JP2001343753A - Substrate transfer mechanism and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transport mechanism, which is capable of adequately and smoothly carrying out transport of substrates and a series of exposure work, while being hardly affected by the thickness and dimensions of substrates and the degree of hardness of the coating films of a photosensitive agent. SOLUTION: The substrate transport mechanism 1, which transports the substrates exposed by irradiation with rays inclusive of UV rays, between the transport end position and the exposure table, has a loading section 2 to be loaded with the substrates, a drive body 3 for holding this loading section and a movement guide 4 moving this drive body between the transport end position and the exposure table along et same. The loading section has support sections 2a, which abuts against the under surfaces of the substrates and horizontally support the substrates and a through-hole section 2b, which is formed between the support sections 2b and the section and are not brought into contact with the substrates. At least one end of the through-hole sections is formed communicatively, up to the end edge of the loading section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transport mechanism for transporting a substrate such as a printed circuit board and an exposure apparatus for transporting the substrate and performing exposure processing. The present invention relates to a substrate transport mechanism and an exposure apparatus that can cope with the above.

[0002]

2. Description of the Related Art In recent years, as printed circuit boards have been promoted with higher precision, higher density, and finer lines, the substrates themselves have become thinner. For this reason, the standard thickness was 1.6m
However, recently, substrates having a thickness of 0.1 mm have been widely used, and the trend toward thinning has been progressing, and the thickness has been further reduced from 0.06 mm.

[0003] A liquid photosensitive agent typified by a solder resist or the like applied to a substrate is affected by a dry state depending on the degree of humidity, temperature, and the like. May occur. Therefore, the hardness of the surface coating of the photosensitive agent is maintained to be constant, but the hardness of the surface coating of the photosensitive agent may be insufficient when performing the exposure operation.

In consideration of the above-described conditions of the substrate, the substrate transport mechanism generally has a configuration of a handler mechanism for sucking and moving the surface of the substrate to be transported, or supporting the lower end surface of the substrate. It is known to have a configuration of a transport roller mechanism for moving. In addition, the substrate is transported to the exposure table,
In an exposure apparatus that exposes a substrate by performing an alignment operation and a light irradiation operation, a transport mechanism corresponding to a type of the substrate and a photosensitive agent to be used is used.

[0005]

However, the conventional substrate transfer mechanism and the configuration of the exposure apparatus having the transfer mechanism have the following problems. That is, in the case of a handler system in which the transfer mechanism for transferring the substrate is moved by vacuum suction of the upper surface of the substrate by the suction pad, the self-weight of the substrate and the holding force against the air resistance applied to the entire substrate when the substrate is pulled up. Therefore, it is necessary to strongly suction the substrate with a handler.

[0006] For this reason, if the coating film hardness of a photosensitive agent such as a solder resist is insufficient, defects such as traces of a suction pad of a handler are left on the resist surface. Is more likely to occur. Particularly, in the case of an extremely thin substrate having a thickness of, for example, 0.06 mm or less, the possibility that the substrate becomes defective due to deformation is significantly increased. At the same time, various drawbacks such as the absorption of the photosensitive agent by the strong vacuum suction of the handler and the attachment of the photosensitive agent to other substrates have occurred.

In addition, when the substrate is thin, the leading end of the substrate, particularly at the corner, may hang down. When the leading end of the substrate hangs down, the sloping leading end of the substrate becomes part of the transport mechanism. In some cases, a situation occurs in which the substrate cannot be sent further. When the substrate is transferred by the transfer roller, the position of the substrate changes during the transfer, so that the position of the substrate moved to the exposure table side varies, which adversely affects the alignment operation performed later.

In particular, in the case of the exposure apparatus, if the substrate is deformed during operation or a state in which the substrate cannot be transferred by the transfer mechanism occurs, it is necessary to stop a series of processes performed in the exposure apparatus, which is a problem. . Also, if the position of the substrate conveyed to the exposure table varies, when performing alignment work with the mask, the position conveyed for each substrate differs, and the amount of movement of the substrate or mask moved by the alignment mechanism is reduced. As a result, the burden on the alignment mechanism of the exposure apparatus is large, which is inconvenient.

