JP2008029093A - Power conversion equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide power conversion equipment which can achieve downsizing and price down by simplifying the constitution of a power module part in the power conversion equipment. <P>SOLUTION: In the power conversion equipment which has a power module part which is equipped with a plurality of bridge circuits having switching elements, a power smoothing capacitor part which smoothes the voltage of DC power applied to the power module part, a drive circuit part which drives the power module part, a control circuit part which controls the power module part via the drive circuit part, and a cooler where the power module part is mounted, the plurality of bridge circuits include a plurality of power switching device groups which have each one or more power switching devices constituted of a pair of bridge circuits consisting of one or more switching elements. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a power conversion device that controls electric power supplied to an electric motor, and an automobile including the same.

  In an electric vehicle using an electric motor as a drive source, such as an electric vehicle or a hybrid vehicle, a reduction in size and weight of a power conversion device that converts DC power supplied from a battery to the electric motor into AC power is being studied. This is for reducing the price of the power conversion device, improving the fuel consumption of the electric vehicle by reducing the size and weight of the power conversion device, and reducing the space for mounting the power conversion device in the electric vehicle. The power conversion device includes a power module unit composed of a plurality of power semiconductor elements, a power supply smoothing capacitor, a drive circuit unit that drives the power module unit, and a control circuit unit that controls the power module unit via the drive circuit unit. And a cooling unit.

In the structure of the power drive unit of the power module section, a power semiconductor element such as IGBT is joined to the insulating substrate by using solder or the like, and the power module solder-joined to the base metal plate is interposed through the heat conductive grease. Installed in the cooling section. The insulating substrate is obtained by bonding a thin metal plate for an electrode to a ceramic substrate such as aluminum nitride (AlN) or alumina (Al ₂ O ₃ ).

  The electronic components and power drive unit in the power converter generate heat during self-operation. In the power converter, in order to ensure stable operation of the elements, means for cooling the semiconductor elements is required so that the temperature during operation of the semiconductor elements does not exceed a predetermined limit operating temperature.

  2. Description of the Related Art Conventionally, a technique in which a heat radiating plate is disposed in a power drive unit or the like, as in the technique described in Japanese Patent Application Laid-Open No. 11-89248 (Patent Document 1), is widely known.

JP 11-89248 A

  In the conventional structure using a power drive unit as the configuration of the power module unit, the number of materials used and the number of components such as a plurality of power semiconductor elements, a plurality of insulating substrates, and a gel increase. For this reason, reducing the materials used and the number of parts that make up the power drive unit and simplifying the configuration of the power module unit will help reduce the size, weight, price, and reliability of the power converter. Is preferable.

  In the present invention, a power module unit having an inverter circuit composed of six sets of bridge circuits composed of one or more switching elements, a power supply smoothing capacitor unit that smoothes a DC power supply voltage applied to the power module unit, A drive circuit unit that drives the power module unit; a control circuit unit that controls the power module unit via the drive circuit unit; and a cooling unit on which the power module unit is mounted, and a predetermined DC power is supplied to the desired unit In a power conversion device for converting to AC power, a power switching device group in which six bridge circuits have one or more power switching devices composed of one bridge circuit composed of one or more switching elements and one or more diodes. A simple material with a typical configuration of a power converter characterized by six sets Providing a power conversion device which can constitute the power device portion.

  Furthermore, the cooling unit is composed of six sets of cooling unit units divided for each power switching device group, and the power switching device group is mounted on the cooling unit unit. A power conversion device capable of configuring a power device unit with a simple material by providing two representative configurations is provided.

  According to the present invention, the power conversion device can be reduced in size and weight.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic view generally showing a hybrid vehicle provided with inverter devices according to first to nineteenth embodiments of the present invention, and FIG. 2 shows the first to nineteenth embodiments of the present invention. It is such a bridge circuit diagram.

  The power conversion device controls power supplied to an electric motor, for example, and includes, for example, a rectifier that converts AC power into DC power, an inverter device that converts DC power into AC power, and a combination of the rectifier and the inverter device. There is a DC-DC converter device that converts input DC power into desired DC power. In the following description, an inverter device that converts DC power output from a DC power storage device into AC power and supplies the motor to an electric motor will be described as an embodiment of the present invention. The configuration of the present invention includes a rectifier and DC-DC. The present invention can also be applied to a converter device.

