JP4167147B2 - Laminating apparatus and laminating method for laminated board - Google Patents

Description

  The present invention relates to a laminating apparatus for laminating plates, in which an intermediate laminated product pressed by a film body in a vacuum space in a vacuum laminating apparatus is pressed by a flattening press apparatus disposed in a subsequent process to form a laminated board, and The present invention relates to a laminating method, and more particularly, to a laminating apparatus and a laminating method for a laminated board having a flattening press apparatus for the purpose of uniformizing the thickness of the laminated board.

  As a laminating apparatus for forming a laminated plate by pressurizing an intermediate laminated product pressed by a film body in a vacuum laminating apparatus with a flattening press apparatus, the one described in Patent Document 1 is known. However, what is described in Patent Document 1 is to pressurize the central portion of the product 4 ′ with the piston rod 23 of the hydraulic cylinder 22 fixed to the center of the lower surface of the flattening hot plate 2 B of the flattening press 2. As a result, there is a problem that the applied pressure between the central portion and the peripheral portion of the product 4 ′ becomes non-uniform and the parallelism between the flattening hot plates 2A and 2B is difficult to be maintained. Therefore, there is a problem that the thickness of the product 4 ′ pressed by the flattening press 2 is not completely uniform.

Similarly, a device described in Patent Document 2 is known as a device in which a flattening press device is provided in a subsequent process of the vacuum laminator. In Patent Document 2, a plurality of cylinders 11 are provided in a flat press device 9, and the cylinders 11 and the lower press block 8 are connected by a support point joint 10 that can swing, and the plurality of cylinders are connected. 11 is used to pressurize the laminated body 5. However, since the lower press block 8 is attached to the cylinder 11 so as to be able to swing and the laminated body 5 is processed by the lower press block 8 in the one described in Patent Document 2, the upper press block 7 and the lower press block 8 cannot be maintained in parallel, and there is a problem that the thickness of the laminated body 5 to be laminated is not completely uniform. Moreover, since the thing of patent document 2 controls all the cylinders collectively, it was difficult to adjust a delicate pressurizing force.
JP 2002-120100 A (0024, FIG. 1) JP 2002-36272 A (0010 to 0039, FIG. 1)

  Accordingly, the present invention provides a flattening press in a laminating apparatus for laminating plates in which an intermediate laminated product pressed by a film body in a vacuum space in a vacuum laminating apparatus is pressed by a flattening press apparatus disposed in a subsequent process. Provided a laminating apparatus and a laminating method for a laminated board that solve the problem that the parallelism between the hot plates in the apparatus and the pressure applied to the intermediate laminated product are not uniform, and the thickness of the laminated laminate is not uniform The purpose is to do.

According to a first aspect of the present invention, there is provided a laminating apparatus for a laminated board, comprising: a vacuum laminating apparatus that pressurizes a laminated material and a laminated material with a film body in a reduced pressure space to form an intermediate laminated product; In a laminating apparatus for laminating plates comprising a flattening press device for pressurizing an intermediate laminated product, the flattening press device includes a fixed platen provided with a hot plate, and a fixed plate provided with a hot plate. And a booster cylinder mechanism in which a main ram that moves the movable plate forward and backward is inserted into the main cylinder chamber of the main cylinder, and a booster cylinder is arranged in the main ram, near the intersection of diagonal lines on the movable plate Arranged between the first pressurizing mechanism and the intersection of the diagonal of the movable plate and the corner of the movable plate at a position overlapping the intermediate laminate product to be pressurized in plan view. A second pressurizing mechanism that is Moving the movable platen by a first pressing mechanism in the apparatus,
After the intermediate laminated product is sandwiched between the hot plates, the intermediate laminated product is pressurized by the first pressure mechanism and the second pressure mechanism .