The present invention has been made in view of the above-mentioned problems, and is hardly affected by the thickness of the substrate and the degree of hardness of the coating film of the photosensitive agent. An object of the present invention is to provide a substrate transport mechanism and an exposure apparatus that can perform operations without delay.

[0010]

The present invention has been made as follows to solve the above-mentioned problems. That is, as a first aspect, a substrate transport mechanism that transports a substrate to be exposed by irradiating a light beam including ultraviolet rays between a transport position and an exposure table, and a mounting portion for mounting the substrate, A driving body for holding the mounting portion, and a movement guide for moving the driving body along between the transport position and the exposure table, wherein the mounting portion partially contacts the lower surface of the substrate. The substrate transport mechanism includes a support portion for supporting the substrate and a penetrating portion formed between the support portions so as to communicate with the edge of the mounting portion and not in contact with the substrate.

With such a configuration, the substrate to be transported is supported at its lower end by the supporting portion, so that the substrate does not sag even when the substrate is thin.
Further, even if the mounting portion moves up and down when being transported, it is possible to minimize the adverse effect of the substrate being swung by the operation.

The exposure table of the substrate transport mechanism has a lifting / lowering mechanism for lifting / lowering from a substrate mounting surface on which the substrate is mounted, and the lifting / lowering mechanism is inserted into a penetrating portion of the mounting section. And a delivery drive unit that can support the substrate and a vertical drive unit that drives the delivery support unit up and down. With such a configuration, when the substrate is moved onto the exposure table, the delivery support unit is inserted into the through portion of the placement unit to receive the substrate, and the delivered placement unit can move to the transfer substrate position. it can. Further, the delivery support unit that has received the substrate is lowered to the exposure table side by the operation of the elevation drive unit, and the substrate can be supported by the exposure table.

Further, the substrate transfer mechanism has a structure in which suction holes for sucking the substrate are provided at positions where the support portion and the delivery support portion contact the substrate. With such a configuration, when the substrate is supported by the mounting plate or transferred to the exposure table, the substrate is not sucked by the suction holes and does not shift in position.

Further, the through portion of the substrate transport mechanism is provided in parallel with the moving direction of the mounting portion. With such a configuration, the mounting portion can be smoothly moved after the substrate is transferred to the exposure table side.

Further, the exposure apparatus includes one and the other substrate transfer mechanisms for transferring the substrate from the carry-in position to the exposure table and the carry-out position from the exposure table, and an overprint frame having a mask provided above the exposure table. A light source unit provided above the upper printing frame, imaging means provided between the upper printing frame and the light source to image a matching position between the substrate and the mask, and any one of the exposure table or the upper printing frame. And an alignment mechanism provided on one of the sides to perform the alignment operation of the substrate and the mask.

[0016] The substrate transport mechanism includes a mounting portion for mounting the substrate, a driving main body for holding the mounting portion,
A moving guide for moving the driving body along the transport path, wherein the mounting portion is configured to contact the lower surface of the substrate and support the substrate; A penetrating portion formed so as to be in communication with the edge of the portion and not in contact with the substrate, wherein the exposure table includes a lifting / lowering transfer mechanism that passes the substrate through the penetrating portion of the mounting portion. did.

With this configuration, when the substrate is transported from the loading position to the exposure table, the substrate is transported while the lower surface is supported by the mounting portion. Then, after the substrate conveyed to the exposure table is subjected to the alignment operation with the mask by the imaging mechanism and the alignment mechanism, the light irradiation operation is performed by irradiating light rays including ultraviolet rays from the light source. After the light irradiation operation is completed, the substrate is transferred from the exposure table to the carry-out position while the lower surface of the substrate is supported via the mounting portion of the substrate moving mechanism.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partially sectional side view showing a substrate transport mechanism, FIG. 2 is a plan view showing the substrate transport mechanism, and FIGS. 3A and 3B are views of a mounting portion and an exposure table of the substrate transport mechanism. FIG. 4 is a perspective view showing the configuration, FIG. 4 is a rear view showing a partial cross section of the substrate transfer mechanism, and FIGS.
(B), (c) and (d) are side views schematically showing the operation state of the substrate transfer mechanism, and FIGS. 6 (a), (b), (c) and
(D) is a side view schematically showing the operation state of the substrate transport mechanism.