  In FIG. 1, the output of the engine 10 is input to the transmission 30 via the drive shaft 15. The engine 10 is an injection-type spark ignition engine that uses gasoline as fuel. The transmission 30 is an automatic transmission and is connected to drive wheels 15 of a hybrid vehicle (not shown) on which the engine 10 is mounted to change the engine output and transmit it to the drive wheels 15 to drive the hybrid vehicle.

A motor 20 is connected to the drive shaft 15 between the engine 10 and the transmission 30. The motor 20 always rotates when the engine 10 rotates, and is energized at the time of starting to crank and start the engine 10, and also energized at the time of acceleration or the like to assist (increase) the rotation of the engine 10. When the motor 20 is not energized, the motor 20 idles as the engine 10 rotates, and fuel supply to the engine 10 is stopped. It has a regenerative function that converts kinetic energy generated by the rotation of the drive shaft 15 into electric energy and outputs it during deceleration. The motor 20 functions as a generator.

The motor 20 is connected to the battery 60 via the inverter device 50. The motor 20 is a DC brushless motor, more specifically, an AC synchronous motor. As will be described later, the inverter device 50 includes a power module unit, converts the direct current supplied from the battery 60 into alternating current, and supplies the alternating current to the battery 60.

  A current sensor 70 is disposed between the inverter device 50 and the motor 20. The current sensor 70 outputs a signal corresponding to the current supplied (output) from the inverter device 50 to the motor 20.

  Next, an embodiment of the present invention will be described in detail with an inverter device with reference to FIGS.

  A first embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention. FIG. 3 is an enlarged perspective view of the power module section and the cooling section shown in FIG. FIG. 4 is an enlarged perspective view of the power switching device shown in FIG.

  In FIG. 2, for simplification of illustration, many electronic components mounted on the control circuit board 180 and the like, through-holes formed in the control circuit board 180, recesses formed in the cooling unit 120, and insertion holes for positioning pins The screw holes are omitted.

The inverter device includes a power module unit 130 (a three-phase inverter composed of six bridge circuits), a drive circuit board (electronic circuit board) 150 for driving the power module unit 130 thereon, and power via the drive circuit unit. A control circuit board (electronic circuit board) 180 for controlling the module unit 130, a current sensor 160 for detecting current, each bus bar 170, a case 140 for housing the power module unit 130, a smoothing capacitor 195, an upper lid 190, power A cooling unit (heat sink) 120 is provided below the module unit 130. A connector 185 connected to an external ECU is mounted on the upper surface of the control circuit board 180.

  The power module unit 130 is configured by screwing a power switching device 110 (specifically, 24 units) including one bridge circuit composed of one or more switching elements and one or more diodes on the cooling unit 120. Secure with (not shown). The power switching devices 110 are arranged in parallel, and the groups 111a, b, c, d, 112a, b, c, and d are U phases, and the groups 113a, b, c, d, 114a, b, c, and d are V phases. , Groups 115a, b, c, d, 116a, b, c, d are W phases, and groups 111a, b, c, d, groups 113a, b, c, d, and groups 115a, b, c, d are positive. , Groups 112a, b, c, d, groups 114a, b, c, d, and groups 116a, b, c, d are negative electrodes.

  The power circuit for one phase is composed of one or more power switching devices 110 (for example, eight). Above the power switching device 110, there is a first through hole of the drive circuit board 150, through which the control terminal 118 from the power switching device 110 is inserted.

In the power switching device 110, for example, one or more switching elements IGBT and one or more free hole diode elements are bonded to a control terminal by a bond wire and mounted on an insulating substrate. These surroundings are molded with resin.

  The drive circuit board 150 and the control circuit board 180 are mounted with a plurality of electronic components including arithmetic processing elements and power semiconductor control elements that constitute the control unit. The electrical wiring between the power module unit 130 is performed by solder connection in which the control terminal 118 extending from the power switching device 110 passes through the through holes of the drive circuit board 150 and the control circuit board 180.

  As the wiring board, a glass epoxy printed wiring board in which a plurality of metal layers are laminated from the upper surface is used. For example, it is a copper foil having a thickness of about 35 μm to 70 μm and can be easily patterned. The metal layer is used for circuit patterns. Since the arithmetic processing element is a surface mounting component, it is mounted on the metal layer.

