JP4358015B2 - Surface mount machine - Google Patents

Description

  The present invention is a surface mounter that holds electronic components such as ICs by suction with a mounting head and transports and mounts them on a substrate such as a printed circuit board, in particular, image recognition of the suction state of the components by the mounting head. The present invention relates to a surface mounter configured to mount a component after correcting the suction position error due to the above.

  Conventionally, a surface mounter configured to adsorb electronic components such as ICs from a component supply unit by means of a movable head unit equipped with a mounting head, and transport and mount it to a predetermined position on a printed circuit board. Is generally known.

In this type of surface mounter, in order to prevent mounting defects due to component suction errors or suction position shifts (errors) due to the mounting head, the suction component is image-recognized in advance (before mounting) and the suction state is checked. If the suction position deviation exceeds the allowable range, the deviation is corrected. Generally, after picking up the parts, the head unit is placed on the camera fixed at a specific position on the base. The suction part is moved and imaged (for example, Patent Document 1).
Japanese Patent Laid-Open No. 8-24297

  However, in such a configuration, it is necessary to move the head unit once to a specific position on the base after picking up the parts, so depending on the picking position of the parts, the moving distance of the head unit becomes long and the tact time is shortened. It is disadvantageous to do.

  Therefore, it is necessary to improve this point. In particular, in the case where a plurality of mounting heads are mounted on the head unit, the head unit is heavy and difficult to drive at high speed, and it is necessary to recognize a plurality of components as images. For this reason, the proportion of the component recognition operation time in the tact time is large, and improvement is desired.

  The present invention has been made in view of the above circumstances, and in a surface mounter in which a plurality of mounting heads are mounted on a head unit, the components held by each mounting head are more efficiently recognized. The purpose is to shorten the tact time.

In order to solve the above-mentioned problem, the invention according to claim 1 has a movable head unit mounted in a state where a plurality of mounting heads are arranged, and a component supply unit by the mounting head of the head unit. In the surface mounter that picks up the components from the board and transports them on the substrate at the mounting work position and mounts them. The image pickup means includes a line sensor in which image pickup elements are arranged in a direction orthogonal to the arrangement direction of the mounting heads, and a first image pickup that is movably supported by a head unit support member that supports the head unit. It means and includes a line sensor image sensor are arranged in the array direction parallel to the direction of the mounting head, and the first to the head unit supporting member Second imaging means supported so as to be movable integrally with the image means, and further having a reflecting surface inclined in a direction orthogonal to the direction of arrangement of the mounting heads, and the component supply section and the mounting operation An optical member that is disposed in a region between the positions and through which the mounting head passes as the head unit moves, and that reflects a suction component image sucked by each mounting head of the head unit; after adsorbing component by the mounting head at the component supply section, together with the head unit to control the drive in order to convey the suction unit products from the component sucking position to the mounting work position, in the middle the part conveying the second 1, the second imaging means and the said the head unit is moved relative to the mounting head first imaging unit and the second imaging means of each mounting head The first to execute the component recognition operation for imaging the Chakubuhin, least a contrast control unit that drives and controls the side of the second imaging means and said head unit, said first, second imaging means, Each of the component images reflected by the optical member is provided so as to be able to pick up images, and the control means moves the first and second image pickup means and the head unit relative to each other in the arrangement direction of the mounting heads. A first component recognition operation for picking up the suction component of each mounting head by the first imaging means, and moving the head unit in a direction perpendicular to the mounting head arrangement direction with respect to the optical member. Drive control of the head unit and the first and second imaging means to selectively execute a second component recognition operation for imaging the suction component of the mounting head by the second imaging means. And, and prior to these component recognition operation, while moving the head unit to the component pickup operation end position near the image pickup start position, the first at a position corresponding to the imaging start position, the second imaging means when the movement is the first in together, the movement of the second imaging means, in which the head unit is configured to complete at the same time or earlier timing than the reaching to the imaging start position.

According to this surface mounter, the first component recognition operation using the first imaging means and the second imaging means are performed in accordance with the relative positional relationship between the component suction operation completion position and the first component mounting position on the board. The second component recognition operation to be used is alternatively executed. In particular, at the time of each component recognition operation, the first and second imaging means are arranged at a position corresponding to the imaging start position of the head unit on the head unit support member at the same time as or earlier than the completion of the component suction operation. Then, after the components are picked up, the picked-up component images are picked up by the image pickup means via the optical parts from the first and second image pickup means while the head unit moves from the component supply unit to the mounting work position. For this reason, it is possible to quickly pick up an image of a component regardless of where the component adsorption operation completion position by the head unit is. In addition, by applying the first and second imaging means having the line sensor as the imaging means , the suction component is imaged while moving the head unit relative to the imaging means. The parts can be imaged continuously and quickly. The second imaging means is supported by a head unit support member, and the second imaging means and the head unit (mounting head) are kept in a fixed positional relationship in a direction orthogonal to the mounting head arrangement direction. However, as described above, the reflection surface of the optical member is provided so as to be inclined in a direction orthogonal to the direction in which the mounting heads are arranged. As a result, the head unit is held with respect to the optical member with the suction component held at a certain height position. When the mounting head is moved in a direction orthogonal to the arrangement direction of the mounting heads, the suction component image reflected on the reflecting surface is relative to the imaging means (the suction component image is simulated with respect to the second imaging means). ) It moves in a direction orthogonal to the arrangement direction of the mounting heads, so that the suction component can be imaged by the second imaging means.

Further , according to this configuration, it is possible to obtain a layout configuration in which the component supply unit and the mounting work position are brought closer to each other. That is, the first between the mounting work position and the component supply unit, movable the second imaging means, the adsorbed to the mounting head components is also conceivable to directly imaged, in this case, Since it is necessary to provide a mechanism for driving this in addition to the imaging means itself, the gap between the lively component supply unit and the mounting work position is widened. On the other hand, according to the above configuration, since it is only necessary to arrange an optical member between the component supply unit and the mounting work position, the imaging unit is provided movably between the component supply unit and the mounting work position. Compared to the case, the interval between the component supply unit and the mounting work position can be made closer.

When the optical member is provided as described above, the optical member is movably provided in the region through which the mounting head passes as the head unit moves, and the control means further includes the optical member. first to drive control, preferably configured to be interlocked with the optical member as the imaging of the component is possible and the imaging means by the second imaging means (claim 2).

In this surface mounter, the optical member moves in a region between the component supply unit and the mounting work position, and the optical member and the first and second imaging means move as a pair so that the picked-up component can be imaged. It will be.

In the configuration of claim 2 , a holding member that holds the optical member in a movable manner is provided, and an illumination device that provides illumination for imaging by the imaging unit is provided on at least one side of the holding member or the imaging unit. It is preferable that they are integrally provided (Claim 3 ).

  According to this configuration, illumination can be provided from a position close to the subject (suction component), and an illumination device can be configured with a small number of light emitters.

