JP2021132178A - Processing device - Google Patents

Abstract

To quickly wash the upper surface of a wafer.SOLUTION: A processing device 1 includes a chuck table 2 that holds a workpiece 15 on a holding surface 200, processing means 3 that processes the workpiece 15 held on the holding surface 200, and a first conveyance pad 608 that conveys the workpiece 15. In the processing device, by using the first conveyance pad 608 including water layer forming means 9 and an ultrasonic vibrator 50 provided on the first conveyance pad 608, water 51 is supplied to an upper surface 150 of the workpiece 15 from a water supply source 90 provided in the water layer forming means 9, and a water layer 52 is formed on the upper surface 150 of the workpiece 15; then, power is supplied to the ultrasonic vibrator 50 from a high frequency power source unit 5 to vibrate the ultrasonic vibrator 50 to propagate ultrasonic vibration, caused by the ultrasonic vibrator 50, to the water layer 52. Thus, the upper surface 150 of the workpiece 15 is washed by the water 51 of the water layer 52.SELECTED DRAWING: Figure 2

Description

The present invention relates to a processing apparatus.

A grinding device that grinds the upper surface of a wafer using a grinding wheel transfers the wafer to a spinner table using a transfer means after grinding, rotates the spinner table that holds the wafer at high speed, and cleans water on the upper surface of the wafer. Is supplied to remove the processing debris adhering to the upper surface of the wafer by the movement of the washing water subjected to the centrifugal force.
However, an uneven surface is formed on the upper surface of the wafer by grinding with a grinding wheel. Therefore, there is a case where the processing debris has entered the recess and the processing debris on the upper surface cannot be removed only by moving the washing water subjected to the centrifugal force.
Therefore, as disclosed in Patent Document 1, there is an invention in which cleaning water propagating ultrasonic vibration is ejected from a nozzle to clean the upper surface of a wafer.

Further, the spinner table provided in the apparatus for spin-cleaning the processed wafer has a spinner holding surface for holding the wafer. The work chips adhering to the lower surface of the wafer may also adhere to the spinner holding surface. Therefore, as disclosed in Patent Document 2, there is an invention of a processing apparatus provided with a wafer bottom surface cleaning means for removing stains adhering to the bottom surface of the wafer after processing.
In addition, work chips generated during grinding may adhere to the holding surface of the chuck table that holds the wafer for grinding the wafer. Therefore, as disclosed in Patent Document 3, there is an invention in which cleaning water is supplied to the holding surface to clean the holding surface.

JP-A-1999-031643 Japanese Unexamined Patent Publication No. 2016-051872 Japanese Unexamined Patent Publication No. 2011-200785

However, in cleaning by ejecting cleaning water, since the wafer is partially cleaned, there is a problem that work chips separated from the upper surface of the wafer reattach to the upper surface of the wafer and that cleaning takes time. Further, due to dust adhering to the upper surface of the wafer, dust caught between the upper surface of the wafer and the suction surface when the transport pad having a suction surface for sucking and holding the upper surface of the wafer sucks and holds the wafer. The wafer may be damaged. Therefore, there is a problem to be solved that the entire upper surface of the wafer before the wafer is carried into the holding surface of the chuck table and the entire upper surface of the wafer after processing are quickly cleaned.
Further, even if the lower surface of the wafer is cleaned by using the bottom surface cleaning means, dust remains on the lower surface of the wafer, and dust is caught between the lower surface of the wafer and the spinner holding surface, damaging the processed wafer. There's a problem. Therefore, there is a problem to be solved that the spinner holding surface is quickly cleaned.
Further, when the cleaning is partially carried out, there is a problem that the work debris separated from the holding surface due to the supply of the cleaning water reattaches to the holding surface. There is a problem to be solved that the entire surface of the holding surface is quickly cleaned.