The case 140 that accommodates the power module unit 130 is formed so as to surround the power switching device 110, and the drive circuit board 150, each bus bar 170, and the current sensor 160 are unitized. Bolt holes for fixing the control circuit board 180 are provided inside the case 140 (specifically, four places), and a component in which the current sensor 160 and the bus bar 170 are unitized is hooked on the frame of the case 140. To implement. Since the power switching device 130, the drive circuit board 150, each bus bar 170, and the current sensor 160 are unitized, the assembling property is improved.

  The current sensor 160 includes a substantially C-shaped magnetic core having a gap, and a magnetoelectric conversion element such as a Hall element inserted in the gap. The magnetoelectric transducer is connected to the control circuit board via a lead pin (not shown). With the current sensor 160 configured in this manner, the output current flowing through the bus bar of each phase is measured.

  The cooling unit 120 is made of a heat dissipating material or a metal material having a relatively high thermal conductivity. A plurality of screw holes into which screws are inserted are formed at convenient positions of the cooling unit 120. These screw holes are used for vehicle mounting. Also, a plurality of screw holes for fixing the cooling unit 120 and the case 140 surrounding the power switching device 110 are appropriately formed. Inside these screw holes, female screws are respectively screwed.

  The upper lid 190 is disposed so as to close the case upper surface opening. A power supply smoothing capacitor 195 for smoothing the DC power supply voltage applied to the power module unit 130 is disposed on the back surface of the case.

  A second embodiment of the present invention will be described with reference to FIG. 5, FIG. 6, FIG. 7, and FIG.

  5 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention, FIG. 6 is an enlarged perspective view of a power switching device unit shown in FIG. 5, and FIG. 7 is a lower portion shown in FIG. 8 is an enlarged perspective view of the case, and FIG. 8 is an enlarged perspective view of the lower case and the power switching device unit accommodation shown in FIG.

  FIG. 5 shows a large number of electronic components mounted on the control circuit board 180 and the like, through holes formed in the control circuit board 180, recesses formed in the divided cooling part 220, positioning pin insertion holes, The screw holes are also omitted.

The inverter device of the second embodiment is an improved example of the power module unit 130 and the cooling unit 120 of the first embodiment. The cooling unit 120 is divided (specifically six) for each group of power switching devices 110 and accommodated in the lower case 210. The divided cooling unit 220 and the power switching device 110 group form one power switching device unit 240. The lower case 210 is divided (specifically six) so that the power switching device unit 240 can be accommodated. A fixed band 230 on the grid is installed on the power switching device unit 240 so that the power switching device unit 240 does not move.

  By forming the power switching device unit 240, it can be easily assembled. For this reason, maintainability, such as when a failure occurs in the power switching device unit 240, can be improved. In addition, the yield of the power switching device power module unit 250 can be improved.

  In addition, the division | segmentation shape of the division | segmentation cooling part 220 and the lower case 210 is not limited to a grid | lattice shape, Other shapes, such as circular and a triangle, may be sufficient.

  A third embodiment of the present invention will be described with reference to FIG.

  FIG. 9 is an exploded perspective view generally showing an inverter device according to a third embodiment of the present invention.

  In FIG. 9, for simplification of illustration, many electronic components mounted on the control circuit board 180 and the like, through holes formed in the control circuit board 180, recesses formed in the cooling unit 120, insertion holes for positioning pins, The screw holes are omitted.

  In the inverter device of the third embodiment, in the power module portion 130 structure of the first embodiment, an insulating sheet 200 having electrical insulation is added to the lower portion of the power switching device 110 to ensure electrical insulation. Yes.

  A fourth embodiment of the present invention will be described with reference to FIG.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention.

  In the inverter device of the fourth embodiment, in the power module unit 130 structure of the first embodiment, the cooling unit 120 on which the power switching device 110 is mounted in order to ensure electrical insulation is replaced with a member having electrical insulation (for example, (Aluminum nitride or alumina).

  By using a member having electrical insulation in the cooling unit 120 on which the power switching device 110 is mounted, it is not necessary to newly arrange a member having electrical insulation. As a result, the number of parts is reduced, and it is possible to reduce the weight, the price, and the assembly man-hours.

  A fifth embodiment of the present invention will be described with reference to FIG.

  FIG. 10 is an exploded perspective view generally showing an inverter device according to a fifth embodiment of the present invention.