As shown in FIGS. 1 to 3, the substrate transport mechanism 1 is provided between the installation position of the loading mechanism 10 which is the transport position of the substrate W and the exposure table 5, and places the substrate W thereon. Mounting part 2 and drive body 3 holding this mounting part 2
And a movement guide 4 for moving the drive body 3 along a movement path.

The mounting portion 2 partially contacts the lower surface of the substrate W and supports at least two or more supporting portions 2a for supporting the substrate W in a horizontal state, and the mounting portion 2 is provided between the supporting portions 2a. And a penetrating portion 2b that continuously opens to the edge of the placing portion 2. Here, the support portion 2a has a plate-shaped contact surface with the substrate W, and is configured to support the substrate W at five locations. A suction hole 2c for sucking and supporting the substrate W is provided on the contact surface side of the support portion 2a with the substrate W.
Are formed. The means for sucking the substrate W may be a suction means using a vacuum pump, a Bernoulli chuck method, or an ejector method. The shape of the support portion 2a is not particularly limited, such as a rod shape, as long as the support portion 2a can be appropriately supported by partially contacting the lower surface of the substrate W.

The penetrating portion 2b is formed to have a width D that allows the substrate W to be supported horizontally when the substrate W is supported by the support portion 2a even if the substrate W is 0.06 mm or less.
Note that the horizontal state of the substrate W refers to a state in which the substrate W is gently curved without damaging the substrate W, and a state in which the substrate W does not become an obstacle when moving and includes a drooping state. Of course, it is desirable that the substrate W is visually horizontal. The penetrating portion 2b may be formed so that at least one end thereof (on the side of the exposure table 5) communicates with the edge of the mounting portion 2 and the other end does not communicate with the edge of the mounting portion 2 ( One end of the support 2a is continuous in a plane.)
It may be.

As shown in FIG. 2, here, the penetrating portion 2b is formed in a rectangular shape having a long side parallel to the moving direction of the substrate W. Also, the substrate W
When the transport roller 10 is installed at the carry-in position, the width D at which the penetrating portion 2b can move up and down between the transport rollers 10 is used.
(Set so that the substrate W can be supported in a horizontal state or smaller). In the case of a configuration in which one end of the penetrating portion 2b communicates with the edge of the mounting portion 2, the position of the penetrating portion 2b is set so as to allow communication between the feed rollers.

As shown in FIGS. 1 to 4, the driving main body 3 includes a main body 3a for fixing each support portion 2a, a driving section 3b for vertically moving the main body 3a, and a driving section 3b.
Guide bars 3c, 3 for guiding the operation of the main body 3b by the
c. In addition, the driving main body 3 includes
The groove 3s is formed in the main body 3a that supports. As shown in FIG. 4, the depth dimension of the groove 3s is formed to be larger than the diameter of the feed roller 10a.

At the lower end side of the driving section 3b, a driving guide section 3d which moves along a moving guide 4 provided between the substrate loading position and the exposure table 5 is provided at right and left sides of the driving guide section 3d. And driven rollers 3e, 3e provided. As shown in FIG. 4, the driven rollers 3e, 3e include a rotating body that rotates along the driven guides 4b, 4b of the moving guide 4, and a transport roller that rotates on the road surface.

The moving guide 4 has a main guide 4a for guiding the guide portion 3d of the drive main body 3, and the left and right sides of the main guide 4a centered on the main guide 4a.
and e, 3e.

On the other hand, the exposure table 5 is shown in FIGS.
As shown in (b), an elevation transfer mechanism 6 for receiving the substrate W transported immediately above by the transport mechanism 1 is provided on the substrate mounting surface. The lifting / lowering mechanism 6 includes
Each of the delivery support portions 6a is inserted into the through portion 2b of the first and second portions, and an elevating drive portion 6b that drives the delivery support portion 6a up and down. Then, as shown in FIGS. 1 and 3 (b), the lifting drive unit 6b supports the support rod 6e of each delivery support unit 6a via the holding plate 6d in order to simultaneously raise and lower each delivery support unit 6a. ing.

Further, in this case, the delivery support portion 6a is provided on the exposure table 5 so as to have four penetration portions 2b of the mounting portion 2 corresponding to the four penetration portions 2b. Further, the delivery support portion 6a has a plurality of suction holes 6c for holding the substrate W by suction at positions where the delivery support portion 6a comes into contact with the substrate W. In addition, the delivery support part 6a
Is not particularly limited as long as it can be received in a state where the substrate W is not damaged by deformation.