The present invention comprises a chuck table that holds a work piece by a holding surface, a processing means that processes the work piece held on the holding surface, and a transport pad that holds and conveys the work piece. At least, the transport pad faces the water layer forming means for supplying water to the work piece to form a water layer on the upper surface of the work piece and the upper surface of the work piece. The upper surface of the work piece is cleaned by propagating the ultrasonic vibration oscillated from the ultrasonic vibrator to the water layer. It is a device.
In the present invention, a chuck table that holds a work piece by a holding surface, a processing means for processing the work piece held on the holding surface, a transport pad that holds and conveys the work piece, and a spinner. A processing device including at least a spinner table that holds the work piece by a holding surface and rotates the spinner holding surface to clean the work piece, and the transport pad provides water to the work piece. It is provided with an aqueous layer forming means for supplying and forming an aqueous layer on the upper surface of the workpiece, and an ultrasonic transducer arranged facing the spinner holding surface and landing on the aqueous layer.
This is a processing device that cleans the spinner holding surface by propagating ultrasonic vibrations oscillated from the ultrasonic vibrator to the aqueous layer.
The present invention includes at least a chuck table for holding a work piece by a holding surface, a processing means for processing the work piece held on the holding surface, and a transport pad for holding and transporting the work piece. In the processing device, the transport pad is a water layer forming means for supplying water to the holding surface to form a water layer on the holding surface, and water of the water layer arranged inside facing the holding surface. It is a processing apparatus including an ultrasonic vibrator that lands on water, and propagates the ultrasonic vibration oscillated from the ultrasonic vibrator to the water layer to clean the holding surface.
In the above-mentioned processing apparatus, the workpiece is supported by the ring frame via the tape by being attached to a tape attached to the ring frame so as to close the opening of the ring frame having an opening. The transport pad includes a holding portion for holding the ring frame, a plate on which the holding portion is arranged, and a water layer forming means for forming the water layer by supplying water from the lower surface of the plate. It is desirable that the plate is provided with ultrasonic vibrations that are arranged inside the plate, are exposed on the lower surface of the plate, and land on the water of the aqueous layer.
In the above-mentioned processing apparatus, the transport pad has a suction surface for sucking the upper surface of the work piece, and is arranged inside the water layer forming means for supplying water from the suction surface to form the water layer. It is desirable that the ultrasonic vibrator is provided so as to be exposed to the suction surface and land on the water of the aqueous layer.

Even if the workpiece is extremely dirty due to the slurry supplied between the polishing member and the workpiece adhering to the upper surface of the workpiece during CMP polishing, ultrasonic cleaning is performed. It becomes possible to remove dirt by performing.
Further, the holding surface of the chuck table can be ultrasonically cleaned, and the spinner holding surface can be ultrasonically cleaned.

It is a perspective view which shows the whole processing apparatus. It is sectional drawing which shows the state of cleaning the upper surface of the workpiece supported by a ring frame. FIG. 5 is a cross-sectional view showing a state in which the lower surface of the first transport pad is in contact with the upper surface of the work piece held by the holding surface. It is sectional drawing which shows the state of cleaning the upper surface of the workpiece held on the holding surface.

(First Embodiment)
1 Configuration of processing device The processing device 1 shown in FIG. 1 is a processing device that grinds a workpiece 15 using a grinding wheel 340. Hereinafter, the processing apparatus 1 will be described.
The workpiece 15 is attached to a tape 16 attached to the ring frame 17 so as to close the opening 171 of the ring frame 17 having the opening 171 and is supported by the ring frame 17 via the tape 16. There is.

As shown in FIG. 1, the processing apparatus 1 includes a base 10 extending in the Y-axis direction and a column 11 erected on the + Y direction side of the base 10.

A chuck table 2 is arranged on the base 10. The chuck table 2 includes a holding means 20 and a frame body 21 that supports the holding means 20. The upper surface of the holding means 20 is a holding surface 200 on which the workpiece 15 is held. The upper surface 210 of the frame 21 is formed flush with the holding surface 200.
A suction means or the like (not shown) is connected to the holding surface 200. When the workpiece 15 is placed on the holding surface 200, the generated suction force is transmitted to the holding surface 200 by exerting the suction force by using a suction means (not shown) or the like, and the holding surface 200 The work piece 15 is sucked and held.

