JP2001210145A - Conductive pressure-sensitive adhesive sheet and method for producing the same - Google Patents

Abstract

(57) Abstract: Provided is a conductive pressure-sensitive adhesive sheet having a sufficient pressure-sensitive adhesive strength and a method for producing the same. A pressure-sensitive adhesive layer and a conductive layer are formed on a base material.
A pressure-sensitive adhesive layer 2 or a conductive layer 3 is patterned on a conductive pressure-sensitive adhesive sheet or release paper 4 laminated so that a part of the pressure-sensitive adhesive layer 2 is exposed over the entire surface, and a conductive agent or a pressure-sensitive adhesive is applied thereon. The method for producing the conductive pressure-sensitive adhesive sheet to be bonded to the substrate after the processing, and the pressure-sensitive adhesive layer 2 or the conductive layer 3 patterned on the release paper 4 and the conductive layer 3 or the pressure-sensitive adhesive coated on the substrate 1 The method for producing the conductive pressure-sensitive adhesive sheet to be bonded to the layer 2, and the conductive layer 3 on the pressure-sensitive adhesive layer 2 such that a part of the pressure-sensitive adhesive layer 2 is entirely exposed.
And a method for producing the conductive pressure-sensitive adhesive sheet, wherein the pressure-sensitive adhesive layer 2 or the conductive layer 3 is patterned on a release paper 4 and a conductive agent or a pressure-sensitive adhesive is applied thereon.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive pressure-sensitive adhesive sheet in which conductivity and pressure-sensitive adhesive properties are separated, and a method for producing the same.

[0002]

2. Description of the Related Art In the advanced information society represented by multimedia, digital information equipment is the mainstream of information transmission means, and failures due to electromagnetic noise or electrostatic discharge may occur everywhere. May be fatal to electronic control equipment in some cases. In order to solve the above problems, metal foil is used as the base material, or an adhesive tape using a metal-deposited base material has been marketed, but using an acrylate-based adhesive or a rubber-based adhesive. In this case, the contact surface with the adherend is in an insulated state, so that effective grounding is difficult. In addition, there are pressure-sensitive adhesive tapes in which metal powder or carbon black is dispersed in the pressure-sensitive adhesive to impart conductivity, but the cohesive force is insufficient because a conductive substance is present in the pressure-sensitive adhesive, Also, it was difficult to freely control the adhesive strength.

[0003]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a conductive pressure-sensitive adhesive sheet having an adhesive force and a sufficient cohesive force according to the application.

[0004]

Means for Solving the Problems The present inventors laminated an electrically conductive layer on the pressure-sensitive adhesive layer such that a part of the pressure-sensitive adhesive layer was exposed over the entire surface, so that the pressure-sensitive adhesive was controlled in accordance with the intended use. The present inventors have found that a conductive pressure-sensitive adhesive sheet having a sufficient cohesive force can be obtained, and the present invention has been achieved.
In other words, the present invention forms a surface in which an adhesive surface and a conductive surface coexist as an adhesive interface between the pressure-sensitive adhesive sheet and the adherend, and has a sufficient cohesive force and conductivity that are incompatible with a single layer. It is a combination.

That is, the present invention is a conductive pressure-sensitive adhesive sheet formed by laminating a pressure-sensitive adhesive layer and a conductive layer on a base material such that a part of the pressure-sensitive adhesive layer is exposed over the entire surface. Also,
In the present invention, a conductive layer is patterned on a release paper, an adhesive is applied thereon, and then bonded to a substrate, and the conductive layer and the adhesive layer are substantially the same on a surface in contact with an adherend. This is a method for producing the pressure-sensitive adhesive sheet having a flat surface. Further, the present invention provides a method in which a pressure-sensitive adhesive layer is patterned on a release paper, a conductive agent is applied thereon, and then bonded to a base material, so that the conductive layer and the pressure-sensitive adhesive layer are substantially in contact with an adherend. This is a method for producing the above-mentioned pressure-sensitive adhesive sheet, which is substantially coplanar. Further, the present invention is the above-mentioned method for producing a pressure-sensitive adhesive sheet, in which a conductive layer patterned on release paper and a pressure-sensitive adhesive layer coated on a substrate are bonded. Further, the present invention is the above-mentioned method for producing a pressure-sensitive adhesive sheet, in which a pressure-sensitive adhesive layer patterned on release paper and a conductive layer coated on a substrate are bonded.

