JP3850402B2 - Transfer material - Google Patents

Description

  The present invention relates to a transfer material used for decorating the surface of a resin molded product.

  Conventionally, there is a simultaneous molding transfer method as a method for decorating the surface of a resin molded product. In the simultaneous molding transfer method, a transfer material in which a transfer layer consisting of a release layer, a design layer, an adhesive layer, etc. is sequentially laminated on a substrate sheet is sandwiched in a molding die, and the resin is injected and filled in the cavity, followed by cooling. In this method, a transfer material is adhered to the surface at the same time as the resin molded product is obtained, and then the base sheet is peeled off to transfer the transfer layer to the surface of the resin molded product.

  Usually, the transfer material used in the molding simultaneous transfer method is formed by printing each layer on a long base sheet in accordance with the roll width of the printing press, and the appropriate width according to the size of the transfer object. After cutting (slit), it is transferred and used.

  In this case, the slit portion of the transfer material is composed of the peeling layer 104, the anchor layer 107, the design layer 105, the adhesive layer 106, and the like as shown in FIGS. 9 and 10 due to a shock that the blade 130 hits at the time of the slit. There has been a drawback in that a foil spill phenomenon occurs in which the ink coating piece 131 is peeled off from the surface of the release layer 103 formed on the base sheet 102. This is because not only the portion used for transfer but also the portion not used for transfer is excellent in peelability between the base sheet of the transfer material and the transfer layer. Foil spills when there are many design layers as the transfer layer, or when it is necessary to provide a vapor deposition layer as the design layer, when the release layer must be thick like a hard coat transfer material, or when there are many functional layers The larger the transfer layer thickness, the more prominent.

  As a result, the ink film piece again adheres to the transfer material and sometimes enters between the transfer object and the transfer layer during transfer. In addition, if simultaneous molding and transfer is performed with the ink film piece attached to the back surface of the transfer material, the ink film piece adheres to the cavity surface of the mold, and the surface of the molded product is indented by the ink film piece. Sometimes called “scratches”.

  Therefore, when the release layer 103 is provided on the base sheet 102 in order to prevent foil spillage at the time of slitting, the release layer 103 is provided in a strip pattern excluding the portion corresponding to the slit portion 108, and the release layer is provided thereon. 109, a transfer layer composed of a design layer 105, an adhesive layer 106, and the like (see FIG. 4 and Patent Document 1).

Further, instead of providing the release layer 103 over the entire surface, it is conceivable that the transfer material 101 is provided in a pattern and the transfer material 101 is configured so that the slit blade does not contact the transfer layer when slitting (see FIG. 5). .
Japanese Patent Laid-Open No. 11-58584

  However, when performing simultaneous molding transfer using the transfer material 101 having the configuration shown in FIG. 4, if a mold 111 having a side gate 113 is used, a molding resin communicating with the cavity 112 is used as shown in FIG. The runner portion 113 contacts the vicinity of the slit portion 108 of the transfer material 101 (80 in FIG. 7 is a region where the release layer 103 is present, and 81 is a region where the release layer 103 is not present). The resin sprue runner is fused to the adhesive layer 106 of the transfer material 101 (as shown in FIG. 8, in the injection-molded state, the peelable portion is formed by the release layer 103 and the release layer 104 that are peeled off after transfer. Since it is only the portion 84 which is the interface, and does not peel at other portions, and there is an adhesive layer 106 on the sprue runner side of the molded resin portion 120, and there is no portion that can be peeled off. Toner is fused to the adhesive layer 106), there is a problem can not be performed continuously molded like transfer material 101 is broken (see FIG. 6). In particular, as shown in FIG. 7, when simultaneous transfer is performed on both sides of a molded product using two transfer materials 101, the molding resin passes through in contact with the end of one of the transfer materials 101. Therefore, the above phenomenon is more likely to occur.

  In the transfer material having the structure shown in FIG. 5, when the surface strength of the transfer molded product is to be increased, an ionizing radiation curable resin is used as the release layer 109, but the ionizing radiation curable resin is partially patterned by a printing method. Then, since the thickness is limited, there is a problem that sufficient surface strength cannot be obtained.

