GB1248087A - Improvements relating to pressure gauges - Google Patents
Improvements relating to pressure gaugesInfo
- Publication number
- GB1248087A GB1248087A GB00732/69A GB1073269A GB1248087A GB 1248087 A GB1248087 A GB 1248087A GB 00732/69 A GB00732/69 A GB 00732/69A GB 1073269 A GB1073269 A GB 1073269A GB 1248087 A GB1248087 A GB 1248087A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resistors
- pressure
- enclosure
- metal
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000012530 fluid Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 238000009966 trimming Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
1,248,087. Semiconductor devices. FERRANTI Ltd. 27 Feb., 1970 [28 Feb., 1969], No. 10732/69. Heading H1K. [Also in Division G1] A pressure gauge includes a transducer support 25 carrying a semi-conductor body 10 having a plurality of piezo-resistive strain sensing elements 13 formed therein, mounted in an enclosure 32, 22 containing a fluid at a predetermined pressure, a bore 28 extending through the enclosure part 22 to allow fluid whose pressure is to be measured to communicate with a cavity 26 defined by the support 25 and semi-conductor body 10 and thereby flex the sensing part of body 10. The transducer 10, Fig. 1, comprises superimposed P-type substrate 11 and N-type epitaxial layer 12 having formed in its central region 14 diffused P-type sensing resistive elements 13, P-type layer 11 being removed from region 14 to allow layer 12 to flex. Four resistors 13 are provided at the centre of 14 and two pairs os U-shaped resistors 13 at its periphery which resistors are connected by aluminium strips 17 to terminals 18. In operation two of the central resistors 13 and two of the U-shaped resistors are connected to form a Wheatstone Bridge the output from which varies in response to changes in pressure on region 14. Others of the resistors 13 may be employed as balancing or calibrating resistors, or pairs may be connected in series and used as temperature sensors together with thin film trimming resistors to provide a temperature independent output. The silicon support 25 is bonded to a metal tube 23 having a matching coefficient of expansion and which extends through header 22 forming part of the hermetically sealed enclosure. The pressure in the enclosure may be a vacuum or can be preselected by a valve connected to tube 33 communicating with metal can 32. Instead of mounting the pressure gauge to anchorage 42 by means of screwthreaded part 38 of header 22 the metal can 32 may be provided with a screw-threaded block to which is attached tube 33, Fig. 3 (not shown).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB00732/69A GB1248087A (en) | 1969-02-28 | 1969-02-28 | Improvements relating to pressure gauges |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB00732/69A GB1248087A (en) | 1969-02-28 | 1969-02-28 | Improvements relating to pressure gauges |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1248087A true GB1248087A (en) | 1971-09-29 |
Family
ID=9973274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB00732/69A Expired GB1248087A (en) | 1969-02-28 | 1969-02-28 | Improvements relating to pressure gauges |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1248087A (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50105285A (en) * | 1974-01-25 | 1975-08-19 | ||
US4040297A (en) * | 1974-12-02 | 1977-08-09 | U.S. Philips Corporation | Pressure transducer |
US4085620A (en) * | 1975-09-30 | 1978-04-25 | Tokyo Shibaura Electric Co., Ltd. | Pressure-electric transducers |
FR2409500A1 (en) * | 1977-11-18 | 1979-06-15 | Philips Nv | BOXED SEMICONDUCTOR TRANSDUCER |
US4168630A (en) * | 1976-11-24 | 1979-09-25 | Tokyo Shibaura Electric Co., Ltd. | Semiconductor pressure converter |
FR2433176A1 (en) * | 1978-08-10 | 1980-03-07 | Nissan Motor | PRESSURE SENSORS WITH SEMICONDUCTOR MEMBRANE |
FR2446471A1 (en) * | 1979-01-11 | 1980-08-08 | Nissan Motor | PRESSURE SENSOR |
FR2448141A1 (en) * | 1979-01-31 | 1980-08-29 | Nissan Motor | PRESSURE SENSOR |
