JP2005311106A - Wiring circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring circuit board, in which the reliability of moisture resistance can be prevented from lowering and short circuiting among terminals can be prevented, even if the wiring circuit board is connected with an electronic components via an anisotropic conductive film. <P>SOLUTION: A connection terminal part 5 is formed, such that a conductor pattern 3, being exposed from an opening 6 when a cover insulation layer 4 is opened at one end part of a flexible wiring circuit board 1, serves as a terminal 7 for connection with the terminal 35 of an electronic component 31 via an anisotropic conductive film 32. At its connection terminal part 5, end edge 8 of the opening 6 in the cover insulation layer 4 is shaped in waveform along the width direction, such that the end edge projects in substantially V-shape toward one side of the flexible wiring circuit board 1 in the longitudinal direction, in the region between the terminals 7, and projects in substantially V-shape toward the other side in the region above each terminal 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a printed circuit board, and more particularly, to a printed circuit board including a connection terminal portion connected to an electronic component through an anisotropic conductive film.

  For example, a liquid crystal display device is used for a display screen of a mobile phone. In this liquid crystal display device, a printed circuit board is electrically connected via an anisotropic conductive film in which conductive particles are dispersed in an adhesive.

  Such a printed circuit board connected to an electronic component such as a liquid crystal display device through an anisotropic conductive film is usually covered at one end in the longitudinal direction of the printed circuit board 41 as shown in FIG. The connection layer 42 is formed by opening the insulating layer 43, and the conductor pattern 45 exposed from the opening 44 serves as a terminal 46 connected to the electronic component through the anisotropic conductive film. ing.

  Then, the printed circuit board 41 and the electronic component are provided with an anisotropic conductive film in the opening 44, and the terminals of the electronic component are overlaid on the installed anisotropic conductive film, and then heated. Electrical connection is established by applying pressure.

  In such a connection terminal portion 42, the edge 47 of the opening 44 in the cover insulating layer 43 is generally planar along the direction orthogonal to the longitudinal direction of the conductor pattern 45, that is, along the width direction of the printed circuit board 42. It is formed in a straight line.

Further, for example, in a flexible wiring board for a liquid crystal panel, a portion of a circuit pattern excluding a large number of aligned electrode terminals used for connection with a liquid crystal panel and a mounted IC chip is covered with a protective film. By forming the edge of the film in the shape of a sine wave, the edge of the protective film becomes longer than the width of the electrode terminal within the range of the width of the electrode terminal, and corrosion due to the influence of moisture in the atmosphere It has been proposed to prevent (see, for example, Patent Document 1).
JP 2003-46213 A

  However, in the printed circuit board 41 shown in FIG. 6, when heated and pressurized, the anisotropic conductive film flows due to melting of the adhesive, and the conductive particles 48 form the cover insulating layer 43 as shown in FIG. 7. There is a case where it is pushed toward the edge 47 and aggregates there. Then, due to this, the moisture resistance reliability decreases, and further, a short circuit between the terminals 46 may occur at the time of connection by heating and pressurization.

  Also, in the flexible wiring board for a liquid crystal panel described in Patent Document 1, when the electrode terminal is connected to the IC chip through an anisotropic conductive film, the end of the protective film formed in a sine wave shape In the portion where the edge is recessed between the electrode terminals with respect to the side where the electrode terminals are exposed, the moisture resistance reliability is lowered as described above, and further, when the connection is made by heating and pressurization. In some cases, a short circuit occurs between the electrode terminals.

  An object of the present invention is to provide a printed circuit board that can prevent deterioration of moisture resistance reliability and short circuit between terminals even when connected to an electronic component via an anisotropic conductive film. .

  In order to achieve the above object, a wired circuit board according to the present invention includes a base insulating layer, a conductor pattern formed on the base insulating layer and formed of a plurality of wirings provided at predetermined intervals, and A plurality of wirings formed by an insulating cover layer provided on the insulating base layer so as to cover the conductive pattern and an opening of the insulating cover layer, and exposed from the opening, contain conductive particles. A plurality of terminals for connecting to an electronic component via an anisotropic conductive film, and between all the terminals, the longitudinal direction of the wiring in at least one of the terminals A particle storage section capable of storing the conductive particles is formed at an intersection between the orthogonal width direction edge and the edge of the opening in the insulating cover layer.