The present invention is also a conductive pressure-sensitive adhesive sheet formed by laminating a conductive layer on a pressure-sensitive adhesive layer such that a part of the pressure-sensitive adhesive layer is entirely exposed. Further, the present invention is the above-mentioned method for producing an adhesive sheet, wherein a conductive layer is patterned on release paper, and an adhesive is applied thereon. Further, the present invention is the above-mentioned method for producing a pressure-sensitive adhesive sheet, wherein a pressure-sensitive adhesive layer is patterned on release paper, and a conductive agent is coated thereon.

Further, according to the present invention, the conductive layer has a volume resistance of 10
The conductive adhesive sheet according to any one of the above, which has a ^-6 to 10 ¹¹ Ωcm. Further, the present invention is any of the above conductive pressure-sensitive adhesive sheets, wherein the exposed pressure-sensitive adhesive layer has an area ratio of 20 to 80%. Further, the present invention is a release material with a conductive layer having a patterned conductive layer on release paper.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The substrate may be any material that can secure the function as an adhesive, and includes a conductive substrate and a non-conductive substrate. The conductive base material has a volume resistance of 10 ⁻⁶ to 10 ¹¹ Ω.
cm, and as the conductive substrate, use metal foil, metal-deposited plastic film, metal fiber (non) woven fabric, metal coated fiber (non) woven fabric, carbon fiber (non) woven fabric, etc. Can be. Further, specific examples of the metal constituting the conductive substrate include a single metal such as platinum, gold, silver, copper, palladium, tungsten, aluminum, nickel, chromium, iron, magnesium, zinc, and tin. An alloy in which two or more kinds of metals are combined is exemplified. When the pressure-sensitive adhesive sheet of the present invention is used as an electromagnetic wave shield, a conductive substrate, in particular, a metal foil which is thin, strong, and has a smooth surface with respect to the adherend surface is preferable. In particular, copper foil is suitable because it has a low volume resistance of 2 × 10 ⁻⁶ Ωcm and is relatively inexpensive among noble metals.

[0009] The non-conductive base material has a volume resistance of 10 ¹² Ωcm.
The above substrate, non-conductive substrate, as a transparent or colored plastic film, paper such as high-quality paper or kraft paper, synthetic resin fibers and cellulose fibers, nonwoven fabrics made of glass fibers and the like, polyethylene, polyurethane, Styrene-isoprene-styrene block copolymer (SI
For example, a foam made of S) or the like can be used. Specific examples of the plastic film include olefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate, polyimide, cellophane, polystyrene, polyvinyl alcohol, polyvinylidene chloride, polyvinylidene chloride copolymer, polyvinylidene fluoride, and polyvinyl chloride. Examples include films of vinyl, nylon, polyacrylic acid, polymethacrylic acid, and the like.

The pressure-sensitive adhesive tape of the present invention includes a tape using a base material and a tape not using the base material.
A thickness of about 00 μm is good, but a thickness that is easy to use may be selected depending on the application. If it is used as a so-called carrier tape for processing small components such as electronic components while transporting them, a thickness of about 50 to 200 μm is particularly preferable because it is necessary to provide a rigidity during transport. Further, if it is used as a packaging tape for electronic parts, it is important that the adhesive be adhered to the shape of the adherend flexibly.
About 0 μm is particularly good. If the contact area between the conductive structure and the housing of a personal computer or the like is small, the electromagnetic wave shielding effect is low if the contact area is small.
About 100 μm is particularly good.

In the case of a double-sided pressure-sensitive adhesive tape in which an insulating pressure-sensitive adhesive typified by an acrylate-based pressure-sensitive adhesive is in contact with the base material and the pressure-sensitive adhesive layers are exposed on both sides, the conductivity of the base material is not important In some cases, a plastic film may be used as the base material. The surface of the plastic film may not be treated, but may be subjected to an easy adhesion treatment such as a corona discharge treatment and a primer coating treatment. In addition, plastic films include various antioxidants, UV absorbers, light stabilizers, heat stabilizers, plasticizers,
An additive such as a lubricant may be contained.

The pressure-sensitive adhesive layer in the present invention is made of a pressure-sensitive adhesive resin, and is a rubber-like region in a temperature range during use.
180 degree peeling adhesive strength according to the adhesive tape / adhesive sheet test method specified in IS Z0237 is 50 mN /
There is no particular limitation as long as it exhibits adhesive properties of 25 mm or more and a holding force of 60 minutes or more before dropping at room temperature.