  Accordingly, an object of the present invention is to provide a transfer material that solves the above-described problems and that can be continuously molded by a simultaneous molding transfer method and that can obtain a molded product having excellent surface strength. To do.

  In order to achieve the above object, the present invention is configured as follows.

  According to the first aspect of the present invention, a base sheet, a strip-shaped pattern release layer laminated on the base sheet, an ionizing radiation-cured layer entirely laminated on the release layer, A pattern layer laminated entirely or partially on the ionizing radiation cured layer, an adhesive layer laminated entirely on the pattern layer, and at least the release layer on the adhesive layer; Provided is a transfer material including a non-adhesive layer partially laminated at a non-overlapping portion.

  According to the second aspect of the present invention, the peel strength from the resin plate at the portion where the release layer is not provided when the resin plate is peeled off at an angle of 90 ° with respect to the resin plate. Provides a transfer material according to the first aspect, wherein the transfer material is less than 50 N / m.

  According to a third aspect of the present invention, there is provided the transfer material according to the first or second aspect, further comprising an anchor layer laminated entirely or partially between the ionizing radiation cured layer and the pattern layer. To do.

  The transfer material of the present invention comprises a base sheet, a strip-shaped pattern release layer laminated on the base sheet, an ionizing radiation cured layer entirely laminated on the release layer, and the ionizing radiation. A design layer that is entirely or partially laminated on the cured layer, an adhesive layer that is fully laminated on the design layer, and a portion that does not overlap at least the release layer on the adhesive layer Since the non-adhesive layer partially laminated is provided, continuous molding is possible in the molding simultaneous transfer method, and a molded product having excellent surface strength can be obtained.

  In addition, by appropriately combining arbitrary embodiments of the various embodiments described above, it is possible to achieve the respective effects.

  Embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a transfer material according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a transfer material according to one modification of the embodiment of the present invention. FIG. 3 is a cross-sectional view showing a transfer material according to another modification of the embodiment of the present invention. FIG. 11 is a plan view showing the relationship between the transfer material and the mold according to the embodiment of the present invention. FIG. 12 is a cross-sectional view of the transfer material according to the above-described embodiment of the present invention at the portion A in FIG. FIG. 13 is a cross-sectional view of a transfer material according to another embodiment of the present invention at the portion A in FIG. 14-15 is explanatory drawing for demonstrating the peeling test of the transcription | transfer material concerning the said embodiment of this invention. FIG. 16 is a perspective view of a transfer material according to an embodiment of the present invention having four strip-shaped pattern release layers. FIG. 17 is a cross-sectional view of a transfer material according to an embodiment of the present invention when the adhesive layer region is narrower than the release layer region. FIG. 18 is a cross-sectional view of a state in which a transfer material according to an embodiment of the present invention is bonded to a resin plate for a peel test. FIG. 19 is a cross-sectional view of a final product obtained using the transfer material according to the embodiment of the present invention.

  In the figure, 1 and 51 are transfer materials, 2 and 52 are substrate sheets, 3 and 53 are release layers, 4 and 54 are ionizing radiation cured layers, 5 and 55 are design layers, 6 and 56 are adhesive layers, and 57 is an adhesive layer. A non-adhesive layer, 58 is an anchor layer, and 8 is a slit portion. In the drawings, the same components are denoted by the same reference numerals.

  The transfer material 51 of the present invention includes a base sheet 52, a strip-shaped pattern release layer 53 stacked on the base sheet 52, and an ionizing radiation-cured layer stacked entirely on the release layer 53. 54, a design layer 55 that is entirely or partially laminated on the ionizing radiation-cured layer 54, an adhesive layer 56 that is entirely laminated on the design layer 55, and an adhesive layer 56 And a non-adhesive layer 57 partially laminated at least in a portion not overlapping with the release layer 53 (see FIGS. 1 to 3).

