JP3837212B2 - Inspection head for flat object - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inspection head used for an energization test of a flat object to be inspected having a plurality of electrodes on one surface like an integrated circuit.
[0002]
[Prior art]
As one of inspection heads used for energization tests of a plurality of integrated circuits formed on a semiconductor wafer, there is a probe card described in Japanese Patent Laid-Open No. 7-201935. This probe card (inspection head) has a plate-like base (substrate) having an opening in the center and a plurality of connector portions around the opening, and a plurality of probes attached to a long and narrow support plate. It includes a probe unit and a wiring board provided for each probe unit.
[0003]
In the inspection head, the substrate further includes a plurality of first wiring portions connected to the connector portion, and a plurality of tester lands connected to the first wiring portion, and each wiring board includes: A plurality of second wiring portions connected to the probe of the corresponding probe unit are included. The probe unit is attached to the substrate in parallel with the probe protruding from the opening.
[0004]
The second wiring portion of each wiring board is connected to the connector portion of the substrate by a flat cable. The connector part of the board is connected to a tester having an energization circuit for the probe by a pogo pin connected to the tester land of the board. Energization from the tester to the probe is performed via the pogo pin, the first wiring part of the substrate, the flat cable, and the second wiring part of the wiring board.
[0005]
However, in the above-described inspection head, the wiring board is not only near the probe unit but also a number of flat cables are near the probe unit, so that the handling of the head is troublesome. Further, since the length of the wiring is increased by the length of the flat cable, the response speed is slow, and it is difficult to achieve impedance matching at the connection portion between the flat cable and the connector portion of the board.
[0006]
[Problems to be solved]
Therefore, it is desirable to eliminate the flat cable exposed in the vicinity of the probe unit and facilitate the handling of the head.
[0007]
[Solution, action and effect]
The inspection head of the present invention includes a substrate having a plurality of first wiring portions on one surface and one or more probe units arranged on the substrate. The probe unit is a long support disposed on the substrate, the first surface on the side of the substrate, following the first surface, a second surface having an angle with respect to the first surface and the substrate, and A support having a third surface opposite to the first surface and a support extending in a state extending from the first surface to the second surface and arranged in parallel in the longitudinal direction of the support A plurality of second wiring portions extending in a longitudinal direction, a plurality of probes arranged on the third surface at intervals in the longitudinal direction of the support and electrically connected to the second wiring portions, A spacer having conductivity and elasticity disposed between the substrate and the first surface to electrically connect the second wiring portion;
[0008]
The probe and the first wiring part are electrically connected via the wiring part and the spacer. For this reason, it is not necessary to use a flat cable exposed in the vicinity of the probe unit. As a result, handling of the head is facilitated, wiring is shortened, and response speed is increased.
[0009]
In addition, since the support has a recess having the first surface as the bottom surface and a part of the wiring film is received, the positioning of the wiring film with respect to the support is facilitated, and the probe unit is assembled. Becomes easier.
[0010]
Furthermore, since the support has a slot that opens in a recess for receiving a part of the wiring film and extends in the longitudinal direction of the support, the positioning of the wiring film with respect to the support becomes easier, and the assembly of the probe unit is facilitated. It becomes easier.
[0011]
The spacer is a plate-like base material having electrical insulation and elasticity, and a plurality of conductive thin wires arranged on the base material, and the spacer is used to electrically connect the terminal part and the wiring part. A plurality of fine wires penetrating the base material obliquely in the thickness direction can be provided.
[0012]
Furthermore, a cover can be included that is assembled to the support so that the wiring film extends from the first surface along the second surface. Thereby, while maintaining a wiring film in the correct attitude | position to a support body, damage to a wiring film is prevented.
[0013]
A plurality of probe units can be arranged in parallel at intervals on the substrate. As a result, the number of probes that can come into contact with a large number of electrodes of the object to be inspected increases, so that a plurality of inspected locations can be tested simultaneously.
[0014]
The substrate can have one or more through-holes that allow the tip of at least some of the probes to be viewed. Thereby, coupled with the fact that the flat cable does not exist in the vicinity of the probe unit, the positional relationship between the tip (needle tip) of the probe and the electrode of the object to be inspected can be visually observed.
[0015]
Each probe can be formed from a thin wire having conductivity such as a thin metal wire. In this case, each probe can be bent in a crank shape so that the front end portion and the rear end portion thereof extend in opposite directions, and can be connected to the second wiring portion at the rear end portion.
[0016]
However, the probe may be formed by a tip region including one end of the wiring portion and a tip region integrated with the wiring film. If it does in this way, a wiring film and a probe can be manufactured simultaneously.