Specific examples of the adhesive resin include adhesive (meth) acrylic resin, urethane resin, natural and synthetic cis-1,4-polyisoprene rubber, butyl rubber, halogenated butyl rubber, partially vulcanized butyl rubber, styrene- Butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SI
And S), styrene-ethylene-butylene-styrene block copolymer (SEBS), silicone rubber, chloroprene rubber, nitrile rubber, butadiene rubber, and the like, which are generally used as resins for pressure-sensitive adhesives.

In particular, the tacky (meth) acrylic resin is
The glass transition point (Tg) can be freely changed by appropriately setting the composition and molecular weight, and is excellent in transparency and weather resistance, and is suitable for the pressure-sensitive adhesive layer of the present invention. The adhesive acrylic resin is synthesized by ordinary radical polymerization.
There is no particular limitation on the synthesis method, and the synthesis can be performed by a known polymerization method such as solution polymerization, bulk polymerization, or emulsion polymerization. At the time of the polymerization reaction, a known solvent and a polymerization initiator can be used. The adhesive acrylic resin can be partially cross-linked using a cross-linking agent such as an isocyanate, an epoxy compound, or a metal chelate to improve the cohesive strength before use.

[0015] Commercially available solvent-based adhesives containing an adhesive acrylic resin include Olivine B manufactured by Toyo Ink Mfg. Co., Ltd.
PS3156D, BPS3180-3A, BPS371
3, BPS4891 and as the water-based adhesive,
BPW5689J and BPW5320.
The thickness of the pressure-sensitive adhesive layer is preferably about 5 to 150 μm. An appropriate thickness may be selected depending on the application, but if it is used as a carrier tape, it is preferably about 5 to 50 μm. When used as an electronic component packaging tape, the thickness is preferably about 15 to 100 μm. In the case of a junction conduction application, about 10 to 100 μm is particularly desirable.

The conductive layer in the present invention is a layer containing a conductive substance and, if necessary, a binder resin. The binder resin is used when the conductive substance does not have a film-forming property. The conductive layer may be adhesive or non-adhesive at the ambient temperature of the use of the adhesive sheet. When the conductive layer is non-adhesive, air and moisture mixed between the adherend and the adhesive sheet are extruded in one direction with a squeegee or the like when the pressure-sensitive adhesive sheet is adhered to the adherend. The layer can be easily removed to the outside of the adhesive sheet as a passage.

The conductive substance includes a metal, a metal oxide, carbon, and an organic compound. The shape of the conductive substance may be any of powder, scale, and fiber. Specific examples of the metal include platinum, gold, silver, copper, palladium, tungsten, aluminum, nickel, chromium, iron, magnesium, zinc, tin, and the like, and alloys thereof.
Alternatively, two or more kinds can be used as a mixture. Inorganic substances such as metals and glasses that are inexpensive and have low conductivity as metals,
An organic material such as polyester, which is coated with a highly conductive metal such as gold, silver, or nickel by an electroless plating method, a vapor deposition method, or the like, can also be used.

Examples of the metal oxide include chromium dioxide and molybdenum dioxide. Examples of the carbon include carbon black and graphite. Examples of the organic compound include hydrophilic resins represented by polyvinyl alcohol and polyethylene oxide-containing polymers, cationic activators represented by quaternary ammonium salts, nonionic activators such as ethylene oxide, and anions such as alkyl phosphates. Activators and betaine-based zwitterionic activators.
Further, a conjugated polyene compound represented by polyacetylene, in which the resin itself has conductivity, a chelate compound represented by polycopper phthalocyanine, and a charge transfer addition compound represented by polyvinyl carbazole antimony pentachloride are exemplified.

As the binder resin, (meth) acrylic resin, polyester resin, polyurethane resin, polystyrene resin, polypropylene resin, polyethylene resin,
Acrylonitrile butadiene styrene (ABS) resin,
Polycarbonate resin, epoxy resin, natural and synthetic cis-1,4-polyisoprene rubber, butyl rubber, halogenated butyl rubber, partially vulcanized butyl rubber, SBS, SI
S, SEBS, silicone rubber, chloroprene rubber, nitrile rubber, butadiene rubber, and the like. As the conductive layer, a metal powder dispersed in a binder resin,
In particular, a material in which silver powder is dispersed in a polyester resin is preferable because it has a low volume resistance of 5 × 10 ⁻⁴ Ωcm or less and has flexibility to follow the shape of an adherend.