  In FIG. 10, for simplification of illustration, many electronic components mounted on the control circuit board 180 and the like, through holes formed in the control circuit board 180, recesses formed in the divided cooling part 220, positioning pin insertion holes The screw holes are omitted.

  In the power converter of the fifth embodiment, the structure of the power module unit 130 of the second embodiment is formed by adding an insulating sheet 200 having electrical insulation to the lower part of the power switching device 109 in order to ensure electrical insulation. Yes.

  A sixth embodiment of the present invention will be described with reference to FIG.

  FIG. 7 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention.

  In the inverter of the sixth embodiment, the split cooling unit 220 mounted on the power switching device power module unit 250 of the second embodiment is formed using an electrically insulating member (for example, aluminum nitride or alumina). Yes.

  By using a member having electrical insulation as the divided cooling unit 220 on which the power switching device 110 is mounted, it is not necessary to newly arrange a member having electrical insulation. As a result, the number of parts is reduced, and it is possible to reduce the weight, the price, and the assembly man-hours.

  A seventh embodiment of the present invention will be described with reference to FIG.

  FIG. 5 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention.

  In the inverter device of the seventh embodiment, the lower case 210 is electrically connected to the power switching device power module 250 structure of the second embodiment, the fifth embodiment, and the sixth embodiment in order to ensure electrical insulation. It is made of an insulating member (specifically, a resin material).

  By using a member having electrical insulation as the divided cooling unit 220 on which the power switching device 110 is mounted, it is not necessary to newly arrange a member having electrical insulation. For this reason, the number of parts is reduced, making it possible to reduce the weight, reduce the price, and reduce the number of assembly steps.

  Further, since the divided cooling unit can be formed of a member having good thermal conductivity (for example, copper or aluminum), heat generated from the power switching device power module unit 250 can be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced, and the reliability of the inverter device is improved.

  An eighth embodiment of the present invention will be described with reference to FIG.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention.

  The inverter device of the eighth embodiment is an improvement plan of the cooling unit 120 of the first embodiment, the third embodiment, and the fourth embodiment. The cooling part base part 121 on which the power switching device 110 is mounted is formed by adding a fin part having a higher cooling capacity than other parts.

  The cooling capacity can be enhanced by forming a fin portion having a higher cooling capacity than other parts in the cooling section base section 121, and heat generated from the power module section 130 can also be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced, and the reliability of the inverter device is improved.

  A ninth embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 11 is an enlarged perspective view of the cooling section of the inverter device according to the ninth embodiment of the present invention.

  In the power conversion apparatus of the ninth embodiment, the cooling section base section 121 on which the power switching device 110 having the cooling section structure of the eighth embodiment is mounted is provided with a cooling section fin section 122 having a cooling capacity higher than that of other portions in a plate shape. A plurality of members were arranged in parallel.

  By increasing the cooling capacity of the cooling unit 120, the heat generated from the power module unit 130 can be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced, and the reliability of the inverter device is improved.

  A tenth embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 12 is an enlarged perspective view of the cooling section of the inverter device according to the tenth embodiment of the present invention.

  In the inverter device of the tenth embodiment, a plurality of rod-like members are arranged in parallel with fin portions having a cooling capacity higher than that of other parts on the cooling portion base portion 121 on which the power switching device 110 having the cooling portion structure of the eighth embodiment is mounted. And arranged to form.

  By increasing the cooling capacity of the cooling unit 120, heat generated from the power module unit 130 can be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced, and the reliability of the inverter device is improved.

  An eleventh embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 13 is a cooling section (plate shape of the eighth embodiment) of the inverter device according to the eleventh embodiment of the present invention. And a power device group enlarged perspective view.

  In the inverter device of the eleventh embodiment, the shape of the cooling unit base 121 on which the power switching device 110 having the cooling unit structure of the eighth, ninth, and tenth embodiments is mounted is a wave type having a plurality of inclinations. A surface was formed.

  The mounting area on the plane can be reduced by inclining the shape of the cooling unit base 121. As a result, the inverter can be easily mounted on the vehicle by increasing the degree of freedom in the plane and the height direction in the overall shape of the inverter.

  A twelfth embodiment of the present invention will be described with reference to FIGS.

  FIG. 2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 14 is a cooling section (plate shape of the eighth embodiment) of the inverter device according to the twelfth embodiment of the present invention. And a power device group enlarged perspective view.

