JP2001007580A - Cooling device, and electronics with built-in cooing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve heat control having high efficiency while ensuring of miniaturization. SOLUTION: A both-surface air suction type blast fan 24 is housed in a fan casing 23 in a manner that both surfaces can suck air, the fan casing 23 is installed to a heat-dissipation member 22 on which a heat-receiving section 221 is mounted, air is sucked from both end sections of the fan casing 23 in accordance with the driving of the blast fan 24, air is blasted to the heat- receiving section 221 of the heat-dissipation member 22 from a blasting port 231 formed to the fan casing 23, and an electronic part 21 is cooled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a portable personal computer (PC), and more particularly to a cooling device therefor.

[0002]

2. Description of the Related Art Recently, in the field of electronic devices of this kind, electronic components for processing various information such as characters, voices, images, etc., for example, MPU (Micro Processing).
(Unit)), and the promotion of multi-function is being promoted. In such an electronic device, the power consumption of the MPU is increased as the integration and performance of the MPU are increased, and the amount of heat generated is increased due to the increase in the power consumption. The amount of heat generated during operation of the entire device is increased.

On the other hand, electronic devices are required to be small and thin so as to be suitable for carrying, and it is difficult to secure a desired gap in which a printed wiring board on which electronic components are mounted is mounted on a housing of the device. Has become.

Therefore, in the above-mentioned electronic equipment, a cooling device for thermally controlling electronic parts such as an MPU of a printed wiring board housed in the equipment housing is assembled, and a cooling structure for thermally controlling the electronic parts is adopted. ing.

In such a conventional cooling device, an electronic component is thermally connected to one end of a heat radiating member called a heat sink, and a blower fan is attached to the other end of the heat radiating member.

According to the above configuration, when the electronic components are driven and generate heat, the amount of heat is transferred to the other end of the heat radiating member, and the amount of heat transferred to the other end of the heat radiating member is cooled by the blowing fan, and the electronic component is cooled. Thermally control the part to the desired temperature.

However, in the above-described cooling device, the heat generated by other electronic components including a power supply system mounted on a printed wiring board is effectively radiated with the increase in speed and multifunctionality of the electronic components. However, there is a risk that the temperature of the device will rise, and as a result, the performance of other components will be impaired.

Therefore, a method of improving the cooling capacity of the cooling device and performing high-efficiency heat control in an equipment housing (not shown) can be considered.

However, in the above-described cooling device, the capacity of the blower fan must be improved in order to improve the cooling capacity, so that the equipment housing (not shown) becomes large and thick. In addition, there is a problem that it is difficult to satisfy the miniaturization and thinning to be suitable for carrying.

[0010]

As described above, the conventional cooling device has a problem that it becomes large in size in response to an increase in the amount of heat generated by the electronic components.

The present invention has been made in view of the above circumstances, and has as its object to provide a cooling device capable of realizing high-efficiency heat control while ensuring miniaturization.

Further, the present invention provides an electronic device capable of realizing high-efficiency heat control and improving the processing capacity while securing a small size and a thin shape until it is suitable for carrying. The purpose is to do.

[0013]

According to the present invention, a pair of intake ports are provided in the direction of the fan axis of a two-sided intake type fan, and a pair of intake ports are provided around the fan shaft in a direction substantially perpendicular to the fan shaft. The cooling device comprises a cooling fan unit, a heat receiving unit thermally connected to the electronic components, and a heat radiating member provided with a fan unit mounting portion to which the cooling fan unit is mounted.

According to the above configuration, when the blower fan is driven, the cooling fan unit draws air from both of the pair of intake ports, and transfers the drawn air from the blower port to the heat receiving portion of the heat radiating member. The electronic component is cooled by blowing air toward the heat receiving portion of the heat radiation member.

[0015] Thereby, a sufficient amount of air can be supplied to the heat receiving portion of the heat radiating member, so that the cooling capacity can be improved, and high-efficiency cooling of the electronic component can be realized, and the size can be reduced. After securing, it is possible to promote the processing capacity of the electronic component.