  As the base sheet 52, a long sheet is preferably used. As a material of the base sheet 52, a polyethylene resin such as polyethylene terephthalate resin, an acrylic resin, a polyvinyl chloride resin, a polypropylene resin, a polyester resin, a polyamide resin, or a copolymer resin thereof. Sheets, metal foils such as aluminum foil and copper foil, glassine paper, coated paper, cellulosic sheets such as cellophane, or composites of the above respective sheets can be used. Moreover, when the surface of the base sheet 52 has fine irregularities, the irregularities are copied to the transfer layer, and surface shapes such as matte and hairline can be expressed. Further, a surface treatment such as easy adhesion may be performed. The easy adhesion process is a process for bringing the ionizing radiation cured layer 54 into close contact with the base sheet 52 when the transfer material 1 is slit so as to have an appropriate width for transfer. Examples of the easy adhesion treatment method include a corona treatment method for roughening the surface of the base sheet 52 to make it easy to adhere, and a method for applying an anchor coat to the surface when the base sheet 52 is manufactured.

  Here, the reason for slitting the transfer material is that the transfer material of the necessary width is printed side by side on the wide base sheet as shown in FIG. 16 as compared with the case of printing the transfer material on the base sheet of the necessary width. It is because the production efficiency is better if the slitting is performed after that (the amount that can be produced in a short time is large). Further, fixing the width of the base sheet to be constant is advantageous in ordering and managing the base sheet, and it is not necessary to change the setting of the printing machine depending on the width of the base sheet during printing.

  The release layer 53 is a layer that is released from the ionizing radiation cured layer 54 together with the base sheet 52 when the base sheet 52 is peeled off after transfer or after simultaneous molding transfer. To form. When the base sheet 52 is long, one or a plurality of strip-like patterns made of the release layer 53 are formed so as to be parallel to the long side of the base sheet 52. In the case where there are a plurality of release layers 53, the gap between the adjacent release layers 53 and the release layers 53 is a portion that slits the transfer material 1, and therefore, it is appropriate to form a width of about 5 to 10 mm.

  As the material of the release layer 53, melamine resin release agent, silicone resin release agent, fluorine resin release agent, cellulose derivative release agent, urea resin release agent, polyolefin resin release agent Paraffin type release agents and composite release agents thereof can be used. Further, in order to form fine irregularities on the transfer surface, a material mixed with particles such as silicone may be used as necessary. As a method for forming the release layer 53, there are printing methods such as a gravure printing method and a screen printing method.

  The ionizing radiation cured layer 54 is the outermost layer of the resin molded product after the base sheet 52 is peeled off, and is formed over the entire surface. As a material of the ionizing radiation curable layer 54, an active energy ray curable resin such as an ultraviolet curable resin or an electron beam curable resin, a thermosetting resin, or the like can be used. Moreover, you may add and color a pigment and dye as needed. Examples of the method for forming the ionizing radiation curable layer 54 include a coating method such as a gravure coating method, a roll coating method and a comma coating method, a printing method such as a gravure printing method and a screen printing method. Moreover, if the ionizing radiation hardening layer 54 is a precure type, it is good to perform ultraviolet irradiation or electron beam irradiation after solvent drying. Further, if the ionizing radiation curable layer 54 is an after cure type, it may be irradiated with ultraviolet rays or electron beams after transfer or after simultaneous molding. In the ionizing radiation cured layer 54, the entire surface means that it does not need to be formed in a portion that is not utilized as a transfer material after the slit.

  The design layer 55 is entirely laminated on the ionizing radiation cured layer 54 (see FIG. 2). The design layer 55 may be partially laminated (see FIG. 1). The design layer 55 is usually formed as a printing layer. As a material for the printing layer, a resin such as polyvinyl resin, polyamide resin, polyester resin, acrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin is used as a binder. A colored ink containing a pigment or dye of an appropriate color as a colorant may be used. As a method for forming the printing layer, a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method may be used. In particular, the offset printing method and the gravure printing method are suitable for performing multicolor printing and gradation expression. In the case of a single color, a coating method such as a gravure coating method, a roll coating method, or a comma coating method may be employed.

