JP2006261598A - Electronic component comprising shield case - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component comprising a shield case capable of easily positioning the shield case to a ceramic circuit board for fitting in excellent connection stability. <P>SOLUTION: The electronic component comprises a multilayer ceramic circuit board 2 in which a hole 9 facing the rear side is formed on the substrate surface on which electronic component elements 3 and 4 are mounted, and a shield case 5 which comprises an extension 6 that can be engaged with the hole 9 and can be attached to cover the substrate surface of the multilayer ceramic circuit board 2. The extension 6 is inserted in the hole 9, and the shield case 5 and the multilayer ceramic circuit board 2 are made to abut with each other for mutual positioning, so that the shield case 5 is attached to the multilayer ceramic circuit board 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component having a shield case, and more particularly to an electronic component having a shield case formed by coating a ceramic circuit board on which various electronic component elements are mounted with a shield case.

  Conventionally, an electronic component having a shield case is widely known as, for example, a high frequency module used in a wireless local area network (LAN), Bluetooth, or the like.

  Specifically, a wiring pattern for forming a predetermined circuit is formed on a ceramic circuit board, and a predetermined electronic component element is mounted on the wiring pattern. And the shield case used as the earth potential of these electronic component elements is attached to the ceramic circuit board so that these electronic component elements may be covered.

As a method of attaching a shield case to a ceramic circuit board, for example, as known in Patent Document 1 and Patent Document 2, various methods have been proposed. it can.
(1) A method in which an extending part extending along the left and right side surfaces of the ceramic circuit board is provided at the lower end of the shield case, and the side surfaces of the ceramic circuit board are sandwiched between the left and right extending parts.
(2) A method of bonding and fixing the shield case to the ceramic circuit board using a resin adhesive.
JP 2003-8393 A. JP 2001-119169A.

  However, as described in the above (1), in the method of attaching the side surface of the ceramic circuit board with the left and right extending portions provided at the lower end of the shield case, until the extending portion can contact the side surface of the ceramic circuit board, It can be easily realized by increasing the length. However, as shown in Patent Document 1, for example, since the extended portion has to be extended outside the ceramic circuit board, the dimension of the shield case becomes larger than that of the board.

  Further, as shown in Patent Document 2, even if a notch is provided on the side surface of the ceramic circuit board and the extension is absorbed in the notch, the ceramic circuit is absorbed by the extension. Since the outer shape of the substrate has to be increased, the size of the electronic component is increased.

  Furthermore, both the ceramic circuit board dimensions and the shield case dimensions tend to vary, and depending on the combination, there is a problem that the predetermined clamping force cannot be obtained, or the extension portion cannot be inserted into the side surface of the ceramic circuit board. .

  On the other hand, as described in (2) above, it can be easily realized by selecting a resin adhesive having reflow heat resistance. However, there is a problem that the number of processes for applying the resin adhesive and waiting for the curing increases, and the workability is poor.

  Therefore, there is a technical problem to be solved in order to provide an electronic component having a shield case that can be easily positioned on a ceramic circuit board and can be mounted with excellent connection stability. The present invention aims to solve this problem.

  The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is a ceramic circuit board formed by forming a hole toward the back side on the surface of the board on which the electronic component element is mounted, A shield case that has an extending portion that can be inserted into and engaged with the hole, and that is attached to cover a surface of the ceramic circuit board, and the shield portion is inserted into the hole, An electronic component having a shield case attached to the ceramic circuit board is provided.

  According to this configuration, when the extending portion of the shield case is inserted into the hole of the ceramic circuit board, the shield case is positioned on the ceramic circuit board, and the shield case is attached to the ceramic circuit board.

  According to a second aspect of the present invention, there is provided a shield case in which a shield case solder joint land is provided on the surface of the substrate positioned outside the shield case when the shield case is attached to the ceramic circuit board. Provide electronic components.

  According to this configuration, the shield case solder bonding land and the shield case are soldered, and a reliable connection is obtained.