[0017]
The wiring film can have a plurality of slits that separate the tip region into a plurality of probe regions including one or more probes. Thereby, since adjacent probe regions can be individually deformed, the probe can be reliably brought into contact with the object to be inspected.
[0018]
Another wiring portion electrically connected to each terminal portion can be formed on the other surface of the substrate, and the spacer can be brought into contact with the terminal portion of the substrate. In this case, the spacer is electrically connected to the other wiring part by the terminal part.
[0019]
Using an appropriate method such as a printed wiring technique, the conductive wiring portion can be formed on one surface of an electrically insulating and flexible wiring film such as polyimide. Such a wiring film can be arrange | positioned at a support body so that a wiring part may be on the opposite side to a support body. However, the wiring part may be formed directly on the first and second surfaces of the support.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Referring to FIGS. 1 to 5, the inspection head 10 is used for a current test of a plurality of integrated circuits formed on a semiconductor wafer, although not shown. In the inspection head 10, a plurality of probe units 12 are arranged at the center of a disk-shaped substrate 14 by a frame 16.
[0021]
The base, that is, the substrate 14 has a plurality of first wiring portions 20 on one surface (upper surface in the drawing) of the electrical insulating plate, and a plurality of terminal portions 22 on the other surface (lower surface in the illustrated example). ). Each first wiring portion 20 is a part of a wiring pattern formed on an electrical insulating plate by an appropriate method such as a printed wiring technique, and is connected to a tester land (or a connector portion) (not shown) at one end portion. ing. As shown in FIG. 4, each terminal portion 22 corresponds to the first wiring portion 20, and also corresponds to the first conductive portion 24 that forms a through hole that penetrates the substrate 14 in the thickness direction. It is connected to the wiring part 20.
[0022]
The frame 16 has a rectangular shape, and each side portion of the frame 16 has a square cross-sectional shape. The frame 16 is for detachably assembling the plurality of probe units 12 to the substrate 14 and is bonded to the substrate 14. However, the frame 16 may be detachably attached to the substrate 14 by a plurality of screw members 26 (see FIG. 2), or the probe unit 12 may be detachably attached to the substrate 14 without using the frame 16.
[0023]
As shown in FIGS. 4 and 5, each probe unit 12 includes a long support 30 formed of an electrically insulating material in a substantially rectangular cross-sectional shape, a wiring film 32 disposed on the support 30, and a support. A plurality of probes 34 arranged at intervals in the longitudinal direction of the support, a spacer 36 arranged between the substrate 14 and the support 30, and a cover 38 assembled to the support 30 are included.
[0024]
The support 30 has a first surface (upper surface in FIG. 4) and a second surface (in FIG. 4) having an angle of approximately 90 degrees with respect to the first surface and the substrate following the first surface. Left side), a third surface opposite to the first surface (lower surface in FIG. 4), and a fourth surface opposite to the second surface (right side surface in FIG. 4) Have The vicinity of the boundary between the first and second surfaces is a curved surface that is continuous with each other. The third surface is an inclined surface that gradually becomes lower from the second surface side toward the fourth surface side.
[0025]
The support 30 also has a recess 40 whose bottom surface is the first surface and a slot 42 that opens into the recess 40. The recess 40 is an upward stepped portion that opens to the second surface side. The slot 42 is a long hole that extends in the longitudinal direction of the support 30 and penetrates the support 30 from the recess 40 side to the fourth surface side. However, the slot 42 may be a groove that opens only to the recess 40.
[0026]
In the wiring film 32, a plurality of second wiring portions 44 are formed on one surface of a sheet layer 46 having electrical insulation and flexibility such as polyimide by an appropriate method such as printed wiring technology. . The wiring film 32 has a rectangular shape. The second wiring portion 44 extends from one end edge in the width direction of the wiring film 32 to the other end edge substantially in parallel with an interval in the longitudinal direction of the wiring film 32.
[0027]
The wiring film 32 has one end in the width direction received in the recess 40 and the end edge received in the slot 42, and the second wiring portion 44 is connected to the support 30 and the sheet layer 46. The opposite side is disposed along these surfaces in a range extending from the first surface to the second surface of the support 30 so as to extend from the first surface to the second surface of the support 30.
[0028]
As shown in FIG. 4, each probe 34 is a metal needle formed of a conductive thin metal wire, and the needle tip portion 50 and the needle rear portion 52 are opposite to the needle main body portion 54 between them. It has a crank-like shape bent into The probe 34 is supported on the third surface of the support 30 by the electrically insulating adhesive 56 in the needle main body 54 in a state in which the needle tip portion 50 extends downward toward the fourth surface of the support 30. The body 30 is attached at intervals in the longitudinal direction.