In the configuration of claim 1, wherein the first imaging means, the first posture to the array direction parallel to the direction of the mounting head image sensor are arranged in the direction orthogonal to the arrangement direction of the mounting head posture of the line sensor and a second position is configured to be switched to the imaging element is arranged, and wherein in the second position, the imaging element and said mounting La-sensor of the image pickup device and the second imaging means of the line sensor being arranged relative to the second imaging means to the array direction of use the head line up, the control means, whereas when the first component recognition operation switches the line sensor in the first position, before the second when the component recognition operation and attitude control of the line sensor of the first imaging means to switch said line sensor in the second position, when more of the second component recognition operation Preferably configured so as to image the adsorbed components in both the first image pickup means and the second imaging means (claim 4).

When Yoreru to this configuration, at the time of second component recognition operation, first, both can be extended imaging area of the second component recognition operation by Rukoto using the second imaging means, adsorbed on a plurality of mounting heads It is possible to satisfactorily image all of the components that have been performed using both imaging means.

According to the surface mounter of the first to fourth aspects, the first component recognition operation and the second component recognition operation are performed in accordance with the relative positional relationship between the component suction operation completion position and the first component mounting position on the board. Since it can be selectively executed, more efficient component mounting can be achieved. In particular, at the time of each component recognition operation, after picking up the component, the imaging unit is always arranged in the vicinity of the component suction operation completion position of the head unit, and the picked-up component is quickly imaged wherever the component suction operation completion position is. be able to. That is, there is no need to image the suction component after moving the head unit to a position far from the position where the component suction operation has been completed as in the prior art. In addition, the suction component can be imaged while relatively continuously moving the head unit and the imaging means. Accordingly, the suction component can be recognized extremely efficiently in the surface mounter including the head unit having a plurality of mounting heads, and as a result, the tact time can be effectively shortened.

Further, since the image the adsorbed component through the optical engine member, can be kept relatively narrow gap between the component supply section and mounting work position, reducing the total movement amount of the head unit in the mounting operation It becomes possible. Therefore, it is advantageous in shortening the tact time.

  The best mode for carrying out the present invention will be described with reference to the drawings.

  1 and 2 schematically show a first embodiment of a surface mounter (hereinafter abbreviated as a mounter) according to the present invention. As shown in the figure, a printed circuit board conveying conveyor 2 is disposed on a base 1 of the mounting machine, and the printed circuit board 3 is conveyed on the conveyor 2 to a predetermined mounting work position (shown in the figure). It stops at the position of the printed circuit board. In the present embodiment, the printed circuit board 3 is carried in from the right side of FIGS. 1 and 2 and carried out to the left side.

  On both sides of the conveyor 2, component supply units 4 are arranged. These component supply units 4 are provided with, for example, multiple rows of tape feeders 4a. Each tape feeder 4a is configured such that small chip components such as ICs, transistors, capacitors, etc. are accommodated at predetermined intervals, and the held tape is led out from the reel. It is configured to intermittently feed out the parts as it is taken out.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable over the component supply unit 4 and the mounting work position where the printed circuit board 3 is located, and the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the direction perpendicular to the X-axis on the horizontal plane). ) Can be moved to.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion 6a (see FIG. 3) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are provided with encoders 9a and 15a, respectively, so that the movement position of the head unit 6 is detected.

  The head unit 6 is provided with a plurality of mounting heads 16 configured in an axial shape. In this embodiment, the six mounting heads 16 are arranged in a line at equal intervals in the X-axis direction. It is mounted in the state. In the following description, when it is necessary to distinguish each mounting head 16 in particular, the first mounting head, the second mounting head, etc. in order from the right end (substrate carry-in side) in FIGS. It will be referred to as 6 mounting head.

  These mounting heads 16 can be moved in the Z-axis direction and rotated around the R-axis (nozzle center axis) with respect to the frame of the head unit 6, respectively, and ascending / descending drive means using a servo motor as a drive source and rotation It is driven by driving means. Each mounting head 16 is provided with a suction nozzle 16a at its tip (lower end), and negative pressure is supplied to the tip of the suction nozzle from a negative pressure supply means (not shown). Parts are attracted by suction force.

  As shown in FIGS. 1 to 3, the support member 11 is equipped with a camera unit 20 for recognizing an image of a component sucked and held by the suction nozzle 16 a.

  The camera unit 20 is integrally provided with a pair of cameras 22 and 23 (referred to as a first camera 22 and a second camera 23) incorporating a CCD line sensor and an illumination device 21, as shown in FIGS. The support member 11 is supported on the lower surface of the support member 11 so as to be movable along the support member 11 in the X-axis direction.

  Specifically, the lower surface of the support member 11 is provided with a fixed rail 25 extending in the X-axis direction and a ball screw shaft 27 in the X-axis direction that is rotationally driven by a servo motor 26 via a drive belt 29. The camera unit 20 is movably mounted on the fixed rail 25, and the ball screw shaft 27 is screwed into the camera unit 20. With this configuration, the camera unit 20 moves in the X-axis direction along the fixed rail 25 when the servo motor 26 is operated. The servo motor 26 is fixed to the support member 11 in a state of being arranged in the Y-axis direction with respect to the ball screw shaft 27. In FIG. 3, reference numerals 28a and 28b denote a drive pulley and an idle pulley to which the drive belt 29 is attached.

  The cameras 22, 23 are arranged in a line in the X-axis direction, and obliquely downward with respect to the support member 11, specifically, the head unit 6 over the mirror 32 described later provided on the base 1. Is moved obliquely downward to the camera unit 20 at an angle at which the picked-up component image reflected on the mirror 32 can be picked up.

  Of the cameras 22 and 23, the first camera 22 is supported so as to be rotatable about its optical axis with respect to the frame of the camera unit 20, and is rotated by a rotation driving means using a servo motor 30 (see FIG. 5) as a drive source. It is configured to be driven. On the other hand, the second camera 23 is fixedly supported with respect to the frame. Specifically, as schematically shown in FIG. 4, the first camera 22 is driven in a first posture (indicated by a solid line in the drawing) in which the element array 22 a of the CCD line sensor is orthogonal to the X-axis direction by driving the servo motor 30. The second camera 23 is configured to be switchable between a second posture (indicated by a broken line in the figure) and a second posture in which the element row 22a is parallel to the X-axis direction. Are fixed so as to be parallel to the X-axis direction, and the element lines 22a and 23a of the CCD line sensors of both cameras 22 and 23 are aligned in the X-axis direction in a state where the first camera 22 is switched to the second posture. Both cameras 22 and 23 are provided for the camera unit 20 so as to be lined up. In this embodiment, the first camera 22, the camera unit 20, the servo motor 30, etc. constitute the first imaging means of the present invention, and the second camera 23, the camera unit 20, etc. constitute the second imaging means. The

  Each of the cameras 22 and 23 includes the CCD line sensor and a condensing lens for forming an image of the suction component on the sensor element. Both the cameras 22, 23 have the first camera 22 set in the second posture, and the suction component images of the first to third mounting heads 16 of the suction component images reflected on the mirror 32 described later are the first camera 22. While the image is formed on the CCD line sensor (imaging device), the suction component images of the fourth to sixth mounting heads 16 are formed on the CCD line sensor (imaging device) of the second camera 23 and the first camera 22 is moved. In the state set in the first posture, the entire Y-axis direction of the suction component (maximum size component) image of the first to sixth mounting heads 16 reflected on the mirror 32 described later is the CCD line sensor (imaging device) of the first camera 22. The number of CCD line sensors in each of the cameras 22 and 23, the arrangement of condensing lenses, and the like are set.