Next, the operation of the substrate transport mechanism 1 will be described with reference to FIG. 5 or FIG. First, the substrate W transferred to the transfer position, which is the transfer position, is placed on the feed roller 10a of the transfer mechanism 10. And the feed roller 10a
The substrate W supported thereon is preliminarily positioned by being pushed toward the center thereof from four sides by the preliminary positioning mechanism 17 (see FIG. 4).

When the pre-positioning operation is completed, the placing section 2 which has been waiting below the substrate W and the feed roller 10a
As shown in FIG. 5A, the mounting unit 2 is raised by the driving unit 3b from the position of the virtual line to the position of the solid line, and the substrate W
From the transport roller 10 to the support 2a. When the support portion 2a receives the substrate W, each suction hole 2
The substrate W is sucked and held by suction from c (see FIG. 2). The substrate W is supported by the supporting portion 2a by its own weight regardless of whether it is thin or thick.
, And can be securely held by light suction.

As shown in FIG. 5 (b), the mounting portion 2 receiving the substrate W contacts the substrate W with the support portion 2a, and the mounting portion 2 receives the substrate W through the through portion 2b (see FIG. 2). While not in contact with W, the substrate W is held in a horizontal state, and is moved above the exposure table 5 via the movement guide 4. Then, when the mounting section 2 moves onto the exposure table 5, it is lowered to the lower end by the driving section 3b.

As shown in FIG. 5C, when the substrate W is transported onto the exposure table 5, the delivery support portion 6a of the elevating delivery mechanism 6 rises and is inserted through the through portion 2b of the mounting portion 2. At the same time, the substrate W further rises to receive the substrate W from the support 2a. At this time, as shown in FIG. 2, the suction from the suction holes 2c of the support portions 2a is stopped, and the substrate W is suction-held by suction from the suction holes 6c of the delivery support portion 6a.

When holding the substrate W by suction, the delivery support portion 6a temporarily stops at the height position of the support portion 2a (a position in contact with the substrate W), sucks the substrate W through the suction hole 6c, and preliminarily holds the substrate W. If the suction operation from the suction hole 2c of the support portion 2 is stopped later after the suction, the substrate W can be reliably transferred without displacing the position of the substrate W.

As shown in FIG. 5C, the mounting portion 2 having passed the substrate W returns to the loading mechanism 10 along the moving guide 4. At this time, as shown in FIG. 2, the penetrating part 2 b of the placing part 2 communicates with the end of the placing part 2, so that the delivery supporting part 6 a of the elevating delivery mechanism 6 moves the placing part 2. There is no obstacle to In addition, since the penetrating portion 2b is formed parallel to the moving direction of the mounting portion 2, the mounting portion 2
Means that the ascending / descending movement moves against the substrate W (the delivery support portion 6a,
As long as the minimum distance for transferring to the feed rollers 10a and 20a) can be secured, the transfer can be performed.

Then, as shown in FIG.
The receiving and supporting unit 6a receiving the data is moved up and down by the elevation drive unit 6b (FIG. 1).
(See FIG. 3), and the substrate W is supported on the exposure table 5.

When the substrate W is supported on the exposure table 5, the substrate W is sucked and held by the suction holes 6c of the delivery support portion 6a and the suction holes 5a on the exposure table 5. When preliminary positioning work is required for the substrate W on the exposure table 5, the four peripheral ends of the substrate W are pushed by a preliminary positioning mechanism (not shown) to perform preliminary positioning.

Further, as shown in FIG. 6A, the exposure table 5 supports the substrate W, and raises the substrate W by the vertical driving unit 8 to adjust the alignment mechanism 7 and the CCD camera 1.
3. The light source unit 12 performs alignment work of the substrate W and the mask M and light irradiation work. After performing a series of processes on the substrate W, the exposure table 5 is lowered to the lower end of the movement of the exposure table 5 while supporting the substrate W.

The substrate W whose one surface has been subjected to the exposure processing is carried out to the carry-out side through the carrying path. At this time, the substrate transport mechanism 1 and the exposure table 5 are as shown in FIG.
As shown in (b), (c) and (d), the operation is as follows. As shown in FIG. 6B, while stopping the suction from the suction holes 5a of the exposure table 5, the suction holes 6c of the delivery support portion 6a raise the delivery support portion 6a while maintaining the suction of the substrate W. .