According to a second aspect of the present invention, there is provided a method for laminating a laminated board using a laminated apparatus for a laminated board comprising a vacuum laminating apparatus and a flattening press apparatus that is disposed in a subsequent process and pressurizes an intermediate laminated product . In the laminating method , the flattening press device includes a fixed plate provided with a hot plate, a movable plate provided with a hot plate and opposed to the fixed plate, and a movable plate moved forward and backward in the main cylinder chamber of the main cylinder. A booster cylinder mechanism having a main ram inserted and a booster cylinder disposed in the main ram is provided, and a first pressurizing mechanism disposed near the intersection of diagonal lines on the movable platen, and a point near the intersection of diagonal lines of the movable platen And a second pressurizing mechanism disposed at a position overlapping the pressurized intermediate laminated product with respect to the intermediate laminated product to be pressed in a plan projection view. The movable platen is moved by the pressurization mechanism of the intermediate laminated product After held between the hot plate, characterized in that pressurizing the intermediate laminate by a first pressing mechanism and a second pressure mechanism.

The present invention includes a booster cylinder mechanism in which a main ram for moving a movable plate is inserted into a main cylinder chamber of a main cylinder and a booster cylinder is disposed in the main ram in a flattening press apparatus in a laminating apparatus for laminating plates. A first pressurizing mechanism disposed near the intersection of diagonal lines on the movable platen, and an intermediate laminated product to be pressurized between the vicinity of the diagonal line of the movable platen and the corner of the movable platen Is provided with a second pressurizing mechanism disposed at a position overlapping the plane projection view, so that the parallelism between the hot plates that pressurize the intermediate laminated product can be increased. Thus, the thickness of the molded laminate can be made closer to a more uniform state. Further, fine adjustment of the applied pressure can be more easily performed according to the intermediate laminated product to be pressurized.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic view showing a laminating apparatus for laminated sheets according to the present invention. FIG. 2 is a plan view showing the arrangement of the movable platen, the hot plate, the intermediate laminated product, and each cylinder in the flattening press apparatus of the present invention. FIG. 3 is a diagram showing a hydraulic circuit in the flattening press apparatus of the present invention. FIG. 4 shows test results using the flattening press apparatus of the present invention. FIG. 5 shows test results using a conventional flattening press apparatus.

  As shown in FIG. 1, a vacuum laminating apparatus 1 is disposed in a laminating apparatus for laminating plates, and a flattening press apparatus 2 is disposed on the subsequent process side. A film supply mechanism 3 is disposed on the pre-process side of the vacuum laminating apparatus 1. Then, the plate-like body in which the laminated material A1 and the material to be laminated A2 are stacked is placed on the carrier film 4 supplied from the film supply mechanism 3 and conveyed to the vacuum laminating apparatus 1. Yes. The vacuum laminating apparatus 1 is a known laminator, and a decompression space that is isolated from the outside and decompressed by decompression means (not shown) can be formed between the opposing upper board 5 and lower board 6. ing. The upper board 5 and the lower board 6 are provided with heaters (not shown) as heating means. Further, at least one of the upper board 5 and the lower board 6 is provided with a film body 7 made of silicon rubber or the like and bulged by an air supply means (not shown). Then, due to the bulging of the film body 7, the plate-like body on which the laminated material A1 and the laminated material A2 carried into the reduced pressure space are pressed is pressurized and can be formed into the intermediate laminated product A3.

  The intermediate laminated product A3 formed by the vacuum laminating apparatus 1 is disposed in the subsequent process of the vacuum laminating apparatus 1 together with the carrier film 4 by the carrier film 4 being pulled by the film holding and conveying mechanism 8 and the film collecting mechanism 9. It is conveyed to the flattening press apparatus 2 made. In the flattening press apparatus 2, the intermediate laminated product A3 is pressurized and laminated and formed into a laminated plate A4 having a substantially uniform thickness. In the flattening press apparatus 2, four tie bars 12 are erected between a substantially rectangular base board 10 and a substantially rectangular fixed board 11 which is an upper board, and the tie bar 12 has a substantially rectangular shape which is a lower board. The movable platen 13 is slidably disposed. The movable platen 13 is disposed opposite to the fixed platen 11 and can be moved close to and away from the fixed platen 11 by a pressurizing mechanism described later.