  The design layer 55 may be a metal thin film layer or a combination of a printed layer and a metal thin film layer. The metal thin film layer is for expressing metallic luster as the pattern layer 55, and is formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method, or the like. Metals such as aluminum, nickel, gold, platinum, chromium, iron, copper, tin, indium, silver, titanium, lead, and zinc, and alloys or compounds thereof are used depending on the metallic luster color to be expressed. As an example of forming a partial metal thin film layer, a solvent-soluble resin layer is formed on a portion that does not require the metal thin film layer, and then a metal thin film is formed on the entire surface, followed by solvent cleaning. There is a method of removing an unnecessary metal thin film together with a solvent-soluble resin layer. As another example, there is a method in which a metal thin film is formed on the entire surface, a resist layer is then formed on a portion where the metal thin film is to be left, and etching is performed with acid or alkali.

  When the pattern layer 55 is formed, the ink constituting the pattern layer 55 is partially formed (only in a range overlapping with the release layer 53) with respect to the ink having the property of adhering to the molding resin. A material that does not adhere to the molding resin (including a metal vapor deposition layer) may be formed entirely.

  The adhesive layer 56 adheres each of the above layers to the surface of the transfer object, and is laminated over the entire surface. As the adhesive layer 56, a heat-sensitive or pressure-sensitive resin suitable for the material of the transfer object is appropriately used. For example, when the material of the transfer object is an acrylic resin, an acrylic resin may be used. In addition, when the material of the material to be transferred is polyphenylene oxide / polystyrene resin, polycarbonate resin, styrene copolymer resin, or polystyrene blend resin, acrylic resin, polystyrene resin, polyamide having affinity with these resins A series resin or the like may be used. Further, when the material of the transfer object is a polypropylene resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, and coumarone indene resin can be used. Examples of the method for forming the adhesive layer 56 include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, and a printing method such as a gravure printing method and a screen printing method.

  The non-adhesive layer 57 is formed on the adhesive layer 56 at a location that does not overlap with at least the release layer 53. The location that does not overlap with at least the release layer 53 means that there may be a location where the non-adhesive layer 57 is located in a region where the release layer 53 is formed. As the non-adhesive layer 57, a resin that can be applied on the adhesive layer 56 and does not adhere to the molding resin may be appropriately selected and used.

  If the non-adhesive layer 57 covers the entire portion where the release layer 53 is not formed at the position (region) where the non-adhesive layer 57 is to be formed, there is a problem that the molding resin and the base sheet 52 are not peeled off. Absent. However, even in a portion where the release layer 53 is not formed, the non-adhesive layer 57 may not be formed as long as it is not in contact with the sprue runner during molding. Accordingly, the non-adhesive layer 57 is formed at least at a location that does not overlap with the release layer 53 that contacts the sprue runner during molding. The non-adhesive layer 57 does not necessarily have a strip shape. The method for forming the non-adhesive layer 57 is not limited to application. If the thickness of the non-adhesive layer 57 is too thick, for example, exceeding 1 cm, it causes some trouble during molding. As a method for determining the non-adhesive layer 57, it is appropriate to determine at the time of printing that the width is 1 mm or more larger than the width of the portion where the release layer 53 is not formed and 1 mm or more smaller than the width of the portion where the pattern is not formed. It is desirable to consider the deviation. As a method for revealing the non-adhesive region, the adhesive layer 56 is formed on the entire surface, and then the non-adhesive region is formed by reducing the adhesive effect by UV, EB (Electron Beam) or the like in the region formed as the non-adhesive layer 57. It can also be formed as layer 57.

  Further, if necessary, the anchor layer 58 may be provided entirely or partially in order to improve the adhesion between the transfer layers. In particular, if the anchor layer 58 is formed between the ionizing radiation-cured layer 54 and the design layer 55, the molded product and the design layer 55 can be protected from chemicals (see FIG. 3). As the anchor layer 58, for example, a two-component curable urethane resin, a thermosetting resin such as a melamine type or an epoxy type, or a thermoplastic resin such as a vinyl chloride copolymer resin can be used. Examples of the method for forming the anchor layer 58 include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, and a printing method such as a gravure printing method and a screen printing method.