As shown in FIG. 6C, the discharge roller 20
The loading section 2 waiting on the side (transport position) is moved by the moving guide 4
And arrive below the delivery support portion 6a.
Then, as shown in FIGS. 6C and 6D, whether the placing section 2 is raised, or whether the delivery support section 6a is lowered,
Alternatively, by performing both operations, the delivery support portion 6
The substrate W is transferred from the “a” to the receiver 2.

As shown in FIG. 6D, the receiving section 2 which has received the substrate W moves along the moving guide 4 to the unloading roller 20 side, descends just above the unloading roller 20, and drops. 2 transfers the substrate W to the unloading roller 20. In addition,
Since the mounting portion 2 includes the penetrating portion 2b, it is convenient when receiving and moving the substrate W from the transfer support portion 6a or when transferring the substrate to the transport roller 20.

In order to prevent the substrate W from sticking, the transfer support section 6a is lowered to a position one step lower than the surface level of the exposure table 5 when the substrate W is transferred to the exposure table 5, and then transferred. It is convenient to construct so as to operate at the same height as the surface level.

The substrate transport mechanism 1 includes an exposure table 5
Although the arrangement has been described with respect to the arrangement on one side and the other side, the arrangement may be made only on one side of the exposure table 5. In this case, the loading mechanism 10 performs both the loading and unloading of the substrate. Further, the suction holes 2 of the substrate W are provided in the support portion 2a of the mounting portion 2 and the delivery support portion 6a of the exposure table 5.
Although the configuration has been described as having the holes c and 6c, the suction holes 2c and 6c do not need to be particularly provided as long as there is no displacement during transport due to the weight of the substrate W and the size of the support surface.

Next, the configuration of the exposure apparatus 30 including the substrate transport mechanism 1 shown in FIGS. 1 to 6 will be described with reference to FIG. FIG. 7 is a schematic diagram showing the configuration of the exposure apparatus. 1 to 6 are denoted by the same reference numerals and description thereof will be simplified.

As shown in FIG. 7, the exposure apparatus 30 includes a loading mechanism 10 and one of the substrate transport mechanisms 1 attached to the loading mechanism 10.
, An unloading mechanism 20 provided on the exposure table 5 with the other substrate transfer mechanism 1 interposed therebetween, and an overprint frame 11 provided above the exposure table 5.
And an imaging means 13 provided above the upper grilling frame 11 and a light source unit 12 provided above the upper grilling frame 11.

The carry-in mechanism 10 includes feed rollers 10a (see FIG. 2) arranged in a plurality of rows on which the substrates W are placed, and a drive belt 10 wound around a rotation shaft of the feed rollers 10a.
b and a drive motor 10 for driving the drive belt 10b
c. The feed rollers 10a are installed so that the transfer rollers 10a of each row can be inserted into the penetrating portions 2b formed on the mounting portion 2 of the substrate transfer mechanism 1 (see FIG. 2).

As shown in FIGS. 7 and 1, the exposure table 5 includes an X, Y, and θ direction moving mechanism (hereinafter, referred to as an aligning mechanism) 7 for aligning the substrate W and the mask M. A vertical driving unit 8 that supports the substrate W and can move upward is provided. The alignment mechanism 7 includes an X-direction moving unit 7A that moves the substrate W in one direction of a horizontal plane, a Y-direction moving unit 7B that moves the substrate W in a direction orthogonal to the X-direction moving unit 7A, and a rotational direction of the horizontal plane. Θ to move the substrate W
And a direction moving unit 7C. Further, the exposure table 5 includes an elevating delivery mechanism 6 for delivering the substrate W from the substrate transport mechanism 1.

Here, the alignment mechanism 7 sets the substrate W to X,
Although the alignment operation is performed by moving the mask M in the Y, θ directions, the alignment mechanism (three-point locator mechanism) ( (Not shown) may be provided.

