JP2662033B2 - Radiation curable adhesive tape - Google Patents

Description

The present invention relates to an adhesive tape used in a process of manufacturing various semiconductors, and more specifically, for example, a pattern-formed wafer is formed for each pattern. The present invention relates to a radiation-curable pressure-sensitive adhesive tape for fixing a semiconductor wafer, which is used when cutting and dividing as a semiconductor element.

(Prior Art) Conventionally, a direct pick-up method has been used when performing dicing for cutting and separating a semiconductor wafer on which a circuit pattern is formed into element pieces. In this method, a semiconductor wafer is pasted and fixed on an adhesive tape in advance, and the semiconductor wafer is cut along a device shape by a rotating round blade,
The fixing adhesive tape is radially stretched to slightly widen the space between the elements, and then the element pieces are pushed up with a needle or the like and picked up from the adhesive tape with air tweezers or the like.

In this method, at the time of cutting the semiconductor wafer using the rotating round blade, 2 kg /
Cleaning water under a water pressure of about ² cm ² is discharged onto the rotating round blade and the semiconductor wafer. For this reason, the element fixing adhesive force at the time of dicing processing must be strong enough to withstand the cutting impact force of the rotating round blade and at the same time to withstand the water pressure of the washing water. In this sense, if the element fixing adhesive force is strong, The stronger the better. But,
If the adhesive strength for fixing the element is too strong, it is difficult to pick up the element from the adhesive tape, and the element may be damaged. That is, the element fixing adhesive force at the time of dicing and at the time of pickup must be controlled in accordance with the size of the element piece. Since the adhesive strength of the adhesive tape does not change during dicing and pick-up, it is necessary to set the adhesive force according to the size of the element piece so that the element does not scatter during dicing and does not damage the element during pick-up. is there. In addition, with the size of 25 mm ² or more, such as LSI elements with increased integration in recent years, the adhesive strength for fixing each element becomes too large, making it difficult to pick up from the adhesive tape, and the above direct pickup method There was a problem that was not applicable.

In order to solve this problem, a pickup system using a radiation-curable adhesive tape has been proposed. It is composed of a support that transmits radiation, for example, light such as ultraviolet light, or ionizing radiation such as an electron beam, and a pressure-sensitive adhesive layer coated on the support and having a property of being cured by irradiation with radiation. With the adhesive tape for fixing the semiconductor wafer, the element fixing adhesive force at the time of dicing processing is made to be a strong adhesive force, after cutting and separating the semiconductor wafer into element pieces, irradiating radiation from the support side to cure the radiation-curable adhesive layer, This is a method in which the element fixing adhesive force is greatly reduced so that a large element of, for example, 25 mm ² or more can be easily picked up regardless of the size of the element piece.

In this proposed method, a radiation-curable compound contained in the adhesive of a semiconductor wafer fixing adhesive tape in which a radiation-curable adhesive is coated on a radiation-transmissive support is cured by irradiation with radiation to form an adhesive. It is based on the principle of providing a three-dimensional network structure and significantly reducing its fluidity. Such pressure-sensitive adhesive tapes and pressure-sensitive adhesives include JP-A-60-196956, JP-A-60-201642, and JP-A-61-2857.
No. 2, JP-A-62-10180 and the like.

(Problems to be Solved by the Invention) Such a conventional radiation-curable pressure-sensitive adhesive tape has a base material film which transmits radiation such as polyvinyl chloride, ethylene-vinyl acetate copolymer, polyethylene, polypropylene, and polyethylene terephthalate. It is obtained by applying a radiation-curable pressure-sensitive adhesive as exemplified above to one surface of a film-like support composed of these single resin layers, using a conductive material.

However, in response to increasing demands such as improvement of productivity in recent years and improvement of process accuracy accompanying automation, the demand level of pressure-sensitive adhesive tapes is also increasing. However, conventional radiation-curable pressure-sensitive adhesive tapes cannot satisfy these requirements, and the following points are to be solved.