[0029]
Each probe 34 corresponds to the second wiring portion 44 and is connected to the corresponding second wiring portion 44 in the needle rear portion 52 by an appropriate means such as solder. The needle tip portion 50 of each probe 34 is formed in a conical shape that gradually decreases as the needle tip (tip) increases.
[0030]
As shown in FIG. 4, the spacer 36 is formed of a so-called conductive rubber in which a plurality of conductive thin wires 60 such as metal thin wires are arranged on a base material 62 of a plate having electrical insulation and elasticity such as rubber. Has been. The fine wire 60 penetrates the base material 62 obliquely in the thickness direction thereof. The spacer 36 is disposed in the recess 40 such that a part of the spacer 36 protrudes upward, one end of the fine wire 60 comes into contact with the terminal portion 22, and the other end of the fine wire 60 comes into contact with the second wiring portion 44. .
[0031]
The cover 38 is curved so as to reach the second surface through a curved surface from a part of the first surface of the support 30, and is attached to the support 30 by screw members 64 (see FIG. 3) at both ends. Removably assembled.
[0032]
For example, each probe unit 12 solders the needle rear portion 52 of each probe 34 to the corresponding second wiring portion 44, adheres the probe 34 to the third surface of the support 30, and ends one end edge of the wiring film 32. Is inserted into the slot 42, the spacer 36 is disposed in the recess 40, and the cover 38 is attached to the support 30. The wiring film 32 is disposed such that the second wiring portion 44 is on the cover 38 side.
[0033]
When assembling the probe unit 12 as described above, one end edge of the wiring film 32 is inserted into the slot 42, and one end of the wiring film 32 is disposed in the recess 40, thereby positioning the wiring film 32 with respect to the support 30. Therefore, the positioning of the wiring film 32 with respect to the support 30 is facilitated, and the assembly of the probe unit 12 is facilitated.
[0034]
As described above, if the wiring film 32 is pressed against the support 30 by the cover 38 so that the wiring film 32 extends from the first surface along the second surface, the wiring film 32 maintains the correct posture on the support 30. In addition, damage to the wiring film 32 is prevented. However, the cover 38 may not be provided.
[0035]
As shown in FIG. 3, the probe unit 12 assembled as described above is spaced from the substrate 14 by attaching flanges 66 formed at each end of the support 30 to the frame 16 by screw members 68. Placed in parallel.
[0036]
In a state where the probe unit 12 is assembled to the substrate 14, the spacer 36 is sandwiched between the substrate 14 and the wiring film 32 in a slightly compressed state. Thereby, since the thin wire 60 is pressed by the terminal part 22 and the 2nd wiring part 44, the 1st wiring part 20 and the probe 34 are the 2nd wiring part 44, the thin wire 60, the terminal part 22, and conductive. It is securely connected electrically by the sex part 24.
[0037]
The inspection head 10 is used for an energization test of an integrated circuit by connecting a tester land (or connector portion) formed on the substrate 14 to a tester by a plurality of pogo pins (or flat cables). The probe 34 of each probe unit 12 and the first wiring part 20 of the substrate 14 are connected by the second wiring part 44 of the wiring film 32, one or more thin wires 60 of the spacer 36, and the conductive part 24. .
[0038]
For this reason, it is not necessary to use a flat cable exposed in the vicinity of the probe unit, the handling of the head is facilitated, the wiring is shortened, and the response speed is increased. Moreover, since it is not necessary to connect the 1st wiring part 20 and the probe 34 with a flat cable, it can be set as the structure where an impedance matches.
[0039]
Further, even when the first wiring portion 20 of the wiring board 14 is connected to the tester by the connector portion connected thereto and the flat cable connected to the connector portion, By forming it on the outer side of the substrate, it can be separated from the probe unit 12. For this reason, such a flat cable is not exposed near the probe unit.
[0040]
The substrate 14 preferably includes a hole for viewing one or more probes of each probe unit 12. Such a hole may be a hole 70 for viewing one or more probes arranged at least at each end of each probe unit 12 as shown in FIG. 2, or each probe as shown in FIG. The long holes 72 that allow all the probes of the unit 12 to be viewed may be used. Both of the holes 70 and 72 are through holes that penetrate the substrate 14 in the thickness direction.
[0041]
In the above embodiment, the wiring film 32 having the second wiring portion 44 is used. However, the second wiring portion 44 may be directly formed on the support 30 as shown in FIG. In the embodiment shown in FIG. 7, a plurality of second wiring portions 44 corresponding to the probes 34 are formed from the first surface of the support 30 to the second surface by an appropriate method such as a printed wiring technique. Yes.