  The invention according to claim 3 provides an electronic component having a shield case in which the hole is a through hole.

  According to this configuration, it is possible to eliminate the positioning hole provided in addition to the through hole.

  The invention according to claim 4 provides an electronic component having a shield case in which the extended portions of the shield case are provided at the four corners of the shield case, and at least four holes are provided corresponding to the extended portions. To do.

  According to this configuration, the shield case and the ceramic circuit board can be reliably positioned using the four through holes and the four extending portions.

  The invention according to claim 5 provides an electronic component having a shield case in which the ceramic circuit board is a multilayer wiring board and the holes are provided from at least a surface layer to an intermediate layer.

  According to this configuration, it is possible to obtain an electronic component having a ceramic circuit board having a multilayer shape and having holes provided at least from the surface layer to the intermediate layer.

  According to a sixth aspect of the present invention, the outer dimension of the ceramic case is such that the outer dimension of the shield case is positioned within the outer periphery of the surface of the ceramic substrate when the shield case is attached to the ceramic circuit board. Provided is an electronic component having a shield case that is the same or smaller than that of the shield case.

  According to this configuration, a miniaturized electronic component structure in which the shield case is within the width of the ceramic circuit board can be obtained.

  According to the first aspect of the present invention, the shield case and the ceramic circuit board can be easily positioned by simply inserting the extending portion of the shield case into the hole of the ceramic circuit board. In this state, the shield case and the ceramic circuit board can be easily fixed.

  According to the second aspect of the present invention, since the shield case solder bonding land and the shield case can be soldered, in addition to the effect of the first aspect of the invention, it is possible to mount with excellent connection stability. become.

  In the invention described in claim 3, since it is not necessary to provide a new positioning hole by using a through hole in the hole for positioning the shield case, in addition to the effect of the invention described in claim 1, the structure is further simplified. And miniaturization becomes possible.

  In the invention described in claim 4, since the shield case and the ceramic circuit board can be reliably positioned using the four through holes and the four extending portions, in addition to the effect of the invention described in claim 3 Therefore, it is possible to mount with excellent positioning and connection stability.

  Since the invention according to claim 5 has a ceramic circuit board which is multi-layered and has holes provided at least from the surface layer to the intermediate layer, in addition to the effect of the invention according to claim 3 or 4, high density circuit Can be realized.

  According to the sixth aspect of the present invention, since the shield case is attached in a state of being accommodated within the width of the ceramic circuit board, in addition to the effects of the first, second, third, fourth or fifth aspect of the invention, a miniaturized electronic A part structure is obtained.

  In order to achieve the purpose of obtaining an electronic component having a shield case that can be easily positioned on a ceramic circuit board and can be mounted with excellent connection stability, a back surface is provided on the substrate surface on which the electronic component element is mounted. A ceramic circuit board formed with a hole toward the side, and a shield case that has an extending portion that can be inserted into and engaged with the hole, and that is attached to cover the substrate surface of the ceramic circuit board, This was realized by inserting an extending portion into the hole and attaching the shield case to the ceramic circuit board.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a first embodiment of an electronic component of the present invention, FIG. 1 is a plan view of the electronic component, FIG. 2 is a perspective view of the electronic component, and FIG. 3 is a line AA in FIG. FIG. 4 shows an exploded perspective view of the main part of the electronic component.

  The electronic component of the present embodiment is a high-frequency module for performing wireless communication such as wireless LAN and Bluetooth, and is mounted on an information processing apparatus such as a personal computer and used for data communication between the apparatuses.

  1 to 4, the high-frequency module 1 includes a multilayer ceramic circuit board 2, an electronic component element 3 such as a chip resistor and a chip capacitor, an IC chip 4 that is also an electronic component element, and a shield case 5. Yes.

