JP4774636B2 - IC module, IC card having IC module, and manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is resistant to an external force, the IC module, IC card having an IC module, and relates to a manufacturing method thereof.
[0002]
[Prior art]
In recent years, from the viewpoint of efficiency of information processing and security, an IC card incorporating an IC circuit using a semiconductor element for recording and processing data has been put into practical use instead of a magnetic card. An IC card is usually stored in a wallet or a card case, or carried and used as a single card. Under these operating conditions, external stress, impact force, etc. (external force) are often applied to the IC card, in which case the external force is applied to the IC chip built in the IC card and the IC chip is deformed. There is a risk that functions such as data recording and data processing cannot be performed. For this reason, an IC card and an IC module that are not deformed or destroyed by external force are desired.
[0003]
In recent years, as disclosed in Japanese Patent Laid-Open No. 2000-99678, when an IC card is manufactured, a metal foil is left other than the circuit surface of the IC chip, and the IC chip is reinforced by the metal foil. IC cards are known. Further, as disclosed in JP-A-2-158156, there is known an IC card in which an IC chip is sealed with a resin and a reinforcing plate is formed on the IC chip.
[0004]
[Problems to be solved by the invention]
However, the IC card disclosed in JP-A-2-158156 in which an IC chip is sealed with a resin has a problem that sufficient reinforcing strength cannot be obtained.
Further, in an IC card disclosed in JP-A-2-158156, in which a reinforcing plate is formed on an IC chip, an etching process is performed on the IC chip having a thickness of 0.2 mm or less to form a reinforcing plate. Has been. However, since the IC chip tends to become larger and thicker as the performance of the IC chip in recent years increases, there is a problem that sufficient reinforcement strength cannot be obtained even if the IC chip itself is reinforced by an etching process or the like. Therefore, an IC module and an IC card that are not deformed or broken by an external impact force or bending stress are desired.
[0005]
Accordingly, an object of the present invention is to provide an IC module that is resistant to external impact and bending, a method for manufacturing the IC module, and a method for manufacturing an IC card that is not deformed or broken even by external impact force or bending stress.
[0006]
[Means for Solving the Problems]
According to the present invention, an insulating substrate and an antenna coil formed on one surface of the insulating substrate at least once so that both end portions are offset from the center of the insulating substrate. And a first electrode of metal foil formed at a position where both ends of the antenna coil are formed on one surface of the insulating substrate, and the first surface on the other surface of the insulating substrate. The second electrode of the metal foil formed corresponding to the position of the electrode, and formed on the one surface of the insulating substrate adjacent to the first electrode, A third electrode of metal foil electrically connected through a through-hole formed in the insulating substrate; the first electrode formed adjacent to one surface of the insulating substrate; and Disposed on the third electrode, and the first and second electrodes Wherein the signal terminal first electrode and the third electrode, and the are connected to the both ends of the antenna coil, comprising the signal processing IC chip, a,
A capacitor constituting a resonance circuit with the antenna coil by the first electrode and the second electrode formed opposite to each other across the insulating substrate and the resin insulating substrate functioning as a dielectric. Configure
The area of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate, and the second surface formed on the other surface of the insulating substrate. The area of the electrode forming area is larger than the area of the IC chip, and bending stress and / or impact applied to the IC chip by the first electrode of the metal foil and the second electrode of the metal foil. Functions as a reinforcing member to reduce the force,
A separation portion of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate is shifted from a center in a plane of the IC chip;
An IC module is provided.
[0007]
Preferably, the planar shape of the insulating substrate is rectangular, and the antenna coil is formed in a rectangular shape along the periphery of the insulating substrate on one surface of the insulating substrate at least once. The both end portions are located at positions shifted from the center of the insulating substrate, and the planar shape of the IC chip is rectangular, and the first electrode, the second electrode, and the third electrode The electrode has a rectangular shape, the width of the rectangular formation region of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate, and the insulating substrate The width of the rectangular formation region of the second electrode formed on the other surface is larger than the area of the IC chip whose plane is rectangular, and the second electrode is formed adjacent to one surface of the insulating substrate. 1 electrode and the third electrode spaced apart in parallel Min is offset from the center of the IC chip.