  When this printed circuit board is connected to an electronic component via an anisotropic conductive film, the anisotropic conductive film flows due to heat and pressure, and the conductive particles are formed in the openings in the cover insulating layer. Even if it is pushed close to the edge, it can be stored in the particle storage part formed at the intersection of the edge of the insulating cover layer and the edge in the width direction of the terminal. Therefore, it is possible to prevent the conductive particles from staying in the middle between the terminal portions. As a result, it is possible to prevent a decrease in moisture resistance reliability and a short circuit between terminals.

  In the present invention, in the region between the terminals, the edge of the opening in the insulating cover layer is close to the terminal along the width direction at the intersection. Accordingly, it is preferable that the first opening is formed so as to be inclined along the longitudinal direction toward the side where the opening is not formed.

  If the particle storage part is formed in this way, the conductive particles can be reliably stored.

  Further, in the present invention, in the region between the terminals, the edge of the opening in the insulating cover layer is inclined from one terminal to the other terminal along the width direction. It is suitable that it is formed.

  Thereby, a particle | grain storage part can be formed easily.

  Further, in the present invention, the particle storage portion is an intersection between the width direction edge of the wiring in both the terminals and the edge of the opening in the cover insulating layer in a region between the terminals. In addition, it is preferable that each of them is formed.

  If the particle storage portion is formed in this way, conductive particles can be stored on both sides in the width direction in the region between the terminals. Therefore, it is possible to more reliably prevent a decrease in moisture resistance reliability and a short circuit between terminals.

  In this case, in the region between the terminals, the edge of the opening in the cover insulating layer is along the width direction from the both terminals toward the middle position between them. It is preferable that the film is formed so as to incline toward the side where the opening is formed along the longitudinal direction.

  Thereby, the particle | grain storage part can be easily and reliably formed in the width direction both sides in the area | region between each terminal.

  Further, in this case, in the region above all the terminals, the edge of the opening in the insulating cover layer extends along the width direction from the both edges in the width direction of each terminal. It is preferable that it is formed so as to incline toward the position where the opening is not formed along the longitudinal direction.

  If the edge of the opening in the insulating cover layer is formed in this way, the edge is not elongated in the longitudinal direction, and the particle reservoir is easily and reliably provided on both sides in the width direction in the region between the terminals. Can be formed.

  According to the wired circuit board of the present invention, it is possible to prevent the conductive particles from staying in the middle between the respective terminal portions, and to prevent a decrease in moisture resistance reliability and a short circuit between the terminals. it can.

  FIG. 1 is a manufacturing process diagram showing a method for manufacturing a flexible printed circuit board, which is an embodiment of the printed circuit board of the present invention.

  In FIG. 1, in the manufacturing method of the flexible printed circuit board 1, first, as shown in FIG. 1A, a base insulating layer 2 is prepared. The insulating base layer 2 is not particularly limited as long as it has insulating properties and flexibility. For example, polyimide resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin It consists of a resin film such as polyvinyl chloride resin. Preferably, it consists of a polyimide resin film. The insulating base layer 2 has a thickness of, for example, 5 to 30 μm.

  Next, in this method, a conductor pattern 3 is formed on the base insulating layer 2 as shown in FIG. The conductor pattern 3 is not particularly limited as long as it has conductivity, but for example, metal such as copper, chromium, nickel, aluminum, stainless steel, copper-beryllium, phosphor bronze, iron-nickel, and alloys thereof. Made of foil. Preferably, it consists of copper foil. Moreover, the thickness of the conductor pattern 3 is 3-40 micrometers, for example.

  The formation of the conductor pattern 3 is not particularly limited, but a known patterning method such as an additive method or a subtractive method is used.

  For example, in the subtractive method, a two-layer substrate in which a metal foil is laminated on the base insulating layer 2 is prepared, and the conductor pattern 3 is formed by patterning the metal foil of the two-layer substrate by etching. Can be formed.