The volume resistance of the conductive layer is 10 ^-6 to 10 ¹¹ Ωc.
m is preferable. Volume resistance of conductive layer is 10 ¹¹ Ω
cm or less functions as an antistatic material. The adhesive sheet of 10 ^-2 to 10 ⁸ Ωcm functions as an antistatic material. The pressure-sensitive adhesive sheet of 10 ^-6 to 10 ^-2 Ωcm functions as an electromagnetic wave shielding material. The thickness of the conductive layer is preferably 1 nm to 2 mm, particularly 5 nm to 1 m.
m is preferable. A film on the order of nm can be obtained by vapor deposition or the like, but if the thickness of the conductive layer is less than 1 nm, there is concern about the continuity of the film formed by the deposited metal, and it is possible to stably exhibit conductivity. It will be difficult. 2m
If it exceeds m, it lacks flexibility as an adhesive tape,
It becomes difficult to use.

The conductive layer of the pressure-sensitive adhesive sheet of the present invention may be such that a part of the pressure-sensitive adhesive layer is exposed over the entire surface in a state where the conductive layer and the pressure-sensitive adhesive layer are laminated, and the conductive layer itself is partially coated. It may be processed (patterned) or entirely coated. However, the conductive layer needs to be continuous. When the conductive layer is discontinuous, conduction is hindered, and the effects of preventing static electricity and preventing static electricity and shielding electromagnetic waves cannot be expected. Further, the pattern of the conductive layer exposed on the surface in contact with the adherend may be any pattern, and as the pattern,
Examples include geometric patterns such as stripes, lattices, polka dots, inverted polka dots, and staggered patterns, and patterns having information such as characters and symbols.

More specifically, the stripe means a pattern in which the exposed portion of the conductive layer is a straight line having a width of 50 μm to 10 mm, and the interval between the straight lines (conductive layer) is in a range of 50 μm to 50 mm. Also, the lattice refers to a pattern in which two stripes in the above range intersect at an angle of 90 degrees, but may have a shape in which the intersecting angle (smaller intersection angle) is changed from 30 degrees to 80 degrees. . Further, a combination of a plurality of line widths and a plurality of intervals between straight lines may be used.

A polka dot means that the exposed portion of the conductive layer has a diameter of 50 μm.
a circle in the range from m to 10 mm, and the distance between the centers of the circles is 10
The pattern is a close-packed arrangement in the range of μm to 50 mm, but the diameters of all the circles do not have to be the same, and the circles may be randomly arranged. The reverse polka dot refers to a pattern in which the polka dot pattern is a negative type (the exposed portion of the adhesive layer is the polka dot pattern). The staggered pattern means a pattern in which one unit is in a range of 50 μm to 50 mm.

Further, the adhesive performance of the adhesive layer and the conductive performance of the conductive layer are determined by the area ratio between the exposed adhesive layer and the conductive layer.
It is desirable that the area ratio of the conductive layer be in the range of 20 to 80% / 80 to 20%. If the area ratio of the pressure-sensitive adhesive layer is lower than 20%, sufficient adhesiveness cannot be exhibited, and if it exceeds 80%, a sufficient conductive effect cannot be obtained.
In any case, the object of the present invention is not sufficiently achieved.

The method for producing the conductive pressure-sensitive adhesive sheet of the present invention is not particularly limited, but includes a method for producing a conductive layer by partially coating (patterning) and a method for producing a conductive layer by coating the entire surface. It is roughly divided. The method of manufacturing by partially coating the conductive layer includes (1) a method in which the conductive layer is patterned on a release paper, an adhesive is coated thereon, and then the substrate is bonded to the base material; (3) a method in which a conductive layer is patterned and a pressure-sensitive adhesive layer is coated thereon, and (3) a method in which a conductive layer patterned on a release paper and a pressure-sensitive adhesive layer coated on a base material are bonded to each other. Method. Also, as a method of manufacturing by coating the entire surface of the conductive layer,
(4) a method in which an adhesive layer is patterned on a release paper, a conductive agent is applied thereon, and then the substrate is bonded to a base material;
A method of patterning a pressure-sensitive adhesive layer on release paper and applying a conductive agent thereon, (6) a method of bonding the pressure-sensitive adhesive layer patterned on release paper and the conductive layer coated on the substrate, Of the three methods.