As shown in FIG. 7, the upper frame 11 includes a frame 11a, a light-transmitting plate 11b held by the frame 11a, a mask M attached to the light-transmitting plate 11b, and having a pattern. A seal rubber (bank rubber) 11c provided around the mask M is provided. In addition,
The vacuum suction mechanism 14 for bringing the mask M into close contact with the light-transmitting plate 11b includes a groove (not shown) provided on the periphery of the light-transmitting plate 11b.
The mask M is vacuum-adsorbed to the light-transmitting plate 11b.

As shown in FIG. 7, when the mask M and the substrate W are brought into close contact with each other, the imaging means 13 includes CCD cameras 13a, 13a for imaging the positioning marks (not shown) provided respectively. , The CCD cameras 13a, 13
moving mechanism 13b for retracting a from the exposure area,
13b.

As shown in FIG. 7, the light source unit 12 includes a discharge lamp 12a for irradiating a light beam containing ultraviolet light having a predetermined wavelength, a reflecting mirror 12b for reflecting the light beam from the discharge lamp 12a to the mask M side. It has. In addition, it is convenient to provide a configuration in which a shutter mechanism (not shown) for simulating turning on and off of the discharge lamp 12a is provided.

As shown in FIG. 7, the unloading mechanism 20 includes feed rollers 20a arranged in a plurality of rows (see FIG. 2) for receiving the substrates W from the substrate transport mechanism 1, and a rotating shaft of the feed rollers 20a. A drive belt 20b is provided, and a drive motor 20c for driving the drive belt 20b is provided. The feed roller 20a is configured to be able to pass through a through portion 2b formed on the mounting portion 2 of the substrate transport mechanism 1.

Next, the operation of the exposure apparatus 30 will be described. First, the substrate W is placed on the feed roller 10a of the loading mechanism 10, and the end face is pushed toward the center of the substrate W on the feed roller 10a, and the preliminary positioning operation is performed by the preliminary positioning mechanism 17 (see FIG. 4). (Fig. 5 (a)
reference). Then, the mounting portion 2 of the substrate transport mechanism 1 rises from below the feed roller 10a, and the mounting portion 2 receives the substrate W. At this time, the mounting section 2 sucks the substrate W through the suction holes 2c provided in the support section 2a.

The mounting section 2 supporting the substrate W includes a driving body 3
Is moved along the movement guide 4 so that the exposure table 5
It comes directly above. Next, the delivery support section 6a of the exposure table 5 is raised by the operation of the elevation drive section 6b, and
The substrate W is received through the penetrating portion 2b of FIG.
(B)). At this time, the suction hole 6c of the delivery support portion 6a
After the substrate W is sucked and held by the delivery support portion 6a, the suction of the suction hole 2a of the support portion 2a is stopped, so that the substrate W can be received without shifting its position.

When the substrate W is transferred to the transfer support section 6a, the mounting section 2 is moved to the loading mechanism 10 along the movement guide 4 by the operation of the drive section main body 3 (see FIG. 5C). Then, the delivery support section 6 a that holds the substrate W by suction is lowered and places the substrate W on the exposure table 5. Delivery support 6
When a falls, the surface height becomes the same as the surface height of the exposure table 5, and the exposure table 5 supports the substrate W (FIG. 5).
(D)).

As shown in FIG. 7 and FIG. 6A, the exposure table 5 is moved by
The substrate W is brought into contact with one of the masks M, and the mask M and the substrate W are brought into close contact with each other by the vacuum suction mechanism 14. Then, the CCD camera 13a is moved to the imaging position by the moving mechanism 13b of the imaging means 13, the position of the positioning marks Mm and Wm of the mask M and the substrate W is imaged, and the alignment movement of the substrate W (or the mask M) is performed from that position. Calculation control unit (not shown)
It is calculated by:

When the position of the substrate W is displaced from the mask M, the vacuum suction state by the vacuum suction mechanism 14 is weakened or released by a leak valve (not shown) or the like, and the vacuum contact state of the substrate W and the mask M is brought about. Cancel. Further, the amount of alignment movement of the substrate W is transmitted to the alignment mechanism 7, and the X-direction moving unit 7A
Then, the Y-direction moving unit 7B and the θ-direction moving unit 7C are operated to perform the alignment work.