  On the surfaces of the fixed platen 11 and the movable platen 13 facing each other, substantially rectangular hot plates 14 and 15 are disposed, respectively. Although not shown in detail for details, the heat plates 14 and 15 are composed of a heat insulating plate, a heat plate portion in which a cartridge heater is embedded, a cushion plate, and a mirror plate made of a stainless steel plate in this order from the side fixed to the board. . The parallelism between the mirror plates of the hot plates 14 and 15 facing each other is extremely high. Further, the flattening press apparatus 2 is provided with a limit switch 35 for detecting that the intermediate laminated product A3 is sandwiched between the hot plates 14 and 15 when the movable platen 13 is raised.

  Next, the pressurizing mechanism of the flattening press apparatus 2 will be described. The flattening press apparatus 2 is provided with a plurality of pressurizing mechanisms capable of pressurizing the intermediate laminated product A3 substantially uniformly between the hot plates 14 and 15. A main cylinder 17 of a booster cylinder mechanism 16 that is a first pressurizing mechanism is fixed to the approximate center of the base board 10. The booster cylinder mechanism 16 itself is known, and a piston 18 is slidably disposed inside the main cylinder 17, and a main cylinder chamber 19 is formed on the cylinder side (downward) of the piston 18. Yes. A sub-cylinder chamber 20 is formed on the non-cylinder side (above) of the piston 18, and a main ram 21 that can be moved up and down and moves the movable plate 13 forward and backward is fixed to the center of the piston 18 on the non-cylinder side. Yes. The main ram 21 is slidably inserted into the main cylinder chamber 19, and the end 21 a on the non-cylinder side of the main ram 21 is fixed near the intersection P of the diagonal D on the back surface of the movable platen 13. It is arranged. A booster cylinder 22, which is a pressurizing mechanism different from the main cylinder chamber 19, is bored in the shaft core portion inside the main ram 21. Further, a booster cylinder inner cylinder portion 23 is fixed to a lower axial core portion of the main cylinder chamber 19 of the main cylinder 17, and the booster cylinder inner cylinder portion 23 is slidably inserted into the booster cylinder 22. ing. Therefore, the booster cylinder 22 and the main cylinder chamber 19 are partitioned by the booster cylinder inner cylinder portion 23. In the present embodiment, due to the above configuration, the cylinder inner diameter (pressure area) of the booster cylinder 22 is about 1/9 of the piston area (pressure area) of the main cylinder 17.

  As shown in FIGS. 1 and 2, four sub-cylinders 24 as second pressurizing mechanisms are arranged around the booster cylinder mechanism 16 in the base panel 10. In the sub-cylinder 24, the cylinder portion 25 is fixed to the base plate 10, and the rod portion 26 is near the intersection P of the diagonal D of the movable platen 13 and the corner C of the movable platen 13 (including the case where it is chamfered). Are arranged so as to be fixed to the respective parts. The position where the rod portion 26 of the sub cylinder 24 is fixed is a position where the peripheral portion 15a of the hot plate 15 disposed on the movable platen 13 and the intermediate laminate A3 to be pressurized overlap with the planar projection view. is there. Therefore, the sub-cylinder 24 is provided so that the pressurizing force is directly applied to the intermediate laminated product A3 that is in contact with the hot plate 15 from the vertical direction. In this embodiment, the total piston area of the four sub cylinders 24 is about ½ of the piston area of the main cylinder 17. Thus, the booster cylinder 22, the main cylinder 17, and the sub-cylinder 24, which are pressurization mechanisms, are arranged concentrically in a plan view around the intersection P of the diagonal D of the movable platen 13. .