[0008]
Preferably, the width of the rectangular formation region of the second electrode formed on the other surface of the insulating substrate is equal to the first electrode formed adjacent to one surface of the insulating substrate. And wider than the rectangular area of the third electrode.
[0009]
Preferably, a bump is provided on a surface of the IC chip to which the first and third electrodes are connected, and the bump is connected to the antenna coil via an anisotropic conductive film.
[0010]
Preferably, when the antenna coil is formed in a plurality of turns, the antenna coil is formed on the other surface of the insulating substrate so as to intersect with the antenna coil formed on the one surface of the insulating substrate. The antenna portion is formed, and one end portion of the both end portions is one end portion of the antenna coil formed in a circular shape on one surface of the insulating substrate, and the other end portion of the both end portions is formed. An end portion is connected to a first conductive member penetrating the insulating substrate, and the first conductive member is connected to one end of an antenna portion formed on the other surface of the insulating substrate, The other end of the antenna portion is guided to one surface of the insulating substrate through a second conductive member that penetrates the insulating substrate, and is formed in a circular shape on one surface of the insulating substrate. The other end of the antenna coil is connected.
[0011]
Preferably, on the one surface of the insulating substrate, end portions of the IC chip, the first electrode, and the third electrode are sealed with a resin covering them.
[0012]
Preferably, a metal reinforcing plate is disposed on the surface of the IC chip opposite to the surface connected to the first electrode and the third electrode.
[0013]
According to the present invention, the IC module, a resin adhesive sheet provided on both sides of the IC module, a resin core sheet provided outside the adhesive sheet, and provided on both sides of the core sheet. An IC card is provided in which the oversheet formed is laminated.
[0014]
According to the present invention, a method for manufacturing the IC module is provided.
[0015]
Moreover, according to the present invention, there is provided a method for manufacturing an IC module laminated as an IC card,
The IC module has an insulating substrate having the same planar dimensions as the IC card, and is formed in a circular shape at least once on one surface of the insulating substrate, and both end portions are shifted from the center of the insulating substrate. The formed antenna coil, the signal processing IC chip connected to the both ends of the antenna coil via an anisotropic conductive film, and the insulating substrate on the other surface of the insulating substrate A metal foil that is formed in a portion corresponding to the IC chip with a larger area than the IC chip and functions as a reinforcing member that reduces bending stress and / or impact force applied to the IC chip. And
The method of manufacturing the IC module is as follows:
Forming a first metal foil and a second metal foil on one side and the other side of the insulating substrate, respectively,
The antenna coil is formed so that the antenna coil is formed at a position where both ends are shifted from the center of the insulating substrate with respect to the first metal foil formed on the one surface at least once. And applying a second resist so that the metal foil is formed in a portion corresponding to the IC chip with respect to the resist and the second metal foil formed on the other surface;
Performing a first etching process and performing a second etching process;
Removing the first resist remaining after the first etching process and the second resist remaining after the second etching process;
Transferring the anisotropic conductive film to the both ends of the antenna coil formed by the treatment;
Placing the signal processing IC chip on the transferred anisotropic conductive film;
Electrically connecting the IC chip to the both ends of the antenna coil by thermocompression bonding;
A method for manufacturing an IC module is provided.
[0032]
DETAILED DESCRIPTION OF THE INVENTION
First embodiment A first embodiment of the present invention will be described with reference to Figs.
FIG. 1 is a diagram showing a configuration of an IC card according to the present embodiment.
FIG. 2 is a schematic plan view of an IC module built in the IC card illustrated in FIG.
3 is a cross-sectional view taken along the line AA ′ of FIG.
[0033]
As shown in FIG. 1, a non-contact type IC card 200 according to the first embodiment has a seven-layer laminate structure, and cores are provided on both surfaces of an IC module 100 described later via adhesive sheets 10 and 11. Sheets 12 and 13 and oversheets 14 and 15 are laminated.
[0034]
The size of the IC card 200 is, for example, 54 mm long, 85.6 mm wide, and 0.76 mm ± 10% as defined by the ISO international standard.
[0035]
First, each card substrate will be described.