  In the inverter device of the twelfth embodiment, the power switching device 110 having the cooling section structure of the eleventh embodiment is mounted only on the surface group having the same inclination.

  The mounting area on the plane can be reduced by inclining the shape of the cooling unit base 121. As a result, the inverter can be easily mounted on the vehicle by increasing the degree of freedom in the plane and the height direction in the overall shape of the inverter.

  A thirteenth embodiment of the present invention will be described with reference to FIG.

  FIG. 5 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention. In the inverter device according to the thirteenth embodiment, the second embodiment, the fifth embodiment, the sixth embodiment, This is an improvement plan of the divided cooling unit 220 of the seventh embodiment. The split cooling part base part 221 on which the power switching device 110 is mounted is formed by adding a fin part having a higher cooling capacity than other parts.

  The cooling capacity can be increased by forming fin portions in the divided cooling section base section 221 that have a higher cooling capacity than other parts. For this reason, the heat generated from the power switching device power module unit 250 can be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced, and the reliability of the inverter device is improved.

  A fourteenth embodiment of the present invention will be described with reference to FIGS.

  FIG. 5 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention, and FIG. 6 is an enlarged perspective view of the power switching device unit shown in FIG.

  In the power conversion apparatus of the fourteenth embodiment, the divided cooling section fin section 222 having a cooling capacity higher than that of other parts is provided on the divided cooling section base section 221 on which the power switching device 110 having the cooling section structure of the thirteenth embodiment is mounted. A plurality of plate-like members were arranged in parallel.

  By increasing the cooling capacity of the divided cooling unit 220, heat generated from the power switching device power module unit 250 can be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced and the reliability of the inverter device is improved.

  A fifteenth embodiment of the present invention will be described with reference to FIGS.

  FIG. 5 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention, and FIG. 15 is an enlarged perspective view of a cooling portion of the inverter device according to the fifteenth embodiment of the present invention.

  In the inverter device of the fifteenth embodiment, a plurality of rod-like members are arranged in parallel on the divided cooling portion base portion 221 on which the power switching device 110 having the cooling portion structure of the thirteenth embodiment is mounted. And arranged to form.

  By increasing the cooling capacity of the divided cooling unit 220, heat generated from the power switching device power module unit 250 can be efficiently radiated to the outside. As a result, the temperature of the electronic component is reduced, and the reliability of the inverter device is improved.

  A sixteenth embodiment of the present invention will be described with reference to FIGS.

  FIG. 5 is an exploded perspective view generally showing an inverter device according to the second embodiment of the present invention, and FIG. 16 is a cooling section (plate-like shape of the fourteenth embodiment) of the inverter device according to the fourteenth embodiment of the present invention. And a power device group enlarged perspective view.

  In the inverter device of the sixteenth embodiment, the shape of the divided cooling section base portion 221 on which the power switching device 110 having the cooling section structure of the thirteenth embodiment, the fourteenth embodiment, and the fifteenth embodiment is mounted has a plurality of slopes. The surface was formed.

  The mounting area on the plane can be reduced by inclining the shape of the divided cooling part base part 221. As a result, the inverter can be easily mounted on the vehicle by increasing the degree of freedom in the plane and the height direction in the overall shape of the inverter.

  A seventeenth embodiment of the present invention will be described with reference to FIGS.

  FIG. 5 is an exploded perspective view generally showing an inverter device according to a second embodiment of the present invention, and FIG. 6 is an enlarged perspective view of the power switching device unit shown in FIG.

  In the inverter device of the seventeenth embodiment, the power switching device 110 having the structure of the divided cooling section base portion 221 of the eleventh embodiment is mounted only on the surface group having the same inclination.

  The mounting area on the plane can be reduced by inclining the shape of the divided cooling part base part 221. As a result, the inverter can be easily mounted on the vehicle by increasing the degree of freedom in the plane and the height direction in the overall shape of the inverter.

  An eighteenth embodiment of the present invention will be described with reference to FIGS. 2, 5, 9, and 10.

  2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 5 is an exploded perspective view generally showing the inverter device according to the second embodiment of the present invention. FIG. 9 is an exploded perspective view generally showing an inverter device according to a third embodiment of the present invention, and FIG. 10 is an exploded perspective view generally showing an inverter device according to a fifth embodiment of the present invention.