(1) When using a radiation-curable pressure-sensitive adhesive tape to perform dicing on a semiconductor wafer or the like, the semiconductor wafer bonded to the pressure-sensitive adhesive tape may be cut by a rotary round blade, or may adhere due to the weight of the semiconductor wafer itself. The tape is under considerable tension. For this reason, in the case of an adhesive tape using a flexible resin, these tensions cause the film-shaped support to elongate, and the adhesive tape is loosened as if depressed from the center. If the loosened pressure-sensitive adhesive tape is stored in a carrier cassette in order to be transferred to the next step, there is a problem that the pressure-sensitive adhesive tape cannot be stored due to the looseness of the pressure-sensitive adhesive tape or the wafers come into contact with each other in the carrier cassette. In addition, loosening of the adhesive tape narrows the gap between the element pieces, causing a problem that the end of the element comes into contact with another adjacent element and is damaged.

(2) The radiation-curable pressure-sensitive adhesive tape is irradiated with radiation in order to reduce the element-fixing adhesive force as a pre-treatment for element pickup. At the time of this radiation irradiation, the adhesive tape is heated by the heat generated by irradiating a considerable amount of light in the infrared region. For this reason, the heat or the like causes new elongation of the adhesive tape and partial wrinkles. These elongations and wrinkles are held until the final step in which the element is picked up by the curing of the radiation-curable adhesive, so that not only can it not be stored in a carrier cassette used for transfer between steps, but also in the element pick-up process. In this case, variations in the element gap are caused, which also causes a defective pickup of the element.

An object of the present invention is to provide a radiation-curable pressure-sensitive adhesive tape that can solve the above problems at once.

More specifically, an object of the present invention is to apply a semiconductor wafer to an adhesive tape so that the adhesive tape does not elongate or loosen when dicing is performed, and that radiation is applied to reduce the element fixing adhesive force. However, an object of the present invention is to provide a radiation-curable pressure-sensitive adhesive tape which is free from new elongation and partial wrinkles, and is capable of satisfactorily performing all steps including a final pickup step.

Further, the object of the present invention is to provide a radiation curing property in which even if elongation or loosening of the adhesive tape occurs due to some external factor, the elongation or loosening of the adhesive tape is rapidly eliminated by the heating action in the irradiation step and cooling after irradiation. The purpose is to provide an adhesive tape.

(Means for Solving the Problems) The present inventors initially focused on a radiation-transparent plastic film formed by biaxial stretching and capable of contracting by heating, as a film-like support for an adhesive tape. However, when such a film is used, since the film shrinks due to heat generated in the radiation irradiation step, elongation or loosening of the adhesive tape is eliminated, but the shrinkage rate of the film-like support is too large, so that the device A partial widening of the gap occurs. Further, when the cutting depth during dicing was large, the adhesive tape was broken between the elements. Furthermore, in the case of the above biaxially stretched film or crosslinked film, the rigidity of the film-like support itself is high and the film is hardly deformed at the time of picking up the element. Therefore, when the element fixing adhesive force is sufficiently reduced, one element is used. It was confirmed that there was a problem that the shock when picking up the laser was transmitted to other elements, causing a displacement in other elements.

As a result of repeated investigations to overcome such disadvantages, the film-shaped support of the radiation-curable pressure-sensitive adhesive tape is composed of at least two or more resins, and one of the resins has a Vicat softening point of at least 120. By using a resin having a molding shrinkage of 0.5 to 3% at ℃, even a non-stretched film shows good shrinkage by radiation irradiation, and can sufficiently eliminate elongation and loosening caused by tension applied to the adhesive tape. I found it. Further, as a radiation-curable pressure-sensitive adhesive layer applied to one surface of the film-like support, 100 parts by weight of an acrylic pressure-sensitive adhesive, and a group selected from a cyanurate compound having a carbon-carbon double bond and an isocyanurate compound. By containing at least one compound of 5 to 500 parts by weight, it is cured by irradiation, generates a three-dimensional network structure, and fixes the element regardless of the surface roughness and the surface treatment state of the bonding surface of the element piece. The present inventors have found that the composition shows stable curing of the adhesive strength, and have completed the present invention based on these findings.