In the methods (1) and (4), the pressure-sensitive adhesive layer and the conductive layer can be made substantially coplanar and smooth on the surface in contact with the adherend by bonding to the substrate. it can. Also in the methods (2), (3), (5) and (6), the pressure-sensitive adhesive layer and the conductive layer are substantially coplanar on the surface in contact with the adherend, and the surface is smooth. Can be realized. If the surface in contact with the adherend is smooth,
It is preferable because the adhesive performance and the conductive performance are stably exhibited. The pressure-sensitive adhesive sheet produced by the methods (2) and (5)
It is a cast type using release paper as a base material for coating, and at the time of application, the release paper is peeled off to form a sheet comprising an adhesive layer and a conductive layer.

After laminating the conductive layer and the pressure-sensitive adhesive layer on the release paper, the adhesive force at the conductive layer / release paper interface is smaller than the pressure-sensitive adhesive layer / conductive layer interface, and at the same time, at the release interface in contact with the pressure-sensitive adhesive layer. It is required that the release paper can be easily peeled off and that no pressure-sensitive adhesive layer remains on the release paper. The level that can be easily peeled here is generally 1 level.
It has a peel strength of less than 1 N / 25 mm. More specifically, as the release paper, those obtained by applying a silicone-based or non-silicone-based release agent on various plastic films or paper such as polyethylene terephthalate or oriented polypropylene can be used. Examples of commercially available release paper include a film binder series and a binder sheet series manufactured by Fujimori Industries Co., Ltd., and a tocello separator SP series manufactured by Tosero Corporation.

The method of applying the pressure-sensitive adhesive on a release paper or a base material may be any method capable of forming a thin film layer of about 5 to 150 μm, for example, a comma coater, a die coater,
This is performed using a lip coater, a kiss coater, a gravure coater, or the like. The viscosity of the adhesive is
About 0.1 to 100 Pa · s is good. To form a conductive layer on release paper or a substrate, a gravure printing, silk-screen printing, offset printing, flexo printing is performed by dissolving or dispersing a conductive substance and, if necessary, a binder resin in a liquid medium. The coating is performed by a method such as inkjet, thermal transfer, intermittent die coating, or the like. Alternatively, it can be performed by depositing a conductive metal on release paper or a base material. Metal deposition layer (conductive layer)
Can be performed by bonding the pressure-sensitive adhesive layer of the sheet having the patterned pressure-sensitive adhesive layer to the metal vapor-deposited layer and then peeling it off.

[0029]

The present invention will be described below with reference to examples. In the examples, “parts” means “parts by weight”.

(Example 1) Conductive agent ("SS Riophase Ag-A" manufactured by Toyo Ink Mfg. Co., Ltd., conductive material:
Silver, a binder resin: a polyester resin) and a dry film thickness of 20 μm in a pattern having a grid width of 0.5 mm and an area ratio (ratio to the entire grid printed portion) of 30% as shown in FIG.
m, polyethylene terephthalate (PE
T) Release paper (“SP-PET-D13-” manufactured by Tosero Corporation)
50-BU ”) was subjected to silk printing on the release surface to obtain a release material with a conductive layer composed of release paper 4 / conductive layer 3. Next, an adhesive containing an adhesive acrylic resin (“Olivein BPS3156” manufactured by Toyo Ink Mfg. Co., Ltd.) is formed on the conductive layer 3 of the release material.
D ") 100 parts and a tolylene diisocyanate derivative-based curing agent (" BHS8515 "manufactured by Toyo Ink Mfg. Co., Ltd.) 3
And the coating liquid obtained by stirring and mixing the mixture with a dry coat part 4 with a comma coater.
Coating the whole surface to 0 μm, and take up 25 μm
It was laminated with a thick copper foil at a pressure of 0.3 MPa to obtain a pressure-sensitive adhesive sheet 1 having a cross section shown in FIG. 1 composed of a release paper 4 / a conductive layer 3 / a pressure-sensitive adhesive layer 2 / a substrate 1.