  In the inverter device according to the eighteenth embodiment, the power switching device 110 according to the first to seventeenth embodiments includes one or more switching elements and one or more diodes on an insulating metal substrate made of a metal, an insulating substrate, and a metal. And a bridge circuit is formed by metal wiring, and a module is formed in which the portion other than the electrical connection portion with the outside is covered with an insulating member.

  A nineteenth embodiment of the present invention will be described with reference to FIGS. 2, 5, 9, and 10. FIG.

  2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 5 is an exploded perspective view generally showing the inverter device according to the second embodiment of the present invention. FIG. 9 is an exploded perspective view generally showing an inverter device according to a third embodiment of the present invention, and FIG. 10 is an exploded perspective view generally showing an inverter device according to a fifth embodiment of the present invention.

  In the inverter device according to the eighteenth embodiment, the power switching device 110 according to the first to seventeenth embodiments includes one or more switching elements and one or more diodes on an insulating metal substrate made of a metal, an insulating substrate, and a metal. A module is formed by forming a bridge circuit with metal wiring, covering the outside of the mounting surface of the substrate on which the switching element and the diode are mounted with an insulating member, and forming an electrical connection portion with the outside. ing.

  A twentieth embodiment of the present invention will be described with reference to FIGS. 2, 5, 9, and 10. FIG.

  2 is an exploded perspective view generally showing the inverter device according to the first embodiment of the present invention, and FIG. 5 is an exploded perspective view generally showing the inverter device according to the second embodiment of the present invention. FIG. 9 is an exploded perspective view generally showing an inverter device according to a third embodiment of the present invention, and FIG. 10 is an exploded perspective view generally showing an inverter device according to a fifth embodiment of the present invention.

  In the inverter device of the twentieth embodiment, the substrates of the eighteenth and nineteenth embodiments are formed of a metal, an insulating substrate and a metal laminate.

  As described above, the first to twentieth embodiments have been described in detail with reference to the drawings. However, the present invention is not particularly limited thereto, and may be appropriately selected without departing from the technical idea of the present invention. It can be changed.

  For example, in the above embodiment, the power module unit 130 and the power switching device power module unit 250 have been described in the case where four power semiconductor elements are connected in parallel, but the present invention is not limited to this.

  Moreover, in the said Example, although IGBT is used as a power semiconductor element, it is not restricted to this in particular, Another power semiconductor element like MOSFET can also be used instead of IGBT. When a MOSFET is used as the power semiconductor element, the MOSFET has a built-in diode because of its structure, so that an external diode connected in parallel to the IGBT can be omitted.

  As mentioned above, according to the said Example, it becomes possible to reduce the use raw material and component number which comprise a power module part, and to simplify the structure of a power module part. As a result, the power conversion device can be reduced in size, weight, price, and reliability.

It is the schematic which shows the hybrid vehicle provided with the inverter apparatus which concerns on 1st Example to 19th Example of this invention generally. 1 is an exploded perspective view generally showing an inverter device according to a first embodiment of the present invention. It is an expansion perspective view of the power module part and cooling part which are shown in FIG. FIG. 3 is an enlarged perspective view of the power switching device shown in FIG. 2. It is a disassembled perspective view which shows generally the inverter apparatus which is 2nd Example of this invention. FIG. 6 is an enlarged perspective view of a power switching device unit shown in FIG. 5. It is a lower case expansion perspective view shown in FIG. It is a lower case and power switching device unit accommodation expansion perspective view shown in FIG. It is a disassembled perspective view which shows generally the inverter apparatus which is 3rd Example of this invention. It is a disassembled perspective view which shows generally the inverter apparatus which is 5th Example of this invention. It is a cooling part expansion perspective view of the inverter apparatus which is 9th Example of this invention. It is a cooling part expansion perspective view of the inverter apparatus which is 10th Example of this invention. It is a cooling part and power device group enlarged perspective view of the inverter apparatus which is the 11th Example of this invention. It is a cooling part and power device group enlarged perspective view of the inverter apparatus which is the 12th Example of this invention. It is a cooling part expansion perspective view of the inverter apparatus which is 15th Example of this invention. It is a cooling part and power device group enlarged perspective view of the inverter apparatus which is the 16th Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 ... Power switching device, 111a-d ... Power switching device group (U phase, positive electrode), 112a-d ... Power switching device group (U phase, negative electrode), 113a-d ... Power switching device group (V phase, positive electrode) , 114a to d ... power switching device group (V phase, negative electrode), 115a to d ... power switching device group (W phase, positive electrode), 116a to d ... power switching device group (W phase, negative electrode), 118 ... control terminal DESCRIPTION OF SYMBOLS 120 ... Cooling part 121 ... Cooling part base part 122 ... Cooling part fin part 130 ... Power module part 140 ... Case 150 ... Drive circuit board 160 ... Current sensor 170 ... Busbar 180 ... Control circuit board 185 ... Connector, 190 ... Upper lid, 195 ... Smoothing capacitor, 210 ... Lower case 220 ... division cooling unit, 221 ... division cooling unit base,
222: Divided cooling unit fin section, 230: Fixed band, 240: Power switching device unit, 250: Power switching device power module section.