According to the present invention, there is provided an equipment housing in which a printed wiring board on which electronic components are mounted is accommodated and arranged, and a fan shaft of a double-sided intake type blower, which is accommodated and arranged in the equipment housing. A cooling fan unit provided with a pair of air intake ports in the direction of the blower fan in the direction, and a blower port provided in a periphery substantially orthogonal to the fan axis, and accommodated in the device housing, and An electronic device is provided including a heat receiving portion thermally connected to electronic components of the wiring board, and a heat radiating member provided with a fan unit mounting portion to which the cooling fan unit is mounted.

According to the above configuration, when the blower fan is driven, the cooling fan unit draws air from both of the pair of intake ports and directs the sucked air from the blower port to the heat receiving portion of the heat radiation member. To cool the electronic components by directly cooling the heat receiving portion of the heat radiating member, and to blow the air into the equipment housing to cool the equipment housing.

Thus, a sufficient amount of air can be supplied to the heat receiving portion of the heat radiating member and the inside of the equipment housing, so that the cooling capacity can be improved. Cooling of the inside of the body is realized, so that the size of the device housing can be reduced to a size suitable for carrying, and the processing capacity of electronic components can be promoted.

[0019]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows an electronic apparatus according to an embodiment of the present invention. An apparatus housing 10 includes a case 101 and a cover 1 made of a metal material such as a magnesium alloy.
02 is formed in a substantially box shape, and the keyboard 11 is mounted on the cover 102 so as to be operable by keys. And
A liquid crystal display (LCD) 13 is attached to the device housing 10 via a hinge mechanism 14 so as to be openable and closable in the direction of the arrow, corresponding to the keyboard 11.

As shown in FIG. 2, a printed wiring board 20 is accommodated in the equipment housing 10, and the keyboard 11 and the liquid crystal display 13 are electrically connected to the printed wiring board 20. The printed wiring board 20 is driven in conjunction with the key operation of the keyboard 11, and desired information corresponding to the key operation is displayed on the liquid crystal display 13.

On one surface of the printed wiring board 20, a plurality of electronic components, for example, electronic components 21 such as MPU are mounted. And the electronic component 21 of this printed wiring board 20
A heat dissipating member 22 called a heat sink constituting the cooling device
Is thermally coupled via a heat conducting member called a cool sheet (not shown).

As shown in FIG. 3, the heat dissipating member 22 has a fan mounting portion 222 integrally formed at one end of the heat receiving portion 221. An intermediate portion between the fan mounting portion 222 and the heat receiving portion includes, for example, an external device. A plurality of ventilation windows 223 for blowing are formed at predetermined intervals.

The heat radiating member 22 has a heat receiving portion 22.
The end of the heat pipe 25 constituting the heat transfer path is attached to the heat pipe 1 by caulking or the like. Here, the heat pipe 25
Transfers the heat transmitted to the heat receiving unit 221 to a gap (not shown) in the device housing and radiates the heat, thereby cooling the heat receiving unit 221.

An opening is provided in the fan mounting portion 222 of the heat radiating member 22, and a fan casing 23 constituting a cooling fan unit is mounted corresponding to this opening using screws or the like. The fan casing 23 is formed in, for example, a bottomed cylindrical shape, and accommodates a so-called turbo fan structure double-sided air blower fan 24 in which a plurality of flat blades are radially arranged on a rotation shaft. A rotating shaft of a blower fan 24 is rotatably attached to the fan casing 23, and an intake port 23 is provided around the rotating shaft.
1 is provided to face the opening of the fan mounting portion 222.

The fan casing 23 has a blower port 232 (see FIG. 2) in a direction substantially perpendicular to the rotation axis of the blower fan 24, and
21 is formed. Thereby, the blower fan 2
4 is driven, the air flows to the open side of the fan casing 23 and the air inlet 231 corresponding to both surfaces of the blower fan 24.
And is blown from the blower port 232 of the fan casing 23. The blown air is blown to the heat receiving portion 221 of the heat radiation member 22 and is blown into the device housing 10 through the ventilation window 231.