  In addition, as shown in FIG. 2, the conductor pattern 3 has a plurality of (four) wires 3 a, 3 b, 3 c, and 3 d in a direction orthogonal to the longitudinal direction of the flexible printed circuit board 1 (hereinafter referred to as a width direction). ) Are provided as patterns arranged in parallel along the longitudinal direction of the flexible printed circuit board 1 at a predetermined interval from each other. The width (line width) of each of the wirings 3a, 3b, 3c and 3d is, for example, 10 to 100 μm, preferably 20 to 80 μm, and the interval (line space) between the wirings 3a, 3b, 3c and 3d is For example, it is 10-100 micrometers, Preferably it is 20-80 micrometers.

  Next, in this method, as shown in FIG. 1C, the insulating cover layer 4 is formed on the insulating base layer 2 so as to cover the conductive pattern 3, thereby obtaining the printed circuit board 1.

  The insulating cover layer 4 is made of the same resin film as described above, and is preferably made of a polyimide resin film. The insulating cover layer 4 is formed by, for example, applying or printing a resin solution, drying and curing, or attaching a resin film. Furthermore, after applying the photosensitive resin solution, it can be formed simultaneously with patterning by exposure and development. The insulating cover layer 4 has a thickness of 2 to 40 μm, for example.

  Further, in this method, when the insulating cover layer 4 is formed, a connection terminal portion for opening one end in the longitudinal direction of the flexible printed circuit board 1 in the insulating cover layer 4 to be electrically connected to the electronic component 31. 5 is formed.

  As shown in FIG. 2, the connecting terminal portion 5 has one end in the longitudinal direction of the flexible printed circuit board 1 (from one longitudinal end edge of the flexible wired circuit board 1 to the opposite end along the longitudinal direction with respect to the one end edge. Is formed by forming the opening 6 of the insulating cover layer 4 at a predetermined portion).

  For example, when printing a resin solution or patterning a photosensitive resin, the opening 6 is formed at one end in the longitudinal direction of the flexible printed circuit board 1 at the same time as the insulating cover layer 4 is formed. Formed as a pattern.

  Further, for example, when the resin solution is applied over the entire surface or when a resin film is attached, the opening 6 is formed by a known processing method such as drilling, punching, laser processing, or etching.

  In the connection terminal portion 5, a plurality of terminals at which exposed portions (shaded portions) from the openings 6 in the plurality of wirings 3 a, 3 b, 3 c, and 3 d are connected to the electronic component 31 through the anisotropic conductive film 32. 7a, 7b, 7c, and 7d (hereinafter, when the terminals are not distinguished from each other, only the reference numeral “7” is used).

  For example, a gold plating layer may be formed on the surfaces of these terminals 7 in order to improve the corrosion resistance.

  And in the flexible printed circuit board 1 obtained in this way, in the connection terminal part 5, between all the terminals 7, the particle | grain storage part 9 for storing the electroconductive particle 33 of the anisotropic conductive film 32 is provided. Is formed. As shown in FIG. 3, each particle reservoir 9 has a width direction edge 10 of both terminals 7 facing each other in the width direction, and an opening 6 in the cover insulating layer 4 in the region between the terminals 7. Intersection with the edge 8 (the end in the width direction in the region between the terminals 7, from the intersection between the width direction edge 10 of the terminal 7 and the edge 8 of the cover insulating layer 4, inward in the width direction) (Predetermined portions) 11 are formed respectively.

  More specifically, in the connection terminal portion 5, as shown in FIG. 2, the edge 8 of the opening 6 in the insulating cover layer 4 is formed in a waveform, and in the region between the terminals 7. As shown in FIG. 3, the edge 8 of the insulating cover layer 4 is formed with an opening 6 along the longitudinal direction from both terminals 7 toward the middle position between both terminals 7 along the width direction. In the region between the terminals 7, the edge 8 of the insulating cover layer 4 protrudes in a substantially V shape toward the one edge of the flexible printed circuit board 1 so as to incline toward the side where it is formed. It is formed to do.

  And the particle | grain storage part 9 is the edge of the cover insulating layer 4 which inclines to the side in which the opening part 6 is not formed along a longitudinal direction, as it approaches each terminal 7 along the width direction in the cross | intersection part 11. 8, that is, at the intersecting portion 11, the edge 8 of the insulating cover layer 4 extending outward in the width direction in the region between the terminals 7 is the other side in the longitudinal direction of the flexible printed circuit board 1. It is formed as an inclined surface which inclines toward.