  Although not shown in detail, the illuminating device 21 has a plurality of LEDs 21 a disposed around the cameras 22 and 23. These LEDs 21a are fixed to the camera unit 20 in a state of being directed downward in parallel with the optical axes of the cameras 22 and 23, and when the head unit 6 moves above the mirror 32 described later, The mounting head 16 is configured to irradiate illumination light from below.

  On the other hand, when the head unit 6 is further moved between the component supply unit 4 and the mounting work position on the base 1, directly below the component sucked by each mounting head 16 (suction nozzle 16 a). A pair of mirrors 32 and 32 (optical members) for projecting (reflecting) an image (lower surface image) are provided. Each of these mirrors 32 is fixedly provided in a space between the conveyor 2 and the component supply unit 4.

  These mirrors 32 are rectangular total reflection mirrors that are elongated in the X-axis direction. As shown in FIG. 3, when each mounting head 16 is positioned above each mirror 32, each mirror 32 is connected to the camera 22, In a state where the reflecting surface is directed upward so as to be directed to 23, and in a slanting posture that descends from the front side of the apparatus toward the rear side (from the lower side to the upper side in FIG. 1), in detail, the normal line of the mirror 32 is It is fixedly provided in each space between the conveyor 2 and the component supply unit 4 at an angle that bisects the angle between the optical axis M1 of the cameras 22 and 23 and the Z axis.

  Each mirror 32 is set to have a length dimension in the X-axis direction so as to include at least the component supply unit 4, and is a component sucked by the mounting head 16, specifically, a component having the maximum size among the mounted components. The length dimension in the Y-axis direction (inclination direction) is set so that the entire directly below image (bottom surface image) of the part is reflected (reflected) when adsorbed.

  FIG. 5 is a schematic block diagram showing the control system of the mounting machine.

  The mounting machine of this embodiment is composed of a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during operation of the apparatus, and the like. The controller 40 is provided. The controller 40 includes a main control unit 42, an axis control unit 44, a camera unit drive control unit 45, a camera attitude switching control unit 46, an illumination control unit 47, a camera control unit 48, and an image processing unit 50 as functional configurations. Yes.

  The main control unit 42 controls the operation of the mounting machine in an integrated manner, and controls the drive of the servo motors 9 and 15 and the like via the axis control unit 44 so as to operate the head unit 6 and the like according to a program stored in advance. In addition, the suction state of the component based on the component images captured by the cameras 22 and 23, specifically, the suction displacement amount in the X-axis and Y-axis directions with respect to the nozzle center, and the suction displacement around the nozzle center axis (R-axis). The amount is calculated.

  Further, during the mounting operation, the axis control unit 44 and the camera unit drive control are performed so that the camera unit 20 and the head unit 6 execute a predetermined component recognition operation for imaging the component sucked by the mounting head 16. The servo motors 9, 15, 26, 30 and the like are driven and controlled via the unit 45 and the camera attitude switching control unit 46. At this time, based on the board information stored in the mounting data storage unit (not shown), that is, information on the type of the printed circuit board 3 and the type and mounting position of components mounted thereon, the head unit 6 is connected to the camera unit 20. First component recognition operation that mainly picks up the picked-up component by the first camera 22 while moving the X-axis direction, and using both cameras 22 and 23 while moving the support member 11 in the Y-axis direction with respect to the mirror 32 Then, the servo motors 9, 15, 26, 30 and the like are driven and controlled via the control units 44, 45, 46 so as to alternatively execute the second component recognition operation for imaging the picked-up components. Each component recognition operation will be described in detail later.

  The axis control unit 44 drives and controls the Y-axis servo motor 9 and the X-axis servo motor 15 while detecting the current position (X, Y) of the head unit 6 based on signals from the encoders 9a and 15a. Move to a predetermined position. Although not shown, the shaft control unit 44 similarly performs drive control for the lifting / lowering drive means of the mounting head 16 and the servo motor of the rotation drive means.

  The camera unit drive control unit 45 drives the servo motor 26 to control the camera unit 20 in a predetermined manner while detecting the current position (X coordinate position) of the camera unit 20 based on a signal from an encoder 26a incorporated in the servo motor 26. To the imaging start position.

  The camera attitude switching control unit 46 controls the attitude of the first camera 22 of the camera unit 20, and detects the rotational angle position of the first camera 22 based on a signal from an encoder 30 a incorporated in the servo motor 30. The attitude of the first camera 22 is switched by controlling the drive of the servo motor 30.

  The illumination control unit 47 and the camera control unit 48 control the illumination device 21 and the cameras 22 and 23 of the camera unit 20.

  The image processing unit 50 generates image data suitable for component recognition by performing predetermined processing on the image signals output from the cameras 22 and 23 and outputs the image data to the main control unit 32.

  The image processing unit 50 includes a distortion correction unit 51 and a magnification correction unit 52. The distortion correction unit 51 performs image correction based on an imaging position on the mirror 32 by the cameras 22 and 23 and distortion component data stored in a storage unit (not shown). That is, the storage unit stores in advance data obtained by measuring the reflection surface of the mirror 32 into a plurality of partial regions to determine how much the image reflected on the mirror 32 is shifted from the reference position. The correction unit 51 performs image correction based on the imaging position and the distortion component data of the partial area corresponding to the position. For example, a distortion obtained by reversing the positive / negative of the distortion component is applied to the picked-up image of the suction component, thereby removing the distortion. Further, the magnification correction unit 52 corrects the picked-up component image captured based on a second component recognition operation described later. This point will be described in detail later.

  Next, the operation control of the first and second component recognition operations executed during the mounting operation will be described in detail with reference to FIGS.

<First part recognition operation>
The first component recognition operation is an operation in which the first camera 22 captures the suction component image of each mounting head 16 reflected on the mirror 32 while moving the head unit 6 in the X-axis direction with respect to the camera unit 20. Specifically, as shown by a solid line in FIG. 6, after the completion of component suction, the head unit 6 is moved from the final component suction position (position [1]) to the imaging start position above the mirror 32, that is, for each mounting. The component picked up by the head 16 is moved to a position where it is shown in a line on the mirror 32 (position [2]; referred to as a first imaging start position if necessary), and the head unit 6 starts the imaging. The camera unit 20 is disposed in the vicinity of the component adsorption completion position of the head unit 6 in the support member 11 at the same time as the arrival of the position or earlier (for example, at the same time as or earlier than the completion of the component adsorption operation). . That is, when the head unit 6 is at the imaging start position ([2] position), it is in the vicinity of the mounting head 16 on the side closer to the printed circuit board 3 of the first or sixth mounting head 16. In addition, the camera unit 20 is arranged so that the first camera 22 is located at a position slightly deviated toward the printed circuit board 3 in the X-axis direction. At this time, the first camera 22 is controlled to be switched to the first posture. Then, the lighting device 21 is turned on while the camera unit 20 is stopped, and the head unit 6 is moved in the X-axis direction in this state. In this way, the light emitted from the LED 21 a is reflected by the mirror 32, further reflected by the lower surface of the component attracted by the mounting head 16, and then reflected again by the mirror 32 and incident on the first camera 22. On the other hand, as described above, the head unit 6 moves relative to the camera unit 20 in the X-axis direction (that is, the direction in which the mounting heads 16 are arranged), whereby the lower surface image of each suction component is first. Images are sequentially captured by the camera 22. After the head unit 6 is moved to the position completely passing through the first camera 22 in this way, that is, the imaging completion position ([3] position), the first mounting position ([4] on the printed circuit board 3). The head unit 6 is moved toward (position).

