JP3065379B2 - 2-layer double-sided TAB tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a T
AB (Tape Automated Bondin)
g) Regarding the method of manufacturing the tape, more specifically, a two-layer double-sided T
The present invention relates to a method for producing an AB tape.

[0002]

2. Description of the Related Art Although the progress of semiconductor mounting technology in recent years is remarkable, in particular, in TAB, since a conductor pattern can be formed at a very high density, it is possible to easily cope with the increase in the number of pins, and a wire is used for bonding. Since the entire lead can be connected to the semiconductor element at a time without any trouble, the development is being actively promoted at the present time when high-density mounting technology is required. Above all, double-sided TABs, which can be provided with a ground layer on the lower surface to reduce impedance and reduce the influence of noise, have been studied for high-speed ICs.

There are two types of TAB tapes, a two-layer structure and a three-layer structure. A three-layer structure (hereinafter abbreviated as three-layer TAB) is generally a conductor foil such as a copper foil and a heat-resistant resin film. It is possible to make full use of its properties because it has an adhesive layer with inferior heat resistance even if a polyimide film with excellent properties such as heat resistance and chemical resistance is used as a film. Did not.

On the other hand, a double-sided double-sided TAB (hereinafter abbreviated as a double-sided double-sided TAB) has excellent heat resistance as a TAB because it has no adhesive layer on a base film, but is difficult due to the difficulty in its production method. It was rarely put to practical use. That is, as a method of manufacturing the two-layer TAB, a conductor layer is provided on a heat-resistant film such as polyimide by using a thin film forming technique such as sputtering, vapor deposition, and plating. Although it is manufactured by a method of forming a predetermined opening such as a sprocket hole, and a conductor pattern, a problem that a rolled foil having excellent flexibility or an Fe-Ni alloy foil having excellent strength cannot be used, Since it is necessary to provide an opening by using an etching method to form a film opening, there is a problem that productivity is significantly reduced as compared with a punching method of a three-layer TAB. .

[0005]

An object of the present invention is to provide a two-layer double-sided TAB having no adhesive layer without lowering the inherent heat resistance, alkali resistance, solvent resistance, and electrical properties. An object of the present invention is to provide a method for producing a two-layer double-sided TAB tape which is excellent in productivity and has no curl and has good adhesion between a copper foil and a film.

[0006]

SUMMARY OF THE INVENTION The present invention provides a method for producing a 3,3 ',
4,4'-biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA) as an essential component, and 3,3 ', 4,4'
An acid dianhydride component containing 0 to 50 mol% of benzophenonetetracarboxylic dianhydride and / or bis (3,4-dicarboxyphenyl) ether dianhydride and a compound represented by the general formula (I):

[0007]

Embedded image

A polyimide comprising an aromatic diamine having a ratio of one or more aromatic diamines represented by the following formula to 1,3-bis-3- (aminophenoxy) benzene of 70:30 to 90:10 is used. The present invention relates to a two-layer double-sided TAB tape having an intermediate layer.

In the present invention, the two-layer double-sided TAB tape is
Precursor of this polyimide (hereinafter referred to as polyamic acid)
Using a varnish of a solution, apply and dry on a conductive foil to imidize it and form a two-layer substrate. It is obtained by forming a required pattern.

In order to obtain a two-layer substrate by casting a polyamic acid solution onto a metal foil, a known coating means such as a rotary coater, knife coater, doctor blade, flow coater or the like is used to obtain a uniform thickness of 50 to 1000 μm. A method of casting and coating is employed.

In the removal of the solvent from the polyamic acid solution by heating, if strong heating is performed from the beginning, the surface becomes rough or tight. Therefore, it is preferable to gradually increase the heating from a low temperature. For example, heating is continuously performed from 100 ° C. to 350 ° C. over 0.5 hour or more. If the time is less than 0.5 hour, depending on the film thickness, the solvent may not be sufficiently removed, or the ring closure of the imide may be insufficient, and the characteristics may not be exhibited. Also, for example, at 100 ° C. for 30 minutes, then at 150 ° C.
30 minutes at 200 ° C, 30 minutes at 250 ° C, 3 minutes
The temperature may be increased stepwise, for example, at 00 ° C. for 30 minutes and at 350 ° C. for 30 minutes. In some cases, the heating atmosphere may be in the air, but when a metal foil that is easily oxidized such as a copper foil is used as the metal foil, it is preferable to perform the treatment under reduced pressure or in a non-oxidizing state while flowing an inert gas. The polyimide film layer thus formed is generally 10 to 200 μm.
It is.

