JP2010248277A - Heat-conductive resin paste and optical disk device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-conductive resin paste, maintaining flexibility after curing polymerization, for alleviating thermal deterioration derived from heat generation of an optical pickup light source, and to provide an optical disk device using the same. <P>SOLUTION: The heat-conductive resin paste includes a curable base resin and heat-conductive particles. The curable base resin includes a bifunctional group epoxy monomer having two functional oxirane rings in one molecule, a monofunctional epoxy monomer having a functional oxirane ring in one molecule, and an antioxidant, the compounding weight ratio of the respective materials being about 2:8:3. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a thermally conductive resin paste that functions as a medium for releasing heat of a heating element to other peripheral members, and an optical disk device using the same.

  Various optical disks such as DVD, CD-R and CD-RW have been developed as optical recording media. In a DVD, information is recorded or reproduced by a laser beam having a wavelength of about 650 nm, whereas in a CD-R or CD-RW, information is recorded or reproduced by a laser beam having a wavelength of about 780 nm. In order to record and reproduce information with high accuracy, it is a necessary condition that there is no deviation of the optical axis of the light source.

  In such an optical disc apparatus that records or reproduces information on a plurality of types of optical discs, the light source temperature rises to about 80 ° C. due to heat generated by the light source of the optical pickup mounted on the optical disc apparatus. Therefore, the heat of the light source is released to the coupling base.

  For example, a silicone grease having thermal conductivity is applied to the gap between the light source and the coupling base, and the heat generated by the light source is conducted to the coupling base. At this time, the light source and the bonding base are fixed with a bonding material, but the silicone-based heat conductive grease maintains flexibility even during curing polymerization or expansion / contraction after curing polymerization. The stress that shifts the optical axis was not applied to the bonding material.

  However, a “pumping out phenomenon” in which silicone oil as a medium bleeds with time has occurred. Therefore, after oil bleed, the function of conducting heat of the heating element that rises to about 80 ° C. cannot be performed sufficiently, and there is a risk of causing problems in the apparatus.

  Therefore, conventionally, a thermally conductive epoxy resin in which a thermally conductive material is blended with a curable epoxy resin has been used (see, for example, Patent Document 1).

Japanese Patent No. 1943804

  However, in the conventional technique, the following problems have occurred.

  In other words, the conventional thermally conductive epoxy resin is rigid and inflexible after curing polymerization, and the epoxy resin deteriorates due to the heat generated by the light source of the optical pickup and the hardness increases, so that the optical axis of the light source is shifted. There is a problem that the heat conductive epoxy resin may be peeled off from the adherend, or may be coherently broken inside the heat conductive epoxy resin, causing a problem in the heat conduction function and difficult to adopt. .

  Therefore, the present invention has been made in view of the above-described problems, and has a flexibility after curing polymerization and a thermal conductive resin paste that reduces thermal deterioration due to heat generation of an optical pickup light source and an optical disk using the same An object is to provide an apparatus.

  The present invention has been made to solve the above problems, and is a thermally conductive resin paste containing a curable base resin and thermally conductive particles, wherein the curable base resin is functional in one molecule. A bifunctional epoxy monomer having two functional oxirane rings, a monofunctional epoxy monomer having one functional oxirane ring in one molecule, and an antioxidant in a weight ratio of about 2: 8: 3. Features.

  Thereby, it has a softness | flexibility after hardening polymerization, and can reduce the thermal deterioration by heat_generation | fever of an optical pick-up light source.

The perspective view which shows the optical pick-up using the heat conductive resin paste in one embodiment of this invention The disassembled perspective view which shows the optical pick-up using the heat conductive resin paste in one embodiment of this invention The perspective view which shows the light source of the optical pick-up using the heat conductive resin paste in one embodiment of this invention The perspective view which shows the light source of the optical pick-up using the heat conductive resin paste in one embodiment of this invention The figure which shows the assembly method of the optical pick-up using the heat conductive resin paste in one embodiment of this invention. The figure which shows the assembly method of the optical pick-up using the heat conductive resin paste in one embodiment of this invention. The figure which shows the optical disk apparatus carrying the optical pick-up using the heat conductive resin paste in one embodiment of this invention The figure which shows the mounting method of the optical pick-up using the heat conductive resin paste in one embodiment of this invention The figure which shows the relationship between the ratio of the monofunctional group epoxy monomer in the monomer, and the Young's modulus of the thermally conductive resin paste The figure which shows the relationship between the compounding ratio of the antioxidant mix | blended with respect to 100 weight part of total epoxy monomers, and the Young's modulus of heat conductive resin paste hardened | cured material. The figure which shows the relationship between each system of antioxidant at the time of mix | blending 30 weight part of antioxidant mix | blended with respect to 100 weight part of total epoxy monomers, and the Young's modulus of heat conductive resin paste hardened | cured material Diagram showing the relationship between the type of curing agent and the storage stability of the thermal conductive resin paste

  The invention described in claim 1 is a heat conductive resin paste containing a curable base resin and heat conductive particles, and the curable base resin has two functional oxirane rings in one molecule. It is characterized by comprising a functional group epoxy monomer, a monofunctional group epoxy monomer having one functional oxirane ring in one molecule, and an antioxidant in a blending weight ratio of about 2: 8: 3. As a result, the addition of the monofunctional epoxy monomer to the bifunctional epoxy monomer at a high concentration of several tens of times the general addition amount breaks the polymer chain and makes the heat conductive resin paste flexible. Therefore, the hardness of the thermally conductive resin paste after the curing polymerization can be made to have a predetermined flexibility or less. In addition, the blending weight ratio of the bifunctional epoxy monomer and the monofunctional epoxy monomer is set to about 2: 8, the ratio of the monofunctional epoxy monomer is suppressed, and a three-dimensional structure is formed by a polymer chain with the bifunctional epoxy monomer. Therefore, the gelled state of the heat conductive resin paste after the curing process is maintained, and fluidization of the heat conductive resin paste can be prevented. As a result, even after the heat conductive resin paste is cured and cured, the angle of the light source, which is a heating element, can be adjusted by maintaining the flexibility of the heat conductive resin paste itself and the adhesion to the adherend. It becomes possible to sufficiently conduct the heat of the heating element without obstructing and preventing fluidization of the heat conductive resin paste. In addition, since the epoxy resin generally has a low curing shrinkage rate, it is possible to avoid a phenomenon that cuts off the heat flow path such as interfacial peeling from the adherend and cohesive failure of the resin itself due to the curing shrinkage.