  The shield case 5 covers the upper surface of the multilayer ceramic circuit board 2 in order for the IC chip 4 mounted on the upper surface of the multilayer ceramic circuit board 2 to suppress external noise when processing high frequency signals. It is attached. The shield case 5 is formed, for example, by pressing a metal plate into a concave shape, and its planar shape is a substantially quadrangular shape, and has a notch surface 5a at each corner. In addition, extending portions (projections) 6 and 6 that extend straight downward are integrally provided at the lower ends of the pair of cutout surfaces 5a and 5a facing each other along a diagonal line.

The multilayer ceramic circuit board 2 is a board whose length in the XY direction is substantially the same as that of the shield case 5 and in which each corner is not provided with a notch, and the planar shape is substantially square. Therefore, when the shield case 5 is overlaid on the multilayer ceramic circuit board 2, as shown in FIG. 1, the four corners are on the outside of the shield case 5 as much as the cut-out surface 5a is provided at each corner of the shield case 5. Protruding protrusion areas 2a to 2d are provided.

  The multilayer ceramic circuit board 2 has a structure in which 5 to 10 layers (seven layers in this example) ceramic plates each formed with wiring and via patterns are integrally fired. On the upper surface of the multilayer ceramic circuit board 2, connection pads and wiring patterns (not shown) are formed in addition to the protruding electrodes 7, and conductive films connected to the wiring patterns are formed in the protruding regions 2b and 2d. A shield case solder bonding land 8 is provided.

  Further, the multilayer ceramic circuit board 2 has a hole 9 from the upper surface to the lower surface at the boundary between the projecting regions 2a and 2c, corresponding to the extending portion 6 of the shield case 5, so that the extending portion 6 can be fitted and inserted. On the other hand, it is formed up to a middle position (up to the bottom surface position of the four layers in this example). The shape of the extension 6 is not particularly limited. For example, the extension 6 may be formed in a hemispherical shape. In this case, the extension 6 can be easily inserted into the hole 9. Moreover, although the hole 9 may penetrate to the lower surface of the multilayer ceramic circuit board 2, when it is made halfway, an internal circuit can be formed in the part which does not provide the hole of five layers or less.

  On the lower surface of the multilayer ceramic circuit board 2, a protruding electrode 10 for connection to a printed wiring board (not shown) is formed. The protruding electrode 10 is configured to protrude several tens of μm to several hundreds of μm downward from the lower surface of the multilayer ceramic circuit board 2, and wiring on the upper surface via vias (not shown) and the internal wiring pattern 11 of the multilayer ceramic circuit board 2. It is connected to the pattern or upper surface protruding electrode 7.

  Therefore, in the high-frequency module 1 configured as described above, the shield case 5 is formed from the upper side of the multilayer ceramic circuit board 2 on which the IC chip 4 and the other electronic component elements 3 are mounted with the extending portion 6 facing downward. When the extending portion 6 is fitted and inserted into the hole 9 until it faces the multilayer ceramic circuit board 2 and the lower end surface of the shield case 5 comes into contact with the upper surface of the multilayer ceramic circuit board 2, the shield case 5 becomes the multilayer ceramic circuit board. 2 are joined, positioned and attached. Thereafter, the shield case 5 is securely fixed to the multilayer ceramic circuit board 2 by soldering between the shield case solder bonding land 8 and the cutout surface 5 a of the shield case 5. The shield case 5 fits within the width of the multilayer ceramic circuit board 2 in the XY direction, so that the miniaturized high-frequency module 1 is obtained.

  Next, an electronic component according to a second embodiment of the present invention will be described with reference to FIGS. 5 to 8 show a second embodiment of the electronic component of the present invention, FIG. 5 is a plan view of the electronic component, FIG. 6 is a perspective view of the electronic component, and FIG. 7 is a BB line in FIG. FIG. 8 shows an exploded perspective view of the main part of the electronic component.