(Example 2) In the same manner as in Example 1, a release material with a conductive layer composed of release paper 4 '/ conductive layer 3' was manufactured. On the conductive layer 3 'of the obtained release material, a coating solution comprising the same adhesive and curing agent as in Example 1 was applied over the entire surface by the same method, and at the time of winding, the adhesive obtained in Example 1 was applied. The sheet is laminated at a pressure of 0.3 MPa so that the first surface of the sheet and the pressure-sensitive adhesive layer are in contact with each other, and a release paper 4 / a conductive layer 3 / a pressure-sensitive adhesive layer 2 / a substrate 1 / a pressure-sensitive adhesive layer 2 '/ Conductive layer 3'
/ A pressure-sensitive adhesive sheet 2 having a cross section shown in FIG.

(Embodiment 3) The pattern of the conductive layer is shown in FIG.
Was changed to a reverse polka dot pattern with a polka dot diameter of φ2.0 mm and an area ratio (ratio to the entire reverse polka dot printed portion) of 70%, and the copper foil used at the time of winding was replaced with PET release paper “SP-
PET-D13-50-BU "in the same manner as in Example 1 except that the pressure-sensitive adhesive layer and the release surface were laminated at a pressure of 0.3 MPa so as to be in contact with each other.
A pressure-sensitive adhesive sheet 3 having a cross section shown in FIG.

(Example 4) Conductive agent ("Aqua Ace Conductive Sumi" manufactured by Toyo Ink Mfg. Co., Ltd., conductive substance: carbon black, binder resin: polyester resin)
The same PET as in Example 1 was used to obtain a dry film thickness of 10 μm in a pattern having a lattice width of 1.0 mm and an area ratio (ratio of the entire lattice printed portion) of 30% as shown in FIG.
Gravure printing was performed on the release surface of the release paper “SP-PET-D13-50-BU” to obtain a release material with a conductive layer composed of release paper 4 / conductive layer 3. On the other hand, a 25 μm-thick PET film was entirely coated with a coating solution comprising the same adhesive and curing agent as in Example 1 in the same manner as in Example 1 to form an adhesive comprising an adhesive layer 2 and a base material 1. I got a sheet. Next, the obtained release material with a conductive layer and the pressure-sensitive adhesive sheet were laminated at a pressure of 0.3 MPa so that the conductive layer 3 and the pressure-sensitive adhesive layer 2 were in contact with each other.
FIG. 4 comprising release paper 4 / conductive layer 3 / adhesive layer 2 / substrate 1
Was obtained.

(Example 5) A coating liquid comprising the same adhesive and curing agent as in Example 1 was applied to a coating liquid having a width of 1.0 as shown in FIG.
mm and an area ratio (the ratio of the stripe-printed portion to the whole) of 50% was applied by a comma coater to the release surface of the PET release paper as in Example 1 so as to have a dry film thickness of 25 μm. / A sheet comprising the pressure-sensitive adhesive layer 2 was obtained. Next, on the adhesive layer of this sheet, a conductive agent (conductive adhesive (“SK Dyne 535” manufactured by Soken Chemical Co., Ltd.)
D ", conductive substance: carbon black, binder resin: adhesive acrylic resin) 100 parts and tolylene diisocyanate derivative-based curing agent (" B "manufactured by Toyo Ink Mfg. Co., Ltd.)
HS8515 ”) is coated with a comma coater over the entire surface to a dry film thickness of 40 μm.
At the time of winding, it was laminated with a copper foil having a thickness of 25 μm at a pressure of 0.3 MPa to obtain an adhesive sheet composed of release paper 4 / conductive layer 3 / adhesive layer 2 / base material 1. Further, the same conductive agent is applied on the entire surface of the pressure-sensitive adhesive layer 2 'of the sheet composed of the release paper 4' / pressure-sensitive adhesive layer 2 'obtained by the same method in the same manner. The pressure-sensitive adhesive sheet obtained in the above, 0.3 MPa so that the substrate surface of the pressure-sensitive adhesive sheet and the conductive layer are in contact with each other
And a release paper 4 / adhesive layer 2 / conductive layer 3 / substrate 1 / conductive layer 3 '/ adhesive layer 2' / release paper 4 '
The pressure-sensitive adhesive sheet 5 having a cross section shown in FIG. 5 was obtained.