  Furthermore, the composition weight ratio of the total epoxy monomer and the antioxidant is approximately 10: 3, and the curing polymerization is carried out by blending the antioxidant with respect to the epoxy monomer at a high concentration of several tens to several hundred times the general addition amount. Even if the later heat conductive resin paste is exposed to heat generated from a light source as a heating element for a long period of time, deterioration due to material oxidation is suppressed, the flexibility of the heat conductive resin paste itself and adhesion to the adherend The reliability can be significantly improved.

  According to the second aspect of the present invention, in the antioxidant, the mixing weight ratio of the first antioxidant having a radical scavenging action and the second antioxidant having a peroxide decomposing action is set to about 1: 2. It is characterized by this. As a result, radicals generated by the primary oxidation of the curable base resin are captured and invalidated. Furthermore, by adding the second antioxidant approximately twice as much as the first antioxidant, the generated peroxide is decomposed into harmless substances, and new radicals and peroxides are generated continuously and continuously. It is possible to block the strong oxidation mechanism of typical secondary oxidation.

  The invention described in claim 3 is characterized in that the antioxidant contains a phenol-based antioxidant, a phosphite-based antioxidant, and a sulfur-based antioxidant. Each system of phenolic antioxidant, phosphite antioxidant, sulfur antioxidant, or a mixture of two systems is insufficient in antioxidant effect, and the best antioxidant effect is exhibited by mixing three systems. In the three-system mixing, first, the phenolic antioxidant captures and invalidates radicals generated by the primary oxidation of the curable base resin. Furthermore, it is possible to decompose the peroxide generated by the phosphite-based antioxidant and the sulfur-based antioxidant into harmless substances and prevent a secondary oxidation chain mechanism in which new radicals are generated.

  The invention according to claim 4 is characterized in that the blending weight ratio of the phenolic antioxidant, the phosphite antioxidant and the sulfur antioxidant is set to approximately 1: 1: 1. As a result, the chain mechanism of primary oxidation and secondary oxidation is cut off most efficiently. In particular, since the antioxidant of sulfur is slower than that of phosphite, the decomposition rate of peroxide is low. Has a synergistic effect of preventing the oxidation for a long period of time, and the stable antioxidant ability can be improved.

  The invention according to claim 5 is characterized in that the antioxidant is compatible with a mixture containing a bifunctional epoxy monomer and a monofunctional epoxy monomer. As a result, since the antioxidant is uniformly dispersed in the mixture of the bifunctional epoxy monomer and the monofunctional epoxy monomer, there is no variation in the flexibility of the heat conductive paste, and a stable flexibility is obtained. Can do.

  The invention according to claim 6 is characterized in that the curable base resin further includes a latent curing agent, and the bifunctional epoxy monomer is blended with an epoxy monomer classified into bisphenol A type or bisphenol F type. The curing agent is a polyamine-based curing agent in which the curing agent active part is masked with a phenol group. As a result, the polyamine-based curing agent in which the active part of the curing agent is masked with a phenol group has high curing reactivity with a bisphenol A type or bisphenol F type bifunctional epoxy monomer. A structure can be formed.

  The invention according to claim 7 is characterized in that the monofunctional epoxy monomer has a low crystallization grade. Thereby, in long-term storage of the thermally conductive resin paste before curing polymerization, the monofunctional epoxy monomer and the bifunctional epoxy monomer cause a crystallization reaction due to a change in storage temperature, and prevent crystal precipitation or crystal precipitation. It becomes possible to keep dispersibility stable.

  The invention according to claim 8 is characterized in that the heat conductive resin paste is blended with a dispersant. Thereby, the dispersibility of particle | grains increases, Therefore The viscosity of a resin paste falls and it can increase the discharge amount by a dispenser. In addition, it has a great effect in improving the wettability on the substrate and controlling the fluidity of the resin.

  The invention according to claim 9 is characterized in that the thermally conductive resin paste has a viscosity before curing polymerization of 5 Pa · s to 150 Pa · s (25 ° C.). Thereby, when discharging the heat conductive resin paste before hardening from the dispenser which has the injection tool of a small diameter nozzle, it becomes possible to improve discharge amount stability without nozzle clogging.

  A tenth aspect of the present invention is an optical disc apparatus comprising: a light source that emits laser light; and a coupling base that regulates and fixes the position of the light source, and the thermally conductive resin according to any one of the first to ninth aspects. The light source and the coupling base are fixed by a paste. As a result, even when exposed to the heat generated from the light source for a long period of time, deterioration due to material oxidation is suppressed, the thermal conductive resin paste itself remains flexible and adherent to the adherend, and is more resistant to impact. The heat generated by the light source can be released to the coupling base with high reliability.

  Embodiments of the present invention will be described below.

(Embodiment 1)
1 and 2 are a perspective view and an exploded perspective view showing an optical pickup using a heat conductive resin paste according to an embodiment of the present invention.

  1 and 2, the light source 1, the light receiving element 2, and the optical members 4 and 5 are respectively joined to the coupling base 3. Between the light source 1 and the optical members 4 and 5, there is a through hole 3a provided in the coupling base 3, and the light emitted from the light source 1 passes through the through hole 3a and enters the optical members 4 and 5. The light emitted from the optical member 5 is applied to an optical disc (not shown) through at least a light collecting means such as an objective lens (not shown), and performs predetermined information recording on the optical disc.

  The light reflected from the optical disk passes through at least the objective lens and is incident on the optical member 5, and after being reflected one or more times inside the optical member 5, is incident on the light receiving element 2. In the light receiving element 2, incident light is converted into an electric signal, and the electric signal is sent to a circuit section of a signal generation system, which generates a tracking error signal, a focus error signal, an RF signal, etc. Based on the signal, tracking control and focus control of the optical pickup are performed, and desired information is generated from the RF signal.

  The light source 1 is attached from the rear part of the coupling base 3, and is attached to the coupling base 3 so that the light emitting part at the tip of the light source 1 and the optical member 4 attached to the coupling base 3 face each other. The light incident surface of the light receiving element 2 faces at least the side part of the optical member 5, and the optical member 4 faces the bottom of the optical member 5.

  Hereinafter, each part will be described in detail.

  First, the light source 1 will be described.

  3 and 4 are perspective views showing a light source of an optical pickup using the heat conductive resin paste in one embodiment of the present invention.