Further, FIG.
As shown in FIG. 7, an air guide portion 233 is formed corresponding to the air intake port 103 of the device housing 10 described in detail later. The air guide section 233 is connected to the air intake port 103 of the device housing 10.
The outside air taken in from the fan is efficiently guided to the intake port 231 and the open side of the fan casing 23 on one side of the blower fan 24.

In the heat radiation member 22, a plurality of positioning protrusions 224 are formed at predetermined intervals on the fan mounting portion 222 so as to face the case 101 of the device housing 10 (see FIG. 3). The protrusion 224 is mounted on the inner wall of the case 101 and positions the heat radiation member 22 at a predetermined position. In this state, the heat dissipating member is mounted on the case 101 using screws or the like. Thereby, the fan casing 2 attached to the fan mounting portion 222 of the heat radiation member 22
3 is the case in which the blower fan 24 is
1 is effectively prevented from coming into contact with the device housing 1.
0 can be promoted.

Here, when the blower fan 24 is driven to rotate, the cooling fan unit draws air from the intake port 231 of the fan casing 23 and the opening of the fan mounting part 222 from the open side thereof, and the exhaust port 232 thereof. From the heat receiving part 221 of the heat radiating member 22. Thereby, the heat receiving portion 221 of the heat radiating member 22 is cooled by the air blown from the exhaust port 232 of the fan casing 23, and efficiently cools the electronic component 21 of the printed wiring board 20.

At the same time, the air blown from the exhaust port 232 of the fan casing 23 is blown into the equipment housing 10 through the ventilation window 223 of the heat radiating member 22 to cool other heat generating parts in the equipment housing 10. Provided. As a result, the temperature inside the device housing 10 is prevented from rising.

In the above description, the intake port 231 is provided on the bottom surface.
Using a bottomed tubular fan casing 23 formed with
An opening is formed in the fan mounting portion 222 of the heat radiation member 22,
Although the air is sucked in from the upper and lower ends of the fan casing 23, the present invention is not limited to this. It may be configured as follows.

As shown in FIG. 5, a resin wall portion 30 is provided on one side wall of the device housing 10 so as to be thermally insulated from the case 101 and the cover 102 made of a metal material. On the resin wall portion 30, the air intake port 103, the air exhaust port 104, the power switch 105, and the switch lock operator 106 are arranged in parallel. Air inlet 1
Numeral 03 draws air outside the device housing 10 into the device housing 10 by driving the blower fan 24 of the cooling fan unit. The air exhaust port 104 exhausts the exhaust air exhausted into the device housing 10 from the exhaust port 232 of the fan casing 23 by driving the blower fan 24 of the cooling fan unit to the outside of the device housing 10.

The power switch 105 is connected to the electronic component 21 on the printed wiring board 20, and selectively switches on and off the power by the switching operation. The switch lock operator 106 locks and unlocks the power switch 105 at the operation position by the switching operation.

In FIG. 5, reference numeral 107 denotes a mounting hole to which a not-shown anti-theft mechanism, called a Kensington lock hole, is attached. It serves as an air inlet and outlet to the inside, contributing to the improvement of cooling efficiency.

Further, reference numeral 108 in FIG.
An expansion card slot for a PC card or the like according to the A standard.

Further, the case 101 of the device housing 10
Are formed with a plurality of air exhaust holes 109 (see FIG. 2). The air that has been blown from the blower fan 24 of the cooling fan unit and circulated in the device housing 10 is discharged to the outside of the device housing 10 through the plurality of air exhaust holes 109.