Further, a cover 27 and a bellows 28 stretchably connected to the cover 27 are arranged around the chuck table 2. For example, when the chuck table 2 moves in the Y-axis direction, the cover 27 moves together with the chuck table 2 in the Y-axis direction, and the bellows 28 expands and contracts.

A vertical moving means 4 for supporting the processing means 3 so as to be able to move up and down is arranged on the side surface of the column 11 on the −Y direction side. The processing means 3 includes a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 31 that rotatably supports the spindle 30, a spindle motor 32 that rotationally drives the spindle 30 around the rotating shaft 35, and a spindle 30. An annular mount 33 connected to the lower end of the mount 33 and a grinding wheel 34 detachably attached to the lower surface of the mount 33 are provided.
The grinding wheel 34 includes a wheel base 341 and a plurality of substantially rectangular grinding wheels 340 arranged in an annular shape on the lower surface of the wheel base 341, and the lower surface of the grinding wheel 340 grinds the workpiece 15. The grinding surface is 342.

The vertical moving means 4 rotates the ball screw 40 having the rotating shaft 45 in the Z-axis direction, the pair of guide rails 41 arranged parallel to the ball screw 40, and the ball screw 40 around the rotating shaft 45. It includes a shaft motor 42, an elevating plate 43 in which an internal nut is screwed into a ball screw 40 and a side portion is in sliding contact with a guide rail 41, and a holder 44 which is connected to the elevating plate 43 and supports the processing means 3.

When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 rotates about the rotation shaft 45, the elevating plate 43 is guided by the guide rail 41 and moves up and down in the Z-axis direction. The processing means 3 held in the holder 44 moves in the Z-axis direction.

For example, a thickness measuring means 100 is arranged on the base 10. The thickness measuring means 100 includes, for example, a housing 103 arranged on the −X direction side of the base 10 of the processing apparatus 1. An upper surface height gauge 101 and a holding surface height gauge 102 are arranged on the side surface of the housing 103.
For example, the height of the upper surface 150 of the workpiece 15 is measured by bringing the probe of the upper surface height gauge 101 into contact with the upper surface 150 of the workpiece 15 while the workpiece 15 is held on the holding surface 200. Can be done.
Further, for example, by bringing the probe of the holding surface height gauge 102 into contact with the upper surface 210 of the frame body 21, the height of the holding surface 200 formed flush with the upper surface 210 of the frame body 21 can be measured.
Inside the housing 103, for example, a thickness calculating means having a CPU, a memory, etc. (not shown) is provided. The thickness calculating means has a function of calculating the thickness of the workpiece 15 based on the measured height value of the upper surface 150 of the workpiece 15 and the height value of the holding surface 200. There is.

A cassette mounting portion 12 is provided on the −Y direction side of the base 10.
A cassette 70 is mounted on the cassette mounting portion 12. The cassette 70 contains the workpiece 15 before grinding. Further, the cassette 70 can accommodate the workpiece 15 after the grinding process.

A robot 71 is arranged on the + Y direction side of the cassette 70. The robot 71 includes a holding means 710 and a shaft portion 711 that rotatably supports the holding means 710. The upper surface of the holding means 710 is a holding surface 712 on which the workpiece 15 is held. The workpiece 15 can be conveyed by taking out the workpiece 15 housed in the cassette 70 from the cassette 70 by using the holding means 710 and rotating the holding means 710 around the shaft portion 711. ..

A temporary placement area 13 in which the workpiece 15 before grinding is temporarily placed is arranged on the + X direction side in the range of motion of the holding means 710, and on the −X direction side in the range of motion of the holding means 710. A cleaning region 14 for cleaning the workpiece 15 after grinding is provided.

Alignment means 72 is arranged in the temporary storage area 13. The workpiece 15 carried out from the cassette 70 and placed on the temporary storage area 13 is aligned at a predetermined position by the alignment means 72.

A spinner cleaning means 73 is provided in the cleaning region 14. The spinner cleaning means 73 includes a spinner table 730 in which the workpiece 15 is held, and a cleaning water supply nozzle 731 that ejects cleaning water toward the workpiece 15 held in the spinner table 730. The upper surface of the spinner table 730 is a spinner holding surface 732 on which the workpiece 15 is held.
For example, the workpiece 15 after grinding can be placed on the spinner holding surface 732 of the spinner table 730, and the workpiece 15 can be cleaned by supplying cleaning water from the cleaning water supply nozzle 731. can.

