62 for controlling the valve.

Next, a substrate transport method using the substrate gripping jig 1 of this example will be described with reference to FIG. 3, FIG. 5, FIG. 7, and FIG.
The main control unit 23 of the transfer robot 2 controls the motor driving unit 26 to drive the finger driving unit 21 and the like, so that the fingers 16 are formed between the storage units 31 as shown in FIGS. After being placed in the gap, placed in the storage cassette 3 and placed below the substrate gripping jig 1 on which the substrate S is placed, for example, the center of the back side of the substrate S and the substrate gripping jig 1 The back side edge of the suction hole 6a is adsorbed.
Here, as shown in FIG. 3, air is sucked along the suction path 28 in a state where the suction surface 16 a at the tip of the finger 16 is in contact with or close to the suction surface 6 b of the base 6, thereby gripping the substrate. The jig 1 and the substrate S are sucked and held on the suction surface 16 a of the finger 16.

In other words, the substrate S is placed on the suction surface 7b on the front surface, the suction hole 7a is closed, and the suction surface 6b on the back surface is placed on the suction surface 16a formed at the tip of the finger 16 of the transfer robot 2. The suction hole 6a is communicated with the suction hole 16b formed at the tip of the finger 16, and is sucked along the suction holes 6a and 7a and the suction path 28 by vacuum suction. While the holding jig 1 is sucked, the substrate S is pressed against the substrate holding jig 1, and the substrate S and the substrate holding jig 1 are sucked and held by the finger 16.
In this way, when the substrate S is pressed against the substrate gripping jig 1 and by adsorbing the back side edge of the suction hole 6a of the substrate gripping jig 1, the substrate S and the substrate gripping jig 1 are moved. The main control unit 23 controls the motor driving unit 26 to drive the finger driving unit 21 and the like, and takes out the substrate S and the substrate holding jig 1 while being sucked and held by the fingers 16.

Thereafter, the main control unit 23 controls the motor driving unit 26 to drive the finger driving unit 21 and the like, and immediately above the placement unit 51 a of the substrate delivery jig 51 of the substrate delivery unit 41 of the substrate processing apparatus 4. Next, the substrate S is moved.
Next, the main control unit 23 controls the motor driving unit 26 to drive the body driving unit 17 and the like, and lowers the finger 16 from above with respect to the substrate delivery jig 51. Thus, as shown in FIG. 9, at the same time that the tip of the finger 16 passes through the recess 51b, the substrate gripping jig 1 on which the substrate S is placed is placed on the placement portion 51a, and the substrate S is delivered. Is called.

Next, the main control unit 57 of the substrate processing apparatus 4 controls the electromagnetic valve control unit 62 to drive the horizontal movement actuator 55 of the substrate transfer unit 41 so that the substrate transfer jig 51 is attached to the substrate chuck 36. After moving to just above the suction surface 36a, the lifting actuator 54 is driven, and the substrate delivery jig 51 on which the substrate gripping jig 1 on which the substrate S is placed is placed above the suction surface 36a. Descent from. Thus, at the same time as the recess 51b passes around the suction surface 36a, the substrate gripping jig 1 on which the substrate S is placed is placed on the suction surface 36a.
The main control unit 57 controls the electromagnetic valve control unit 62 to drive the horizontal movement actuator 55 to move the substrate delivery jig 51 away from the substrate chuck 36, and then drive the lifting / lowering actuator 54. Then, the substrate delivery jig 51 is pulled up.

Next, a substrate processing method using the substrate gripping jig 1 of this example will be described with reference to FIG.
As shown in FIG. 4, a suction path 47 leading from the suction hole 36b at the tip to the ejector in a state where the substrate gripping jig 1 on which the substrate S is placed is placed on the suction surface 36a of the substrate chuck 36. When the substrate S is adsorbed and gripped by the intake air along the direction, the main control unit 57 of the substrate processing apparatus 4 controls the motor driving unit 61 to rotate the substrate chuck 36 at a predetermined number of rotations. While, a predetermined chemical solution is dropped from the nozzle 38 for a predetermined time.