That is, the present invention comprises at least two different resin layers, and at least one of the resin layers has a Vicat softening point of at least 120 ° C. and a molding shrinkage of 0.5 to 3%, preferably 0.5 to 2%. Layer (hereinafter referred to as resin layer A)
The present invention provides a radiation-curable pressure-sensitive adhesive tape characterized by using a radiation-transmissive film-like support having the following formula, and having a radiation-curable pressure-sensitive adhesive layer provided on one surface thereof.

Here, the Vicat softening point is measured according to JIS-K7206. In addition, the molding shrinkage ratio causes volume shrinkage when the resin is solidified after being molded by a mold or the like, but it refers to the dimensional change rate from the molding size at this time, and the measuring method is
Specified in ASTM-D655.

Here, the radiation refers to a light beam such as an ultraviolet ray or an ionizing radiation such as an electron beam.

As the resin constituting the film-like support in the radiation-curable pressure-sensitive adhesive tape of the present invention and having a Vicat softening point of at least 120 ° C. and a molding shrinkage of 0.5 to 3%, preferably high-density polyethylene or polypropylene is used. it can.

Such high-density polyethylene is obtained, for example, by a conventionally known polyethylene polymerization method, and has a density of at least 0.94 g / cc and a crystallinity of 75% or more.
This is represented by low pressure polyethylene. The polypropylene is, for example, an isotactic polypropylene having crystallinity, and a homopolymer or a copolymer can be used.

In the present invention, a different resin layer (hereinafter simply referred to as a resin layer B) laminated with the resin layer A absorbs and externally absorbs an external impact force applied to each adherend at the time of semiconductor wafer ing and at the time of picking up a diced element piece. In addition, the tape has a function of providing cushioning to the tape itself in order to prevent chip flying during dicing and to prevent chips other than the predetermined chip from falling off when picking up element pieces. The resin of the resin layer B generally has a Shore D hardness lower than 60, preferably 50 or less, more preferably 40 or less.

Examples of the resin of the resin layer B include ethylene-vinyl acetate copolymer, polybutene, polymethylpentene, ethylene-ethyl acrylate copolymer, ethylene-
Α-olefin homopolymer or copolymer such as methyl acrylate copolymer, ethylene-acrylic acid copolymer, ionomer, low-density polyethylene, linear low-density polyethylene, ethylene-propylene copolymer, or a mixture thereof Can be arbitrarily selected according to each required characteristic of the film-form support.

In the present invention, a radiation-curable pressure-sensitive adhesive tape is prepared by accumulating different kinds of resins and applying a radiation-curable pressure-sensitive adhesive to the support thus obtained.

This support has at least one resin layer A and at least one resin layer B. Preferably, the resin layer A is an intermediate layer and both outer layers are resin layers B (even if the resin layers B are the same or different from each other). Good).
In this case, the application side of the radiation-curable pressure-sensitive adhesive layer is not particularly limited, but an ethylene copolymer having a content of the copolymer component to the ethylene component of 5% or more (hereinafter referred to as “% by weight”) is used. It is preferred to use.

On the back side of the support, the copolymer resin content of a homopolymer such as low-density polyethylene linear low-density polyethylene or an ethylene-based copolymer is the same as that of the bonding surface to prevent blocking with the bonding surface or the like. It is better to use less.

It is also effective to form a mat surface having fine irregularities on the back side of the film-shaped support.

The thickness of such a film-like support is usually preferably from 30 to 300 μm from the viewpoints of strength, elongation characteristics and radiation transparency. The thickness of the resin layer A is arbitrarily set according to the required characteristics of the film-like support. In this case, the resin layer A in the film-like support is not so wrinkled or loosened after curing by radiation irradiation. It is better to set the ratio appropriately. The thickness of the resin layer A is usually in the range of 3 to 90% with respect to the total thickness of the film support.

