JP3385943B2 - How to mount electronic components with gold bumps - Google Patents
How to mount electronic components with gold bumpsInfo
- Publication number
- JP3385943B2 JP3385943B2 JP32093397A JP32093397A JP3385943B2 JP 3385943 B2 JP3385943 B2 JP 3385943B2 JP 32093397 A JP32093397 A JP 32093397A JP 32093397 A JP32093397 A JP 32093397A JP 3385943 B2 JP3385943 B2 JP 3385943B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- bump
- gold
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、金バンプ付の電子
部品を基板に実装するバンプ付電子部品の実装方法に関
するものである。
【０００２】
【従来の技術】フリップチップなどのバンプ付の電子部
品を基板に実装する方法として、電子部品に突設された
金バンプを基板の電極に半田付けする方法が知られてい
る。この方法では、接合用の半田を供給するために電子
部品の金バンプの先端部に予め半田バンプを形成する
か、または基板の電極上に半田をプリコートする方法が
用いられる。そして半田バンプ形成用の半田の供給形態
としては、クリーム半田などが用いられていた。
【０００３】
【発明が解決しようとする課題】しかしながら、いずれ
の半田供給方法においてもフラックスの使用が前提とな
っており、実装後の信頼性の確保のため、半田付け後の
洗浄を必要としていた。また基板の電極上にプリコート
半田を形成する場合にあっては、電極上に半田を供給す
る方法として半田メッキによる方法や、半田ボールを電
極上に移載した後に加熱して溶融させる方法など、複雑
な工程を要する高コストの方法が用いられていた。
【０００４】このように、従来の金バンプ付き電子部品
の実装方法では、金バンプに半田バンプを形成しようと
する場合にはフラックス使用を必要とし、また基板の電
極上にプリコート半田を形成しようとすれば、工程が複
雑になり高コストを要するという問題点があった。
【０００５】そこで本発明は、フラックスを使用せず
に、また基板へのプリコート半田の形成を必要とせずに
金バンプ付き電子部品を基板に実装することができる金
バンプ付電子部品の実装方法を提供することを目的とす
る。
【０００６】
【課題を解決するための手段】本発明のバンプ付電子部
品の実装方法は、金バンプが形成された電子部品を半田
素材に押圧して前記金バンプに半田素材を転写する工程
と、この電子部品を加熱して転写された半田素材を加熱
手段により加熱して溶融し、その後固化させて前記金バ
ンプの先端部に球形の半田バンプを形成する工程と、前
記電子部品を予め樹脂接着剤が塗布された基板に搭載し
て前記半田ボールをこの基板の電極に当接させ、圧着ツ
ールで前記電子部品を基板に押圧し、前記半田バンプを
前記電極に押しつけて前記半田バンプの表面の酸化膜を
破壊する工程と、前記電子部品を押圧・加熱して前記半
田バンプを前記基板の電極に半田付けするとともに樹脂
接着剤を硬化させるようにした。
【０００７】本発明によれば、電子部品の金バンプを半
田素材に押圧して金バンプに半田を転写することによ
り、フラックスを使用することなく、また基板の電極へ
のプリコート半田を必要とせずに低コストでバンプ付電
子部品を実装することができる。
【０００８】
【発明の実施の形態】（実施の形態１）図１（ａ），
（ｂ），（ｃ）、図２（ａ），（ｂ），（ｃ）は、本発
明の実施の形態１のバンプ付電子部品の実装方法の工程
説明図である。図１（ａ），（ｂ），（ｃ）および図２
（ａ），（ｂ），（ｃ）は、本実装方法を工程順に示す
ものである。
【０００９】図１（ａ）において、電子部品１には突出
電極である金バンプ２が設けられている。電子部品１は
圧着ツール３に保持されて、半田供給部５上に位置して
いる。半田供給部５は半田素材である半田箔６の供給リ
ール７、受け台８および半田箔６の回収リール９を備え
ている。半田箔６は厚さ約３０ミクロンの半田の薄膜を
テープ状にしたものであり、供給リール７から回収リー
ル９に送られる。図１（ｂ）に示すように、圧着ツール
３を下降させ、電子部品１の金バンプ２を受け台８上の
半田箔６に対して押圧する。これにより、金バンプ２の
下端部は、半田箔６の半田中に埋入し、このとき半田箔
６表面の酸化膜が部分的に破壊される。次に圧着ツール
３を上昇させると、図１（ｃ）に示すように電子部品１
の金バンプ２の下端部には半田箔６の小片６ａが付着し
たまま上昇する。すなわち金バンプ６には半田箔６が転
写される。
【００１０】この後、図２（ａ）に示すように電子部品
１は圧着ツール３に内蔵された加熱手段により加熱され
る。これにより金バンプ２の先端部の半田箔６は溶融
し、その後固化することにより金バンプ２の先端部に球
状の半田バンプ６’を形成する。このとき前述のように
半田箔６の表面の酸化膜は部分的に破壊されているの
で、溶融時には金バンプ２の表面に良好に半田付けされ
る。また、半田箔６を金バンプ２に転写するに際しフラ
ックスを使用しないので、加熱時に有害ガスが発生しな
い。
【００１１】次に電子部品１は基板１０に実装される。
図２（ｂ）において、基板１０には電極１１が形成され
ており、基板１０の上面の２つの電極１１の間には樹脂
接着剤１２が予め塗布されている。この基板１０に圧着
ツール１３に保持された電子部品１を位置合わせし、圧
着ツール１３を下降させる。そして図２（ｃ）に示すよ
うに、半田バンプ６’を電極１１上に当接させて圧着ツ
ール１３によって電子部品１を基板１０に対して押圧す
るとともに、圧着ツール１３を介してヒータにより加熱
する。所定荷重、所定温度での押圧、加熱を所定時間継
続することにより、半田バンプ６’が溶融する。
【００１２】このとき、半田バンプ６’が電極１１の表
面に押しつけられることにより半田バンプ６’の表面の
酸化膜は部分的に破壊され、電極１１と接合性良く半田
付けされる。この半田付けに際し、フラックスを使用す
る必要がなく、したがって半田付け後の洗浄工程を必要
とせずに信頼性の高い実装を行うことができる。また加
熱により樹脂接着剤１２は熱硬化し、電子部品１を基板
１０に強固に接着するとともに、電子部品１と基板１０
の接合部を封止する。これにより電子部品１の基板１０
への実装が完了する。
【００１３】（実施の形態２）図３（ａ），（ｂ），
（ｃ）は本発明の実施の形態２のバンプ付電子部品の実
装方法の工程説明図である。本実施の形態２は、金バン
