JP2000086744A - Epoxy resin composition, inductance component and semiconductor sealing device - Google Patents

Abstract

(57) [Problem] An epoxy resin composition which is excellent in filling property of a thin portion, has no defects such as voids, has excellent crack resistance due to toughness, and has excellent reliability such as moisture resistance. Thus, an insulated and sealed inductance component and a semiconductor sealing device are provided. SOLUTION: A resin component containing (A) a liquid epoxy resin mixed with a reactive diluent as required and (B) an inorganic filler, and (C) hydrogenated methylnadic acid or an anhydride thereof as a curing agent. (D) An epoxy resin composition, which is a two-part electrical insulating material, obtained by mixing a curing agent component containing an imidazole compound as a liquid curing accelerator, and a cast of the epoxy resin composition. And a coil and a semiconductor chip are insulated and sealed by a cured product, and an inductance component and a semiconductor sealing device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition having excellent crack resistance, moisture resistance, moldability, and excellent electrical properties at high temperatures and high heat resistance, and insulating and sealing with the epoxy resin composition. To a manufactured inductance component and a semiconductor sealing device.

[0002]

2. Description of the Related Art Conventionally, electric power of coils, semiconductor elements, etc.
Electronic components have been resin-insulated and sealed to protect them from the external atmosphere and mechanical shock. In recent years, the coil device has been downsized, the internal voltage has been increased,
On the other hand, as semiconductor devices become lighter, thinner and shorter, casting and molding resins are further reduced in viscosity and cast and molded after molding so as to be suitable for filling between coil windings and thin moldability. Reliability such as moisture resistance and crack resistance has been required.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and is excellent in the filling property of a thin portion, has no defects such as voids, and has excellent crack resistance due to toughness. Another object of the present invention is to provide an epoxy resin composition excellent in reliability such as moisture resistance and the like, and an insulated and sealed inductance component and a semiconductor sealing device.

[0004]

Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, mixed an inorganic filler with a liquid epoxy resin, and if necessary, a reactive diluent and a defoamer. The above object is achieved by curing a resin component containing an agent, an antisettling agent, a colorant, and the like, using a liquid curing agent component comprising a hydrogenated methyl nadic acid curing agent and an imidazole-based curing accelerator. Thus, the present invention has been completed.

That is, the present invention relates to a resin component containing (A) a liquid epoxy resin containing a reactive diluent as required and (B) an inorganic filler, and (C) hydrogenated methyl nadic acid as a curing agent. Alternatively, the epoxy resin composition is a two-part electrically insulating material obtained by mixing a curing agent component containing an anhydride thereof and (D) an imidazole-based compound as a liquid curing accelerator. Further, another invention is a cast product of the epoxy resin composition, a cured product, a coil,
An inductance component and a semiconductor sealing device, wherein a semiconductor chip is insulated and sealed.

Hereinafter, the present invention will be described in detail.

[0007] As the epoxy resin (A) used in the present invention, those generally used without being limited by the molecular structure, molecular weight, etc., as long as the compound has at least two epoxy groups in the molecule. Can be widely used.

For example, epoxy novolak type, biphenyl type aromatic systems, alicyclic systems such as cyclohexane derivatives, etc.
Further, a bisphenol A type epoxy resin represented by the following general formula may be mentioned.

[0009]

Embedded image (In the formula, n represents an integer of 0 or more.) These epoxy resins can be used alone or in combination of two or more. These epoxy resins are used as liquid epoxy resins without or with the addition of reactive diluents.

As the inorganic filler (B) used in the present invention, those generally used are widely used. Specifically, for example, silica powder, alumina, antimony trioxide, talc, calcium carbonate, titanium white, clay, bengal, glass fiber, carbon fiber and the like can be mentioned, and silica powder and alumina are particularly preferably used. The mixing ratio of the inorganic filler is 25 to the entire resin composition.
It is preferable to mix so as to contain 95% by weight. If the proportion is less than 25% by weight, the hygroscopicity of the resin composition is high,
Moisture resistance is inferior, and if it exceeds 95% by weight, fluidity extremely deteriorates and moldability is inferior, which is not preferable.

The resin component (A) containing the liquid epoxy resin and the resin component (B) containing the inorganic filler is prepared by heating and mixing the components (A) and (B). Also, if necessary, a reactive diluent such as an alicyclic epoxy, an antifoaming agent such as silicones and a silane coupling agent, or various anti-settling agents, a coloring agent such as carbon black, etc. may be appropriately added. can do.

The (C) hydrogenated methyl nadic acid curing agent used in the present invention is a hydride of methyl nadic acid and / or a hydride of methyl nadic anhydride, and its molecular weight and acid anhydride equivalent are as follows. There is no particular limitation, and the one represented by the following general formula is optimal.

[0013]

Embedded image The hydrogenated methyl nadic acid curing agent may be used in combination with another acid anhydride curing agent such as methyl tetrahydrophthalic anhydride.

The liquid curing accelerator (D) comprising an imidazole compound used in the present invention may be used for accelerating the reaction between epoxy resins or between the epoxy resin and (C) hydrogenated methylnadic anhydride curing agent. Any material may be used as long as it is used. Illustrative examples of the curing accelerator include, for example, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl
-4-methylimidazole and the like. Among these curing agents, 1-benzyl-2- represented by the following formula in consideration of the moldability (castability) of the resin composition and the heat resistance of the cured product.
Methyl imidazole and the like are preferably used.