Next, the hydraulic circuit of the first pressure mechanism and the second pressure mechanism in the flattening press apparatus 2 of the present invention will be described with reference to FIG. In the flattening press apparatus 2, a plurality of pressurizing mechanisms cylinders 17, 22, and 24 are divided into two or more control systems, and a control mechanism 27 is provided to control each control system separately. The pipes from the variable pump 28 are branched into three systems: pipes 29 and 30 for operating the main cylinder 17 and the booster cylinder 22 of the booster cylinder mechanism 16 and a pipe 31 for operating the sub cylinder 24, respectively. In a line 29 to the main cylinder 17 of the booster cylinder mechanism 16, an electromagnetic proportional reducing valve 29 a for controlling the operation of the main cylinder 17 and a three-position four-port partially closed center type are sequentially provided from the variable pump 28 side. An electromagnetic switching valve 29b is provided. The B port of the electromagnetic switching valve 29b is connected to the main cylinder chamber 19 of the main cylinder 17, and a pressure sensor 29c for detecting the hydraulic pressure of the main cylinder chamber 19 is provided. The A port is connected to the sub cylinder chamber 20 of the main cylinder 17. Further, the P port is connected to the variable pump 28 via the conduit 29, and the T port is connected to the tank 32. When the solenoids 29b1 and 29b2 of the electromagnetic switching valve 29b are in a non-excited state and are in the center position, the A, B and T ports are connected to each other, and the P port is set to the closed position.

  The booster cylinder mechanism 16 has a conduit 30 to the booster cylinder 22 in order from the variable pump 28 side, an electromagnetic proportional reducing valve 30a for controlling the operation of the booster cylinder 22, and a two-position four-port partially closed type. An electromagnetic switching valve 30b is provided. The A port of the electromagnetic switching valve 30 b is connected to the booster cylinder 22, a pressure sensor 30 c for detecting the hydraulic pressure of the booster cylinder 22 is provided, and the T port is connected to the tank 32. When the solenoid 30b1 of the electromagnetic switching valve 30b is in a non-excited state, the A port and the T port are connected and the P port is in the closed position.

  Also for the pipe line 31 to the sub-cylinder 24, an electromagnetic proportional reducing valve 31a for controlling the operation of the sub-cylinder 24 and a two-position four-port partially-closed electromagnetic switching valve 31b are sequentially provided from the variable pump 28 side. It is arranged. The B port of the electromagnetic switching valve 31b is connected to the cylinder side chamber 33 of the sub cylinder 24, and a pressure sensor 31c for detecting the hydraulic pressure of the sub cylinder 24 is provided. The A port of the electromagnetic switching valve 31 b is connected to the rod side chamber 34. The P port is connected to the variable pump 28 via the pipe line 31, and the T port is connected to the tank 32. When the solenoid 31b1 of the electromagnetic switching valve 31b is in a non-excited state, the A, B, and T ports are connected to each other, and the P port is in the closed position. In the present embodiment, the four sub cylinders 24 are configured such that the pipeline 31 from the A port of the electromagnetic switching valve 31b branches in the middle and hydraulic oil is supplied to each sub cylinder 24. The four sub cylinders 24 are controlled by the control system. And the input of the various setting values of the vacuum laminating apparatus 1 and the flattening press apparatus 2 in the laminating apparatus is performed by inputting from a touch panel (not shown).

  In addition, about the planarization press apparatus 2 of this invention, it is not limited above, The following may be sufficient. Regarding the configuration and heating means of the hot plates 14 and 15 of the flattening press apparatus 2, the fixed platen 11 and the movable platen 13 may constitute the hot plates 14 and 15. Further, regarding the arrangement of the fixed platen 11 and the movable platen 13 of the flattening press apparatus 2, the movable platen may be arranged above and the fixed platen may be arranged below, and the movable platen is moved in the horizontal direction. It may be a thing. The pressurizing mechanism is not limited to a hydraulic mechanism, and may be a pneumatic mechanism, an electric mechanism including a combination of a servo motor and a ball screw, or a combination thereof. Also, when using a hydraulic mechanism, it is not limited to one using an electromagnetic proportional reducing valve. All the pressurizing mechanisms may be controlled separately by the control mechanism. In that case, the thickness of each part of the laminated plate A4 pressed in the flattening press apparatus 2 may be measured, and the hydraulic pressure of each sub cylinder 24 may be finely adjusted manually. Servo valves are provided in the four sub-cylinders 24 respectively, and the positions of the four corners of the movable platen 13 and / or the pressures of the four sub-cylinders 24 are detected according to each molding of the intermediate laminated product A3. These servo valves may be separately controlled by a closed loop to perform parallel control of the movable platen 13.