As a method for producing this film-shaped support, a conventionally known co-extrusion method, a laminating method, or the like is used. In this case, the resin layer A and the resin layer B An adhesive may be applied during the process. As such an adhesive, an ordinary adhesive such as an ethylene-vinyl acetate copolymer or a maleic acid-modified ethylene-vinyl acetate copolymer can be used.

The radiation-curable pressure-sensitive adhesive layer provided on the film-shaped support, for example, 100 parts by weight of an acrylic pressure-sensitive adhesive,
It contains 5 to 500 parts by weight of at least one compound selected from the group consisting of a cyanurate compound having a carbon-carbon double bond and an isocyanurate compound, and contains a photoinitiator and a polymerization accelerator, other known tackifiers, and softening agents. A composition comprising an agent, an antioxidant, a pigment and the like can be opened.

The acrylic pressure-sensitive adhesive is a homopolymer having an acrylic acid or methacrylic acid ester as a main structural unit, or a copolymer with acrylic acid or methacrylic acid or an ester or an acid amide thereof and other copolymerizable comonomers. It is a coalescence or a mixture of these polymers.
As its monomers and comonomers, for example, acrylic acid or methacrylic acid alkyl esters such as methyl ester, ethyl ester, butyl ester, 2-ethylhexyl ester, octyl ester, glycidyl ester, hydroxymethyl ester, 2-hydroxyethyl ester, hydroxypropyl ester, And amides and N-substituted amides of acrylic acid or methacrylic acid, such as N-hydroxymethylacrylamide or methacrylamide. If necessary, a compound containing a crosslinking agent such as a polyisocyanate compound or an alkyl etherified melamine compound can be used.

Further, a cyanurate or isocyanurate compound is a compound having a triazine ring or an isotriazine ring in a molecule and further having at least two or more radiation-polymerizable carbon-carbon double bonds, and a monomer, an oligomer or a mixture thereof. It does not matter. A compound having a triazine ring or an isotriazine ring can be generally synthesized by a conventional cyclization reaction using a halocyan compound, a dianiline compound, a diisocyanate compound, or the like as a raw material. Furthermore, a compound used in the present invention can be obtained by introducing a functional group containing a radiation-polymerizable carbon-carbon double bond-containing group, such as a vinyl group, an acryloxy group or a methacryloxy group, into the compound synthesized in this manner. .

There is no particular limitation on the cyanurate or isocyanurate compound, but those in which the carbon-carbon double bond-containing group introduced into the triazine ring or the isotriazine ring does not include a so-called rigid molecular structure, such as an aromatic heterocyclic group or the like. Is preferred. The reason for this is that if these compounds impart excessive rigidity to the radiation-polymerizable compound, the pressure-sensitive adhesive of the present invention is excessively embrittled by radiation curing. Therefore, the bonding group between the carbon-carbon double bond and the triazine ring or isotriazine ring preferably contains a group having a high atomic free rotation. Examples of these groups include aliphatic groups such as an alkylene group and an alkylidene group, which may have an -O-, -OCO-, -COO-, -NHCO-, -NHCOO- bond, or the like. Good. When this bonding group is bonded to the triazine ring via -O-, at least one of the three alkylene groups, alkylidene groups and the like bonded to -O- preferably has 2 or more carbon atoms.

Specific examples of these cyanurate or isocyanurate compounds include 2-propenyl di-3-butenyl cyanurate, 2-hydroxyethyl bis (2-acryloxyethyl) isocyanurate, tris (acryloxyethyl) isocyanurate, and tris (Methacryloxyethyl) isocyanurate, bis (2-acryloxyethyl) 2-{(5) acryloxyhexyl) -oxy} ethyl isocyanurate, tris (1,3-diacryloxyisopropyl-oxycarbonyl-n-hexyl) ) Isocyanurate, tris (1-acryloxy-3)
-Methacryloxyisopropyl-oxycarbonylamino-n-hexyl) isocyanurate and the like.