  As described above, in the transfer material 51 in which at least the strip-shaped release layer 53, the ionizing radiation cured layer 54, the design layer 55, and the adhesive layer 56 are formed on the base sheet 52, the transfer material 51 is formed. After being bonded to the resin plate 144, the peel strength from the resin plate at a portion where the release layer 53 is not provided when peeled at an angle of 90 ° with respect to the resin plate 144 may be less than 50 N / m. It is important in the present invention.

  In order to measure the peel strength, first, the transfer material 51 (corresponding to 145 in FIGS. 14 and 15) is bonded to a flat resin plate 144 made of the same material as the transfer object by a roll transfer machine. The conditions were a transfer temperature of 220 ° C., a transfer pressure of 15 kN / m, and a transfer speed of 35 mm / second. Next, as shown in FIG. 14, the resin plate 144 is horizontally disposed by being held by a holding device 143 such as a chuck, and the end of the base sheet 52 is held by the hook 142 of the load measuring device 141 held by the hand 140. The load (N) when the substrate sheet 52 is peeled off by pulling upward 90 ° (in the vertical direction indicated by the arrow 146) is measured by the load measuring device 141. A value obtained by dividing the measured load (N) by the width (m) of the peeled substrate sheet 52 is defined as peel strength (N / m). Note that the peel strength does not depend on the size of the transfer material 51 and the size of the resin plate 144. Moreover, the environmental temperature at the time of measurement was made into normal temperature.

  In this way, by setting the peel strength to less than 50 N / m, as shown in FIG. 11, the sprue runner 213 of the molding resin that communicates with the cavity 212 is formed in the slit portion of the transfer material 51 at the time of molding simultaneous transfer by injection molding. Even if it is a case where it contacts the vicinity of 59, since the sprue runner 213 will contact the non-adhesion layer 57, the sprue runner 213 can peel easily and can perform continuous shaping | molding. That is, as shown in FIG. 13, in the injection-molded state, the part that can be peeled off is the part on the sprue runner side of the molding resin part 150 in addition to the part 88 that is the interface with the release layer 53 to be released after transfer. Since there is no adhesive layer 56 in the portion 87, it can be peeled off, and since the sprue runner 213 can be easily peeled in this portion 87, the molding resin sprue runner is fused to the adhesive layer as in the past. There is nothing to do.

  The surface of the molded resin portion 150 of the resin molded product can be decorated using the transfer material 51 configured as described above. The molded resin portion 150 of the resin molded product is the same as in the first embodiment. FIG. 13 is a diagram illustrating a state in which the transfer material 1 is transferred to the surfaces on both sides of the molded resin portion 150 of the resin molded product.

  A method for decorating the surface of an object to be transferred using the transfer method using the transfer material 51 having the above-described layer structure will be described. First, the adhesive layer 56 side of the transfer material 51 is brought into close contact with the surface of the transfer object. Next, using a transfer machine such as a roll transfer machine or an up-down transfer machine equipped with a heat-resistant rubber-like elastic body such as silicon rubber, a heat-resistant rubber-like condition set at a temperature of about 80 to 260 ° C. and a pressure of about 490 to 1960 Pa. Heat and pressure are applied from the substrate sheet 52 side of the transfer material 51 through the elastic body. By doing so, the adhesive layer 56 adheres to the surface of the transfer object. Finally, when the base sheet 52 is peeled off after cooling, peeling occurs at the boundary surface between the release layer 53 and the ionizing radiation cured layer 54, and the transfer is completed.