When the alignment operation is completed, the exposure table 5 is raised to bring the substrate W into contact with the mask M, and the vacuum suction mechanism 1
4. The position of the positioning marks Mm and Wm on the mask M and the substrate W is imaged and confirmed by the CCD camera 13a. If both the positioning marks Mm and Wm are within the allowable alignment range, the CCD camera 13a is retracted by the moving mechanism 13b, and the light source unit 12 irradiates a light beam including ultraviolet rays for a predetermined time, and the light irradiation operation is performed. Exposure is through a mask.

When the light irradiation operation is completed, the vacuum suction mechanism 1
4 releases the vacuum contact state between the substrate W and the mask M, and the exposure table 5 sucks and holds the substrate W and moves downward by the operation of the vertical drive unit 8 (see FIG. 6B). When the exposure table 5 is lowered, the substrate W is raised from the exposure table 5 by the elevation of the delivery support section 6a, and the mounting section 2 of the substrate transport mechanism 1 waiting at the position of the unloading mechanism 20 is set.
Is moved to the exposure table 5 side (see FIG. 6C).
After the light irradiation operation is completed, even if the substrate W is stuck on the surface of the exposure table, the substrate W
Can be separated by a mechanical operation, which is convenient.

Then, the support portion 2a of the mounting portion 2 is disposed immediately below the substrate W, and the delivery support portion 6a is lowered.
The substrate W is transferred to the receiver 2 (see the virtual line in FIG. 6D). Then, the receiver 2 that has received the substrate W transfers the substrate W to the feed roller 20 a of the unloading mechanism 20. In addition,
When the mounting unit 2 moves toward the unloading mechanism 20 while sucking and holding the substrate W, the mounting unit 2 performs the operation described above and conveys a new substrate W to the exposure table side on the loading mechanism 10 side.

The operation described above is repeated, and the substrate W is transported from the loading mechanism 10 to the exposure table 5, where the aligning operation and the light irradiating operation are performed, and is transported to the unloading mechanism 20 side. Exposure.

Here, the mounting portion 2 of the substrate transport mechanism 1
Has four penetrating portions 2a, but this can be changed to an appropriate one according to the dimensions and weight and thickness of the substrate. Further, there is no particular limitation as long as the substrate can be properly transferred, such as by forming the penetrating portion of the mounting portion and the delivery support portion in a direction orthogonal to the transport direction of the substrate W.

Further, after the light irradiation operation is completed, the substrate W is affected by the liquid photosensitive agent such as a solder resist, the degree of humidity and temperature, the heat at the time of light irradiation, the pressure due to the vacuum adhesion, and the like, and the drying state is affected. Even if it is attached to the exposure table 5, it can be easily peeled off from the exposure table 5 by the operation of the lifting / lowering delivery mechanism 6 (the delivery support portion 6 a descends to a position one step lower than the surface level of the exposure table 5). Can be.

[0062]

The present invention has the following advantages because of the construction described above. (1) Since the substrate transport mechanism transports the substrate while supporting it from below, even if the substrate is extremely thin during transport, it does not adversely affect the substrate. In addition, since the through portion of the mounting portion is formed to communicate with one end, the substrate can be received from the through portion at the exposure stage or the transport position, and the transport operation of the mounting portion can be smoothly performed. The transfer of the substrate can be performed while performing the above.

(2) In the substrate transport mechanism, the delivery support portion of the lifting / lowering delivery mechanism provided on the exposure table is inserted into the penetrating portion of the mounting portion, and can receive the substrate supported by the support portion. Therefore, even if the substrate conveyed to the exposure table by the mounting portion is extremely thin, it can be appropriately conveyed without being affected.

(3) In the substrate transport mechanism, suction holes for sucking and supporting the substrate are provided in the support portion of the mounting portion and the delivery support portion of the exposure table. Therefore, when the substrate is received from the transfer position and placed on the receiving portion, when the substrate is transferred from the mounting portion to the transfer support portion of the exposure table, or when the substrate is transferred from the transfer support portion to the exposure table, In this case, it is possible to accurately transfer the substrate without shifting the position of the substrate.

(4) In the substrate transfer mechanism, since the penetrating portion of the mounting portion is provided in parallel with the moving direction, the transfer of the substrate at the transfer position and the exposure table is performed.
As long as the moving direction of the mounting portion is not obstructed and the minimum moving distance of the mounting portion for transferring the substrate W to the other party (the transfer support portion or the feed roller) can be ensured, the transfer portion moves. It becomes possible.