  Here, the substrate S is placed on the suction surface 7b on the front surface side to block the suction hole 7a, and the suction surface 6b on the back surface side is placed on the suction surface 36a of the substrate chuck 36, so that the suction hole 6a and The suction hole 36b is communicated, and suction is performed along the suction holes 6a and 7a and the suction path 47 by vacuum suction, so that the substrate gripping jig 1 is attracted to the substrate chuck 36 and the substrate S is gripped by the substrate. When pressed against the jig 1, the substrate S and the substrate gripping jig 1 are attracted and gripped by the substrate chuck 36. The diameter of the suction hole 36b is set to be slightly larger than the diameter of the suction holes 6a and 7a, so that the back side edge of the suction hole 6a is adsorbed.

As described above, according to the configuration of this example, the substrate S is attracted and held by the finger 16 or the substrate chuck 36 via the substrate holding jig 1, so that the substrate fragment is not limited regardless of its shape and size. The substrate S can be gripped even if it is an irregular shaped substrate S or a relatively small size (small diameter of 40 mm or less), and the utilization rate of the substrate can be increased regardless of damage.
Further, for example, by using the substrate holding jig 1 having a relatively large area and using the storage cassette 3 matched to the size of the substrate holding jig 1, substrates of different sizes can be placed in the same type of storage cassette 3. Since they can be stored together and handled like substrates of the same size, the versatility of the storage cassette can be improved and the cost in the processing steps can be reduced.
Moreover, as a material of the substrate mounting portion 7, for example, a material having a relatively high friction coefficient with respect to silicon is used, so that the substrate S can be prevented from being displaced or dropped. Further, since the substrate platform 7 has a buffer function, the substrate S can be protected from impact.

FIG. 10 is a plan view for explaining the configuration of the substrate gripping jig according to the second embodiment of the present invention. FIG. 11 shows the substrate gripped through the substrate gripping jig during substrate transport. It is sectional drawing which shows the state made.
This example is greatly different from the first embodiment described above in that a plurality of intake holes are provided in the substrate mounting portion of the substrate gripping jig.
Since the configuration other than this is substantially the same as the configuration of the first embodiment described above, the same constituent elements as those of the first embodiment will be described with reference to FIGS. The description is simplified by using the same reference numerals as those used.

As shown in FIGS. 10 and 11, the substrate gripping jig 1 </ b> A of this example is formed from a disk-shaped member on which substrate pieces Sa, Sb, Sc are placed on a base 6 made of a disk-shaped member. A substrate mounting portion 61 is formed and schematically configured.
A suction hole 6 a is formed at the center of the base 6. Further, the substrate mounting portion 61 is formed with a plurality of suction holes 61a1, 61a2,. The base 6 and the substrate mounting part 61 are overlapped and joined so that the suction hole 6a and the suction hole 61a communicate with each other. In this state, the 61a2, 61a3, ..., the suction hole 61a1, and the suction hole 6a are: The communication is made through the ridge portion 61c.

  In this example, substrate pieces Sa, Sb, Sc are placed on the suction surface 61b on the front surface side to block 61a1, 61a2,..., And the attracted surface 6b on the back surface side is the tip of the finger 16 of the transport robot 2. The suction hole 6a and the suction hole 16b formed at the tip of the finger 16 are communicated with each other, and the suction hole 6a and the suction holes 61a1 (61a2, 61a3 are formed by vacuum suction. ,...) And the suction path 28, the substrate gripping jig 1 is attracted to the fingers 16, and the substrates Sa, Sb, Sc are pressed against the substrate gripping jig 1 </ b> A to form the substrate Sa. , Sb, Sc and the substrate gripping jig 1A are attracted and gripped by the finger 16.

According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.
In addition, a plurality of substrate pieces can be placed and simultaneously transported and processed.

FIG. 12 is a cross-sectional view showing a state in which the substrate is gripped during transport via the substrate gripping jig according to the third embodiment of the present invention, and FIG. 13 is a storage cassette in which the substrate is stored. It is sectional drawing which shows the structure of this mounting shelf.
This example is greatly different from the first embodiment described above in that the suction hole of the substrate mounting portion is provided in the central portion and the suction hole of the base is provided in the peripheral portion.
Since the other configuration is substantially the same as the configuration of the first embodiment described above, the same components as those of the first embodiment are used in FIGS. 3 and 7 in FIGS. 12 and 13. The same reference numerals are used to simplify the description.