At a position adjacent to the temporary placement area 13, a first transport pad 608 that carries the workpiece 15 aligned by the alignment means 72 into the chuck table 2 is arranged.
The first transport pad 608 includes a disk-shaped plate 67 and an arm 61 for vertically suspending the plate 67. A tubular shaft portion 610 having a rotation shaft 65 in the Z-axis direction is connected to the end portion of the arm 61. For example, a rotating means (not shown) for rotating the shaft portion 610 around the rotating shaft 65 is connected to the shaft portion 610.
By rotating the shaft portion 610 around the rotating shaft 65 using a rotating means (not shown) or the like, the arm 61 connected to the shaft portion 610 rotates around the rotating shaft 65.

An annular member 62 is connected to the end of the arm 61 on the side not connected to the shaft portion 610. For example, three through holes 620 are formed through the annular member 62 at equal intervals on the circumference, and a screw 63 (only one is shown in FIG. 1) penetrates through each of the through holes 620. Then, it is further screwed into the plate 67. The brim portion of the screw 63 is formed to have a diameter larger than that of the through hole 620, and the screw 63 is suspended from the annular member 62 together with the plate 67 in a state where the lowering range thereof is limited.

Further, the first transport pad 608 includes a shaft portion 64 that penetrates the opening of the annular member 62 and is connected to the plate 67.
As shown in FIG. 2, a through hole 640 is formed through the shaft portion 64 in the Z-axis direction.

The plate 67 includes a support member 68 connected to the shaft portion 64 and a central member 69 arranged on the lower surface 681 of the support member 68. Through holes 680 and through holes 690 are formed through the support member 68 and the center member 69, respectively, in the Z-axis direction.
For example, it is assumed that the through holes 640, 680, and 690 have the same diameter and are arranged linearly in the Z-axis direction.

Inside the central member 69, a plurality of ultrasonic vibrators 50 are arranged so that their lower portions are exposed from the lower surface 691 of the central member 69. A high frequency power supply unit 5 is connected to the ultrasonic vibrator 50. The ultrasonic vibrator 50 can be vibrated by supplying electric power from the high frequency power supply unit 5 to the ultrasonic vibrator 50.

A suction cup-shaped holding portion 66 for holding the ring frame 17 is provided on the lower surface 681 of the support member 68 of the plate 67.
The holding portion 66 is connected to the suction source 80 via the suction path 82. The suction path 82 is provided with a suction valve 81 that switches the communication state between the suction source 80 and the holding portion 66.
When the suction source 80 is operated while the suction valve 81 is open, the suction source 80 exerts a suction force, and the suction force generated by the suction source 80 is transmitted to the lower surface 660 of the holding portion 66 through the suction path 82. Will be done.

For example, by operating the suction source 80 in a state where the upper surface 170 of the ring frame 17 is in contact with the holding portion 66 and transmitting the suction force generated by the suction source 80 to the holding portion 66, the holding portion 66 The ring frame 17 can be sucked and held.
For example, in a state where the lower surface 660 of the holding portion 66 is in contact with the upper surface 170 of the ring frame 17, the lower surface 660 of the holding portion 66 is further pressed against the upper surface 170 of the ring frame 17 to operate the suction source 80. At least, the ring frame 17 may be attracted to the holding portion 66.

The first transport pad 608 includes an aqueous layer forming means 9. The water layer forming means 9 includes a water supply source 90 and a flow path 92 connecting the water supply source 90 and the shaft portion 64. The flow path 92 is provided with a water valve 91 that switches the communication state between the water supply source 90 and the shaft portion 64.
For example, when the water valve 91 is opened and the water 51 is supplied from the water supply source 90 while the ring frame 17 supporting the workpiece 15 is held by the holding portion 66, the water 51 passes through the flow path 92. It is supplied to the shaft portion 64 through the shaft portion 64, further passes through the through hole 640 of the shaft portion 64, the through hole 680 of the support member 68, and the through hole 690 of the central member 69, and is centered from the through hole 690 of the central member 69. It is supplied between the lower surface 691 of the member 69 and the upper surface 150 of the workpiece 15. As a result, the water layer 52 is formed on the upper surface 150 of the workpiece 15.