The number of radiation-polymerizable carbon-carbon double bonds per repeating unit of the isocyanurate compound or the monomer or oligomer of the isocyanurate compound is usually preferably at least two, more preferably 2 to 6. If the number of these double bonds is less than 2, a sufficient degree of crosslinking to lower the adhesive strength by irradiation is not obtained, and if it exceeds 6, the embrittlement of the adhesive after radiation curing is excessive. Sometimes.

The compounding amount of the cyanurate compound or the isocyanurate compound is usually from 5 to 500 parts by weight, more preferably from 10 to 300 parts by weight, based on 100 parts by weight of the acrylic pressure-sensitive adhesive. When the compounding amount is too small, three-dimensional network formation by irradiation of the radiation-curable pressure-sensitive adhesive becomes insufficient, and it is not possible to control the flow inhibition of the acrylic pressure-sensitive adhesive, so that the element can be easily picked up. This is not preferable because the adhesive strength for fixing the element does not decrease to a certain extent. Conversely, if the amount is too large, the plasticizing effect on the acrylic pressure-sensitive adhesive is large, and it is not possible to obtain sufficient element fixing adhesion enough to withstand the cutting impact force of the rotating round blade during dicing or the water pressure of the washing water. .

In the radiation-curable pressure-sensitive adhesive of the present invention, the radiation-curable compound described above can be used in combination with other radiation-curable compounds, for example, one or more aliphatic polyol polyacrylates or polymethacrylates. Examples of these compounds include ethylene glycol, diethylene glycol, trimethylolpropane,
Examples include acrylic acid or methacrylic acid esters such as 1,4-butanediol, 1,6-hexanediol, pentaerythritol, dipentaerythritol, polyethylene glycol (carbon number = 3 to 14), and oligomers thereof.

When the radiation-curable pressure-sensitive adhesive tape of the present invention is cured by ultraviolet irradiation, a photopolymerization initiator such as isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, and benzyl By adding one or more of dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethyl phenylpropane and the like to the pressure-sensitive adhesive layer, the curing reaction time or the amount of ultraviolet irradiation can be increased. Even if the amount is small, the curing reaction can efficiently proceed, and the adhesive strength for fixing the element can be reduced.

The thickness of the radiation-curable pressure-sensitive adhesive layer on the film-like support is not particularly limited, but is usually 2 to 50 μm.

(Examples) Next, the present invention will be described in more detail based on examples.

Example 1 A polyisocyanate compound (Nihon Polyurethane Co., Ltd.) was added to 100 parts by weight of an acrylic pressure-sensitive adhesive (copolymer of 2-ethylhexyl acrylate and n-butyl acrylate).
3 parts by weight, trade name: Coronate L), 100 parts by weight of tris-2-acryloxyethyl isocyanurate as an isocyanurate compound, and 1 part by weight of α-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator. The adhesive was adjusted.

This radiation-curable pressure-sensitive adhesive was mixed with an ethylene-vinyl acetate copolymer and high-density polyethylene (manufactured by Tosoh Corporation, trade name Nipolon Hard, 4010, Vicat softening point 126 ° C, molding shrinkage)
The main layer (thickness: 30 μm) consisting of two types of resin layers (thickness: 1.0-2.0%) and high-density polyethylene is used as an intermediate layer, and an ethylene-vinyl acetate copolymer having a vinyl acetate content of 15% is provided on the adhesive surface of the adhesive. (Thickness: 30 μm), and the back layer of the support was an ethylene-vinyl acetate copolymer (thickness: 3%) having a vinyl acetate content of 3%.
30 μm), and a thickness of 100 obtained by co-extrusion using an ethylene-vinyl acetate copolymer having a vinyl acetate content of 25% as an adhesive layer between the intermediate layer and both outer layers.
A corona treatment is applied to the side of the ethylene-vinyl acetate copolymer having a vinyl acetate content of 15% of a μm film-like support, and the surface is dried to a thickness of 20 μm to obtain a radiation-curable adhesive tape. Was.