Example 6 A coating liquid comprising the same adhesive and curing agent as in Example 1 was applied to a coating liquid having a width of 1.0 as shown in FIG.
mm and an area ratio (the ratio of the stripe-printed portion to the whole) of 50% was applied by a comma coater to the release surface of the PET release paper as in Example 1 so as to have a dry film thickness of 25 μm. / A sheet comprising the pressure-sensitive adhesive layer 2 was obtained. Next, a conductive agent (SS Riophase CC, manufactured by Toyo Ink Mfg. Co., Ltd., conductive material: graphite, binder resin: polyester resin) is applied on the adhesive layer of this sheet so that the dry film thickness becomes 50 μm. The whole surface is coated by silk screen printing, release paper 4 / adhesive layer 2 /
Pressure-sensitive adhesive sheet 6 having a cross section shown in FIG.
I got

Example 7 Aluminum was deposited on the entire surface of the PET release paper in the same manner as in Example 1 so as to have a thickness of 20 nm, and a release material with a conductive layer composed of release paper 4 / conductive layer 3 was formed. I got On the other hand, the same pressure-sensitive adhesive “Oribine BPS3” as in Example 1 was placed on a PET film having a thickness of 25 μm.
156D "100 parts and the curing agent" BHS8515 "3 parts were stirred and mixed, and the coating liquid diluted to 10% of non-volatile content with ethyl acetate was applied as shown in FIG. Gravure printing was performed so that the dry coating amount was 1 μm in a pattern of 50% (the ratio of the entire portion) to obtain an adhesive sheet composed of the adhesive layer 2 and the base material 1. Next, the obtained release material with a conductive layer and the pressure-sensitive adhesive sheet are laminated at a pressure of 0.3 MPa so that the conductive layer 3 and the pressure-sensitive adhesive layer 2 are in contact with each other. Layer 2 /
An adhesive sheet 7 having the cross section shown in FIG.

(Comparative Example 1) A coating liquid containing the same adhesive and curing agent as in Example 1 was applied on the same release paper as in Example 1 by a comma coater so as to have a dry film thickness of 30 μm. At the time of removal, an aluminum foil having a thickness of 25 μm and 0.
Lamination was performed under a pressure of 3 MPa to obtain a pressure-sensitive adhesive sheet 8 having a cross section shown in FIG. (Comparative Example 2) On the same release paper as in Example 1, a coating liquid comprising the same conductive pressure-sensitive adhesive and curing agent as in Example 5 was applied over the entire surface with a comma coater so as to have a dry film thickness of 30 µm.
At the time of winding, it was laminated with a polyethylene terephthalate film having a thickness of 25 μm at a pressure of 0.3 MPa to obtain an adhesive sheet 9 having a cross section shown in FIG.

The pressure-sensitive adhesive force and electric resistance of the obtained pressure-sensitive adhesive sheet were evaluated by the following methods, and the volume resistance of the conductive layer was calculated from the electric resistance value. Table 1 shows the results. (1) Evaluation of adhesive strength The release paper 4 of the adhesive sheet was peeled off, and the adhesive tape / adhesive sheet test method specified in JIS Z0237 was used.
The 0 degree peel adhesion was measured. Specifically, for a double-sided pressure-sensitive adhesive sheet (pressure-sensitive adhesive sheets 2, 3, and 5), a 25-μm polyethylene terephthalate film was laminated on the opposite side of the measurement surface, and then a single-sided pressure-sensitive adhesive sheet (pressure-sensitive adhesive sheets 1, 4
And 6 to 9) in the same form, width 25
mm, and cut into 210 mm in length, and bonded to a stainless steel plate (SUS304) polished with # 280 water-resistant abrasive paper while pressing it with a rubber roller at a pressure of 0.2 MPa. It was measured. The 180 ° peel adhesion was measured under the conditions of a temperature of 25 ° C. and a relative humidity of 60%.
The peeling speed was 300 mm / min.

(2) Evaluation of Electric Resistance As shown in FIGS. 12 and 13, an adhesive sheet A was placed on an epoxy resin-impregnated glass plate C such that the release paper 4 was on top. In the case of a double-sided pressure-sensitive adhesive sheet, the release paper 4 ′ was peeled off and adhered, and in the case of a single-sided pressure-sensitive adhesive sheet, the substrate 1 was placed on the glass plate C such that the substrate 1 was in contact with the glass plate C. Then
Peel off the release paper 4 of the adhesive sheet A, and place 2 on the adhesive sheet A.
One copper foil B was placed, a tester D was connected to the copper foil B, and the electric resistance was measured.