The adhesive sheets 10 and 11 are made of, for example, a sheet mainly composed of polyester resin, epoxy resin, or the like.
The core sheets 12 and 13 and the oversheets 14 and 15 are made of plastic resin. The core sheets 12 and 13 and the oversheets 14 and 15 are made of any one of plastic resins such as PET-G, ABS resin, PET, PEN, acrylic resin, polycarbonate, and vinyl chloride.
[0036]
As shown in the figure, the IC module 100 includes a center sheet 1, an antenna coil 2, an anisotropic conductive film 3, an IC chip 4, and a reinforcing metal foil 5.
[0037]
The center sheet 1 is formed of a plastic resin.
The antenna coil 2 is an antenna coil connected to the IC chip 4 and includes a front surface antenna coil 21, a back surface metal foil 22, and through holes 23 and 24. The antenna coil 2 forms a resonance circuit with a capacitor (not shown), and transmits and receives signals using a radio wave having a resonance frequency.
The surface antenna coil 21 is formed of a conductive metal on the loop at the peripheral edge of the surface of the center sheet 1.
The front surface antenna coil 21 is electrically connected to the back surface metal foil 22 through the through holes 23 and 24.
The back surface metal foil 22 is a conductive metal foil formed on the back surface of the center sheet 1 and is electrically connected to the front surface antenna coil 21 through the through holes 23 and 24.
Moreover, although the back surface metal foil 22 is formed with the same material as the surface antenna coil 21, it may be formed with a different material.
[0038]
The anisotropic conductive film 3 is, for example, a mixture of conductive fine particles dispersed in an adhesive, and the film itself exhibits insulating properties, but the conductive fine particles come into contact with each other by compressing the film, and the conductivity is obvious. It is to become.
[0039]
The IC chip 4 is an IC chip having a circuit for performing signal processing, is provided with bumps (connection terminals) 6, and is electrically connected to the antenna coil 2 through the anisotropic conductive film 3. ing.
[0040]
The reinforcing metal foil 5 is formed of metal on the back surface of the center sheet 1 on the side opposite to the position where the IC chip 4 is mounted. The reinforcing metal foil 5 is formed larger than the edge of the center sheet 1 of the IC chip 4.
[0041]
Thus, in the IC module 100 and the IC card 200 according to the present embodiment, the reinforcing metal foil 5 is formed on the back surface of the center sheet 1 at a position opposite to the position where the IC chip 4 is mounted. In addition, there is an effect that the bending stress and impact resistance of the IC chip 4 are increased.
[0042]
Next, a method for manufacturing the IC module 100 will be described using the cross-sectional view shown in FIG. 4 and the flowchart shown in FIG.
[0043]
Step ST1:
As shown in FIG. 4A, metal foils 21 a and 22 a are pasted on both surfaces of the center sheet 1.
[0044]
Step ST2:
As shown in FIG. 4B, resists R21 and R22 having a pattern of the front surface antenna coil 21, the back surface metal foil 22, and the reinforcing metal foil 5 to be formed are applied.
[0045]
Step ST3:
As shown in FIG. 4C, etching is performed using an etching solution to expose the center sheet 1 other than the resist R20 and R22 application portions.
[0046]
Step ST3:
As shown in FIG. 4D, the resists R20 and R22 are removed to form the desired front surface antenna coil 21, back metal foil 22, and reinforcing metal foil 5.
[0047]
Step ST4:
Through holes 23 and 24 are formed, and the front surface antenna coil 21 and the back surface metal foil 22 are electrically connected.
[0048]
Step ST5:
On the anisotropic conductive film 3, the anisotropic conductive film 3 is transferred onto the surface antenna coil 21 formed on the center sheet 1 so that the connection terminals 6 of the IC chip 4 are located on the lower surface. And the IC chip 4 is connected and fixed to the surface antenna coil 21 to electrically connect the IC chip 4 and the antenna coil 2.
The IC module 100 of the first embodiment can be formed by the above process.
[0049]
Next, a method for manufacturing the IC card 200 will be described with reference to a flowchart shown in FIG.