  Next, referring to FIGS. 1 to 3, a method for laminating a laminated product using a laminating apparatus will be described. As the laminate A1 used in the present invention, an epoxy resin film is often used in the case of laminate molding of a printed wiring board, but a photoresist film or other resin film may be used. In the case of laminated molding of IC cards or the like, polyethylene terephthalate or vinyl chloride resin is used as the laminated material. In the case of laminate molding of a printed wiring board, a substrate having irregularities in which a pattern such as a copper foil is formed on the surface of a glass epoxy core substrate is often used as the laminate A2 on which the laminate A1 is stacked. However, the substrate may be made of other materials. And the number of laminated material A1 and laminated material A2 to be stacked is not limited to one each. In the present embodiment, the thickness of the plate-like body on which the laminated film and the substrate having unevenness are stacked is 3 mm, and the allowable parallelism error in the laminated board A4 is 0.030 mm. However, in the laminating apparatus for laminating plates, it is possible to laminate and form a plate-like body having a thickness of about 0.3 mm to 9 mm. Further, the plate-like body in which the laminated material A1 and the laminated material A2 are stacked may be a plate-like body that is continuous in a strip shape instead of a single plate-like body having a predetermined length. The plate-like body in which the laminate material A1 and the material to be laminated A2 as described above are stacked is placed on the carrier film 4 at the carry-in position, and is conveyed to the vacuum lamination apparatus 1 as the carrier film 4 moves. . In addition, about the carrier film 4, it consists of resin films, such as a polyethylene terephthalate, polyethylene, a polyimide, and the width | variety of the carrier film 4 is wider than the width | variety of laminated material A1 and to-be-laminated material A2.

  In the vacuum laminating apparatus 1, when a plate-like body in which the laminated material A1 and the material to be laminated A2 are stacked is carried in, the lower plate 6 facing the upper plate 5 is raised, and molding between the two is performed. The space is closed from the outside, and decompression is started by decompression means (not shown). At the same time, the plate-like body on which the laminated material A1 and the laminated material A2 are stacked is heated by a heater (not shown). When the depressurized space reaches a predetermined degree of vacuum, air is sent between the film body 7 such as silicon rubber and the board on which the film body 7 is disposed by the air supply means. The plate-like body on which the laminated material A2 is stacked is pressed for a predetermined time, and an intermediate laminated product A3 in which the laminated material A1 is attached to the laminated material A2 is formed. In the vacuum laminating apparatus 1, pressure is applied to the plate-like body in which the laminated material A1 and the laminated material A2 are overlapped by the film body 7 under reduced pressure, so that the laminated material A2 is a substrate having irregularities. However, the film-like laminate A1 can be pasted without generating voids or wrinkles. The pressure applied by the film body 7 of the vacuum laminating apparatus 1 is about 0.3 MPa to 1 MPa, and the intermediate laminated product A3 cannot be completely flat within a predetermined time, and the unevenness of the substrate before molding is The intermediate laminated product A3 remaining on the surface is laminated and formed. Although the molding time by the vacuum laminating apparatus 1 in this embodiment is 60 seconds, a molding time of about 40 seconds to 90 seconds is set according to the laminated material A1 or the laminated material A2 to be laminated.

  When the lamination molding by the vacuum laminating apparatus 1 is completed, the decompression space of the vacuum laminating apparatus 1 is opened, and the intermediate laminated product A3 is moved from the pressure position in the vacuum laminating apparatus 1 by the carrier film 4 to the hot plate in the flattening press apparatus 2. 14 and 15 is sent to a pressurizing position in a substantially central part. In this embodiment, the hot plates 14 and 15 of the flattening press apparatus 2 are each heated to 100 ° C. by a cartridge heater. The temperature of the hot plates 14 and 15 varies depending on the material of the intermediate laminate A3 to be pressed, but is heated to about 75 ° C. or 120 ° C. during molding. Further, for example, in the case of performing lamination molding of IC cards using vinyl chloride resin, the hot plates 14 and 15 are heated to about 75 ° C. to 85 ° C., and the pressed IC card is lowered to the glass transition temperature or lower. The