[0015]

Embedded image

A general method for preparing the epoxy resin composition of the present invention as a casting or molding material is to mix the above-mentioned specific epoxy resin, inorganic filler and other components, and to make the mixture sufficiently uniform with a mixer or the like. The resin component mixed by heating and the hardener component obtained by heating and mixing the liquid hardening accelerator composed of the hydrogenated methyl nadic acid hardener and the imidazole compound sufficiently uniformly with a mixer or the like as a two-component component,
These can be mixed before use to form a casting or molding material. The casting and molding materials obtained in this way can provide excellent properties and reliability when applied to sealing, coating, insulation, etc. of electric or electronic components such as coil casting and molding of semiconductor elements. Can be.

As a general method of casting and molding, there is a vacuum casting. A resin component mixed with a specific epoxy resin, an inorganic filler and other components, and heated and mixed sufficiently uniformly with a mixer or the like is mixed with hydrogen. Injection molding, compression molding, etc. by mixing in advance two resin components, a hardening agent component obtained by heating and mixing a liquid curing accelerator consisting of a methylated nadic acid curing agent and an imidazole-based compound sufficiently uniformly with a mixer or the like. Casting and molding by other methods are also possible. After sealing by these casting and molding methods, the mixture is heated and cured, and finally, a coil casting and a semiconductor sealing device sealed with the cured product are obtained.

[0018]

The epoxy resin composition of the present invention, by using a specific hydrogenated methyl nadic acid curing agent, has excellent filling properties in the thin portion of the resin composition, does not generate defects such as voids, and has a high toughness. An epoxy resin composition having excellent crack resistance and excellent crack resistance suitable for coil casting, semiconductor encapsulation, etc., having excellent reliability such as moisture resistance can be provided.

[0019]

Next, the effects of the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.

Example 1 100 parts by weight of an epoxy resin (epoxy equivalent: 190), 220 parts by weight of fused silica powder, 0.1 part by weight of a silicone-based defoamer and 0.3 part by weight of a silane coupling agent were put into a mixer and heated at 70 ° C. The mixture was mixed to form an epoxy resin component. Separately, 90 parts by weight of a hydrogenated methyl nadic acid curing agent (anhydride equivalent: 183) and 0.7 part by weight of 1-benzyl-2-methylimidazole were charged into a mixer, and heated and mixed at 70 ° C. to obtain a curing agent component.

The epoxy resin component and the curing agent component were mixed to obtain an epoxy resin composition of Example 1.

Examples 2 to 4 The compositions shown in Table 1 were heated and mixed at 70 ° C. to obtain an epoxy resin component and a curing agent component. The epoxy resin component and the curing agent component shown in Table 1 were mixed in the same manner as in Example 1, and
~ 4 epoxy resin compositions were obtained.

Comparative Examples 1 to 3 The compositions shown in Table 1 were mixed by heating at 70 ° C. in the same manner as in the Examples.
Mixing the epoxy resin component and the curing agent component, Comparative Examples 1-3
Was obtained.

The composition obtained above was coil-injected under vacuum at 70 ° C., then at 110 ° C. for 3 hours, and further at 150 ° C.
For 5 hours. Various tests were performed on these epoxy resin compositions, and the results are shown in Table 2. Similarly, the semiconductor element is sealed with the same resin under the same curing conditions, and the number of defective ICs that have broken due to the corrosion of the aluminum wiring of the semiconductor element after 125 hours at 2.3 atm and 500 hours is counted and described. did. The results are also shown in Table 2. The epoxy resin composition of the present invention was excellent in crack resistance and the like, and the remarkable effect of the present invention could be confirmed.

[0025]

[Table 1] * 1: Epoxy equivalent 190 * 2: Acid anhydride equivalent 183 * 3: Me-THPA * 4: HHPA * 5: Me-HHPA

[0026]

[Table 2] * 1: Regarding coil impregnation, the resin was injected into a flyback transformer, post-cured at 110 ° C for 3 hours and further at 150 ° C for 5 hours, and the cut surface of the coil was observed with a microscope. An impregnation rate of 95% or more was judged as good impregnation, and an impregnation rate of less than 95% was judged as poor impregnation. Regarding the number of void defects, the number was described by counting the number of void defects when the impregnation was determined. * 2: Insert a bolt and nut washer into a tin plate shear (5 cm in diameter x 1.5 cm in height) and cast it. 200 cycles of 30 minutes each of high temperature (130 ° C) and low temperature (-60 ° C) for 200 minutes. The test pieces were applied once, and the length of cracks generated in each specimen was measured. * 3: A cured product having a diameter of 50 mm and a thickness of 3 mm was put into PCT (125 ° C / 2.3atm / 24H), and the water absorption was calculated from the weight change after 24 hours. * 4: A semiconductor integrated circuit device with aluminum wiring is bonded to a copper frame and post-cured at 110 ° C for 3 hours and then at 150 ° C for 5 hours. PCT in saturated steam at 125 ° C and 2.3 atm. (Pressure cooker test) was performed for 500 hours, and the number of defective ICs due to corrosion of aluminum wiring was counted and described.

[0027]

As apparent from the above description and Table 2, the epoxy resin composition of the present invention is excellent in the filling property of a thin portion, has no defects such as voids, and has a crack resistance due to toughness. It is an epoxy resin composition having excellent crack resistance suitable for coil casting, semiconductor encapsulation, etc., which is excellent in reliability such as moisture resistance.

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Claims (3)

[Claims] 1. A resin component containing (A) a liquid epoxy resin containing a reactive diluent as required and (B) an inorganic filler, and (C) hydrogenated methylnadic acid or an anhydride thereof as a curing agent. And (D) a curing agent component containing an imidazole compound as a liquid curing accelerator, wherein the epoxy resin composition is a two-part electrically insulating material. 2. An inductance component, wherein the coil is insulated by the casting of the epoxy resin composition according to claim 1. 3. A semiconductor sealing device, wherein a semiconductor chip is sealed with a cured product of the epoxy resin composition according to claim 1.