Step ST11:
The center sheet 1, the adhesive sheets 10 and 11, the core sheets 12 and 13, and the oversheets 14 and 15 are laminated as shown in FIG. 1 and temporarily attached.
In this temporary tensioning process, for example, sandwiching between two rubber rolls, adjusting and setting the roll interval and rubber strength as appropriate, laminating, and laminating by extruding air so that no air remains in the bonding surface Let
[0050]
Step ST12:
The laminated body of the center sheet 1, the adhesive sheets 10 and 11, the core sheets 12 and 13, and the oversheets 14 and 15 that have been temporarily pasted is pressed together with heat by a pressing tool such as a press plate (not shown) and laminated. For example, press laminating is performed at a temperature of 120 ° C., a pressure of 20 kg / cm ² , and a pressing time of 12 minutes.
[0051]
Step ST13:
With the above processing, a desired IC card 200 can be formed by punching into a card size.
[0052]
Thus, in the manufacturing method of the IC module 100 and the IC card 200 of the first embodiment, the back metal foil 22 and the reinforcing metal foil 5 are simultaneously formed by etching. For this reason, compared with the case where the back surface metal foil 22 and the reinforcement metal foil 5 are formed separately, a manufacturing method becomes simple.
[0053]
The IC chip 4 is mounted on the antenna coil 2 and connected to the antenna coil 2 via the connection terminal 6 and the anisotropic conductive film 3. For this reason, the manufacturing method is simplified as compared with the conventional connection method using wire bonding.
[0054]
Second embodiment A second embodiment will be described with reference to Figs.
FIG. 7 is a schematic plan view of an IC module built in the IC card according to the present embodiment.
FIG. 8 is an enlarged view of the IC chip and the capacitor of the IC module illustrated in FIG.
9 is a cross-sectional view taken along line BB ′ of FIG.
In the IC module 100 and the IC card 200 of the present embodiment, as shown in the figure, the IC module 100 has a center sheet 1, an antenna coil 2, an anisotropic conductive film 3, an IC chip 4, and a capacitor 7. .
[0055]
The center sheet 1 is formed of a plastic resin. The center sheet 1 serves as a capacitor dielectric.
The antenna coil 2 is a coil connected to the IC chip 4 and includes a front surface antenna coil 21 and a back surface metal foil 22 electrically connected through a through hole 23.
The surface antenna coil 21, the through hole 23, and the anisotropic conductive film 3 are the same as those described in the first embodiment.
[0056]
As shown in the figure, the capacitor 7 of the IC module 100 includes a center sheet 1, a capacitor electrode 71 and a capacitor electrode 72 formed on the surface of the center sheet 1, and a surface opposite to the surface on which the capacitor electrodes 71 and 72 are formed. The capacitor electrode 73 is formed on the back surface on the side, and the through hole 8.
[0057]
The through hole 8 electrically connects the capacitor electrode 72 formed on the front surface and the capacitor electrode 73 formed on the back surface.
[0058]
Further, the edges of the capacitor electrode 71 and the capacitor electrode 72 are formed so as to be shifted from the center of the IC chip 4 to be mounted.
[0059]
The IC chip 4 is mounted across the capacitor electrode 71 and the capacitor electrode 72 and the center of the IC chip 4 is shifted from the edges of the capacitor electrode 71 and the capacitor electrode 72.
Further, the IC chip 4 is provided with bumps (connection terminals) 6, and the IC chip is provided via the capacitor electrode 71 and the capacitor electrode 72 formed on the surface of the center sheet 1 and the anisotropic conductive film 3. 4 is electrically connected.
[0060]
Thus, in the IC module 100 and the IC card 200 of the second embodiment, the capacitor electrode mounting area of the IC chip 4 and a part of the capacitor electrode mounting area are shared, and the IC chip 4 Since two metal foils are formed on the mounting region of the first and second layers, the bending stress and impact resistance of the IC chip 4 are further improved as compared with the first embodiment.
[0061]
Further, in the IC module 100 and the IC card 200 according to the second embodiment, the mounting area of the IC chip 4 is divided into the capacitor electrode 71 and the capacitor electrode 72, and the boundary from the center of the IC chip 4. Due to the misalignment, the area where the IC chip 4 is easily bent becomes the end side of the IC chip 4 and the mechanical strength of the IC chip 4 is further improved.