プ２に供給される半田素材として、半田粒を用いるもの
である。
【００１４】図３（ａ）において、半田素材の供給部１
５内には、半田素材としての半田粒１６が貯溜されてい
る。半田粒１６は、半田を１０〜１００ミクロンの範囲
の径を有する粒子に加工したものである。供給部１５は
平らな底面１５ａを有する箱状の容器であり、スキージ
１７で半田粒１６をかき寄せることにより、底面１５ａ
上には半田粒１６が所定厚さの層状に配列される。
【００１５】供給部１５上には電子部品１を保持した圧
着ツール３が位置している。次に図３（ｂ）に示すよう
に、圧着ツール３を供給部１５に対して下降させ、底面
１５ａ上の半田粒１６に電子部品１の金バンプ２の下端
部を押圧する。これにより金バンプ２の下面にあった半
田粒１６は押しつぶされ、金バンプ２に圧着される。こ
のとき、半田粒１６の表面の酸化膜は部分的に破壊され
る。
【００１６】この状態で圧着ツールを上昇させると、図
３（ｃ）に示すように電子部品１の金バンプ２には半田
粒１６が転写されている。以降の工程については、実施
の形態１の図２（ａ），（ｂ），（ｃ）に示すものと同
様である。
【００１７】以上各実施の形態において説明したよう
に、電子部品１の金バンプ２へ半田を供給する方法とし
て、半田素材としての半田箔または半田粒を金バンプ２
に押圧して転写するようにしているので、フラックスを
使用せずにしかも簡単な設備で金バンプ２の先端部に半
田バンプを形成することができる。
【００１８】
【発明の効果】本発明は、電子部品の金バンプを半田素
材に押圧して金バンプに半田を転写するようにしている
ので、金バンプに半田バンプを付設するに際して、単に
押圧するのみの簡単な設備を用い、しかもフラックスを
用いる必要なく半田バンプを形成することができる。し
たがって低コストで半田バンプが形成され、しかもフラ
ックスを使用していないため加熱時の有害ガスの発生が
なく、安全な工程が実現される。さらに基板への実装に
際して基板の電極上にプリコート半田を予め形成する必
要がないため、低いコストの実装が実現され、またフラ
ックスを使用しないため半田付け後の洗浄を必要とせず
に実装後の信頼性を確保することができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component with bumps on an electronic component with gold bumps on a substrate. 2. Description of the Related Art As a method of mounting an electronic component with a bump such as a flip chip on a substrate, a method of soldering a gold bump protruding from the electronic component to an electrode of the substrate is known. In this method, a solder bump is formed in advance at the tip of a gold bump of an electronic component in order to supply solder for joining, or a method of pre-coating solder on an electrode of a substrate is used. As a supply form of the solder for forming the solder bump, cream solder or the like has been used. [0003] However, in any of the solder supply methods, the use of flux is premised, and cleaning after soldering is required to ensure reliability after mounting. . Also, when forming pre-coated solder on the electrodes of the substrate, such as a method by solder plating as a method of supplying the solder on the electrodes, a method of heating and melting after transferring the solder balls on the electrodes, High cost methods requiring complex steps have been used. As described above, in the conventional mounting method of an electronic component with a gold bump, it is necessary to use a flux when forming a solder bump on the gold bump, and to form a precoat solder on an electrode of a substrate. Then, there is a problem that the process becomes complicated and high cost is required. Accordingly, the present invention provides a method for mounting an electronic component with a gold bump on a substrate, which can mount the electronic component with a gold bump on the substrate without using a flux and without forming a pre-coated solder on the substrate. The purpose is to provide. A method for mounting an electronic component with bumps according to the present invention comprises the steps of: pressing an electronic component with a gold bump formed thereon against a solder material to transfer the solder material to the gold bump; Heat the transferred solder material by heating this electronic component
