JP2002270467A - Electronic chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an axial mount electronic chip component which can have external terminals 3 easily inserted even when the inner diameter of an external terminal insertion hole 5 is small so as to greatly suppress play caused by the vibration of an insulating plate 2. SOLUTION: The electronic ship component is composed of an electronic component main body having the external terminals 3 led out from the same end, and the insulating plate 2 which is made to abut against the external terminal lead-out side. The external terminals 3 inserted into external terminal through holes 5 of the insulating plate 2 and bent along the reverse surface of the insulating plate 2 is provided with a guide surface 8 for guiding the insertion into the external terminal through holes 5. Even when the gaps between the external terminals through holes 4 and external terminals 3 are made extremely small, the play caused by the vibration of the insulating plate 2 can be prevented. Further, even when the inner diameter of the external terminal through holes 5 is nearly equal to the outer diameter of the external terminals 3, the guide surface 8 provided to the insulating plate 2 makes it easy to insert the external terminals 3 into the external terminal through holes 5 in such a case.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component which is surface-mounted on a printed circuit board, and more particularly to a chip-type electronic component having an insulating plate for vertical installation.

[0002]

2. Description of the Related Art As shown in FIG. 6, a conventional chip-type electronic component for vertical placement having an insulating plate has an external terminal 3 led out of an electronic component body 1 on an external terminal lead-out side of an outer case 11 as shown in FIG. The one used as a connection electrode by being inserted into the external terminal through hole 5 of the insulated plate 2 and bent and stored along the storage groove 9 provided on the lower surface of the insulated plate 2. Is known (Japanese Patent Laid-Open No. 59-21121).
No. 4). As described above, the chip-type electronic component for vertical placement can be made independent by attaching the insulating plate 2 to the electronic component body 1 and can be surface-mounted.

[0003]

However, in the conventional vertical chip type electronic component as shown in FIG. 6, an external terminal 3 led out of the electronic component body 1 is provided with an external terminal through an external terminal provided on an insulating plate 2. The electronic component main body 1 and the insulating plate 2 are integrally supported by inserting the holes 5 and bending and storing them along the storage grooves provided on the lower surface of the insulating plate 2. Since the inner diameter of the through hole 5 is larger than the outer diameter of the external terminal 3 so that the external terminal 3 can be easily inserted, a gap is provided between the external terminal through hole 5 and the external terminal 3. This causes the insulating plate 2 to rattle even with a small vibration. Therefore, mechanical stress is repeatedly applied to the external terminal 3, and the external terminal 3 may be damaged.

Therefore, the inner peripheral diameter of the external terminal through hole 5 of the insulating plate 2 and the outer peripheral diameter of the external terminal 3 are made substantially the same, and the gap between the external terminal 3 and the external terminal through hole 5 is extremely reduced. It is conceivable to prevent rattling due to the vibration of the insulating plate 2 and to improve the seismic performance. However, when the inner peripheral diameter of the external terminal through-hole 5 is reduced, it becomes very difficult to insert the external terminal 3 into the external terminal through-hole 5 and the yield is deteriorated.

The present invention has been made in view of this problem, and it is possible to greatly suppress the rattling due to the vibration of the insulating plate, improve the seismic performance, and improve the inner diameter of the external terminal through-hole. It is an object of the present invention to provide a chip-type electronic component for vertical installation that allows external terminals to be easily inserted even when the size is reduced.

[0006]

In order to solve the above-mentioned problems, a chip-type electronic component according to the present invention comprises an electronic component main body having a plurality of external terminals led out from the same end face, and an external terminal lead-out side. A chip-type electronic component comprising an insulated plate, wherein the external terminal is inserted through an external terminal through hole of the insulated plate and bent along a lower surface of the insulated plate; A guide surface for guiding the external terminal so as to be inserted into the external terminal through hole is provided in the through hole. According to this configuration, the gap between the external terminal through hole of the insulating plate and the external terminal is extremely reduced, so that it is possible to prevent rattling due to the vibration of the insulating plate and improve the seismic performance. Also, even when the inner peripheral diameter of the external terminal through hole is substantially the same as the outer peripheral diameter of the external terminal, when the external terminal is inserted into the external terminal through hole, the external terminal is provided in the external terminal through hole of the insulating plate. The guideway is
Since the external terminals are guided to be inserted into the external terminal through holes, the external terminals can be easily inserted into the external terminal through holes.