[0062]
In addition, since two capacitor electrodes 71 and 72 are formed on the mounting surface of the IC chip 4, the IC chip 4 and the capacitor can be connected by directly mounting the connection terminal 6 of the IC chip 4. There is an effect that poor connection is less likely to occur than when connecting by wire bonding.
[0063]
In addition, by mounting the IC chip 4 on the capacitor 7 in the IC module 100 and the IC card 200, it becomes possible to use the area under the IC chip 4 that has not been formed as an electrode of the conventional capacitor. Larger capacitance can be ensured.
[0064]
The manufacturing method of the IC module 100 and the IC card 200 is substantially the same as that shown in the first embodiment. Hereinafter, differences from the first embodiment will be described.
[0065]
As shown in FIG. 5, in step ST <b> 2, a resist having a pattern of capacitor electrodes 71 and 72 is applied to the surface of the center sheet 1, and a resist having a pattern of the capacitor electrode 73 is applied to the back surface.
Then, etching is performed (ST3), the resist is removed (ST4), and capacitor electrodes 71, 72, 73 are formed.
In step ST5, the capacitor electrode 72 and the capacitor electrode 73 are electrically connected through the through hole 8.
In step ST6, the IC chip 4 straddles the formed capacitor electrode 72 and capacitor electrode 73, and the center of the IC chip 4 is shifted from the edge of the capacitor electrode 72 and capacitor electrode 73. Is installed.
The steps other than the above steps are the same as those described in the first embodiment.
[0066]
Thus, in the manufacturing method of the IC chip 100 and the IC card 200 according to the second embodiment, the IC chip 4 straddles the capacitor electrode 72 and the capacitor electrode 73, and the center of the IC chip 4 is the capacitor electrode. The IC chip 4 is mounted via the anisotropic conductive film 3 while being shifted from the edge of the capacitor electrode 73 and the capacitor electrode 73. For this reason, the process of mounting the IC chip 4 is facilitated.
[0067]
Third Embodiment A third embodiment will be described with reference to FIG.
In the IC module 100 and the IC card 200 of the present embodiment, as shown in FIG. 10, the IC chip 4 is sealed with a resin 50 so as to be covered.
The resin seal 50 seals the anisotropic conductive film 3, the IC chip 4, and the capacitor electrodes 71 and 72 using, for example, a thermosetting resin.
Other configurations are the same as those described in the IC module 100 and the IC card 200 of the second embodiment.
[0068]
As described above, in the IC module 100 and the IC card 200 according to the third embodiment, two layers of metal foil are formed on the mounting area of the IC chip 4 and the IC chip 4 is sealed with the resin seal 50. It has been stopped. For this reason, compared with the case where IC chip 4 is reinforced only by resin sealing, bending stress resistance, impact resistance, etc. improve.
[0069]
About the manufacturing method of IC module 100 and IC card 200 of this Embodiment, it is substantially the same as the manufacturing method of IC module 100 and IC card 200 of 2nd Embodiment. Only differences from the second embodiment will be described.
As shown in FIG. 11, in step ST <b> 7 a, for example, the IC chip 4 is covered with a thermosetting resin so as to surround the IC chip 4, heated and cured, and the IC chip 4 is sealed as a resin seal 50. The rest is the same as that described in the second embodiment.
[0070]
Fourth embodiment A fourth embodiment will be described with reference to FIG.
In the IC module 100 and the IC card 200 of the present embodiment, as shown in FIG. 12, a reinforcing plate 60 is formed of metal on the surface of the IC chip 4 opposite to the surface in contact with the capacitor electrodes 71 and 72. .
Other configurations are the same as those described in the IC module 100 and the IC card 200 of the second embodiment.