Heated and melted by means then solidified by forming a solder bump of the spherical tip of the gold bumps, mounted on a substrate in advance a resin adhesive applied to the electronic component
The solder balls into contact with the electrodes of this board
Press the electronic component against the substrate with a
Press the electrode against the electrode to remove the oxide film on the surface of the solder bump.
In the step of breaking , the electronic component is pressed and heated to solder the solder bump to the electrode of the substrate and to cure the resin adhesive. According to the present invention, the gold bump of the electronic component is pressed against the solder material and the solder is transferred to the gold bump, so that no flux is used and no pre-coat solder is required for the electrodes of the substrate. The electronic components with bumps can be mounted at low cost. (Embodiment 1) FIG. 1 (a),
(B), (c), FIGS. 2 (a), (b), (c) are process explanatory views of the mounting method of the electronic component with bumps according to the first embodiment of the present invention. 1 (a), (b), (c) and FIG.
(A), (b), and (c) show this mounting method in process order. In FIG. 1A, an electronic component 1 is provided with a gold bump 2 which is a protruding electrode. The electronic component 1 is held by the crimping tool 3 and located on the solder supply unit 5. The solder supply unit 5 includes a supply reel 7 for a solder foil 6 as a solder material, a receiving stand 8, and a collection reel 9 for the solder foil 6. The solder foil 6 is a tape-like thin film of solder having a thickness of about 30 microns, and is sent from a supply reel 7 to a recovery reel 9. As shown in FIG. 1B, the crimping tool 3 is lowered, and the gold bumps 2 of the electronic component 1 are pressed against the solder foil 6 on the receiving table 8. Thereby, the lower end of the gold bump 2 is buried in the solder of the solder foil 6, and at this time, the oxide film on the surface of the solder foil 6 is partially destroyed. Next, when the crimping tool 3 is raised, as shown in FIG.
Is raised with the small pieces 6a of the solder foil 6 adhered to the lower ends of the gold bumps 2. That is, the solder foil 6 is transferred to the gold bump 6. Thereafter, as shown in FIG. 2A, the electronic component 1 is heated by a heating means built in the crimping tool 3. As a result, the solder foil 6 at the tip of the gold bump 2 is melted and then solidified to form a spherical solder bump 6 ′ at the tip of the gold bump 2. At this time, since the oxide film on the surface of the solder foil 6 is partially broken as described above, it is satisfactorily soldered to the surface of the gold bump 2 at the time of melting. In addition, since no flux is used when transferring the solder foil 6 to the gold bumps 2, no harmful gas is generated during heating. Next, the electronic component 1 is mounted on a substrate 10.