(3) Calculation of Volume Resistance The volume resistance was calculated from the following formula. Volume resistance value (Ωcm) = (R × t × W) / L R: resistance value between electrodes (Ω) t: thickness of coating film (cm) W: width of coating film (cm) L: between electrodes Distance (cm)

[0041]

[Table 1]

[0042]

According to the present invention, a pressure-sensitive adhesive sheet having both adhesiveness and conductivity can be provided by adopting a simple structure in which a pressure-sensitive adhesive layer and a conductive layer are laminated so that a part of the pressure-sensitive adhesive layer is exposed over the entire surface. It has become possible.

[0043]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an adhesive sheet of Example 1.

FIG. 2 is a cross-sectional view of the pressure-sensitive adhesive sheet of Example 2.

FIG. 3 is a cross-sectional view of the pressure-sensitive adhesive sheet of Example 3.

FIG. 4 is a cross-sectional view of the pressure-sensitive adhesive sheet of Example 4.

FIG. 5 is a cross-sectional view of the pressure-sensitive adhesive sheet of Example 5.

FIG. 6 is a sectional view of the pressure-sensitive adhesive sheet of Example 6.

FIG. 7 is a cross-sectional view of the pressure-sensitive adhesive sheet of Example 7.

FIG. 8 is a cross-sectional view of the pressure-sensitive adhesive sheets of Comparative Examples 1 and 2.

FIG. 9 is an exposure pattern (filled portion) of the conductive layer of the pressure-sensitive adhesive sheets of Examples 1, 2, and 4.

FIG. 10 is an exposure pattern (filled portion) of a conductive layer of the pressure-sensitive adhesive sheets of Examples 3 and 7.

FIG. 11 is an exposure pattern (filled portion) of a conductive layer of the pressure-sensitive adhesive sheet of Example 5.

FIG. 12 is a top view showing a method for measuring electric resistance.

FIG. 13 is a cross-sectional view showing a method for measuring electric resistance.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base material 2, 2 'adhesive layer 3, 3' conductive layer 4, 4 'Release paper A Adhesive sheet B Copper foil C Epoxy resin impregnated glass plate

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Masato Yanagi F-term in Toyo Ink Manufacturing Co., Ltd. 2-3-13 Kyobashi, Chuo-ku, Tokyo 4J004 AA04 AA05 AA06 AA10 AA11 AA14 AB01 CA02 CA03 CA04 CA05 CA06 CA07 CA08 CB01 CC03 CE03 DB03 DB04 FA05 5G307 GA08 GB02 GC01 GC02 5G323 AA03

Claims (11)

[Claims] 1. A conductive pressure-sensitive adhesive sheet obtained by laminating a pressure-sensitive adhesive layer and a conductive layer on a substrate such that a part of the pressure-sensitive adhesive layer is exposed over the entire surface. 2. A conductive pressure-sensitive adhesive sheet comprising a conductive layer laminated on a pressure-sensitive adhesive layer such that a part of the pressure-sensitive adhesive layer is entirely exposed. 3. The conductive layer has a volume resistance of 10 ^-6 to 10 ¹¹ Ωcm.
The conductive pressure-sensitive adhesive sheet according to claim 1 or 2, wherein 4. An exposed pressure-sensitive adhesive layer having an area ratio of 20 to 80.
% Of the conductive pressure-sensitive adhesive sheet according to claim 1. 5. A conductive layer is patterned on a release paper, an adhesive is applied thereon, and then bonded to a base material, so that the conductive layer and the adhesive layer are substantially in contact with the adherend. The method for producing a conductive pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive sheet is coplanar. 6. The method for producing a conductive pressure-sensitive adhesive sheet according to claim 2, wherein a conductive layer is patterned on release paper, and a pressure-sensitive adhesive is applied thereon. 7. A conductive layer patterned on release paper,
The method for producing a conductive pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer applied to the substrate is laminated. 8. A pressure-sensitive adhesive layer is patterned on a release paper, a conductive agent is applied thereon, and then bonded to a base material, so that the conductive layer and the pressure-sensitive adhesive layer are substantially in contact with the adherend. 2. The method for producing a conductive pressure-sensitive adhesive sheet according to claim 1, wherein the same surface is provided. 9. The method for producing a conductive pressure-sensitive adhesive sheet according to claim 2, wherein a pressure-sensitive adhesive layer is patterned on release paper, and a conductive agent is applied thereon. 10. The method for producing a conductive pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer patterned on the release paper and the conductive layer coated on the base material are bonded. 11. A release material with a conductive layer having a patterned conductive layer on release paper.