  When the intermediate laminated product A3 is carried into the pressing position of the flattening press apparatus 2 and stopped, the flattening press apparatus 2 starts a movable plate raising process (mold closing process). In the movable plate raising process, a signal is sent from the control mechanism 27 to the solenoid 29b1 of the electromagnetic switching valve 29b of the main cylinder 17, which is the first pressurizing mechanism, and the solenoid 29b1 is excited to connect the P port and the B port. The hydraulic oil is supplied to the main cylinder 17. At the same time, the solenoid switching valve 30b of the booster cylinder 22 is also excited by a signal from the control mechanism 27, the P port and the A port are connected, and hydraulic oil is supplied to the booster cylinder 22. Therefore, the movable platen 13 is raised by operating the main cylinder 17 and the booster cylinder 22 at the same time, and the intermediate laminated product A3 is sandwiched between the two heat plates 14 and 15 before long. At this time, the cylinder side chamber 33 of the sub-cylinder 24 has a negative pressure, but hydraulic oil is supplied from the rod side chamber 34 by the differential circuit, and hydraulic oil is also supplied from the tank 32. The reason why only the booster cylinder mechanism 16 disposed substantially at the center of the movable platen 13 is operated to raise the movable platen 13 is to raise the movable platen 13 at a high speed. Further, the sub-cylinder 24 is a differential circuit, so that the moving speed of the movable platen 13 is secured. The movable platen 13 may be raised by operating only the booster cylinder 22.

  When the movable platen 13 is raised and the intermediate laminated product A3 is sandwiched between the heat plates 14 and 15, the limit switch 35 is activated almost simultaneously with the transmission of the signal to the control mechanism 27, then the intermediate laminated product. The pressurizing process is started. In the intermediate laminated product pressurizing step, a signal is transmitted from the control mechanism 27 to the solenoid 31b1 of the electromagnetic switching valve 31b, the P port and B port of the electromagnetic switching valve 31b are connected, and the variable side pump 33 is also connected to the cylinder side chamber 33 of the sub cylinder 24. The hydraulic oil is supplied from 28, and pressurization of the intermediate laminated product A3 by the sub cylinder 24 is started. At this time, the main cylinder 17 and the booster cylinder 22 are also continuously supplied with hydraulic oil and pressurized by the main cylinder 17 and the booster cylinder 22. In this intermediate laminated product pressurizing step, the cylinders 17, 22, and 24 are controlled by detecting the hydraulic oil pressure by the pressure sensors 29c, 30c, and 31c and via the control mechanism 27, the electromagnetic proportional reducing valve 29a, This is done by controlling 30a and 31a. Then, the hydraulic oil in each cylinder is controlled to a predetermined pressure by the electromagnetic proportional reducing valves 29a, 30a, 31a. The positions of the main ram 21 of the booster cylinder mechanism 16 and the rod portion 26 of the sub-cylinder 24 overlap with the hot plate 15 and the intermediate laminate A3 in contact with the hot plate 15 in a plan projection view. Since it is disposed at the position, in the intermediate laminate product pressurizing step, it is possible to apply pressure directly and substantially uniformly to the intermediate laminate product A3 from the vertical direction. Further, in the present invention, the hot plate 15 disposed on the movable platen 13 does not change the angle in accordance with the intermediate laminated product A3 as in Patent Document 2, so that the hot plate 15 is always disposed on the fixed platen 11. The parallelism of the hot plate 15 is maintained. In the present embodiment, the intermediate laminated product A3 is pressurized with a pressure of 1.0 MPa. In addition, as for the applied pressure with respect to the intermediate | middle laminated product A3 in the planarization press apparatus 2, about 0.5 Mpa thru | or 3 Mpa is desirable. Then, by pressing the intermediate laminated product A3 in the flattening press apparatus 2, a flat laminated plate A4 in which the unevenness of the laminated material is completely embedded with the laminated material is obtained.