[0012] As a method of providing an opening in the two-layer substrate, punching, cutting, or the like can be used. After crimping the two-layer substrate and the conductor foil, a predetermined resist pattern is formed on the conductor foil, and when performing an etching process, the opening portion is filled with a required filling material to perform etching from the opening portion. It must be prevented. After forming the conductor pattern, the resist and the filling material remaining on the conductor foil are removed, and a sprocket hole is formed by punching.

In the present invention, the condition for heating and pressing the two-layer substrate and the conductor foil is 300 in the case of the press type.
5 to 100 kg / cm ² , 5 to 30 minutes, 300 to 500 ° C., 1 to 50 in case of a roll laminator
kg / cm, 0.1 to 10 m / min.
In particular, it is desirable that the temperature is higher by 50 to 100 ° C. than the drying temperature of the polyamic acid film.

The polyamic acid solution used in the present invention only has to have a film-forming ability, excellent adhesion to a metal foil, and thermoplasticity, but the following polyamic acid is most suitable. That is, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA) is an essential component, and 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride and / or Screw (3, 4
-Dicarboxyphenyl) ether dianhydride from 0 to 50
mol%, the ratio of the acid dianhydride component to one or more aromatic diamines represented by the general formula (I) and 1,3-bis-3- (aminophenoxy) benzene is 70: 3.
It is a polyimide obtained by heating and curing a polyamic acid solution comprising an aromatic diamine having a ratio of 0 to 90:10.

The tetracarboxylic acid dianhydride used in the present invention includes 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride. , Bis (3,4-dicarboxyphenyl) ether dianhydride, but other acids such as pyromellitic dianhydride, 2,3,3 ', 4'-biphenyltetracarboxylic dianhydride , 3,3 ', 4,
4′-P-terphenyltetracarboxylic dianhydride,
2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3 ', 4,4'-P-terphenyltetracarboxylic dianhydride 4,4,4'-hexafluoroisopropylidenebis (phthalic acid (Anhydrides) can be used in combination as long as the acid anhydride properties are not impaired.

The diamine used in the present invention is a diamine represented by the formula (1) such as P-phenylenediamine and 1,3-diamine.
Bis (3-aminophenoxy) benzene, but other amines such as 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 4,4′-diaminodiphenyl ether, 4,4′-diamino Diamines such as diphenylmethane, 3,3'-dimethylbenzidine, 4,4'-diamino-P-terphenyl, 4,4'-diamino-P-quarterphenyl and 2,8-diaminodiphenylene oxide also impair the properties. It can be used together in a range that does not exist.

The reaction between the tetracarboxylic dianhydride component and the diamine component is carried out with an acid component / amine component (molar ratio) of 0.90.
It is preferably carried out at １．０1.00, and when it is lower than 0.90, the degree of polymerization does not increase and the film properties after curing are poor. If it is larger than 1.00, gas is generated at the time of curing, and a smooth film cannot be obtained.

The reaction is usually carried out in an organic polar solvent which does not react with tetracarboxylic dianhydrides or diamines. In addition to being inert to the reaction system and being a solvent for the product, the organic polar solvent must be a good solvent for at least one of the reaction components, preferably both. Typical examples of this type of solvent include N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfone, dimethyl sulfoxide, N-methyl-2-pyrrolidone, and the like. These solvents may be used alone or in combination. used. In addition, benzene, which is used in combination as a solvent,
Non-polar solvents such as dioxane, xylene, toluene, cyclohexane and the like are used as a dispersion medium of a raw material, a reaction regulator or a volatilization regulator from a product, a film smoothing agent and the like.

The reaction is generally preferably carried out under anhydrous conditions. This is because the tetracarboxylic dianhydride may be ring-opened by water, inactivated, and stop the reaction. Therefore, it is necessary to remove both the water in the raw materials and the water in the solvent. But on the other hand, it regulates the progress of the reaction,
Water is also added to control the degree of polymerization of the resin. The reaction is preferably performed in an inert gas atmosphere. This is to prevent oxidation of diamines. Dry nitrogen gas is generally used as the inert gas.

Examples of the material that can be used for the conductor layer include metal foils such as Fe—Ni alloy and Fe—Cr—Al alloy in addition to simple metal foils such as copper, aluminum and nickel.

[0021]

According to the present invention, a hole is formed in a two-layer substrate obtained by applying and drying a specific polyamic acid solution on a conductive foil,
Furthermore, by performing a step of forming a conductor wiring by applying heat and pressure to the conductor foil, a two-layer double-sided TAB tape can be obtained easily and inexpensively with high productivity and yield.