[0071]
As described above, in the IC module 100 and the IC card 200 according to the fourth embodiment, the reinforcing plate 60 is formed on the surface of the IC chip 4 opposite to the surface in contact with the capacitor electrodes 71 and 72. The IC chip 4 is double reinforced by the capacitor electrodes 71 and 71 and the capacitor electrode 73 and further reinforced by the reinforcing plate 60. For this reason, compared with the IC module 100 and the IC card 200 of the second embodiment, there is an effect that the bending stress and the impact resistance of the IC chip 4 are increased. For this reason, even if it forms a reinforcement board thinly compared with the conventional reinforcement board, the bending stress, the impact resistance, etc. equivalent or more can be obtained.
[0072]
The manufacturing method of the IC module 100 and the IC card 200 according to the present embodiment is the second except that the reinforcing plate 60 is formed of a metal on the surface opposite to the surface in contact with the capacitor electrodes 71 and 72 of the IC chip 4. This is the same as described in the embodiment. Only the differences will be described below.
As shown in FIG. 13, in step ST7b, a reinforcing plate 60 is formed of a metal foil on the surface of the IC chip 4 opposite to the surface in contact with the capacitor electrodes 71 and 72.
The rest is the same as that described in the second embodiment.
[0073]
Note that the present invention is not limited to the present embodiment, and various suitable modifications can be made. For example, the IC chip 4 of the present embodiment is connected via an anisotropic conductive film, but is not limited thereto. For example, the IC chip 4 may be connected using a gold wire or the like.
[0074]
【The invention's effect】
Thus, according to the present invention, it is possible to provide an IC module in which an IC chip is improved in impact resistance and bending stress with respect to the outside.
Thus, according to the present invention, it is possible to provide an IC module and an IC card manufacturing method in which the impact resistance and bending stress of the IC chip are improved with respect to the outside.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of an IC card according to a first embodiment of the present invention.
2 is a schematic plan view of an IC module built in the IC card shown in FIG. 1. FIG.
3 is a cross-sectional view of an IC chip of the IC module shown in FIG.
4 is a diagram showing a manufacturing method of the IC module shown in FIG. 2; FIG.
5 is a flowchart of a manufacturing method of the IC module shown in FIG. 2;
6 is a flowchart of a manufacturing method of the IC card shown in FIG. 1. FIG.
FIG. 7 is a schematic plan view of an IC module built in an IC card according to a second embodiment of the present invention.
8 is an enlarged view of an IC chip and a capacitor of the IC module shown in FIG.
9 is a cross-sectional view of the IC module and the capacitor shown in FIG.
FIG. 10 is a cross-sectional view of an IC chip and a capacitor of an IC module according to a third embodiment of the present invention.
11 is a flowchart of a manufacturing method of the IC module shown in FIG.
FIG. 12 is a cross-sectional view of an IC chip and a capacitor of an IC module according to a fourth embodiment of the present invention.
13 is a flowchart of a manufacturing method of the IC module shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Center sheet 2 ... Antenna coil 21 ... Front surface antenna coil 21a, 22a ... Metal foil 22 ... Back surface metal foil 23, 24 ... Through hole 3 ... Anisotropic conductive film 4 ... IC chip 5 ... Reinforcing metal foil 6 ... For connection Terminal 7 ... Capacitors 71, 72, 73 ... Capacitor electrode 8 ... Through holes 10, 11 ... Adhesive sheets 12, 13 ... Core sheets 14, 15 ... Oversheet 50 ... Resin sealing 60 ... Reinforcement plate 100 ... Module 200 ... Card R20 , R21, R22 ... resist

Claims (17)

An insulating substrate;
On one surface of the insulating substrate, the antenna coil is formed at least once in a circular shape, and both end portions are formed at positions shifted from the center of the insulating substrate;
A first electrode of a metal foil formed at a position where both ends of the antenna coil are formed on one surface of the insulating substrate;
A second electrode of a metal foil formed on the other surface of the insulating substrate corresponding to a position where the first electrode is formed;
Metal foil formed adjacent to the first electrode on one surface of the insulating substrate and electrically connected to the second electrode through a through hole formed in the insulating substrate A third electrode of
The first and second signal terminals are disposed on the first electrode and the third electrode formed adjacent to one surface of the insulating substrate, and the first and second signal terminals are disposed on the first electrode and the third electrode. A signal processing IC chip connected to the both ends of the third electrode and the antenna coil;
Comprising
A capacitor constituting a resonance circuit with the antenna coil by the first electrode and the second electrode formed opposite to each other across the insulating substrate and the resin insulating substrate functioning as a dielectric. Composed of
The area of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate, and the second surface formed on the other surface of the insulating substrate. The area of the electrode forming area is larger than the area of the IC chip, and bending stress and / or impact applied to the IC chip by the first electrode of the metal foil and the second electrode of the metal foil. Functions as a reinforcing member to reduce the force,
A separation portion of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate is shifted from a center in a plane of the IC chip;
IC module. The planar shape of the insulating substrate is a rectangle,
The antenna coil is formed in a rectangular shape along the periphery of the insulating substrate on one surface of the insulating substrate at least once, and the both end portions are shifted from the center of the insulating substrate. Located in the
The planar shape of the IC chip is rectangular,
The first electrode, the second electrode, and the third electrode are rectangular,
The area of the rectangular formation region of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate, and the surface formed on the other surface of the insulating substrate The area of the rectangular formation region of the second electrode is larger than the area of the IC chip whose plane is rectangular,
A parallel portion of the first electrode and the third electrode formed adjacent to one surface of the insulating substrate and spaced apart from each other is displaced from the center of the IC chip.