[0042]
The probe unit 74 shown in FIGS. 8 and 9 uses a plurality of probes 76 formed integrally with the wiring film 32. The probe 76 is formed in a tip region including one end of the second wiring portion 44, and the tip region is manufactured integrally with the wiring film 32. The wiring film 32 has a plurality of slits 78 that separate the tip region into a plurality of probe regions including one or more probes 76.
[0043]
The support 80 is configured in the same manner as the support 30 except that the vicinity of the boundary between the second and third surfaces is also a curved surface that is continuous with each other. In the wiring film 32, the second wiring portion 44 extends from the first surface of the support 80 to the third surface through the second surface, and the probe 76 of the support 80 is connected to the electrically insulating cover 82 side. The support body 80 is assembled so as to extend the third surface.
[0044]
The probe 76 is bonded to the third surface of the support 80 with an electrically insulating adhesive 84 in a state in which the tip portion protrudes from the third surface of the support 80. Each probe 76 has a bump 86 at its tip. The cover 82 reaches the third surface from the first surface through the second surface.
[0045]
If the above-described probe unit 74 is used, not only the wiring film 32 and the probe 76 can be manufactured simultaneously, but also the adjacent probes 76 can be individually deformed. Can be made.
[0046]
The present invention provides not only an inspection head for a plurality of integrated circuits formed on a semiconductor wafer, but also an inspection head for other flat plate-like objects to be inspected, such as a panel before cutting a plurality of liquid crystal panels. Can also be applied.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of an inspection head according to the present invention.
FIG. 2 is a bottom view of the inspection head shown in FIG.
3 is a cross-sectional view taken along line 3-3 in FIG.
4 is a cross-sectional view taken along line 4-4 in FIG.
5 is an exploded perspective view showing an embodiment of a probe unit used in the inspection head of FIG. 1. FIG.
6 is a bottom view similar to FIG. 2, showing another embodiment of a visual through hole. FIG.
FIG. 7 is an exploded perspective view showing another embodiment of the probe unit.
FIG. 8 is a sectional view showing still another embodiment of the probe unit.
FIG. 9 is a bottom view of the probe unit shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Inspection head 12,74 Probe unit 14 Board | substrate 16 Frame 20 1st wiring part 22 Terminal part 24 Conductive part 30,80 Support body 32 Wiring film 34,76 Probe 36 Spacer 38,82 Cover 40 Recess 42 Slot 44 Second wiring part 70, 72 Visual hole 78 Slit

Claims (10)

A substrate having a plurality of terminal portions on one surface, and one or more probe units disposed on the one surface side of the substrate, the probe unit comprising:
A long support disposed on the substrate, the first surface on the side of the substrate, the second surface following the first surface and having an angle with respect to the first surface and the substrate; And a support having a third surface opposite to the first surface;
An electrically insulating wiring film disposed on the support body from the first surface to the second surface, and spaced from the first surface to the second surface in the longitudinal direction of the support body A wiring film having a plurality of wiring portions extending in parallel with each other;
A plurality of probes arranged on the third surface at intervals in the longitudinal direction of the support and electrically connected to the second wiring portion;
A conductive and elastic spacer disposed between the substrate and the first surface to electrically connect the terminal portion and the wiring portion;
The support body further has a recess having the first surface as a bottom surface and a recess in which a part of the wiring film is received, and an opening in the recess to receive a part of the wiring film. An inspection head for a flat inspected object having a slot extending in a longitudinal direction of the support.   The spacer is a plate-like base material having electrical insulating properties and elasticity, and a plurality of conductive thin wires arranged on the base material, the base portion for electrically connecting the terminal portion and the wiring portion. The inspection head according to claim 1, further comprising: a plurality of thin wires that penetrate the material obliquely in a thickness direction thereof.   The inspection head according to claim 1, further comprising a cover assembled to the support so that the wiring film extends from the first surface to the second surface.   4. The inspection head according to claim 1, wherein the plurality of probe units are arranged in parallel on the substrate at intervals. 5.   The inspection head according to any one of claims 1 to 4, wherein the substrate has one or more through holes through which at least a part of the tip of the probe can be visually observed.   The inspection head according to claim 1, wherein each probe is formed of a thin wire having conductivity.   6. The inspection head according to claim 1, wherein the probe is a tip region including one end portion of the wiring portion and is formed by a tip region integrated with the wiring film.   The inspection head according to claim 7, wherein the wiring film has a plurality of slits that separate the tip region into a plurality of probe regions including one or more probes.   The said board | substrate has the other wiring part electrically connected to each terminal part in the other surface, and the said spacer is contact | abutted to the said terminal part, The any one of Claim 1-8. Inspection head.   The inspection head according to claim 1, wherein the wiring portion is formed on the first and second surfaces.

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