As shown in FIGS. 12 and 13, the substrate gripping jig 1 </ b> B of this example is a substrate mounting portion made of a disk-like member on which a substrate S is placed on a base portion 63 made of a disk-like member. 7 is formed and schematically configured.
The base 63 is formed with a suction hole 63a in the center on the front side and suction holes 63b and 63b in the peripheral edge on the back side. The suction hole 63a and both the suction holes 63b and 63b are connected by a ridge part 63c. It is communicated.
A suction hole 7a is formed at the center of the substrate platform 7, and the base 63 and the substrate platform 7 are overlapped and bonded so that the suction holes 63a and 7a communicate with each other.

The finger 16A of the transfer robot in this example is formed in a Y-shape with the front end branching into a bifurcated shape, and the peripheral portion of the attracted surface on the back side of the substrate gripping jig 1B is formed at the front end of each branch portion 64. Is formed on the suction surface 64a. Here, the substrate gripping jig 1B is placed so that the suction hole 63b and the suction hole 64b overlap on the suction surface 64a.
In addition, the mounting shelf 32A of the storage unit 31A of the storage cassette of this example has the branch portions 64 and 64 of the finger 16A inserted therein, and the branch portion 64 of the finger 16A on the periphery of the attracted surface of the substrate gripping jig 1B. , 64 are provided with substantially U-shaped recesses 65, 65 for guiding and contacting them.

According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.
In addition, for example, in the substrate processing apparatus, the configuration can be simplified by eliminating the substrate delivery section, and the transport (delivery) of the substrate S can be speeded up.

FIG. 14 is a cross-sectional view showing the structure of a substrate holding jig according to a fourth embodiment of the present invention.
This example is greatly different from the first embodiment described above in that a wall portion is formed around the entire periphery of the base portion of the substrate gripping jig.
Since the other configuration is substantially the same as the configuration of the first embodiment described above, the same reference numerals as those used in FIG. 2 are used in FIG. 14 for the same components as those of the first embodiment. The explanation will be simplified.

In the substrate gripping jig 1C of this example, as shown in FIG. 14, a substrate mounting portion 7 made of a disk-like member on which the substrate S is placed is formed on a base 67 made of a disk-like member. It is roughly structured.
The base 67 and the substrate platform 7 are both formed with suction holes 67a and 7a at the center, and the base 67 and the substrate platform 7 are overlapped and joined so that the suction holes 67a and 7a communicate with each other. ing.
In the base portion 67 of this example, a wall portion 67b for preventing the substrate S from dropping off is formed on the entire periphery of the base portion 67 when the substrate S is taken out or delivered. The wall 67b is formed with a discharge hole 67p at a predetermined location, for example, for discharging a chemical solution during substrate processing.

According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.
In addition, since the wall portion 67b is formed at the peripheral edge portion of the base portion 67, for example, the substrate S can be reliably prevented from falling off when the substrate S is taken out or delivered.

FIG. 15 is a cross-sectional view showing a state where a substrate is gripped during transport via a substrate gripping jig according to a fifth embodiment of the present invention.
This example is greatly different from the first embodiment described above in that the substrate holding jig can be sucked from above by a finger during substrate transfer.
Since the other configuration is substantially the same as the configuration of the first embodiment described above, the same reference numerals as those used in FIG. 3 are used in FIG. 15 for the same components as those of the first embodiment. The explanation will be simplified.

In the substrate gripping jig 1D of this example, as shown in FIG. 15, a substrate mounting portion 7 made of a disk-like member on which the substrate S is placed is formed on a base 69 made of a disk-like member. It is roughly structured.
The base 69 is formed with a suction hole 69a at the center on the surface side and an annular suction groove 69b at the peripheral edge on the surface side, and the suction hole 69a and the suction groove 69b communicate with each other by a plurality of ridges 69c. Has been.

A suction hole 7a is formed at the center of the substrate platform 7, and the base 69 and the substrate platform 7 are overlapped and joined so that the suction holes 69a and 7a communicate with each other.
In the finger 16B of the transfer robot of this example, an annular suction surface 71a for sucking the peripheral edge of the surface of the base 69 is formed on the lower surface side of the tip, and the annular intake groove 71b is connected to the intake groove 69b. In a state where they are arranged so as to overlap each other, the substrate gripping jig 1D is sucked and gripped, and is retracted or pulled up.