In FIG. 2B, an electrode 11 is formed on the substrate 10, and a resin adhesive 12 is applied in advance between the two electrodes 11 on the upper surface of the substrate 10. The electronic component 1 held by the crimping tool 13 is aligned with the substrate 10, and the crimping tool 13 is lowered. Then, as shown in FIG. 2C, the electronic component 1 is pressed against the substrate 10 by the crimping tool 13 with the solder bumps 6 ′ in contact with the electrodes 11, and is heated by the heater via the crimping tool 13. I do. By continuing pressing and heating at a predetermined load and a predetermined temperature for a predetermined time, the solder bump 6 'is melted. At this time, when the solder bump 6 ′ is pressed against the surface of the electrode 11, the oxide film on the surface of the solder bump 6 ′ is partially broken, and is soldered to the electrode 11 with good bonding. At the time of this soldering, it is not necessary to use a flux, so that a highly reliable mounting can be performed without requiring a cleaning step after soldering. In addition, the resin adhesive 12 is thermally cured by heating, and firmly adheres the electronic component 1 to the substrate 10.
Is sealed. Thereby, the substrate 10 of the electronic component 1
Is completed. (Embodiment 2) FIGS. 3 (a), 3 (b),
(C) is a step explanatory view of the method for mounting an electronic component with bumps according to Embodiment 2 of the present invention. In the second embodiment, solder particles are used as the solder material supplied to the gold bump 2. In FIG. 3 (a), a solder material supply unit 1
In 5, solder particles 16 as a solder material are stored. The solder grains 16 are obtained by processing solder into particles having a diameter in the range of 10 to 100 microns. The supply unit 15 is a box-shaped container having a flat bottom surface 15a.
The solder particles 16 are arranged in a layer of a predetermined thickness on the upper side. The crimping tool 3 holding the electronic component 1 is located on the supply unit 15. Next, as shown in FIG. 3B, the pressure bonding tool 3 is lowered with respect to the supply unit 15, and the lower end of the gold bump 2 of the electronic component 1 is pressed against the solder particles 16 on the bottom surface 15a. Thus, the solder particles 16 on the lower surface of the gold bump 2 are crushed and pressed to the gold bump 2. At this time, the oxide film on the surface of the solder grain 16 is partially destroyed. When the crimping tool is raised in this state, the solder particles 16 are transferred to the gold bumps 2 of the electronic component 1 as shown in FIG. The subsequent steps are the same as those shown in FIGS. 2A, 2B, and 2C of the first embodiment. As described in the above embodiments, a method of supplying solder to the gold bumps 2 of the electronic component 1 is to use a solder foil or a solder grain as a solder material.
Therefore, the solder bumps can be formed on the tips of the gold bumps 2 with simple equipment without using flux. According to the present invention, the gold bumps of the electronic component are pressed against the solder material to transfer the solder to the gold bumps. Therefore, when the solder bumps are attached to the gold bumps, they are simply pressed. It is possible to form solder bumps using only simple equipment and without using flux. Therefore, solder bumps are formed at low cost, and since no flux is used, no harmful gas is generated during heating, and a safe process is realized. Furthermore, there is no need to pre-form solder on the electrodes of the board when mounting it on the board, so low-cost mounting is realized.Flux is not used, so cleaning after soldering is not required and reliability after mounting is low. Nature can be secured.