  Then, in the flattening press apparatus 2, when the same time as the molding time of the vacuum laminating apparatus 1 (60 seconds in the present embodiment) elapses, the intermediate laminated product pressurizing step is finished, and the movable plate lowering step (die opening step) is performed. Be started. Regarding the control of each cylinder in the movable plate lowering process, the solenoid 29b2 of the electromagnetic switching valve 29b is excited by a signal, the P port and the A port of the electromagnetic switching valve 29b are connected, and the variable pump 28 to the sub cylinder of the main cylinder 17 are connected. Hydraulic fluid is supplied to the chamber 20. The B port and T port of the electromagnetic switching valve 29 b are connected, and the hydraulic oil in the main cylinder chamber 19 is drained to the tank 32. At the same time, the solenoid 30b1 of the electromagnetic switching valve 30b is demagnetized, the A port and T port of the electromagnetic switching valve 30b are connected, and the hydraulic oil of the booster cylinder 22 is drained to the tank 32. At the same time, the solenoid 31b1 of the electromagnetic switching valve 31b is demagnetized, the A port, B port, and T port of the electromagnetic switching valve 31b are connected, and the hydraulic oil in the cylinder side chamber 33 is returned to the rod side chamber 34 and drained to the tank 32. The By controlling each cylinder as described above, the rod portion 26 of the main ram 21 and the sub cylinder 24 is lowered, and the movable platen 13 is also lowered. Then, the laminate A4 that has been pressed by the flattening press apparatus 2 is sent to the unloading position together with the carrier film 4 by driving the film recovery mechanism 9. When the laminate A4 is laminated by the build-up method, the laminate A4 further processed with a predetermined pattern becomes the laminate A2, and the laminate with the laminate A1 on the surface is again used in the laminate apparatus. It is carried in and lamination molding is repeated.

  In addition, about the control method of the pressurization mechanism of the flattening press apparatus 2, it can change according to the material, area, thickness, etc. of the intermediate | middle laminated product A3 pressurized. For example, when it is desired to reduce the pressure applied to the intermediate laminated product A3 to a certain level or less, the cylinder is selectively operated, for example, pressure is not applied by the main cylinder 17, but is applied by the booster cylinder 22 and the sub cylinder 24. Also good. In the flattening press apparatus 2 of the present invention, the booster cylinder 22 and the main cylinder 17 of the booster cylinder mechanism 16 are arranged concentrically, so that the movable plate 13 tilts even if any cylinder is selectively used. Thus, the pressurizing force on the intermediate laminated product A3 does not become a partial pressure state. Further, when the area of the intermediate laminated product A3 is small, the pressurization by the sub cylinder 24 may not be performed. Furthermore, the control of the pressurizing mechanism can change the operating pressure of each cylinder during one cycle, or start or stop the operation of the cylinder to change the applied pressure in the middle.

  4 and 5 show a fuse test in which solder is placed on a hot plate using the flattening press apparatus 2, and the thickness is measured after pressing the solder between the hot plates. It is a test result when performing. The test results in FIG. 4 are test data of the flattening press apparatus 2 of the present invention. In the fuse test of the flattening press apparatus 2, the hydraulic pressure of the booster cylinder mechanism 16 is set to 2.6 MPa, the hydraulic pressure of the sub cylinder 24 is set to 13 MPa, and the total of the four sub cylinders 24 is added to the applied pressure of the booster cylinder mechanism 16. The pressure was increased and pressure was applied to the solder disposed at various places on the hot platen 15. As a result, the range of the maximum thickness and the minimum thickness of the solder was within 0.020 mm. On the other hand, the test results of FIG. 5 are test data of a conventional flattening press apparatus having a pressure cylinder only at the center. In a fuse test using a conventional flattening press apparatus, only the central portion of the movable platen is pressurized by the cylinder, and the substantially central portion of the movable plate and the hot plate disposed on the movable plate bulges out in a convex shape when pressurized. Therefore, the range between the minimum thickness at the center of the solder and the maximum thickness near the end was 0.066 mm.

  Further, the present invention is not enumerated one by one, but is not limited to the above-described embodiment, and it goes without saying that the present invention is applied to those modified by a person skilled in the art based on the gist of the present invention. is there.