  As the light source 1, for example, a frame laser light source shown in FIGS. 3 and 4 is preferably used. The frame laser light source as the light source 1 is configured to cover a part of the plate 6 with a mold member 7. As the plate 6, a metal plate such as Cu, Cu alloy, Ag, Ag alloy, Al, Al alloy, Fe, Fe alloy or the like is preferably used, and more preferably, soldering is performed on the plate. It is preferable to coat a good material by means such as plating or vapor deposition. In the present embodiment, the plate-like body is made of a metal material. However, a material having good thermal conductivity and high conductivity other than the metal material, such as a conductive ceramic, can be used. In the present embodiment, the plate 6 is provided with side portions 6a and 6b protruding in both directions, and the side portions 6a and 6b are provided so as to promote heat dissipation or are attached to other members. It is provided to improve.

  A semiconductor laser element 9 is provided on the plate 6 via a submount 8 having an insulating portion, and the upper surface of the semiconductor laser element 9 is electrically connected to the plate 6 by a wire such as Au. At this time, the light emitting surface of the semiconductor laser element 9 is disposed above the frame laser light source. The base of the submount 8 is made of an insulating material. Separate electrodes 11 and 12 are formed on the surface of the submount 8 on which the semiconductor laser element 9 is formed. The semiconductor laser element 9 is formed on the electrodes 11 and 12. Electrically joined.

  The semiconductor laser element 9 is configured to emit light of one to a plurality of different wavelengths in a monoblock, that is, one block. In the present embodiment, the semiconductor laser element 9 that emits a laser beam having a wavelength of about 650 nm (for example, DVD system) and a laser beam having a wavelength of about 780 nm (CD system) is used. The light emitted from the semiconductor laser element 9 may be one, or three or more lights having different wavelengths may be irradiated. The optical pickup according to the present embodiment is particularly suitable when using a plurality of semiconductor laser elements 9 that emit light having different wavelengths. In the present embodiment, when a plurality of lights having different wavelengths are emitted, a monoblock is used as the semiconductor laser element 9. However, the semiconductor laser element 9 emits a light beam having one wavelength in one block. May be mounted on a plurality of plates 6 to emit a plurality of lights having different wavelengths. In this case, there is a possibility that the size of the light source 1 is increased. However, since the semiconductor laser element 9 that emits light beams having arbitrary different wavelengths can be mounted, it is configured to emit a plurality of light beams having significantly different wavelengths. Is easy.

  The terminal portion 13 is formed integrally with the plate 6. That is, the plate 6 and the terminal portion 13 are electrically connected. The terminal portions 14 and 15 are provided separately from the plate 6 and the terminal portion 13, and are fixed to each other by the mold member 7. An end portion of the terminal portion 14 is electrically joined to the electrode 12 via a conductive wire 16, and the terminal portion 15 is electrically joined to the electrode 11 via a wire 17.

  For example, the semiconductor laser element 9 emits a light beam that performs at least one of information recording / reproduction with respect to a DVD optical disk and a light beam that performs at least one of information recording / reproduction with respect to a CD optical disk. The terminal unit 13 is connected to the ground, the terminal unit 14 is connected to a circuit that supplies a current that emits a DVD-type light beam, and the terminal unit 15 supplies a current that emits a CD-type light beam. Connected to the circuit. That is, when a DVD-type light beam is emitted, for example, current flows in the order of the terminal portion 14, the wire 16, the electrode 12, the semiconductor laser element 9, the wire 10, the plate 6, and the terminal portion 13. When emitting a CD-type light beam, for example, current flows in the order of the terminal portion 15, the wire 17, the electrode 11, the semiconductor laser element 9, the wire 10, the plate 6, and the terminal portion 13.

  The coupling base 3 is preferably formed of a material having relatively light weight, high precision shape workability, heat dissipation, etc., for example, Zn, Zn alloy, Al, Al alloy, Ti, Ti alloy, etc. Preferably used. In the present embodiment, the bonding base 3 is configured by low-cost Zn die casting.

  An assembly method of the optical pickup configured as described above will be described with reference to FIGS.

  5 and 6 are diagrams illustrating an optical pickup assembling method using the heat conductive resin paste in one embodiment of the present invention.

  As shown in FIG. 5, the light source 1 is inserted into the space portion 35 from the bottom side of the coupling base 3, and the side portions 6 b and 6 a are disposed in the gaps 38 and 40. The light receiving element 2 is also brought into contact with the attachment portions 23 and 24 on the side wall, and an ultraviolet curable adhesive is applied to at least one surface of the light receiving element 2 or the attachment portion. Then, the balance adjustment is performed by causing the light source 1 to emit light and moving in the X-axis direction, and the light receiving element 2 is also moved in the Y-axis and Z-axis directions to perform height adjustment and S-shaped adjustment.

  Each member is adjusted to a predetermined position, and in the positional relationship between the light source 1 and the light receiving element 2, the light from the light source 1 is reliably guided to the optical disk, and the light from the optical disk is incident on the light receiving element 2. If it is almost confirmed, an ultraviolet curing adhesive of acrylic resin is applied between the light source 1 and the coupling base 3, and the light source 1 is moved along the Z axis shown in FIG. Performs defocus adjustment of light used for DVD. When the defocus adjustment is completed, ultraviolet light is irradiated to temporarily fix the light source 1 and the coupling base 3. At this time, the ultraviolet curable adhesive is applied to at least one of the side portions 6 a and 6 b or the joint portions 41 and 42. Further, the position adjustment of the light source 1 is performed while observing by visual recognition or image recognition by an automatic machine.

  The light source 1 and the coupling base 3 may be temporarily fixed by mechanical fixing. In this case, there are a method of pressurizing the mold part 7 of the light source 1 and a method of clamping the terminal parts 13, 14 and 15 of the light source 1.

  When the light source 1 and the coupling base 3 are temporarily fixed, as shown in FIG. 6, an organic material such as an epoxy resin adhesive, an instantaneous adhesive, or an ultraviolet curable adhesive is formed in the boundary region between the protrusions 36, 37, 39 and the plate 6. A bulk material (including powder and granules) such as an adhesive is supplied, and the light source 1 and the coupling base 3 are permanently fixed.

  After the main fixing of the light source 1 and the coupling base 3, as shown in FIG. 6, the thermal conductive resin paste 100 having a high thermal conductivity of the present invention is connected to the side portions 6a and 6b of the plate 6 of the light source 1 and the coupling base 3. It is applied by using an injection tool having a small nozzle inner diameter so as to be joined, and fixed by room temperature curing or thermosetting.