  The arrangement of the head unit 6 at the start of component imaging in the first component recognition operation (position [2]), the arrangement of the camera unit 20 (cameras 22 and 23), and the movement direction of the head unit 6 at the time of component imaging are as follows: Relative positional relationship between the position ([1] position) of the head unit 6 when the final part is sucked and the position ([4] position) when the head unit 6 is arranged at the first component mounting position. Is set so that the amount of movement of the head unit 6 is as small as possible. In the present embodiment, the arrangement of the head unit 6 at the start of component imaging is set in the main controller 42 based on the board information and the like as follows, for example.

  First, the coordinate positions of the first and sixth mounting heads 16 of the head unit 6 at the [1] position and the coordinate positions of the first and sixth mounting heads 16 of the head unit 6 at the [4] position are obtained. 7A, a line segment R1 connecting the coordinate position of the first mounting head 16 at the [1] position and the coordinate position of the sixth mounting head at the [4] position with a straight line, And the length of the line segment R2 connecting the coordinate position of the sixth mounting head 16 at the position [1] and the coordinate position of the first mounting head at the position [4] is calculated. Based on the calculation result, when the line segment R1 <the line segment R2 and the difference exceeds a predetermined value (| R1-R2 |> R), that is, as shown in FIG. When the unit 6 is at a position biased toward the board carry-out side with respect to the printed circuit board 3, the moving direction of the head unit 6 at the time of picking up the suction component is the right direction (right direction in the figure (the direction of the white arrow); The direction from the exit side to the substrate carry-in side) is set.

  Next, the arrangement of the head unit 6 at the start of component imaging (position [2]) and the camera unit 20 so that the suction component images can be sequentially captured by moving the head unit 6 in this direction (right direction). Find the coordinate position. Specifically, a line segment R0 connecting the coordinate positions of the first mounting head 16 at the positions [1] and [4] with a straight line and the center line M of the mirror 32 (passing the center in the Y-axis direction to the X-axis). And the position of the head unit 6 when the first mounting head 16 is located at the intersection coordinate position is obtained as the [2] position. Then, the head (right end) position when the head unit 6 is moved to the [2] position on the support member 11 is further obtained, and the first camera 22 is appropriately outside the head position or the head position. The coordinate position of the camera unit 20 at the time of arranging the element (accurately, the element line of the CCD line sensor) is obtained as the arrangement of the camera unit 20 at the time of imaging the component.

  On the other hand, when the comparison result of the line segments R1 and R2 is line segment R1> line segment R2 and the difference exceeds a predetermined value (| R1-R2 |> R), that is, schematically shown in FIG. As shown in FIG. 4, when the head unit 6 is at a position biased toward the board carry-in side with respect to the printed board 3 at the [1] position, the moving direction of the head unit 6 at the time of picking up the suction component is set to the left (see FIG. So that the suction component images can be sequentially captured by moving the head unit 6 in this direction (leftward direction). Then, the arrangement (position [2]) of the head unit 6 and the coordinate position of the camera unit 20 at the start of component imaging are obtained. Specifically, a line segment R0 ′ connecting the coordinate positions of the sixth mounting head 16 at the positions [1] and [4] with a straight line and the center line M of the mirror 32 (through the center in the Y-axis direction, the X axis And the position of the head unit 6 when the sixth mounting head 16 is located at the intersection coordinate position is obtained as the [2] position. Then, the head (right end) position when the head unit 6 is moved to the [2] position on the support member 11 is further obtained, and the first camera 22 is appropriately outside the head position or the head position. The coordinate position of the camera unit 20 at the time of arranging the element (accurately, the element line of the CCD line sensor) is obtained as the arrangement of the camera unit 20 at the time of imaging the component.

<Second part recognition operation>
The second component recognition operation is an operation in which both the cameras 22 and 23 capture the suction component image of each mounting head 16 reflected on the mirror 32 while moving the support member 11 in the Y-axis direction with respect to the mirror 32. Similar to the first component recognition operation, the line segments R1 and R2 are calculated, and the comparison result is the line segment R1 = the line segment R2, or the difference between the line segment R1 and the line segment R2 is less than a predetermined value. (| R1-R2 | <R), i.e., when the final component suction position by the head unit 6 is located at a side portion of the printed circuit board 3 (generally indicated by a hatched portion in FIG. 6). Specifically, as shown by a broken line in FIG. 5, after the completion of the component suction, the head unit 6 is first moved straight from the final component suction position (position [5]) in the Y-axis direction to move above the mirror 32. The suction part image reflected on the mirror 32 is picked up by the cameras 22 and 23 during the passage. At this time, when the head unit 6 moves straight in the Y-axis direction and each mounting head 16 reaches the imaging start position in front of the mirror 32 (referred to as the second imaging start position if necessary), or more than that. The camera unit 20 is arranged at a position corresponding to the central portion (the center in the X-axis direction) of the head unit 6 at an early timing (for example, at the same time as the completion of the component suction operation or earlier), and the first camera 22 is arranged. By switching to the second posture, the first camera 22 picks up the component image sucked by the first to third mounting heads 16 among the sucked component images reflected on the mirror 32, while the fourth to fourth. 6 The component image adsorbed by the mounting head 16 is picked up by the second camera 23. Thus, after the head unit 6 is moved to the position completely passing through the mirror 32, that is, the imaging completion position ([6] position), the first mounting position ([7] position) on the printed circuit board 3 is obtained. The head unit 6 is moved toward

  Since the head unit 6 and the camera unit 20 are both supported by the support member 11 as described above and move integrally in the Y-axis direction, the cameras 22 and 23 (CCD lines in which image pickup elements are arranged in the X-axis direction). It is considered impossible to image the suction component with the sensor), but as a result of the mirror 32 being provided in an inclined posture as described above, the suction component is moved in the Y-axis direction with respect to the mirror 32. The cameras 22 and 23 and the suction component can be pseudo-moved relative to each other in the Y-axis direction, and as a result, the suction component can be imaged.

Hereinafter, the principle will be described with reference to FIG. The figure schematically shows the positional relationship among the cameras 22 and 23, the mounting head 16, the suction component C and the mirror 32. In this figure, consider the case where the head unit 6 and the camera unit 20 move from the left side to the right side with respect to the mirror 32. here,
-Optical path length from the cameras 22 and 23 before movement to the mirror 32 (reflection surface); L1
The optical path length from the mirror 32 (reflection surface) before the movement to the suction component C; L2
-Optical path length from the camera 22, 23 after movement to the mirror 32; L1 '
-Optical path length from the mirror 32 (reflection surface) after the movement to the suction component C; L2 '
The inclination angle of the mirror 32 (angle formed by the reflecting surface and the horizontal surface); θ
-Movement distance of the head unit 6; Δd
And Further, it is assumed that the imaging positions (positions of the optical axis L2) by the cameras 22 and 23 before movement coincide with the center of the nozzle.