【図面の簡単な説明】
【図１】（ａ）本発明の実施の形態１のバンプ付電子部
品の実装方法の工程説明図
（ｂ）本発明の実施の形態１のバンプ付電子部品の実装
方法の工程説明図
（ｃ）本発明の実施の形態１のバンプ付電子部品の実装
方法の工程説明図
【図２】（ａ）本発明の実施の形態１のバンプ付電子部
品の実装方法の工程説明図
（ｂ）本発明の実施の形態１のバンプ付電子部品の実装
方法の工程説明図
（ｃ）本発明の実施の形態１のバンプ付電子部品の実装
方法の工程説明図
【図３】（ａ）本発明の実施の形態２のバンプ付電子部
品の実装方法の工程説明図
（ｂ）本発明の実施の形態２のバンプ付電子部品の実装
方法の工程説明図
（ｃ）本発明の実施の形態２のバンプ付電子部品の実装
方法の工程説明図
【符号の説明】
１ 電子部品
２ 金バンプ
３ 圧着ツール
５ 供給部
６ 半田箔
１０ 基板
１１ 電極
１２ 樹脂接着剤
１３ 圧着ツールBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (a) Process explanatory view of a mounting method of a bumped electronic component according to a first embodiment of the present invention (b) Mounting of a bumped electronic component according to a first embodiment of the present invention FIGS. 2 (a) and 2 (a) are explanatory diagrams illustrating a method of mounting the electronic component with bumps according to the first embodiment of the present invention. FIGS. Process explanatory drawing (b) Process explanatory drawing of the mounting method of the electronic component with bump of Embodiment 1 of the present invention (c) Process explanatory drawing of the mounting method of the electronic component with bump of Embodiment 1 of the present invention [FIG. (A) Process explanatory view of the mounting method of the electronic component with bump according to the second embodiment of the present invention (b) Process explanatory view of the mounting method of the electronic component with the bump according to the second embodiment of the present invention (c) The present invention Process description diagram of mounting method of electronic component with bump according to Embodiment 2 [Description of reference numerals] 1 Electronic component 2 Gold bump 3 Crimping tool 5 Supply unit 6 Solder foil 10 Substrate 11 Electrode 12 Resin adhesive 13 Crimping tool
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平３−108734（ＪＰ，Ａ) 特開 平５−136151（ＪＰ，Ａ) 特開 平６−216135（ＪＰ，Ａ) 特開 平８−203904（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-108734 (JP, A) JP-A-5-136151 (JP, A) JP-A-6-216135 (JP, A) JP-A-8-108 203904 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 21/60
Claims (1)
に押圧して前記金バンプに半田素材を転写する工程と、
この電子部品を加熱して転写された半田素材を加熱手段
により加熱して溶融し、その後固化させて前記金バンプ
の先端部に球形の半田バンプを形成する工程と、前記電
子部品を予め樹脂接着剤が塗布された基板に搭載して前
記半田ボールをこの基板の電極に当接させ、圧着ツール
で前記電子部品を基板に押圧し、前記半田バンプを前記
電極に押しつけて前記半田バンプの表面の酸化膜を破壊
する工程と、前記電子部品を押圧・加熱して前記半田バ
ンプを前記基板の電極に半田付けするとともに樹脂接着
剤を硬化させる工程とを含むことを特徴とする金バンプ
付電子部品の実装方法。(57) Claims: a step of pressing an electronic component having a gold bump formed thereon against a solder material to transfer the solder material to the gold bump;
This electronic component is heated and the transferred solder material is heated by heating means.
And heated to melt by, then solidified by forming a solder bump of the spherical tip of the gold bumps, before mounted on the substrate in advance a resin adhesive applied to the electronic component
The solder balls are brought into contact with the electrodes on this board, and a crimping tool
The electronic component is pressed against the substrate with the solder bumps.
Pressing the electrode against an electrode to destroy the oxide film on the surface of the solder bump; pressing and heating the electronic component to solder the solder bump to the electrode on the substrate and cure the resin adhesive And a method of mounting an electronic component with gold bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32093397A JP3385943B2 (en) | 1997-11-21 | 1997-11-21 | How to mount electronic components with gold bumps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32093397A JP3385943B2 (en) | 1997-11-21 | 1997-11-21 | How to mount electronic components with gold bumps |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11154689A JPH11154689A (en) | 1999-06-08 |
| JP3385943B2 true JP3385943B2 (en) | 2003-03-10 |
Family
ID=18126910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32093397A Expired - Lifetime JP3385943B2 (en) | 1997-11-21 | 1997-11-21 | How to mount electronic components with gold bumps |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3385943B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7674651B2 (en) * | 2006-12-26 | 2010-03-09 | International Business Machines Corporation | Mounting method for semiconductor parts on circuit substrate |
| JP5066935B2 (en) * | 2007-02-22 | 2012-11-07 | 富士通株式会社 | Method for manufacturing electronic component and electronic device |
| JP2010205964A (en) * | 2009-03-04 | 2010-09-16 | Taiyosha Electric Co Ltd | Chip resistor for detecting current, and method of manufacturing the same |
| CN101807532B (en) * | 2010-03-30 | 2012-05-09 | 上海凯虹科技电子有限公司 | Flip-chip packaging method and packaging body of ultrathin chip |
| US20150373845A1 (en) * | 2014-06-24 | 2015-12-24 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component mounting structure and method of manufacturing electronic component mounting structure |
-
1997
- 1997-11-21 JP JP32093397A patent/JP3385943B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11154689A (en) | 1999-06-08 |
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