  In this way, the side portions 6a and 6b of the plate 6 of the light source 1 and the coupling base 3 joined with the heat conductive resin paste 100 having a high thermal conductivity have a higher thermal conductivity than the conventional one. The heat generated in 1 can be effectively released to the coupling base 3, which is effective as a heat countermeasure for the light source 1.

  FIG. 7 is a diagram showing an optical disc apparatus equipped with an optical pickup using a heat conductive resin paste in one embodiment of the present invention. In FIG. 7, the housing 500 is configured by combining an upper housing portion 500a and a lower housing portion 500b. The upper housing part 500a and the lower housing part 500b are fixed to each other using a spiral or the like. The spindle motor 502 is provided on a tray 501 provided in the casing 500 so as to be able to appear and retract. The optical pickup shown in FIGS. 1 to 6 is used as the optical pickup 503, and performs at least one of an operation of writing information on or reading information from the optical disc. The optical pickup 503 is mounted on a carriage (not shown) held so as to be movable in the radial direction of the optical disk. The bezel 504 is provided on the front end surface of the tray 501 and is configured to close the entrance / exit 505 of the tray 501 when the tray 501 is stored in the housing 500. The rails 506 and 507 are slidably attached to both the tray 501 and the housing 500, respectively. The rails 506 and 507 are provided on both sides of the tray 501, and the tray 501 is mounted on the rails 506 and 507 so that the tray 501 can protrude and retract in the direction of arrow P shown in FIG.

  An eject switch 508 is provided on a bezel 504 provided on the front end surface of the tray 501.

  FIG. 8 is a diagram showing a method for mounting an optical pickup using the thermally conductive resin paste in one embodiment of the present invention.

  As shown in FIG. 8, the optical pickup is inserted into the notch 615 provided in the carriage 600, and the protrusions 617 and 616 are inserted into the through holes 18a and 19a provided in the fixing portions 18 and 19, respectively. At this time, the diameters of the protrusions 616 and 617 are slightly smaller than the diameters of the through holes 18a and 19a, and the optical pickup is somewhat movable even after the protrusions 616 and 617 are inserted into the through holes 18a and 19a. Thus, the optical pickup and the carriage 600 can be relatively moved within a certain range even after being mounted, so that the optical axis can be adjusted with high accuracy. When the optical adjustment or the like is completed, the carriage 600 and the optical pickup are fixed by caulking or welding the protrusions 616 and 617. Alternatively, an adhesive is applied between the fixing portions 18 and 19 and the carriage 600 to fix them to each other.

  In this way, the fixing portions 18 and 19 are integrally provided on the coupling base 3 to which the light source 1 and the optical members 4 and 5 are directly fixed, and the fixing portions 18 and 19 are directly joined to other members such as the carriage 600. Therefore, the optical axis can be adjusted reliably, and the optical pickup can be firmly fixed to the carriage 600.

  The heat conductive resin paste 100 of the present invention is a heat conductive resin paste comprising a curable base resin and particles of a heat conductive material. Therefore, the detailed configuration of the heat conductive resin paste 100 will be described in detail by dividing it into a curable base resin and a heat conductive material. (Table 1) shows the relationship between the amount of material blended and the resin characteristics, and Examples 1 to 8 of the thermal conductive resin paste 100 of the present invention and Comparative Examples 1 to 3 thereof.

  First, the curable base resin blended in the thermally conductive resin paste 100 of the present invention shown in Example 1 of (Table 1) will be described.

  Even if the thermally conductive resin paste 100 after curing polymerization is exposed to heat generated from a light source as a heating element for a long period of time, deterioration due to material oxidation is suppressed, and the flexibility and adhesion of the thermally conductive resin paste 100 itself are suppressed. In order to maintain the adhesiveness to the body and achieve a remarkable reliability improvement, the curable base resin is composed of a bifunctional epoxy monomer having two functional oxirane rings in one molecule and one molecule. A monofunctional epoxy monomer having one functional oxirane ring and an antioxidant are included at a blending weight ratio of approximately 2: 8: 3.

  Here, FIG. 9 shows the relationship between the ratio of the monofunctional group epoxy monomer in the monomer and the Young's modulus of the thermally conductive resin paste cured product.

  FIG. 10 shows the relationship between the blending ratio of the antioxidant blended with respect to 100 parts by weight of the total epoxy monomer and the Young's modulus of the thermally conductive resin paste cured product.

  Further, FIG. 11 shows the relationship between each system of antioxidants and the Young's modulus of the thermally conductive resin paste cured product when 30 parts by weight of the antioxidant blended with respect to 100 parts by weight of the total epoxy monomer is blended.

  Examples of the bifunctional epoxy monomer constituting the curable base resin include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol # 200 diglycidyl ether, polyethylene glycol # 400 diglycidyl ether, propylene glycol diglycidyl ether, tripropylene Glycol diglycidyl ether, polyoxyalkylene BPA diglycidyl ether, polypropylene glycol # 400 diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether, glycerin di Glycidyl ether, hydrogenated BPA diglycidyl ether, 2,3-dibromo neo Emissions chill glycol diglycidyl ether, trimethylolpropane diglycidyl ether, polyglycol diglycidyl ether, alkyl diglycidyl ether.

  In the thermally conductive resin paste in one embodiment of the present invention, polyoxyalkylene BPA diglycidyl ether was used as the bifunctional epoxy monomer.

  In addition, as the monofunctional group epoxy monomer constituting the curable base resin, methyl glycidyl ether, 2-ethylhexyl glycidyl ether, decyl glycidyl ether, stearyl glycidyl ether, glycidose, p-tert-butylphenyl glycidyl ether, C12, C13 mixed higher alcohol glycidyl ether, alkyl monoglycidyl ether, alkylphenol monoglycidyl ether, secondary butylphenol monoglycidyl ether, tertiary carboxylic acid glycidyl ester and the like.

  Here, in long-term storage of the thermally conductive resin paste before curing polymerization, the monofunctional epoxy monomer and the bifunctional epoxy monomer cause a crystallization reaction due to a change in storage temperature, and prevent crystal precipitation or crystal precipitation. In order to keep the dispersibility stable, the monofunctional epoxy monomer is preferably of a low crystallization grade that is difficult to crystallize or precipitate.

  Examples of the antioxidant include phenolic antioxidants, phosphite antioxidants, sulfur antioxidants, and the like.