  The electronic component in the second embodiment is the high-frequency module 1 as in the first embodiment. This high-frequency module 1 uses a through hole 12 in the hole 9 provided in the protruding regions 2a and 2c shown in FIGS. 1 to 4, and is used for shield case solder bonding provided in the protruding regions 2b and 2d. Since the land 8 is eliminated and the other configurations are the same as those in FIGS. 1 to 4, the same members are denoted by the same reference numerals, and redundant description is omitted.

  The through hole 12 provided in the multilayer ceramic circuit board 2 has a diameter that allows the extension portion 6 to be fitted and inserted, and is formed to a midway position (up to four layers in this example). ing. The through hole 12 may penetrate to the lower surface.

  Therefore, in the structure of the high-frequency module 1 of the second embodiment, the shield case is formed from the upper side of the multilayer ceramic circuit board 2 on which the IC chip 4 and other electronic component elements 3 are mounted with the extending portion 6 facing downward. 5, until the lower end surface of the shield case 5 is joined to the upper surface of the multilayer ceramic circuit board 2, the extending portion 6 is fitted and inserted into the through hole 12, so that the shield case 5 covers the multilayer ceramic circuit board 2. Is positioned and attached. After that, when the extension portion 6 and the through hole 12 are soldered, the shield case 5 is securely fixed to the multilayer ceramic circuit board 2.

  Thereby, in the case of the structure of the second embodiment, the hole 9 and the shield case solder bonding land 8 used in the first embodiment can be eliminated, and the structure can be simplified.

  In the structure of the high-frequency module 1 of the second embodiment, the structure in which the through holes 12 and the extending portions 6 are provided at the two corners is disclosed. However, for example, as shown in FIG. It may be. In FIG. 9, members denoted by the same reference numerals as those in FIGS. 5 to 8 are members corresponding to FIGS.

  The present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

It is a top view of the electronic component shown as 1st Example of this invention. It is a perspective view of the electronic component which is a 1st Example. FIG. 2 is an enlarged sectional view taken along line AA in FIG. 1. It is a principal part disassembled perspective view of the electronic component shown as 1st Example of this invention. It is a top view of the electronic component shown as a 2nd Example of this invention. It is a perspective view of the electronic component which is a 2nd Example. FIG. 6 is an enlarged sectional view taken along line B-B in FIG. 5. It is a principal part disassembled perspective view of the electronic component shown as 2nd Example of this invention. It is a top view of the electronic component shown as a modification of the 2nd Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 High frequency module 2 Multilayer ceramic circuit board 2a-2d Protrusion area | region 3 Electronic component element 4 IC chip (electronic component component)
DESCRIPTION OF SYMBOLS 5 Shield case 5a Notch surface 6 Extension part 7 Protruding electrode 8 Shield case soldering land 9 Hole 10 Protruding electrode 11 Internal wiring pattern 12 Through hole

Claims (6)

A ceramic circuit board formed with a hole toward the back side on the surface of the board on which the electronic component element is mounted;
A shield case that has an extending portion that can be inserted into and engaged with the hole, and that is attached to cover the surface of the ceramic circuit board;
An electronic component having a shield case, wherein the extended portion is inserted into the hole and the shield case is attached to the ceramic circuit board.   The electronic component having a shield case according to claim 1, wherein when the shield case is attached to the ceramic circuit board, a shield case solder bonding land is provided on the surface of the board located outside the shield case.   The electronic component having a shield case according to claim 1, wherein the hole is a through hole.   4. The electronic component having a shield case according to claim 3, wherein the extended portions of the shield case are provided at four corners of the shield case, and at least four holes are provided corresponding to the extended portions.   5. The electronic component having a shield case according to claim 3, wherein the ceramic circuit board is a multilayer wiring board, and the holes are provided from at least a surface layer to an intermediate layer. The outer dimension of the shield case is the same as or smaller than the outer dimension of the ceramic circuit so that it is located within the outer periphery of the substrate surface of the ceramic substrate when attached to the ceramic circuit board. An electronic component having a shield case as defined in claim 1, 2, 3, 4, or 5.

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