When the water layer 52 is formed on the upper surface 150 of the workpiece 15, it is assumed that the ultrasonic vibrator 50 exposed from the lower surface 691 of the central member 69 has landed on the water 51 of the water layer 52. ..

As shown in FIG. 1, a second transport pad 609 is arranged on the −X direction side of the first transport pad 608. Since the second transport pad 609 has the same configuration as the first transport pad 608, the same reference numerals are given and the description thereof will be omitted.

The processing device 1 is not limited to the single-screw grinding device shown in FIG. 1, and may be a multi-screw grinding device, a polishing device, or a cutting device.

2 Operation of the processing device The operation of the processing device 1 when grinding the work piece 15 and cleaning the upper surface 150 of the work piece 15 using the above processing device 1 will be described below.
First, using the robot 71 shown in FIG. 1, one of the workpieces 15 housed in the cassette 70 is pulled out and placed in the temporary placement area 13. When the work piece 15 is placed on the temporary placement area 13, the work piece 15 is aligned by the positioning means 72.

After aligning the workpiece 15 with the alignment means 72, the workpiece 15 is placed on the holding surface 200 of the chuck table 2 using the first transport pad 608 to operate the suction means and the like (not shown). Let me. As a result, the generated suction force is transmitted to the holding surface 200, and the workpiece 15 is sucked and held on the holding surface 200.

Then, with the workpiece 15 being sucked and held by the holding surface 200, the chuck table 2 is moved in the + Y direction and positioned below the machining means 3.
Next, the chuck table 2 is rotated around the rotating shaft 25 by using the rotating means 24 to rotate the workpiece 15 held on the holding surface 200, and the rotating shaft 35 is rotated by using the spindle motor 32. The grinding wheel 340 is rotated around the axis.

In a state where the workpiece 15 is rotating about the rotation shaft 25 and the grinding wheel 340 is rotating about the rotating shaft 35, the grinding wheel 340 is moved to −Z by using the vertical moving means 4. By lowering in the direction, the grinding surface 342 of the grinding wheel 340 is brought into contact with the upper surface 150 of the workpiece 15. The workpiece 15 is ground by further lowering the grinding wheel 340 in the −Z direction while the grinding surface 342 is in contact with the upper surface 150 of the workpiece 15.

During the grinding process of the workpiece 15, the thickness of the workpiece 15 is measured by using the thickness measuring means 100. When the workpiece 15 is ground to a predetermined thickness, the grinding process is completed.

After the grinding process, the chuck table 2 is moved in the −Y direction using a Y-axis moving means (not shown) to position the chuck table 2 within the movable range of the second transport pad 609.

Then, the ring frame 17 is sucked and held by using the second transport pad 609 shown in FIG. With the ring frame 17 being sucked and held by the second transport pad 609, the water valve 91 is opened to supply water 51 from the water supply source 90. As a result, water 51 is supplied from the through holes 690 to the upper surface 150 of the workpiece 15 through the through holes 640, 680, and 690.
By supplying the water 51 to the upper surface 150 of the work piece 15, the water 51 is deposited on the upper surface 150 of the work piece 15, and the water layer 52 is formed on the upper surface 150 of the work piece 15. As a result, the plurality of ultrasonic vibrators 50 exposed from the lower surface 691 of the central member 69 in the −Z direction side land on the water layer 52.

In this state, the high frequency power supply unit 5 is operated to supply electric power to the ultrasonic vibrator 50. As a result, ultrasonic vibration is oscillated from the ultrasonic vibrator 50, the ultrasonic vibration is propagated to the water layer 52, and the upper surface 150 of the workpiece 15 is washed by the vibration of the water 51 of the water layer 52.