A large silicon wafer having a diameter of 5 inches was adhered to the radiation-curable adhesive tape as an adherend, according to JIS-Z0237.
The adhesive strength before and after ultraviolet irradiation was measured based on the above (90 ° peeling, peeling speed 50 mm / min, the following Examples and Comparative Examples were by this method). At this time, the surface state of the wafer to be bonded to the adhesive tape was a mirror surface and a lapping # 600 finished surface (having fine irregularities equivalent to the surface state of US mesh # 600). The results are shown in Table 1.

Furthermore, a 5 inch diameter silicon wafer was attached to the radiation-curable adhesive tape, and the area of the element piece was reduced to 1 m.
It was dicing as m ^2. When the state of the tape was visually checked after dicing, looseness due to the weight of the semiconductor wafer itself or elongation of the adhesive tape and the like were not observed. Further, the carrier was stored in a carrier cassette for transfer to the next ultraviolet irradiation step, but there was no hindrance due to looseness or elongation of the adhesive tape.

Next, when ultraviolet irradiation is performed to reduce the adhesive strength for fixing the element, no new loosening or elongation of the adhesive tape occurs, and no partial variation of the element gap occurs. Rather, the adhesive tape absorbs a slight slack or the like generated when the adhesive tape before the dicing treatment is bonded to a tape cutting frame or the like, so that there is no slack at all.

For this reason, no damage was caused to the element due to the contact between the adhesive tapes in the carrier cassette, and even in the step of picking up the element after irradiating the ultraviolet rays, the pick-up was not satisfactorily performed, and the processing was performed satisfactorily.

Measure the tape state after dicing and the tape state after ultraviolet irradiation, the pickup state after ultraviolet irradiation,
The results are shown in Table 2 below.

Example 2 As a film-like support of a radiation-curable adhesive tape,
A main layer (thickness: 60 μm) made of high-density polyethylene (same as in Example 1) was used as an intermediate layer, and an ethylene-vinyl acetate copolymer having a vinyl acetate content of 10% was formed on both sides of the main layer as sublayers, each having a thickness of 20 μm. A three-layer film having a thickness of 100 μm was prepared by a co-extrusion method.

Furthermore, in order to prevent blocking during storage of the film, when producing a film-like support, use a roller having fine irregularities on a forming roll on the side of the ethylene-vinyl acetate copolymer, which is a back surface of the support, to use the irregularities on the film surface. Was transferred to the mat surface.

Corona treatment is applied to the unmatted ethylene-vinyl acetate copolymer side of the three-layer film, and the same adhesive is applied thereon in the same manner as in Example 1 so as to have a dry thickness of 20 μm. Thus, a radiation-curable pressure-sensitive adhesive tape was obtained.

Example 3 As a film-like support of a radiation-curable pressure-sensitive adhesive tape,
A main layer (thickness: 40 μm) made of high-density polyethylene (same as in Example 1) was used as an intermediate layer, and an ethylene-vinyl acetate copolymer having a vinyl acetate content of 10% (thickness:
It was prepared by co-extrusion using low-density polyethylene (Petrocene 170R, manufactured by Tosoh Corporation) (thickness: 30 μm) for the back layer of the support.

A corona treatment is applied to the ethylene-vinyl acetate copolymer side of the film-like support, and the surface after drying has a thickness of 20%.
The composition was coated to a thickness of μm to obtain a radiation-curable pressure-sensitive adhesive tape.

Example 4 As a film-like support of a radiation-curable pressure-sensitive adhesive tape,
A main layer (thickness: 30 μm) made of high-density polyethylene (the same as in Example 1) was used as an intermediate layer, and an ionomer resin (Mitsui-Dupont Polychemical Co., Ltd.) was used as a sublayer on both sides.
Made of Himilan 1652) in a thickness of 20 μm
μm three-layer films were made by coextrusion.

This film was used as a base film, and the same adhesive was applied thereon in the same manner as in Example 1 so that the thickness after drying was 20 μm to obtain a radiation-curable pressure-sensitive adhesive tape.