  Examples of phenolic antioxidants include AO-20, AO-30, AO-40, AO-50, AO-60, AO-70, AO-80, AO-330 (above, trade names manufactured by ADEKA), SP. , SP-23 (trade name, manufactured by Sanko Co., Ltd.) and the like.

  Examples of the phosphite antioxidant include PEP-4C, PEP-8, PEP-36, HP-10, 2112, 260, C, 3010, and TPP (trade name, manufactured by ADEKA).

  Examples of the sulfur-based antioxidant include AO-412S and AO-503 (product names manufactured by ADEKA).

  In the thermally conductive resin paste in one embodiment of the present invention, AO-80, 260 and AO-412S (trade name, manufactured by ADEKA) were used as antioxidants.

  Here, the curable base resin is configured to include a bifunctional epoxy monomer and an antioxidant at a blending weight ratio of approximately 2: 8: 3. As a result, the addition of the monofunctional epoxy monomer with respect to the bifunctional epoxy monomer is blended at a high concentration that is several tens of times the general addition amount, so that the polymer chain is cut and the heat conductive resin paste 100 is flexible. Therefore, the hardness of the thermally conductive resin paste 100 after the curing polymerization can be made flexible with a predetermined value or less. In addition, the blending weight ratio of the bifunctional epoxy monomer and the monofunctional epoxy monomer is set to about 2: 8, the ratio of the monofunctional epoxy monomer is suppressed, and a three-dimensional structure is formed by a polymer chain with the bifunctional epoxy monomer. Therefore, the gelled state of the heat conductive resin paste 100 after the curing process is maintained, and fluidization of the heat conductive resin paste 100 can be prevented. As a result, even if the heat conductive resin paste 100 is after the curing polymerization, the heat conductive resin paste itself maintains the flexibility and adhesion to the adherend, thereby obstructing the angle adjustment of the light source as the heating element. In addition, it becomes possible to sufficiently conduct the heat of the heating element while preventing fluidization of the heat conductive resin paste 100. In addition, since the epoxy resin generally has a low curing shrinkage rate, it is possible to avoid a phenomenon in which the heat flow path is interrupted, such as interfacial peeling from the adherend and cohesive failure of the resin itself due to curing shrinkage.

  Furthermore, the composition weight ratio of the total epoxy monomer and the antioxidant is approximately 10: 3, and the curing polymerization is carried out by blending the antioxidant with respect to the epoxy monomer at a high concentration of several tens to several hundred times the general addition amount. Even if the later heat conductive resin paste 100 is exposed to heat generated from a light source as a heating element for a long period of time, deterioration due to material oxidation is suppressed, the flexibility of the heat conductive resin paste itself and the adherend The adhesiveness can be maintained and the reliability can be remarkably improved.

  Here, the light source 1 and the bonding base 3 are a bonding material 200 in a bulk form (including powders and granules) such as an organic adhesive such as an epoxy resin adhesive, an instantaneous adhesive, and an ultraviolet curing adhesive. As shown in FIG. 9, when the proportion of the monofunctional epoxy monomer in the total epoxy monomer is less than about 60 wt%, the Young's modulus of the thermally conductive resin paste after curing polymerization is Since the modulus is higher than the Young's modulus and there is no flexibility, a stress that shifts the optical axis of the light source 1 is applied to the bonding material 200, which may cause a reliability problem.

  On the other hand, as shown in FIG. 9, when the proportion of the monofunctional epoxy monomer in the total epoxy monomer exceeds approximately 95 wt%, the thermally conductive resin paste is insufficiently gelled and highly fluid even after curing polymerization. For this reason, the heat conductive resin paste flows out and sticks to other members due to tacking, which is not suitable. Therefore, as shown in Example 1 of (Table 1), the proportion of the monofunctional epoxy monomer in the total epoxy monomer is preferably about 80 wt%.

  Further, if the antioxidant is about 30 parts by weight or less with respect to 100 parts by weight of the total epoxy monomer in the heat conductive resin paste, a mixture comprising a bifunctional epoxy monomer and a monofunctional epoxy monomer This makes it possible to achieve a high filling of the heat conductive material and a uniform dispersion of the heat conductive material during the filling process of the heat conductive material. However, when the amount of the antioxidant exceeds about 30 parts by weight, it is difficult to maintain compatibility with the mixture composed of the bifunctional epoxy monomer and the monofunctional epoxy monomer, and it is difficult to highly charge the heat conductive material. In addition, it becomes difficult to uniformly disperse the heat conductive material during the filling process of the heat conductive material.

  In addition, since the light source temperature rises to about 80 ° C. due to the heat generated by the light source of the optical pickup mounted on the optical disc apparatus, in order to maintain high reliability, generally even when 1000 hours have passed at 80 ° C. Although it is necessary to suppress the change exceeding the Young's modulus of the bonding agent 200, as shown in Comparative Examples 1 to 3 in FIG. 10, the antioxidant is substantially omitted with respect to 100 parts by weight of the total epoxy monomer in the thermally conductive resin paste. If the blending is less than 30 parts by weight, deterioration due to material oxidation progresses with time, and after 1000 hours, the increase in Young's modulus exceeds the Young's modulus of the bonding agent 200, and the heat conductive resin paste itself The flexibility and adhesion to the adherend cannot be maintained.

  On the other hand, as shown in Example 1 of FIG. 10, the heat conductive resin after curing polymerization is blended by adding approximately 30 parts by weight of the antioxidant to 100 parts by weight of the total epoxy monomer in the heat conductive resin paste. Even if the paste is exposed to heat generated from a light source that is a heating element for a long period of time, deterioration due to material oxidation is suppressed, and the heat conductive resin paste itself retains its flexibility and adherence to the adherend. Reliability can be improved.

  In addition, as shown in FIG. 11, when a case where the total amount of the antioxidant is blended with about 30 parts by weight with respect to 100 parts by weight of the total epoxy monomer in the thermally conductive resin paste is compared with the case where the antioxidant is not blended, the example As shown in FIG. 2, the effect of suppressing thermal degradation is recognized when the phenolic antioxidant is added alone. Similarly, as shown in Example 3 and Example 4, respectively, the phosphite antioxidant and the antioxidant of the sulfur-based antioxidant are each less effective than the phenol-based antioxidant alone even if each of the antioxidants is combined. Is effective.

  Further, in blending two systems of antioxidants, as shown in Example 5 of FIG. 11, by adding equal amounts of phosphite antioxidants and sulfur antioxidants, phenolic antioxidants are blended. The effect is recognized although the effect is lower than the case where the agent is blended alone.