According to the above configuration, the power switch 105 and the switch lock operation member 106 are disposed on the resin side wall portion 30 formed of a resin material having a small specific heat, so that the power switch 105 and the switch lock operation member 106 are separated from the metal housing 10. Thermally insulated,
In addition, the specific heat is similarly small for the air intake port 103 and the air exhaust port 104, so that they are thermally insulated from each other. Therefore, even when the computer main body is driven, the temperature of the power switch 105 and the switch lock operator 106 during operation are effectively reduced, and a good operational feeling can be obtained.

In the above configuration, when the electronic components 21 of the printed wiring board 20 are driven and generate heat, the electronic components 21
Is transmitted to the heat receiving portion 221 of the heat radiating member 22, and the temperature of the heat receiving portion 221 rises.

Here, when a temperature sensor (not shown) detects a rise in temperature, a control unit (not shown) drives and controls the blower fan 24 of the cooling fan unit in response to this. Then, in association with the driving, the blower fan 24 forcibly sucks the external air of the device housing 10 from the air inlet 103 of the device housing 10 and the air inlet 231 of the fan casing 23.
And the fan mounting portion 222 of the heat radiation member 22 through the open side
Inlet air through the openings. This fan casing 23
The air sucked into the air is blown from the blowing port 232 to the heat receiving section 221 of the heat radiation member 22 to cool the heat receiving section 221,
The electronic component 21 of the printed wiring board 20 is cooled.

At the same time, the air outlet 2 of the fan casing 23
The air blown from the air radiating member 32 is
3 is blown into the equipment housing 10 to cool the internal equipment including the printed circuit board 20 in the equipment housing 10. And
The air blown from the air outlet 232 of the fan casing 23 is discharged out of the equipment housing 10 from the air outlet 204 of the equipment housing 10.

As described above, in the cooling device, the double-sided intake type blower fan 24 is accommodated in the fan casing 23 so as to be capable of both-sided intake, and the fan casing 23 is connected to the heat receiving portion 221.
Is attached to the heat dissipating member 22, and the air is sucked in from both ends of the fan casing 23 in conjunction with the driving of the blower fan 23, and the air outlet 23 provided in the fan casing 23 is provided.
1 to the heat receiving portion 221 of the heat radiating member 22 to cool the electronic component 21.

According to this, when the blower fan 24 is driven, air is sucked in from the open side of the fan casing 23 attached to the heat radiating member 22 and from both sides of the intake port 231, and is blown from the blower port 232 of the fan casing 23. Since the air is blown toward the heat receiving portion 221 of the heat radiating member 22 and the electronic component 21 is cooled by directly cooling the heat receiving portion 221 of the heat radiating member 22, without increasing the performance of the blower fan 24. Therefore, it is possible to secure a sufficient air flow. As a result,
Improvement of the cooling capacity is realized, high-efficiency cooling of the electronic component 21 is realized, and the size of the electronic component 2 is reduced.
1 can promote the processing capacity.

Further, the electronic device is a device housing 1 in which a printed wiring board 22 on which an electronic component 21 is mounted is housed and arranged.
0, the two-sided intake type blower fan 24 is connected to the fan casing 2
3 so that it can be sucked into both sides.
3 is attached to the heat dissipating member 22 provided with the heat receiving portion 221, and the electronic component 21 of the printed wiring board 20 is thermally coupled to the heat receiving portion 221 of the heat dissipating member 22.
4, air is sucked in from both ends of the fan casing 23, and is blown to the heat receiving portion 221 from the blower port 232 provided in the fan casing 23, and
Is configured to cool the electronic component 21.

According to this, when the blower fan 24 is driven, the cooling fan unit draws air from both sides of the open side of the fan casing 23 and the intake port 231 to radiate heat from the blower port 232 of the fan casing 23. Air is blown toward the heat receiving portion 221 of the member 22 to directly cool the heat receiving portion 221 of the heat radiating member 22 to cool the electronic component 221, and to blow air into the device housing 10 to blow the device housing 10. The inside of the body 10 is cooled.