In addition, the electronic component main body has a plurality of external terminals led out from the same end face, and an insulating plate abutted on the external terminal lead-out side. In the chip-type electronic component that is inserted and bent along the lower surface of the insulating plate, a projection having a guide surface for guiding the external terminal to be inserted into the external terminal through hole is provided. I do. According to this configuration, the gap between the external terminal through hole of the insulating plate and the external terminal is extremely reduced, so that it is possible to prevent rattling due to the vibration of the insulating plate and improve the seismic performance. Also, the protrusion provided on the inner wall surface of the external terminal through hole allows the external terminal to be inserted into the external terminal through hole even if the inner peripheral diameter of the external terminal through hole is substantially the same as or smaller than the outer diameter of the external terminal. At this time, since the guide surface provided on the projection guides the external terminal so as to be inserted into the external terminal through hole, the external terminal can be easily inserted into the external terminal through hole.

Further, a fitting portion for fitting the projection is provided on the external terminal. Thus, by providing the external terminal with the fitting portion for fitting the protrusion,
In a state where the predetermined external terminal is inserted into the external terminal through hole, the protrusion is fitted to the fitting portion of the external terminal. The insulating plate can be prevented from being separated from the main body, and the integration between the electronic component body and the insulating plate can be further strengthened.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a chip type electronic component according to an embodiment of the present invention. FIG. 2 is an external perspective view showing a chip-type electronic component according to the embodiment of the present invention. FIG. 3 is an external perspective view showing external terminal through holes provided in the insulating plate of the chip-type electronic component according to the embodiment of the present invention. FIG. 4 is a cross-sectional view showing an external terminal through hole provided in an insulating plate of the chip-type electronic component according to the embodiment of the present invention. FIG. 5 is a sectional view showing a chip-type electronic component according to another embodiment of the present invention.

(Embodiment) The chip-type electronic component of this embodiment comprises an electronic component main body having a plurality of external terminals derived from the same end face, and an insulating plate abutting on the external terminal lead-out side. As a chip-type electronic component in which an external terminal is inserted through an external terminal through hole of the insulating plate and bent along the lower surface of the insulating plate, a chip-type capacitor for vertical placement is exemplified.

As shown in FIG. 1, a chip-type capacitor for vertical installation according to the present embodiment has an outer case 1 made of aluminum.
1, a capacitor element 10 having an anode and a cathode external terminal is housed therein, an opening of the outer case 11 is sealed by a sealing member 4, and the external terminal 3 led out from the opening is connected to the sealing member 4. It is mainly composed of a capacitor body led out from the provided through portion and an insulating plate 2 abutted on the external terminal lead-out side of the outer case 11.

The capacitor element 10 used in this embodiment
Is formed by winding a separator between an anode foil and a cathode foil made of a valve metal such as aluminum, and a capacitor element impregnated with a driving electrolyte, or instead of the driving electrolyte. A solid electrolytic capacitor element using a conductive polymer layer such as polyethylene dioxythiophene is used.

The capacitor element 10 is provided with a sealing member 4 made of an elastic material such as rubber and provided with a penetrating portion through which the external terminal 3 penetrates. The capacitor body 1 is housed in the case 11 and the side and upper ends of the outer case 11 are caulked to form a sealed state.

As shown in FIG. 2, the insulating plate 2 is in contact with the external terminal lead-out side of the capacitor body 1, has a substantially rectangular shape, has a predetermined thickness, and is made of an electrically insulating resin. The insulating plate 2 has an external terminal 3 derived from the capacitor body 1.
Is provided through the external terminal through-hole 5. A receiving groove 9 is provided on the lower surface of the insulating plate 2 in a direction in which the anode and cathode external terminals 3 are separated from each other. The external terminals 3 led out of the capacitor body 1 are inserted through the external terminal through holes 5 and are bent and stored along the storage grooves 9 to complete a chip-type capacitor.