  That is, the phenolic antioxidant is a main material that suppresses thermal degradation, and blending at least approximately 10 parts by weight of the phenolic first antioxidant with respect to 100 parts by weight of the total epoxy monomer results in primary oxidation. It is effective in preventing. In addition, it is effective in blending at least about 20 parts by weight of a phosphite-based or sulfur-based second antioxidant to prevent secondary oxidation. Therefore, when about 30 parts by weight of the antioxidant is blended with 100 parts by weight of the total epoxy monomer in the thermally conductive resin paste, as shown in Example 6 and Example 7 of FIG. Blending of a first phenolic antioxidant having a radical scavenging action and a second phosphite or sulfurous antioxidant having a peroxide decomposing action at a blending weight ratio of about 1: 2. In this case, radicals generated by primary oxidation of the curable base resin are captured and invalidated. Furthermore, the generated peroxide is decomposed into harmless substances, blocking the powerful oxidation mechanism of chain and continuous secondary oxidation in which new radicals and peroxides are generated. Higher effect than that.

  Further, as shown in Example 1 of FIG. 11, the blending weight ratio of the phenolic antioxidant, the phosphite antioxidant, and the sulfur antioxidant is blended to about 1: 1: 1. The chain mechanism of secondary oxidation and secondary oxidation is cut off most efficiently, and a higher effect can be obtained. In particular, sulfur-based antioxidants have a slower decomposition rate of peroxides than phosphite-based agents, and thus have a synergistic effect of preventing secondary oxidation for a long period of time, enabling stable improvement of antioxidant ability. .

  Thus, the highest effect is obtained by blending three types of antioxidants of phenol, phosphite, and sulfur in a ratio of about 1: 1: 1. In addition, the bifunctional epoxy monomer constituting the curable base resin is blended with an epoxy monomer classified into bisphenol A type or bisphenol F type, and the curing agent is a thermally conductive resin paste after the curing process. In order to maintain the gelled state, a polyamine-based thermosetting latent curing agent in which the active part of the curing agent is masked with a phenol group is suitable. Thereby, since the curable base resin before thermosetting has a long pot life, the viscosity of the heat conductive resin paste 100 is stabilized below the curing temperature, so that the handling property is stable, and the stable storage for a long time. Is possible.

  Here, the relationship between the kind of hardening | curing agent and the storage stability of a heat conductive resin paste is shown in FIG. The storage stability is confirmed by measuring the change of the discharge amount in the dispenser discharge. As shown in FIG. 12, in the case of Example 1 using a latent curing agent, the increase in viscosity is low in the storage environment at the room temperature level (25 ° C.), the dispenser discharge property is stable, and the pot life is long. . On the other hand, when the same amount of polyamidoamine-based obvious curing agent in which the active part of the curing agent is not masked is used in place of the latent curing agent of Example 1, the increase in viscosity is remarkable in the storage environment, and the dispenser discharge Since the amount is remarkably reduced and dispenser discharge is not stable, it is preferable to add a latent curing agent to the heat conductive paste as in Example 1.

  Examples of the bifunctional epoxy monomer classified into bisphenol A type or bisphenol F type are EXA-4850-150, EXA-4850-1000, HP-4032D (trade name, manufactured by Dainippon Ink, Inc.), EP- 4000, EP-4000SS, EP-4003S, EP-4100E, EP-4901E, EPR-4030, EPR-4033, EPU-78-13S, EP-49-23, EP-49-25 (above, manufactured by ADEKA) Name), jER828 (trade name of Japan Epoxy Resin Co., Ltd.) and the like.

  In the thermally conductive resin paste in one embodiment of the present invention, EP-4003S (trade name, manufactured by Japan Epoxy Resin Co., Ltd.) was used as a bifunctional epoxy monomer.

  Examples of the polyamine-based latent curing agent include EH-4357S, EH-4380S (trade name, manufactured by ADEKA).

  In the thermally conductive resin paste in one embodiment of the present invention, EH-4357S (trade name, manufactured by ADEKA) was used as a polyamine-based latent curing agent.

  Moreover, the heat conductive resin paste is blended with a dispersant, so that the dispersibility of the particles is increased, so that the viscosity of the heat conductive resin paste is lowered and the discharge amount by the dispenser can be increased. In addition, the present invention has a great effect on improving the wettability on the adherend and controlling the fluidity of the heat conductive resin paste.

  Examples of the dispersing agent include Sol Sparse 3000, Sol Sparse 9000, Sol Sparse 13240, Sol Sparse 13650, Sol Sparse 13940, Sol Sparse 17000, 18000, Sol Sparse 20000, Sol Sparse 21000, Sol Sparse 20000, Sol Sparse 24000, Sol Sparse 26000, Sol Sparse 27000, Sol Sparse 28000, and Sol Sparse 32000. Solsperse 36000, Solsperse 37000, Solsperse 38000, Solsperse 41000, Solsperse 42000, Solsperse 43000, Solsperse 46000, Solsperse 54000 (above, trade name manufactured by Lubrizol), Dispersic 130, Dispersic 161, Dispersic 162, Dispersic 163, Dispersic 170, Dispersic 171, Dispersic 174, Dispersic 180, Dispersic 182, Dispersic 183, Dispersic 184, Dispersic 185, Dispersic 2000, Dispersic 2001, Dispersic 2020, Dispersic 2050 , Disperbic 2070, Disperbic 2096, Disperbic 2150 (above, trade names manufactured by Bic-Chemie), Efka 46, Efka 47, Efka 452, Efka LP4008, Efka 4009, Efka LP4010, Efka LP4050, LP4055, Efka 400, Efka 401 , Efka 402, Evka 403, Evka 450, Evka 451, Evka 453, Evka 45 0, EFKA 4550, EFKA LP4560, EFKA 120, EFKA 150, EFKA 1501, EFKA 1502, EFKA 1503 (the product names made by EFKA), Ajisper PB711, Addispar PB821, Addisper PB822, Addispar PB814, Addispar PN411, Addispar PN411, As mentioned above, it is also possible to use Ajinomoto Co., Ltd. product name).

  In the thermally conductive resin paste in one embodiment of the present invention, Ajisper PB711 (trade name, manufactured by Ajinomoto Co., Inc.) was used as a dispersant.