As a result, a sufficient amount of air can be supplied to the heat receiving portion 221 of the heat radiating member 22 and the inside of the device housing 10, and the cooling capacity can be improved. Along with the cooling, the cooling of the device housing 10 is realized, so that the size of the device housing 10 can be reduced to be optimal for carrying, and the processing capability of the electronic component 21 can be promoted.

In the above embodiment, the double-sided intake fan 24 is provided by using the bottomed tubular fan casing 23.
And the configuration in which air is drawn in from both sides of the blower fan 24 has been described. However, the present invention is not limited to this, and various configurations are possible.

In the above-described embodiment, a case has been described in which one of the electronic components 21 mounted on the printed wiring board 20 is thermally coupled to the heat receiving portion 221 of the heat radiating member 22. The present invention is not limited to this, and it is also possible to configure so that a plurality of electronic components are thermally coupled.

Therefore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the scope of the present invention.

[0049]

As described above in detail, according to the present invention, it is possible to provide a cooling device capable of realizing high-efficiency heat control while ensuring miniaturization.

Further, according to the present invention, while ensuring a small size and a thin shape suitable for carrying, a highly efficient heat control can be realized to improve the processing capability. Equipment can be provided.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing the appearance of an electronic apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded perspective view showing a main part of the cooling device according to the embodiment of the present invention, taken out and shown.

FIG. 3 is a perspective view showing the cooling fan unit of FIG. 2 taken out therefrom;

FIG. 4 is a sectional view showing a part of FIG. 1 in section;

FIG. 5 is a side view showing a main part of FIG. 1 taken out.

[Explanation of symbols]

 10 ... equipment housing. 101 ... Case. 102 ... Cover. 103 ... air inlet. 104 ... air exhaust port. 105 Power switch. 106 ... switch lock operator. 107 ... mounting holes. 108 ... expansion card slot. 109 ... air exhaust hole. 11 ... keyboard. 13 ... Liquid crystal display. 14 ... Hinge mechanism. 20 ... printed wiring board. 21 Electronic parts. 22 ... heat dissipating member. 221 ... heat receiving part. 222: Fan mounting portion. 223 ... Ventilation window. 224: Projection. 23 ... Fan casing. 231 ... intake port. 232… Vent. 233 ... air guide. 24… fan. 25 ... heat pipe.

Continued on the front page (72) Inventor Katsuhiko Yamamoto 2570-1, Gosuda, Kamo-shi, Niigata F-term (reference) in Toshiba Home Techno Co., Ltd. 5E322 AA01 AA11 BA01 BA04 BA05 BB03 BB04 DB10 FA02

Claims (6)

[Claims] An electronic component comprising: a cooling fan unit having a pair of intake ports provided in a fan axis direction of a two-sided intake type fan with the ventilation fan interposed therebetween, and having a ventilation port provided at a periphery substantially orthogonal to the fan axis; A heat receiving part thermally connected to the cooling fan unit, and a heat radiating member provided with a fan unit mounting part to which the cooling fan unit is mounted. 2. The cooling device according to claim 1, wherein the heat radiating member is provided with a ventilation window for supplying the air blown from a blowing port of the cooling fan unit to the outside. 3. The cooling device according to claim 1, wherein the cooling fan unit includes a plurality of flat blades arranged radially. 4. An equipment housing in which a printed wiring board on which electronic components are mounted is housed and arranged; and a housing which is housed and arranged in the equipment housing, wherein the air is blown in a fan axial direction of a double-sided air blower fan. A cooling fan unit provided with a pair of air intake ports with a fan interposed therebetween, and a blower port provided substantially perpendicular to the fan axis; and a cooling fan unit housed and disposed in the equipment housing, An electronic device comprising: a heat receiving portion thermally connected to an electronic component; and a heat radiating member provided with a fan unit mounting portion to which the cooling fan unit is mounted. 5. The electronic device according to claim 4, wherein the heat radiating member is provided with a ventilation window for supplying air blown from a blower opening of the cooling fan unit to the outside. 6. The electronic device according to claim 4, wherein the cooling fan unit includes a plurality of flat blades arranged radially.