If the head unit 6 and the camera unit 20 are moved in the Y-axis direction relative to the mirror 32 while the suction component C is maintained at a certain height from this state, the mirror 32 is inclined. The image pickup positions (positions of the optical axis L2 ′) after movement by the optical discs 22 and 23 are shifted in the Y-axis direction by the displacement amount y from the nozzle center. That is, from the figure, Δd · tan θ = y · tan θ + y / tan 2θ
Because
y = ((tan θ · tan 2θ) / (tan θ · tan 2θ + 1)) · Δd
As a result, the cameras 22 and 23 and the suction component C are pseudo-relatively moved. In other words, the cameras 52a and 52b and the mirror image of the suction component C move relatively.

  Therefore, in the second component recognition operation, the relative movement between the cameras 22 and 23 and the suction component C as described above occurs while the head unit 6 and the camera unit 20 are integrally moved in the Y-axis direction as described above. By doing so, it becomes possible to image the suction component C by the cameras 22 and 23.

  Note that when the suction component C is imaged using the above-described pseudo relative movement, the imaging distance between the cameras 22 and 23 and the subject (suction component C) changes as the head unit 6 moves. . That is, since the image magnification changes, it is necessary to correct the magnification when recognizing the part.

Specifically, if the difference in the optical path length from the cameras 22 and 23 before and after the movement to the mirror 32 (reflection surface) is a and the difference in the optical path length from the mirror 32 to the suction part C before and after the movement is b, from FIG. a = y / sin2θ
・ B = y / tan2θ
Therefore, if the magnification deviation before and after movement is e,
E = (L1 ′ + L2 ′) / (L1 + L2)
= (L1 + L2- (y / sin2θ + y / tan2θ)) / (L1 + L2)
It becomes.

  In this way, when the suction component C is imaged using pseudo relative movement, a magnification shift e corresponding to the amount of movement of the cameras 22 and 23 in the Y-axis direction occurs in the image. Therefore, in this embodiment, when the suction component is imaged by the second component recognition operation, the magnification deviation e is calculated by the main control unit 42, and the image processing unit 50 performs the calculation based on the magnification deviation e. The magnification correction unit 52 is configured to perform image correction (magnification correction).

  Next, the operation control of the mounting machine by the controller 30 will be described based on the flowchart of FIG.

  In the mounting operation, first, information on the parts to be sucked by each mounting head 16 of the head unit 6 from the board information (sucking part information), that is, the type of the target part, the position of the tape feeder 4a to which the target part is supplied, and the target Information on the type of component, the position of the mounting head 16 that sucks the component, the suction order, and the like, as well as information on the mounting position and mounting order of the target component on the printed circuit board 3 (loading position information) are read. (Step S1).

  The lengths of the line segments R1 and R2 are calculated based on the final component suction position in the component supply unit 4 and the first mounting position on the printed circuit board 3, and based on the comparison result of the line segments R1 and R2. It is determined in which operation of the first or second component recognition operation (described as imaging methods 1 and 2 in the flowchart) the suction component recognition is performed (step S2). Specifically, when the line segment R1 <(or>) line segment R2 and the difference exceeds a predetermined value (| R1-R2 |> R), it is determined as the first component recognition operation, and the line segment R1 = If the line segment R2 or the difference between R1 and R2 is less than a predetermined value (| R1-R2 | <R), it is determined as the second component recognition operation.

  Here, when it is determined that the first component recognition operation is performed, the coordinate position of the camera unit 20 (cameras 22 and 23) is obtained, and the servo motor 26 is driven to move the camera unit 20 to the coordinate position ( Steps S3 and S4). Then, it is determined whether or not the first camera 22 is in the first posture. If NO is determined, the servo motor 30 is driven to switch the posture of the first camera 22 to the first posture (step) S5, S6). Even when it is determined in step S2 that the second component recognition operation is performed, the same processing is performed except that the posture of the first camera 22 is switched to the second posture (steps S3 ′ to S6 ′).

  When the last component suction is completed, the head unit 6 is moved from the component supply unit 4 onto the printed circuit board 3 at the mounting work position, and the suction component sucked by each mounting head 16 during the movement is mirrored. Images are taken by the cameras 22 and 23 via 32. Specifically, as described above, in the case of the first component recognition operation, the head unit 6 is reflected on the mirror 32 by moving the head unit 6 above the mirror 32 in the X-axis direction relative to the camera unit 20. The suction part image of each mounting head 16 is picked up by the first camera 22 (operations [1] to [3] in FIG. 6). On the other hand, in the case of the second component recognition operation, each mounting head reflected on the mirror 32 by moving the camera unit 20 and the head unit 6 integrally in the Y-axis direction as the support member 11 moves. Sixteen suction component images are picked up by both cameras 22 and 23 (operations [5] to [6] in FIG. 6).

  When the imaging of the suction component is completed based on each component recognition operation described above, the head unit 6 is moved to the first mounting position ([4] or [7] in FIG. 6) on the printed circuit board 3, Based on the image of the suction component, the suction state of the component by each mounting head 16 is image-recognized, and the suction position error around the X axis, Y axis and R axis of the component with respect to the suction nozzle 16a is obtained. Correction amounts (ΔX, ΔY, ΔR) are calculated (step S8). Then, the target position is reset based on the correction amount, and the head unit 6 is driven and controlled according to the reset target position, so that the components sucked by the mounting heads 16 are sequentially placed on the printed circuit board 3. (Step S9).

  Next, it is determined whether or not all the mounting processes for the printed circuit board 3 have been completed (step S10). If NO is determined here, the process proceeds to step S1 to proceed to the next mounting operation. On the other hand, if YES is determined, the printed circuit board 3 at the mounting work position is carried out to the next process by driving the conveyor 2, and this flowchart is ended.

  As described above, in this mounting machine, the camera unit 20 (cameras 22 and 23) for imaging the picked-up component is movably provided, and at the latest, the head unit 6 is in the imaging start position (the first component recognition operation is the first one). It is assumed that at the timing of reaching the first imaging start position (second imaging start position in the second component recognition operation), in the vicinity of the component suction completion position by each mounting head 16, that is, the head unit 6 is at the imaging start position. If the camera unit 20 moves to a position near the head unit 6 in the case where the head unit 6 moves and can immediately pick up the picked-up component image, the picked-up component is quickly removed after the pick-up of the component is completed. Since it is configured to be able to take an image, the picked-up component can be picked up immediately regardless of where the component pick-up completion position by the head unit 6 is. Ukoto can. In other words, the time required for the imaging operation of a component may greatly vary depending on the distance between the component suction completion position and the camera position, as in this type of conventional mounting machine in which the camera is fixed at a specific position on the base. However, the suction part can always be imaged as quickly as possible. In addition, using the cameras 22 and 23 equipped with CCD line sensors as the cameras for picking up the picked-up parts, the picked-up parts are moved while moving the head unit 6 and the camera unit 20 relatively in the X-axis direction in the first part recognition operation. Therefore, it is possible to capture each component adsorbed by the plurality of mounting heads 16 with extremely high efficiency. Therefore, the tact time can be effectively shortened as compared with the conventional mounting machine of this type.