As shown in FIG. 1, the inner diameter of the outer terminal through hole 5 of the insulating plate 2 and the outer diameter of the outer terminal 3 are substantially the same. This is because the inner peripheral diameter of the external terminal through-hole 5 is reduced and the gap between the external terminal through-hole 5 and the external terminal 3 is extremely reduced, so that the rattling due to the vibration of the insulating plate 2 is reduced. Prevent and improve seismic performance. The external terminal through hole 5 is provided with a guide surface 8 that is wide on the capacitor body side and becomes gradually narrower. When the external terminal 3 is inserted into the external terminal through hole 5, the guide surface 8 is connected to the external terminal. 3 to the external terminal through hole 5
Is guided to pass through. Thus, even when the external terminal 3 is slightly deformed due to mechanical stress during the manufacturing process, the external terminal 3 can be easily inserted into the external terminal through hole 5.

As shown in FIG. 1, the guide surface 8 provided in the external terminal through hole 5 of the insulating plate 2 is formed of a tapered surface or a curved surface, and the external terminal through hole of the insulating plate is gradually formed from the capacitor body side. Any shape that guides the external terminal 3 so as to be inserted into the external terminal through hole 5, such as a narrow shape, may be used. Further, the shape of the external terminal through-hole 5 of the insulating plate 2 is not limited to a circle, an ellipse, a square or the like, and the guide surface 8 is provided on the entire periphery of the external terminal through-hole 5. Is preferable, but it may be a part thereof.

In addition, as shown in FIG. 3, a projection 6 is provided on the inner wall surface of the external terminal through-hole 5 of the insulating plate 2, and the projection 6 is provided with a guide surface 8 that is wide on the capacitor body side and gradually narrows. Can also. This is because the inner peripheral diameter of the external terminal through-hole 5 including the protrusion 6 is substantially the same as or smaller than the outer peripheral diameter of the external terminal 3, so that the gap between the external terminal through-hole 5 and the external terminal 3 is increased. Can be extremely reduced, so that the insulating plate 2
It is possible to prevent rattling due to the vibration of. When the external terminal 3 is inserted into the external terminal through hole 5, the guide surface 8 provided on the projection 6 and having a wider and gradually narrower capacitor body side inserts the external terminal 3 into the external terminal through hole 5. Thus, the external terminal 3 can be easily inserted into the external terminal through-hole 5 even if the inner diameter of the external terminal through-hole 5 is small.

As the protrusion 6 provided on the inner wall surface of the external terminal through hole 5 of the insulating plate 2, a spherical protrusion 6 can be used as shown in FIG. Also,
The protrusion 6 is not limited to being formed on a part of the inner wall surface of the external terminal through-hole 5, but may be any part as long as the inner wall surface of the external terminal through-hole 5 is formed. Also, the number of the protrusions 6 is not specified, and may be formed at several places.

In addition, as shown in FIG. 5, on the inner wall surface of the external terminal through hole 5 of the insulating plate 2, there is provided a projection 6 having a guide surface 8 on the capacitor body side which is wide and gradually narrows. The external terminal 3 may be provided with a fitting portion 7 for fitting the projection 6. This is because the fitting portion 7 provided on the external terminal 3
Since the gap between the external terminal through-hole 5 and the external terminal 3 can be extremely reduced by fitting the protrusion 6, the rattling due to the vibration of the insulating plate 2 can be prevented, and the external terminal 3 The insulating plate 2 can be prevented from being separated from the main body, and the integration between the capacitor body 1 and the insulating plate 2 can be further strengthened. When the external terminal 3 is inserted into the external terminal through hole 5, the guide surface 8 provided on the projection 6 and having a wider and gradually narrower capacitor body side inserts the external terminal 3 into the external terminal through hole 5. Thus, even when the inner diameter of the external terminal through hole 5 is small, the external terminal 3 can be easily inserted into the external terminal through hole 5.