  More specifically, the edge 8 of the insulating cover layer 4 is located in the region between the terminals 7 with respect to the most protruding position 12 that protrudes most toward the one end edge in the longitudinal direction. The intersection 14 with the width direction edge 10 of the other terminal 7 (the right side in the drawing) is arranged on the other side in the longitudinal direction of the flexible printed circuit board 1 with respect to the intersection 13 with the width direction edge 10.

  In the longitudinal direction of the flexible printed circuit board 1, the ratio (L2 / L1) of the length L2 from the most protruding position 12 to the other intersection 14 with respect to the length L1 from the most protruding position 12 to one intersection 13 is, for example, 0.1 to 10, preferably 0.25 to 4.

  Further, the ratio (L2 / W) of the length L2 from the most protruding position 12 to the other intersection 14 with respect to the length W between the terminals 7 is, for example, 0.5 to 2, preferably 1 to 1. .5.

  In addition, in the connection terminal portion 5, as shown in FIG. 2, the edge 8 of the cover insulating layer 4 extends along the width direction in the region above all the terminals 7. From the edge 10 toward the middle position between them, it is inclined along the longitudinal direction to the side where the opening 6 is not formed, that is, in the region above each terminal 7, The edge 8 is formed so as to protrude in a substantially V shape toward the other side of the flexible printed circuit board 1.

  That is, in this connection terminal portion 5, the edge 8 of the insulating cover layer 4 is substantially directed toward one side (opening 6 side) in the longitudinal direction of the flexible printed circuit board 1 in the region between the terminals 7. It protrudes in a V shape and protrudes in a substantially V shape toward the other side (opposite opening 6 side) in a region above each terminal 7 (depresses in a substantially V shape with respect to one side). In addition, it is formed in a waveform along the width direction.

  If the edge 8 of the insulating cover layer 4 is formed in such a waveform, the edge 8 does not become longer in the longitudinal direction of the flexible printed circuit board 1 but on both sides in the width direction in the region between the terminals 7. The particle reservoir 9 can be easily and reliably formed.

  And the electronic component 31 is connected to the flexible printed circuit board 1 obtained in this way through the anisotropic conductive film 32 in the connection terminal portion 5 as shown in FIG. .

  The anisotropic conductive film 32 is a polymer film in which the conductive particles 33 are uniformly dispersed in the adhesive 34, and the terminal 7 of the connection terminal portion 5 and the terminal 35 of the electronic component 31 are heated and pressed. Are connected in the thickness direction.

  The anisotropic conductive film 32 has a thickness of, for example, 10 to 40 μm, preferably 20 to 30 μm, and the average particle diameter of the conductive particles 33 is, for example, 2 to 20 μm, preferably 4 to 15 μm. is there.

  Further, the electronic component 31 is not particularly limited, and examples thereof include a liquid crystal display device.

  In this connection, the anisotropic conductive film 32 is installed in the opening 6, the terminal 35 of the electronic component 31 is overlaid on the installed anisotropic conductive film 32, and then heated and pressurized. At this time, even when the anisotropic conductive film 32 flows due to the melting of the adhesive 34 and the conductive particles 33 are pressed against the edge 7 of the cover insulating layer 4 in the opening 6, as shown in FIG. The conductive particles 33 can be stored in the particle storage portions 9 formed on both sides in the width direction in the region between the terminals 7. Therefore, it is possible to prevent the conductive particles 33 from staying in the middle between the terminals 7. As a result, it is possible to prevent a decrease in moisture resistance reliability and a short circuit between the terminals 7.

  In addition, the particle storage portion 9 is a region between the terminals 7, and an edge 8 of the insulating cover layer 4 extending outward in the width direction at the intersecting portion 11 of both the terminals 7 is a flexible wiring. Since it forms as an inclined surface which inclines toward the other side of the longitudinal direction of the circuit board 1, the conductive particle 33 can be reliably collected, forming the particle storage part 5 easily.

  In the above description, the particle reservoirs 9 are formed on both sides in the width direction in the region between the terminals 7. For example, as shown in FIG. In this area, it may be formed on one side in the width direction. That is, in FIG. 4, the edge 8 of the opening 6 in the cover insulating layer 4 is formed in a waveform, and in the region between the terminals 7, as shown in FIG. The edge 8 is formed so as to incline toward the side where the opening 6 is not formed along the longitudinal direction from one terminal 7 toward the other terminal 7 along the width direction. That is, in the region between the terminals 7, the edge 8 of the insulating cover layer 4 is formed so as to be inclined between the one terminal 7 and the other terminal 7.