When this processing apparatus is used, for example, the slurry supplied between the polishing member and the workpiece 15 during CMP polishing or the like adheres to the upper surface 150 of the workpiece 15, and the workpiece 15 is severely affected. Even if it is in a dirty state, it is possible to remove the dirt by cleaning with ultrasonic waves.
Further, since the upper surface 150 can be cleaned while the workpiece 15 after the grinding process is conveyed by using the second conveying pad, the time required for cleaning can be shortened.

Further, by operating the processing device 1 in the same manner, the spinner holding surface 732 of the spinner table 730 and the holding surface 200 of the chuck table 2 can be ultrasonically cleaned.

The first transport pad 608 provided in the processing apparatus 1 may include a suction unit 600 and a frame body 601 for supporting the suction unit 600, as shown in FIG. 3, instead of the plate 67 described above.
The upper portion of the frame body 601 is connected to the shaft portion 64 and is suspended from the shaft portion 64. The suction unit 600 has a suction surface 604 that sucks the upper surface 150 of the workpiece 15. Through holes 602 and through holes 603 are formed through the suction portion 600 and the frame body 601 in the Z-axis direction, respectively.
Further, for example, it is assumed that the through holes 640, 602, and 603 have the same diameter and are formed in a straight line in the Z-axis direction.

The chuck table 2 is supported by the base 22. A rotating means 24 is arranged inside the base 22. The rotating means 24 includes a motor or the like (not shown), and the base 22 can be rotated about the rotating shaft 25 in the Z-axis direction. When the base 22 is driven by the rotating means 24 and rotates about the rotating shaft 25, the chuck table 2 supported by the base 22 rotates about the rotating shaft 25.

Further, it is assumed that the protective tape 18 is attached to the lower surface 151 of the workpiece 15.

When cleaning the upper surface 150 of the workpiece 15 using the processing apparatus 1, first, as shown in FIG. 4, the upper surface of the workpiece 15 is suction-held by the holding surface 200 of the chuck table 2. The second transport pad 609 is positioned above the 150.

Next, the water valve 91 is opened to supply water 51 from the water supply source 90. The water 51 supplied from the water supply source 90 passes through the through holes 640, 603, and 602, and is supplied from the suction surface 604 to the upper surface 150 of the workpiece 15. Water 51 is supplied from the water supply source 90 to the upper surface 150 of the workpiece 15, and the water 51 is deposited on the upper surface 150 of the workpiece 15, so that the water layer 52 is formed on the upper surface 150 of the workpiece 15. Will be done.
When the water layer 52 is formed on the upper surface 150 of the workpiece 15, the ultrasonic vibrator 50 exposed without protruding from the suction surface 604 is in a state of landing on the water layer 52.
That is, since the exposed surface of the ultrasonic vibrator 50 exposed on the suction surface 604 is flush with the suction surface 604 or recessed from the suction surface 604, when the workpiece 15 is sucked and held by the suction surface 604. It does not damage the workpiece 15.

A water layer 52 is formed on the upper surface 150 of the workpiece 15, and the high frequency power supply unit 5 is operated in a state where the ultrasonic vibrator 50 is landing on the water layer 52 to form the ultrasonic vibrator 50. Supply power. As a result, ultrasonic vibration is oscillated from the ultrasonic vibrator 50, the ultrasonic vibration is propagated to the water layer 52, and the upper surface 150 of the workpiece 15 is washed by the vibration of the water 51 of the water layer 52.

By using the processing device 1 having such a configuration, the work piece 15 can be cleaned by ultrasonic cleaning to remove the dirt on the work piece 15. Further, by operating the processing device 1 in the same manner, the holding surface 200 of the chuck table 2 can be ultrasonically cleaned, and further, the spinner holding surface 732 can be ultrasonically cleaned.