  In addition, the mounting machine is configured to switch between the first component recognition operation and the second component recognition operation according to the component suction position as described above, which also contributes to shortening of the tact time. effective. That is, all of the suction component recognition may be performed by the first component recognition operation. In this case, the component suction completion position by the head unit 6 is a portion immediately on the side of the printed circuit board 3 (the hatched line in FIG. 6). In order to take an image of the component, it is necessary to temporarily move the head unit 6 along the mirror 32 in the X-axis direction, that is, from the printed board 3 to the board carry-in side or the carry-out side. . Therefore, when the component suction operation is completed at the side portion of the printed circuit board 3, the total amount of movement of the head unit 6 is increased, which is disadvantageous in reducing the tact time. On the other hand, according to the configuration of the embodiment in which the first component recognition operation and the second component recognition operation are used in combination, when the component suction operation is completed at the side portion of the printed circuit board 3 as described above, By performing component recognition based on the two-component recognition operation, the head unit 6 can be moved onto the printed circuit board 3 as it is after the component suction (see the broken line diagram in FIG. 6). Therefore, it is effective in reducing the tact time as compared with the case where component recognition is performed only by the first component recognition operation.

  In the above-described embodiment, the illumination device 21 is provided in the camera unit 20, but the illumination device 21 may be provided on the base 1 side. Specifically, the LED 21a may be arranged along the mirror 32 over the entire area, and the main control unit 42 may be configured to control the lighting of the necessary LED 21a according to the movement path of the head unit 6 at the time of component imaging. Good. According to this configuration, since the LED 21a is arranged in the vicinity of the mirror 32, it is possible to irradiate illumination light from a position closer to the component attracted by the mounting head 16, which is suitable for component recognition. There is an advantage that a clearer image can be taken.

  Further, in the above-described embodiment, the camera unit 20 is provided with the two cameras 22 and 23 and the first camera 22 is provided so that the posture can be switched. Thus, in the second component recognition operation, each of the first to third mounting heads 16. Although the first camera 22 is commonly used as a camera for imaging the suction parts, a dedicated camera may be provided for each part recognition operation. In this case, the camera used for each component recognition operation can be fixed to the camera unit 20.

  Further, in the second component recognition operation, the components picked up by the plurality of mounting heads 16 are configured to be imaged by the common camera 22 (or 23). You may comprise so that an adsorption | suction component may be imaged. According to this, since the picked-up component can be imaged more clearly and greatly, the component recognition accuracy can be increased.

  When component recognition is performed by the second component recognition operation, a pseudo relative movement amount between the suction component and the cameras 22 and 23 with respect to the movement amount of the head unit 6 (mounting head 16) in the Y-axis direction (the suction component of the suction component). The relative movement amount between the mirror image and the cameras 22 and 23) is small, so that it is not suitable to recognize a large component based on the second component recognition operation. Therefore, in the case of mounting ultra-small chip components on the side portion of the mounting work position (printed circuit board 3) as much as possible after setting up the tape feeder 4a so that ultra-small chips are supplied, It is desirable to optimize the mounting order and the like so that all the suction parts by the head 16 become ultra-small chip parts.

  Next, a second embodiment of the present invention will be described.

  10 and 11 schematically show a second embodiment of the mounting machine according to the present invention. Since the mounting machine of the second embodiment basically has the same configuration as the mounting machine of the first embodiment, the common parts are described by attaching the same reference numerals as those of the first embodiment. In the following, differences from the mounting machine of the first embodiment will be described in detail.

  The mounting machine according to the second embodiment is provided with optical units 60 and 61 for projecting (reflecting) suction components in a space between the conveyor 2 and the component supply unit 4.

  Each of the optical units 60 and 61 is provided in a space between the conveyor 2 and the component supply units 4 on both sides thereof, and a mirror 66 (an optical member) that reflects a suction component image and the like, and an illumination device 67 are integrated. It is configured to move in the X-axis direction. That is, in the space between the conveyor 2 and the component supply unit 4 on the base 1, the X-axis direction rotated by a pair of parallel fixed rails 62 and servomotors 63 extending in the X-axis direction. The ball screw shaft 64 is provided, a movable table 65 (holding member) is movably mounted on the fixed rail 62, and the ball screw shaft 64 is screwed into the movable table 65. . The mirror 66 and the illumination device 67 are integrally mounted on the movable table 65, and the mirror 66 and the like move in the X-axis direction along the fixed rail 62 integrally with the movable table 65 by the operation of the servo motor 63. It is configured.

  The servomotors 63 of the optical units 60 and 61 are each provided with an encoder 63a (shown in FIG. 12) so that the moving position of the movable table 25 is detected.

  The mirror 66 is formed of a rectangular mirror elongated in the X-axis direction. As shown in FIG. 11, when the mounting heads 16 are positioned above the mirrors 66, the mirrors 66 point to the cameras 22 and 23. In this manner, it is mounted (held) on the movable table 65 in a state in which the reflecting surface faces upward and from the front side of the apparatus to the rear side (from the lower side to the upper side in FIG. 10) in a tilting posture that is first lowered. Note that the size of the mirror 66 in the X-axis direction is such that a component adsorbed by all the mounting heads 16 of the head unit 6, specifically, a directly below image of a component when the component of the maximum size among the mounted components is adsorbed. The distance between the mounting heads 16 at both ends is set to be appropriately longer so that the (lower surface image) is reflected (reflected) at the same time. Further, the size in the Y-axis direction is set so that the above-mentioned maximum size component can be seen with a margin.

  Although not shown in detail, the illuminating device 67 has a plurality of LEDs 67 a disposed over the entire circumference of the mirror 66. These LEDs 67a are fixed to the movable table 65 so as to be directed almost directly above, and when the head unit 6 is above the movable table 25, the suction parts of the mounting heads 16 are illuminated from below. It is comprised so that light may be irradiated.

  FIG. 12 is a schematic block diagram showing the control system of the mounting machine according to the second embodiment. As shown in the figure, the controller 40 of the second embodiment is further provided with an optical unit drive controller 54.

  The optical unit drive controller 54 controls the operation of the movable table 65 of the optical units 60 and 61, and detects the current position (X coordinate) of the movable table 65 based on a signal from the encoder 63a. The movable table 65 is moved to a predetermined position by controlling the driving of the movable table 65. During the mounting operation, the movable table 65 is moved to the same position as the camera unit 20 in the X-axis direction based on a control signal from the main control unit 42. That is, the movable table 65 is moved to a position where the suction parts can be picked up by the cameras 22 and 23 (position where the suction part image is reflected on the mirror 66).

  In the controller 40 of the second embodiment, the illumination control unit 47 is connected to the illumination devices 67 of the optical units 60 and 61, and the illumination control unit 47 performs lighting control of the illumination devices 67. It is configured.