[0022]

EXAMPLES Example 1 A 4-neck separable flask equipped with a thermometer, a stirrer, a reflux condenser and a dry nitrogen gas injection port was charged with 0.01 mol of APB and 1,4-dimethyl-2,5-diaminobenzene in a 4-neck separable flask. 0.06 mol, p
-Take 0.03 mol of phenylenediamine, add a mixed solvent of 90% by weight of anhydrous N-methyl-2-pyrrolidone and 10% by weight of toluene, in such an amount that the solid content ratio in all the raw materials becomes 20% by weight. Was added and dissolved. Dry nitrogen gas was allowed to flow throughout the entire process from the preparation of the reaction to the removal of the product. Then purified BPDA 0.0
7 mol and 0.03 mol of BTDA are added little by little with stirring. However, since it is an exothermic reaction, about 1 mol is added to the external water tank.
This was cooled by circulating cold water at 5 ° C. After the addition, the internal temperature was set at 20 ° C., and the mixture was stirred for 5 hours to complete the reaction, thereby obtaining a polyamic acid solution.

This polyamic acid solution is applied on a rolled copper foil with a spinner so as to have a thickness of 50 μm after imidization, and dried at 110 ° C. for 15 minutes and further at 250 ° C. for 20 minutes to obtain a two-layer substrate. Was. Drilling (device hole) using a mold, superimposing a polyimide film surface on the roughened surface of a commercially available rolled copper foil, 400 ° C., 40 kg / cm
^2. Heating / compression bonding was performed for 15 minutes to obtain a double-sided two-layer substrate having device holes.

Using the obtained double-sided two-layer substrate, a predetermined resist pattern and a hole-filling material are applied on the conductor foil, and the conductor pattern is formed by performing an etching process. Was removed and sprocket holes were formed by punching to obtain an excellent two-layer double-sided TAB tape.

Example 2 Using a two-layer substrate having device holes similar to that of Example 1, a polyimide film surface was superposed on a roughened surface, and a roll type laminator was used at 90 ° C. and 15 kg / cm. ^2. Heating / compression bonding was performed at 0.2 m / min to obtain a double-sided two-layer substrate having device holes. A good two-layer double-sided TAB tape was obtained in the same manner as in Example 1 except that this double-sided two-layer substrate was used.

(Example 3) Using the same apparatus and method as in Example 1, PPD 0.02 mol, APB 0.05 mol,
1,4-dimethyl-2,5-diaminobenzene 0.03
mol, BPDA 0.08 mol, ODPA 0.01 m
ol and BTDA 0.01 mol were obtained. Thereafter, a good double-sided two-layer TAB tape was obtained in the same manner as in Example 1.

Comparative Example 1 Using the same apparatus and method as in Example 1, 0.1 mol of P-phenylenediamine, BPDA
A polyamic acid solution consisting of 0.1 mol was obtained. After that, an attempt was made to produce a double-sided two-layer substrate in the same manner as in Example 1, but no adhesion was observed even when thermocompression-bonded to a copper foil.

(Comparative Example 2) Using the same apparatus and method as in Example 1, 0.1 m of 4,4'-diaminodiphenyl ether was used.
ol and 0.1 mol of pyromellitic dianhydride were obtained as a polyamic acid solution. After that, an attempt was made to produce a double-sided two-layer substrate in the same manner as in Example 1, but no adhesion was observed even when thermocompression-bonded to a copper foil.

[0029]

According to the present invention, there is provided a curl-free copper foil and film having excellent heat resistance, chemical resistance and the like provided with device holes by punching with excellent productivity by using a specific polyamic acid. Two-layer T with good adhesion to
AB could be obtained, and a double-sided two-layer TAB using a rolled foil that could not be used by a vapor deposition method or the like could be produced. The present invention can be easily applied to a continuous process using a continuous sheet.
This is suitable as a method for manufacturing the layer TAB.

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-294557 (JP, A) JP-A-4-234191 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B32B 27/34 H01L 21/60 311 B05D 1/00-7/26

Claims (1)

(57) [Claims] An essential component of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA), comprising 3,3', 4,4'-benzophenonetetracarboxylic dianhydride (Hereinafter abbreviated as BTDA) and / or bis (3,4-dicarboxyphenyl) ether dianhydride (hereinafter abbreviated as ODPA) in an amount of from 0 to 50 mol%, and an acid dianhydride component and a compound represented by the general formula (I): ] One or more aromatic diamines represented by
3-bis-3- (aminophenoxy) benzene (hereinafter referred to as A
A double-sided double-sided TAB tape, characterized in that the intermediate layer has a polyimide composed of an aromatic diamine having a ratio of 70:30 to 90:10 (abbreviated as PB).