  And the particle | grain storage part 9 is a cover insulating layer which inclines toward the side in which the opening part 6 is not formed along a longitudinal direction as it approaches each terminal 7 along the width direction in any one of the crossing parts 11. 4, that is, at the intersecting portion 11, the edge 8 of the insulating cover layer 4 extending outward in the width direction in the region between the terminals 7 is the length of the flexible printed circuit board 1. It is formed as an inclined surface inclined toward the other side of the direction.

  More specifically, the edge 8 of the insulating cover layer 4 protrudes toward the one end edge in the longitudinal direction in the region between the terminals 7, and the intersection position 15 with the width direction edge 10 of any one terminal 7. The crossing position 16 of the other terminal 7 with the width direction edge 10 is arranged on the other side in the longitudinal direction of the flexible printed circuit board 1. The ratio (L3 / W) of the length L3 from one intersection position 15 to the other intersection position 16 in the longitudinal direction of the flexible printed circuit board 1 with respect to the length W between the terminals 7 is, for example, 0.5 ˜2, preferably 0.8˜1.5.

  Further, in the connection terminal portion 5, as shown in FIG. 4, the edge 8 of the cover insulating layer 4 is on one side or the other side of the flexible printed circuit board 1 in the region above all the terminals 7. It is formed so as to protrude in a substantially V shape.

  Also in such a flexible printed circuit board 1, when the electronic component 31 is connected via the anisotropic conductive film 32, the anisotropic conductive film 32 flows due to melting of the adhesive 34, and the conductive particles 33. As shown in FIG. 5, the conductive particles 33 are formed on one side in the width direction in the region between the terminals 7 even when the opening 6 is pushed toward the edge 7 of the insulating cover layer 4. The particles can be stored in the particle storage unit 9. Therefore, it is possible to prevent the conductive particles 33 from staying in the middle between the terminals 7. As a result, it is possible to prevent a decrease in moisture resistance reliability and a short circuit between the terminals 7.

  Further, the particle storage portion 9 is an area between the terminals 7, and an edge 8 of the insulating cover layer 4 extending outward in the width direction is formed at the intersection portion 11 of the one terminal 7. Since it forms as an inclined surface which inclines toward the other side of the longitudinal direction of the circuit board 1, the conductive particle 33 can be reliably collected, forming the particle storage part 5 easily.

  In the above description, the edge 8 of the opening 6 in the cover insulating layer 4 is formed in a corrugated shape, but is not particularly limited as long as the above-described particle reservoir 9 can be formed. For example, zigzag, It can be formed in various forms.

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to the examples and comparative examples.

Example 1
A two-layer substrate was prepared in which a copper foil having a thickness of 18 μm was laminated on a base insulating layer made of a polyimide film having a thickness of 25 μm. Next, the copper foil was etched with a ferric chloride aqueous solution to form a conductor pattern composed of a plurality of wirings having a line width of 50 μm and a line space of 50 μm (see FIG. 1B). Thereafter, the cover insulating layer made of epoxy resin is formed with an opening at one end in the longitudinal direction, and the edge of the cover insulating layer in the opening is one side in the longitudinal direction in the region between the terminals. In the region above each terminal, it is formed so as to form a waveform along the width direction so as to protrude in a substantially V shape toward the other side (see FIG. 1 (c), see FIG. 2).

  Thereafter, the surface of the terminal exposed from the insulating cover layer was plated with gold having a thickness of 0.2 μm to obtain a printed circuit board.

Comparative Example 1
In the insulating cover layer made of epoxy resin, an opening is formed at one edge in the longitudinal direction, and the edge of the insulating cover layer in the opening is perpendicular to the longitudinal direction of the conductor pattern (width direction of the printed circuit board). The printed circuit board was obtained in the same manner as in Example 1 except that the wiring circuit board was formed so as to be formed in a straight line shape in plan view (see FIG. 6).