  Next, a method for decorating the surface of a resin molded product, which is a transfer object, using the transfer material 51 described above and utilizing a simultaneous molding transfer method by injection molding will be described. First, the transfer material 51 is fed into a molding die composed of a movable die and a fixed die. At that time, the sheet-like transfer material 51 may be fed one by one, or a necessary portion of the long transfer material 51 may be intermittently fed. When the long transfer material 51 is used, it is preferable to use a feeding device having a positioning mechanism so that the register of the design layer 55 of the transfer material 51 and the molding die coincide. Further, when the transfer material 51 is intermittently fed, if the transfer material 51 is fixed by the movable type and the fixed type after the position of the transfer material 51 is detected by the sensor, the transfer material 51 is always kept at the same position. This is convenient because it can be fixed and the positional shift of the symbol layer 55 does not occur. After closing the molding die, the molten resin is injected and filled from the gate into the die, and the transfer material 51 is adhered to the surface at the same time as the transfer object is formed. After the resin molded product, which is the transfer target, is cooled, the molding die is opened and the resin molded product is taken out. Finally, the transfer is completed by removing the base sheet 52.

  The transfer material 51 has a configuration in which a part having no release layer 53 in the vicinity of the slit portion 59 is formed with a layer having low adhesion to the molding resin as the outermost surface. The sprue runner peels off smoothly and does not hinder continuous molding. Further, since the ionizing radiation cured layer 54 can be laminated over the entire surface, it is easy to increase the thickness of the ionizing radiation cured layer 54, and a molded product having sufficient surface strength can be obtained.

  While the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as being included therein, so long as they do not depart from the scope of the present invention according to the appended claims.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used when decorating a plastic molded article or the like with a metallic luster and is industrially useful.

It is sectional drawing which shows the transfer material of embodiment in this invention. It is sectional drawing which shows the transfer material of one modification of embodiment in this invention. It is sectional drawing which shows the transfer material of another modification of embodiment in this invention. It is sectional drawing which shows an example of the conventional transfer material. It is sectional drawing which shows an example of the conventional transfer material. It is a schematic diagram which shows the case where shaping | molding simultaneous transfer is performed using the conventional transfer material. It is a top view which shows the relationship between the conventional transfer material and a metal mold | die. It is sectional drawing of the conventional transcription | transfer material of A part of FIG. It is explanatory drawing of the state which slits in the slit part of the conventional transfer material. It is explanatory drawing for demonstrating foil spilling phenomenon. It is a top view which shows the relationship between the transfer material concerning the said embodiment of this invention, and a metal mold | die. It is sectional drawing of the transfer material concerning the said embodiment of this invention of A part of FIG. It is sectional drawing of the transfer material concerning another embodiment of this invention of A part of FIG. It is explanatory drawing for demonstrating the peeling test of the transfer material concerning the said embodiment of this invention. It is explanatory drawing for demonstrating the peeling test of the transfer material concerning the said embodiment of this invention. It is a perspective view of the transfer material concerning the embodiment of the present invention which has four release layers of a strip pattern. It is sectional drawing of the transcription | transfer material concerning embodiment of this invention in case the area | region of an adhesive layer is narrower than the area | region of a mold release layer. It is sectional drawing of the state which bonded the transfer material concerning embodiment of this invention to the resin board for peeling tests. It is sectional drawing of the final product obtained using the transfer material concerning embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,51 Transfer material 2,52 Base sheet 3,53 Release layer 4,54 Ionizing radiation hardening layer 5,55 Design layer 6,56 Adhesive layer 57 Non-adhesion layer 58 Anchor layer 8 Slit location

Claims (3)

A base sheet;
A release layer having a belt-like pattern laminated on the base sheet;
An ionizing radiation-cured layer entirely laminated on the release layer;
A pattern layer laminated entirely or partially on the ionizing radiation-cured layer;
An adhesive layer entirely laminated on the design layer;
A transfer material comprising: a non-adhesive layer partially laminated on at least a portion not overlapping with the release layer on the adhesive layer. The peel strength from the resin plate at a portion where the release layer is not provided when the resin plate is peeled off at an angle of 90 ° with respect to the resin plate is less than 50 N / m. The transfer material as described in 1. The transfer material according to claim 1, further comprising an anchor layer laminated entirely or partially between the ionizing radiation-cured layer and the design layer.

Images