1: Processing equipment 10: Base 11: Column 12: Cassette mounting part 13: Temporary placement area 14: Cleaning area 100: Thickness measuring means 101: Top surface height gauge 102: Holding surface height gauge 103: Housing 2: Chuck table 20: Suction Part 200: Holding surface 21: Frame 210: Top surface of frame 22: Base 24: Rotating means 25: Rotating shaft 27: Cover 28: Bellows 3: Machining means 30: Spindle 31: Housing 32: Spindle motor 33: Mount 34: Grinding wheel 340: Grinding grindstone 342: Grinding surface 341: Wheel base 35: Rotating shaft 4: Vertical movement means 40: Ball screw 41: Guide rail 42: Z-axis motor 43: Elevating plate 44: Holder 45: Rotating shaft 5 : High frequency power supply unit 50: Ultrasonic transducer 51: Water 52: Water layer 608: First transfer pad 609: Second transfer pad 600: Suction unit 601: Frame 602: Through hole 603: Through hole 604: Suction surface 61 : Arm 610: Shaft 62: Ring member 620: Through hole 63: Screw 64: Shaft 640: Through hole 65: Rotating shaft 66: Holding part 660: Lower surface of holding part 67: Plate 68: Support member 681: Support member Lower surface 680: Through hole 69: Central member 691: Lower surface of central member 690: Through hole 70: Cassette 71: Robot 710: Robot hand 712: Holding surface 711: Shaft 72: Alignment means 73: Spinner cleaning means 730: Spinner table 732: Spinner holding surface 731: Washing water supply nozzle 80: Suction source 81: Suction valve 82: Suction path 9: Water layer forming means 90: Water supply source 91: Water valve 92: Flow path 15: Work piece 150 : Upper surface of the workpiece 151: Lower surface of the workpiece 18: Protective tape 16: Tape 17: Ring frame 170: Upper surface of the ring frame 171: Opening of the ring frame

Claims (5)

A processing device including at least a chuck table for holding a work piece by a holding surface, a processing means for processing the work piece held on the holding surface, and a transport pad for holding and transporting the work piece. And
The transport pad is arranged to face the upper surface of the workpiece and the aqueous layer forming means for supplying water to the workpiece to form an aqueous layer on the upper surface of the workpiece and landing on the aqueous layer. Equipped with an ultrasonic vibrator that makes water
A processing device that cleans the upper surface of the work piece by propagating ultrasonic vibrations oscillated from the ultrasonic vibrator to the water layer. The chuck table that holds the work piece by the holding surface, the processing means that processes the work piece held on the holding surface, the transport pad that holds and conveys the work piece, and the spinner holding surface. A processing device including at least a spinner table that holds a work piece and rotates the spinner holding surface to clean the work piece.
The transport pad is arranged to face the spinner holding surface and the water layer forming means for supplying water to the work piece to form a water layer on the upper surface of the work piece, and land on the water layer. Equipped with an ultrasonic transducer,
A processing device that cleans the spinner holding surface by propagating ultrasonic vibrations oscillated from the ultrasonic vibrator to the aqueous layer. A processing device including at least a chuck table for holding a work piece by a holding surface, a processing means for processing the work piece held on the holding surface, and a transport pad for holding and transporting the work piece. hand,
The transport pad is an aqueous layer forming means for supplying water to the holding surface to form an aqueous layer on the holding surface, and ultrasonic waves arranged inside facing the holding surface and landing on the water of the aqueous layer. Equipped with a vibrator,
A processing device that cleans the holding surface by propagating ultrasonic vibrations oscillated from the ultrasonic vibrator to the aqueous layer. The work piece is supported by the ring frame via the tape by being attached to a tape attached to the ring frame so as to close the opening of the ring frame having an opening.
The transport pad includes a holding portion that holds the ring frame, a plate on which the holding portion is arranged, a water layer forming means that supplies water from the lower surface of the plate to form the water layer, and the plate. It is provided with ultrasonic vibration, which is arranged inside the plate and is exposed on the lower surface of the plate and landed on the water of the aqueous layer.
The processing apparatus according to any one of claims 1, 2, and 3. The transport pad has a suction surface that sucks the upper surface of the work piece, the water layer forming means that supplies water from the suction surface to form the water layer, and the water layer forming means that is arranged inside and exposed to the suction surface. The ultrasonic transducer, which landed on the water of the aqueous layer, is provided.
The processing apparatus according to any one of claims 1, 2, and 3.

Images