The IC module according to claim 1. The width of the rectangular formation region of the second electrode formed on the other surface of the insulating substrate is such that the first electrode formed adjacent to the one surface of the insulating substrate and the first electrode 3 wider than the width of the rectangular formation region of the electrodes,
The IC module according to claim 2. Bumps are provided on the surfaces to which the first and third electrodes of the IC chip are connected, and the bumps are connected to the antenna coil via an anisotropic conductive film.
The IC module according to claim 1. When the antenna coil is formed in a plurality of turns,
On the other surface of the insulating substrate, an antenna portion formed by crossing an antenna coil formed in a circular shape on one surface of the insulating substrate is formed,
One end portion of the both end portions is one end portion of the antenna coil formed in a circular shape on one surface of the insulating substrate,
The other end of the both ends is connected to a first conductive member that penetrates the insulating substrate,
The first conductive member is connected to one end of an antenna portion formed on the other surface of the insulating substrate;
The other end of the antenna portion is guided to one surface of the insulating substrate through a second conductive member that penetrates the insulating substrate, and is formed in a circular shape on one surface of the insulating substrate. Connected to the other end of the antenna coil,
The IC module according to claim 1. On the one surface of the insulating substrate, the ends of the IC chip, the first electrode, and the third electrode are sealed with a resin that covers them.
The IC module according to claim 1. A metal reinforcing plate is disposed on a surface opposite to the surface connected to the first electrode and the third electrode of the IC chip.
The IC module according to claim 1. An IC module according to any one of claims 1 to 7;
A resin adhesive sheet provided on both sides of the IC module;
A resin-made core sheet provided outside the adhesive sheet;
An oversheet provided on both sides of the core sheet;
Are stacked,
IC card. A method for manufacturing the IC module according to claim 1,
The antenna coil is formed on one surface at least once so that both ends thereof are offset from the center of the insulating substrate, and the antenna coil is formed at positions where both ends of the antenna coil are formed. A first electrode of the metal foil and a third electrode of the metal foil formed adjacent to the first electrode, and the other surface corresponds to the formation position of the first electrode. The second electrode of the metal foil formed in this way, and the second electrode and the third electrode are electrically connected through a through hole formed in the insulating substrate. A first step of preparing a conductive substrate;
A second step of connecting bumps provided on the IC chip to both ends of the antenna coil to which the first and third electrodes are connected via the anisotropic conductive film;
A method for manufacturing an IC module. A method for manufacturing the IC module according to claim 6,
The antenna coil is formed on one surface at least once so that both ends thereof are offset from the center of the insulating substrate, and the antenna coil is formed at positions where both ends of the antenna coil are formed. A first electrode of the metal foil and a third electrode of the metal foil formed adjacent to the first electrode, and the other surface corresponds to the formation position of the first electrode. The second electrode of the metal foil formed in this way, and the second electrode and the third electrode are electrically connected through a through hole formed in the insulating substrate. A first step of preparing a conductive substrate;
A second step of connecting bumps provided on the IC chip to both ends of the antenna coil to which the first and third electrodes are connected via the anisotropic conductive film;
A third step of covering the ends of the IC chip, the first electrode, and the third electrode with a resin on the one surface of the insulating substrate; and
A method for manufacturing an IC module. A method for manufacturing the IC module according to claim 7, comprising:
The antenna coil is formed on one surface at least once so that both ends thereof are offset from the center of the insulating substrate, and the antenna coil is formed at positions where both ends of the antenna coil are formed. A first electrode of the metal foil and a third electrode of the metal foil formed adjacent to the first electrode, and the other surface corresponds to the formation position of the first electrode. The second electrode of the metal foil formed in this way, and the second electrode and the third electrode are electrically connected through a through hole formed in the insulating substrate. A first step of preparing a conductive substrate;