  The heat conductive resin paste 100 preferably has a viscosity before curing polymerization of 5 Pa · s to 150 Pa · s (25 ° C.). Thereby, when discharging the heat conductive resin paste 100 before hardening from the dispenser which has the injection tool of a small diameter nozzle, it becomes possible to improve discharge amount stability without nozzle clogging.

  Next, the heat conductive substance mix | blended with the heat conductive resin paste 100 of this invention is demonstrated in detail.

  The thermally conductive substance blended in the thermally conductive resin paste 100 of the present invention includes substantially spherical aluminum oxide particles having a thermal conductivity of 20 W / m · K or higher, and a thermal conductivity of 150 W / m · K or higher. It is comprised with the substantially spherical aluminum nitride particle | grains which have.

  By mixing aluminum nitride particles having higher thermal conductivity than aluminum oxide particles with aluminum oxide particles, it is possible to impart higher thermal conductivity than aluminum oxide particles alone.

  Further, by making the heat conductive material substantially spherical, the specific surface area of the heat conductive particles is minimized, and there is an effect of suppressing the resin viscosity when the heat-conductive base resin is highly filled with heat conductivity.

  The surface of the aluminum oxide particles is surface-treated with a silane coupling agent having a phenyl group and an amino group. As a result, the phenyl group and the amino group mediate the chemical bond between the aluminum oxide particles, which are inorganic materials, and the polymer, which is an organic material, and the aluminum oxide particles and organic materials, which are inorganic materials with different chemical properties due to the silane coupling agent. As a result, the formation of the interface with the polymer is promoted and the wettability with the polymer is improved, so that the dispersibility of the aluminum oxide particles is improved and the viscosity increase at the time of high filling is suppressed. As a result, high filling of aluminum oxide particles becomes possible.

  In addition, for aluminum nitride particles, surface treatment is performed in which pulverized primary particles of uneven aluminum nitride with surface protrusions are sintered at a high temperature by adding yttrium oxide as a sintering aid and boron nitride as a particle size control agent. Thus, substantially spherical secondary particles can be obtained. As a result, the wettability with the polymer is improved. This improves the dispersibility of the aluminum nitride particles, and has an effect of suppressing an increase in viscosity at the time of high filling. As a result, high filling of aluminum nitride particles becomes possible.

  In addition, the surface of aluminum nitride particles is surface-treated with polysaccharides by hydroxyl coating or silicate coating to prevent water resistance deterioration such as moisture absorption and hydration. To prevent it from rising.

  The thermally conductive resin paste 100 includes the substantially spherical aluminum nitride particles treated as described above and two types of substantially spherical aluminum oxide particles having different diameters, and the average particle diameter of the aluminum nitride particles is approximately 40 μm or more. The average particle size of the large aluminum oxide particles is approximately 10 μm, and the average particle size of the small aluminum oxide particles is approximately 0.5 μm. The aluminum nitride particles, the large aluminum oxide particles, and the small aluminum oxide particles The blending weight ratio is approximately 5: 5: 1, and the blending weight ratio between the curable base resin and the thermally conductive particles in the thermally conductive resin paste 100 is approximately 1: 9.

  Here, since the gap length between the aluminum nitride particles per unit volume can be shortened as the particle diameter increases, the thermal conductivity of the thermally conductive resin paste can be increased.

  In addition, the aluminum nitride particles having a large average particle size are not used to constitute the heat conductive material, but the aluminum oxide particles having an average particle size smaller than the aluminum nitride particles are included. Since not only large aluminum oxide particles but also aluminum oxide particles with a small average particle size are included, even if the proportion of particles of heat conductive material is extremely large relative to the curable base resin, the heat conductive resin before curing The viscosity of the paste 100 can be kept low below a predetermined value, and the work of injecting the heat conductive resin paste 100 into a narrow gap by taking out the heat conductive resin paste 100 from an injection tool with a narrow nozzle inner diameter becomes possible.

  Further, the latent curing agent may be liquid or particles having an average particle size of 40 μm or less and a maximum particle size of 150 μm or less, and the aluminum oxide particles and the aluminum nitride particles may be particles having a maximum particle size of 150 μm or less. It is preferable because the heat conductive resin paste 100 can be taken out from the ultra-fine injection tool having an inner diameter of about 200 μm without clogging the nozzle, and the heat conductive resin paste 100 can be injected into an extremely narrow gap.

  Moreover, since the ratio of the particle | grains of a heat conductive substance is included very much with respect to curable base resin, it also becomes possible to make the heat conductivity of the heat conductive resin paste 100 high, and Example 1 of (Table 1) is shown in Example 1. As shown, a high thermal conductivity of about 6.8 W / m · K can be obtained.

  Similarly, as shown in Example 8 of (Table 1), the average particle diameter of aluminum nitride particles is approximately 40 μm or more, the average particle diameter of aluminum oxide particles having a large diameter is approximately 10 μm, and aluminum oxide particles having a small diameter The average particle size is approximately 0.5 μm, and the mixing weight ratio of aluminum nitride particles, large-diameter aluminum oxide particles, and small-diameter aluminum oxide particles is approximately 7: 5: 1. By increasing the filling ratio of high aluminum nitride and configuring the blending weight ratio of the curable base resin and the thermally conductive material particles in the thermally conductive resin paste 100 to be approximately 1:10, it is possible to obtain a pre-cured value within a predetermined range. Although the viscosity of the thermal conductive resin paste 100 becomes higher, it is also possible to obtain a higher thermal conductivity of about 8.5 W / m · K.

  However, if the ratio of the thermally conductive material particles is excessively increased to a composition of the weight ratio of the curable base resin and the thermally conductive material particles of about 1:11, the sufficient amount of the polymer and the thermally conductive material particles is sufficient. Since the wettability cannot be maintained, the viscosity of the thermally conductive resin paste 100 before curing not only becomes higher than a predetermined value, but also makes it difficult to uniformly disperse and highly charge the thermally conductive material, resulting in curing. Things are not suitable because they are very fragile.

  Therefore, in the thermally conductive resin paste 100, the aluminum nitride particles and the aluminum oxide particles subjected to the above surface treatment are used for the thermally conductive material particles, and the curable base resin and the thermally conductive material particles are blended. By configuring the weight ratio to be approximately 1: 9, the viscosity of the thermally conductive resin paste 100 before curing can be kept low below a predetermined value, and high thermal conductivity can be obtained.

  Next, the manufacturing process and storage means of the heat conductive resin paste 100 will be described.