Example 5 Polypropylene (trade name, manufactured by Nippon Petrochemical Co., Ltd., trade name: Nisseki Polypro F150J, Vicat softening point 151 ° C., molding shrinkage 1.5 to 1.5 mm) as a film-shaped support of the radiation-curable pressure-sensitive adhesive tape
A 100-μm-thick film was produced by a co-extrusion method in the same manner as in Example 1, except that the main layer (thickness: 2.0%) (thickness: 60 μm) was used as the intermediate layer.

This film was used as a base film, and Example 1 was formed thereon.
The same pressure-sensitive adhesive was applied in the same manner as in the above to a thickness of 20 μm after drying to obtain a radiation-curable pressure-sensitive adhesive tape.

Comparative Example 1 An ethylene-vinyl acetate copolymer having a thickness of 100 μm and a vinyl acetate content of 10% (Vicat softening point 78 ° C., molding shrinkage 1.25 to 1.
A radiation-curable pressure-sensitive adhesive tape was produced in the same manner as in Example 1 except that a single resin layer (5%) was used.

Comparative Example 2 A radiation-curable pressure-sensitive adhesive tape was used in the same manner as in Example 1, except that a single resin layer of high-density polyethylene (same as in Example 1) having a thickness of 100 μm was used as a film-like support of the radiation-curable pressure-sensitive adhesive tape. Was prepared.

The same test as in Example 1 was conducted on the radiation-curable pressure-sensitive adhesive tapes produced in Examples 2 to 5 and Comparative Examples 1 and 2. The results are shown in Tables 1 and 2 below.

As an additional test to the above test, the radiation-curable pressure-sensitive adhesive tape of Example 3 was forcibly slackened by applying a force after dicing to make the film sink up to about 3 mm from the center, but the same as in Example 1. After the irradiation with ultraviolet light for curing the adhesive, the slack of the film was absorbed and completely disappeared.

(Effects of the Invention) When the radiation-curable pressure-sensitive adhesive tape of the present invention is used for cutting a semiconductor wafer or the like, the impact received by the element cutting process using a rotating round blade, or the extension or loosening of the pressure-sensitive adhesive tape due to the weight of the semiconductor wafer itself Does not occur. In addition, even if irradiation is performed to reduce the element fixing adhesive force, the adhesive tape does not newly elongate or loosen, but rather occurs when the adhesive tape before dicing treatment is bonded to a tape cutting frame etc. It absorbs the slight slack that has occurred. Further, in the pressure-sensitive adhesive tape of the present invention, even if the elongation or loosening increases, the problem can be solved by increasing the heating time in irradiation with the radiation glands. Thus, the radiation-curable pressure-sensitive adhesive tape of the present invention has an excellent effect that it can be picked up favorably without occurrence of contact between the pressure-sensitive adhesive tapes and variations in element gaps in a carrier cassette used for transfer between processes. Play. Further, the pressure-sensitive adhesive tape can have excellent blocking resistance in a wound state.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical indication location C09J 7/02 JKK C09J 7/02 JKK JLE JLE H01L 21/301 H01L 21/78 M

Claims (3)

(57) [Claims] 1. A radiation-transmissive film comprising at least two different resin layers, wherein at least one resin layer has a Vicat softening point of at least 120 ° C. and a molding shrinkage of 0.5 to 3%. A radiation-curable pressure-sensitive adhesive tape comprising a support and a radiation-curable pressure-sensitive adhesive layer provided on one surface thereof. 2. The radiation-curable pressure-sensitive adhesive tape according to claim 1, wherein the resin layer having a Vicat softening point of at least 120 ° C. and a molding shrinkage of 0.5 to 3% is high-density polyethylene or polypropylene. 3. The radiation-curable pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive.
The radiation-curable pressure-sensitive adhesive tape according to claim 1, comprising 100 parts by weight and 5 to 500 parts by weight of at least one compound selected from the group consisting of a cyanurate compound having a carbon-carbon double bond and an isocyanurate compound.