  The mounting machine of the second embodiment also controls movement of the head unit 6 and the camera unit 20 as in the first embodiment, and moves the movable table 65 to the camera unit 20 in the first component recognition operation and the second component recognition operation. The movable table 65 and the camera unit 20 are apparently moved integrally by controlling the movement in the X-axis direction in synchronization with the movement of.

  That is, in the second embodiment, instead of providing the long mirror 32 over the entire arrangement direction of the tape feeder 4a as in the first embodiment, the small mirror 66 is provided so as to be movable, and the head unit 6 The mirror 66 is configured to move in conjunction with the camera unit 20 in accordance with the movement path.

  According to the mounting machine of the second embodiment, since the mirror 66 is reduced in size, it is difficult for the mirror 66 itself to be distorted, and the occurrence of distortion due to an increase in ambient temperature is reduced. Therefore, the influence on the image due to the distortion of the mirror 66 itself can be effectively reduced. Further, since the mirror 66 is reduced in size as described above, the burden of collecting data for correcting image distortion, that is, the burden of collecting distortion component data used for the distortion correction processing in the distortion correcting unit 51 is reduced. Further, it becomes easy to closely examine the distortion component of the entire mirror 66 (the entire reflection surface). Accordingly, in total, it is possible to reduce the influence on the image due to the distortion of the mirror 66, and there is an advantage that it is possible to increase the image recognition accuracy of the suction component as compared with the first embodiment. is there.

  Further, since the illumination device 67 is integrally mounted on the movable table 65 that holds the mirror 66, it is possible to provide illumination from a position closer to the suction component as compared with the first embodiment. As a result, there is an advantage that a clearer image suitable for component recognition can be taken.

  The illumination device 67 may be mounted on the camera unit 20 as in the case of the first embodiment, or may be fixedly provided on the base 1, specifically, the movement of the movable table 65. You may arrange | position LED along a path | route and light up the LED corresponding to the position of the movable table 65b among these LEDs. Moreover, the movable table 65 and the camera unit 20 do not necessarily have to be moved integrally in appearance, and may be moved with a slight time difference.

By the way, the mounting machines of the first and second embodiments described above are the best embodiments of the surface mounting machine according to the present invention, and the specific configuration thereof is appropriately changed without departing from the gist of the present invention. Is possible. For example, the following aspects can also be taken.
(1) In the first and second embodiments, two types of imaging operations (first component recognition operation and second component recognition operation) are alternatively executed as the imaging operation of the suction component. The component recognition may be performed only by the first component recognition operation, that is, the operation of imaging the suction component while moving the head unit 6 relative to the camera unit 20 in the X-axis direction.

  According to this configuration, the total amount of movement of the head unit 6 when the component suction is completed in the component supply unit 4 at the portion immediately adjacent to the mounting work position (the portion indicated by the oblique lines in FIG. 6) is the second component recognition operation. However, since the magnification correction process is not required for component recognition, it is not necessary to provide the magnification correction unit 52 in the controller 40, and the configuration of the control system is simplified. There is an advantage that the control load of image processing can be reduced. In addition, since it becomes possible to image the suction component only with the first camera 22 held in the first posture as a camera for imaging the suction component, the number of cameras can be reduced, and a mechanism for switching the camera posture Is also unnecessary. Therefore, it is an effective configuration for simplifying and reducing the device configuration.

  In the second embodiment, when the suction part is recognized only by the first part recognition operation, it is not always necessary to display all the suction parts on the mirror 66, and the first camera 22 (that is, the line sensor) captures the suction parts. It is sufficient if a component image having a possible width is reflected on the mirror 66. Therefore, in the second embodiment, when the component recognition is performed only by the first component recognition operation, the width dimension of the mirror 66 can be reduced in the X-axis direction. In this case, by moving the movable table 65 and the camera unit 20 together in an integrated manner, it is possible to sequentially image the components adsorbed by the mounting heads 16. According to such a configuration, since the mirror 66 is further downsized, there is an advantage that the influence on the image due to the distortion of the mirror 66 can be further reduced. In addition, since the number of LEDs constituting the lighting device 67 can be reduced, the configuration is effective in simplifying and reducing the cost of the device configuration.

Further, in the case where the small mirror 66 that reflects the minimum necessary suction component image is applied, for example, as shown in FIG. 13, the first camera 22 is mounted on the movable table 65, and the mirror 66 and the first camera are mounted. It is also conceivable to move 22 together in the X-axis direction. According to such a configuration, a configuration (first camera 22) for recognizing a suction component or the like is not mounted at all on the head unit 6 or the head unit support member 11, which is advantageous in driving the head unit 6 at high speed. It becomes composition. There is also an advantage that the drive system of the mirror 66 (movable table 65) and the drive system of the first camera 22 can be integrated.
(2) In the first and second embodiments, in the first component recognition operation, the camera unit 20 is stopped and the head unit 6 is moved. Of course, the head unit 6 is stopped and the camera unit is moved. 20 may be moved. In this case, in the second embodiment, if only the camera unit 20 is moved while the movable table 65 is stopped, the suction part image reflected on the mirror 66 can be captured by the first camera 22. Good.

  In the first component recognition operation, both the head unit 6 and the camera unit 20 may be moved. Thus, if both the head unit 6 and the camera unit 20 are moved in directions opposite to each other, it is possible to increase the relative moving speed between the first camera 22 and the suction component during the suction component imaging. It becomes possible to image the suction component at a higher speed. For this reason, it is possible to perform the component recognition processing quickly and to further shorten the tact time.

When both the head unit 6 and the camera unit 20 are moved in this way, the camera unit 20 and the head unit 6 may be moved in the same direction with a speed difference. In this way, even when the relative moving speed between the first camera 22 and the suction component during component imaging is limited, the head unit 6 is quickly moved to the printed circuit board 3 side, while being optimal for component recognition. There is an advantage that it is possible to take an image of the suction component. That is, after the component suction, it is efficient to image the suction component while moving the head unit 6 at a high speed. For example, the camera unit 20 is stopped and the component is imaged. When the relative movement speed between the first camera 22 and the suction component is limited by the relationship between the light quantity 21 (67) and the component type, for example, if the image quality is prioritized, the movement speed of the head unit 6 must be reduced. Inevitably, this leads to a drop in mounting efficiency. On the other hand, when the camera unit 20 and the head unit 6 are moved in the same direction with a speed difference as described above, the head unit 6 is moved at a high speed after picking up the components, but at a slower speed. By moving the camera unit 20 in the same direction as the head unit 6, while moving the head unit 6 toward the printed circuit board 3 at a high speed, the first camera 22 and the suction component are relatively moved within the speed limit. Thus, it is possible to capture an optimal part image. Therefore, there is an advantage that the tact time can be effectively shortened while the recognition accuracy of the suction component can be kept good.
(3) In the first component recognition operation, the relative moving speed between the head unit 6 and the camera unit 20 (cameras 22 and 23) may be controlled according to the type of component. By controlling the moving speed in this way, it is possible to secure an exposure time according to the type of suction component while keeping the illumination at a constant light quantity, and for optimal image according to the type of component, that is, component recognition An optimal image can be acquired. Such control can be performed by driving and controlling the illumination device 21 (illumination device) via the illumination control unit 47 by the main control unit 42 based on the substrate information.
(4) In both the first and second embodiments, the part adsorbed by each mounting head 16 is reflected (reflected) on the mirror 32 (66), and this is supported by the support member 11 in the camera unit 20. (Cameras 22, 23) are configured to capture images, but a camera including a line sensor in which image sensors are arranged in the Y-axis direction is placed between the conveyor 2 and the component supply unit 4 on the base 1. It is provided so as to be movable in the axial direction, and after sucking the component, the head unit 6 is arranged above the moving path of the camera and the camera and the head unit 6 are moved relative to each other in the X-axis direction. You may comprise so that it may image directly with a camera. As a specific configuration, for example, a configuration in which the camera is mounted on the movable table 65 instead of the mirror 66 of the second embodiment can be considered. According to such a configuration, since all the mechanisms for driving the camera are mounted on the base 1 side, the support member 11 can be reduced in weight, which is advantageous in driving the head unit 6 at high speed. There is an advantage.