According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.
In addition, the substrate can be easily taken out even when the substrate is disposed on a tray in a planar manner, for example.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Are also included in the present invention.
For example, in the above-described embodiments, the case where the substrate processing apparatus is applied to a spinner has been described. However, the present invention can also be applied to a case where the substrate as the object to be processed is not necessarily rotated. In this case, it is not always necessary to adsorb the substrate only on the stage.

Further, the material of the base of the substrate gripping jig is not limited to stainless steel, and aluminum, other metals, alloys may be used, and synthetic resin or ceramics may be used.
In addition, as a material for the substrate mounting part, fluorine rubber including vinylidene fluoride (VDF) fluorine rubber, butyl rubber, ethylene-propylene rubber, chloroprene rubber, hydrin rubber, nitrile rubber, acrylic rubber, silicone rubber, urethane rubber, etc. It may be used. In addition to synthetic rubber, natural rubber may be used.

Further, the base portion of the substrate gripping jig and the substrate mounting portion may be integrated. That is, it may be manufactured from the same material. Alternatively, the substrate placement unit may be eliminated and the substrate may be placed directly on the base. Here, the surface of the base may be processed to have a predetermined surface roughness.
Moreover, the base part and the substrate mounting part that constitute the substrate gripping jig are not limited to flat members, and the back surface of the base part may include a curved surface, for example.

Further, the substrate holding jig can be applied not only for manufacturing a semiconductor device but also for manufacturing an optical disc by processing, for example, an optical disc substrate as a substrate.
Moreover, although the case where two pairs of arms (first arm and second arm) are provided in the transfer robot has been described, one of them may be eliminated. In addition, the case where the transfer robot includes a single body unit, the first arm, the second arm, and the finger has been described. However, two sets (a pair) of the first arm, the second arm, and the finger may be provided. It is also possible to provide three or more sets. Further, air may be used as at least a part of the power source.
When the first arm or the second arm is omitted, the entrance portion of the concave portion of the storage shelf of the storage cassette may be enlarged.

In the substrate processing apparatus, when the container is moved up and down, the cylinder actuator may be used both for lifting the container and for lifting the substrate delivery jig. Moreover, you may make it raise / lower a container etc. using a motor.
In the substrate processing apparatus, a plurality of substrate gripping jigs and substrates may be gripped on the substrate chuck.

Further, instead of the cylinder actuators for raising and lowering the substrate delivery jig and for horizontal movement, for example, a pulse delivery motor (stepping motor) and a ball screw may be used to displace the substrate delivery jig. Further, the horizontal movement (for example, displacement at the time of retraction) of the substrate delivery jig may be manually displaced.
Further, instead of using the substrate delivery jig, the method of adsorbing from above described in the fifth embodiment may be used. Further, the substrate delivery jig may be composed of a pair of mutually expandable members.

Further, the chemical solution may be dropped by a static dispensing method or a dynamic dispensing method. Moreover, it is applicable not only when dripping a chemical | medical solution but also when spraying.
Further, the outer wall portion of the container may be movable along the vertical direction so that the height can be adjusted. Further, the container may be provided with a lid portion to enhance the medicine scattering prevention function.
Further, the shape of the container is not limited to a cylindrical shape, and may be a rectangular tube shape. Further, the cross section of the waste liquid storage part is not limited to an annular shape, but may be an annular shape, and the discharge pipe may be a circular tube or a rectangular tube.
In addition to the cleaning process, the substrate processing apparatus may be used in a coating process such as a rest or a development process.

Further, in the first embodiment, the substrate and the substrate holding jig may be sucked and held by the substrate delivery jig until they are received from the transfer robot and delivered to the substrate chuck.
In addition to sucking the edge of the suction hole on the back side of the substrate gripping jig, it sucks only the substrate gripping jig (not communicating with the suction hole of the substrate gripping jig). You may branch and provide in the inside of a chuck. Further, without sucking the edge of the suction hole on the back surface of the substrate gripping jig 1, the substrate and the substrate gripping jig are sucked only by being sucked onto the suction surface and pressed against the substrate gripping jig. -You may comprise so that it may be hold | gripped.