Evaluation The terminals of the liquid crystal display device were overlaid with the anisotropic conductive film containing conductive particles having an average particle diameter of 5 μm interposed between the terminals of the printed circuit boards of Example 1 and Comparative Example 1, and 200 The terminal of the liquid crystal display device was connected to the terminal of the printed circuit board through the anisotropic conductive film by heating and pressurizing for 15 seconds under the conditions of ° C and 1.5 MPa.

  Thereafter, the liquid crystal display device to which the wired circuit board was connected was stored in an environment of 85 ° C. and 85% (relative humidity), and then an energization test was performed.

  The liquid crystal display device to which the printed circuit board of Comparative Example 1 was connected stopped operating after 150 hours. When the connection part between the printed circuit board and the liquid crystal display device of Comparative Example 1 was observed with a microscope, it was confirmed that the conductive particles were pressed against the edge of the insulating cover layer and aggregated, resulting in poor insulation. It was.

  On the other hand, the liquid crystal display device to which the printed circuit board of Example 1 was connected did not malfunction even after 500 hours.

BRIEF DESCRIPTION OF THE DRAWINGS It is a manufacturing process figure which shows the manufacturing method of the flexible wiring circuit board which is one Embodiment of the wiring circuit board of this invention, Comprising: (a) is the process of preparing a base insulating layer, (b) is a base insulating layer. (C) is a step of forming a cover insulating layer on the base insulating layer so as to cover the conductor pattern; The process of connecting an electronic component through a direction conductive film is shown. It is a top view of the one end part of the flexible printed circuit board shown in FIG. FIG. 3 is an enlarged plan view of a main part showing a region between terminals at one end of the flexible printed circuit board shown in FIG. 2. It is a top view of the one end part of the flexible wiring circuit board which is other one Embodiment of the wiring circuit board of this invention. FIG. 5 is an enlarged plan view of a main part showing a region between terminals at one end of the flexible printed circuit board shown in FIG. 4. It is a top view of the one end part of the conventional flexible printed circuit board. It is a principal part enlarged plan view which shows the area | region between each terminal in the one end part of the flexible printed circuit board shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible wiring circuit board 2 Base insulating layer 3 Conductor pattern 4 Cover insulating layer 5 Connection terminal part 6 Opening part 7 Terminal 8 Edge of cover insulating layer 9 Particle | grain storage part 10 Edge in width direction of wiring 11 Crossing part 31 Electronic component 32 Anisotropic conductive film 33 Conductive particles

Claims (6)

A base insulating layer;
A conductor pattern formed on the base insulating layer and formed of a plurality of wirings provided at a predetermined interval;
A cover insulating layer provided on the base insulating layer so as to cover the conductor pattern;
A plurality of wirings formed by openings in the insulating cover layer and exposed from the openings are connected as a plurality of terminals for connecting to an electronic component through an anisotropic conductive film containing conductive particles. A terminal portion,
Between all the terminals, the conductive particles are disposed at intersections between at least one of the terminals in the width direction perpendicular to the longitudinal direction of the wiring and the edge of the opening in the insulating cover layer. A printed circuit board, wherein a particle storage section capable of storing is formed. In the region between each of the terminals, the particle storage portion extends in the longitudinal direction as the edge of the opening in the insulating cover layer approaches the terminal along the width direction at the intersection. The printed circuit board according to claim 1, wherein the printed circuit board is formed so as to incline toward the side where the opening is not formed. In the region between the terminals, the edge of the opening in the insulating cover layer is formed so as to be inclined from one terminal to the other terminal along the width direction. The wired circuit board according to claim 1 or 2, characterized in that The particle storage portion is formed in each region between the terminals at an intersection between the width direction edge of the wiring in both the terminals and the edge of the opening in the cover insulating layer. The wired circuit board according to claim 1, wherein the printed circuit board is provided. In the region between the terminals, the edge of the opening in the insulating cover layer is along the longitudinal direction from both terminals toward the middle position between both terminals along the width direction. The wired circuit board according to claim 4, wherein the printed circuit board is formed so as to be inclined toward a side where the opening is formed. In the region above all the terminals, the edge of the opening in the insulating cover layer extends along the width direction from the both end edges in the width direction of each terminal toward a midway position between them. The wired circuit board according to claim 5, wherein the printed circuit board is formed so as to be inclined along the longitudinal direction toward a side where the opening is not formed.

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