Note that, according to the configuration in which the mirror 32 is fixedly provided between the conveyor 2 and the component supply unit 4 as in the first embodiment, the head unit 6 is driven at a high speed through the weight reduction of the support member 11. Although it is inferior to the above configuration, it is superior to the above configuration in that the moving distance of the head unit 6 is shortened. That is, in the first embodiment, since the mirror 32 is only disposed between the conveyor 2 and the component supply unit 4, a camera driving mechanism, an illumination device, and the like are provided between the conveyor 2 and the component supply unit 4. Compared to the above configuration in which these wirings and the like need to be provided, the interval between the component supply unit 4 and the conveyor 2 can be narrowed. Therefore, it is possible to reduce the total movement distance of the head unit 6 that repeatedly moves between the component supply unit 4 and the mounting work position, and this has the advantage that it can contribute to shortening the tact time.
(5) In the first and second embodiments, the mirror 32 (66) is applied as an optical member for reflecting (reflecting) the component adsorbed on the mounting head 16, but of course other than this. An optical member such as a half mirror or a prism can also be applied.

It is a top view which shows 1st Embodiment of the surface mounting machine which concerns on this invention. It is a front view which shows the surface mounting machine which concerns on this invention. It is a side view which shows the structure of a head unit and a camera unit. It is a front view (drawing which looked at the camera unit in the optical axis direction of the camera) of the camera unit which shows the relation between the 1st camera and the 2nd camera. It is a block diagram which shows the control system of the surface mounter which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the imaging operation of an adsorption | suction component, A continuous line shows the motion of the head unit in 1st component recognition operation, and the broken line has shown the motion of the head unit in 2nd component recognition operation. It is a schematic diagram explaining the method of determining the imaging start position of a head unit and a camera unit in the imaging operation of a suction component. It is a schematic diagram explaining the principle of 2nd components recognition operation | movement. It is a flowchart which shows an example of mounting operation control. It is a top view which shows 2nd Embodiment of the surface mounter which concerns on this invention. It is a side view which shows the structure of a head unit, a camera unit, and an optical unit. It is a block diagram which shows the control system of the surface mounter which concerns on 2nd Embodiment. It is side surface schematic drawing of the optical unit etc. which show the modification of the surface mounting machine which concerns on 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 6 Head unit 16 Mounting head 16a Adsorption nozzle 18 Camera 20 Camera unit 21 Illumination device 21a LED
22 1st camera 23 2nd camera 32 Mirror

Claims (4)

It has a movable head unit that is mounted in a state where a plurality of mounting heads are arranged. The mounting head of this head unit picks up the component from the component supply unit and transports it onto the substrate at the mounting work position. In the surface mounter that mounts after picking up the picked-up component by the imaging means and recognizing the picked-up state of the component prior to this mounting,
As the imaging means comprises a line sensor image sensor are arranged in the direction orthogonal to the arrangement direction of the mounting head, and a first imaging means that is movably supported with respect to the head unit support member for supporting the head unit And a second image pickup means that is supported so as to be movable integrally with the first image pickup means with respect to the head unit support member, the image sensor being arranged in a direction parallel to the arrangement direction of the mounting heads. And,
The mounting head has a reflecting surface that is inclined in a direction perpendicular to the mounting head arrangement direction, and the mounting head passes between the component supply unit and the mounting work position as the head unit moves. An optical member that is disposed in the region and reflects the suction component image sucked by each mounting head of the head unit;
Wherein after adsorbing the component by the mounting head at the component supply section, together with the head unit to control the drive in order to convey the suction unit products from the component sucking position to the mounting work position, in the middle the part conveying the first, component recognition for imaging an adsorption part of the mounting head by the second imaging means and the said the head unit is moved relative to the mounting head first imaging unit and the second imaging means the first to execute the operation, at least on the other hand and control means for driving and controlling the side of the second imaging means and said head unit,
The first and second imaging means are provided so as to be able to capture component images reflected by the optical member,
The control means moves the first and second imaging means and the head unit relative to each other in the mounting head arrangement direction, and causes the first imaging means to pick up the suction component of each mounting head. A first component recognition operation; and a second imaging unit configured to image the suction component of the mounting head by the second imaging unit by moving the head unit in a direction perpendicular to the arrangement direction of the mounting head with respect to the optical member. The head unit and the first and second imaging means are driven and controlled to selectively execute a component recognition operation, and prior to these component recognition operations, the head unit is imaged in the vicinity of the component suction operation completion position. while moving to the starting position, the first at a position corresponding to the imaging start position, the first to together by moving the second imaging means, the movement of the second imaging means, Surface mounting machine serial head unit is characterized in that to complete simultaneously or earlier timing than the reaching to the imaging start position. In the surface mounting machine according to claim 1,
Before Symbol light Faculty material is provided movably in the region of the mounting head along with the movement of the head unit passes,
The control means, the Rukoto was further wherein as said imaging adsorption component by the first imaging means to drive control the optical member becomes possible optical member and the first, interlocking the second imaging means A featured surface mounter. In the surface mounting machine according to claim 2,
A holding member that movably holds the optical member is provided, and an illuminating device that provides illumination for imaging by the first and second imaging means is at least one of the holding member and the first and second imaging means. surface mounter which is characterized that you have provided integrally on the side. In the surface mounting machine according to claim 1 ,
The first imaging means includes the line in a first posture in which the imaging elements are arranged in a direction orthogonal to the arrangement direction of the mounting heads and a second posture in which the imaging elements are arranged in a direction parallel to the arrangement direction of the mounting heads. The sensor posture is configured to be switchable, and in the second posture, the image sensor of the line sensor and the image sensor of the line sensor of the second imaging means are arranged in a line in the arrangement direction of the mounting heads. Arranged in parallel with the second imaging means;
The control means switches the line sensor to the first posture during the first component recognition operation, and switches the line sensor to the second posture during the second component recognition operation. of the line sensor and attitude control, further surface mounter, wherein Rukoto to image the adsorbed component when the second component recognition operation in both the first image pickup means and the second imaging means.

Images