FR2448140A1 (en) * | 1979-02-02 | 1980-08-29 | Nissan Motor | DIAPHRAGM PRESSURE SENSOR |
FR2448139A1 (en) * | 1979-02-02 | 1980-08-29 | Nissan Motor | PRESSURE SENSOR |
EP0015836A1 (en) * | 1979-03-09 | 1980-09-17 | Thomson-Csf | Surface acoustic wave pressure transducer |
US4303903A (en) * | 1978-09-22 | 1981-12-01 | Hitachi, Ltd. | Pressure sensitive apparatus |
US4563697A (en) * | 1982-02-25 | 1986-01-07 | Fuji Electric Company, Ltd. | Semiconductor pressure sensor |
EP0949494A3 (en) * | 1998-04-09 | 2000-05-03 | Fujikoki Corporation | Semiconductive pressure sensor |
CN104006913A (en) * | 2013-02-27 | 2014-08-27 | 霍尼韦尔国际公司 | Integrated reference vacuum pressure sensor with atomic layer deposition coated input port |
EP2816335A1 (en) * | 2013-06-19 | 2014-12-24 | Honeywell International Inc. | Integrated soi pressure sensor having silicon stress isolation member |
CN105742371A (en) * | 2014-12-26 | 2016-07-06 | 长野计器株式会社 | Sensor Module And Method For Producing Sensor Module |
-
1969
- 1969-02-28 GB GB00732/69A patent/GB1248087A/en not_active Expired
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50105285A (en) * | 1974-01-25 | 1975-08-19 | ||
US4040297A (en) * | 1974-12-02 | 1977-08-09 | U.S. Philips Corporation | Pressure transducer |
US4085620A (en) * | 1975-09-30 | 1978-04-25 | Tokyo Shibaura Electric Co., Ltd. | Pressure-electric transducers |
US4168630A (en) * | 1976-11-24 | 1979-09-25 | Tokyo Shibaura Electric Co., Ltd. | Semiconductor pressure converter |
FR2409500A1 (en) * | 1977-11-18 | 1979-06-15 | Philips Nv | BOXED SEMICONDUCTOR TRANSDUCER |
FR2433176A1 (en) * | 1978-08-10 | 1980-03-07 | Nissan Motor | PRESSURE SENSORS WITH SEMICONDUCTOR MEMBRANE |
US4314225A (en) | 1978-08-10 | 1982-02-02 | Nissan Motor Company, Ltd. | Pressure sensor having semiconductor diaphragm |
US4303903A (en) * | 1978-09-22 | 1981-12-01 | Hitachi, Ltd. | Pressure sensitive apparatus |
FR2446471A1 (en) * | 1979-01-11 | 1980-08-08 | Nissan Motor | PRESSURE SENSOR |
FR2448141A1 (en) * | 1979-01-31 | 1980-08-29 | Nissan Motor | PRESSURE SENSOR |
US4287501A (en) | 1979-01-31 | 1981-09-01 | Nissan Motor Company, Limited | Pressure sensor |
US4276533A (en) * | 1979-02-02 | 1981-06-30 | Nissan Motor Company, Limited | Pressure sensor |
FR2448139A1 (en) * | 1979-02-02 | 1980-08-29 | Nissan Motor | PRESSURE SENSOR |
US4314226A (en) | 1979-02-02 | 1982-02-02 | Nissan Motor Company, Limited | Pressure sensor |
FR2448140A1 (en) * | 1979-02-02 | 1980-08-29 | Nissan Motor | DIAPHRAGM PRESSURE SENSOR |
FR2451026A1 (en) * | 1979-03-09 | 1980-10-03 | Thomson Csf | SURFACE ELASTIC WAVE PRESSURE SENSOR |
EP0015836A1 (en) * | 1979-03-09 | 1980-09-17 | Thomson-Csf | Surface acoustic wave pressure transducer |
US4563697A (en) * | 1982-02-25 | 1986-01-07 | Fuji Electric Company, Ltd. | Semiconductor pressure sensor |
EP0949494A3 (en) * | 1998-04-09 | 2000-05-03 | Fujikoki Corporation | Semiconductive pressure sensor |
US6176137B1 (en) | 1998-04-09 | 2001-01-23 | Fujikoki Corporation | Pressure sensor |
CN104006913A (en) * | 2013-02-27 | 2014-08-27 | 霍尼韦尔国际公司 | Integrated reference vacuum pressure sensor with atomic layer deposition coated input port |
CN104006913B (en) * | 2013-02-27 | 2018-04-13 | 霍尼韦尔国际公司 | Integrated reference vacuum pressure sensor with the input port coated with atomic layer deposition |
EP2816335A1 (en) * | 2013-06-19 | 2014-12-24 | Honeywell International Inc. | Integrated soi pressure sensor having silicon stress isolation member |
JP2015007626A (en) * | 2013-06-19 | 2015-01-15 | ハネウェル・インターナショナル・インコーポレーテッド | Integrated soi pressure sensor having silicon stress isolation member |
US10151647B2 (en) | 2013-06-19 | 2018-12-11 | Honeywell International Inc. | Integrated SOI pressure sensor having silicon stress isolation member |
CN105742371A (en) * | 2014-12-26 | 2016-07-06 | 长野计器株式会社 | Sensor Module And Method For Producing Sensor Module |
CN105742371B (en) * | 2014-12-26 | 2021-05-25 | 长野计器株式会社 | Sensor module and method of manufacturing the same |
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