In the second embodiment, for example, the path portion that communicates the suction hole 61a1 and the suction holes 61a2, 61a3,... May be formed by forming a groove in the base portion and the substrate mounting portion. However, the groove may be formed only on one side.
In the third embodiment, when placing the substrate on the suction surface of the substrate chuck of the substrate processing apparatus, the outer wall of the container may be displaced downward along the vertical direction. May be displaced upward along the vertical direction.

Further, in the fourth embodiment, a case has been described in which a wall portion is continuously formed around the entire periphery of the base portion and a discharge hole is provided. A notch part may be provided and a wall part may be provided intermittently. Moreover, you may form a wall part continuously, without providing a hole part and a notch part.
Further, in the fifth embodiment, a suction hole may be provided on the back side of the substrate gripping jig so as to be delivered to the substrate chuck and sucked as it is. In this case, at the time of substrate processing, a lid member may be placed on the suction hole on the surface side of the substrate gripping jig and adsorbed, and the suction hole may be closed. In addition, although the case where the annular intake groove is provided in the base and finger of the substrate gripping jig has been described, it may be adsorbed at a predetermined location.

Further, in the fifth embodiment, the substrate is not limited to the case where the substrate is stored in the storage cassette so as to be arranged along the vertical direction, but the substrate is placed in a plane on, for example, a tray partitioned in a lattice shape. Then, it may be stored, accessed from above, taken up, and transferred.
Here, the tray is placed on the xy table so as to be displaceable along the x-axis direction and the y-direction, and only the finger is displaced along the z-axis direction when taking out the substrate, thereby speeding up the conveyance. You may do it.

  As a semiconductor substrate to be processed, the present invention can be applied to a case where a III-V compound semiconductor (for example, gallium arsenide) substrate or the like is transferred or processed in addition to a silicon substrate. In addition to a semiconductor substrate, for example, a transparent glass substrate, a sapphire substrate, or the like can be used as the substrate.

It is a top view which shows the structure of the jig | tool for board | substrate holding | gripping which is 1st Example of this invention. It is sectional drawing which shows the structure of the jig | tool for said board | substrate holding | grip. It is sectional drawing which shows the state by which the board | substrate was hold | gripped through the board | substrate holding jig | tool at the time of board | substrate conveyance. It is sectional drawing which shows the state by which the board | substrate was hold | gripped through the board | substrate holding jig at the time of a board | substrate process. It is explanatory drawing for demonstrating the method to convey the said board | substrate from a storage cassette to a substrate processing apparatus with a conveyance robot. It is a block diagram for demonstrating the structure of the same conveyance robot and the same substrate processing apparatus. It is sectional drawing which shows the structure of the mounting shelf of the storage cassette. It is sectional drawing which shows the structure of the same substrate processing apparatus. It is a top view which shows the structure of the board | substrate delivery jig | tool of the same substrate processing apparatus. It is a top view for demonstrating the structure of the jig | tool for board | substrate holding | gripping which is 2nd Example of this invention. It is sectional drawing which shows the state by which the board | substrate was hold | gripped through the board | substrate holding jig | tool at the time of board | substrate conveyance. It is sectional drawing which shows the state by which the board | substrate was hold | gripped at the time of conveyance via the board | substrate holding jig which is the 3rd Example of this invention. It is sectional drawing which shows the structure of the mounting shelf of the storage cassette in which the board | substrate is accommodated. It is sectional drawing which shows the structure of the jig | tool for board | substrate gripping which is the 4th Example of this invention. It is sectional drawing which shows a mode that a board | substrate is hold | gripped at the time of conveyance via the board | substrate holding jig | tool which is 5th Example of this invention.