It is the schematic which shows the lamination apparatus of the laminated board of this invention. It is a top view which shows arrangement | positioning of the movable board in a planarization press apparatus of this invention, a hot plate, an intermediate | middle laminated product, and each cylinder. It is a figure which shows the hydraulic circuit in the planarization press apparatus of this invention. It is a test result using the flattening press apparatus of this invention. It is a test result using the conventional flattening press apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vacuum laminating apparatus 2 Flattening press apparatus 3 Film supply mechanism 4 Carrier film 5 Upper board 6 Lower board 7 Film body 8 Film holding | maintenance mechanism 9 Film collection mechanism 10 Base board 11 Fixed board 12 Tie bar 13 Movable board 14,15 Hot plate 15a Peripheral portion 16 Booster cylinder mechanism 17 Main cylinder 18 Piston 19 Main cylinder chamber 20 Sub cylinder chamber 21 Main ram 21a End portion 22 Booster cylinder 23 Booster cylinder inner cylinder portion 24 Sub cylinder 25 Cylinder portion 26 Rod portion 27 Control mechanism 28 Variable pump 29, 30, 31 Pipes 29a, 30a, 31a Electromagnetic proportional reducing valves 29b, 30b, 31b Electromagnetic switching valves 29c, 30c, 31c Pressure sensors 29b1, 29b2, 30b1, 31b1 Solenoid 32 Tank 33 Cylinder Side chamber 34 the rod side chamber 35 limit switch A1 laminate A2 the laminate A3 intermediate laminate A4 laminate C corner D diagonal P intersection

Claims (2)

A vacuum laminating apparatus that pressurizes the laminated material and the laminated material with a film body in a reduced pressure space to form an intermediate laminated product;
It is arranged in a subsequent process of the vacuum laminating apparatus,
In a laminating apparatus for laminating plates comprising a flattening press apparatus for pressurizing the intermediate laminated product,
In the flattening press apparatus,
A stationary platen provided with a hot plate;
A movable plate that is provided with a hot plate and faces the fixed plate;
Insert the main ram to move the movable plate back and forth in the main cylinder chamber of the main cylinder,
A first pressurizing mechanism provided with a booster cylinder mechanism in which a booster cylinder is disposed in the main ram, and disposed near an intersection of diagonal lines in the movable platen;
A second pressurizing mechanism disposed between the vicinity of the intersection of the diagonal of the movable platen and the corner of the movable platen at a position overlapping the pressurized intermediate laminated product in plan projection view; Is provided,
The movable platen is moved by the first pressure mechanism in the flattening press apparatus,
After sandwiching the intermediate laminate by a hot plate,
A laminate apparatus for laminating a laminate, wherein the intermediate laminate product is pressurized by a first pressurizing mechanism and a second pressurizing mechanism . A vacuum laminating apparatus that pressurizes the laminated material and the laminated material with a film body in a reduced pressure space to form an intermediate laminated product;
It is arranged in a subsequent process of the vacuum laminating apparatus,
In a method for laminating a laminated board using a laminating apparatus for a laminated board comprising a flattening press apparatus for pressurizing the intermediate laminated product ,
In the flattening press apparatus,
A stationary platen provided with a hot plate;
A movable plate that is provided with a hot plate and faces the fixed plate;
Insert the main ram to move the movable plate back and forth in the main cylinder chamber of the main cylinder,
A first pressurizing mechanism provided with a booster cylinder mechanism in which a booster cylinder is disposed in the main ram, and disposed near an intersection of diagonal lines in the movable platen;
A second pressurizing mechanism disposed between the vicinity of the intersection of the diagonal of the movable platen and the corner of the movable platen at a position overlapping the pressurized intermediate laminated product in plan projection view; Is provided,
The movable platen is moved by the first pressure mechanism in the flattening press apparatus,
After sandwiching the intermediate laminate by a hot plate,
A method for laminating laminates, wherein the intermediate laminate product is pressurized by a first pressurizing mechanism and a second pressurizing mechanism.