A second step of disposing a metal reinforcing plate on a surface opposite to a surface connected to the first electrode and the third electrode of the IC chip; and
A method for manufacturing an IC module. In the first step of preparing the insulating substrate,
Forming a first metal foil and a second metal foil respectively on one surface and the other surface of the insulating substrate;
The antenna coil is formed at least once around the first metal foil formed on the one surface, and the antenna coil is formed at positions where both end portions are offset from the center of the insulating substrate. The first resist is applied so that the first electrode is formed at a position where both ends of the first electrode are formed, and the third electrode is formed at a position adjacent to the first electrode, and A second resist is applied to the second metal foil formed on the other surface so that the second electrode is formed corresponding to the formation position of the first electrode,
Performing a first etching process leaving a portion coated with the first resist, and performing a second etching process leaving a portion coated with the second resist;
Removing the first resist remaining after the first etching process and the second resist remaining after the second etching process;
Connecting the second electrode and the third electrode through a through-hole formed in the insulating substrate;
A method for manufacturing the IC module according to claim 9, 10 or 11. The first metal foil and the second metal foil are the same conductive material,
A method for manufacturing the IC module according to claim 12. After the processing of the method for manufacturing an IC module according to any one of claims 9, 10, and 11,
A resin adhesive sheet provided on both sides of the IC module;
A resin-made core sheet provided outside the adhesive sheet;
An oversheet provided on both sides of the core sheet;
Laminating sequentially,
IC card manufacturing method. A method of manufacturing an IC module stacked as an IC card,
The IC module has an insulating substrate having the same planar dimensions as the IC card, and is formed in a circular shape at least once on one surface of the insulating substrate, and both end portions are shifted from the center of the insulating substrate. The formed antenna coil, the signal processing IC chip connected to the both ends of the antenna coil via an anisotropic conductive film, and the insulating substrate on the other surface of the insulating substrate A metal foil that is formed in a portion corresponding to the IC chip with a larger area than the IC chip and functions as a reinforcing member that reduces bending stress and / or impact force applied to the IC chip. And
The method of manufacturing the IC module is as follows:
Forming a first metal foil and a second metal foil on one side and the other side of the insulating substrate, respectively,
The antenna coil is formed so that the antenna coil is formed at a position where both ends are shifted from the center of the insulating substrate with respect to the first metal foil formed on the one surface at least once. And applying a second resist so that the metal foil is formed in a portion corresponding to the IC chip with respect to the resist and the second metal foil formed on the other surface;
Performing a first etching process and performing a second etching process;
Removing the first resist remaining after the first etching process and the second resist remaining after the second etching process;
Transferring the anisotropic conductive film to the both ends of the antenna coil formed by the treatment;
Placing the signal processing IC chip on the transferred anisotropic conductive film;
Electrically connecting the IC chip to the both ends of the antenna coil by thermocompression bonding;
A method for manufacturing an IC module. The first metal foil and the second metal foil are the same conductive material,
A method for manufacturing the IC module according to claim 15. After processing of the method of manufacturing an IC module according to claim 15 or 16, A resin adhesive sheet provided on both sides of the IC module;
A resin-made core sheet provided outside the adhesive sheet;
An oversheet provided on both sides of the core sheet;
Laminating sequentially,
IC card manufacturing method.

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