  First, the heat conductive resin paste 100 is manufactured by kneading a curable base resin, aluminum oxide particles, and aluminum nitride particles with a vacuum stirring defoaming mixer so that no bubbles remain in the heat conductive resin paste 100. In addition, since the heat conductive material is uniformly dispersed and stirred, stable heat conductivity and high adhesion to the adherend can be maintained.

  The long-term storage means for the heat conductive resin paste 100 is that the curable base resin, the aluminum oxide particles, and the aluminum nitride particles are cooled immediately after kneading at a temperature lower than −5 ° C. and stored at a temperature not higher than −5 ° C. As a result, the curing polymerization rate of the thermally conductive resin paste 100 after kneading is greatly reduced, and therefore the pot life of the thermally conductive resin paste 100 can be extended.

  With the above contents, according to the thermal conductive resin paste 100 of the present invention, the addition amount of the monofunctional epoxy monomer to the bifunctional epoxy monomer is blended at a high concentration of several tens of times the general addition amount. Since the polymer chain can be cut and the heat conductive resin paste 100 can be made flexible, the hardness of the heat conductive resin paste 100 after the curing polymerization can be made to have a predetermined flexibility or less. In addition, the blending weight ratio of the bifunctional epoxy monomer and the monofunctional epoxy monomer is set to about 2: 8, the ratio of the monofunctional epoxy monomer is suppressed, and a three-dimensional structure is formed by a polymer chain with the bifunctional epoxy monomer. Therefore, the gelled state of the heat conductive resin paste 100 after the curing process is maintained, and fluidization of the heat conductive resin paste 100 can be prevented. As a result, even if the heat conductive resin paste 100 is after the curing polymerization, the heat conductive resin paste itself maintains the flexibility and adhesion to the adherend, thereby obstructing the angle adjustment of the light source as the heating element. In addition, it becomes possible to sufficiently conduct the heat of the heating element while preventing fluidization of the heat conductive resin paste 100. In addition, since the epoxy resin generally has a low curing shrinkage rate, it is possible to avoid a phenomenon in which the heat flow path is interrupted, such as interfacial peeling from the adherend and cohesive failure of the resin itself due to curing shrinkage.

  Furthermore, the composition weight ratio of the total epoxy monomer and the antioxidant is approximately 10: 3, and the curing polymerization is carried out by blending the antioxidant with respect to the epoxy monomer at a high concentration of several tens to several hundred times the general addition amount. Even if the later heat conductive resin paste 100 is exposed to heat generated from a light source as a heating element for a long period of time, deterioration due to material oxidation is suppressed, the flexibility of the heat conductive resin paste itself and the adherend Maintains adhesion and increases resistance to impact.

  Furthermore, since the ratio of the particle | grains of a heat conductive substance can be included very much with respect to curable base resin, the heat conductivity of the heat conductive resin paste 100 can be made high.

  Furthermore, since the viscosity at room temperature of the thermally conductive resin paste 100 before curing is kept below a predetermined value for a long time and the maximum particle size of the contained particles is below a predetermined value, the inner diameter of the nozzle is heated from the ultrafine injection tool. It is possible to stably discharge the conductive resin paste 100 without clogging the nozzles, and to inject the heat conductive resin paste 100 into an extremely narrow gap.

  Further, in the optical disk apparatus using the heat conductive resin paste 100, it is possible to efficiently release the heat generated by the light source that emits the laser light.

  As described above, the thermally conductive resin paste of the present invention and the optical disk apparatus using the same have flexibility after curing polymerization and can reduce thermal degradation. It is useful as a medium for escaping to other peripheral members.

DESCRIPTION OF SYMBOLS 1 Light source 2 Light receiving element 3 Coupling base 3a Through-hole 4,5 Optical member 6 Plate 6a, 6b Side part 7 Mold member 8 Submount 9 Semiconductor laser element 10 Wire 11, 12 Electrode 13, 14, 15 Terminal part 16, 17 Wires 18, 19 Fixing portion 18a, 19a Through hole 35 Space portion 36, 37, 39 Protruding portion 38, 40 Gap 41, 42 Joining portion 100 Thermal conductive resin paste 200 Joining material 500 Housing 500a Upper housing portion 500b Lower housing Body part 501 Tray 502 Spindle motor 503 Optical pickup 504 Bezel 505 Recession opening 506, 507 Rail 508 Eject switch 600 Carriage 615 Notch part 616, 617 Projection

Claims (10)

A thermally conductive resin paste comprising a curable base resin and thermally conductive particles, wherein the curable base resin is composed of a bifunctional epoxy monomer having two functional oxirane rings in one molecule and one molecule. A heat conductive resin paste comprising a monofunctional epoxy monomer having one functional oxirane ring and an antioxidant in a mixing weight ratio of about 2: 8: 3. The antioxidant is characterized in that the blending weight ratio of the first antioxidant having a radical scavenging action and the second antioxidant having a peroxide decomposing action is set to about 1: 2. The heat conductive resin paste according to 1. The thermally conductive resin paste according to claim 1, wherein the antioxidant includes a phenol-based antioxidant, a phosphite-based antioxidant, and a sulfur-based antioxidant. The heat conductive resin according to claim 3, wherein a blending weight ratio of the phenolic antioxidant, the phosphite antioxidant, and the sulfur antioxidant is approximately 1: 1: 1. paste. 5. The heat conduction according to claim 1, wherein the antioxidant is compatible with a mixture containing the bifunctional epoxy monomer and the monofunctional epoxy monomer. Resin paste. The curable base resin further includes a latent curing agent, and the bifunctional epoxy monomer is compounded with an epoxy monomer classified into bisphenol A type or bisphenol F type, and the latent curing agent is phenol. The thermally conductive resin paste according to claim 1, which is a polyamine-based curing agent in which a curing agent active part is masked with a group. The thermally conductive resin paste according to claim 1, wherein the monofunctional group epoxy monomer is a low crystallization grade. The heat conductive resin paste according to any one of claims 1 to 7, wherein the heat conductive resin paste contains a dispersant. The thermal conductivity according to any one of claims 1 to 8, wherein the thermal conductive resin paste has a viscosity before curing polymerization of 5 Pa · s to 150 Pa · s (25 ° C). Resin paste. An optical disc device comprising a light source that emits laser light and a coupling base that regulates and fixes the position of the light source, and the light source is separated from the light source by the thermally conductive resin paste according to claim 1. An optical disc apparatus, wherein the coupling base is fixed.

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