Explanation of symbols

1, 1A, 1B, 1C, 1D Substrate gripping jig 2 Transfer robot 3 Storage cassette 4 Substrate processing device 6 Base (base)
6a Suction hole (part of the first intake path)
7 Substrate placing portion 7a Suction hole (first suction port, part of first suction path)
7b Suction surface (first suction surface)
9, 11 Substrate gripping structure 16, 16A, 16B Finger (gripping mechanism)
16a, 64a, 71a adsorption surface (second adsorption surface)
16b, 64b, 71b Suction hole (second suction port)
28 Suction path (second intake path)
36 Substrate chuck (gripping mechanism)
36a Suction surface (second suction surface)
36b Suction hole (second suction port)
47 Suction path (second intake path)
61 Substrate placing portion 61a1, 61a2, ... Suction hole (first suction port, part of first suction path)
61b Suction surface (first suction surface)
61c Sway (part of the first intake path)
63 Base (base)
63a, 63b Suction hole (part of the first intake path)
63c Sway (part of the first intake path)
67 Base (base)
67 Suction hole (part of the first intake path)
69 Base (base)
69a, 69b Suction hole (part of the first intake path)
69c Sway (part of the first intake path)
S substrate Sa, Sb, Sc substrate piece (substrate)

Claims (5)

A substrate gripping structure for sucking and gripping a substrate by sucking air along an intake path,
A first suction surface having a predetermined shape and area and provided with a first suction port for sucking the substrate having an arbitrary shape and size is formed, and the first suction surface is formed inside the first suction surface. Through the substrate gripping jig in which the first intake path leading to the suction port is formed,
With the second suction surface on which the substrate and the second suction port for sucking-gripping the substrate gripping jig is provided are formed in the interior, the leading to the second suction port by each branch of the 2 bifurcated fingers intake path is formed respectively, the substrate is adsorbed and grasped,
In a state where the substrate is placed on the first suction surface and the substrate gripping jig is placed on each second suction surface, the first suction path and each second suction path Communicated with
When air is sucked along the first intake path and each of the second intake paths, the substrate is adsorbed on the first adsorption surface of the substrate gripping jig, and the bifurcated by the attracted surface of the back surface of the substrate gripping jig to the second suction surface of each branch portion of the finger is adsorbed, together with the substrate is gripped by each branch of the bifurcated fingers,
On the mounting shelf on which the substrate is placed via the substrate gripping jig , the second suction surface of each branch portion of the bifurcated finger is set to the suctioned surface on the back surface of the substrate gripping jig. In addition, first and second recesses are provided to enable each branching portion of the bifurcated finger to be extracted from the mounting shelf while adsorbing and holding the substrate. A substrate gripping structure.   The substrate gripping jig is made of a disc-shaped rigid member, and a back surface is formed on the base as a surface to be attracted to the second suction surface, and is formed on the base. The substrate has a substrate mounting portion that is made of an elastic member and has a surface used as the first suction surface. A suction hole that extends from the back surface of the base to the surface of the substrate mounting portion has the first intake path. The substrate holding structure according to claim 1, wherein the substrate holding structure is formed inside.   3. The plurality of first suction ports capable of adsorbing the plurality of substrates are formed on a surface of the substrate platform as the first adsorption surface. Substrate gripping structure. A substrate holding jig used for adsorbing and holding a substrate by sucking air along an intake path,
A substrate gripping jig comprising the substrate gripping jig constituting the substrate gripping structure according to claim 1, 2 or 3. A substrate gripping method for adsorbing and gripping a substrate by sucking air along an intake path,
A first suction surface having a predetermined shape and area and provided with a first suction port for sucking the substrate having an arbitrary shape and size is formed, and the first suction surface is formed inside the first suction surface. Through the substrate gripping jig in which the first intake path leading to the suction port is formed,
With the second suction surface on which the substrate and the second suction port for sucking-gripping the substrate gripping jig is provided are formed in the interior, the leading to the second suction port by each branch of the 2 bifurcated fingers intake path is formed respectively, the substrate was adsorbed and grasped,
The substrate is placed on the first suction surface so that the first suction path and each second suction path communicate with each other, and the substrate holding jig is placed on each second suction surface. Placed
Air is sucked along the first air intake path and each second air intake path to adsorb the substrate to the first adsorption surface of the substrate holding jig, and the substrate holding the attaching object face of the back surface of the use jig that is adsorbed in the second adsorption surface of each branch portion of the bifurcated fingers, said substrate while held by the branch portion of the bifurcated fingers,
The second suction surface of each branching portion of the bifurcated finger is previously placed on the suction surface on the back surface of the substrate gripping jig on the mounting shelf on which the substrate is placed via the substrate gripping jig. And a first recess and a second recess for allowing each branching portion of the bifurcated finger to be extracted from the mounting shelf while adsorbing and holding the substrate. A substrate gripping method.

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