(5) The exposure apparatus has a configuration in which the substrate transport mechanism supports the lower end of the substrate and transports the substrate between the carry-in position, the exposure table, and the carry-out position. A series of exposure operations (conveyance, pre-positioning, alignment operation, light irradiation operation) can be continuously performed without delay regardless of the thickness dimension.

[Brief description of the drawings]

FIG. 1 is a partially sectional side view showing a substrate transport mechanism according to the present invention.

FIG. 2 is a plan view showing a substrate transport mechanism according to the present invention.

FIGS. 3A and 3B are perspective views respectively showing configurations of a mounting portion and an exposure table of the substrate transport mechanism according to the present invention.

FIG. 4 is a rear view in partial cross section of the substrate transfer mechanism according to the present invention.

FIGS. 5A, 5B, 5C, and 5D are side views schematically showing an operation state of the substrate transfer mechanism according to the present invention.

FIGS. 6 (a), (b), (c) and (d) are side views schematically showing an operation state of the substrate transfer mechanism according to the present invention.

FIG. 7 is a schematic diagram illustrating a configuration of an exposure apparatus according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate conveyance mechanism 2 Placement part 2a Support part 2b Penetration part 2c Suction hole 3 Drive body 3a Body part 3b Drive part 3c Guide bar 3d Guide part 3e Followed roller 4 Movement guide 4a Main guide 4b Followed guide 5 Exposure table 5a Suction hole Reference Signs List 6 Elevation delivery mechanism 6a Delivery support part 6b Elevation drive part 6c Suction hole 7 Alignment mechanism (X, Y, θ direction movement mechanism) 7A X direction movement part 7B Y direction movement part 7C θ direction movement part 8 Vertical direction drive part 10 Loading Mechanism 10a Feed roller 10b Drive belt 10c Drive motor 11 Burning frame 11a Frame body 11b Light transmitting plate 11c Seal rubber 12 Light source unit 12a Discharge lamp 12b Reflecting mirror 13 Imaging means 13a CCD camera 13b Moving mechanism 20 Unloading mechanism 20a Feed roller 20b Drive belt 20c drive motor M mask W substrate

Claims (5)

[Claims] 1. A substrate transport mechanism for irradiating a substrate exposed by irradiating a beam including ultraviolet rays between a transport position and an exposure table, comprising: a mounting portion for mounting the substrate; And a movement guide for moving the drive body between the transfer position and the exposure table, wherein the mounting portion partially contacts the lower surface of the substrate and A substrate transport mechanism, comprising: a support portion for supporting the substrate; and a penetrating portion formed between the support portions to communicate with an edge of the mounting portion and not in contact with the substrate. 2. The apparatus according to claim 1, wherein the exposure table has a lifting / lowering mechanism for lifting / lowering from a substrate mounting surface on which the substrate is mounted, and the lifting / lowering mechanism is inserted into the through portion to support the substrate. 2. The substrate transport mechanism according to claim 1, further comprising: a transfer support portion for moving the transfer support portion up and down. 3. The substrate transport mechanism according to claim 1, wherein a suction hole for sucking the substrate is provided at a position of the support portion and the delivery support portion that abuts on the substrate. 4. The substrate transport mechanism according to claim 1, wherein the through portion is provided in parallel along a moving direction of the mounting portion. 5. A substrate transport mechanism for transporting a substrate from a carry-in position to an exposure table and from the exposure table to a carry-out position; an overprint frame having a mask provided above the exposure table; A light source unit provided, an imaging unit provided between the overprint frame and the light source, and an imaging unit for capturing an alignment position between the substrate and the mask; and the substrate provided at one of the exposure table or the overprint frame. An alignment mechanism for performing a mask alignment operation, wherein the substrate transfer mechanism includes a mounting portion for mounting the substrate, a driving main body for holding the mounting portion, and a driving main body along the conveyance path. A moving guide for moving, wherein the mounting portion communicates with a supporting portion that partially contacts the lower surface of the substrate to support the substrate, and between the supporting portion and an edge of the mounting portion. Formed in a non-contact manner with the substrate And a section, the exposure table, the exposure apparatus comprising: a lifting delivery mechanism is inserted into the through part of the mounting section passing the substrate.