Claims (20)

A power module unit comprising a plurality of bridge circuits having one or more switching elements;
A power supply smoothing capacitor unit that smoothes a DC power supply voltage applied to the power module unit;
A drive circuit unit for driving the power module unit;
A control circuit unit for controlling the power module unit via the drive circuit unit;
A power converter having a cooling unit on which the power module unit is mounted,
The plurality of bridge circuits include a plurality of power switching device groups each including one or more power switching devices configured by one set of bridge circuits including one or more switching elements. The power conversion device according to claim 1,
The cooling unit has a plurality of cooling unit units divided for each power switching device group, and the power switching device group is mounted on the cooling unit unit. The power conversion device according to claim 1,
The power switching device group, wherein the power switching device group is mounted on the cooling unit via a member having electrical insulation. The power conversion device according to claim 1,
The cooling unit has an electrical insulation property at least on a partial surface on which the power switching device group is mounted. The power conversion device according to claim 2,
The power conversion device, wherein the power switching device group is mounted on the cooling unit through a member having electrical insulation. The power conversion device according to claim 2,
The power conversion device according to claim 1, wherein the cooling unit section has electrical insulation properties at least on a partial surface on which the power switching device group is mounted. The power conversion device according to claim 2,
The plurality of cooling unit sections are arranged via members having electrical insulation properties. The power conversion device according to claim 1,
The said cooling part has a base part which mounts the said power switching device group, and a fin part whose cooling capability is higher than another site | part, The power converter device characterized by the above-mentioned. The power conversion device according to claim 8, wherein
The power converter according to claim 1, wherein a plurality of plate-like members are arranged in parallel on a surface of the base portion other than the surface on which the power switching device group is mounted. The power conversion device according to claim 8, wherein
The power conversion device, wherein the fin portion has a plurality of rod-like members arranged in parallel on a surface of the base portion other than the surface on which the power switching device group is mounted. The power conversion device according to claim 8, wherein
A surface of the base portion on which the power switching device group is mounted is configured by a substantially wave-shaped surface group having a plurality of slopes. The power conversion device according to claim 11, wherein
The power switching device group is mounted on a surface group having substantially the same inclination. The power conversion device according to claim 2,
The cooling unit section includes a base section on which the power switching device group is mounted, and a fin section having a higher cooling capacity than other parts. The power conversion device according to claim 13, wherein
The power converter according to claim 1, wherein a plurality of plate-like members are arranged in parallel on a surface of the base portion other than the surface on which the power switching device group is mounted. The power conversion device according to claim 13, wherein
The power conversion device according to claim 1, wherein a plurality of rod-like members are arranged in parallel on a surface of the base portion other than a surface on which the power switching device group is mounted. The power conversion device according to claim 13, wherein
A surface of the base portion on which the power switching device group is mounted is configured by a substantially wave-shaped surface group having a plurality of slopes. The power conversion device according to claim 16, wherein
The power switching device group is mounted on a surface group having substantially the same inclination. The power conversion device according to claim 1,
The power switching device is a module in which one or more switching elements are mounted on a substrate, a bridge circuit is configured with metal wiring, and an electrical connection portion with the outside is covered with an insulating member. Power converter. The power conversion device according to claim 1,
The power switching device includes one or more switching elements mounted on a substrate, a bridge circuit formed of metal wiring, an electrical connection with the outside, and the substrate mounted with the switching element and the diode A power conversion device, characterized in that the module is a module in which the back surface of the mounting surface is covered with an insulating member. The power conversion device according to claim 18, wherein
The said board | substrate consists of a laminated body of a metal, an insulated substrate, and a metal, The power converter device characterized by the above-mentioned.

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