[0021]

As described above, according to the present invention,
An electronic component main body having a plurality of external terminals derived from the same end face, and an insulating plate abutting on the external terminal lead-out side, wherein the external terminals are inserted through external terminal through holes of the insulating plate; In a chip-type electronic component bent along the lower surface of the insulating plate, a guide surface for guiding the external terminal to be inserted into the external terminal through hole is provided in the external terminal through hole of the insulating plate. The gap between the external terminal through-hole and the external terminal is extremely reduced to prevent rattling due to the vibration of the insulating plate, and to improve the seismic performance. Even when the inner diameter is substantially the same as the outer diameter of the external terminal, when the external terminal is inserted into the external terminal through-hole, the guide surface provided in the external terminal through-hole of the insulating plate forms the external terminal. Insert through external terminal through hole To urchin guide can be easily inserted through the external terminal to an external terminal through-holes.

Further, the electronic component main body has a plurality of external terminals led out from the same end face, and an insulating plate abutted on the external terminal lead-out side, wherein the external terminals have external terminal through holes formed in the insulating plate. In a chip-type electronic component that is inserted and bent along the lower surface of the insulating plate, a projection having a guide surface that guides the external terminal so as to be inserted into the external terminal through hole is provided. By extremely reducing the gap between the terminal through hole and the external terminal,
It is possible to prevent the rattling due to the vibration of the insulating plate and improve the seismic performance, and the projection provided on the inner wall surface of the external terminal through-hole allows the inner peripheral diameter of the external terminal through-hole to be reduced to the outer peripheral diameter of the external terminal. Even if the diameter is substantially the same or smaller, when the external terminal is inserted into the external terminal through-hole, the guide surface provided on the protrusion guides the external terminal so as to be inserted into the external terminal through-hole. The external terminal can be easily inserted into the external terminal through hole.

[0023] Further, the external terminal is provided with a fitting portion for fitting a projection having a guide surface which is provided on the inner wall surface of the through hole of the external terminal of the insulating plate and whose width is gradually reduced. Thereby, in a state where the predetermined external terminal is inserted into the external terminal through-hole, the protrusion is fitted to the fitting portion of the external terminal, so that it is possible to further suppress rattling due to vibration of the insulating plate, Separation of the insulating plate from the external terminals can be prevented, and the integrity of the electronic component body and the insulating plate can be further strengthened.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a chip-type electronic component according to an embodiment of the present invention.

FIG. 2 is an external perspective view showing a chip-type electronic component according to an embodiment of the present invention.

FIG. 3 is an external perspective view showing an external terminal through hole provided in an insulating plate of the chip-type electronic component according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating an external terminal through hole provided in an insulating plate of the chip-type electronic component according to the embodiment of the present invention.

FIG. 5 is a sectional view showing a chip-type electronic component according to another embodiment of the present invention.

FIG. 6 is a sectional view showing a conventional chip-type electronic component for vertical placement.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component (capacitor) main body 2 Insulating plate 3 External terminal 4 Sealing body 5 External terminal through-hole 6 Projection 7 Fitting part 8 Guide surface 9 Storage groove 10 Capacitor element 11 Exterior case

Claims (3)

[Claims] 1. An electronic component main body having a plurality of external terminals derived from the same end face, and an insulating plate abutting on the external terminal lead-out side, wherein the external terminals are formed through external terminal through holes of the insulating plate. In a chip-type electronic component that is inserted and bent along the lower surface of the insulating plate, a guide surface that guides the external terminal into an external terminal through hole of the insulating plate so as to insert the external terminal into the external terminal through hole. A chip-type electronic component comprising: 2. An electronic component main body having a plurality of external terminals led out from the same end face, and an insulating plate abutting on the external terminal lead-out side, wherein the external terminals have external terminal through holes formed in the insulating plate. In the chip-type electronic component that is inserted and bent along the lower surface of the insulating plate, the external terminal is guided to the inner wall surface of the external terminal through hole of the insulating plate so as to be inserted into the external terminal through hole. A chip-type electronic component provided with a projection having a guiding surface to be driven. 3. The chip-type electronic component according to claim 2, wherein a fitting portion fitted to said projection is provided on said external terminal.